Wafer dryer, and wafer support assembly and lifting mechanism thereof

Abstract

Embodiments of the present application relate to the field of wafer cleaning devices. Disclosed are a wafer dryer, and a wafer support assembly and a lifting mechanism thereof, which are capable of solving the problem in the prior art that clamped regions of wafers cannot be effectively cleaned and dried during cleaning. The wafer support assembly comprises a wafer support connected to the inner bottom wall of a drying chamber and configured to carry a plurality of wafers, and a limiting assembly connected to the inner side wall of the drying chamber and configured to work in conjunction with the wafer support to limit the orientation of the plurality of wafers. The wafer support comprises a support assembly connected to the drying chamber and a plurality of support comb plates connected to the support assembly. The end portion of each support comb plate away from the support assembly is provided with a plurality of support grooves along the length direction of the support comb plate. Two support beveled edges respectively configured to abut against two sides of a wafer are formed in each support groove, so that the support beveled edges are in point contact with the wafer. The plurality of support comb plates are connected to the support assembly at intervals, so that the plurality of support comb plates support the bottom sides of the wafers along the arc-shaped extension direction of the edges of the wafers.

Description

Wafer dryer, wafer support assembly and lifting mechanism

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411625027.X, filed on November 14, 2024, entitled “Wafer Dryer and Wafer Support Assembly and Lifting Mechanism Thereof”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of wafer cleaning equipment, specifically to a wafer dryer and its wafer support assembly and lifting mechanism. Background Technology

[0004] Marangoni dryers are wafer cleaning equipment used for wafer cleaning and drying. They utilize the Marangoni effect, which refers to the flow phenomenon caused by the difference in surface tension of liquids. Through this effect, moisture or solvents on the wafer surface can be effectively removed, thereby achieving a drying effect without watermarks or pollution.

[0005] In existing technologies, wafer supports typically hold wafers using structures such as Y-grooves. However, this design results in a large contact area between the wafer and the support. Due to this large clamping area, the portion of the wafer in contact with the support cannot be fully exposed to the cleaning solution and drying airflow, leading to ineffective cleaning and drying in these areas. This not only affects the overall cleanliness of the wafer, making it prone to leaving watermarks or chemical residues on the surface, but also impacts wafer quality and the yield of subsequent processes.

[0006] Application content

[0007] To address this issue, this application provides a wafer dryer, a wafer support assembly, and a lifting mechanism thereof, to solve the problem in the prior art that the clamped area of ​​the wafer cannot be effectively cleaned during the cleaning process.

[0008] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0009] A wafer support assembly for a wafer dryer, the wafer dryer comprising a main body, a drying tank connected to the main body, an inlet pipe connected to the drying tank and configured to inject cleaning fluid into the drying tank, a solution tank connected to the drying tank and configured to inject isoacetone vapor into the drying tank, a drain pipe connected to the drying tank and configured to discharge cleaning fluid from the drying tank, and a lifting mechanism connected to the main body and configured to lift multiple wafers into the drying tank. The wafer support assembly includes a wafer support connected to the inner bottom wall of the drying tank and configured to support multiple wafers. A limiting component is connected to the inner wall of the drying tank and configured to cooperate with the wafer support to restrict the orientation of multiple wafers. The wafer support includes a support component connected to the drying tank and multiple support combs connected to the support component. The ends of the support combs away from the support component have multiple support grooves along their own length direction. Each support groove forms two support bevels respectively configured to abut against the two sides of the wafer so that the support bevels make point contact with the wafer. The multiple support combs are connected to the support component at intervals so that the multiple support combs support the bottom side of the wafer along the arcuate extension direction of the wafer edge.

[0010] Optionally, the support assembly is connected to a support portion on the inner bottom wall of the drying tank, a support column on the inner bottom wall of the first support portion away from the drying tank, and a support plate on the end of the support column away from the first support portion. Multiple support combs are connected to the support plate. The inner bottom wall of the drying tank is provided with a drain port that matches the drain pipe. The drain port is located at the bottom of the support portion. The support portion is connected to the inner bottom wall of the drying tank through multiple connecting columns, so that the support portion and the drain port are arranged at intervals.

[0011] Optionally, the support plate has multiple drainage grooves that penetrate it. A guide arc plate is connected to the side of the support plate away from the support comb plate. The guide arc plate has guide holes that avoid the support column. The guide holes are clearance-fitted with the support column. The guide holes are located at the lowest point of the guide arc plate so that the liquid remaining on the support plate drips into the drying tank through the drainage grooves and the guide holes. The two support inclined sides intersect to form a V-shaped groove. One side of the support comb plate is formed as a vertical plane that matches the V-shaped groove, and the other side is formed with two guide inclined surfaces that match the support inclined sides. The two guide inclined surfaces and the two support inclined sides correspond one-to-one.

[0012] Optionally, the support includes a first connecting plate connected to a plurality of connecting columns, a second connecting plate connected to the side of the first connecting plate away from the connecting columns, a third connecting plate connected to the side of the second connecting plate away from the first connecting plate, and a fourth connecting plate connected to the side of the third connecting plate away from the second connecting plate, with one end of the support column connected to the fourth connecting plate.

[0013] The connecting post has a first threaded hole, the first connecting plate has a plurality of first elongated holes that mate with the first threaded hole, the second connecting plate has a second threaded hole, the third connecting plate has a plurality of second elongated holes that mate with the second threaded hole, the third connecting plate has a third threaded hole, and the fourth connecting plate has a plurality of third elongated holes that mate with the third threaded hole.

[0014] The length extension direction of the first elongated hole is in the same direction as the length extension direction of the second elongated hole, and the length extension direction of the third elongated hole is perpendicular to the length extension direction of the second elongated hole.

[0015] Optionally, the two opposite sides of the first connecting plate are each threaded with a plurality of first limiting bolts configured to abut against the inner sidewall of the drying tank, and the length extension direction of the first limiting bolts is in the same direction as the length extension direction of the first elongated hole.

[0016] The two opposite sides of the third connecting plate are integrally formed with a first limiting plate. The two first limiting plates abut against the two opposite sides of the second connecting plate, and the first limiting plates are connected to the sides of the second connecting plate by a second limiting bolt.

[0017] The other two opposite sides of the third connecting plate are integrally formed with second limiting plates, and the second limiting plates are threadedly connected with a plurality of third limiting bolts, one end of which abuts against the side wall of the fourth connecting plate.

[0018] Optionally, the support comb plate is detachably connected to the support plate by bolts. There are three support comb plates, which are flush with each other, and the support groove of the middle support comb plate is lower than the support grooves of the two side support comb plates.

[0019] A transition member connects the support plate and the support column. The transition member includes a sleeve plate fitted onto the support column and two wing plates integrally formed on opposite sides of the sleeve plate. The support column has an circumferential step that restricts the downward sliding of the sleeve plate. The outer wall of the sleeve plate is threaded with a plurality of fourth limiting bolts configured to abut against the outer wall of the support column. The bottom of the support plate has two connectors integrally formed. The connectors have positioning grooves configured to embed the wing plates. The wing plates have fourth threaded holes. The outer wall of the connectors has a fourth elongated hole that communicates with the positioning grooves and mates with the fourth threaded hole. The length extension direction of the fourth elongated hole is perpendicular to the length extension direction of the third elongated hole.

[0020] Optionally, the support plate has multiple fifth threaded holes on both sides, and the support comb plate installed on the two sides of the support plate has multiple sixth threaded holes that cooperate with the fifth threaded holes. The two sides of the support plate extend outward to form installation steps, and the installation steps are threadedly connected to multiple fifth limiting bolts, one end of which is configured to abut against the bottom wall of the support comb plate.

[0021] Optionally, the limiting component includes a rotating member rotatably connected to the inner wall of the drying tank, a limiting comb plate connected to the rotating member, and a driving component connected to the outer wall of the drying tank and configured to drive the rotating member to rotate. The limiting comb plate has multiple limiting grooves that cooperate with the supporting grooves along its own length direction. Each limiting groove forms two supporting inclined surfaces respectively configured to abut against both sides of the wafer. The multiple limiting grooves and the multiple supporting grooves correspond one-to-one. The driving component is configured to drive the limiting comb plate closer to the supporting comb plate.

[0022] Optionally, there are two drive components, which are respectively connected to two opposite outer walls of the drying tank. The rotating component includes two rotating rods respectively connected to the drive components and a rotating plate assembly connected between the two rotating rods. The rotating plate assembly includes a fifth connecting plate connected to a limiting comb plate, two extension plates integrally formed on one end of the fifth connecting plate and perpendicular to the fifth connecting plate, two sixth connecting plates respectively connected to one end of the two rotating rods and perpendicular to the rotating rods, and an adjustment plate connected between the extension plates and the sixth connecting plates.

[0023] The adjusting plate has adjusting grooves at both ends, which are respectively configured to embed the sixth connecting plate and the extension plate. The bottom of one end of the adjusting groove has a plurality of seventh threaded holes. The sixth connecting plate has a plurality of eighth threaded holes configured to cooperate with the seventh threaded holes. The plurality of seventh threaded holes and the plurality of eighth threaded holes correspond one-to-one. The bottom of the other end of the adjusting groove has a plurality of ninth threaded holes. The extension plate has a plurality of fifth elongated holes configured to cooperate with the ninth threaded holes.

[0024] Optionally, the drive assembly includes a mounting shell connected to the outer wall of the drying tank, a mounting plate frame connected to the mounting shell, and a rotary cylinder connected to the mounting plate frame, wherein the rotating component is connected to the output shaft of the rotary cylinder.

[0025] Optionally, the first connecting plate is connected to a plurality of positioning posts configured to support the support plate of the lifting mechanism, one end of each of the four positioning posts extends to the top of the second connecting plate, and the height of the four positioning posts decreases sequentially from high to low.

[0026] This application also discloses a lifting mechanism for a wafer dryer. The wafer dryer includes a main body, a drying tank connected to the main body, and a lifting mechanism connected to the main body and configured to lift and lower multiple wafers into the drying tank. The drying tank is connected to a wafer support assembly as described above. The lifting mechanism includes an electric slide connected to the main body, a first mounting plate group for a slider connected to the electric slide, a second mounting plate group connected to one end of the first mounting plate group away from the slider, a pull plate connected to one end of the second mounting plate group away from the first mounting plate group, a support frame connected to the pull plate away from the second mounting plate group, and a tray connected to the support frame and configured to support the wafer cassette. One side of the tray is connected to multiple positioning elements that cooperate with the wafer cassette.

[0027] Optionally, the two opposite inner sidewalls of the support frame are respectively connected to support members configured to support the tray. The support member includes a support block connected to the support frame by fasteners and a positioning block connected to the support block. The tray has a positioning groove that penetrates itself and cooperates with the positioning block. The side of the tray away from the positioning member has a plurality of positioning holes that cooperate with the positioning posts of the wafer support.

[0028] Optionally, the second mounting plate group includes a first mounting plate connected to the first mounting plate group, a second mounting plate connected to the end of the first mounting plate away from the first mounting plate group, and a third mounting plate connected to the end of the second mounting plate away from the first mounting plate, wherein the pull plate is connected to the third mounting plate;

[0029] The first mounting plate has a first bending plate formed by bending its two sides, the second mounting plate has a second bending plate formed by bending its two sides, and the third mounting plate has a third bending plate formed by bending its two sides.

[0030] The second bending plate abuts against the outer side of the first bending plate. The first bending plate has a plurality of tenth threaded holes, and the second bending plate has a plurality of sixth elongated holes that cooperate with the tenth threaded holes.

[0031] Optionally, the third mounting plate is connected to the second mounting plate by a plurality of fasteners, and the third mounting plate is threaded with a plurality of sixth limiting bolts, one end of which abuts against the second mounting plate, to adjust the distance between the third mounting plate and the second mounting plate. The third bent plate is threaded with a plurality of seventh limiting bolts, one end of which abuts against the outer wall of the second bent plate, to adjust the distance between the third bent plate and the second bent plate.

[0032] Optionally, a universal bearing is connected between the third mounting plate and the second mounting plate.

[0033] This application also discloses a wafer dryer, including a main body, a drying tank connected to the main body, and a lifting mechanism connected to the main body and configured to lift and lower multiple wafers into the drying tank. The drying tank is connected to the wafer support assembly as described above, and the lifting mechanism is the lifting mechanism as described above.

[0034] Compared with the prior art, this application has at least the following beneficial effects:

[0035] In the cleaning process, a lifting mechanism slowly raises and lowers a wafer cassette containing multiple wafers into the drying tank of the wafer dryer. As the cassette descends, the wafers are transferred and supported onto multiple support combs on the wafer holder. These combs support the bottom of the wafers, with the two sides of the wafer's bottom abutting against two inclined support edges of the support tank. The contact area between the inclined support edges and the wafer is point-contact, relatively small. Then, a limiting component restrains the top of the wafer, working in conjunction with the multiple support combs to maintain the wafer's orientation and ensure point contact between the inclined support edges and the wafer. Cleaning fluid is injected into the drying tank through the inlet pipe, and the fluid level gradually rises until it covers the wafer surface. Then, a set... The cleaning solution is discharged from the drying tank through the drain pipe, while isoacetone vapor is injected into the drying tank through the solution tank. Due to the low surface tension of isoacetone, when the vapor comes into contact with the wafer surface, the Marangoni effect is generated, causing the liquid on the wafer surface to spread and evaporate rapidly, achieving a watermark-free and pollution-free drying effect until all the cleaning solution is discharged from the drying tank. Compared with the large clamping area in the prior art, this application maximizes the cleaning exposure area of ​​the wafer surface because the multiple support combs between the wafer and the wafer holder are in point contact, resulting in a small contact area. This effectively solves the problem of incomplete local cleaning caused by the large contact area in the prior art, improving the wafer cleaning quality and the yield of subsequent processes. Attached Figure Description

[0036] To more intuitively illustrate the prior art and this application, several exemplary figures are provided below. It should be understood that the specific shapes and structures shown in the figures should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary figures, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, size ratios, etc. of certain units (components).

[0037] Figure 1 is a schematic diagram of the overall structure of a wafer dryer provided in an embodiment of this application;

[0038] Figure 2 is a partial schematic diagram of Figure 1;

[0039] Figure 3 is a schematic diagram of the cooperation between the drying tank and the lifting mechanism of a wafer dryer provided in an embodiment of this application;

[0040] Figure 4 is a partial schematic diagram of Figure 3;

[0041] Figure 5 is a schematic diagram of the structure of the drying tank of a wafer dryer provided in an embodiment of this application;

[0042] Figure 6 is another perspective view of Figure 5;

[0043] Figure 7 is a partial schematic diagram of Figure 5;

[0044] Figure 8 is a schematic diagram of the wafer support structure of a wafer support assembly for a wafer dryer provided in an embodiment of this application;

[0045] Figure 9 is a partial schematic diagram of Figure 8;

[0046] Figure 10 is a partial schematic diagram of Figure 9;

[0047] Figure 11 is a schematic diagram of the explosion in Figure 10;

[0048] Figure 12 is a schematic diagram of the structure of the third connecting plate provided in an embodiment of this application;

[0049] Figure 13 is a schematic diagram of the structure of the first connecting plate provided in an embodiment of this application;

[0050] Figure 14 is a schematic diagram of the cooperation between the first connecting plate and the support plate provided in an embodiment of this application;

[0051] Figure 15 is a partial schematic diagram of Figure 14;

[0052] Figure 16 is a partial schematic diagram of Figure 10;

[0053] Figure 17 is a partial exploded view of Figure 16;

[0054] Figure 18 is a partial exploded view of the structure in Figure 16;

[0055] Figure 19 is a partial schematic diagram of Figure 18;

[0056] Figure 20 is an enlarged view of point A in Figure 19;

[0057] Figure 21 is a schematic diagram of the cooperation between multiple support comb plates and support plates provided in the embodiments of this application;

[0058] Figure 22 is a side view of Figure 21;

[0059] Figure 23 is a schematic diagram of the cooperation between multiple support combs and support plates and wafers provided in the embodiments of this application;

[0060] Figure 24 is a schematic diagram of the structure of the support comb plate provided in an embodiment of this application;

[0061] Figure 25 is a schematic diagram of the cooperation between the support comb plate and the wafer provided in the embodiment of this application;

[0062] Figure 26 is an enlarged view of section B in Figure 25;

[0063] Figure 27 is a schematic diagram of the cooperation between the drying tank and the limiting component provided in the embodiment of this application;

[0064] Figure 28 is a partial schematic diagram of the limiting component provided in an embodiment of this application;

[0065] Figure 29 is a partial exploded view of the structure in Figure 28;

[0066] Figure 30 is a structural schematic diagram of the limiting comb plate provided in an embodiment of this application;

[0067] Figure 31 is a schematic diagram of the fit between the limiting comb plate, the wafer, and the supporting comb plate provided in an embodiment of this application;

[0068] Figure 32 is a schematic diagram of the lifting mechanism of the wafer dryer provided in an embodiment of this application;

[0069] Figure 33 is a schematic diagram of the cooperation between the support frame, tray and wafer box provided in the embodiment of this application;

[0070] Figure 34 is a schematic diagram of the cooperation between the support frame and the tray provided in an embodiment of this application;

[0071] Figure 35 is another perspective view of Figure 34;

[0072] Figure 36 is a schematic diagram of the explosion in Figure 34;

[0073] Figure 37 is a structural schematic diagram of the second mounting plate assembly of the lifting mechanism provided in an embodiment of this application;

[0074] Figure 38 is a partial structural schematic diagram of Figure 37.

[0075] Explanation of reference numerals in the attached drawings: 1. Main body; 2. Drying tank; 21. Connecting column; 3. Solution tank; 4. Drain pipe; 5. Inlet pipe; 6. Wafer support assembly; 61. Support component; 6111. Support part; 6111. First connecting plate; 6111a. First limiting bolt; 6111b. First elongated hole; 6112. Second connecting plate; 6113. Third connecting plate; 6113a. Second limiting bolt; 6113b. Second elongated hole; 6113c. First limiting plate; 6113d. Second limiting plate; 6114. Fourth connecting plate; 6114a. Third limiting bolt 6114b, Third oblong hole; 612, Support column; 613, Support plate; 6131, Drainage trough; 6132, Connector; 6132a, Positioning groove; 6132b, Fourth oblong hole; 6133, Installation step; 6133a, Fifth limiting bolt; 62, Support comb plate; 621, Support groove; 6211, Support inclined side; 6212, Guide inclined surface; 63, Positioning column; 64, Guide arc plate; 65, Transition piece; 651, Sleeve plate; 6511, Fourth limiting bolt; 652, Wing plate; 7, Limiting assembly; 71, Rotating piece; 711. Rotating rod; 7111. Sixth connecting plate; 712. Rotating plate assembly; 7121. Fifth connecting plate; 7121a. Extension plate; 7121b. Fifth elongated hole; 7122. Adjusting plate; 72. Limiting comb plate; 72. Limiting comb plate; 721. Limiting groove; 7211. Supporting inclined surface; 73. Drive assembly; 731. Mounting shell; 732. Mounting plate frame; 733. Rotary cylinder; 8. Lifting mechanism; 81. Electric slide; 811. Slider; 812. First mounting plate assembly; 813. Second mounting plate assembly; 8131. First mounting... Plate; 8131a, First bending plate; 8132, Second mounting plate; 8132a, Second bending plate; 8132b, Sixth elongated hole; 8133, Third mounting plate; 8133a, Third bending plate; 8133b, Sixth limiting bolt; 8133c, Seventh limiting bolt; 8133d, Universal bearing; 814, Pull plate; 815, Support frame; 8151, Support component; 8151a, Support block; 8151b, Positioning block; 816, Pallet; 8161, Positioning component; 8162, Positioning hole; 9, Wafer box; 91, Wafer. Detailed Implementation

[0076] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0077] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," "third," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "comprising," "including," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).

[0078] Referring to Figures 1-9, 23-26, and 31, this application discloses a wafer support assembly 6 for a wafer dryer. The wafer dryer includes a main body 1, a drying tank 2 connected to the main body 1, an inlet pipe 5 connected to the drying tank 2 and configured to inject cleaning fluid into the drying tank 2, a solution tank 3 connected to the drying tank 2 and configured to inject isoacetone vapor into the drying tank 2, a drain pipe 4 connected to the drying tank 2 and configured to discharge cleaning fluid from the drying tank 2, and a lifting mechanism 8 connected to the main body 1 and configured to lift multiple wafers 91 into the drying tank 2. The wafer support assembly 6 includes a wafer 91 support connected to the inner bottom wall of the drying tank 2 and configured to support multiple wafers 91. A limiting component 7 is connected to the inner wall of the drying tank 2 and configured to cooperate with the wafer 91 support to restrict the orientation of multiple wafers 91. The wafer 91 support includes a support component 61 connected to the drying tank 2 and multiple support comb plates 62 connected to the support component 61. Multiple support grooves 621 are formed at the ends of the support comb plates 62 away from the support component 61 along their own length direction. The support grooves 621 form two support inclined edges 6211 respectively configured to abut against the two sides of the wafer 91 so that the support inclined edges 6211 make point contact with the wafer 91. Multiple support comb plates 62 are connected to the support component 61 at intervals so that the multiple support comb plates 62 support the bottom side of the wafer 91 along the arc-shaped extension direction of the edge of the wafer 91.

[0079] In the cleaning process, the lifting mechanism 8 slowly raises and lowers the wafer cassette 9 containing multiple wafers 91 into the drying tank 2 of the wafer dryer. During the descent of the wafer cassette 9, the multiple wafers 91 inside are transferred and supported onto multiple support comb plates 62 of the wafer 91 holder. The support comb plates 62 support the bottom of the wafers 91, and the two sides of the bottom of the wafers 91 abut against the two support bevels 6211 of the support groove 621. The support bevels 6211 and the wafers 91 have point contact with each other, resulting in a relatively small contact area. Then, the limiting component 7 restricts the top of the wafers 91, working in conjunction with the multiple support comb plates 62 to maintain the orientation of the wafers 91, ensuring that the support bevels 6211 and the wafers 91 remain in point contact. Cleaning fluid is injected into the drying tank 2 through the liquid inlet pipe 5, and the level of the cleaning fluid gradually rises until it completely covers the wafers. On the surface of wafer 91, the cleaning solution is discharged from the drying tank 2 through the drain pipe 4 at a set flow rate, while isopropyl ketone vapor is injected into the drying tank 2 through the solution tank 3. Due to the low surface tension of isopropyl ketone, when the vapor comes into contact with the surface of wafer 91, the Marangoni effect is generated, causing the liquid on the surface of wafer 91 to spread and evaporate rapidly, achieving a drying effect without watermarks or pollution, until all the cleaning solution is discharged from the drying tank 2. Compared with the large clamping area in the prior art, this application has a small contact area because the multiple support combs 62 of wafer 91 and wafer 91 support are in point contact, maximizing the cleaning exposure area on the surface of wafer 91. This effectively solves the problem of incomplete local cleaning caused by the large contact area in the prior art, and improves the cleaning quality of wafer 91 and the yield of subsequent processes.

[0080] It should be noted that the solution tank 3 and the lifting mechanism 8 are existing technologies. The solution tank 3 contains an isopropanol solution, which can generate isopropanone vapor during the cleaning process through heating or other methods. This vapor enters the drying tank 2 and forms a gas-liquid interface on the surface of the wafer 91 to achieve the Marangoni drying effect. The lifting mechanism 8 is configured to lower the wafer cassette 9 containing the wafer 91 into the drying tank 2, and during the descent of the wafer cassette 9, smoothly transfer the wafer 91 onto the support comb plate 62. Other pipeline structures of the wafer dryer are not shown in the figure.

[0081] Referring to Figures 7-9, the support assembly 61 consists of a support portion 611 connected to the inner bottom wall of the drying tank 2, a support column 612 connected to the inner bottom wall of the first support portion 611 away from the drying tank 2, and a support plate 613 connected to the end of the support column 612 away from the first support portion 611. Multiple support comb plates 62 are connected to the support plate 613. The inner bottom wall of the drying tank 2 has a drain port that mates with the drain pipe 4. The drain port is located at the bottom of the support portion 611. The support portion 611 is connected to the inner bottom wall of the drying tank 2 via multiple connecting columns 21, ensuring that the support portion 611 and the drain port are spaced apart. The structure of the support column 612 elevates the support portion 611, preventing it from directly covering the drain port and thus preventing blockage.

[0082] Referring to Figures 21-26, the support plate 613 has multiple through-hole drainage grooves 6131. ​​A guide arc plate 64 is connected to the side of the support plate 613 away from the support comb plate 62. The guide arc plate 64 has guide holes that avoid the support column 612. The guide holes are clearance-fitted with the support column 612. The guide holes are located at the lowest point of the guide arc plate 64 so that the liquid remaining on the support plate 613 drips into the drying tank 2 through the drainage grooves 6131 and the guide holes. The two support inclined sides 6211 intersect to form a V-shaped groove in the support groove 621. One side of the support comb plate 62 forms a vertical plane that matches the V-shaped groove, and the other side forms two guide inclined surfaces 6212 that match the support inclined sides 6211. The two guide inclined surfaces 6212 and the two support inclined sides 6211 correspond one-to-one.

[0083] During the discharge of cleaning fluid, any residual cleaning fluid on the support plate 613 flows through the drain trough 6131 to the guide arc plate 64. The guide arc plate 64 causes the cleaning fluid to flow along its arc-shaped surface and eventually collect at the lowest point of the guide hole, allowing the cleaning fluid to drip smoothly into the gradually descending liquid level in the drying tank 2, preventing residual liquid from accumulating on the support assembly 61. Furthermore, the vertical plane of the support comb plate 62 and the guide slope 6212 work together to ensure that the cleaning fluid flows towards the drain trough 6131 on the support comb plate 62, reducing the possibility of liquid residue.

[0084] Optionally, there are three support comb plates 62 and two drainage troughs 6131, with the two drainage troughs 6131 located between two adjacent support comb plates 62.

[0085] Referring to Figures 8-12, the support 611 includes a first connecting plate 6111 connected to a plurality of connecting posts 21, a second connecting plate 6112 connected to the side of the first connecting plate 6111 away from the connecting posts 21, a third connecting plate 6113 connected to the side of the second connecting plate 6112 away from the first connecting plate 6111, and a fourth connecting plate 6114 connected to the side of the third connecting plate 6113 away from the second connecting plate 6112. One end of the support post 612 is connected to the fourth connecting plate 6114.

[0086] The connecting post 21 has a first threaded hole, the first connecting plate 6111 has a plurality of first elongated holes 6111b that mate with the first threaded hole, the second connecting plate 6112 has a second threaded hole, the third connecting plate 6113 has a plurality of second elongated holes 6113b that mate with the second threaded hole, the third connecting plate 6113 has a third threaded hole, and the fourth connecting plate 6114 has a plurality of third elongated holes 6114b that mate with the third threaded hole;

[0087] The length extension direction of the first elongated hole 6111b is in the same direction as the length extension direction of the second elongated hole 6113b, and the length extension direction of the third elongated hole 6114b is perpendicular to the length extension direction of the second elongated hole 6113b.

[0088] The support section 611 is composed of multiple connecting plates connected sequentially. Through elongated holes in different directions, the position of the support column 612 can be adjusted in multiple directions. The first connecting plate 6111 can be adjusted along the length of the first elongated hole 6111b; similarly, the second connecting plate 6112 can be adjusted along the length of the second elongated hole 6113b, and the third connecting plate 6113 provides an adjustment direction perpendicular to the first two through the third elongated hole 6114b. Thus, the support column 612 on the fourth connecting plate 6114 can be freely adjusted in two mutually perpendicular directions, thereby controlling the position of the support comb plate 62. Through this multi-directional adjustable structure, the support column 612 can be adjusted according to specific installation requirements, allowing the support comb plate 62 to be precisely aligned with the wafer 91.

[0089] It should be noted that the threaded hole and the oblong hole are fixed together by bolts.

[0090] Optionally, the first connecting plate 6111 has a relief groove that extends through itself, so that the cleaning fluid can enter the drain port from the relief groove during the discharge process.

[0091] The two opposite sides of the first connecting plate 6111 are threadedly connected with a plurality of first limiting bolts 6111a configured to abut against the inner sidewall of the drying tank 2. The length extension direction of the first limiting bolts 6111a is in the same direction as the length extension direction of the first elongated hole 6111b.

[0092] The two opposite sides of the third connecting plate 6113 are integrally formed with a first limiting plate 6113c. The two first limiting plates 6113c abut against the two opposite sides of the second connecting plate 6112 respectively, and the first limiting plates 6113c are connected to the side of the second connecting plate 6112 by a second limiting bolt 6113a.

[0093] The other two opposite sides of the third connecting plate 6113 are integrally formed with a second limiting plate 6113d, and the second limiting plate 6113d is threadedly connected with a plurality of third limiting bolts 6114a, one end of which abuts against the side wall of the fourth connecting plate 6114.

[0094] The two opposite sides of the first connecting plate 6111 are abutted against the inner wall of the drying tank 2 by a plurality of first limiting bolts 6111a. The first limiting bolts 6111a extend in the same direction as the first elongated hole 6111b, which can effectively limit the horizontal displacement of the first connecting plate 6111, thereby ensuring the stability of the first connecting plate 6111 during installation. The two opposite sides of the third connecting plate 6113 are integrally formed with the first limiting plate 6113c and fixedly engaged with the second connecting plate 6112 by a plurality of second limiting bolts 6113a, thereby limiting the relative position of the third connecting plate 6113 relative to the second connecting plate 6112. In addition, the other two opposite sides of the third connecting plate 6113 are integrally formed with the second limiting plate 6113d and connected to the fourth connecting plate 6114 by a plurality of third limiting bolts 6114a, further limiting the relative displacement between the fourth connecting plate 6114 and the third connecting plate 6113.

[0095] Through the combined action of the first, second, and third limiting bolts, each connecting plate in the support assembly 61 can effectively limit its own displacement and relative position changes, thereby ensuring that the installation position of the support column 612 remains stable during cleaning and drying.

[0096] Referring to Figure 16-23, the support comb plate 62 is detachably connected to the support plate 613 by bolts. There are three support comb plates 62, which are flush with each other, and the support groove 621 of the middle support comb plate 62 is lower than the support grooves 621 of the two side support comb plates 62.

[0097] A transition piece 65 connects the support plate 613 and the support column 612. The transition piece 65 includes a sleeve plate 651 fitted onto the support column 612 and two wing plates 652 integrally formed on opposite sides of the sleeve plate 651. The support column 612 forms an circumferential step that restricts the downward sliding of the sleeve plate 651. The outer wall of the sleeve plate 651 is threaded with a plurality of fourth limiting bolts 6511 configured to abut against the outer wall of the support column 612. The bottom of the support plate 613 is integrally formed with two connectors 6132. The connectors 6132 have positioning grooves 6132a configured to embed the wing plates 652. The wing plates 652 have fourth threaded holes. The outer wall of the connectors 6132 has a fourth elongated hole 6132b that communicates with the positioning grooves 6132a and mates with the fourth threaded hole. The length extension direction of the fourth elongated hole 6132b is perpendicular to the length extension direction of the third elongated hole 6114b.

[0098] The support grooves 621 of the three support comb plates 62 have different heights. The middle support comb plate 62 is supported at the lowest point of the wafer 91, while the support comb plates 62 on both sides are supported on both sides of the lowest point.

[0099] The support comb plate 62 is detachably connected to the support plate 613 by bolts, and the support plate 613 and the support column 612 are connected by a transition piece 65. The transition piece 65 includes a sleeve plate 651 fitted onto the support column 612 and two wing plates 652. The wing plates 652 engage with the positioning groove 6132a at the bottom of the support plate 613, ensuring that the transition piece 65 and the support plate 613 have a fixed position during installation, preventing relative rotation. By rotating the sleeve plate 651, the rotational orientation of the transition piece 65 and the support plate 613 in the horizontal plane can be finely adjusted, ensuring that the support comb plate 62 can be accurately positioned according to positional requirements. In addition, the outer wall of the sleeve plate 651 is provided with a fourth limiting bolt 6511, which restricts the relative rotation between the sleeve plate 651 and the support column 612.

[0100] The support plate 613 can be positioned along the direction of the third elongated hole 6114b. Combined with the multi-directional adjustment of the first, second, and third elongated holes 6114b, the final position and orientation of the support comb plate 62 can be finely adjusted through the transition piece 65, so that the support comb plate 62 can maintain the best contact position and support orientation with the wafer 91.

[0101] The support plate 613 has multiple fifth threaded holes on both sides. The support comb plate 62, which is installed on both sides of the support plate 613, has multiple sixth threaded holes that match the fifth threaded holes. The two sides of the support plate 613 extend outward to form an installation step 6133. The installation step 6133 is threadedly connected to multiple fifth limiting bolts 6133a, one end of which is configured to abut against the bottom wall of the support comb plate 62.

[0102] Multiple fifth threaded holes are formed on both sides of the support plate 613, which mate with the sixth threaded holes on the support comb plates 62 mounted on both sides of the support plate 613, allowing the support comb plates 62 to be fixed to the support plate 613 with fasteners. During installation, the fifth limiting bolt 6133a is rotated so that its end abuts against the bottom wall of the support comb plate 62, thereby supporting the support comb plate 62 and aligning the sixth and fifth threaded holes. This allows installers to more easily fix the fasteners in the corresponding holes, ensuring precise alignment between the support comb plate 62 and the support plate 613.

[0103] Referring to Figures 27-31, the limiting component 7 includes a rotating member 71 rotatably connected to the inner wall of the drying tank 2, a limiting comb plate 7272 connected to the rotating member 71, and a driving component 73 connected to the outer wall of the drying tank 2 and configured to drive the rotating member 71 to rotate. The limiting comb plate 7272 has multiple limiting grooves 721 that cooperate with the supporting grooves 621 along its own length direction. The limiting grooves 721 form two supporting inclined surfaces 7211 respectively configured to abut against both sides of the wafer 91. The multiple limiting grooves 721 and the multiple supporting grooves 621 correspond one-to-one. The driving component 73 is configured to drive the limiting comb plate 7272 to approach the supporting comb plate 62.

[0104] When multiple wafers 91 are supported by multiple support comb plates 62 of the wafer 91 holder, the drive assembly 73 drives the rotating component 71 to rotate, so that the limiting comb plate 7272 rotates closer to the top of the wafer 91, and the two sides of the top of the wafer 91 abut against the support slope 7211 of the limiting groove 721. In conjunction with the wafer 91 holder, the orientation of the multiple wafers 91 is restricted, preventing the wafers 91 from shaking during the cleaning process and keeping the wafers 91 in a vertical state.

[0105] There are two drive components 73, which are respectively connected to two opposite outer walls of the drying tank 2. The rotating component 71 includes two rotating rods 711 respectively connected to the drive components 73, and a rotating plate assembly 712 connected between the two rotating rods 711. The rotating plate assembly 712 includes a fifth connecting plate 7121 connected to a limiting comb plate 7272, two extension plates 7121a respectively integrally formed on one end of the fifth connecting plate 7121 and perpendicular to the fifth connecting plate 7121, two sixth connecting plates 7111 respectively connected to one end of the two rotating rods 711 and perpendicular to the rotating rods 711, and an adjusting plate 7122 connected between the extension plate 7121a and the sixth connecting plate 7111.

[0106] The adjusting plate 7122 has adjusting grooves at both ends, which are respectively configured to embed the sixth connecting plate 7111 and the extension plate 7121a. The bottom of one end of the adjusting groove has multiple seventh threaded holes, and the sixth connecting plate 7111 has multiple eighth threaded holes configured to mate with the seventh threaded holes. The multiple seventh threaded holes and the multiple eighth threaded holes correspond one-to-one. The bottom of the other end of the adjusting groove has multiple ninth threaded holes, and the extension plate 7121a has multiple fifth elongated holes 7121b configured to mate with the ninth threaded holes.

[0107] Two drive components 73 are located at both ends of the rotating component 71, which can synchronously drive the rotating component 71 to rotate smoothly, avoiding the deflection phenomenon caused by unilateral drive. The middle part of the rotating component 71, namely the fifth connecting plate 7121, is bent to one side to form a clearance space for related structures of the lifting mechanism 8 (such as wafer box 9), so that the wafer 91 is not disturbed during lifting and lowering. At the same time, this bending structure allows the fifth connecting plate 7121 to rotate close to the top of the wafer 91, ensuring that the limiting comb plate 7272 can accurately contact both sides of the wafer 91.

[0108] In addition, the adjustment plate 7122 can adjust the relative position between the extension plate 7121a and the sixth connecting plate 7111 through the fifth elongated hole 7121b, so as to adjust the distance between the fifth connecting plate 7121 and the rotating rod 711, flexibly adapting to wafers 91 of different sizes, and can adaptively support and limit wafers 91 of different sizes during cleaning and drying processes.

[0109] The drive assembly 73 includes a mounting shell 731 connected to the outer wall of the drying tank 2, a mounting plate frame 732 connected to the mounting shell 731, and a rotary cylinder 733 connected to the mounting plate frame 732. The rotating component 71 is connected to the output shaft of the rotary cylinder 733.

[0110] Referring to Figures 13-15, the first connecting plate 6111 is connected to a plurality of positioning posts 63 configured to support the lifting mechanism 8, and one end of each of the four positioning posts 63 extends to the top of the second connecting plate 6112. The height of the four positioning posts 63 decreases from high to low. During the descent of the lifting mechanism 8, multiple support combs 62 of the wafer 91 holder pass through the through holes at the bottom of the wafer box 9, supporting the multiple wafers 91 inside the wafer box 9, causing the multiple wafers 91 to gradually detach from the wafer box 9. As the lifting mechanism 8 continues to descend, the wafer box 9 is supported on the support plate 816 of the lifting mechanism 8. The four positioning posts 63 can support the support plate 816 and the wafer box 9 together, and the ends of the four positioning posts 63 are at different heights. The support plate 816 and the wafer box 9 are supported on the positioning posts 63 in a slightly tilted state. This tilt makes it less likely for the wafer box 9 to accumulate liquid during the discharge of cleaning fluid, and the cleaning fluid can flow smoothly from the tilted surface of the wafer box 9, reducing the residue of cleaning fluid.

[0111] It should be noted that the end of the positioning post 63 is formed into a pointed tip, and the bottom of the support plate 816 is provided with a positioning hole 8162 that matches the pointed tip of the positioning post 63. The opening of the positioning hole 8162 is large and the diameter gradually decreases. The pointed tip of the positioning post 63 is inserted into the positioning hole 8162 to lift the support plate 816.

[0112] Referring to Figures 32-38, this application also discloses a lifting mechanism 8 for a wafer dryer. The wafer dryer includes a main body 1, a drying tank 2 connected to the main body 1, and a lifting mechanism 8 connected to the main body 1 and configured to lift and lower multiple wafers 91 into the drying tank 2. The drying tank 2 is connected to the wafer support assembly 6 as described above. The lifting mechanism 8 includes an electric slide 81 connected to the main body 1, a first mounting plate group 812 connected to a slider 811 of the electric slide 81, a second mounting plate group 813 connected to the end of the first mounting plate group 812 away from the slider 811, a pull plate 814 connected to the end of the second mounting plate group 813 away from the first mounting plate group 812, a support frame 815 connected to the pull plate 814 away from the second mounting plate group 813, and a tray 816 connected to the support frame 815 and configured to support a wafer cassette 9. A plurality of positioning members 8161 that cooperate with the wafer cassette 9 are connected to one side of the tray 816.

[0113] The lifting mechanism 8 utilizes the existing electric slide table 81 and slider 811. The electric slide table 81 drives the slider 811 to move, achieving synchronous lifting and lowering of the support frame 815, the tray 816, and the wafer cassette 9. When the electric slide table 81 drives the slider 811 to move up and down, the slider 811 transmits the movement step by step through the first mounting plate group 812, the second mounting plate group 813, and the pull plate 814, so that the support frame 815, the tray 816, and the wafer cassette 9 on it rise and fall smoothly. The tray 816 is equipped with multiple positioning elements 8161, which are distributed around the wafer cassette 9. These positioning elements 8161 can effectively limit the movement of the wafer cassette 9 and ensure that the wafer cassette 9 is stable in position during the lifting and lowering process, without any deviation or shaking.

[0114] The electric slide table 81, the slider 811 and the positioning element 8161 are all prior art, and will not be described in detail in this application.

[0115] The two opposing inner sidewalls of the support frame 815 are respectively connected to support members 8151 configured to support the tray 816. The support member 8151 includes a support block 8151a connected to the support frame 815 by fasteners and a positioning block 8151b connected to the support block 8151a. The tray 816 has a positioning groove 6132a that passes through itself and cooperates with the positioning block 8151b. On the side of the tray 816 away from the positioning member 8161, there are multiple positioning holes 8162 that cooperate with the positioning posts 63 of the wafer 91 holder. The tray 816 is supported by the positioning groove 6132a passing through the positioning block 8151b, ensuring that the position of the tray 816 within the support frame 815 is stable. When the lifting mechanism 8 descends, the tray 816 moves together with the support frame 815 until the wafer cassette 9 is accurately positioned in the cleaning and drying position.

[0116] After the tray 816 descends to the designated position, the positioning post 63 on the wafer 91 support gradually engages with the positioning hole 8162 on the tray 816, lifting the tray 816. In this way, as the lifting mechanism 8 continues to descend, the tray 816 and the wafer cassette 9 on it are reliably supported on the wafer 91 support.

[0117] The second mounting plate group 813 includes a first mounting plate 8131 connected to the first mounting plate group 812, a second mounting plate 8132 connected to one end of the first mounting plate 8131 away from the first mounting plate group 812, and a third mounting plate 8133 connected to one end of the second mounting plate 8132 away from the first mounting plate 8131, with a tension plate 814 connected to the third mounting plate 8133.

[0118] The first mounting plate 8131 is bent on both sides to form a first bent plate 8131a, the second mounting plate 8132 is bent on both sides to form a second bent plate 8132a, and the third mounting plate 8133 is bent on both sides to form a third bent plate 8133a.

[0119] The second bending plate 8132a abuts against the outside of the first bending plate 8131a. The first bending plate 8131a has multiple tenth threaded holes, and the second bending plate 8132a has multiple sixth elongated holes 8132b that mate with the tenth threaded holes.

[0120] The second mounting plate 8132 is bent on both sides to form a second bent plate 8132a, which is closely attached to the outer side of the first bent plate 8131a of the first mounting plate 8131. The tenth threaded hole on the first bent plate 8131a cooperates with the sixth elongated hole 8132b on the second bent plate 8132a, so that the second mounting plate 8132 can be adjusted in position along the length direction of the sixth elongated hole 8132b (which is the same as the length extension direction of the second mounting plate 8132). This allows for slight displacement adjustment of the tray 816 and the wafer cassette 9 on it in the horizontal plane, ensuring the alignment accuracy of the wafer cassette 9 when the lifting mechanism 8 moves to the drying tank 2.

[0121] The third mounting plate 8133 is connected to the second mounting plate 8132 by a plurality of fasteners. The third mounting plate 8133 is threaded with a plurality of sixth limiting bolts 8133b, one end of which abuts against the second mounting plate 8132, to adjust the distance between the third mounting plate 8133 and the second mounting plate 8132. The third bent plate 8133a is threaded with a plurality of seventh limiting bolts 8133c, one end of which abuts against the outer wall of the second bent plate 8132a, to adjust the distance between the third bent plate 8133a and the second bent plate 8132a.

[0122] The third mounting plate 8133 is connected to the second mounting plate 8132 by multiple fasteners, and the distance between the third mounting plate 8133 and the second mounting plate 8132 is adjusted by multiple sixth limiting bolts 8133b, thereby achieving precise control over the height of the support plate 816 and the wafer cassette 9. One end of the sixth limiting bolt 8133b abuts against the second mounting plate 8132, and rotation adjustment can change the relative position of the third mounting plate 8133 and the second mounting plate 8132, thereby fine-tuning the vertical height of the support plate 816 and the wafer cassette 9. Finally, the third mounting plate 8133 and the second mounting plate 8132 are connected by multiple fasteners.

[0123] Meanwhile, the third bending plate 8133a is engaged with the outer wall of the second bending plate 8132a through the seventh limiting bolt 8133c. One end of the plurality of seventh limiting bolts 8133c abuts against the outer wall of the second bending plate 8132a. By rotating and adjusting the seventh limiting bolt 8133c, the distance between the third bending plate 8133a and the second bending plate 8132a can be adjusted, thereby further adjusting the horizontal position of the support plate 816 and the wafer box 9.

[0124] By combining and adjusting related structures such as the sixth elongated hole 8132b, the sixth limiting bolt 8133b, and the seventh limiting bolt 8133c, the positions of the tray 816 and the wafer box 9 can be precisely fine-tuned in three vertical directions.

[0125] Optionally, fasteners can also be connected between the first mounting plate 8131 and the second mounting plate 8132 to further fix the position between the first mounting plate 8131 and the second mounting plate 8132.

[0126] A universal bearing 8133d is connected between the third mounting plate 8133 and the second mounting plate 8132.

[0127] The universal bearing 8133d can ensure the relative connection between the third mounting plate 8133 and the second mounting plate 8132, and facilitate the adjustment of the positional relationship between the third mounting plate 8133 and the second mounting plate 8132 by means of the sixth limiting bolt 8133b and the seventh limiting bolt 8133c.

[0128] This application also discloses a wafer dryer, including a main body 1, a drying tank 2 connected to the main body 1, and a lifting mechanism 8 connected to the main body 1 and configured to lift and lower a plurality of wafers 91 into the drying tank 2. The drying tank 2 is connected to the wafer support assembly 6 as described above, and the lifting mechanism 8 is the lifting mechanism 8 as described above.

[0129] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

[0130] The present application has been described in a relatively specific and detailed manner above through general descriptions and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not depart from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the protection scope of the claims of the present application. Industrial applicability

[0131] In summary, the embodiments of this application provide a wafer dryer and its wafer support assembly and lifting mechanism. The wafer and multiple support combs of the wafer support are in point contact, with a small contact area, which maximizes the cleaning exposure area on the wafer surface. This effectively solves the problem of incomplete local cleaning caused by the large contact area in the prior art, and improves the cleaning quality of the wafer and the yield of subsequent processes.

Claims

1. A wafer support assembly for a wafer dryer, the wafer dryer comprising a main body, a drying tank connected to the main body, an inlet pipe connected to the drying tank and configured to inject cleaning fluid into the drying tank, a solution tank connected to the drying tank and configured to inject isoacetone vapor into the drying tank, a drain pipe connected to the drying tank and configured to discharge cleaning fluid from the drying tank, and a lifting mechanism connected to the main body and configured to lift and lower multiple wafers into the drying tank, characterized in that... The wafer support assembly includes a wafer support connected to the inner bottom wall of the drying tank and configured to support multiple wafers, and a limiting component connected to the inner side wall of the drying tank and configured to cooperate with the wafer support to restrict the orientation of the multiple wafers. The wafer support includes a support component connected to the drying tank and multiple support combs connected to the support component. The ends of the support combs away from the support component have multiple support grooves along their own length direction. Each support groove forms two support bevels respectively configured to abut against the two sides of the wafer so that the support bevels make point contact with the wafer. The multiple support combs are connected to the support component at intervals so that the multiple support combs support the bottom side of the wafer along the arcuate extension direction of the wafer edge.

2. The wafer support assembly of claim 1, wherein The support assembly consists of a support portion connected to the inner bottom wall of the drying tank, a support column connected to the first support portion away from the inner bottom wall of the drying tank, and a support plate connected to the end of the support column away from the first support portion. Multiple support comb plates are connected to the support plate. The inner bottom wall of the drying tank is provided with a drain port that matches the drain pipe. The drain port is located at the bottom of the support portion. The support portion is connected to the inner bottom wall of the drying tank through multiple connecting columns so that the support portion and the drain port are arranged at intervals.

3. The wafer support assembly of claim 2, wherein, The support plate has multiple drainage grooves that penetrate it. A guide arc plate is connected to the side of the support plate away from the support comb plate. The guide arc plate has guide holes that avoid the support column. The guide holes are in clearance fit with the support column. The guide holes are located at the lowest point of the guide arc plate so that the liquid remaining on the support plate drips into the drying tank through the drainage grooves and the guide holes. The two support inclined sides intersect to form a V-shaped groove. One side of the support comb plate is formed as a vertical plane that matches the V-shaped groove, and the other side is formed with two guide inclined surfaces that match the support inclined sides. The two guide inclined surfaces correspond one-to-one with the two support inclined sides.

4. The wafer support assembly of claim 2, wherein, The support includes a first connecting plate connected to a plurality of connecting columns, a second connecting plate connected to the side of the first connecting plate away from the connecting columns, a third connecting plate connected to the side of the second connecting plate away from the first connecting plate, and a fourth connecting plate connected to the side of the third connecting plate away from the second connecting plate, with one end of the support column connected to the fourth connecting plate. The connecting post has a first threaded hole, the first connecting plate has a plurality of first elongated holes that mate with the first threaded hole, the second connecting plate has a second threaded hole, the third connecting plate has a plurality of second elongated holes that mate with the second threaded hole, the third connecting plate has a third threaded hole, and the fourth connecting plate has a plurality of third elongated holes that mate with the third threaded hole. The length extension direction of the first elongated hole is in the same direction as the length extension direction of the second elongated hole, and the length extension direction of the third elongated hole is perpendicular to the length extension direction of the second elongated hole.

5. The wafer support assembly of claim 4, wherein, The two opposite sides of the first connecting plate are threaded with a plurality of first limiting bolts configured to abut against the inner sidewall of the drying tank. The length extension direction of the first limiting bolts is in the same direction as the length extension direction of the first elongated hole. The two opposite sides of the third connecting plate are integrally formed with a first limiting plate. The two first limiting plates abut against the two opposite sides of the second connecting plate, and the first limiting plates are connected to the sides of the second connecting plate by a second limiting bolt. The other two opposite sides of the third connecting plate are integrally formed with second limiting plates, and the second limiting plates are threadedly connected with a plurality of third limiting bolts, one end of which abuts against the side wall of the fourth connecting plate.

6. The wafer support assembly of claim 4, wherein, The support comb plate is detachably connected to the support plate by bolts. There are three support comb plates, which are flush with each other, and the support groove of the middle support comb plate is lower than the support grooves of the two side support comb plates. A transition member connects the support plate and the support column. The transition member includes a sleeve plate fitted onto the support column and two wing plates integrally formed on opposite sides of the sleeve plate. The support column has an circumferential step that restricts the downward sliding of the sleeve plate. The outer wall of the sleeve plate is threaded with a plurality of fourth limiting bolts configured to abut against the outer wall of the support column. The bottom of the support plate has two connectors integrally formed. The connectors have positioning grooves configured to embed the wing plates. The wing plates have fourth threaded holes. The outer wall of the connectors has a fourth elongated hole that communicates with the positioning grooves and mates with the fourth threaded hole. The length extension direction of the fourth elongated hole is perpendicular to the length extension direction of the third elongated hole.

7. The wafer support assembly of claim 6, wherein The support plate has multiple fifth threaded holes on both sides, and the support comb plate installed on the two sides of the support plate has multiple sixth threaded holes that match the fifth threaded holes. The two sides of the support plate extend outward to form installation steps, and the installation steps are threadedly connected to multiple fifth limiting bolts, one end of which is configured to abut against the bottom wall of the support comb plate.

8. The wafer support assembly of claim 1 or 3, wherein, The limiting component includes a rotating member rotatably connected to the inner wall of the drying tank, a limiting comb plate connected to the rotating member, and a driving component connected to the outer wall of the drying tank and configured to drive the rotating member to rotate. The limiting comb plate has multiple limiting grooves along its own length direction that cooperate with the support grooves. Each limiting groove forms two support slopes respectively configured to abut against both sides of the wafer. The multiple limiting grooves and the multiple support grooves correspond one-to-one. The driving component is configured to drive the limiting comb plate closer to the support comb plate.

9. The wafer support assembly of claim 8, wherein, The driving assembly consists of two components, which are respectively connected to two opposite outer walls of the drying tank. The rotating component includes two rotating rods respectively connected to the driving assembly and a rotating plate assembly connected between the two rotating rods. The rotating plate assembly includes a fifth connecting plate connected to a limiting comb plate, two extension plates integrally formed on one end of the fifth connecting plate and perpendicular to the fifth connecting plate, two sixth connecting plates respectively connected to one end of the two rotating rods and perpendicular to the rotating rods, and an adjusting plate connected between the extension plates and the sixth connecting plates. The adjusting plate has adjusting grooves at both ends, which are respectively configured to embed the sixth connecting plate and the extension plate. The bottom of one end of the adjusting groove has a plurality of seventh threaded holes. The sixth connecting plate has a plurality of eighth threaded holes configured to cooperate with the seventh threaded holes. The plurality of seventh threaded holes and the plurality of eighth threaded holes correspond one-to-one. The bottom of the other end of the adjusting groove has a plurality of ninth threaded holes. The extension plate has a plurality of fifth elongated holes configured to cooperate with the ninth threaded holes.

10. The wafer support assembly of claim 8 or 9, wherein, The drive assembly includes a mounting shell connected to the outer wall of the drying tank, a mounting plate frame connected inside the mounting shell, and a rotary cylinder connected to the mounting plate frame. The rotating component is connected to the output shaft of the rotary cylinder.

11. The wafer support assembly of claim 4, wherein, The first connecting plate is connected to a plurality of positioning posts configured to support the support plate of the lifting mechanism. One end of each of the four positioning posts extends to the top of the second connecting plate, and the height of the four positioning posts decreases sequentially from high to low.

12. A lift mechanism of a wafer drying machine, the wafer drying machine comprising a main body, a drying tank body connected to the main body, a lift mechanism connected to the main body and configured to lift a plurality of wafers into the drying tank body, the drying tank body connected with the wafer support assembly according to any one of claims 1-11, characterized in that, The lifting mechanism includes an electric slide connected to the main body, a first mounting plate group for a slider connected to the electric slide, a second mounting plate group connected to the end of the first mounting plate group away from the slider, a pull plate connected to the end of the second mounting plate group away from the first mounting plate group, a support frame connected to the pull plate away from the second mounting plate group, and a tray connected to the support frame and configured to support the wafer cassette. One side of the tray is connected to a plurality of positioning elements that cooperate with the wafer cassette.

13. The lifting mechanism of claim 12, wherein, The two opposing inner sidewalls of the support frame are respectively connected to support members configured to support the tray. The support members include a support block connected to the support frame by fasteners and a positioning block connected to the support block. The tray has a positioning groove that penetrates itself and cooperates with the positioning block. The side of the tray away from the positioning member has a plurality of positioning holes that cooperate with the positioning posts of the wafer support.

14. The lifting mechanism of claim 12, wherein, The second mounting plate group includes a first mounting plate connected to the first mounting plate group, a second mounting plate connected to the end of the first mounting plate away from the first mounting plate group, and a third mounting plate connected to the end of the second mounting plate away from the first mounting plate, wherein the tension plate is connected to the third mounting plate; The first mounting plate has a first bending plate formed by bending its two sides, the second mounting plate has a second bending plate formed by bending its two sides, and the third mounting plate has a third bending plate formed by bending its two sides. The second bending plate abuts against the outer side of the first bending plate. The first bending plate has a plurality of tenth threaded holes, and the second bending plate has a plurality of sixth elongated holes that cooperate with the tenth threaded holes.

15. The lifting mechanism of claim 14, wherein, The third mounting plate is connected to the second mounting plate by a plurality of fasteners. The third mounting plate is threaded with a plurality of sixth limiting bolts, one end of which abuts against the second mounting plate, to adjust the distance between the third mounting plate and the second mounting plate. The third bent plate is threaded with a plurality of seventh limiting bolts, one end of which abuts against the outer wall of the second bent plate, to adjust the distance between the third bent plate and the second bent plate.

16. The lifting mechanism of claim 15, wherein, A universal bearing is connected between the third mounting plate and the second mounting plate.

17. A wafer drying machine characterized by comprising: The device includes a main body, a drying tank connected to the main body, and a lifting mechanism connected to the main body and configured to lift and lower a plurality of wafers into the drying tank. The drying tank is connected to a wafer support assembly according to any one of claims 1-11, and the lifting mechanism is a lifting mechanism according to any one of claims 12-16.

Images