Wafer processing apparatus
The wafer processing device addresses the cost and space inefficiencies of separate wafer and wafer module processing by integrating flexible processing modes and shared equipment, enhancing efficiency and reducing equipment needs.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TECHNICS
- Filing Date
- 2025-08-11
- Publication Date
- 2026-05-15
AI Technical Summary
Existing semiconductor equipment is costly due to the need for separate devices to process wafers and wafer modules of different sizes, leading to inefficiencies and increased space requirements.
A wafer processing device capable of selectively processing wafers and wafer modules, featuring a processing unit, alignment unit, inversion unit, and transfer unit with detachable end effectors, allowing flexible processing modes and shared equipment for different wafer types.
Reduces equipment costs and idle time by enabling flexible processing of various wafer sizes and types within a single device, optimizing space usage and improving production efficiency.
Smart Images
Figure KR2025012114_15052026_PF_FP_ABST
Abstract
Description
Wafer processing unit
[0001] An exemplary embodiment relates to a wafer processing apparatus.
[0002] In a wafer processing device, a wafer processing device for processing a wafer and a wafer processing device for processing a wafer module including a ring frame may be provided as separate devices.
[0003] If a single wafer processing unit capable of selectively processing wafers and wafer modules is provided, semiconductor equipment costs, etc., can be saved.
[0004] A wafer processing device capable of selectively processing wafers and wafer modules is provided.
[0005] A wafer processing device according to an exemplary embodiment is configured to selectively process wafers of different sizes and return them to a cassette, and comprises: a processing unit for processing the wafers; an alignment unit configured to align the wafers supplied to the processing unit; an inversion unit configured to invert a wafer of a predetermined size among the wafers; and a transfer unit configured to transfer the wafers between the processing unit, the alignment unit, and the inversion unit. The transfer unit includes an end effector that contacts the wafers, and the end effector may be detachably mounted on the transfer unit.
[0006] The wafer of a predetermined size that the above-mentioned inversion part can invert includes a first wafer that is transported by a ring frame supported from the outside, and the ring frame and the first wafer can form a wafer module.
[0007] The wafer includes a second wafer having a different size from the first wafer, and the end effector includes a first end effector and a second end effector which are optionally mounted according to the user's choice, the first end effector is configured to transport the wafer module, and the second end effector may be configured to transport the second wafer.
[0008] The second end effector applies negative pressure to the surface of the second wafer to perform an inversion operation, and the first end effector can unload the wafer module to the inversion unit and reload the wafer module inverted by the inversion unit.
[0009] The processing unit may include a chuck table that provides a workspace for the wafer or wafer module and a lifting guide that supports at least a portion of the ring frame from below and is configured to seat the wafer module on the chuck table or raise it relative to the chuck table as it descends or ascends relative to the chuck table.
[0010] When the lifting guide is in a raised state, a handling area is provided so that the first end effector can enter and exit the lower side of the lifting guide, and the first end effector can be configured to load or unload the wafer module onto the lifting guide by entering and exiting the handling area.
[0011] The alignment unit may include a first support member configured to support the second wafer from below when the second wafer is in an alignment waiting state, and a second support member configured to support the ring frame from below when the wafer module is in an alignment waiting state.
[0012] The above transfer unit may have at least two.
[0013] The above-mentioned inversion part may be configured so that the clamping assembly supports the rotation of the wafer module by fixing the ring frame.
[0014] The clamping assembly includes a first clamp and a second clamp positioned to face each other, and the first clamp and the second clamp may be configured to move toward each other or away from each other.
[0015] The first clamp and the second clamp may be configured to fix the ring frame by moving closer to each other, or to release the fixation to the ring frame by moving away from each other.
[0016] The first clamp and the second clamp may each include a plurality of first grips and a plurality of second grips arranged symmetrically with respect to the center.
[0017] The clamping assembly can prevent damage to the first wafer by providing a floating area defined as the space between the plurality of first grips and the plurality of second grips between the first clamp and the second clamp.
[0018] The plurality of first grips and the plurality of second grips can each protrude toward each other at the ends of the first clamp and the second clamp.
[0019] The above transfer unit may be configured to perform direct inversion when the workpiece is the second wafer, and to transfer the wafer module to the inversion unit when the workpiece is the wafer module.
[0020] The wafer processing device can determine whether to transfer the workpiece to the inversion unit depending on the type of end effector included in the transfer unit.
[0021] The wafer processing device can determine whether to transfer the workpiece to the inversion unit depending on the type of the cassette.
[0022] A wafer processing device according to an exemplary embodiment can provide a wafer processing device capable of selectively processing wafers and wafer modules through an end effector configuration that is detachably mounted on a transfer unit.
[0023] A wafer processing device according to an exemplary embodiment can provide a wafer processing device that supports the rotation of a wafer module by fixing a ring frame through an inversion section configuration including a clamping assembly.
[0024] A method for applying a work path of a wafer processing device according to an exemplary embodiment provides a different path depending on the workpiece, thereby providing a method for applying a work path of a wafer processing device that can flexibly respond to different types of workpieces.
[0025] FIG. 1 is a perspective view of a wafer processing apparatus according to an exemplary embodiment.
[0026] FIG. 2 is a plan view of a wafer processing apparatus according to an exemplary embodiment.
[0027] FIG. 3 is a perspective view of a wafer supply module according to an exemplary embodiment.
[0028] FIG. 4 is a perspective view illustrating a transfer unit to which a first end effector is applied according to an exemplary embodiment.
[0029] FIG. 5 is a plan view illustrating a different first end effector in an exemplary embodiment.
[0030] FIG. 6 is a perspective view illustrating a transfer unit to which a second end effector is applied according to an exemplary embodiment.
[0031] FIG. 7 is a perspective view illustrating a chuck table according to an exemplary embodiment.
[0032] FIG. 8 is a perspective view illustrating a chuck table according to an exemplary embodiment.
[0033] FIG. 9 is a perspective view illustrating an inversion section according to an exemplary embodiment.
[0034] FIG. 10 is a conceptual diagram illustrating the operation of an inversion unit according to an exemplary embodiment.
[0035] FIG. 11 is a conceptual diagram illustrating the operation of an inversion unit according to an exemplary embodiment.
[0036] FIG. 12 is a perspective view illustrating an alignment part according to an exemplary embodiment.
[0037] FIG. 13 is a perspective view illustrating an alignment part according to an exemplary embodiment.
[0038] FIG. 14 is a flowchart illustrating a method for applying a work path of a wafer processing device according to an exemplary embodiment.
[0039] FIG. 15 is a flowchart illustrating a method for applying a work path of a wafer processing device according to an exemplary embodiment.
[0040] Hereinafter, exemplary embodiments will be described in detail with reference to the attached drawings. In the drawings below, the same reference numerals denote the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience of explanation. Meanwhile, the embodiments described below are merely exemplary, and various modifications are possible from these embodiments. In the following, terms such as "upper" or "upper" may include not only those located directly above, below, left, or right in contact, but also those located above, below, left, or right in non-contact. A singular expression includes a plural expression unless the context clearly indicates otherwise. Furthermore, when a part is described as "comprising" a component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. The use of the term "above" and similar descriptive terms may apply to both the singular and plural. Unless there is an explicit description of the order of the steps constituting the method, these steps may be performed in a suitable order and are not necessarily limited to the described order. Additionally, terms such as "...part," "module," etc., as used in the specification refer to a unit that performs at least one function or operation, which may be implemented in hardware or software, or a combination of hardware and software. The connections of lines or connecting members between components depicted in the drawings are exemplary representations of functional connections and / or physical or circuit connections, and may be replaced or additionally represented as various functional connections, physical connections, or circuit connections in the actual device. The use of all examples or exemplary terms is merely intended to describe the technical concept in detail and, unless limited by the claims, the scope is not limited by such examples or exemplary terms.
[0041] Below, a wafer processing device and a method for applying a work path of the wafer processing device according to an exemplary embodiment will be described in more detail.
[0042] Within the specification, the term "wafer" may be used as a general term for all wafers having different sizes. Wafers of different sizes may be referred to as a first wafer, a second wafer, etc., but are not limited thereto. The first wafer may refer to a substrate supported by a carrier including a ring frame. The second wafer may refer to a substrate not supported by a carrier including a ring frame. The first wafer may be carried by a ring frame, but is not limited thereto. The ring frame may support the first wafer from the outside. The term "wafer module" may be used to refer to a wafer-ring frame assembly. The substrate included in the wafer module may be referred to as the first wafer. The wafer module may include a ring frame surrounding the outside of the first wafer. The wafer module may include a film connecting the ring frame and the first wafer. The film may be, for example, a porous film, but is not limited thereto. The ring frame and the film of the wafer module may serve as a carrier by supporting the first wafer. The wafer module may include a film frame carrier (FFC). However, this is merely an exemplary description and is not limited thereto.
[0043] Meanwhile, the term "wafer" as used within the specification may refer to both the first wafer and the second wafer. Where not explicitly referred to as the first wafer or the second wafer, "wafer" may refer to both the first wafer and the second wafer.
[0044] FIG. 1 is a perspective view of a wafer processing device (1) according to an exemplary embodiment. FIG. 2 is a plan view of a wafer processing device (1) according to an exemplary embodiment.
[0045] Referring to FIGS. 1 and 2, a wafer processing apparatus (1) according to an exemplary embodiment may be configured to process a wafer. Herein, processing the wafer may include loading the wafer at a specific location or unloading it at a specific location, in addition to performing physical / chemical operations on the wafer directly or indirectly.
[0046] A wafer processing device (1) may be configured to selectively process a wafer module (31) or a second wafer (32) including a ring frame (310) and return it to a cassette (2). Here, processing the wafer module (31) by the wafer processing device (1) may mean processing the first wafer (311) included in the wafer module (31). Selectively processing the wafer module (31) or the second wafer (32) by the wafer processing device (1) may mean that the wafer processing device (1) processes a specific type of wafer according to the user's selection. The wafer processing device (1) may have multiple processing modes. The wafer processing device (1) may change to a specific processing mode among the multiple processing modes according to the user's selection. For example, the user may apply the first wafer (311) processing mode to the wafer processing device (1) to process the first wafer (311). For example, the user may apply a second wafer (32) processing mode to the wafer processing device (1) to process the second wafer (32). In other words, the wafer processing device (1) may be equipped with multiple processing modes so as to process multiple types of wafers according to the user's purpose.
[0047] A wafer processing device (1) according to an exemplary embodiment may include a processing unit (7) configured to process a wafer. The wafer may be processed inside the processing unit (7). Processing of the wafer by the processing unit (7) may include, for example, grooving or dicing processes, but is not limited thereto. A wafer that may be supplied into the processing unit (7) may include a first wafer (311) or a second wafer (32). Supplying the first wafer (311) into the processing unit (7) may mean supplying a wafer module (31) into the processing unit (7), but is not limited thereto.
[0048] A wafer processing device (1) according to an exemplary embodiment may include an alignment unit (6). The alignment unit (6) may be configured to align a wafer supplied to a processing unit (7). The alignment unit (6) may align the wafer before the wafer is transferred into the processing unit (7). A wafer that the alignment unit (6) can align may include a wafer module (31) or a second wafer (32).
[0049] A wafer processing device (1) according to an exemplary embodiment may include an inversion unit (5). The inversion unit (5) may be configured to invert a wafer module (31). The wafer module (31) may be inverted by the inversion unit (5). The specific operation of the inversion unit (5) will be described later.
[0050] A wafer processing device (1) according to an exemplary embodiment includes a transfer unit (4). The transfer unit (4) can load a wafer from a cassette (2). In other words, the transfer unit (4) can move a wafer from the cassette (2) into the interior of the wafer processing device (1). Additionally, the transfer unit (4) can return a wafer processed inside the wafer processing device (1) to the cassette (2). The transfer unit (4) can transfer a wafer inside the wafer processing device (1). The transfer unit (4) can be configured to transfer a wafer module (31) and a second wafer (32) between the cassette (2), the processing unit (7), the alignment unit (6), and the inversion unit (5).
[0051] In other words, within the wafer processing device (1), the wafer can be transported between the processing unit (7), the alignment unit (6), and the inversion unit (5) by the transport unit (4). The transport unit (4) can be configured to invert the second wafer (32). The transport unit (4) can provide different work paths to the wafer module (31) and the second wafer (32), respectively, within the wafer processing device (1). The specific operation of the transport unit (4) will be described later.
[0052] FIG. 3 is a perspective view of a wafer supply module (20) according to an exemplary embodiment.
[0053] Referring to FIGS. 1 to 3, a wafer processing device (1) according to an exemplary embodiment may include a cassette (2). The cassette (2) may constitute a part of the wafer processing device (1), but is not limited thereto. For example, the cassette (2) may be placed on one side of the wafer processing device (1), and as the wafer processing operation proceeds, the cassette (2) may be separated or replaced with a different type of cassette (2).
[0054] A cassette (2) according to an exemplary embodiment can accommodate wafers. The cassette (2) can accommodate a plurality of wafers processed by a wafer processing device (1). In other words, a plurality of wafers processed by a wafer processing device (1) can be accommodated by the cassette (2). A wafer processed by a wafer processing device (1) can be returned to the cassette (2). In other words, the wafer processing device (1) can process the wafers accommodated by the cassette (2) and transfer the processed wafers back to the cassette (2).
[0055] According to an exemplary embodiment, the cassette (2) may constitute at least a part of the wafer supply module (20). In other words, the wafer supply module (20) may include the cassette (2). The wafer supply module (20) may supply wafers inside the cassette (2) into the interior of the wafer processing device (1). The wafer supply module (20) may be an Equipment Front End Module (EFEM). The wafer supply module (20) may be a Load Port Module (LPM). However, the type of wafer supply module (20) is not limited to the above description, and various types of wafer supply modules (20) capable of supplying wafers into the interior of the wafer processing device (1) may be provided.
[0056] There may be multiple cassettes (2). For example, there may be two cassettes (2), but this is not limited thereto. If there are multiple cassettes (2), the wafer processing device (1) can load a wafer into at least some of the multiple cassettes (2) while simultaneously unloading a wafer into at least some of the other cassettes.
[0057] The term cassette (2) may collectively refer to a first cassette (21) that accommodates a second wafer (32) and a second cassette (22) that accommodates a wafer module (31). There may be at least two types of cassettes (2). More specifically, the cassette (2) may be at least one of the first cassette (21) that accommodates a second wafer (32) and the second cassette (22) that accommodates a wafer module (31). However, the types of cassettes (2) are not limited thereto and may include various types of cassettes (2) capable of accommodating wafers.
[0058] The wafer supply module (20) may be configured to accommodate a first cassette (21). The wafer supply module (20) may be configured to accommodate a second cassette (22). The wafer supply module (20) may be configured to accommodate multiple cassettes (2). The wafer supply module (20) may be configured to accommodate the first cassette (21) and the second cassette (22) simultaneously, but is not limited thereto.
[0059] The first cassette (21) provided to the wafer processing device (1) may be provided with a second wafer (32) inside the wafer processing device (1). The second cassette (22) provided to the wafer processing device (1) may be provided with a wafer module (31) inside the wafer processing device (1). However, the first cassette (21) and the second cassette (22) may be provided to the wafer processing device (1) simultaneously, or only one of the cassettes may be provided.
[0060] One type of cassette (2), for example, two first cassettes (21), may be provided in the wafer processing device (1). Another type of cassette (2), for example, two second cassettes (22), may be provided in the wafer processing device (1). The first cassette (21) may be, for example, a Foup. However, the above description regarding the number and type of cassettes (2) is merely an exemplary description and is not limited thereto.
[0061] FIG. 4 is a perspective view for explaining a transfer unit (4) to which a first end effector (41) according to an exemplary embodiment is applied.
[0062] Referring to FIGS. 1 through 4, a transfer unit (4) according to an exemplary embodiment may be configured to transfer a wafer between a cassette (2), a processing unit (7), an alignment unit (6), and an inversion unit (5). The transfer unit (4) may include an end effector configured to contact the wafer. The end effector may handle the wafer by contacting the wafer. Handling the wafer by the end effector may include loading and unloading the wafer or transferring the wafer.
[0063] According to an exemplary embodiment, there may be a plurality of transfer units (4). The transfer unit (4) may include a first transfer unit (401) and a second transfer unit (402). The first transfer unit (401) and the second transfer unit (402) may each perform different operations. For example, the first transfer unit (401) may load a wafer inside a cassette (2) into the interior of a wafer processing device (1). For example, the second transfer unit (402) may return a wafer processed by the wafer processing device (1) to the cassette (2). However, the above description regarding the relationship between the number of transfer units (4) and the operations of the plurality of transfer units (4) is merely an exemplary description and is not limited thereto.
[0064] FIG. 5 is a plan view illustrating a first end effector (41) according to an exemplary embodiment.
[0065] Referring to FIGS. 1 to 5, the end effector of the transfer unit (4) according to an exemplary embodiment may include a first end effector (41) configured to handle a wafer module (31). The first end effector (41) can load, unload, or transfer the wafer module (31) by contacting (supporting) the wafer module (31) from below.
[0066] According to an exemplary embodiment, the first end effector (41) may include at least two support members (410) that extend in one direction at a predetermined distance apart from each other. The first end effector (41) may contact the ring frame (310) in at least four areas at the bottom of the wafer module (31).
[0067] More specifically, at least two support members (410) included in the first end effector (41) each support the wafer module (31) from below and can contact the ring frame (310) in two areas each. When the first end effector (41) contacts the ring frame (310) in at least three areas from below the wafer module (31), the first end effector (41) can stably handle the wafer module (31). However, the above description regarding the shape of the first end effector (41) and the method of supporting the wafer module (31) is merely an exemplary description and is not limited thereto.
[0068] FIG. 6 is a perspective view illustrating a second end effector (42) according to an exemplary embodiment.
[0069] Referring to FIGS. 1 through 6, the end effector of the transfer unit (4) according to an exemplary embodiment may include a second end effector (42) configured to handle a second wafer (32). The second end effector (42) can load, unload, or transfer the second wafer (32) by contacting the second wafer (32).
[0070] According to an exemplary embodiment, the second end effector (42) can adsorb the second wafer (32) using negative pressure through a passage formed inside. The second end effector (42) can perform an inversion operation by applying negative pressure to the surface of the second wafer (32). The transfer unit (4) can invert the second wafer (32) by rotating the second end effector (42). After inverting the second wafer (32) through the second end effector (42), the transfer unit (4) can transfer the second wafer (32) to the alignment unit (6). However, the operation of the transfer unit (4) is not limited to the above description. For example, when the transfer unit (4) handles the wafer module (31) through the first end effector (41), a different work path may be applied.
[0071] Meanwhile, the size of the first wafer (311) included in the wafer module (31) according to the exemplary embodiment may differ from the size of the second wafer (32). The size of the wafer module (31) may be larger than the size of the second wafer (32). If the size of the wafer module (31) is large, it may be difficult for the transfer unit (4) to directly perform an inversion operation on the wafer module (31). If the size of the wafer module (31) is large, the transfer unit (4) may exceed the allowable load to invert the wafer module (31). If the size of the wafer module (31) is large, the wafer processing device (1) may apply a different work path to the wafer module (31) than that of the second wafer (32). If the size of the wafer module (31) is large, the wafer processing device (1) may transfer the wafer module (31) to the inversion unit (5) so that the wafer module (31) can be inverted.
[0072] According to an exemplary embodiment, the transfer unit (4) can transfer the wafer module (31) to the inversion unit (5) through the first end effector (41). When the transfer unit (4) handles the wafer module (31) through the first end effector (41), the wafer module (31) may not be directly inverted. More specifically, when the transfer unit (4) handles the wafer module (31) through the first end effector (41), the wafer module (31) may be transferred to the inversion unit (5), and an inversion operation may be performed through the inversion unit (5). The first end effector (41) of the transfer unit (4) can indirectly invert the wafer module (31) by unloading the wafer module (31) to the inversion unit (5) and reloading the inverted wafer module (31).
[0073] A wafer processing device (1) according to an exemplary embodiment may apply different processing modes depending on whether the first end effector (41) or the second end effector (42) is mounted on the transfer unit (4).
[0074] More specifically, if the end effector mounted on the transfer unit (4) is the first end effector (41), the wafer processing device (1) can apply the wafer module (31) processing mode. If the end effector mounted on the transfer unit (4) is the second end effector (42), the wafer processing device (1) can apply the second wafer (32) processing mode.
[0075] When the wafer processing device (1) is in the wafer module (31) processing mode, the transfer unit (4) can directly invert the wafer module (31) by inverting the first end effector (41). When the wafer processing device (1) is in the second wafer (32) processing mode, the transfer unit (4) can indirectly invert the second wafer (32) by transferring the second wafer (32) to the inversion unit (5) through the second end effector (42).
[0076] An end effector according to an exemplary embodiment may be detachably mounted on a transfer unit (4). More specifically, the end effector may include a first end effector (41) and a second end effector (42) which are optionally mounted depending on the choice.
[0077] By selectively mounting a first end effector (41) or a second end effector (42) on the transfer unit (4), the type of wafer to be processed by the transfer unit (4) can be selected. By selectively mounting the first end effector (41) or the second end effector (42) on the transfer unit (4), the user can apply a work path for the transfer unit (4) to transport the wafer. For example, if the user mounts the first end effector (41) on the transfer unit (4), the transfer unit (4) of the wafer processing device (1) can directly invert the wafer module (31) by inverting the first end effector (41). For example, when a user mounts a second end effector (42) to a transfer unit (4), the transfer unit (4) of the wafer processing device (1) can indirectly invert the second wafer (32) by transferring the second wafer (32) to an inversion unit (5) through the second end effector (42).
[0078] A wafer processing device (1) according to an exemplary embodiment can selectively process a wafer module (31) and a second wafer (32), thereby providing a wafer processing device that can be used flexibly as needed. Specifically, the idle time of the wafer processing device can be reduced.
[0079] A wafer processing device (1) according to an exemplary embodiment compresses separate wafer processing devices that process a wafer module (31) and a second wafer (32) into a single wafer processing device, thereby saving space in the production line.
[0080] In addition, the wafer processing device (1) according to the exemplary embodiment can reduce the need to introduce separate devices for processing the wafer module (31) and the second wafer (32) by selectively processing the wafer module (31) and the second wafer (32), thereby reducing the cost of introducing the equipment. The wafer processing device (1) can process different types of wafers in one device by changing the processing mode in one device without the need to move the workpiece to separate equipment to process different types of wafers, thereby reducing bottlenecks in the process and improving the efficiency per unit time of the process.
[0081] FIG. 7 is a perspective view illustrating a chuck table (70) according to an exemplary embodiment. FIG. 8 is a perspective view illustrating a chuck table (70) according to an exemplary embodiment.
[0082] Referring to FIGS. 1 through 8, a processing unit (7) according to an exemplary embodiment may include a chuck table (70) that provides a workspace on a wafer. The processing unit (7) may include a lifting guide (71) configured to support at least a portion of a ring frame (310) from below so that a first end effector (41) can easily load a wafer module (31). The lifting guide (71) may be positioned to surround the outer circumference of the chuck table (70).
[0083] A lifting guide (71) according to an exemplary embodiment may operate when the wafer processing device (1) processes a wafer module (31). The lifting guide (71) may not operate when the wafer processing device (1) processes a second wafer (32). In other words, the lifting guide (71) may operate when the wafer processing device (1) is in wafer module (31) processing mode, but is not limited thereto.
[0084] According to an exemplary embodiment, the lifting guide (71) may be configured to load or unload the ring frame (310) in a raised state. The lifting guide (72) may be configured to load the wafer module (31) onto the chuck table (70) in a lowered state.
[0085] When the ring frame (310) is loaded or unloaded while the lifting guide (71) according to an exemplary embodiment is in a raised state, a handling area (710) through which the first end effector (41) can enter and exit may be provided. More specifically, the support portion (410) of the first end effector (41) can load or unload the wafer module (31) by entering and exiting the handling area (710) provided on the lower side of the lifting guide (71). The lifting guide (71) can operate to facilitate handling of the wafer module (31) by providing a handling area (710) through which the first end effector (41) enters and exits on the lower side via raising.
[0086] A lifting guide (71) according to an exemplary embodiment may be configured to descend or ascend relative to a chuck table (70). When the lifting guide (71) descends relative to the chuck table (70) while supporting at least a portion of the ring frame (310), a wafer module (31) may be seated on the chuck table (70). When the lifting guide (71) ascends relative to the chuck table (70) while supporting at least a portion of the ring frame (310), a handling area (710) through which a first end effector (41) can enter and exit may be provided.
[0087] According to an exemplary embodiment, the lifting guide (71) can load the wafer module (31) onto the chuck table (70) by lowering it while the wafer module (31) is loaded. The lifting guide (71) can operate to load the wafer module (31) onto the chuck table (70) by lowering it so that the wafer module (31) can be properly processed within the processing section (7). However, the above description regarding the function and role of the lifting guide (71) is merely an exemplary description and is not limited thereto.
[0088] A lifting guide (71) according to an exemplary embodiment can raise and lower the ring frame (310) of a wafer module (31) in an up-and-down direction. The lifting guide (71) can raise and lower the wafer module (31) in an up-and-down direction by raising and lowering the ring frame (310) of the wafer module (31). The lifting guide (71) can load the wafer module (31) onto the first end effector (41) by raising the ring frame (310). For example, the lifting guide (71) can provide a space in which the first end effector (41) can be inserted into the lower part of the wafer module (31) by raising the ring frame (310). After the first end effector (41) is inserted into the lower part of the wafer module (31), the lifting guide (71) can load the wafer module (31) onto the first end effector (41) by lowering the ring frame (310). The lifting guide (71) can load the wafer module (31) onto the first end effector (41) without directly applying force to the first wafer (311) of the wafer module (31) by raising and lowering the ring frame (310). However, the above description regarding the function and role of the lifting guide (71) is merely an exemplary description and is not limited thereto.
[0089] FIG. 9 is a perspective view for explaining an inversion unit (5) according to an exemplary embodiment. FIG. 10 is a conceptual diagram for explaining the operation of an inversion unit (5) according to an exemplary embodiment. FIG. 11 is a conceptual diagram for explaining the operation of an inversion unit (5) according to an exemplary embodiment. In this case, FIG. 10 and FIG. 11 may be cross-sectional views conceptually illustrated by enlarging area A of FIG. 9.
[0090] Referring to FIGS. 5, 6, 9 through 11, the inversion unit (5) according to an exemplary embodiment may be configured to invert a wafer module (31) in order to invert a wafer. The inversion unit (5) may include a clamping assembly (50) that supports the rotation of the wafer module (31). The inversion unit (5) may include a connecting arm (500) and a rotor (501). The connecting arm (500) connects the clamping assembly (50) and the rotor (501) and can transmit the rotation of the rotor (501) to the clamping assembly (50). Below, the operation of the clamping assembly (50) that supports the rotation of the wafer module (31) will be described in more detail.
[0091] A clamping assembly (50) according to an exemplary embodiment can support rotation of the wafer module (31) by fixing the ring frame (310) of the wafer module (31). The clamping assembly (50) may include a first clamp (51) and a second clamp (52) arranged to face each other. The first clamp (51) and the second clamp (52) may move in a direction toward each other or away from each other. The first clamp (51) and the second clamp (52) may each move in opposite directions.
[0092] For example, when the first clamp (51) moves in an upward direction, the second clamp (52) may move in a downward direction. When the first clamp (51) moves in an upward direction and the second clamp (52) moves in a downward direction, space may be provided for the first end effector (41) of the transfer unit (4) to unload the wafer module (31) into the clamping assembly (50). For example, when the first clamp (51) moves in a downward direction, the second clamp (52) may move in an upward direction.
[0093] When the first clamp (51) moves downward and the second clamp (52) moves upward, the first end effector (41) of the transfer unit (4) can complete the unloading of the wafer module (31). After unloading the wafer module (31) into the clamping assembly (50), the first end effector (41) of the transfer unit (4) may retract to avoid interference during the inversion operation of the clamping assembly (50). However, the above description regarding the operation of the first clamp (51), the second clamp (52), and the first end effector (41) is merely an exemplary description and is not limited thereto.
[0094] According to an exemplary embodiment, the first clamp (51) and the second clamp (52) may each include a first grip (510) and a second grip (520). The first grip (510) and the second grip (520) may each be formed in a direction facing each other on the first clamp (51) and the second clamp (52).
[0095] The first grip (510) and the second grip (520) may be parts that define the limits of the range of motion when the first clamp (51) and the second clamp (52) approach each other in adjacent directions. The ring frame (310) of the wafer module (31) may come into contact with the first grip (510) and the second grip (520). The first clamp (51) and the second clamp (52) may move up and down until the first grip (510) and the second grip (520) come into contact with the ring frame (310) of the wafer module (31).
[0096] When the first grip (510) and the second grip (520) come into contact with the ring frame (310) as the first clamp (51) and the second clamp (52) move closer to each other, the first grip (510) and the second grip (520) can apply a compressive force to the ring frame (310). In other words, the first clamp (51) and the second clamp (52) of the clamping assembly (50) can fix the ring frame (310) by moving closer to each other.
[0097] However, the operation of the first clamp (51) and the second clamp (52) is not limited to the above description. For example, the ring frame (310) can be fixed by the first clamp (51) not moving and the second clamp (52) moving up and down. For example, the ring frame (310) can be fixed by the first clamp (51) moving up and down without the second clamp (52) moving.
[0098] According to an exemplary embodiment, the first clamp (51) and the second clamp (52) can release the fixation to the ring frame (310) by moving away from each other. In other words, the first clamp (51) and the second clamp (52) can fix the ring frame (310) or release the fixation to the ring frame (310) by moving closer to each other or away from each other. However, the above description regarding the operation of the first clamp (51) and the second clamp (52) is merely an exemplary description and is not limited thereto.
[0099] According to an exemplary embodiment, the first clamp (51) and the second clamp (52) may be arranged to overlap in the vertical direction. In the first clamp (51) and the second clamp (52), a plurality of first grips (510) and second grips (520) may each be arranged symmetrically.
[0100] More specifically, a plurality of first grips (510) may be arranged point-symmetrically with respect to the area where the connecting arm is joined at the first clamp (51). A plurality of second grips (520) may be arranged point-symmetrically with respect to the area where the connecting arm is joined at the second clamp (52). For example, four first grips (510) and four second grips (520) may be arranged, but are not limited thereto.
[0101] A clamping assembly (50) according to an exemplary embodiment may include a floating area (53). The clamping assembly (50) can prevent damage to the wafer module (31) by providing a floating area (53) between a first clamp (51) and a second clamp (52). The floating area (53) may be defined as a space between a plurality of first grips (510) and a plurality of second grips (520). The floating area (53) may be a space in which a first wafer (311) of the wafer module (31) is received. The first wafer (311) of the wafer module (31) may not come into contact with the first clamp (51) and the second clamp (52) within the floating area (53). If the first wafer (311) of the wafer module (31) does not come into contact with the first clamp (51) and the second clamp (52), damage to the first wafer (311) can be prevented.
[0102] FIG. 12 is a perspective view for explaining an alignment part (6) according to an exemplary embodiment. FIG. 13 is a perspective view for explaining an alignment part (6) according to an exemplary embodiment.
[0103] Referring to FIGS. 1, 2, 12, and 13, an alignment unit (6) according to an exemplary embodiment can determine the alignment state of a wafer by recognizing a notch of the wafer. The alignment unit (6) may include a sensing unit (60). The sensing unit (60) may include, for example, a vision camera. For example, the first wafer (311) may include a notch (3210) formed inwardly on the outer side. The alignment state of the first wafer (311) can be determined by the sensing unit (60) directly sensing the notch of the first wafer (311). The alignment unit (6) can align the wafer by rotating the wafer at a predetermined angle with the center of the wafer as an axis, so that the processing unit (7) can process the wafer easily. When the alignment unit (6) performs alignment by directly sensing the notch (3210) of the first wafer (311), the accuracy of the alignment may be excellent. However, the above description regarding the function and role of the alignment unit (6) is merely an exemplary description and is not limited thereto.
[0104] According to an exemplary embodiment, the alignment member (6) may include a first support member (61) and a second support member (62). The first support member (61) may be a member that supports the second wafer (32) when the second wafer (32) is in an alignment waiting state. Here, the alignment waiting state may be a state in which the loading of the wafer on the alignment member (6) is completed before the alignment member (6) performs an alignment operation. The first support member (61) may support the second wafer (32) from below. The second support member (62) may support the wafer module (31) from below. Below, the function and shape of the second support member (62) will be described in detail.
[0105] According to an exemplary embodiment, the second support member (62) may be a member that supports the wafer module (31) when the wafer module (31) is in an alignment waiting state. The second support member (62) may support the ring frame (310) at the bottom of the wafer module (31).
[0106] According to an exemplary embodiment, the second support member (62) may be placed on the side of the alignment member (6). There may be multiple second support members (62). For example, two second support members (62) may be placed on each side of the alignment member (6). However, the above description regarding the number and placement of the second support members (62) is merely an exemplary description and is not limited thereto.
[0107] Hereinafter, a method for applying a work path of a wafer processing device (1) according to an exemplary embodiment will be described. At this time, redundant descriptions will be omitted.
[0108] FIG. 14 is a flowchart illustrating a method for applying a work path of a wafer processing device (1) according to an exemplary embodiment. FIG. 15 is a flowchart illustrating a method for applying a work path of a wafer processing device (1) according to an exemplary embodiment.
[0109] Referring to FIGS. 1 to 5, FIGS. 14 and FIGS. 15, the method of applying a work path of a wafer processing device (1) according to an exemplary embodiment may apply different paths depending on the type of workpiece. Here, the workpiece may include a wafer module (31) including a ring frame (310) and a second wafer (32).
[0110] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment can selectively process a wafer module (31) and a second wafer (32). The method for applying a work path of the wafer processing device (1) can apply a different work path when processing the wafer module (31) and when processing the second wafer (32).
[0111] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment may include a step (S101) in which a transfer unit (4) loads a workpiece from a cassette (2). The step (S101) in which the transfer unit (4) loads a workpiece from a cassette (2) may include a step (S101) in which an end effector of the transfer unit (4) loads a workpiece from the cassette (2) into the interior of the wafer processing device (1). The step (S101) in which the transfer unit (4) loads a workpiece from a cassette (2) may include a step (S101) in which a first end effector (41) of the transfer unit (4) loads a wafer module (31) from a second cassette (22) into the interior of the wafer processing device (1). The step (S101) of the transfer unit (4) loading a workpiece from the cassette (2) may include the step (S101) of the second end effector (42) of the transfer unit (4) loading a second wafer (32) from the first cassette (21) into the interior of the wafer processing device (1).
[0112] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment may include a step (S102) of first inverting a workpiece. Here, the first inversion may refer to an inversion performed on the workpiece before the workpiece is transferred to the alignment unit (6). Here, the first inversion may refer to an inversion performed on the workpiece before the processing unit processes the workpiece.
[0113] In the first inversion step (S102) according to an exemplary embodiment, the transfer unit (4) can perform inversion directly if the workpiece is a second wafer (32). More specifically, the second end effector (42) included in the transfer unit (4) can perform an inversion operation by applying negative pressure to the surface of the second wafer (32). The transfer unit (4) can invert the second wafer (32) by rotating the second end effector (42). After inverting the second wafer (32) through the second end effector (42), the transfer unit (4) can transfer the second wafer (32) to the alignment unit (6).
[0114] In the first inversion step (S102) according to an exemplary embodiment, the transfer unit (4) can transfer the wafer module (31) to the inversion unit (5) if the workpiece is a wafer module (31). More specifically, the first end effector (41) included in the transfer unit (4) can transfer the wafer module (31) to the inversion unit (5). The wafer module (31) can be inverted by the inversion unit (5). The first end effector (41) included in the transfer unit (4) can load the wafer module (31) inverted by the inversion unit (5) and transfer it to the alignment unit (6).
[0115] In the first inversion step (S102) according to an exemplary embodiment, if the workpiece is a second wafer (32), the transfer unit (4) may directly perform the inversion and not transfer the workpiece to the inversion unit (5). In the first inversion step (S102), if the workpiece is not a second wafer (32), for example, if the workpiece is a wafer module (31), the workpiece may be transferred to the inversion unit (5).
[0116] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment may include a step (S103) in which an alignment unit (6) aligns a workpiece. The step (S103) in which the alignment unit (6) aligns a workpiece may include a step in which an end effector of a transfer unit (4) unloads a workpiece to the alignment unit (6). The transfer unit (4) may transfer the workpiece aligned by the alignment unit (6) to a processing unit.
[0117] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment may include a step (S104) in which a processing unit processes a workpiece. The step (S104) in which a processing unit processes a workpiece may include a step in which an end effector of a transfer unit (4) unloads a workpiece to the processing unit. When the processing unit processes a wafer module (31), the lifting guide (71) of the chuck table (70) may load the wafer module (31) onto the first end effector (41) of the transfer unit (4) by raising and lowering the ring frame (310).
[0118] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment may include a step (S105) of inverting a workpiece a second time. Here, the second inversion may refer to an inversion performed on the workpiece after the workpiece has been processed in a processing unit.
[0119] In the step (S105) of inverting the workpiece for the second time according to an exemplary embodiment, the transfer unit (4) can perform inversion directly if the workpiece is a second wafer (32). More specifically, the second end effector (42) included in the transfer unit (4) can perform an inversion operation by applying negative pressure to the surface of the second wafer (32). The transfer unit (4) can invert the second wafer (32) by rotating the second end effector (42). After inverting the second wafer (32) through the second end effector (42), the transfer unit (4) can return the second wafer (32) to the cassette (2).
[0120] In the second inversion step (S105) according to an exemplary embodiment, the transfer unit (4) can transfer the wafer module (31) to the inversion unit (5) if the workpiece is a wafer module (31). More specifically, the first end effector (41) included in the transfer unit (4) can transfer the wafer module (31) to the inversion unit (5). The wafer module (31) can be inverted by the inversion unit (5). The transfer unit (4) can return the wafer module (31) inverted in the inversion unit (5) to the cassette (2).
[0121] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment may include a step (S106) in which a transfer unit (4) transfers a workpiece to a cassette (2). The step (S106) in which the transfer unit (4) transfers a workpiece to a cassette (2) may include a step in which an end effector of the transfer unit (4) unloads a workpiece processed inside the wafer processing device (1) into the cassette (2). The step (S106) in which the transfer unit (4) transfers a workpiece to a cassette (2) may include a step in which a first end effector (41) of the transfer unit (4) unloads a wafer module (31) into the interior of a second cassette (22). The step (S106) in which the transfer unit (4) transfers a workpiece to a cassette (2) may include a step in which a second end effector (42) of the transfer unit (4) unloads a second wafer (32) into the interior of a first cassette (21).
[0122] A method for applying a work path of a wafer processing device (1) according to an exemplary embodiment can determine whether to transfer a workpiece to an inversion unit (5) depending on the type of end effector included in the transfer unit (4). More specifically, if the end effector mounted on the transfer unit (4) is a second end effector (42), the transfer unit (4) can perform inversion directly without transferring the workpiece to the inversion unit (5). If the end effector mounted on the transfer unit (4) is a first end effector (41), the transfer unit (4) can indirectly invert the workpiece by transferring it to the inversion unit (5).
[0123] In the method for applying a work path of a wafer processing device (1) according to an exemplary embodiment, the wafer processing device (1) can determine whether to transfer a workpiece to an inversion unit (5) depending on the type of cassette (2) that provides a workpiece into the wafer processing device (1). More specifically, when the cassette (2) that provides a workpiece into the wafer processing device (1) is a first cassette (21), the transfer unit (4) can perform inversion directly without transferring the workpiece to the inversion unit (5). When the cassette (2) that provides a workpiece into the wafer processing device (1) is a second cassette (22), the transfer unit (4) can indirectly invert the workpiece by transferring the workpiece to the inversion unit (5).
[0124] The method of applying a work path of the wafer processing device (1) according to an exemplary embodiment provides different work paths to the wafer module (31) and the second wafer (32), thereby providing a flexible work path that can process wafers of different sizes. The method of applying a work path of the wafer processing device (1) can flexibly process various types of wafers by indirectly inverting wafers through the inversion unit (5) for which the end effector cannot directly perform inversion due to physical constraints (size and / or weight, etc.). More specifically, the process time can be shortened by directly inverting the second wafer (32) through the second end effector (42), or the wafer module (31) can be indirectly inverted through the first end effector (41) to handle wafers for which the end effector cannot directly perform inversion.
[0125] The above-described embodiments are merely exemplary, and various modifications and equivalent alternative embodiments are possible therefrom for those skilled in the art. Accordingly, the true scope of technical protection according to the exemplary embodiments must be determined by the technical concept described in the following claims.
Claims
1. A wafer processing device configured to selectively process wafers of different sizes and return them to a cassette, A processing unit for processing the above wafer; An alignment unit configured to align the wafer supplied to the processing unit; An inversion unit configured to invert a wafer of a predetermined size among the above wafers; A transfer unit configured to transfer the wafer between the processing unit, the alignment unit, and the inversion unit; comprising The above transfer unit includes an end effector that contacts the wafer, and A wafer processing device in which the above end effector is detachably mounted on the above transfer part.
2. In Paragraph 1, The wafer of the predetermined size, which the inversion part can invert, It includes a first wafer carried by a ring frame supported from the outside, and A wafer processing device in which the above ring frame and the above first wafer constitute a wafer module.
3. In Paragraph 2, The wafer includes a second wafer having a different size from the first wafer, and The above end effector includes a first end effector and a second end effector that are optionally mounted according to the user's choice, and The first end effector is configured to transport the wafer module, and A wafer processing device configured such that the second end effector is configured to transport the second wafer.
4. In Paragraph 3, The first end effector unloads the wafer module to the inversion unit and reloads the wafer module inverted by the inversion unit, and A wafer processing device in which the second end effector applies negative pressure to the surface of the second wafer to perform an inversion operation.
5. In Paragraph 4, The above processing part is, A chuck table providing a workspace for the above wafer or wafer module and A wafer processing apparatus comprising a lifting guide configured to support at least a portion of the ring frame from below and to seat the wafer module on the chuck table or raise it relative to the chuck table as it descends or ascends relative to the chuck table.
6. In Paragraph 5, When the above lifting guide is in a raised state, A handling area is provided so that the first end effector can enter and exit the lower side of the lifting guide. A wafer processing device configured such that the first end effector enters and exits the handling area to load or unload the wafer module onto the lifting guide.
7. In Paragraph 3, The above alignment unit is, A first support member configured to support the second wafer from below when the second wafer is in an alignment waiting state, and A wafer processing device comprising a second support member configured to support the ring frame from below when the wafer module is in an alignment waiting state.
8. In Paragraph 3, A wafer processing device having at least two transfer units.
9. In Paragraph 2, The above inversion part is, A wafer processing device configured such that a clamping assembly supports the rotation of the wafer module by fixing the ring frame.
10. In Paragraph 9, The clamping assembly includes a first clamp and a second clamp arranged to face each other, and A wafer processing device in which the first clamp and the second clamp are configured to move toward each other or away from each other.
11. In Paragraph 10, The first clamp and the second clamp above are, Fixing the aforementioned ring frame by moving closer to each other, A wafer processing device configured to release the fixation to the ring frame by moving away from each other.
12. In Paragraph 11, The first clamp and the second clamp above are, A wafer processing device comprising a plurality of first grips and a plurality of second grips arranged symmetrically with respect to a center.
13. In Paragraph 12, A wafer processing device that prevents damage to the first wafer by providing a floating area defined as the space between the plurality of first grips and the plurality of second grips between the first clamp and the second clamp.
14. In Paragraph 13, The plurality of first grips and the plurality of second grips are, A wafer processing device, each protruding toward each other at the ends of the first clamp and the second clamp.
15. In Paragraph 3, The above transfer unit is, If the workpiece is the second wafer mentioned above, perform direct inversion, and A wafer processing device configured to transfer the wafer module to the inversion unit when the above workpiece is the wafer module.
16. In Paragraph 15, The wafer processing device above is, A wafer processing device that determines whether to transfer the workpiece to the inversion unit according to the type of end effector included in the transfer unit.
17. In Paragraph 15, The wafer processing device above is, A wafer processing device that determines whether to transfer the workpiece to the inversion unit according to the type of the above cassette.