Robot device
The robot device incorporates a sensor device with a PCB substrate, partition, and waterproof layer to address the issue of moisture and foreign substance ingress, enhancing operational reliability by sealing the sensor within the driving device.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2025-10-24
- Publication Date
- 2026-05-15
AI Technical Summary
Conventional robot devices experience issues with moisture or foreign substances entering the interior due to gaps formed between the sensor device and the driving device during operation, which can compromise the functionality and integrity of the system.
A robot device design that includes a sensor device with a PCB substrate, a partition surrounding the sensor, and a waterproof layer between the sensor and the partition, positioned within an opening of the driving device to prevent ingress of moisture and foreign substances.
The design effectively seals the sensor device, preventing moisture and foreign substances from entering the driving device, ensuring the reliability and functionality of the robot's operations.
Smart Images

Figure KR2025017119_15052026_PF_FP_ABST
Abstract
Description
Robot device
[0001] The present disclosure relates to a robot device, and more specifically, to a robot device including a sensor device.
[0002] With the advancement of robotic technology, research and development of various robotic devices designed to replace humans in diverse settings such as stores, cafes, and restaurants are actively underway. These devices include humanoid forms capable of autonomous driving and operation without separate user intervention, and technology is progressively developing in a direction that enhances autonomy and functionality. In particular, there is an increasing number of cases where sensor devices are added to the surface of driving mechanisms to prevent collisions with the surrounding environment or obstacles during operation.
[0003] However, in conventional robot devices, a gap formed between the opening and the sensor device during the process of driving after directly inserting the sensor device into the opening of the driving device, and as a result, a problem occurred in which moisture or foreign substances entered the interior of the driving device.
[0004] Embodiments of the present disclosure may solve at least one of the previously described problems and / or disadvantages and provide the advantages described below. Accordingly, various embodiments of the present disclosure provide a robot device including a sensor device.
[0005] Additional embodiments will be presented in the detailed description below, some of which are obvious from the detailed description, and other embodiments can also be presented through learning from the presented embodiments.
[0006] A robot device according to at least one embodiment of the present disclosure comprises a main body, a driving device supporting the main body from the lower side of the main body, and a sensor device disposed inside an opening formed in the housing of the driving device. The sensor device comprises a PCB substrate disposed such that one surface faces the outside of the driving device within the opening, a sensor disposed on the one surface of the PCB substrate, a partition surrounding the sensor at a position spaced apart from the sensor on the one surface of the PCB substrate and closing the space between the opening and the PCB substrate, and a waterproof layer formed between the sensor and the partition.
[0007] A sensor device according to at least one embodiment of the present disclosure comprises a PCB substrate, a partition wall surrounding the sensor and spaced apart from the sensor at a certain distance on one surface of the PCB substrate, and a waterproof layer formed between the sensor and the partition wall. The height of the waterproof layer is lower than the height of the sensor on the PCB substrate.
[0008] The above description of embodiments of the present disclosure, as well as other aspects, features, and benefits, will become more apparent from the following description with reference to the accompanying drawings. In the accompanying drawings:
[0009] FIG. 1 is a drawing showing a robot device according to at least one embodiment of the present disclosure.
[0010] FIG. 2 is a side view of a driving device according to at least one embodiment of the present disclosure.
[0011] Figure 3 is an enlarged view of 'A' in Figure 2.
[0012] FIG. 4 is a drawing showing a sensor device according to at least one embodiment of the present disclosure.
[0013] FIG. 5 is a drawing showing a sensor device according to at least one embodiment of the present disclosure.
[0014] FIG. 6 is a drawing for explaining a bulkhead according to at least one embodiment of the present disclosure.
[0015] FIG. 7 is a drawing for explaining a sensor device according to at least one embodiment of the present disclosure.
[0016] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.
[0017] In relation to the description of the drawings, similar reference numerals may be used for similar or related components.
[0018] The singular form of the noun corresponding to the item may include one or multiple items, unless the relevant context clearly indicates otherwise.
[0019] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.
[0020] The term "and / or" includes a combination of multiple related described components or any of the multiple related described components.
[0021] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another corresponding component and do not limit the components in other aspects (e.g., importance or order).
[0022] Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.
[0023] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this document, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.
[0024] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.
[0025] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.
[0026] In the embodiment, the 'module' or multiple 'parts' may be integrated into at least one module and implemented by at least one processor, except for the 'module' or 'part' that needs to be implemented in specific hardware.
[0027] Operations performed by a module, program, or other component according to various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.
[0028] Meanwhile, the various elements and areas in the drawings are depicted schematically. Accordingly, the technical concept of the present invention is not limited by the relative sizes or spacing depicted in the attached drawings.
[0029] Below, a robot device (1) according to various embodiments will be described in detail with reference to the drawings.
[0030] FIG. 1 is a drawing showing a robot device (1) according to at least one embodiment of the present disclosure.
[0031] The robot device (1) is a device designed to perform various tasks.
[0032] The robot device (1) may include various types, such as industrial robots used in industrial processes, service robots designed to support or replace human activities, exploration robots used to explore difficult environments or hard-to-access places, household robots that assist in daily life, and drone robots that fly in the air. Additionally, the robot device (1) may include humanoid robots designed to mimic the form and function of a human.
[0033] In FIG. 1, the robot device (1) may include a main body (10), a plurality of robot arms (2000), an image sensor (3000), a driving device (4000), and a sensor device (5000).
[0034] The main body (10) is configured to include devices for overall management of the operation of the robot device (1). The main body (10) is a device that forms the outer shape of the robot device (1). In FIG. 1, the main body (10) may include a robot head (1000), a robot body (1100), and a driving device (4000).
[0035] The robot head (1000) is a component corresponding to the head portion of the robot device (1) and includes functions essential for interaction with humans, such as sensors, a camera, a voice recognition microphone, and a display that expresses facial expressions of the robot device (1). The robot head (1000) may be positioned on the upper side of the robot body (1100). The robot head (1000) may include an image sensor (3000). The robot head (1000) can detect the surrounding environment based on the sensing values of the image sensor (3000). The image sensor (3000) may be formed integrally with the robot head (1000) or may be formed in a form positioned inside the robot head (1000).
[0036] The robot body (1100) may be positioned on the lower side of the robot head (1000). The robot body (1100) may be positioned in the center of the robot device (1). The robot body (1100) is a device that protects various key components of the robot device (1) on the inner side. Multiple robot arms (2000) may be positioned on both sides of the robot body (1100). The robot body (1100) may include robot legs (1200).
[0037] In FIG. 1, the robot leg (1200) and the driving device (4000) are structures that enable the robot device (1) to walk or move. The robot leg (1200) is a component that connects the driving device (4000) and the robot body (1100). However, it is not necessarily limited to this, and the robot leg (1200) can be formed in various shapes according to the user's intention.
[0038] For example, if the manufacturer of the robot device (1) manufactures the robot device (1) as a humanoid robot, the robot leg (1200) may be formed in a shape including two legs.
[0039] If the manufacturer manufactures the robot device (1) as a quadrupedal robot, the robot leg (1200) may be formed in a shape that includes four legs.
[0040] The driving device (4000) can be positioned on the lower side of the robot body (1100). The driving device (4000) can move the robot device (1) to a specific position by the power of a built-in motor.
[0041] In FIG. 1, the driving device (4000) may include a plurality of wheels and a sensor device (5000). A plurality of wheels may be positioned on the lower side of the driving device (4000). The sensor device (5000) may be formed in at least one number on the side of the driving device (4000).
[0042] The sensor device (5000) may be positioned on the inner side of an opening formed in the housing of the driving device (4000). The sensor device (5000) may be positioned such that one surface faces outward from the driving device (4000) within the opening of the housing of the driving device (4000). The sensor device (5000) can extract a distance value between obstacles positioned in front. Since a detailed description of the structure of the sensor device (5000) is to be provided later, a detailed description thereof is omitted.
[0043] In FIG. 1, the driving device (4000) is formed in a shape including a plurality of wheels, but is not necessarily limited thereto.
[0044] For example, if the robot device (1) is a humanoid robot, the driving device (4000) is omitted, and driving can be performed in a walking form by sequential driving of two separate robot legs (1200). In this case, the sensor device (5000) can be placed on the front of the two separate robot legs (1200).
[0045] Even if the robot device (1) is a quadrupedal robot, a driving device (4000) such as a wheel may be omitted, and a robot leg (1200) may take over the role of the driving device. In this case, a sensor device (5000) may be placed on the front of two separate robot legs (1200).
[0046] The sensor device (5000) may include various sensors. The sensor device (5000) may also include the same sensor as the image sensor (3000) placed on the robot head (1000).
[0047] The image sensor (3000) placed on the robot head (1000) can be formed of various sensors, such as a camera or an RGB sensor. The image sensor (3000) can generate a captured image.
[0048] The robot device (1) can identify the characteristics of objects, obstacles, etc. through a captured image generated by an image sensor (3000). Specifically, the robot device (1) divides all pixels within the captured image generated by the image sensor (3000) into multiple pixel groups, and then extracts the pixel representative values of the pixels included in each pixel group.
[0049] Afterwards, the robot device (1) identifies the location of a group of pixels having pixel representative values that are in a similar range to each other, and if a plurality of similar pixel groups are located consecutively, it identifies that the similar pixel groups form an edge for one object.
[0050] Subsequently, the robot device (1) can estimate what kind of object it is based on the shape of the edge, the pixel values of pixels belonging within the edge, etc., and identify the distance to the object based on the size of the edge, etc. Based on this, the robot device (1) can identify the characteristics of the object, etc.
[0051] If the sensor device (5000) is an image sensor, the driving method of the sensor device (5000) may be the same as the driving method of the image sensor (3000) placed on the robot head (1000).
[0052] The robot device (1) can identify the distance between the surrounding environment and obstacles based on the sensing value of the sensor device (5000). Accordingly, the robot device (1) can prevent collisions with the surrounding environment and obstacles.
[0053] For example, if the robot device (1) is a kitchen robot, the robot device (1) holding food, etc., can prevent collisions with the surrounding environment and obstacles based on the sensing value of the sensor device (5000) and can stably transport the food to a specific location.
[0054] Additionally, the robot device (1) can identify an area that can be reached by the shortest distance to a target point based on the sensing value of the sensor device (5000). Accordingly, the robot device (1) can drive efficiently and minimize the power consumed in the movement of the robot device (1).
[0055] The robot device (1) can identify the condition of the ground surface based on the sensing value of the sensor device (5000). Accordingly, if an uneven ground area is identified, the robot device (1) holding food, etc. can perform an action of moving through another area while avoiding the uneven ground area.
[0056] The robot device (1) can identify the arrangement status of surrounding terrain features based on the sensing value of the sensor device (5000). Accordingly, when a user inputs a specific task to the robot device (1), the robot device (1) can determine an optimized driving path and control the driving device (4000) to enable movement.
[0057] A plurality of robot arms (2000) may be disposed on the main body (10). Specifically, a plurality of robot arms (2000) may be attached to both sides of the robot body (1100). The plurality of robot arms (2000) are configured to move each joint of a plurality of joints to move an end effector to a specific position.
[0058] A plurality of robot arms (2000) may be formed integrally with the main body (10), or may exist as modules independent of the main body (10) and be formed in a manner that is assembled to the main body (10). A plurality of robot arms (2000) may include a plurality of joints and end effectors. Additionally, the end effectors may include grippers.
[0059] Multiple joints can move in various ways around each axis. Although the multiple joints are all illustrated as I-shaped modules in FIG. 1, they are not necessarily limited to this and can be formed into various types of modules, such as L-shaped modules. The multiple robot arms (2000) are not limited to two robot arms and may include three or more different robot arms.
[0060] FIG. 2 is a side view of a driving device (4000) according to at least one embodiment of the present disclosure.
[0061] In FIG. 2, the driving device (4000) may include a housing (4100), a plurality of wheels (4200, 4300), and a sensor device (5000).
[0062] The housing (4100) may include a rectangular shape. Additionally, the housing (4100) may include various key components necessary for driving the robot device (1). For example, it may include a motor, a sensor device (5000), etc., for providing power to a plurality of wheels (4200, 4300) positioned on the lower side of the robot device (1).
[0063] A plurality of wheels (4200, 4300) may include a plurality of first wheels (4200) and second wheels (4300).
[0064] Multiple first wheels (4200) may be smaller in size than the second wheels (4300). Multiple first wheels (4200) can precisely control the robot device (1). Additionally, multiple first wheels (4200) can drive stably at low speeds due to less inertia.
[0065] The second wheel (4300) is configured to be able to overcome unevenness, obstacles, and rough surfaces on the ground more easily than the first wheel (4200). The second wheel (4300) is efficient during high-speed driving and has increased absorption capacity when impacting the ground, thereby reducing vibration or damage to internal mechanical parts of the robot device (1). Accordingly, the durability of the robot device (1) can be increased by the second wheel (4300).
[0066] The sensor device (5000) may be positioned in front of the driving device (4000). Specifically, however, it is not necessarily limited to this, and since the robot device (1) may collide with an obstacle (7000) when moving backward, the sensor device (5000) may be positioned at the rear of the driving device (4000) to prevent this.
[0067] When the robot device (1) rotates, it may collide with an obstacle (7000), so to prevent this, a sensor device (5000) may be placed on both sides of the driving device (4000).
[0068] The sensor device (5000) can be placed inside the opening formed in the housing (4100) of the driving device (4000).
[0069] The sensor device (5000) can be positioned so that one surface faces the outside of the driving device (4000) within the opening.
[0070] The sensor device (5000) may include at least one light source and at least one photodetector.
[0071] The sensor device (5000) can emit light from at least one light source. Subsequently, the sensor device (5000) can detect light that is reflected back from an obstacle (7000) among the emitted light using at least one photodetector.
[0072] Accordingly, the robot device (1) can measure the distance (d) between the robot device (1) and the obstacle (7000) based on the sensing value of the sensor device (5000).
[0073] In addition, the robot device (1) can identify terrain features, ground conditions, etc. around the robot device (1) based on the sensing value of the sensor device (5000).
[0074] Figure 3 is an enlarged view of 'A' in Figure 2.
[0075] In FIG. 3, an opening may be formed between one surface (4110) of the housing (4100) of the driving device (4000). A sensor device (5000) may be disposed inside the opening formed in the housing (4100) of the driving device (4000).
[0076] In FIG. 3, the sensor device (5000) may include a PCB substrate (5100), a partition (5200), and a plurality of screws (5110).
[0077] A PCB substrate (5100) may be positioned such that one surface faces the outside of the driving device (4000) within the opening. The PCB substrate (5100) may be fixed to one surface (4110) of the housing (4100) using a plurality of screws (5110). The one surface (4110) of the housing (4100) may include a plurality of screw threads (not shown) on which a plurality of screws (5110) for coupling the PCB substrate (5100) are fastened. The plurality of screws (5110) may be rotatably fastened to the plurality of screw threads (not shown).
[0078] The PCB substrate (5100) and the plurality of screws (5110) can be formed in a form that is separable from each other. The PCB substrate (5100) may have a plurality of grooves (not shown) formed at the edge portions to which the plurality of screws (5110) can be fastened. Accordingly, the plurality of screws (5110) can be fastened to the plurality of grooves (not shown) of the PCB substrate (5100) and then rotatably fastened to a plurality of screw threads (not shown) formed on one surface (4110) of the driving device (4000) to connect the sensor device (5000) to the driving device (4000).
[0079] That is, the sensor device (5000) can be fixed to one surface (4110) of the housing (4100) using a plurality of screws (5110).
[0080] However, it is not necessarily limited to this, and the sensor device (5000) can be fixed in various ways using welding, adhesive members, etc. on one surface (4110) of the housing (4100).
[0081] The sensor device (5000) surrounds the sensor at a position spaced apart from the sensor on one surface of the PCB substrate (5100) and can close the opening and the PCB substrate (5100).
[0082] An opening formed on one surface (4110) of the housing (4100) may be formed with the same shape as the sensor device (5000). Accordingly, the sensor device (5000) can be fitted into the opening.
[0083] Specifically, the inner side of an opening formed on one surface (4110) of the housing (4100) and the opposite side of the surface in contact with the PCB substrate (5100) at the partition wall (5200) of the sensor device (5000) can be in contact with each other. If the opposite side of the surface in contact with the PCB substrate (5100) at the partition wall (5200) is made of an adhesive material, the partition wall (5200) can be attached to the inner side of the opening formed on one surface (4110) of the housing (4100).
[0084] All spaces between multiple screws (5110) and bulkheads (5200) can be occupied by one surface (4110) of the housing (4100).
[0085] FIG. 4 is a drawing showing a sensor device (5000) according to at least one embodiment of the present disclosure.
[0086] In FIG. 4, the sensor device (5000) may include a PCB substrate (5100), a plurality of screws (5110), a partition (5200), a sensor (5300), and a waterproof layer (5400a).
[0087] The PCB substrate (5100) may be formed as a plate-like structure having a rectangular shape but with rounded corners. The PCB substrate (5100) is electrically connected to the sensor (5300).
[0088] A PCB substrate (5100) can be positioned such that one surface faces outward from the driving device (40) within the opening of the driving device (40).
[0089] The PCB substrate (5100) may include a plurality of screws (5110). The plurality of screws (5110) can fix the PCB substrate (5100) inside the driving device (4000).
[0090] The sensor (5300) can be placed on one surface of the PCB substrate (5100). In FIG. 4, the sensor (5300) can be placed in the center of one surface of the PCB substrate (5100).
[0091] The sensor (5300) may include various sensors. For example, the sensor (5300) may include a Time-of-Flight Sensor (ToF), an Infrared Sensor, a Laser Sensor, a Radar Sensor, and an Image Sensor. The robot device (1) can measure the distance between an object or an obstacle based on the sensing value of the sensor (5300). Additionally, the robot device (1) can identify terrain features around the robot device (1) in real time based on the sensing value of the sensor (5300).
[0092] Accordingly, the robot device (1) can move to a target point without colliding with surrounding terrain features. Additionally, the robot device (1) can identify the shortest distance to a target point based on the sensing value of the sensor (5300) and move along the shortest distance based on the identified information.
[0093] The partition (5200) surrounds the sensor (5300) at a position spaced apart from the sensor (5300) on one surface of the PCB board (5100) and can close the opening of the driving device (4000) and the PCB board (5100).
[0094] The partition (5200) may be in the form of a protrusion on one surface of the PCB substrate (5100). The partition (5200) may be formed of various materials such as silicon, metal, etc.
[0095] The partition (5200) can prevent foreign substances from penetrating into the interior of the driving device (4000) by closing the gap between the opening of the driving device (4000) and the PCB board (5100).
[0096] The partition wall (5200) may be formed of an elastic material to prevent cracks caused by external impact. For example, the partition wall (5200) may be formed of various materials such as rubber, TPE (Thermoplastic Elastomer), silicone, and polyurethane.
[0097] The bulkhead (5200) can be expressed by various other terms such as partition wall, compartment wall, etc.
[0098] A waterproof layer (5400a) can be formed between the sensor (5300) and the bulkhead (5200). The waterproof layer (5400a) can prevent moisture or water from penetrating or entering the interior of the driving device (4000).
[0099] A waterproof layer (5400a) can be placed on the surface between the sensor (5300) and the partition wall (5200) using waterproof paint, waterproof solution, synthetic polymer sheet, etc.
[0100] In FIG. 4, the height of the waterproof layer (5400a) can be formed lower than the height of the sensor (5300) on the PCB substrate (5100).
[0101] Accordingly, moisture or water cannot come into direct contact with the PCB substrate (5100) by means of the waterproof layer (5400a) and the partition (5200), so the sensor device (5000) can prevent moisture from penetrating into the driving device (4000).
[0102] The waterproof layer (5400a) can be replaced with various terms. For example, the waterproof layer (5400a) can be expressed by various terms such as waterproof membrane, watertight layer, waterproof sheet, waterproof coating, etc.
[0103] FIG. 5 is a drawing showing a sensor device (5000) according to at least one embodiment of the present disclosure.
[0104] In FIG. 5, the description of the PCB substrate (5100), a plurality of screws (5110), and partitions (5200), etc., is omitted as they were described in detail in FIG. 4.
[0105] In FIG. 5, the sensor (5300) may include at least one light source and at least one photodetector. Here, the region including at least one light source and at least one photodetector may be referred to as a package region (5320).
[0106] At least one light source may include a light-emitting member such as an LED. At least one light source may emit light of a specific wavelength continuously or at a constant period inside the sensor.
[0107] For example, if the sensor (5300) is an infrared sensor, the wavelength of light emitted from at least one light source may have a wavelength range in the infrared region.
[0108] If the sensor (5300) is an image sensor, the wavelength of light emitted from at least one light source may have a wavelength range in the visible light region.
[0109] When light from at least one light source reaches the surface of an obstacle, some of it may be reflected from the surface of the obstacle. Afterwards, the light reflected from the surface of the obstacle may return to the direction of the sensor (5300).
[0110] When light returns to the sensor (5300), at least one photodetector can receive the reflected light. At least one photodetector can output an electrical signal (current or voltage) of a magnitude corresponding to the amount of light input.
[0111] A processor (not shown) can acquire various information based on the magnitude of the electrical signal output from the photodetector. For example, if light or ultrasonic signals reflected and received by an external obstacle are sensed, the processor can identify the distance to the external obstacle based on the time of transmission and reception of the reflected signal. Alternatively, the processor may identify the type of external obstacle based on the amount of light input to the photodetector.
[0112] At least one photodetector may include a photodiode, a phototransistor, a CCD / CMOS, etc.
[0113] Additionally, the sensor (5300) may include a support member (5310) that supports at least one light source and at least one photodetector.
[0114] The support member (5310) may be positioned on the lower side of a member including at least one light source and at least one photodetector. The size of the cross-section of the support member (5310) cut parallel to the wide surface of the PCB substrate (5100) may be larger than the size of the cross-section of the at least one light source and at least one photodetector cut parallel to the wide surface of the PCB substrate (5100).
[0115] The height of the waterproof layer (5400b) can be formed to be less than or equal to the height of the support portion (5310).
[0116] FIG. 6 is a drawing for explaining a bulkhead (5200) according to at least one embodiment of the present disclosure.
[0117] The sensor device (5000) may include a PCB substrate (5100) and a partition (5200). The partition (5200) may be disposed on one surface of the PCB substrate (5100).
[0118] In FIG. 6, the partition (5200) may include three layers (5210, 5220, 5230) sequentially stacked from one surface of the PCB substrate (5100). That is, the partition (5200) may include a first layer (5210) in contact with the PCB substrate (5100) among the three layers (5210, 5220, 5230), a third layer (5230) placed at the top, and a second layer (5220) located in the middle among the three layers (5210, 5220, 5230).
[0119] In FIG. 6, the first layer (5210) and the third layer (5230) may be formed of an elastic material to absorb shock caused by external vibrations. The second layer (5220) may be formed of silicone.
[0120] For example, when the robot device (1) moves, the partition (5200) can receive vibrations from the driving device (4000). The first layer (5210) and the third layer (5230) of the partition (5200) can absorb the received vibrations. Since the first layer (5210) and the third layer (5230) are formed of elastic materials, the probability of the partition (5200) separating from the PCB substrate (5100) due to vibrations can be reduced. Additionally, since the first layer (5210) and the third layer (5230) are formed of elastic materials, the possibility of the partition (5200) being damaged due to received vibrations can be reduced.
[0121] However, it is not necessarily limited to this, and the second layer (5220) can also be formed of an elastic body.
[0122] Elastomers can include various materials such as rubber, TPE (Thermoplastic Elastomer), silicone, and polyurethane.
[0123] Additionally, the first layer (5210) can be formed as a member that can be firmly attached to the PCB substrate (5100).
[0124] In FIG. 6, each of the three layers (5210, 5220, 5230) may be formed of different materials. For example, the first layer (5210) may include a material that can be firmly attached to the PCB substrate (5100). The second layer (5220) may include a rigid material that can prevent damage from vibration of the opening of the driving device (4000). The third layer (5230) may include a material that can be firmly attached to a point in contact with the inner side of the opening of the driving device (4000).
[0125] FIG. 7 is a drawing for explaining a sensor device (5000) according to at least one embodiment of the present disclosure.
[0126] In FIG. 7, the sensor device (5000) may include a PCB substrate (5100), a partition (5200), a sensor (5300), and a waterproof layer (5400).
[0127] The bulkhead (5200), sensor (5300), and waterproof layer (5400) can all be placed on one surface of the PCB substrate (5100).
[0128] The partition wall (5200) may include three layers (5210, 5220, 5230). Among the three layers (5210, 5220, 5230), the first layer (5210) and the third layer (5230) may be formed at the same height.
[0129] Of the three layers (5210, 5220, 5230), the second layer (5220) may be thicker than the first layer (5210). Likewise, the second layer (5220) may be thicker than the third layer (5230).
[0130] In FIG. 7, the sensor (5300) may be placed between the partitions (5200). The height of the sensor (5300) from the PCB substrate (5100) may be lower than the height of the partition (5200) from the PCB substrate (5100).
[0131] The sensor (5300) may include a cover glass (5330) that covers the sensor (5300).
[0132] The cover glass (5330) may be placed on the upper side of the sensor (5300). The cover glass (5330) may cover the outer surface of the sensor (5300).
[0133] The cover glass (5330) can physically protect the sensor (5300). The cover glass (5330) can serve as a barrier to protect against physical hazards such as dust, scratches, impacts, and the ingress of foreign substances.
[0134] The cover glass (5330) can serve to help the sensor (5300) efficiently receive light. Specifically, the cover glass (5330) can be made of a highly transparent material. Additionally, the cover glass (5330) may have a built-in filter function that selectively transmits specific wavelength bands, so that the sensor (5300) can receive only specific wavelength bands that are identifiable.
[0135] The cover glass (5330) can increase the durability of the sensor (5300) by minimizing deformation and discoloration of the sensor (5300) caused by heat or humidity.
[0136] The cover glass (5330) can be formed from a transparent material. The cover glass (5330) can be formed to wrap around the outer surface of the sensor (5300). That is, there may be no gap between the cover glass (5330) and the sensor (5300).
[0137] The waterproof layer (5400) can be placed between the three layers (5210, 5220, 5230) of the partition wall (5200) and the cover glass (5330) of the sensor (5300). Additionally, the waterproof layer (5400) can be placed on the upper side of the PCB substrate (5100).
[0138] The height of the waterproof layer (5400) from the PCB substrate (5100) may be higher than the height of the first layer (5210) of the partition wall (5200) and lower than the height of the second layer (5220). However, it is not necessarily limited to this, and the height of the waterproof layer (5400) from the PCB substrate (5100) may be formed at various heights, such as a height lower than the height from the PCB substrate (5100) of the sensor (5300).
[0139] Each of the components described in this document may consist of one or more components, and the names of such components may vary depending on the type of robot device.
[0140] Although various embodiments of the present disclosure have been described individually above, each embodiment is not required to be implemented alone, and the configuration and operation of each embodiment may be implemented in combination with at least one other embodiment.
[0141] Although preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above. It is understood that various modifications can be made by those skilled in the art without departing from the essence of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present disclosure.
Claims
1. In a robot device, entity; A driving device that supports the main body from the lower side of the main body; A sensor device disposed on the inner side of an opening formed in the housing of the driving device; comprising The sensor device above is, A PCB substrate having one surface positioned to face the outside of the driving device within the opening; A sensor disposed on the one surface of the above-mentioned PCB substrate; A partition wall surrounding the sensor at a position spaced apart from the sensor on the one surface of the PCB substrate and closing the space between the opening and the PCB substrate; and A robot device comprising a waterproof layer formed between the sensor and the partition wall.
2. In Paragraph 1, A robot device in which the height of the above waterproof layer is lower than the height of the sensor on the above PCB board.
3. In Paragraph 1, The above bulkhead is, A robot device formed of an elastic body to prevent cracks caused by external impact.
4. In Paragraph 1, The above bulkhead is, It includes three layers sequentially stacked from one surface of the PCB substrate, Among the three layers mentioned above, the first layer in contact with the PCB substrate and the uppermost third layer are, A robot device formed of an elastic body to absorb shock caused by external vibrations.
5. In Paragraph 4, A robot device in which the second layer located in the middle of the three layers above is formed of silicon.
6. In Paragraph 1, The sensor device above is, It further includes a cover glass that covers the above sensor, and The above sensor is a robot device comprising at least one Time-of-Flight Sensor (ToF) sensor.
7. In Paragraph 1, It includes a support member that supports at least one light source and at least one photodetector, and A robot device in which the height of the above waterproof layer is less than or equal to the height of the above support.
8. In a sensor device, PCB board; A partition wall surrounding the sensor, spaced apart from the sensor at a certain distance on the one surface of the PCB substrate; and It includes a waterproof layer formed between the sensor and the partition wall, and A sensor device in which the height of the above waterproof layer is lower than the height of the sensor on the above PCB board.
9. In Paragraph 8, The above bulkhead is, A sensor device formed of an elastic body to prevent cracks caused by external impact.
10. In Paragraph 8, The above bulkhead is, It includes three layers sequentially stacked from one surface of the PCB substrate, Among the three layers mentioned above, the first layer in contact with the PCB substrate and the uppermost third layer are, A sensor device formed of an elastic body to absorb shock caused by external vibrations.