Punching device and component mounting apparatus

Abstract

The present invention suppresses expansion of through holes (36a) formed by punching while applying tension to a film (36). When a mounting head (12) is lowered, the film (36) is sandwiched and fixed between a punching device (16) and the lower surface (35a) of a tool (35). When the mounting head (12) is further lowered, needles (51) of the punching device (16) pierce the film (36) and are inserted into component suction holes (35b), and the through holes (36a) are formed.

Description

Hole punching device and component mounting device

[0001] The present disclosure relates to a hole punching device and a component mounting device including the same.

[0002] Conventionally, in a component mounting device for mounting electronic components such as ICs on a substrate, in order to remove oxides or dirt on bumps on the lower surface of chip-type electronic components or electrode portions for performing soldering on the substrate before soldering the components to the substrate, flux is attached. In addition, electronic components are also mounted on the substrate using an adhesive.

[0003] For example, in Patent Document 1, it is described that in order to prevent an adhesive between an electronic component and a substrate from adhering to a tool for adsorbing the electronic component, the tool adsorbs the electronic component through a film (tape). Holes for component adsorption are formed in the film.

[0004] Japanese Patent Application Laid-Open No. 2012-044071

[0005] When hole punching is performed by applying tension to the film, the formed holes may expand due to the tension of the film and become larger than the desired size. Flux or adhesive may climb up the tool from the enlarged holes.

[0006] Therefore, an object of the present disclosure is to provide a hole punching device and a component mounting device that suppress the expansion of formed holes.

[0007] The hole-punching device of this disclosure punches a first through-hole in a film placed on the underside of a tool for mounting a component to a substrate, corresponding to a component suction hole provided on the underside of the tool for suctioning the component, in the thickness direction of the film. The hole-punching device comprises a needle for punching the first through-hole in the film, a hole-punching mechanism, and a second plate. The hole-punching mechanism comprises a first plate having a second through-hole from which the needle can move along the longitudinal direction of the needle, and a first sliding mechanism that allows the first plate to slide longitudinally between a first position in which the upper end of the needle is housed in the second through-hole and a second position below the first position in which the needle is exposed from the second through-hole. The second plate is located below the first plate and supports the needle. With the needle positioned directly below the component suction hole and the film sandwiched between the underside of the tool and the upper side of the first plate, as the first plate descends from the first position toward the second position, the needle that has penetrated the film is inserted into the component suction hole.

[0008] The component mounting apparatus of this disclosure includes a tool having component suction holes for adsorbing components, a mounting head for mounting components held by the tool onto a substrate, a drilling device, a mounting head moving mechanism for moving the mounting head to a component supply unit that supplies components via the drilling device, and a mounting head lifting mechanism for raising and lowering the mounting head. The drilling device includes a needle for drilling a first through hole in a film placed on the lower surface of the tool, corresponding to the position of the component suction holes provided on the lower surface of the tool, in the thickness direction of the film, a drilling mechanism, and a second plate. The drilling mechanism includes a first plate having a second through hole from which the needle can move along the longitudinal direction of the needle, and a first sliding mechanism that allows the first plate to slide longitudinally between a first position in which the upper end of the needle is housed in the second through hole and a second position below the first position in which the needle is exposed from the second through hole. The second plate is located below the first plate and supports the needle. The needle is positioned directly below the component suction hole, and with the film sandwiched between the lower surface of the tool and the upper surface of the first plate, the tool pushes down the first plate from the first position to the second position, causing the first plate to descend and the needle, which has penetrated the film, to be inserted into the inside of the component suction hole.

[0009] According to this disclosure, it is possible to provide a drilling device that suppresses the expansion of the formed hole, and a component mounting device.

[0010] Side view showing the schematic configuration of the component mounting device according to the embodiment Plan view showing the bottom surface of the tool Explanatory diagram showing the state in which the bottom surface of the tool is in contact with the drilling device Perspective view of the drilling device Perspective view of the drilling head from the direction of arrow V in Figure 4 Enlarged view of area At in Figure 4 Explanatory diagram explaining the operation of the drilling head Explanatory diagram explaining the operation of the drilling head Explanatory diagram explaining the operation of the drilling head Explanatory diagram showing the state in which the bottom surface of the tool is pressing down on the top surface of the drilling head Explanatory diagram showing the state in which the drilling head is raised after the completion of the drilling operation Side view of the component mounting device with the mounting head in the imaging position Side view of the component mounting device with the mounting head in the transfer position Side view of the component mounting device with the mounting head receiving a component Side view of the component mounting device with the mounting head positioned at the flux application position Side view of the component mounting device with the mounting head applying flux to the picked-up component Side view of the component mounting device with the mounting head positioned at the mounting position Side view of the component mounting device with the mounting head mounting a component on the substrate Side view of the component mounting device with the up / down recognition camera imaging the substrate Side view of the component mounting device with the up / down recognition camera moving above the drilling device Block diagram showing the functional configuration of the component mounting device according to the embodiment Explanatory diagram showing the configuration of the imaging device

[0011] A first aspect of the present disclosure is a hole-punching device that punches a first through-hole in a film placed on the underside of a tool for mounting a component onto a substrate, corresponding to a component suction hole provided on the underside of the tool for suctioning the component, in the thickness direction of the film. The hole-punching device comprises a needle for punching the first through-hole in the film, a hole-punching mechanism, and a second plate. The hole-punching mechanism comprises a first plate having a second through-hole from which the needle can move along the longitudinal direction of the needle, and a first sliding mechanism that allows the first plate to slide longitudinally between a first position in which the upper end of the needle is housed in the second through-hole and a second position below the first position in which the needle is exposed from the second through-hole. The second plate is located below the first plate and supports the needle. With the needle positioned directly below the component suction hole and the film sandwiched between the underside of the tool and the upper side of the first plate, as the first plate descends from the first position toward the second position, the needle that has penetrated the film is inserted into the component suction hole.

[0012] By pressing the film down with a needle, a first through-hole is formed in the film. Since the film can be sandwiched between the lower surface of the tool and the upper surface of the first plate when the first through-hole is formed, the tension on the film can be reduced. Furthermore, since only the area where the first through-hole is made is not being held down, the size of the formed first through-hole can be prevented from spreading to the surrounding area.

[0013] According to a second aspect of this disclosure, in the drilling apparatus of the first aspect, the drilling mechanism is biased in the direction from the second position toward the first position.

[0014] According to a third aspect of this disclosure, in the hole-punching apparatus of the first or second aspect, the film positioned on the underside of the tool separates from the upper surface of the first plate at the same time as, or after, the needle is removed from the film.

[0015] According to a fourth aspect of the present disclosure, in any one of the first to third aspects of the drilling apparatus, the drilling apparatus includes a second sliding mechanism that allows a second plate to slide vertically. The second sliding mechanism lowers the second plate in accordance with the descending first plate, and the second plate is biased in the direction from the second position toward the first position.

[0016] According to a fifth aspect of this disclosure, in a drilling apparatus of the fourth aspect, the drilling apparatus comprises a housing that supports a drilling mechanism. The housing comprises a first slot extending vertically on a first side surface of the housing. The first sliding mechanism comprises a first guide rail extending vertically and fixed to the inside of the first side surface of the housing; a first block to which a first plate is fixed and which is slidable on the first guide rail; a first rod fixed to the lower part of the first block or the first plate and extending from the inside to the outside of the housing through the first slot; and a first stopper that restricts the upward movement of the first rod. The first rod is biased in the direction from a second position to a first position.

[0017] According to a sixth aspect of the present disclosure, in the drilling apparatus of the fifth aspect, the housing includes a second slot extending longitudinally on a second side parallel to a first side. The second sliding mechanism includes a second guide rail extending longitudinally and fixed to the inside of the second side; a second block to which a second plate is fixed and which is slidable on the second guide rail; a second rod fixed to the lower part of the second block or the second plate and extending from the inside to the outside of the housing through the second slot; and a second stopper that restricts the upward movement of the second rod. The second rod is biased in the direction from a second position toward a first position.

[0018] According to a seventh aspect of this disclosure, in a drilling device according to any one of the first to sixth aspects, the drilling device has a first lifting mechanism that moves a needle, a drilling mechanism, and a second plate up and down integrally.

[0019] A component mounting device according to an eighth aspect of the present disclosure includes a tool having component suction holes for adsorbing components, a mounting head for mounting components held by the tool onto a substrate, a drilling device, a mounting head moving mechanism for moving the mounting head to a component supply unit that supplies components via the drilling device, and a mounting head lifting mechanism for raising and lowering the mounting head. The drilling device includes a needle for drilling a first through-hole in the thickness direction of a film placed on the lower surface of the tool, corresponding to the position of the component suction holes provided on the lower surface of the tool, a drilling mechanism, and a second plate. The drilling mechanism includes a first plate having a second through-hole from which the needle can move along the longitudinal direction of the needle, and a first sliding mechanism that allows the first plate to slide longitudinally between a first position in which the upper end of the needle is housed in the second through-hole and a second position below the first position in which the needle is exposed from the second through-hole. The second plate is located below the first plate and supports the needle. The needle is positioned directly below the component suction hole, and with the film sandwiched between the lower surface of the tool and the upper surface of the first plate, the tool pushes down the first plate from the first position to the second position, causing the first plate to descend and the needle, which has penetrated the film, to be inserted into the inside of the component suction hole.

[0020] By pressing the film down with a needle, a first through-hole is formed in the film. Since the film can be sandwiched between the lower surface of the tool and the upper surface of the first plate when the first through-hole is formed, the tension on the film can be reduced. Furthermore, since only the area where the first through-hole is made is not being held down, the size of the formed first through-hole can be prevented from spreading to the surrounding area.

[0021] According to the ninth aspect of this disclosure, in the component mounting device of the eighth aspect, the drilling mechanism is biased in the direction from the second position to the first position.

[0022] According to the tenth aspect of this disclosure, in the component mounting device of the eighth or ninth aspect, the film positioned on the lower surface of the tool separates from the upper surface of the first plate at the same time as, or after, the needle is removed from the film.

[0023] According to an eleventh aspect of this disclosure, in the component mounting device of the eighth or ninth aspect, after the needle penetrates the film, the mounting head rises as the mounting head is raised by the mounting head lifting mechanism, and the first plate rises, and at the same time as, or after, the upper end of the needle is accommodated in the second through hole, the film positioned on the lower surface of the tool separates from the upper surface of the first plate.

[0024] According to a twelfth aspect of the present disclosure, in a component mounting device according to any one of the eighth to eleventh aspects, the drilling device includes a second sliding mechanism that allows the second plate to slide vertically. The second sliding mechanism lowers the second plate in accordance with the descending first plate, and the second plate is biased in the direction from the second position toward the first position.

[0025] According to a thirteenth aspect of the present disclosure, in a component mounting device of a twelfth aspect, the drilling device comprises a housing that supports a drilling mechanism, the housing comprising a first slot extending vertically on a first side surface of the housing. The first sliding mechanism comprises a first guide rail extending vertically and fixed to the inside of the first side surface of the housing, a first block to which a first plate is fixed and which is slidable on the first guide rail, a first rod fixed to the lower part of the first block or the first plate and extending from the inside to the outside of the housing through the first slot, and a first stopper that restricts the upward movement of the first rod, the first rod being biased in the direction from a second position to a first position.

[0026] According to a fourteenth aspect of this disclosure, in the component mounting device of the thirteenth aspect, the housing includes a second slot extending longitudinally on a second side parallel to a first side. The second sliding mechanism includes a second guide rail extending longitudinally and fixed to the inside of the second side; a second block on which a second plate is fixed and which is slidable on the second guide rail; a second rod fixed to the lower part of the second block or the second plate and extending from the inside to the outside of the housing through the second slot; and a second stopper that restricts the upward movement of the second rod. The second rod is biased in the direction from a second position toward a first position.

[0027] According to a 15th aspect of the present disclosure, in a drilling device according to any one of the 8th to 14th aspects, the drilling device has a first lifting mechanism that moves a needle, a drilling mechanism, and a second plate up and down integrally.

[0028] Hereinafter, exemplary embodiments of the drilling apparatus and component mounting apparatus relating to this disclosure will be described with reference to the attached drawings. This disclosure is not limited to the specific configurations of the embodiments described below, but includes configurations based on similar technical ideas.

[0029] [Embodiment] (Overall Configuration) The component mounting device 1 in an embodiment of the present disclosure will be described below with reference to Figure 1. Figure 1 is a side view showing a schematic configuration of the component mounting device 1 equipped with a drilling device 16 according to an embodiment of the present disclosure.

[0030] As shown in Figure 1, the component mounting device 1 comprises a component supply unit 11, a mounting head 12, a stage 13, a flux supply device 15, a drilling device 16, and a beam 17. The component mounting device 1 further comprises an imaging device 18, a control unit 19, a touch panel 20, a base 21, a component supply unit moving unit 23, a pickup head 31, a stage moving unit 25, a stage tilt adjustment unit 29, and a film transport mechanism 47.

[0031] The component mounting device 1 mounts components 203, such as semiconductor chips, onto a substrate 201, which serves as a workpiece. On the base 21, a stage 13 for holding the substrate 201 and a component supply unit 11 are arranged side by side in the Y-axis direction.

[0032] The parts supply unit 11 supplies parts 203. The parts supply unit 11 is mounted on the parts supply unit moving unit 23. The parts supply unit moving unit 23 is controlled by the control unit 19 and moves the parts supply unit 11 in the X and Y directions. The parts supply unit moving unit 23 is, for example, a rack and pinion. Multiple parts 203 are held on the upper part of the parts supply unit 11. The parts 203 are held on the upper part of the parts supply unit 11 either placed on a tray or attached to an adhesive sheet.

[0033] Stage 13 is located above the stage moving unit 25. The stage moving unit 25 is controlled by the control unit 19, which moves Stage 13 in the X and Y directions. Stage 13 receives the substrate 201, for example, via a transport rail, and positions and holds the substrate 201 at the location where the components 203 will be mounted. Stage 13 also transports the substrate 201 with the components 203 mounted to the next process, for example, via a transport rail.

[0034] Inside the stage 13 are a stage heating unit 27 for heating the held substrate 201 and a temperature sensor (not shown) for measuring the temperature of the heated stage 13. The stage heating unit 27 is controlled by the control unit 19 and heats the stage 13 to a specified temperature. The temperature measured by the thermometer inside the stage 13 is transmitted to the control unit 19.

[0035] The stage tilt adjustment unit 29 is located inside the stage movement unit 25 and can adjust the tilt relative to the transfer head 113 by rotating the stage 13 around two orthogonal axes (X axis and Y axis). The stage tilt adjustment unit 29 has a mechanism in which, for example, cam mechanisms are provided at each of the four corners of the stage 13, and a linear cam provided for each cam mechanism moves in the left-right direction, causing the cam follower to move up and down, and each moves independently in the up-down direction.

[0036] Component 203 is held on the component supply unit 11 with the bumps formed on the back surface of component 203 facing upwards. A pickup head 31 is positioned above the component supply unit 11. The pickup head 31 picks up component 203 from the component supply unit 11 by suction. The pickup head 31 rotates around the X axis by a pickup head drive unit (not shown) controlled by the control unit 19, and then moves to a transfer position Pd, which will be described later. That is, at the transfer position Pd, the pickup head 31 holds component 203 with the bumps facing downwards.

[0037] A mounting head 12 is positioned above the pickup head 31 and the component supply unit 11. The mounting head 12 holds the supplied component 203 and mounts it onto the substrate 201 supported by the stage 13. The mounting head 12 moves in the Y-axis direction by a mounting head moving mechanism 33 controlled by a control unit 19. The mounting head moving mechanism 33 is provided on the beam 17. The mounting head moving mechanism 33 includes, for example, a rail (not shown) arranged along the Y-axis direction on the beam 17 and a linear motor (not shown) for moving the mounting head 12. The amount of drive of the linear motor is controlled by the control unit 19, and the mounting head 12 can move the beam 17 in the Y-axis direction along the rail by the amount of drive of the linear motor.

[0038] The beam 17 is a member that extends in the Y-axis direction and supports the mounting head 12 and the flux supply device 15. Although not shown in Figure 1, both ends of the beam 17 in the Y-axis direction are supported, for example, by a housing that surrounds the components of the component mounting device 1. The lower surface of the beam 17 is arranged, for example, substantially parallel to the horizontal plane.

[0039] A tool 35 for adsorbing and holding the component 203 is provided at the lower end of the mounting head 12. The mounting head moving mechanism 33 moves the mounting head 12 between a mounting position Pa for mounting the component 203 on the substrate 201, a drilling position Pb for drilling holes in the film 36 placed on the lower surface of the tool 35, a flux application position Pc for applying flux to the lower surface of the component 203, and a transfer position Pd where the tool 35 adsorbs and receives the component 203 from the pickup head 31.

[0040] The mounting head 12 is equipped with a component heating unit 37 that heats the component 203 held by the tool 35, and a tool temperature sensor 39 that measures the temperature of the tool 35 heated by the component heating unit 37. The component heating unit 37 is controlled by the control unit 19 and heats the tool 35 to a specified temperature. The temperature of the tool 35 measured by the tool temperature sensor 39 is transmitted to the control unit 19.

[0041] Film 36 prevents flux from adhering to tool 35. Film 36 is, for example, a Teflon (registered trademark) sheet. Film conveyance mechanism 47 includes a feed roller 48, a take-up roller 49, and a motor (not shown) that drives take-up roller 49. Since film conveyance mechanism 47 is supported by beam 17 integrally with mounting head 12, it moves horizontally and vertically together with mounting head 12.

[0042] Unused film 36 is supported in a roll shape on feed roller 48. Take-up roller 49 rotates by a motor to wind up the used film 36 disposed on the lower surface of tool 35, and sets the unused film 36 from feed roller 48 on the lower surface of tool 35.

[0043] Mounting head 12 is provided with a mounting head lifting mechanism 41 that raises and lowers mounting head 12. Mounting head lifting mechanism 41 vertically raises and lowers film conveyance mechanism 47 integrally with mounting head 12.

[0044] Further, mounting head 12 is provided with a pressure sensor 43 that measures the load by which mounting head lifting mechanism 41 presses tool 35 holding component 203 against substrate 201.

[0045] Mounting head lifting mechanism 41 is driven and controlled by the mounting control unit 93 of control unit 19, and lowers mounting head 12 so that tool 35 mounts component 203 on substrate 201 with a specified load. Mounting head lifting mechanism 41 includes, for example, a linear motor that raises and lowers mounting head 12, and an encoder that measures the driving amount of the linear motor. Mounting head lifting mechanism 41 may also include, for example, a ball screw. The load measured by pressure sensor 43 is transmitted to control unit 19.

[0046] Mounting head 12 is provided with an ultrasonic oscillator 45 that ultrasonically vibrates tool 35. Ultrasonic oscillator 45 is driven and controlled by control unit 19, and when mounting component 203 on substrate 201 by ultrasonic pressure bonding, ultrasonically vibrates tool 35 with a specified ultrasonic power, amplitude, and frequency.

[0047] The touch panel 20, which is communicably connected to the control unit 19, displays the operation menu and operation status information of the component mounting apparatus 1 on its display screen, and data can be input to the control unit 19 or the component mounting apparatus 1 can be operated using the operation buttons displayed on the display screen. The touch panel 20 may be a portable mobile terminal or may be installed on the component mounting apparatus 1. Instead of the touch panel 20, a combination of a liquid crystal monitor and input units such as operation buttons, a keyboard, and a mouse may be used.

[0048] The imaging device 18 captures an image of the component 203 supported by the mounting head 12 and transmits the captured image to the control unit 19. The imaging device 18 is disposed between the component supply unit 11 and the stage 13. The control unit 19 recognizes the shape of the imaged component 203 and the amount of rotation from the reference position. In the component mounting operation of mounting the component 203 on the substrate 201 by the mounting head 12, the control unit 19 corrects the posture of the component 203 based on the captured image of the component 203 by the imaging device 18.

[0049] The flux supply device 15 supplies flux to be attached to the component 203. The flux supply device 15 has a recess 50 in which the flux 3 is stored, and the recess 50 is slidable in the X-axis direction between a standby position and a supply position.

[0050] (Configuration of the drilling device) The drilling device 16 makes a first through hole in the film 36 in the thickness direction of the film 36 with respect to the film 36 disposed on the lower surface of the tool 35. As shown in FIG. 2, a plurality of component suction holes 35b and a film suction hole 35c are provided on the lower surface 35a of the tool 35. The component suction hole 35b and the film suction hole 35c are each connected to a negative pressure source, and the suction is controlled by the control unit 19.

[0051] As shown in FIG. 3, at the drilling position Pb, when the mounting head 12 descends together with the film conveying mechanism 47, the film 36 is fixed by sandwiching the film 36 between the lower surface 35a of the tool 35 and the drilling device 16. When the mounting head 12 further descends, the needle 51 of the drilling device 16 penetrates the film 36 and is inserted into the component suction hole 35b, thereby forming a through hole 36a (see FIG. 10) in the film 36.

[0052] The drilling device 16 will be described with reference to Figures 3 and 4. Figure 4 is a perspective view of the drilling device 16. The drilling device 16 comprises a drilling head 52 and a lifting mechanism 53.

[0053] The lifting mechanism 53 raises and lowers the drilling head 52 in the vertical direction. The lifting mechanism 53 includes a guide rail 56 extending in the vertical direction, a block 57 connected to the drilling head 52, and a drive unit 58 that raises and lowers the block 57. The drive unit 58 is, for example, a ball screw or a linear motor.

[0054] The lifting mechanism 53 raises and lowers the drilling head 52 along the guide rail 56 to a drilling position and a retracted position lower than the drilling position. When a device other than the mounted head 12 moves along the beam 17, the drilling head 52 is positioned in the retracted position, which prevents interference between the drilling head 52 and the device moving along the beam 17.

[0055] For example, as shown in Figure 19, when the vertical recognition camera 181, which captures the placement position of components 203 mounted on the substrate 201, moves along the beam 17 toward the drilling device 16, the lifting mechanism 53 can avoid interference between the vertical recognition camera 181 and the drilling head 52 by lowering the drilling head 52 from the drilling position to the retracted position, as shown in Figure 20.

[0056] Next, refer to Figures 5 to 7. Figure 5 is a perspective view taken from the direction of arrow V in Figure 4. Figure 6 is an enlarged view of region At in Figure 4. Figure 7 is an explanatory diagram illustrating the drilling head 52 in its initial position.

[0057] The drilling head 52 comprises a needle 51, a drilling mechanism 54, an impact reduction mechanism 55, and a housing 59. The drilling mechanism 54 is a mechanism for extending and retracting the tip of the needle 51, which is supported by the impact reduction mechanism 55. The impact reduction mechanism 55 reduces the load applied to the needle 51 by lowering the needle 51 when the lower surface 35a of the mounting head 12 comes into contact with the needle 51. The housing 59 houses the drilling mechanism 54 and the impact reduction mechanism 55.

[0058] The housing 59 has a roughly rectangular parallelepiped shape and has openings 59a and 59b on its top and bottom surfaces, respectively. The housing 59 has a first side surface 59c and a second side surface 59d that are parallel to each other, and a third side surface 59e that is perpendicular to the first side surface 59c and the second side surface 59d. A drilling mechanism 54 is attached to the first side surface 59c, and an impact reduction mechanism 55 is attached to the second side surface 59d.

[0059] The needle 51 is supported by the impact reduction mechanism 55. The needle 51 has a tapered shape, with its diameter decreasing towards the tip (upper end). Therefore, the needle 51 can easily come out of the film 36, and the burrs formed around the through hole 36a can be reduced from turning inside out. In addition, the size of the diameter of the through hole 36a formed in the film 36 can be adjusted by the amount the film 36 is pushed (descended) onto the needle 51.

[0060] The amount the film 36 is pressed into the needle 51 is, for example, about 0.5 mm. The diameter of the through hole 36a is, for example, about 0.2 to 0.3 mm. The diameter of the needle 51 is, for example, 0.5 mm, and the diameter of the component suction hole 35b is 0.7 to 0.8 mm. The number of needles 51 provided in the punching head 52 may be one or multiple.

[0061] Next, the drilling mechanism 54 will be described. The drilling mechanism 54 comprises a slide mechanism 60, a plate 63, a support block 64, and a biasing member 65.

[0062] The sliding mechanism 60 allows the plate 63 to slide vertically between a first position P1 in which the upper end of the needle 51 is housed in the through hole 63c and a second position P2 (see Figure 8) which is below the first position P1 in which the needle 51 is exposed from the through hole 63c. The sliding mechanism 60 includes, for example, a guide rail 61, a block 62, a rod 66, and a stopper 67.

[0063] The guide rail 61 is attached to the inner surface of the first side surface 59c and extends vertically, guiding the block 62 and plate 63 in the vertical direction.

[0064] Block 62 is mounted so as to be movable vertically along the guide rail 61 and supports the plate 63.

[0065] The plate 63 has, for example, an inverted L-shape and is fixed to the block 62. The plate 63 has a first plate portion 63a that is fixed to the block 62 and extends in the vertical direction, a second plate portion 63b that extends from the upper end of the first plate portion 63a toward the second side surface 59d, and a through hole 63c that extends in the vertical direction inside the second plate portion 63b. Under normal circumstances, the needle 51 is housed in the through hole 63c (see Figures 6 and 7), and the needle 51 is inserted into and removed from the upper surface of the second plate portion 63b.

[0066] The support block 64 is fixed to the third side surface 59e and positioned below the plate 63. A biasing member 65 is positioned between the upper surface of the support block 64 and the lower surface of the rod 66.

[0067] One end of the rod 66 is formed in a flat shape and is fixed to the lower surface of the first plate portion 63a of the plate 63, and is biased upward by a biasing member 65. The other end of the rod 66 is inserted into a first slot 59f, which is a vertically extending through hole provided in the first side surface 59c, and is exposed to the outside of the housing 59.

[0068] The biasing member 65 is installed between the support block 64 and the plate 63. The biasing member 65 is, for example, a coil spring, but it may also be a leaf spring.

[0069] The stopper 67 is attached to the outer surface of the first side surface 59c and restricts the upward movement of the rod 66 by the biasing member 65. At the first position P1, where the rod 66 and plate 63 are at their highest position, the upward movement of the rod 66 is stopped when a portion of the upper surface of the other end of the rod 66 comes into contact with the stopper 67.

[0070] Next, the impact reduction mechanism 55 will be described. The impact reduction mechanism 55 comprises a slide mechanism 70, a plate 73, a support block 74, and a biasing member 75.

[0071] The sliding mechanism 70 allows the plate 73 to slide vertically and lowers the plate 73 in accordance with the descending first plate 63. The sliding mechanism 70 includes, for example, a guide rail 71, a block 72, a rod 76, and a stopper 77.

[0072] The guide rail 71 is attached to the inner surface of the second side surface 59d and extends vertically, guiding the block 72 and plate 73 in the vertical direction.

[0073] Block 72 is mounted so as to be movable vertically along the guide rail 71 and supports the plate 73.

[0074] The plate 73 has, for example, an inverted L-shape and is fixed to the block 72. The plate 73 has a first plate portion 73a that is fixed to the block 72 and extends in the vertical direction, and a second plate portion 73b that extends from the upper end of the first plate portion 73a toward the first side surface 59c. The needle 51 is supported on the upper surface of the second plate portion 73b. The second plate portion 73b of plate 73 is located below the second plate portion 63b of plate 63.

[0075] The support block 74 is fixed to the third side surface 59e and is positioned below the plate 73. A biasing member 75 is positioned between the upper surface of the support block 74 and the lower surface of the rod 76. The support block 74 is positioned lower than the support block 64.

[0076] One end of the rod 76 is formed in a flat shape and is fixed to the lower surface of the first plate portion 73a of the plate 73, and is biased upward by a biasing member 75. The other end of the rod 76 is inserted into a second slot 59g, which is a vertically extending through hole provided in the second side surface 59d, and is exposed to the outside of the housing 59. The second slot 59g is provided below the first slot 59f.

[0077] The biasing member 75 is installed between the support block 74 and the plate 73. The biasing member 75 is, for example, a coil spring, but it may also be a leaf spring.

[0078] The stopper 77 is attached to the outer surface of the second side surface 59d and restricts the upward movement of the rod 76 by the biasing member 75. At the third position P3, where the rod 76 and plate 73 are at their highest position, the upward movement of the rod 76 is stopped when a portion of the upper surface of the other end of the rod 76 comes into contact with the stopper 77. The lower end of the stopper 77 is located below the lower end of the stopper 67.

[0079] As shown in Figure 7, in the initial position before the drilling head 52 is pushed downward by the lower surface of the tool 35, the plate 63 is biased upward by the biasing member 65, so the upper surface of the second plate portion 63b of the plate 63 is at the height of the highest position, the first position P1. At the first position P1, the upper surface of the second plate portion 63b is higher than the upper end of the needle 51, so the needle 51 is housed in the through hole 63c of the second plate portion 63b, and the upper end of the needle 51 is not exposed. Therefore, the tip of the needle 51 is not exposed except when forming the through hole 63c in the film 36, thus improving safety for the operator. Also, since the tip of the needle 51 is not exposed, the film 36 can be tightly sandwiched between the lower surface 35a of the tool 35 and the upper surface of the plate 63.

[0080] Furthermore, in the initial position of the drilling head 52, the plate 73 is biased upward by the biasing member 65, so the upper surface of the second plate portion 73b of the plate 73 is at the height of the third position P3, which is the highest position.

[0081] Next, the operation of the drilling head 52 when a through hole 36a is formed in the film 36 will be explained with reference to Figures 3, 8, and 10. Figure 8 is an explanatory diagram illustrating the operation of the drilling head 52. Figure 10 is an explanatory diagram showing the state in which the lower surface of the tool 35 is pressing down on the upper surface of the drilling head 52.

[0082] With the lower surface 35a of the tool 35 in contact with the upper surface of the second plate portion 63b of the plate 63 of the drilling head 52 via the film 36, when the tool 35 pushes down the second plate portion 63b, the plate 63 and block 62 move downward along the guide rail 61 against the biasing force of the biasing member 65. As a result, the upper part of the needle 51 supported on the second plate portion 73b of the plate 73 of the impact reduction mechanism 55 is exposed through the through hole 63c, forming a through hole 36a in the film 36, and is inserted into the part suction hole 35b of the tool 35.

[0083] When the needle 51 is inserted into the part suction hole 35b of the tool 35, the burrs around the through hole 36a formed in the film 36 are also inserted into the part suction hole 35b. When the tool 35 pushes down the second plate portion 63b, the control unit 19 may perform air suction on the part suction hole 35b. When air suction is performed on the part suction hole 35b, the burrs around the through hole 36a can be reliably sucked into the part suction hole 35b. When air suction is not performed on the part suction hole 35b, it is possible to prevent film debris generated when the through hole 36a is formed from being sucked into the part suction hole 35b.

[0084] Since the upper part of the needle 51 is housed within the component suction hole 35b, the second plate portion 73b of the plate 73 of the impact reduction mechanism 55 does not receive a downward force from the lower surface 35a of the tool 35, and therefore the needle 51 maintains its height without descending.

[0085] The tool 35 pushes down plate 63 to such an extent that the second plate portion 63b of plate 63 does not come into contact with the second plate portion 73b of plate 73, causing the upper surface of the second plate portion 63b of plate 63 to drop to the height of the second position P2. At this time, the biasing member 65 receives the downward force of the tool 35.

[0086] When the tool 35 pushes down the plate 63 of the drilling head 52, if the alignment between the needle 51 and the part suction hole 35b of the tool 35 is not proper, the needle 51 exposed from the through hole 63c will not be inserted into the part suction hole 35b and will instead hit the lower surface 35a of the tool 35. In this case, the pushing force of the tool 35 is transmitted via the needle 51 to the plate 73 of the impact reduction mechanism 55 that supports the needle 51, so the tool 35 pushes down both the plate 63 of the drilling mechanism 54 and the plate 73 of the impact reduction mechanism 55.

[0087] The plate 73 of the impact reduction mechanism 55 moves downward along the guide rail 71 against the biasing force of the biasing member 75, together with the block 72. In this way, the biasing member 65 and the biasing member 75 receive the downward force of the tool 35, so that the force does not concentrate on the needle 51 and cause it to break.

[0088] When the upper part of the needle 51 is inserted into the component suction hole 35b of the tool 35, as shown in Figures 8 and 10, the tool 35 pushes down the plate 63 of the drilling mechanism 54 to the second position P2, forming a through hole 36a in the film 36. Then, as shown in Figure 11, the mounting head 12 is raised by the mounting head lifting mechanism 41, and the film 36 moves away from the mounting head 12.

[0089] The through-holes 36a formed in the film 36 by the hole-punching device 16 are not limited to round holes, but also include openings, tears, and cracks. Therefore, the through-holes 36a only need to be communication portions that communicate from one surface of the film 36 to the other surface in the thickness direction of the film 36.

[0090] After the drilling operation is complete, as shown in Figure 12, the mounting head 12 moves directly above the imaging device 18, and the imaging device 18 images the through-hole 36a of the film 36. Once the imaging of the through-hole 36a is complete, the mounting head 12 moves toward the transfer position Pd.

[0091] Next, as shown in Figure 13, when the mounting head 12 arrives at the transfer position Pd, the control unit 19 starts to pick up the film 36 from the film suction hole 35c of the tool 35 using a negative pressure source. This prevents the film 36 from moving on the lower surface 35a of the tool 35.

[0092] As shown in Figure 14, the mounting head 12 descends at the transfer position Pd, and the tool 35 picks up and receives the part 203 from the pickup head 31. The mounting head moving mechanism 33 moves the mounting head 12 from the transfer position Pd to the flux application position Pc, where flux is applied to the lower surface of the part 203.

[0093] As shown in Figure 15, when the mounting head 12, which has picked up the component 203, arrives at the flux application position Pc from the transfer position Pd, the mounting head 12 lowers the tool 35 by the mounting head lifting mechanism 41, as shown in Figure 16. As a result, the flux 3 in the recess 50 of the flux supply device 15, which is located at the supply position, adheres to the bumps on the back surface of the component 203 that has been picked up by the tool 35. In this specification, flux 3 may include not only flux alone, but also solder paste containing flux.

[0094] After the flux 3 is applied to the back surface of the component 203, the mounting head 12 is raised by the mounting head lifting mechanism 41, and the mounting head moving mechanism 33 moves the mounting head 12 from the flux application position Pc to the mounting position Pa where the stage 13 holds the substrate 201. The imaging device 18 may also image the component 203 that the tool 35 of the mounting head 12 is adsorbing.

[0095] As shown in Figure 17, when the mounting head 12, which has attracted the component 203, arrives at the mounting position Pa, the mounting head 12 is lowered by the mounting head lifting mechanism 41, as shown in Figure 18, to mount the component 203 onto the substrate 201.

[0096] As described above, the tool 35 adsorbs the component 203 via the film 36 and mounts it onto the substrate 201. This prevents flux from creeping up between the component 203 and the tool 35, even for components with a small thickness, thus preventing poor bonding between the substrate 201 and the component 203.

[0097] Next, the control unit 19 will be described with reference to Figure 21. The control unit 19 is communicated with the touch panel 20, the parts supply unit movement unit 23, the stage movement unit 25, the stage heating unit 27, the mounting head movement mechanism 33, the parts heating unit 37, the tool temperature sensor 39, the mounting head lifting mechanism 41, the pressure sensor 43, the ultrasonic oscillator 45, the lifting mechanism 53, and the imaging device 18.

[0098] The control unit 19 is configured to control the component mounting device 1. The control unit 19 is a circuit including semiconductor elements and includes, for example, a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that realizes predetermined functions by executing a program. The control unit 19 has a storage unit 95 such as memory, hard disk, or SSD, and realizes its functions by executing a program stored in the storage unit 95.

[0099] The control unit 19 includes a mounting control unit 93 that controls the operation of the parts supply unit moving unit 23, the stage moving unit 25, the mounting head moving mechanism 33, and the mounting head lifting mechanism 41, respectively, based on the production program 96 in the storage unit 95.

[0100] The production program 96 is a program necessary to operate the component mounting device 1. The production program 96 includes information such as the component mounting positions (coordinates) on the substrate 201, the names and mounting order of the components 203 to be mounted there, and the amount the mounting head 12 descends when punching holes in the film 36 according to the components 203.

[0101] (Configuration of the imaging device) Next, the imaging device 18 will be described with reference to Figure 22. The imaging device 18 includes a camera 81 that captures an image of the object to be captured, and an illumination unit 83 that illuminates the object to be captured with light.

[0102] The camera 81 is a solid-state image sensor such as a CCD image sensor, a CMOS image sensor, or an infrared image sensor. The camera 81 images the through-hole 36a of the film 36, the component 203 that is attracted to the tool 35, the flux applied to the component 203, etc., and sends the captured image data to the control unit 19. Based on the received image data, the control unit 19 determines whether the shape of the through-hole 36a, the orientation of the component 203, the application state of the flux, etc. are appropriate, and controls the operation of the mounting head moving mechanism 33 and the mounting head lifting mechanism 41 according to the determination result.

[0103] The illumination unit 83 is, for example, a ring illumination unit, in which LED (Light Emitting Diode) elements are arranged in a ring shape. By illuminating the object to be imaged with light from the illumination unit 83, the contrast in the image of the object can be enhanced, allowing the camera 81 to capture a clear image. Furthermore, because it is a ring illumination unit, light can be uniformly irradiated onto the through hole 36a.

[0104] (Effects) As described above, the hole-punching device 16 of the embodiment punches through holes 36a in the thickness direction of the film 36, which is placed on the lower surface 35a of a tool 35 for mounting a component 203 onto a substrate 201, corresponding to component suction holes 35b provided on the lower surface 35a of the tool 35 for suctioning the component 203. The hole-punching device 16 comprises a needle 51 for punching through holes 36a in the film 36, a hole-punching mechanism 54, and a plate 63. The hole-punching mechanism 54 comprises a plate 63 having a through hole 63c from which the needle 51 can move along the longitudinal direction of the needle 51, and a slide mechanism 60 that allows the plate 63 to slide longitudinally between a first position P1 in which the upper end of the needle 51 is housed in the through hole 63c and a second position P2 which is below the first position P1 in which the needle 51 is exposed from the through hole 63c. A plate 73 is located below the plate 63 and supports the needle 51. With the needle 51 positioned directly below the component suction hole 35b, and the film 36 sandwiched between the lower surface 35a of the tool 35 and the upper surface of the plate 63, as the plate 63 descends from the first position P1 to the second position P2, the needle 51, having penetrated the film 36, is inserted into the interior of the component suction hole 35b.

[0105] Furthermore, the component mounting device 1 of the embodiment includes a tool 35 having component suction holes 35b for adsorbing components 203, a mounting head 12 for mounting the components 203 held by the tool 35 onto a substrate 201, a drilling device 16, a mounting head moving mechanism 33 for moving the mounting head 12 to a component supply unit 11 that supplies components 203 via the drilling device 16, and a mounting head lifting mechanism 41 for raising and lowering the mounting head 12. The drilling device 16 includes a needle 51 for drilling through holes 36a in the thickness direction of the film 36, corresponding to the positions of the component suction holes 35b provided on the lower surface 35a of the tool 35, a drilling mechanism 54, and a plate 73. The hole-punching mechanism 54 includes a plate 63 having a through-hole 63c through which the needle 51 can move along the longitudinal direction of the needle 51, and a sliding mechanism 60 that allows the plate 63 to slide vertically between a first position P1 where the upper end of the needle 51 is housed in the through-hole 63c and a second position P2 which is below the first position P1 and where the upper end of the needle 51 is exposed from the through-hole 63c. The plate 73 is located below the plate 63 and supports the needle 51. The needle 51 is positioned directly below the component suction hole 35b, and with the film 36 sandwiched between the lower surface 35a of the tool 35 and the upper surface of the plate 63, the tool 35 pushes down the plate 73 from the first position P1 to the second position P2, causing the plate 63 to descend, and the needle 51 that has penetrated the film 36 is inserted into the inside of the component suction hole 35b.

[0106] By pressing the film 36 down with the needle 51, a through hole 36a is formed in the film 36. Since the film 36 can be sandwiched between the lower surface 35a of the tool 35 and the upper surface of the plate 63 when the through hole 36a is formed, the tension on the film 36 can be reduced. Furthermore, since the area where the through hole 36a is made is not held down, the size of the formed through hole 36a can be prevented from spreading to the surrounding area.

[0107] Furthermore, since the needle 51 is inserted into the film 36 from the plate 63 side toward the component suction hole 35b of the tool 35 to form a through hole 36a, the burrs formed around the through hole 36a can be made to stand up inside the component suction hole 35b. This prevents the burrs from coming into contact with the lower surface 35a of the tool 35 and causing the film 36 to lift away from the lower surface 35a of the tool 35. In this way, interference from burrs when mounting components 203 onto the substrate 201 can be reduced without the need for burr processing. Therefore, the efficiency of the drilling work can be improved.

[0108] Furthermore, because the burrs on the film 36 are located inside the component suction hole 35b of the tool 35, even if the film 36 expands due to the heating of the component 203 when the component 203 is mounted on the substrate 201, the burrs on the film 36 catch on the component suction hole 35b, thereby suppressing the movement of the film 36. Therefore, displacement of the component 203 due to the thermal expansion of the film 36 can be suppressed.

[0109] Furthermore, when using a film with pre-formed through holes, it would normally be necessary to detect pitch misalignment of the through holes and control the amount of film wound by the winding roller. However, since the needle 51 of the hole-punching device 16 is inserted into the component-suction hole 35b of the tool 35 to form through holes 36a in the film 36, such control is not necessary.

[0110] Furthermore, since the tip of the needle 51 is housed within the through-hole 63c of the plate 63 during normal operation other than when drilling, it is safe for the worker.

[0111] Furthermore, as soon as the needle 51 exits the film 36, or immediately afterward, the film 36 positioned on the lower surface 35a of the tool 35 separates from the upper surface of the plate 63. In other words, after the needle 51 penetrates the film 36, the plate 63 rises as the mounting head 12 rises due to the mounting head lifting mechanism 41. As soon as the upper end of the needle 51 is accommodated in the through hole 63c, or immediately afterward, the film 36 positioned on the lower surface 35a of the tool 35 separates from the upper surface of the plate 63.

[0112] When inserting the needle 51 into the film 36 while sandwiching it between the tool 35 and the plate 63, and then removing the needle 51 from the film 36, the film 36 remains sandwiched between the tool 35 and the plate 63 until the needle 51 is removed from the film 36 or hidden in the through-hole 63c of the plate 63. This reduces the likelihood of the burr portion pressed into the component suction hole 35b flipping over and protruding from the component suction hole 35b. As a result, interference from the burr when mounting the component 203 onto the substrate 201 can be further reduced, improving the efficiency of the drilling process.

[0113] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood to be included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0114] Furthermore, by appropriately combining any embodiment or modification from the various embodiments and modifications described above, the effects of each can be achieved.

[0115] The drilling apparatus and component mounting apparatus relating to this disclosure are applicable to component mounting apparatus for applying flux or adhesive to components or substrates, and to drilling apparatus provided in such component mounting apparatus.

[0116] 1 Component mounting device 3 Flux 11 Component supply unit 12 Mounting head 13 Stage 15 Flux supply device 16 Drilling device 17 Beam 18 Imaging device 19 Control unit 20 Touch panel 21 Base 23 Component supply unit movement unit 25 Stage movement unit 27 Stage heating unit 29 Stage tilt adjustment unit 31 Pickup head 33 Mounting head movement mechanism 35 Tool 35a Bottom surface 35b Component suction hole 35c Film suction hole 36 Film 36a Through hole 37 Component heating unit 39 Tool temperature sensor 41 Mounting head lifting mechanism 43 Pressure sensor 45 Ultrasonic oscillator 47 Film transport mechanism 48 Feed roller 49 Take-up roller 50 Recess 51 Needle 52 Drilling head 53 Lifting mechanism 54 55 Drilling mechanism 56 Impact reduction mechanism 57 Guide rail 58 Block 59 Drive unit 59 Housing 59a Opening 59b Opening 59c First side 59d Second side 59e Third side 59f First slot 59g Second slot 60 Slide mechanism 61 Guide rail 62 Block 63 Plate 63a First plate section 63b Second plate section 63c Through hole 64 Support block 65 Biasing member 66 Rod 67 Stopper 70 Slide mechanism 71 Guide rail 72 Block 73 Plate 73a First plate section 73b Second plate section 74 Support block 75 Biasing member 76 Rod 77 Stopper 81 Camera 83 Lighting unit 93 Mounting control unit 95 Memory unit 96 Production program 181 Up / Down Recognition Camera 201 Substrate 203 Components Pa Mounting Position Pb Drilling Position Pc Flux Application Position Pd Transfer Position P1 First Position P2 Second Position P3 Third Position At Area

Claims

1. A hole-punching device for punching a first through-hole in a film placed on the lower surface of a tool for mounting components onto a substrate, corresponding to a component adsorption hole provided on the lower surface of the tool for adsorbing the component, the device comprising: a needle for punching the first through-hole in the film; a first plate having a second through-hole from which the needle can move along the longitudinal direction of the needle; a first sliding mechanism that allows the first plate to slide longitudinally between a first position in which the upper end of the needle is housed in the second through-hole and a second position below the first position in which the needle is exposed from the second through-hole; and a second plate located below the first plate and supporting the needle, wherein the needle is positioned directly below the component adsorption hole, and as the first plate descends from the first position toward the second position with the film sandwiched between the lower surface of the tool and the upper surface of the first plate, the needle that has penetrated the film is inserted into the component adsorption hole.

2. The drilling device according to claim 1, wherein the drilling mechanism is biased in the direction from the second position toward the first position.

3. The hole-punching device according to claim 1, wherein the film positioned on the lower surface of the tool separates from the upper surface of the first plate at the same time as, or after, the needle is removed from the film.

4. The drilling device according to claim 1, comprising a second sliding mechanism that allows the second plate to slide vertically, wherein the second sliding mechanism lowers the second plate in accordance with the descending first plate, and the second plate is biased in the direction from the second position toward the first position.

5. The drilling device according to claim 4, comprising a housing that supports the drilling mechanism, the housing having a first slot extending vertically on a first side surface of the housing, the first sliding mechanism comprising a first guide rail extending vertically and fixed to the inside of the first side surface of the housing, a first block to which the first plate is fixed and which is slidable on the first guide rail, a first rod fixed to the lower part of the first block or the first plate and extending from the inside to the outside of the housing through the first slot, and a first stopper that restricts the upward movement of the first rod, the first rod being biased in the direction from the second position toward the first position.

6. The drilling device according to claim 5, wherein the housing has a second slot extending vertically on a second side parallel to the first side, the second sliding mechanism comprises a second guide rail extending vertically and fixed to the inside of the second side, a second block on which the second plate is fixed and which is slidable on the second guide rail, a second rod fixed to the lower part of the second block or the second plate and extending from the inside to the outside of the housing through the second slot, and a second stopper that restricts the upward movement of the second rod, the second rod being biased in the direction from the second position toward the first position.

7. The drilling device according to claim 1, wherein the drilling device has a first lifting mechanism that moves the needle, the drilling mechanism, and the second plate up and down integrally.

8. A mounting head comprising a tool having a component suction hole for adsorbing a component, and mounting the component held by the tool onto a substrate; a hole punching device having a needle for punching a first through hole in a film placed on the lower surface of the tool, corresponding to the position of the component suction hole provided on the lower surface of the tool, in the thickness direction of the film; a mounting head moving mechanism for moving the mounting head to a component supply unit that supplies the component via the hole punching device; and a mounting head lifting mechanism for raising and lowering the mounting head, wherein the hole punching device comprises a first plate having a second through hole from which the needle can move along the longitudinal direction of the needle, a first slide mechanism that allows the first plate to slide longitudinally between a first position in which the upper end of the needle is housed in the second through hole and a second position below the first position in which the needle is exposed from the second through hole, and a second plate located below the first plate and supporting the needle, A component mounting device in which the needle is positioned directly below the component suction hole, and with the film sandwiched between the lower surface of the tool and the upper surface of the first plate, the tool pushes down the first plate from the first position to the second position, causing the first plate to descend and the needle, which has penetrated the film, to be inserted into the component suction hole.

9. The component mounting device according to claim 8, wherein the drilling mechanism is biased in the direction from the second position toward the first position.

10. The component mounting device according to claim 8, wherein the film positioned on the lower surface of the tool separates from the upper surface of the first plate at the same time as, or after, the needle is removed from the film.

11. The component mounting device according to claim 8, wherein, after the needle has penetrated the film, the mounting head rises due to the mounting head lifting mechanism, causing the first plate to rise, and at the same time as, or after, the upper end of the needle is housed in the second through-hole, the film positioned on the lower surface of the tool separates from the upper surface of the first plate.

12. The component mounting device according to claim 8, wherein the drilling device comprises a second sliding mechanism that allows the second plate to slide vertically, the second sliding mechanism lowers the second plate in accordance with the descending first plate, and the second plate is biased in the direction from the second position toward the first position.

13. The component mounting device according to claim 12, wherein the drilling device comprises a housing that supports the drilling mechanism, the housing comprises a first slot extending vertically on a first side surface of the housing, the first sliding mechanism comprises a first guide rail extending vertically and fixed to the inside of the first side surface of the housing, a first block on which the first plate is fixed and which is slidable on the first guide rail, a first rod fixed to the lower part of the first block or the first plate and extending from the inside to the outside of the housing through the first slot, and a first stopper that restricts the upward movement of the first rod, the first rod being biased in the direction from the second position to the first position.

14. The component mounting device according to claim 13, wherein the housing has a second slot extending vertically on a second side parallel to the first side, the second sliding mechanism comprises a second guide rail extending vertically and fixed to the inside of the second side, a second block on which the second plate is fixed and which is slidable on the second guide rail, a second rod fixed to the lower part of the second block or the second plate and extending from the inside to the outside of the housing through the second slot, and a second stopper that restricts the upward movement of the second rod, the second rod being biased in the direction from the second position toward the first position.

15. The component mounting device according to claim 8, wherein the drilling device has a first lifting mechanism that moves the needle, the drilling mechanism, and the second plate up and down integrally.

Images