Electronic device comprising light-emitting material

Abstract

The present disclosure relates to an electronic device. According to an embodiment of the present disclosure, an electronic device may be provided, the electronic device comprising: a housing including a rear plate; a camera assembly disposed in the housing; and a first reflective member configured to surround a portion of the circumference of the camera assembly, wherein: the rear plate includes an opaque upper layer, a lower layer forming the exterior of the electronic device, a first layer disposed between the upper layer and the lower layer and including a light-emitting material, and an opening formed to penetrate the upper layer, the first layer, and the lower layer; the side surface of the first layer is exposed to the outside of the electronic device through the opening; a portion of the camera assembly is exposed to the outside of the electronic device through the opening; and the first reflective member is disposed in an opening between the camera assembly and the first layer and includes a first inclined surface configured to reflect light emitted from the light-emitting material of the first layer, to the outside of the electronic device.

Description

Electronic device including a luminescent material

[0001] The embodiments of the present disclosure relate to electronic devices, for example, electronic devices comprising a light-emitting material.

[0002] Driven by the remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. In particular, recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and in-car navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, the electronic device may be provided, comprising: a housing including a rear plate; a camera assembly disposed in the housing; and a first reflective member configured to surround a portion of the circumference of the camera assembly, wherein the rear plate comprises an opaque upper layer, a lower layer forming the exterior of the electronic device, a first layer disposed between the upper layer and the lower layer and comprising a light-emitting material, and an opening formed to penetrate the upper layer, the first layer, and the lower layer, wherein a side of the first layer is exposed to the outside of the electronic device through the opening, and a portion of the camera assembly is exposed to the outside of the electronic device through the opening, and the first reflective member comprises a first inclined surface disposed in the opening between the camera assembly and the first layer and configured to reflect light emitted from the light-emitting material of the first layer to the outside of the electronic device.

[0006] The present disclosure relates to a rear plate. A rear plate for covering the rear of an electronic device including a camera assembly may be provided, comprising: an opaque upper layer; a lower layer forming the exterior of the electronic device; a first layer disposed between the upper layer and the lower layer and comprising a light-emitting material; an opening formed to penetrate the upper layer, the first layer and the lower layer; and a first reflective member configured to surround a portion of the circumference of the camera assembly, wherein a portion of the camera assembly is exposed to the outside of the electronic device through the opening; the first reflective member comprises a first inclined surface disposed in the opening between the camera assembly and the first layer and configured to reflect light emitted from the light-emitting material of the first layer to the outside of the electronic device, wherein the first inclined surface of the first reflective member is configured to form an angle of 60 degrees with the first layer, and the first inclined surface is configured to have a gloss of GU 100 or higher.

[0007] The present disclosure may provide a method for manufacturing a rear plate comprising: a process of forming a first layer including a light-emitting material; a process of forming an upper layer on the front surface of the first layer; a process of forming a lower layer on the back surface of the first layer; a process of integrating the upper layer, the first layer, and the lower layer into a plate; a process of forming at least one opening in the integrated plate; and a process of forming a first reflective member at a position corresponding to the opening, wherein when a part of an electronic component is placed in the opening, the electronic component is configured to be surrounded by the first reflective member at a position corresponding to the opening, and the first reflective member is configured to be inclined to reflect light provided from the light-emitting material to the outside of the electronic device.

[0008] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0009] FIG. 1 is a block diagram showing an electronic device in a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device showing the front of the electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view of an electronic device showing the rear surface of the electronic device according to one embodiment of the present disclosure.

[0014] Figure 6 is a drawing showing a part of an electronic device according to a comparative example.

[0015] FIG. 7 is a drawing showing a part of a rear plate according to one embodiment of the present disclosure.

[0016] FIG. 8 is a drawing showing the upper layer of a rear plate according to one embodiment of the present disclosure.

[0017] FIG. 9 is a drawing showing a first layer of a rear plate according to one embodiment of the present disclosure.

[0018] FIG. 10 is a drawing showing the lower layer of a rear plate according to one embodiment of the present disclosure.

[0019] FIG. 11 is a front view of a rear plate according to one embodiment of the present disclosure.

[0020] FIG. 12 is a cross-sectional view of a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0021] FIG. 13 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0022] FIG. 14 is a drawing showing a part of a rear plate according to one embodiment of the present disclosure.

[0023] FIG. 15 is a drawing showing a process for manufacturing a first layer according to one embodiment of the present disclosure.

[0024] FIG. 16 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0025] FIG. 17a is a front view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0026] FIG. 17b is a cross-sectional view of a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0027] FIG. 18 is a cross-sectional view of a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0028] FIG. 19 is a drawing showing a process for manufacturing a first layer according to one embodiment of the present disclosure.

[0029] FIG. 20 is an exploded perspective view of a rear plate exploded according to one embodiment of the present disclosure.

[0030] FIG. 21 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0031] FIG. 22 is a cross-sectional view of a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0032] FIG. 23 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0033] FIG. 24a is a front view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0034] FIG. 24b is a cross-sectional view of a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0035] FIG. 25 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0036] FIG. 26 is a drawing showing a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0037] FIG. 27 is a drawing showing a part of a rear plate according to one embodiment of the present disclosure.

[0038] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0039] Electronic devices are being released in various functions and / or sizes depending on their functions and user preferences. As a result, not only functionality and slimness but also external aesthetics have recently become important factors. For example, even if a device possesses generally the same functions as those of other companies, a device with a superior and aesthetically pleasing design is more preferred by users.

[0040] Therefore, in this regard, technologies for improving the aesthetics of electronic devices are being developed. These technologies can serve as a foundation for enhancing the aesthetic competitiveness of electronic devices and securing a competitive edge in the market through differentiated designs.

[0041] Recently, in order to differentiate the design of electronic devices, the design of camera deco sections is also becoming more diverse. Conventionally, to enhance the aesthetic competitiveness of the camera deco section, a separate electrical light source was placed inside the electronic device, and an additional post-processing step was performed to transmit the light from said electrical light source to the outside of the electronic device without loss.

[0042] However, in the case of such conventional technology, since an electric light source is additionally placed inside the electronic device, an issue of increased material costs may arise during the manufacturing of the electronic device. Furthermore, because additional post-processing steps are introduced to accommodate the additional electric light source, a problem of reduced production yield may occur.

[0043] According to one embodiment of the present disclosure, a camera deco part with excellent aesthetics can be provided through a combination of a plurality of mechanical parts without a separate electrical light source.

[0044] According to one embodiment of the present disclosure, a camera deco member with excellent aesthetics can be provided by including a first layer containing a light-emitting material and a high-brightness reflective member disposed adjacent to the first layer.

[0045] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which this disclosure belongs from the description below.

[0046] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described in the present disclosure may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0047] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0048] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0049] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment.

[0050] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0051] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0052] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0053] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0054] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0055] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0056] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0057] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0058] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0059] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0061] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0063] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0064] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0065] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0066] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0067] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0068] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0069] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0070] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0071] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0072] An electronic device according to one embodiment of the present disclosure may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. An electronic device according to an embodiment of the present disclosure is not limited to the aforementioned devices.

[0073] One embodiment of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0074] As used in one embodiment of the present disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0075] One embodiment of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0076] According to one embodiment, the method according to one embodiment of the present disclosure may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0077] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0078] FIG. 2 is a front perspective view of an electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a rear perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0079] In the following detailed description, the length direction, width direction, and / or thickness direction (or height direction) of the electronic device may be mentioned, and the length direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, regarding the direction in which the component is oriented, 'negative / positive (- / +)' may be mentioned together with the Cartesian coordinate system illustrated in the drawings. For example, the front of the electronic device and / or housing may be defined as the 'face facing the +Z direction', and the rear as the 'face facing the -Z direction'. In one embodiment, the side of the electronic device and / or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and / or an area facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. In the following description of the electronic device (101), the ‘first direction’ may mean the X-axis direction (or a direction parallel to the X-axis), the ‘second direction’ may mean the Y-axis direction (or a direction parallel to the Y-axis), and the ‘third direction’ may mean the Z-axis direction (or a direction parallel to the Z-axis). In the following description of the electronic device (101), the statement that a component is ‘disposed on’ another component may mean that the component is placed in the +Z direction relative to the other component. This is based on the orthogonal coordinate system described in the drawings for the sake of brevity of explanation, and it should be noted that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, the orthogonal coordinate system may be defined differently from the present disclosure depending on the design specifications of the electronic device or the user's usage habits.

[0080] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment may include a housing (201) comprising a front (201A), a rear (201B), and a side (201C) surrounding the space between the front (201A) and the rear (201B). In one embodiment (not shown), the housing (201) may refer to a structure forming part of the front (201A) of FIG. 2, the rear (201B) and the side (201C) of FIG. 3. According to one embodiment, at least a portion of the front (201A) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The rear (201B) may be formed by a rear plate (211). The rear plate (211) may be formed, for example, by glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (201C) may be formed by a side bezel structure (or "side member") (212) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the front plate (202) and the side bezel structure (212) may be formed as one body and may comprise the same material. Alternatively, the rear plate (211) and the side bezel structure (212) may be formed as one body and may comprise the same material (e.g., glass, a metal material such as aluminum, or ceramic). According to one embodiment, the front (201A) and / or the front plate (202) may be interpreted as part of a display (210) (e.g., the display module (160) of FIG. 1). According to one embodiment, the housing (201) may include a front plate (202) and a rear plate (211).

[0081] According to one embodiment, the electronic device (101) may include at least one of a display (210), an audio module (203, 204, 205) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (206, 207) (e.g., the camera module (180) of FIG. 1), a key input device (216, 217) (e.g., the input module (150) of FIG. 1), and a connector hole (213, 214) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the connector hole (214)) or additionally include other components.

[0082] According to one embodiment, the display (210) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (210) may be exposed through the front plate (202) forming the front (201A). According to one embodiment, the display (210) may be a flexible display or a foldable display.

[0083] According to one embodiment, the surface of the housing (201) (or the front plate (202)) may include a screen display area formed as the display (210) is visually exposed. For example, the screen display area may include a front (201A).

[0084] In one embodiment (not shown), the electronic device (101) may include a recess or opening formed in a part of the screen display area (e.g., front (201A)) of the display (210), and may include at least one of an audio module (205), a sensor module (not shown), a light-emitting element (not shown), and a camera module (206) aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (205), a sensor module (not shown), a camera module (206), a fingerprint sensor (not shown), and a light-emitting element (not shown) may be included on the back surface of the screen display area of ​​the display (210).

[0085] In one embodiment (not shown), the display (210) may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type pen input device (215) (e.g., a stylus pen).

[0086] In some embodiments, at least a portion of the key input device (216, 217) may be placed in the side bezel structure (212).

[0087] According to one embodiment, the audio module (203, 204, 205) may include, for example, a microphone hole (203) and a speaker hole (204, 205). A microphone for acquiring external sound may be placed inside the microphone hole (203), and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (204, 205) may include an external speaker hole (204) and a receiver hole (205) for communication. In some embodiments, the speaker hole (204, 205) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (204, 205) (e.g., a piezo speaker). The audio module (203, 204, 205) is not limited to the above structure and may be designed in various ways, such as by mounting only some audio modules or adding new audio modules, depending on the structure of the electronic device (101).

[0088] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of an electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on the front (201A) of the housing (201), and / or a third sensor module (not shown) (e.g., HRM (heart rate monitor) sensor) and / or a fourth sensor module (not shown) (e.g., fingerprint sensor) disposed on the rear (201B) of the housing (201). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear (201B) as well as on the front (201A) (e.g., display (210)) of the housing (201). The electronic device (101) may further include at least one of the following sensor modules not shown, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor module (not shown) is not limited to the above structure and can be designed in various ways, such as by mounting only some sensor modules or adding new sensor modules, depending on the structure of the electronic device (101).

[0089] According to one embodiment, the camera module (206, 207) may include, for example, a front camera module (206) placed on the front (201A) of the electronic device (101), a rear camera module (207) placed on the rear (201B), a flash (208), and / or an IR sensor (209). The camera module (206, 207) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (208) may include, for example, a light-emitting diode or a xenon lamp. The camera module (206, 207) is not limited to the above structure and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0090] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras, or triple cameras) each having different attributes (e.g., angle of view) or functions. For example, the rear camera module (207) may include a plurality of camera modules including lenses having different angles of view. For example, the plurality of camera modules may include at least one of a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). Additionally, for example, the plurality of camera modules may include an optical zoom camera with adjustable magnification. According to one embodiment, the electronic device (101) may be configured such that, for the plurality of camera modules, a designated camera module operates or another camera module operates based on a user's selection or under a predetermined environment. According to one embodiment, the IR camera may operate as at least part of a sensor module. For example, the TOF camera may operate as at least part of a sensor module (not shown) for detecting the distance to a subject. According to one embodiment, the front camera module (206) can be implemented as an under display camera (UDC) module.

[0091] According to one embodiment, a key input device (216, 217) (e.g., a volume key) may be placed on the side (201C) of the housing (201). According to one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (216, 217), and the key input devices (216, 217) that are not included may be implemented in other forms, such as soft keys, on the display (210). In some embodiments, the key input device (216, 217) may include a sensor module (not shown) placed on the rear (210B) of the housing (201).

[0092] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front (201A) of the housing (201). The light-emitting element (not shown) may provide state information of the electronic device (101) in the form of light, for example. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of, for example, the front camera module (206). The light-emitting element (not shown) may include, for example, an LED (light emitting diode), an IR (infrared) LED and / or a xenon lamp.

[0093] According to one embodiment, the connector holes (213, 214) may include, for example, a first connector hole (213) capable of accommodating a connector for transmitting and receiving power and / or data with an external electronic device (e.g., a USB connector) or a connector for transmitting and receiving audio signals with an external electronic device (e.g., an earphone jack), and / or a second connector hole (214) capable of accommodating a storage device (e.g., a subscriber identification module (SIM) card, a secure digital (SD) memory card). According to one embodiment, the first connector hole (213) and / or the second connector hole (214) may be omitted. The connector holes (213, 214) are not limited to the above structure and may be designed in various ways, such as by installing only some connector holes or adding new connector holes, depending on the structure of the electronic device (101).

[0094] A pen input device (215) (e.g., a stylus pen) can be guided into the interior of the housing (201) through a hole formed on the side of the housing (201) and inserted or removed, and may include a button to facilitate removal. The pen input device (215) may have a separate resonant circuit built in and may be coupled with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (101). The pen input device (215) may include an EMR (electro-magnetic resonance) method, an AES (active electrical stylus) method, and an ECR (electric coupled resonance) method.

[0095] According to one embodiment, a camera module (206, 207) and / or a sensor module (not shown) may be positioned within the internal space of the electronic device (101) so as to be in contact with the external environment through a designated area of ​​the display (210) and the front plate (202). For example, the designated area may be an area of ​​the display (210) where no pixels are placed. As another example, the designated area may be an area of ​​the display (210) where pixels are placed. When viewed from above the display (210), at least a portion of the designated area may overlap with the camera module (206, 207) and / or the sensor module. As another example, some sensor modules may be positioned within the internal space of the electronic device to perform their functions without being visually exposed through the front plate (202).

[0096] The electronic device (101) disclosed in FIGS. 2 and 3 has a bar-type or plate-type appearance, but is not limited thereto. For example, the illustrated electronic device may be part of a rollable electronic device or a foldable electronic device. "Rollable electronic device" may mean an electronic device in which the display can be bent and deformed so that at least a portion can be wound or rolled and stored inside a housing (e.g., housing (210) in FIG. 2). Depending on the user's needs, the rollable electronic device may be used to expand the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside. "Foldable electronic device" may mean an electronic device that can be folded so that two different areas of the display face each other or in opposite directions. Generally, in a portable state, the display of a foldable electronic device is folded so that two different regions face each other or in opposite directions, and in an actual usage state, the user can unfold the display so that the two different regions form a substantially flat shape. In one embodiment, the electronic device (101) according to one embodiment of the present disclosure may be interpreted to include not only portable electronic devices such as smartphones, but also various other electronic devices such as laptop computers or home appliances.

[0097] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0098] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 18.

[0099] Referring to FIGS. 4 and FIGS. 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 2 or FIG. 3) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 3). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) may electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) may include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction) the battery (350), and a flexible printed circuit board (340c) may electrically connect the first circuit board (340a) and the second circuit board (340b).

[0100] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and redundant descriptions are omitted below.

[0101] The first support member (311) may be provided in a flat shape for at least a portion. In one embodiment, the first support member (311) may be placed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. When the first support member (311) is formed at least partially from a metal material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) attached to one side and a printed circuit board (340a, 340b) attached to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0102] According to one embodiment, the housing (301) may include a first support member (311) and a side structure (310). According to one embodiment, the housing (301) may be understood as a structure for receiving, protecting, or placing a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including a structure that a user can visually or tactilely perceive on the exterior of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). For example, the housing (301) may include structures that form the exterior of the electronic device (101) (e.g., a side structure (310), a front plate (320), a rear plate (380)). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and FIGS. 3. In one embodiment, the phrase “front or rear of the housing (301)” may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 2) and the rear plate (380) (e.g., the second surface (210B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as printed circuit boards (340a, 340b) or a camera assembly (307).

[0103] Memory may include, for example, volatile memory or non-volatile memory.

[0104] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0105] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a part of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) in between. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) in between. Circuit devices (e.g., processors, communication modules, or memory) implemented in the form of integrated circuit chips or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to the embodiment, printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure capable of placing electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not illustrated. For example, the lower support member (360b) may be placed to enclose an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another part of the first support member (311). A speaker module or interface placed on an additional printed circuit board or lower support member (360b) not shown may be placed correspondingly to the audio module (203, 204, 205) or connector hole (213, 214) of FIG. 2.

[0106] The battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, a printed circuit board (340a, 340b). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0107] Although not illustrated, the antenna may include a conductive pattern implemented on the surface of the second support member (360) through, for example, a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the antenna in the form of a thin film may be placed between the rear plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, other antenna structures may be formed by a part or combination thereof of the side structure (310) and / or the first support member (311).

[0108] According to one embodiment, the camera assembly (307) may include at least one camera module (307a) and a camera window (307b). Inside the electronic device (101), the camera assembly (307) (or at least one camera module (307a)) may receive at least a portion of light incident through the camera window (307b) (or optical hole). In one embodiment, the camera assembly (307) may be placed on a first support member (311) at a location adjacent to a printed circuit board (340a, 340b). In one embodiment, the camera module (307a)(s) of the camera assembly (307) may be largely aligned with any one of the camera windows (307b) and may be wrapped at least partially in a second support member (360) (e.g., an upper support member (360a)).

[0109] According to one embodiment, the electronic device (101) may include a camera hole (e.g., the opening (O) in FIG. 7). A plurality of camera holes (e.g., the opening (O) in FIG. 7) may be spaced apart from each other. The camera assembly (307) may receive light that has passed through the camera hole (e.g., the opening (O) in FIG. 7).

[0110] According to one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be placed within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward a printed circuit board (340). The battery (350) may include a battery connecting member (3501) connecting the terrace (353) and the printed circuit board (340).

[0111] According to one embodiment, the electronic device (101) may include a port insertion opening (308). The port insertion opening (308) may be opened in a part of the housing (301). The port insertion opening (308) may be in communication with an external space of the housing (301). The electronic device (101) may be connected to an external device (e.g., a USB port, charging wiring, etc.), and the external device may be inserted into the port insertion opening (308).

[0112] According to one embodiment, the electronic device (101) may include an antenna (309). The antenna (309) may be positioned adjacent to the port insertion opening (308).

[0113] Figure 6 is a drawing showing a part of an electronic device according to a comparative example.

[0114] According to a comparative example, the electronic device (101') may include a light source (L), a front plate (310'), and a rear plate (380').

[0115] According to a comparative example, the front plate (310') inside may be configured to guide light transmitted to the light source (L) to the outside of the electronic device (101). For example, an opening may be formed in at least a part of the rear plate (380') so that light guided from the front plate (310') may be transmitted to the outside of the electronic device (101) through the opening.

[0116] According to a comparative example, the rear plate (380') may include at least one opening. Additionally, the rear plate (380') may be positioned on the back of the front plate (310'). Furthermore, the rear plate (380') may constitute the exterior of the electronic device (101) and may be a part visible to the user when viewed from the outside.

[0117] According to a comparative example, the rear plate (380') may be configured so that light transmitted from the light source (L) is not visible from the outside. For example, the front surface (e.g., +Z direction) of the rear plate (380') may be coated, and the coated portion may be configured to reflect light transmitted from the light source (L). According to a comparative example, the rear plate (380') may protect electronic components inside the electronic device (e.g., the circuit board (340) of FIG. 5 described above) from electromagnetic waves or external radio waves.

[0118] According to a comparative example, the light source (L) may be configured to transmit light toward the front plate (310'). According to a comparative example, the light source (L) may be positioned on the back side (e.g., in the -Z-axis direction) of the front plate (310'). According to a comparative example, the appearance may be improved because the light transmitted from the light source (L) is transmitted to the outside of the electronic device through an opening positioned in the rear plate (380').

[0119] However, in the case of the comparative example, since a separate light source (L) must be additionally placed at a position corresponding to the electronic component, an issue of increased material costs may arise during the production of the electronic device. Furthermore, since an additional post-processing step is introduced to additionally place the light source (L) at a position corresponding to the electronic component, a problem of reduced production yield may occur.

[0120] FIG. 7 is a drawing showing a part of a rear plate according to one embodiment of the present disclosure.

[0121] The components described with reference to FIG. 7 may be partially or entirely identical to the components described with reference to FIG. 1 through 6. The components described with reference to FIG. 7 may be partially or entirely identical to the components described with reference to FIG. 8 through 27.

[0122] According to one embodiment, FIG. 7 is a cross-sectional view taken of a portion of the opening (O) formed in the electronic device (101) in a plane parallel to the longitudinal direction (e.g., Y-axis direction) of the electronic device (101) and the thickness direction (e.g., Z-axis direction) of the electronic device (101).

[0123] According to one embodiment, the electronic device (101) may include a side structure (310), a rear plate (380), and a reflective member (390).

[0124] According to one embodiment, the description of the side structure (310) can be applied in the same way as the description of the side structure (310) described with reference to FIG. 4.

[0125] According to one embodiment, the rear plate (380) may be configured to be visible from the outside. The rear plate (380) may be configured to protect the electronic device. Additionally, the rear plate (380) may be named an 'electronic device cover' or 'cover'.

[0126] According to one embodiment, the rear plate (380) may be configured to surround at least a portion of the electronic device housing or to form at least a portion of the electronic device exterior. Additionally, the rear plate (380) may be positioned on the back side (e.g., in the -Z-axis direction) of the side structure (310).

[0127] According to one embodiment, the rear plate (380) may include a reflective member (390). In the present disclosure and the embodiments below, the reflective member (390) is described as being part of the rear plate, but is not limited thereto. For example, the first reflective member (391) may be a configuration combined with the camera assembly (307) and may be a configuration separated from the camera assembly (307) and the rear plate (380).

[0128] According to one embodiment, the rear plate (380) may include at least one opening (O). Additionally, the rear plate (380) may include a first surface facing a first direction (e.g., +Z-axis direction), a second surface facing a second direction opposite to the first direction (e.g., -Z-axis direction), and at least one opening (O) penetrating the first surface and the second surface.

[0129] According to one embodiment, an electronic component may be disposed in the opening (O). According to one embodiment, at least a portion of the electronic component may be exposed to the outside of the electronic device through the opening (O).

[0130] According to one embodiment, the electronic component placed in the opening (O) may be a camera assembly (307). Thus, a part of the camera assembly (307) may be exposed outside the electronic device through the opening (O). The camera assembly (307) may be applied in the same way as the description of the camera assembly (307) described with reference to FIG. 5. Additionally, the camera assembly (307) may be named a 'camera module'.

[0131] According to one embodiment, the rear plate (380) may include an upper layer (381), a first layer (382), and a lower layer (383). According to one embodiment, an opening (O) formed in the rear plate (380) may be configured to penetrate the upper layer (381), the first layer (382), and the lower layer (383).

[0132] According to one embodiment, the upper layer (381) can prevent internal electronic components of the electronic device from being visible from the outside. Additionally, the upper layer (381) may be placed on the front side (e.g., +Z-axis direction, first direction) of the first layer (382). Additionally, the upper layer (381) may be placed on the back side (e.g., -Z-axis direction, second direction) of the side structure (310). Furthermore, the upper layer (381) may be placed between the side structure (310) and the first layer (382). Additionally, the upper layer (381) may be configured to form the first surface of the rear plate (380). According to one embodiment, the upper layer (381) may be named a 'shielding layer'.

[0133] According to one embodiment, the lower layer (383) may be configured to protect the first layer (382) and / or electronic components inside the electronic device. Additionally, the lower layer (383) may be disposed on the back side (e.g., in the -Z axis direction, in the second direction) of the first layer (382). Furthermore, the lower layer (383) may be configured to form a second surface of the rear plate (380). According to one embodiment, the lower layer (383) may be named a 'cover layer'.

[0134] According to one embodiment, the first layer (382) may be disposed between the upper layer (381) and the lower layer (383). Additionally, the first layer (382) may be disposed inside the rear plate (380) and may include a light-emitting material. Furthermore, the first layer (382) may be a transparent or translucent layer configured to transmit light transmitted from the light-emitting material to the outside.

[0135] A luminescent material refers to a material that emits light on its own without receiving external energy (e.g., electrical energy). A luminescent material may refer to any material that emits light. A luminescent material may refer to any material that generates light on its own. According to embodiments of the present disclosure, a luminescent material may refer to a fluorescent material, a phosphorescent material, and a high-saturation material.

[0136] Fluorescent materials refer to substances that absorb ultraviolet (UV) light or other high-energy light and rapidly emit that absorbed energy as low-energy light (visible light), allowing users to perceive the light. Fluorescent materials have emitted light with a longer wavelength than the absorbed light. Furthermore, fluorescent materials possess the characteristic of emitting light immediately after releasing energy. For example, a fluorescent material can be configured to receive ultraviolet (UV) light and immediately emit visible light.

[0137] Phosphorescent materials refer to substances that, like fluorescent materials, absorb light and re-emit the absorbed energy in the form of light. However, unlike fluorescent materials, phosphorescent materials emit light slowly, allowing them to emit light for a certain period even in the dark. In other words, unlike fluorescent materials, phosphorescent materials possess the characteristic of continuously emitting light. For example, this can refer to substances that continue to emit light even after a period of time, such as radioactive materials.

[0138] High-saturation materials may refer to substances with very high color vividness and / or intensity. Because the color of a high-saturation material appears clear and distinct, it can be visually striking and leave a strong impression. For example, neon colors or vivid primary colors can be high-saturation colors. Therefore, at least some light may be emitted from materials with such high saturation.

[0139] In the present disclosure and the following embodiments, fluorescent materials, phosphorescent materials, and high-saturation materials are described as examples of light-emitting materials, but are not limited thereto. In order to improve the design of the electronic device, various materials that can transmit light to the outside through the first reflective member (391) may be included in the light-emitting material.

[0140] According to one embodiment, the light-emitting material may be a variety of materials. For example, the light-emitting material may be EA (eosin Y), RPC (rhodamine B), RPCF (rhodamine 6G), PS / PC (pyrromethene 597 and pyrromethene 605), GRT (green fluorescent protein), glycerol monostearate, etc.

[0141] According to one embodiment, EA (eosin Y) refers to a red fluorescent dye. Additionally, RPC (rhodamine B) refers to a yellow-green fluorescent dye, and RPCF (rhodamine 6G) refers to a green fluorescent dye. PS / PC (pyrromethene 597 and pyrromethene 605) refer to green and red fluorescent dyes, respectively. Additionally, GRT (green fluorescent protein) refers to a green fluorescent dye. Furthermore, various dyes other than those disclosed in the present disclosure may be included in the luminescent material.

[0142] According to one embodiment, when a part of an electronic component (e.g., camera assembly (307)) is placed in an opening (O), a first reflective member (391) configured to surround the electronic component at a position corresponding to the opening (O) may be included.

[0143] In the present disclosure and the embodiments below, examples are provided for cases where a part of an electronic component is placed in the opening (O), but this is not limited thereto. For example, a first reflective member (391) may be formed to improve the aesthetics of the opening (O), which represents an empty space, such as the microphone hole described above (e.g., the microphone hole (203) in FIG. 2). Additionally, it may be formed to be placed at the edge of the electronic device, such as the second reflective member described later (e.g., the second reflective member (392) in FIG. 24b).

[0144] According to one embodiment, the first reflective member (391) may be configured to be inclined to reflect light provided from the light-emitting material included in the first layer (382) to the outside of the electronic device. Additionally, the surface of the first reflective member (391) configured to be inclined with respect to the first layer (382) may be referred to as the first inclined surface (3911). Furthermore, the first inclined surface (3911) may be configured to be inclined at an angle of 60 degrees with respect to the first layer (382).

[0145] According to one embodiment, the first reflective member (391) may be configured to surround a portion of the circumference of the camera assembly (307). Additionally, the first reflective member (391) may be placed in an opening (O) between the camera assembly (307) and the first layer (382).

[0146] In the present disclosure and the embodiments below, the first inclined surface (3911) and the second inclined surface (e.g., the second inclined surface (3921) of FIG. 24b) described below are configured to form a 60-degree angle with the first layer (382), but are not limited thereto. For example, if light transmitted from the first layer (382) can be transmitted outside the electronic device, it may be configured at a different angle.

[0147] According to one embodiment, the first reflective member (391) may be made of a high-brightness material to reflect light provided from a light-emitting material included in the first layer (382) to the outside of an electronic device. For example, the first reflective member (391) may be made using a metal raw material or through deposition of an injection molded product, painting process, etc. For example, the first reflective member (391) may be a high-brightness structure with a GU of 100 or higher based on a 60-degree gloss level.

[0148] Additionally, after the first reflective member (391) is formed protruding, the inclined surface (3911) may be configured to have high brightness through an additional post-process. The additional post-process may mean, for example, a polishing process.

[0149] Luminance is a physical concept that measures the brightness of light and refers to the intensity of visible light. Additionally, GU 100 or higher at a 60-degree angle on a gloss meter is a unit for measuring the glossiness of a structure. Since glossiness can vary depending on the measurement angle, when measuring glossiness, the angle is set to a pre-specified angle and the glossiness is measured. At this time, GU, the unit of glossiness, is an abbreviation for Gloss Unit, and is a unit that represents the amount of light reflected from a surface as a numerical value. According to one embodiment, the first reflective member (391) may be a high-luminosity structure in which the glossiness of the surface measured at a 60-degree angle is GU 100 or higher.

[0150] According to one embodiment, if a sandblasting process (e.g., roughening the surface to increase adhesion or removing impurities) is added to the first inclined surface (3911), a problem may arise where the surface gloss of the first reflective member (391) is reduced, and thus the improvement of aesthetics may not be effective. Therefore, a brightness of GU 100 or higher based on a gloss meter of 60 degrees may refer to a gloss value after the polishing process.

[0151] According to one embodiment, the rear plate may improve the aesthetics around an electronic component (e.g., camera assembly (307)) and / or an opening (O) by including a first layer (382) containing a light-emitting material and a first reflective member (391) of high brightness.

[0152] In addition, by assembling a first layer (382) containing a light-emitting material and a first reflective member (391) of high brightness, the aesthetics around an electronic component (e.g., camera assembly (307)) and / or an opening (O) can be improved without separate additional configuration. For example, a ring-shaped pattern with a thickness equal to the thickness of the first layer (382) can be formed to surround the electronic component.

[0153] In this city, one opening (O), camera assembly (307), and first reflective member (391) are formed as an example, but multiple ones may be formed.

[0154] FIG. 8 is a drawing showing an upper layer of a rear plate according to one embodiment of the present disclosure. FIG. 9 is a drawing showing a first layer of a rear plate according to one embodiment of the present disclosure. FIG. 10 is a drawing showing a lower layer of a rear plate according to one embodiment of the present disclosure. FIG. 11 is a front view of a rear plate according to one embodiment of the present disclosure.

[0155] The components described with reference to FIGS. 8 through 11 may be partially or entirely identical to the components described with reference to FIGS. 1 through 7. The components described with reference to FIGS. 8 through 11 may be partially or entirely identical to the components described with reference to FIGS. 12 through 27.

[0156] According to one embodiment, the method for manufacturing a rear plate can be configured to proceed according to FIGS. 8 to 11.

[0157] According to one embodiment, a method for manufacturing a rear plate may include a process of forming a first layer (382) containing a light-emitting material, a process of forming an upper layer (381) on the front side (e.g., +Z-axis direction) of the first layer (382), a process of forming a lower layer (383) on the back side (e.g., -Z-axis direction) of the first layer (382), a process of integrating the upper layer (381), the first layer (382), and the lower layer (383) into a rear plate (380), and a process of forming at least one opening (O) in the integrated rear plate (380).

[0158] According to one embodiment, the process of forming at least one opening (O) in the integrated rear plate (380) may further include the process of forming a first reflective member (e.g., the first reflective member (391) of FIG. 7) configured to surround an electronic component at a position corresponding to the opening (O) inside the opening (O).

[0159] In addition, the opening (O) may be positioned at a location corresponding to the aforementioned camera assembly (e.g., camera assembly (307) of FIG. 7). Furthermore, the opening (O) may have a shape corresponding to the aforementioned camera assembly (e.g., camera assembly (307) of FIG. 7).

[0160] In the present disclosure and the embodiments below, the rear plate (380) is described as being formed in the order of a first layer (382), a lower layer (383), and an upper layer (381) as an example, but is not limited thereto. For example, the rear plate (380) may be manufactured by forming the first layer (382), the upper layer (381), and the lower layer (383) in that order.

[0161] In addition, in this city, after forming a rear plate (380), an opening (O) is formed in the rear plate (380), and the rear plate (380) with the opening (O) formed is assembled to an electronic device, but this is not limited thereto. For example, referring to FIG. 14, an upper layer (381) including an opening (O), a first layer (382), etc., can be sequentially assembled to an electronic device including a camera assembly (e.g., camera assembly (307) of FIG. 14).

[0162] According to one embodiment, the process of forming at least one opening (O) in the rear plate (380) may be a CNC process. A CNC process may be a process for machining high-precision parts by automatically controlling machine equipment through a computer program. In addition, a CNC process provides high precision and repeatability and can efficiently produce parts of complex shapes.

[0163] FIG. 12 is a cross-sectional view of a portion of a rear plate cut open according to one embodiment of the present disclosure. FIG. 13 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure. FIG. 14 is a drawing showing a portion of a rear plate according to one embodiment of the present disclosure.

[0164] The components described with reference to FIGS. 12 to 14 may be partially or entirely identical to the components described with reference to FIGS. 1 to 11. The components described with reference to FIGS. 12 to 14 may be partially or entirely identical to the components described with reference to FIGS. 15 to 27.

[0165] Referring to FIGS. 12 and 13, the lower layer (383) constituting the exterior of the electronic device may be formed thinner than the upper layer (381), and the first layer (382) may be formed thicker than the upper layer (381).

[0166] In the present disclosure and the embodiments below, the thickness of the first layer (382) is described as being thicker than that of the upper layer (381) and the lower layer (383), but is not limited thereto. For example, the thickness of the first layer (382) may be formed thicker in proportion to the thickness of the ring-shaped pattern required for aesthetic purposes.

[0167] Referring to FIG. 14, the aforementioned first reflective member (e.g., the first reflective member (391) of FIG. 7) may be formed on at least a part of the camera assembly (307).

[0168] According to one embodiment, unlike the process of FIGS. 8 to 11 described above, a rear plate may be formed by assembling an upper layer (381) having an opening (O), a first layer (382), and a lower layer (383) on a rear plate in which a camera assembly (307) and a first reflective member (e.g., the first reflective member (391) of FIG. 7) are formed.

[0169] FIG. 15 is a drawing showing a process for manufacturing a first layer according to one embodiment of the present disclosure. FIG. 16 is a perspective view showing a part of a rear plate according to one embodiment of the present disclosure. FIG. 17a is a front view showing a part of a rear plate according to one embodiment of the present disclosure. FIG. 17b is a cross-sectional view showing a part of a rear plate cut open according to one embodiment of the present disclosure. FIG. 18 is a cross-sectional view showing a part of a rear plate cut open according to one embodiment of the present disclosure.

[0170] The components described with reference to FIGS. 15 to 18 may be partially or entirely identical to the components described with reference to FIGS. 1 to 14. The components described with reference to FIGS. 15 to 18 may be partially or entirely identical to the components described with reference to FIGS. 19 to 27.

[0171] According to one embodiment, the first layer (382) may include a plurality of layers (3821, 3822) containing light-emitting materials of different colors.

[0172] In the present disclosure and the embodiments below, when the first layer (382) is formed into a plurality of layers, it is described as being divided into two layers (3821, 3822), but is not limited thereto. For example, the first layer (382) may be configured to form three or more layers using three or more materials through multiple injection or multiple extrusion.

[0173] According to one embodiment, a plurality of layers (3821, 3822) containing different colored light-emitting materials may be formed by simultaneously extruding materials of different colors. Additionally, the plurality of layers formed by simultaneously extruding materials of different colors may be named 'first layer (382)'.

[0174] Referring to FIG. 17a, a plurality of layers (3821, 3822) containing different colored light-emitting materials transmit different colored light to a first inclined surface (3911), and can be configured so that a user can see a ring-shaped pattern containing different colors by the transmitted light.

[0175] The method of forming a single composite material by simultaneously extruding materials of different colors is called dual extrusion. In dual extrusion, each material is extruded independently and combined into a single output, and it is primarily used to provide variety in color or properties. For example, it can be used to create composite materials or outputs of various colors.

[0176] Compared to the general extrusion process, double extrusion allows for the optimization of material physical properties or the production of colorful back plates through a simple process, and multiple materials can be formed into completely separate layers.

[0177] FIG. 19 is a drawing showing a process for manufacturing a first layer according to one embodiment of the present disclosure. FIG. 20 is an exploded perspective view showing a rear plate disassembled according to one embodiment of the present disclosure. FIG. 21 is a perspective view showing a part of a rear plate according to one embodiment of the present disclosure. FIG. 22 is a cross-sectional view showing a part of a rear plate cut open according to one embodiment of the present disclosure.

[0178] The components described with reference to FIGS. 19 through 22 may be partially or entirely identical to the components described with reference to FIGS. 1 through 18. The components described with reference to FIGS. 19 through 22 may be partially or entirely identical to the components described with reference to FIGS. 23 through 27.

[0179] According to one embodiment, the first layer (382) may include a plurality of layers (3821', 3822') containing light-emitting materials of different colors.

[0180] According to one embodiment, a plurality of layers (3821', 3822') containing different colored light-emitting materials may be formed by simultaneously injecting materials of different colors. Additionally, the plurality of layers formed by simultaneously injecting materials of different colors may be named 'first layer (382)'.

[0181] A plurality of layers (3821', 3822') containing different colored light-emitting materials can be configured to transmit different colored light to the aforementioned first inclined surface (e.g., the first inclined surface (3911) of FIG. 17a) and to allow a user to see a ring-shaped pattern containing different colors by the transmitted light.

[0182] Dual injection is a type of injection molding process that involves sequentially injecting two or more materials to create a single part. Since the dual injection process requires the two materials to combine to form a single composite part, it can be relatively more complex than a standard injection process. Additionally, the fusion temperature and pressure of the two materials must be precisely controlled, and poor quality at the joint can affect the durability of the back plate.

[0183] In the present disclosure and the embodiments below, double injection and double extrusion are disclosed as methods for forming a plurality of layers (3821, 3822), but are not limited thereto. For example, if a plurality of layers (3821, 3822) can be configured to transmit light of different colors to a first inclined surface (3911) and allow a user to see a ring-shaped pattern containing different colors by the transmitted light, they can be formed in various ways.

[0184] FIG. 23 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure. FIG. 24a is a front view showing a portion of a rear plate according to one embodiment of the present disclosure. FIG. 24b is a cross-sectional view showing a portion of a rear plate cut open according to one embodiment of the present disclosure.

[0185] The components described with reference to FIGS. 23 and 24 may be partially or entirely identical to the components described with reference to FIGS. 1 and 22. The components described with reference to FIGS. 23 and 24 may be partially or entirely identical to the components described with reference to FIGS. 25 and 27.

[0186] According to one embodiment, the rear plate may include a second reflective member (392). Additionally, the second reflective member (392) may include a second inclined surface (3921). Furthermore, the second reflective member (392) and the second inclined surface (3921) may be configured to reflect light provided from a light-emitting material included in the first layer (382) to the outside of the electronic device. The description of the second reflective member (392) and the second inclined surface (3921) may be applied in the same way as the description of the first reflective member (391) and the first inclined surface (3911) described with reference to FIG. 7, except for the location where they are formed.

[0187] According to one embodiment, a second reflective member (392) may be formed on the edge of the rear plate, and the second reflective member (392) may be configured to be inclined to reflect light provided from a light-emitting material to the outside of the electronic device.

[0188] According to one embodiment, the light-emitting material of the first layer (382) emits light into the empty space between the first layer (382) and the second reflective member (392) formed at the edge of the rear plate, and the emitted light can be transmitted to the outside of the electronic device through the second inclined surface (3921). As a result, the user can see the pattern formed along the edge of the electronic device from the outside.

[0189] FIG. 25 is a perspective view showing a portion of a rear plate according to one embodiment of the present disclosure. FIG. 26 is a cutaway view showing a portion of a rear plate according to one embodiment of the present disclosure.

[0190] The components described with reference to FIG. 25 or FIG. 26 may be, in part or in whole, identical to the components described with reference to FIG. 1 through FIG. 24. The components described with reference to FIG. 25 or FIG. 26 may be, in part or in whole, identical to the components described with reference to FIG. 27.

[0191] Referring to FIGS. 25 and 26, the first layer (382) and the reflective member (390) according to the present disclosure may be applied to camera assemblies of various shapes. Additionally, as previously described, the reflective member (390) may be configured to surround electronic components other than the camera assembly. Furthermore, as previously described, the first layer (382) and the reflective member (390) may be formed at the edges of an electronic device. According to one embodiment, the first layer (382) and the reflective member (390) may be formed at various locations where aesthetic appearance is enhanced.

[0192] In addition, the rear plate disclosed in this disclosure is described as a rear plate applied to a bar-type electronic device, but this disclosure is not limited thereto. For example, the rear plate of this disclosure may be applied to an electronic device in which a plurality of housings are connected by a hinge structure (e.g., laptop, foldable electronic device), or an electronic device having a plate-type appearance (e.g., tablet).

[0193] FIG. 27 is a drawing showing a part of a rear plate according to one embodiment of the present disclosure.

[0194] The components described with reference to FIG. 27 may be all or partly identical to the components described with reference to FIG. 1 to FIG. 26.

[0195] According to one embodiment, an electronic device with excellent aesthetics can be provided without using a separate electric light source. According to one embodiment, an electronic device having a pattern of various colors can be implemented depending on the type of light-emitting material included in the first layer (e.g., the first layer (382) of FIG. 7) described above.

[0196] According to one embodiment, since it does not include a separate electric light source, an electronic device with a lower manufacturing cost than when it includes a separate electric light source can be provided. In addition, since a first layer containing a light-emitting material (e.g., the first layer (382) of FIG. 7) and a reflective member with high brightness characteristics (e.g., the first reflective member (391) of FIG. 7) are completed by assembly alone without a separate post-processing step, an electronic device with a better production yield than when there is a separate post-processing step can be provided.

[0197] According to one embodiment, the rear plate can provide a distinctive feature to the appearance at a low price. As a result, the design competitiveness of the rear plate can be enhanced, and it can contribute to increasing the sales competitiveness of the rear plate.

[0198] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device comprises a housing including a rear plate (380), a camera assembly (307) disposed in the housing, and a first reflective member (391) configured to surround a portion of the circumference of the camera assembly (307), wherein the rear plate (380) comprises an opaque upper layer (381), a lower layer (383) forming the exterior of the electronic device, a first layer (382) disposed between the upper layer (381) and the lower layer (383) and comprising a light-emitting material, and an opening (O) formed to penetrate the upper layer (381), the first layer (382), and the lower layer (383), wherein a side of the first layer (382) is exposed to the outside of the electronic device through the opening (O), and a portion of the camera assembly (307) is exposed to the outside of the electronic device through the opening (O), and the first reflective member (391) is a camera An electronic device may be provided comprising a first inclined surface (3911) disposed in an opening (O) between the assembly (307) and the first layer (382) and configured to reflect light emitted from the light-emitting material of the first layer (382) to the outside of the electronic device.

[0199] According to one embodiment, the first inclined surface (3911) of the first reflective member (391) may be configured to form an angle of 60 degrees with the first layer (382), and the first inclined surface (3911) may be configured to have a gloss of GU 100 or higher, and may be an electronic device.

[0200] According to one embodiment, the electronic device may comprise a plurality of openings (O) formed through an upper layer (381), a first layer (382), and a lower layer (383), a plurality of camera assemblies (307) disposed in a housing, each of which is partially exposed to the outside of the electronic device through the plurality of openings (O), and a plurality of first reflective members (391) disposed in the plurality of openings (O) between the plurality of camera assemblies (307) and the first layer (382) and arranged to surround the circumference of each of the plurality of camera assemblies (307), each comprising a first inclined surface (3911) configured to reflect light emitted from a light-emitting material of the first layer (382) to the outside of the electronic device.

[0201] According to one embodiment, the first layer (382) may be an electronic device that is a translucent layer containing the light-emitting material.

[0202] According to one embodiment, the light-emitting material may be an electronic device composed of a fluorescent material.

[0203] According to one embodiment, the light-emitting material may be an electronic device composed of a phosphorescent material.

[0204] According to one embodiment, the light-emitting material may be an electronic device composed of a high-saturation material.

[0205] According to one embodiment, the first layer (382) may be an electronic device comprising a plurality of layers (3821, 3822) comprising light-emitting materials of different colors.

[0206] According to one embodiment, a plurality of layers (3821, 3822) containing different colored light-emitting materials may be an electronic device in which different colored materials are simultaneously extruded and integrated into a first layer (382).

[0207] According to one embodiment, a plurality of layers (3821, 3822) containing different colored light-emitting materials may be an electronic device in which different colored materials are simultaneously injected and integrated into a first layer (382).

[0208] According to one embodiment, the electronic device may further include a second reflective member (392) formed on the edge of the rear plate, wherein the second reflective member (392) is configured to be inclined to reflect light provided from a light-emitting material to the outside of the electronic device.

[0209] According to one embodiment, the light-emitting material may be an electronic device comprising at least one of EA, RPC, RPCF, PS, PC, GRT, or Glycerol Monostearate.

[0210] The present disclosure relates to a rear plate. According to one embodiment of the present disclosure, a rear plate for rear-covering an electronic device including a camera assembly (307) comprises: an opaque upper layer (381); a lower layer (383) forming the exterior of the electronic device; a first layer (382) disposed between the upper layer (381) and the lower layer (383) and comprising a light-emitting material; an opening (O) formed to penetrate the upper layer (381), the first layer (382), and the lower layer (383); and a first reflective member (391) configured to surround a portion of the circumference of the camera assembly (307), wherein a portion of the camera assembly (307) is exposed to the outside of the electronic device through the opening (O); and the first reflective member (391) is disposed in the opening (O) between the camera assembly (307) and the first layer (382) and configured to reflect light emitted from the light-emitting material of the first layer (382) to the outside of the electronic device. A rear plate may be provided that includes an inclined surface (3911), wherein the first inclined surface (3911) of the first reflective member (391) is configured to form an angle of 60 degrees with the first layer (382), and the first inclined surface (3911) is configured to have a gloss of GU 100 or higher.

[0211] According to one embodiment, the first layer (382) may be an electronic device that is a translucent layer containing the light-emitting material.

[0212] According to one embodiment, the first layer (382) may be a back plate, which is a translucent layer containing the light-emitting material.

[0213] According to one embodiment, the first layer (382) may be a back plate comprising a plurality of layers (3821, 3822) comprising different colored light-emitting materials.

[0214] According to one embodiment, the light-emitting material may be a back plate composed of a fluorescent material.

[0215] According to one embodiment, the light-emitting material may be a back plate composed of a phosphorescent material.

[0216] The present disclosure relates to a method for manufacturing a rear plate. According to one embodiment of the present disclosure, a method for manufacturing a rear plate comprises: a process of forming a first layer including a light-emitting material; a process of forming an upper layer on the front surface of the first layer; a process of forming a lower layer on the back surface of the first layer; a process of integrating the upper layer, the first layer, and the lower layer into a plate; a process of forming at least one opening in the integrated plate; and a process of forming a first reflective member at a position corresponding to the opening. When a part of an electronic component is placed in the opening, the electronic component is configured to be surrounded by the first reflective member (391) at a position corresponding to the opening, and the first reflective member (391) is configured to be inclined to reflect light provided from the light-emitting material to the outside of the electronic device.

[0217] According to one embodiment, the first inclined surface (3911) of the first reflective member (391) is configured to form an angle of 60 degrees with the first layer (382), and the first inclined surface (3911) is configured to have a gloss of GU 100 or higher, which may be a method for manufacturing a back plate.

[0218] According to one embodiment, the first layer (382) may be a method for manufacturing a back plate, which is a translucent layer containing the light-emitting material.

[0219] According to one embodiment of the present disclosure, the rear plate can provide a distinctive point in its CMF (Color, Material, Finish) appearance. As a result, the design competitiveness of the rear plate can be enhanced, and this can contribute to increasing the sales competitiveness of the rear plate.

[0220] According to one embodiment of the present disclosure, a rear plate with excellent aesthetics can be provided without using a separate electric light source.

[0221] According to one embodiment of the present disclosure, since it does not include a separate electric light source, a back plate can be provided at a lower manufacturing cost than when a separate electric light source is included.

[0222] According to one embodiment of the present disclosure, a first layer including a light-emitting material and a reflective member having high brightness characteristics are completed by assembly alone without a separate post-processing step, thereby providing a back plate with a better production yield than when there is a separate post-processing step.

[0223] The electronic device (101) described through the embodiment of the present disclosure described above is not limited by the aforementioned embodiment and drawings, and it will be obvious to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of the present invention.

Claims

1. In an electronic device, Housing including a rear plate (380); A camera assembly (307) disposed in the above housing; and It includes a first reflective member (391) configured to surround a portion of the circumference of the camera assembly (307); and The above rear plate (380) comprises an opaque upper layer (381), a lower layer (383) forming the exterior of an electronic device, a first layer (382) disposed between the upper layer (381) and the lower layer (383) and containing a light-emitting material, and an opening (O) formed to penetrate the upper layer (381), the first layer (382), and the lower layer (383). A portion of the above camera assembly (307) is exposed to the outside of the electronic device through the opening (O); The electronic device comprising a first reflective member (391) disposed in an opening (O) between the camera assembly (307) and the first layer (382) and a first inclined surface (3911) configured to reflect light emitted from the light-emitting material of the first layer (382) to the outside of the electronic device.

2. In Paragraph 1, The first inclined surface (3911) of the first reflective member (391) is configured to form an angle of 60 degrees with the first layer (382), and The electronic device, wherein the first inclined surface (3911) is configured to have a gloss of GU 100 or higher.

3. In Paragraph 1 or 2, A plurality of openings (O) formed by penetrating the upper layer (381), the first layer (382), and the lower layer (383); A plurality of camera assemblies (307) disposed in a housing, wherein each of the camera assemblies (307) is partially exposed to the outside of the electronic device through a plurality of openings (O); An electronic device comprising a plurality of first reflective members (391) arranged in a plurality of openings (O) between a plurality of camera assemblies (307) and a first layer (382) and arranged to surround the circumference of each of the plurality of camera assemblies (307), each comprising a first inclined surface (3911) configured to reflect light emitted from a light-emitting material of the first layer (382) to the outside of the electronic device.

4. In any one of paragraphs 1 to 3, The electronic device, wherein the first layer (382) is a translucent layer containing the light-emitting material.

5. In any one of paragraphs 1 to 4, The above-mentioned light-emitting material is an electronic device composed of a fluorescent material.

6. In any one of paragraphs 1 to 5, The above-mentioned luminescent material is an electronic device composed of a phosphorescent material.

7. In any one of paragraphs 1 through 6, The above-mentioned luminescent material is an electronic device composed of a high-saturation material.

8. In any one of paragraphs 1 through 7, The electronic device, wherein the first layer (382) comprises a plurality of layers (3821, 3822) each comprising a light-emitting material of a different color.

9. In any one of paragraphs 1 through 8, An electronic device comprising a plurality of layers (3821, 3822) each containing a different colored light-emitting material, wherein the different colored materials are simultaneously extruded and integrated into a first layer (382).

10. In any one of paragraphs 1 through 9, An electronic device comprising a plurality of layers (3821, 3822) each containing a different colored light-emitting material, wherein the different colored materials are simultaneously injected and integrated into a first layer (382).

11. In any one of paragraphs 1 through 10, It further includes a second reflective member (392) formed on the edge of the rear plate, and The above second reflective member (392) is configured to be inclined to reflect light provided from a light-emitting material to the outside of the electronic device.

12. In any one of paragraphs 1 to 11, An electronic device comprising at least one of the above-mentioned luminescent material, EA, RPC, RPCF, PS, PC, GRT, or Glycerol Monostearate.

13. In a method for manufacturing a rear plate, A process for forming a first layer containing a luminescent material; A process of forming an upper layer on the front surface of the first layer; A process of forming a lower layer on the back surface of the first layer; A process of integrating the upper layer, the first layer, and the lower layer into a plate; A process of forming at least one opening in the integrated plate; and The process includes forming a first reflective member at a position corresponding to the opening, and When a portion of an electronic component is placed in the opening, the electronic component is configured to be surrounded by the first reflective member (391) at a position corresponding to the opening, and A method for manufacturing a back plate, wherein the first reflective member (391) is configured to be inclined to reflect light provided from a light-emitting material to the outside of an electronic device.

14. In Paragraph 13, The first inclined surface (3911) of the first reflective member (391) is configured to form an angle of 60 degrees with the first layer (382), and A method for manufacturing a back plate, wherein the first inclined surface (3911) is configured to have a gloss of GU 100 or higher.

15. In Paragraph 13 or 14, A method for manufacturing a back plate, wherein the first layer (382) is a translucent layer containing the light-emitting material.

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