Radio and sensor modules including an antenna and an encapsulant material, and related sensing instruments

Abstract

A radio and sensor module includes a printed circuit board assembly including electrical components, a sensor module comprising a gas sensor configured to determine at least one property of ambient air surrounding the sensor device package, and a radio device. The radio device includes an antenna disposed around a periphery of the printed circuit board assembly, the antenna and the printed circuit board assembly defining a volume, and a radio frequency transceiver in operable communication with the antenna and operably coupled to the printed circuit board assembly. The radio and sensor module further includes at least one encapsulant material overlying the printed circuit board assembly and filling at least a portion of the volume defined by the antenna, the antenna forming a barrier for the at least one encapsulant. Related gas sensing assemblies, intrinsically safe radio and sensor modules and methods are also disclosed.

Description

RADIO AND SENSOR MODULES INCLUDING AN ANTENNA AND AN ENCAPSULANT MATERIAL, AND RELATED SENSING INSTRUMENTSPRIORITY CLAIM

[0001] This application claims the benefit of the filing date of United States Provisional Patent Application Serial No. 63 / 720,319, filed November 14, 2024, for “GAS SENSOR DEVICE PACKAGE INCLUDING AN ANTENNA AND A POTTING MATERIAL,” and United States Provisional Patent Application Serial No. 63 / 720,077, filed November 13, 2024, for “GAS SENSOR DEVICE PACKAGE INCLUDING AN ANTENNA AND A POTTING MATERIAL,” the disclosure of each which is hereby incorporated herein in its entirety by this reference.TECHNICAL FIELD

[0002] Embodiments of the disclosure relate generally to a radio and sensor module including one or more gas sensors for detecting one or more properties of a gas. More particularly, embodiments of the disclosure relate to an intrinsically safe gas sensing instrument including a battery powered radio and sensor module including at least one gas sensor, an antenna, and a long-range radio, the gas sensor encapsulated with an encapsulant material.BACKGROUND

[0003] Encapsulation of electronic components for electronic devices is often desired to impart intrinsic safety to the electronic devices. For example, encapsulating materials (potting and / or coating compounds) may encapsulate electronic components of the electronic device to allow the electronic devices to operate in explosive environments. However, forming the encapsulation material uniformly at desired locations and with desired thicknesses has heretofore been challenging.BRIEF SUMMARY

[0004] In some embodiments, a radio and sensor module comprises a printed circuit board assembly including electrical components, a sensor configured to determine at least one property of an environment surrounding the radio and sensor module, and a radio device comprising an antenna disposed around a periphery of the printed circuit boardassembly, the antenna and the printed circuit board assembly defining a volume, and a radio frequency transceiver in operable communication with the antenna and operably coupled to the printed circuit board assembly. The radio and sensor module further comprises at least one encapsulant material overlying the printed circuit board assembly and filling at least a portion of the volume defined by the antenna, the antenna forming a barrier for the at least one encapsulant.

[0005] In some embodiments, a gas sensing instrument comprises a radio and sensor module comprising a gas sensor configured to measure at least one condition proximate the gas sensing instrument, a radio frequency transceiver, an antenna, wherein the antenna forms at least a part of an outer surface of the radio and sensor module, and at least one encapsulant material abutting the antenna and overlying the gas sensor and the radio frequency transceiver. The gas sensing instrument further comprises a battery pack comprising a battery in operable communication with the radio and sensor module.

[0006] In some embodiments, an intrinsically safe radio and sensor module comprises a printed circuit board assembly, at least one sensor coupled to the printed circuit board assembly, a radio device coupled to the printed circuit board assembly, an antenna disposed around a periphery of the printed circuit board assembly, the antenna and a surface of the printed circuit board assembly defining a volume, and an encapsulant material overlying the printed circuit board assembly and contacting surfaces of the antenna.

[0007] In some embodiments, an electronic assembly includes a wireless radio device, and an antenna, wherein the antenna forms a part of an outer surface of the electronic assembly.

[0008] In other embodiments, a method of forming a gas sensor device package includes coupling a gas sensor module to a printed circuit board assembly, coupling an antenna around a periphery of the printed circuit board assembly, flowing a potting material over the printed circuit board assembly, the antenna damming a flow of the potting material, and curing the potting material to form the gas sensor device package.

[0009] This summary is provided to introduce a selection of concepts that are further described below in the detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in limiting the scope of the claimed subject matter.

[0010] Additional features and advantages of embodiments of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of such embodiments. The features andadvantages of such embodiments may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. These and other features will become more fully apparent from the following description and appended claims, or may be learned by the practice of such embodiments as set forth hereinafter.BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to describe the manner in which the above-recited and other features of the disclosure can be obtained, a more particular description will be rendered by reference to specific implementations thereof which are illustrated in the appended drawings. For better understanding, the like elements have been designated by like reference numbers throughout the various accompanying figures. While some of the drawings may be schematic or exaggerated representations of concepts, at least some of the drawings may be drawn to scale. Understanding that the drawings depict some example implementations, the implementations will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:

[0012] FIG. l is a simplified schematic illustrating an environment in which a gas sensor device package may operate, according to at least one embodiment of the disclosure;

[0013] FIG. 2Ais a simplified exploded perspective view of the gas sensor device package, according to at least one embodiment of the disclosure;

[0014] FIG. 2B is a simplified exploded perspective view of the gas sensor device package and a housing configured to house the gas sensor device package;

[0015] FIG. 2C is a simplified perspective view of an assembly including the gas sensor device package housed in the housing, according to at least one embodiment of the disclosure;

[0016] FIG. 3 A is a simplified, partial planar view of a gas sensor of a gas sensor module of the gas sensor device package, taken through section line A-A of FIG. 3B, according to at least one embodiment of the disclosure;

[0017] FIG. 3B is a simplified, partial cross-sectional view of the gas sensor taken through section line B-B of FIG. 3 A;

[0018] FIG. 3C is a simplified top-down view of a gas sensor including a plurality of the microhotplates, according to at least one embodiment of the disclosure;

[0019] FIG. 3D is a simplified perspective view illustrating an exploded view of the gas sensor module of FIG. 3 A;

[0020] FIG. 4A is a simplified exploded perspective view of a battery pack, according to at least one embodiment of the disclosure;

[0021] FIG. 4B is a simplified perspective view of a portion of the battery pack of FIG. 4 A; and

[0022] FIG. 4C is a simplified exploded perspective view of a gas sensing instrument, according to at least one embodiment of the disclosure.DETAILED DESCRIPTION

[0023] This disclosure generally relates to an intrinsically safe gas sensing instrument comprising a battery pack and a radio and sensor module configured comprising an antenna and at least one sensor configured to measure (e.g., determine) one or more conditions and / or properties proximate the gas sensing instrument. In some embodiments, the radio and sensor module includes a gas sensor module including one or more gas sensors configured to detect, measure, and / or analyze one or more gases for the presence of one or more materials (e.g., methane, hydrogen sulfide, carbon monoxide, hydrogen gas, another gas). The radio and sensor module may be configured to be powered by a battery of the battery pack, such that the radio and sensor module may be installed in areas where a direct power source is unavailable, in areas where a direct electrical connection may not be intrinsically safe, or areas where installation of the radio and sensor module to a power source may be difficult. The radio and sensor module may include an antenna and a radio (e.g., a radio microprocessor) configured to communicate with other devices or gateways via a long range wide area network (LoRaWAN). The radio may be in operable communication with the one or more sensors (e.g., such as one or more gas sensors) and configured to convert data (e.g., digital data) from the one or more gas into radio frequency signals, which may be transmitted to a remote location by the antenna in the form of electromagnetic waves using a LoRaWAN.

[0024] In some embodiments, the radio and sensor module includes a printed circuit board assembly configured to provide (e.g., distribute) power to different components of the radio and sensor module, such as the one or more sensors (such as one or more gas sensors and / or one or more sensors (e.g., environmental sensors, temperature sensors, pressure sensors, humidity sensors), anemometers (e.g., for detecting wind direction and speed)), the radio, the antenna, and other components of the radio and sensor module. In addition, the printed circuit board assembly may include electrical traces for receiving and transmitting data (e.g., electrical signals) to and from different componentsof the radio and sensor module. The one or more sensors (e.g., the one or more gas sensors and / or the one or more sensors) may provide electrical signals to, for example, the radio, through one or more traces or other components of the printed circuit board assembly. The electrical signals may be indicative of one or more properties sensed by the one or more sensors (e.g., the one or more gas sensors and / or the one or more sensors).

[0025] In some embodiments, the radio and sensor module includes at least one encapsulant material (also referred to as an “encapsulating material”) contacting electronic components of the printed circuit board assembly, the gas sensor, the one or more sensors, the antenna, and the radio. The encapsulant material may encapsulate (e.g., substantially encapsulate, completely encapsulate, substantially surround, completely surround) the electronic components of the printed circuit board assembly, the gas sensor, the sensors, the antenna, the radio, and any other electrical components of the radio and sensor module. The encapsulant material may overlie and contact the electrically active and electrically conductive components of the printed circuit board assembly. The encapsulant material may facilitate safe operation of the radio and sensor module including the electrical equipment thereof and may be exhibit intrinsic safety (IS), reducing (or eliminating) the electrical and thermal energy that may be available for ignition in the environment in which the radio and sensor module and / or the gas sensing instrument.

[0026] The antenna may be operably coupled around at least a portion of a perimeter of the printed circuit board assembly. In some embodiments, the antenna comprises a flexible antenna configured to conform to the peripheral shape of the printed circuit board assembly. During the encapsulation process (which may also be referred to as a “potting process”) in which the encapsulant material is flowed over the printed circuit board assembly to encapsulate the electronic components of the radio and sensor module, the antenna functions as a dam, holding the encapsulant material in place over the electronic components of the printed circuit board assembly. The encapsulant material may cure while held in place (e.g., dammed) by the antenna. In some embodiments, the antenna forms a wall of an outer boundary of the radio and sensor module and directly contacts the encapsulant material. A height of the encapsulant material above the surface of the printed circuit board assembly may be about the same as a height of at least a portion of the antenna above the surface of the printed circuit board assembly.

[0027] The radio and sensor module may be operably coupled to a battery pack including a battery configured to provide power to the radio and sensor module. The battery may be encapsulated in a potting compound to form an environmentally sealed batterypack. The radio and sensor module and the battery pack may be received and enclosed within a housing to define the gas sensing instrument.

[0028] Accordingly, the radio and sensor module and the gas sensing instrument including the radio and sensor module may be intrinsically safe and may be used in industrial applications requiring intrinsic safety. In other words, the encapsulant material may enable installation of the radio and sensor module in areas where explosive concentrations of gases are present. In addition, the LoRAWAN operation of the gas sensing instrument including the radio and sensor module enabled by the antenna may facilitate installation of the gas sensing instrument in remote locations and without a wired electrical connection. Thus, the radio and sensor module of the gas sensing instrument may be configured to transmit and receive data to and from remote locations where electricity may not be readily available.

[0029] FIG. 1 is a simplified schematic illustrating an environment 101 (e.g., a computing environment) in which a gas sensing instrument 175 including a radio and sensor module 100 and a battery pack 180 may operate, according to at least one embodiment of the disclosure. The battery pack 180 may include a battery 182 configured to provide power to the radio and sensor module 100. The radio and sensor module 100 may also be referred to as an electronic assembly. The environment 101 may include the gas sensing instrument 175 (including the radio and sensor module 100 and the battery pack 180), a network 130, a server 140, and a client device 160. The radio and sensor module 100 may be placed at a location including explosive and / or toxic gases. As described in additional detail herein, the radio and sensor module 100 may include an encapsulant material (e.g., encapsulant material 210 (FIG. 2A)) configured to electrically insulate and thermally insulate electronics (electronic components) and circuitry of the radio and sensor module 100 such that the radio and sensor module 100 exhibits intrinsic safety. In addition, the radio and sensor module 100 may be placed in a location where power (e.g., from a grid) may not be readily available or may be difficult to provide. As described herein, the radio and sensor module 100 may be powered by the battery 182 such that the radio and sensor module 100 may be installed in remote locations. In addition, the radio and sensor module 100 may include a long-range wide array network (LoRa WAN) radio device configured for using low amounts of power, enabling the radio and sensor module 100 to be battery operated.

[0030] The radio and sensor module 100 may include a gas sensor module 102 including one or more gas sensors configured to detect one or more properties of a gas fromthe ambient environment (e.g., the ambient air) surrounding the radio and sensor module 100 and / or the gas sensing instrument 175 including the radio and sensor module 100. The gas sensor module 102 may be configured to detect the presence of one or more analytes in the air, a concentration of one or more analytes in the air, an ambient temperature, an ambient pressure, an ambient humidity, or another condition of the ambient air proximate the radio and sensor module 100. As described with reference to FIG. 3 A through FIG. 3D, the gas sensor module 102 may include one or more gas sensors (e.g., gas sensor 300) for determining at least one property of the ambient air surrounding the radio and sensor module 100.

[0031] With continued reference to FIG. 1, the radio and sensor module 100 may include the gas sensor module 102, one or more additional sensors 103, a long-range wide array network (LoRa WAN) radio device 110, an anemometer 116, an input / output (I / O) device 118, a communications interface 120, a display 122, and a battery interface 124. The battery interface 124 may be configured to be in operable communication with the battery 182 of the battery pack 180. The long-range wide array network radio device 110 may include an antenna 112 and radio frequency (RF) transceiver 114 and associated circuitry (also referred to as a “radio circuit”). Together, the antenna 112 and the RF transceiver 114 may form the radio device 110. The RF transceiver 114 may be in operable communication with the antenna 112. In some embodiments, the radio device 110 further a radio frequency signal conductive transmission line (e.g., radio frequency signal conductive transmission line 216) and / or a radio control microprocessor. The one or more additional sensors 103 may include one or more environmental sensors configured to measure at least one condition and / or property of the environment 101, such as a temperature pressure, a pressure sensor, a humidity (e.g., relative humidity) sensor, the anemometer 116 for measuring the speed and / or direction of wind, and / or another type of sensor.

[0032] The LoRa WAN radio device 110 may be in operable communication with the gas sensor module 102 and configured to receive one or more signals (e.g., electrical signals) from the gas sensor module 102 indicative of at least one property and / or at least one condition of the ambient air proximate the radio and sensor module 100. In some embodiments, the gas sensors of the gas sensor module 102 collect data (e.g., real time data, time-series data) from the environment 101 surrounding the radio and sensor module 100. The data may be indicative of, for example, one or more of a temperature, a pressure, a humidity, a concentration of at least one component of a gas, a composition of a gas, or another property of the ambient air. In some embodiments, the gas sensor module 102generates the data in digital format. The one or more additional sensors 103 may be configured to measure (e.g., detect) one or more conditions and / or one or more properties of the environment 101 surrounding the gas sensing instrument 175. The data from the one or more additional sensors 103 may be real-time data or time-series data.

[0033] The RF transceiver 114 may be configured to receive the signals indicative of the at least one property and / or condition from the gas sensor module 102. The RF transceiver 114 may convert the data from the gas sensor module 102 into a form that can be transmitted over long distances using radio waves, such as by modulating the signals from the gas sensor module 102 into radio frequency (RF) signals. The antenna 112 may receive the radio frequency signals from the RF transceiver 114 and transmit the signals as electromagnetic waves. Accordingly, the RF transceiver 114 may convert the signals from the gas sensor module 102 into radio frequency signals which are, in turn, transmitted by the antenna 112.

[0034] In more detail, the RF transceiver 114 may be configured to transmit and receive data using LoRA modulation. The LoRa modulation may include a wireless modulation technique that encodes information on radio waves using chirp pulses, allowing for robust transmission and reception of data over long distances with minimal power consumption. Accordingly, the LoRa modulation techniques of the LoRa WAN radio device 110 facilitates operation of the radio and sensor module 100 at an endpoint at a remote location without a power source while allowing the radio and sensor module 100 to transmit and receive data to and from locations away (distal locations) from the radio and sensor module 100 over the network 130.

[0035] In some embodiments, the RF transceiver 114 converts the digital data from the gas sensor module 102 into radio frequency signals by modulating the data from the gas sensor module 102 onto a radio frequency carrier wave. The antenna 112 receives the radio frequency signals from the RF transceiver 114 and converts the radio frequency signals into electromagnetic waves (radio waves) that can travel through the air. Accordingly, the antenna 112 may be configured to convert the radio frequency signals (e.g., an alternating current carrying modulated data) from the RF transceiver 114 into radio waves and transmit the radio waves to another location. Similarly, the antenna 112 may receive radio waves from another location and convert the radio waves into an alternating current carrying modulated data (radio frequency signals) to be received by the RF transceiver 114. The RF transceiver 114 may demodulate the data from the antenna 112 to determine the original data. The design of LoRa WAN radio device 110 facilities operationof the LoRa WAN radio device 110 to operate in the sub-GHz frequency range, which may facilitate improved long-distance communication with low power. As described in additional detail with reference to FIG. 2A through FIG. 2C, the antenna 112 may include a flexible antenna configured to bend and conform to a shape of the radio and sensor module 100. In addition, the antenna 112 shape of the antenna 112 a periphery of the radio and sensor module 100, such as in a circular or elliptical shape around the periphery of the radio and sensor module 100, may facilitate an improved electromagnetic signal (having a higher strength) from the antenna 112 to facilitate transmission of the signal from the antenna 112 over long distances.

[0036] The anemometer 116 may be configured to measure a velocity and a direction of the ambient air (e.g., a wind speed and wind direction) proximate the radio and sensor module 100. The anemometer 116 may be in operable communication with the LoRa WAN radio device 110. For example, the RF transceiver 114 may receive anemometer data from the anemometer 116 and convert the anemometer data to radio frequency signals, as described above with reference to the gas sensor module data.

[0037] The communications interface(s) 120 may facilitate communication between the radio and sensor module 100 and other electronic devices. The communication interface(s) 120 may be based on wired communication technology, wireless communication technology, or both. Some examples of communication interfaces 120 include a Universal Serial Bus (USB), an Ethernet adapter, a wireless adapter that operates in accordance with an Institute of Electrical and Electronics Engineers (IEEE) 802.11 wireless communication protocol, a Bluetooth® wireless communication adapter, and an infrared (IR) communication port.

[0038] The I / O devices 118 may include one or more of a keyboard, mouse, microphone, remote control device, button, joystick, trackball, touchpad, and lightpen, a speaker and a printer. One specific type of I / O device 118 is the display 122. The display 122 may include any suitable image projection technology, such as liquid crystal display (LCD), light-emitting diode (LED), gas plasma, electroluminescence, or the like. In some embodiments, the display 122 includes a light configured to provide an indication of the operating status (e.g., on / oflf) of the radio and sensor module 100.

[0039] The network 130 may include one or more networks, such as the Internet, and can use one or more communications platforms or technologies suitable for transmitting data and / or communication signals. As a non-limiting example, the network 130 may utilize one or more of near field communication (NFC), BLUETOOTH ©,wireless / cellular networks, wide area networks (WAN), wired communications, or any other conventional network for transmitting data and / or communication signals between the radio and sensor module 100, the server 140, and the client device 160.

[0040] The server 140 may include a detection system (e.g., a leak detection system 142) configured to determine at least one condition of the environment 101. The detection system (e.g., the leak detection system 142) may include, for example, a data manager 144, a detection model (e.g., a leak detection model 146) for determining a presence of a leak in the environment 101, and a data storage 148. In some embodiments, the detection system includes a detection model for detecting one or more conditions and / or one or more properties in the environment 101. The leak detection model 146 may include radio and sensor module data 150 and / or the radio and sensor module data 150 may be stored in the data storage 148. The radio and sensor module data 150 may include data from the radio and sensor module 100 and may include, for example, data from one or more gas sensors (e.g., gas sensor 300 of the gas sensor module 102), data from the one or more sensors 103, and / or data from the anemometer 116.

[0041] The data manager 144 may receive a variety of types of data associated with the radio and sensor module 100 and may store the data to the data storage 148. The data manager 144 may receive the data from a variety of sources, such as from gas sensors of the gas sensor module 102, the one or more additional sensors 103, the anemometer 116, other (e.g., client) devices, user input, etc. The data manager 144 may store any information associated with the radio and sensor module 100 to the data storage 148 as the radio and sensor module data 150.

[0042] In some embodiments, the data manager 144 receives user input. The data manager 144 may receive the user input, for example, via any of the client devices 160 and / or servers 140. Any of the data described herein may be input or augmented via the user input. For example, in some instances, some or all of the radio and sensor module data 150 is received by the data manager 144 as user input. The user input may be received in association with one or more functions or features of the leak detection system 142, such as part of generating determining the presence of a leak in the environment 101 and / or determining at least one property of the ambient air surrounding the radio and sensor module 100 and / or the gas sensing instrument 175.

[0043] In some embodiments, the data manager 144 receives operational parameter data 152, which may be stored in the data storage 148. The operational parameter data 152 may be any information associated with an operation or function of theenvironment 101. For example, the operational parameter data 152 may include upper and lower limits for one or more components (e.g., methane, carbon monoxide, hydrogen sulfide) that may be present in the environment. The operational parameter data 152 may be associated with a type of operation performed in the environment 101. Non-limiting examples of operations include downhole drilling, refining, power production, cement production, or other industrial processes.

[0044] In some embodiments, a user may interface with the client device 160, for example, to communicate with the server 140 and to utilize the leak detection system 142 to monitor the at least one property of the ambient air in the environment 101 surrounding the radio and sensor module 100 and the gas sensing instrument 175. The user may include one or more operators of the environment 101, who may be located remote from the environment 101. Although FIG. 1 illustrates only one client device 160, the radio and sensor module 100 and the gas sensing instrument 175 may be in operable communication with any number of client devices 160 over the network 130.

[0045] The leak detection model 146 may be located on the server 140, which may be at a location remote from the radio and sensor module 100. In some embodiments, the leak detection model 146 is located at the edge on the radio and sensor module 100. The leak detection model 146 may include one or more models and / or algorithms configured to determine the at least one property of the ambient air surrounding the radio and sensor module 100 and the gas sensing instrument 175. In some embodiments, the leak detection model 146 may be updated and / or modified with additional data. For example, the leak detection model 146 may be updated by a user, even after the radio and sensor module 100 and the gas sensing instrument 175 are installed at a remote location.

[0046] In some embodiments, the client device 160 may include a client application installed thereon. In one or more embodiments, the client application is associated with the leak detection system 142. For example, the client application may allow the client device 160 to directly or indirectly interface with the leak detection system 142 of the server 140. The client application may also enable a user (e.g., an operator) to initiate measurements via the leak detection system 142and observe any results of the measurements (e.g., generated images representing the output of the leak detection system 142). Further, the client application enables the user to observe (e.g., view) one or more operating conditions of the environment 101 proximate the radio and sensor module 100 and the gas sensing instrument 175.

[0047] Accordingly, the radio and sensor module 100 may be configured to receive and transmit data from a gas sensor module 102 to a location remote from the radio and sensor module 100. The LoRa WAN radio device 110 may facilitate the installation and of the radio and sensor module 100 at the remote location. As described with reference to FIG. 2A through FIG. 2C, the antenna 112 may include a flexible antenna and may surround an outer perimeter of the radio and sensor module 100, forming a dam for an encapsulant material (e.g., encapsulant material 210 (FIG. 2A)). The antenna 112 (e.g., the major surface 206 of the antenna 112) and the major surface 208 of the PCBA 202 may define a volume. During encapsulation, the encapsulant material 210 may fill the volume defined by the antenna 112 and the PCBA 202. In other words, the antenna 112 may form a barrier to contain the encapsulant material 210 during application of the encapsulant material 210 over the PCBA 202. The encapsulant material 210 may abut and directly contact the antenna 112. The antenna 112 may form a part of an outer surface or an enclosure of the radio and sensor module 100. The encapsulant material 210 may overlie the PCBA 202, such as the electrically conductive or electrically active elements of the PCBA 202 and / or electrically active elements operably coupled to the PCBA 202.

[0048] While the radio and sensor module 100 has been described and illustrated as including the LoRa WAN radio device 110 for remote communication, the disclosure is not so limited. In other embodiments, the radio and sensor module 100 includes a device (e.g., a radio device) other than a LoRa WAN radio device configured to facilitate remote communication between the radio and sensor module 100 and, for example, the server 140 and / or the client device 160.

[0049] FIG. 2A is a simplified exploded perspective view of the radio and sensor module 100, according to at least one embodiment of the disclosure. FIG. 2B is a simplified exploded perspective view of the radio and sensor module 100 and a housing 250 configured to house the radio and sensor module 100. FIG. 2C is a simplified perspective view of an assembly 260 including the radio and sensor module 100 housed in the housing 250, according to at least one embodiment of the disclosure.

[0050] With reference to FIG. 2 A, the radio and sensor module 100 includes a printed circuit board assembly (PCBA) 202 and the antenna 112 disposed around and attached to a periphery of the PCBA 202. The antenna 112 may define a periphery of the radio and sensor module 100. As best seen in FIG. 2B, the PCBA 202 may include openings 204 configured to receive protrusions of the antenna 112 to couple the antenna 112 to the PCBA 202. The openings 204 may be located around a periphery (e.g., an outer edge) ofthe PCBA202. In some embodiments, the openings 204 extend through an entire thickness of the PCB A 202. The openings 204 are not visible in FIG. 2A since the protrusions of the antenna 112 are received and located within the openings 204. The openings 204 of the PCBA202 and the protrusions of the antenna 112 may facilitate reliable and reproducible connections between the antenna 112 and the PCB A 202. Power may be supplied to the antenna 112 by means of a radio frequency amplification circuitry of the radio device 110 (which may be a portion of the RF transceiver 114) and associated circuitry.

[0051] The antenna 112 may include a flexible antenna configured to bend, deform, or otherwise be manipulated to define a shape corresponding to the periphery of the PCB A 202. In some embodiments, the PCB A 202 (or the major surface 208 of the PCBA 202) has a circular or elliptical shape (e.g., when viewed from the top down). The antenna 112, when disposed around the periphery of the PCBA 202, may exhibit a corresponding circular or cross-sectional shape. When the antenna 112 is attached to the PCBA 202 (by coupling protrusions of the antenna 112 through the openings 204 of the PCBA 202), the antenna 112 exhibits a profile corresponding to the shape of the PCBA 202. Accordingly, the antenna 112 may exhibit a circular or elliptical cross-sectional shape corresponding to the shape of the PCBA 202. The circular or elliptical shape of the antenna 112 may improve the strength of the electromagnetic signal provided by the antenna 112, improving the range of the antenna 112. In addition, the circular or elliptical shape of the antenna 112 may facilitate emission of electromagnetic radiation from the antenna 112 substantially uniformly in all directions (e.g., perpendicular to major surfaces of the antenna 112). In some embodiments, the electromagnetic radiation pattern emitted by the antenna 112 may be substantially circular and / or elliptical. In some embodiments, the electromagnetic radiation pattern emitted from the antenna 112 may be substantially parallel to the major surface 208 of the PCBA 202. Thus, the openings 204 of the PCBA 202 and the protrusions of the antenna 112 facilitate forming the antenna 112 on the PCBA 202 with a cross-sectional shape corresponding to the shape of the PCBA 202. The antenna 112 may include a major surface 206 oriented substantially perpendicular to a major surface 208 of the PCBA 202. As described herein, the antenna 112 may form a dam (e.g., a boundary) for an encapsulant material 210 while encapsulating (e.g., potting) the radio and sensor module 100 with the encapsulant material 210.

[0052] In some embodiments, the antenna 112 is configured to wrap around a periphery of the PCBA 202. A first end of the antenna 112 may overlap with a second end of the antenna 112 at overlapping region 213 such that the antenna 112 seals around theperiphery of the PCBA202 and dams the encapsulant material 210 over the PCBA202. As noted above, FIG. 2A is an exploded view of the radio and sensor module 100. It will be understood that the encapsulant material 210 overlies and substantially surrounds the components of the PCBA 202. In some embodiments, a height Hi of the encapsulant material 210 may correspond to a height H2 of a first portion of the antenna 112. The height H2 of the first portion of the antenna 112 may define the height Hi of the encapsulant material 210 during the encapsulation process when the encapsulant material is flowed over the PCBA 202. In some embodiments, the height Hi of the encapsulant material 210 may be the same as the height H2 of the first portion of the antenna 112. As described above, the wall defined by the major surface 206 of the antenna 112 may form a dam, forming a barrier to the flow of the encapsulant material 210 beyond surfaces of the PCBA 202. A second portion of the antenna 112 may have a height H3 larger than the heights Hi, H2.

[0053] The PCBA 202 may include or may be coupled to electric components of the radio and sensor module 100. The PCBA 202 may include circuitry and routing for electrically coupling different components of the radio and sensor module 100 and facilitating electronic communication between the different components of the radio and sensor module 100. For example, the RF transceiver 114 coupled (e.g., soldered) to the PCBA 202. An enclosure 212 may surround the RF transceiver 114 and reduce and / or prevent the encapsulant material 210 from surrounding the microelectronics of the RF transceiver 114. In some embodiments, in addition to surrounding the RF transceiver 114, the enclosure 212 may surround other components of the PCBA 202 to prevent the encapsulant material 210 and / or direct the encapsulant material 210 away from contacting the RF transceiver 114 and / or the components surrounded by the enclosure 212. With continued reference to FIG. 2 A and FIG. 2B, the gas sensor module 102 (FIG. 2B) may be coupled to the PCBA 202. In some embodiments, the gas sensor module 102 is coupled to a back side of the PCBA 202. The gas sensor module 102 may include terminals (or pins) 214 for electrically coupling the gas sensor module 102 to the PCBA 202. In some embodiments, the terminals 214 extend through the PCBA 202 (e.g., from a back side of the PCBA 202) and are soldered to the major surface 208 of the PCBA 202. The battery interface 124 may be coupled (e.g., soldered) to the major surface 208 of the PCBA 202. Terminals of the battery 182 (FIG. 1, FIG. 4A, FIG. 4B) may be coupled to battery interface 124. With continued reference to FIG. 2A, the anemometer 116 may be electrically coupled to the PCBA 202. The PCBA 202 may further include a port 218 configured to operably couple to the battery pack 180. In some embodiments, the port 218 is also configured toreceive the I / O device 118, and / or the I / O device 118 may be in operable communication with the PCBA202 by other means. With reference to FIG. 2B, the back side of the PCBA 202 may include a coating material 240, which may overlie surfaces of the back side of the PCBA 202. The coating material 240 may comprise a different material composition than the encapsulant material 210.

[0054] In some embodiments, each of the RF transceiver 114, the gas sensor module 102, the sensors 103, the battery interface 124, the anemometer 116, and other electronics and circuitry of the radio and sensor module 100 are soldered to the PCBA 202. However, the disclosure is not so limited, and each of the RF transceiver 114, the gas sensor module 102, the sensors 103, the battery interface 124 interface, the anemometer 116 may be electrically connected to the PCBA 202 by methods other than soldering. The PCBA 202 may further include a drive train 217 of the antenna 112 for connecting the output of the RF transceiver 114 to the antenna 112. The drive train 217 may include an electronic transmission line (e.g., a conductive line) for connecting the output of the RF transceiver 114 to the antenna 112. In addition, the PCBA 202 may further include circuitry (e.g., radio circuitry) configured to provide power to the antenna 112, such as a radio frequency signal conductive transmission line 216 (also referred to as a “conductive line”) for providing power to the antenna 112. For example, the radio frequency signal conductive transmission line 216 may control the power supplied from the battery 182 of the battery pack 180 to the battery interface 124 and to the antenna 112. FIG. 2A illustrates some of the conductive portions or terminals of the radio frequency signal conductive transmission line 216. While the anemometer 116 has been described and illustrated as being coupled to the PCBA 202, the disclosure is not so limited. In some embodiments, the anemometer 116 may be part of the gas sensing instrument 175, but may not be directly coupled to the PCBA 202.

[0055] The encapsulant material 210 may include one or more thermally dispersive and electrically insulative materials formulated and configured to impart intrinsic safety to the radio and sensor module 100. The encapsulant material 210 when applied to the PCBA 202 may be flowable. The antenna 112 attached to the PCBA 202 may form a dam reducing and / or preventing the flow of the encapsulant material 210 outside of the boundaries defined by the antenna 112, such as off of surfaces of the PCBA 202. The encapsulant material 210, before curing, may exhibit a viscosity such that the encapsulant material does not flow through an interface between the antenna 112 and the PCBA 202. In other words, the encapsulant material 210 may remain only on surfaces (e.g., the majorsurface 208) of the PCBA 202 due to the coupling of the antenna 112 to the PCB A 202 and the viscosity of the encapsulant material 210 before curing.

[0056] After flowing the encapsulant material 210 on the PCBA 202, the encapsulant material 210 may be cured, such as by exposing the encapsulant material to curing conditions. The curing conditions may include one or more of a curing temperature, such as a temperature greater than a predetermined temperature (e.g., greater than about 50°C, such as greater than about 75°C, greater than about 100°C, or greater than about 150°C); exposure to electromagnetic radiation (e.g., exposure to ultraviolet electromagnetic radiation); or another curing condition. In some embodiments, curing the encapsulant material 210 includes exposing the encapsulant material to a curing temperature. Curing the encapsulant material 210 may harden the encapsulant material 210 such that the encapsulant material 210 is no longer flowable.

[0057] The encapsulant material 210 may include one or more electrically insulative dielectric materials. In some embodiments, the encapsulant material 210 exhibits a dielectric constant less than about 20, such as less than about 15, less than about 10, less than about 5, less than about 3, or less than about 2. In some embodiments, the dielectric constant of the encapsulant material is less than about 2.5. In some embodiments, the encapsulant material 210 exhibits a thermal conductivity greater than about 0.14 W / m K, such as greater than about 0.15 W / m K, greater than about 0.20 W / m K, or greater than about 0.25 W / m K. The thermal conductivity of the encapsulant material 210 may be within a range of from about 0.10 W / m K to about 0.20 W / m K, such as from about 0.12 W / m K to about 0.18 W / m K, or from about 0.13 W / m K to about 0.17 W / m K. The encapsulant material 210 may be formulated and configured to exhibit an Underwriters Laboratory (UL) rating of UL 94 or UL 746E. In some embodiments, the encapsulant material 210 includes a resin that functions as a spark barrier. In some embodiments, the encapsulant material 210 exhibits a flame resistance that meets or exceeds a horizontal burn (HB) flame rating (also referred to as a UL 94 HB rating), indicating that the encapsulant material 210 may be exposed to a flame for 30 seconds and has a bum rate of less than 3 inches per minute (76 mm / min) or stops burning before reaching a specific mark. In some embodiments, the encapsulant material 210 includes a two-part epoxy exhibiting flame-retardant and low flammability ratings. By way of non-limiting example, the encapsulant material 210 may include a glass micro-balloon filled material and encapsulation compound, a polyurethane compound, or another material formulated and configured to impart the desired properties (e.g., intrinsic safety in explosive environments). In some embodiments, the encapsulantmaterial 210 includes a glass micro-balloon filled epoxy (or resin) material. The resin material may form a thixotropic paste. In some embodiments, the encapsulant material 210 exhibits a relatively high viscosity configured to facilitate ease of manufacturing of the radio and sensor module 100 (e.g., by reducing the tendency of the uncured encapsulant material 210 to spill during flow of the encapsulant material 210 prior to curing). In some embodiments, the encapsulant material 210 exhibits a viscosity higher than about 15,000 cP at about 25°C prior to curing. In some embodiments, the encapsulant material 210 includes a two component (two part) polyurethane compound. The encapsulant material 210 may provide environmental protection and intrinsic safety to the radio and sensor module 100. In addition, the encapsulant material 210 may comprise a spark arrester configured to arrest (e.g., stop) sparks and / or prevent sparks from contacting components of the PCBA 202 and the gas sensor module 102.

[0058] In some embodiments, the encapsulant material 210 includes an optically transparent material such that the display 122 is at least partially visible through the encapsulant material 210. For example, where the display 122 includes a light (e.g., providing an indication of the operating status of the radio and sensor module 100) the light may be visible through the encapsulant material 210.

[0059] The encapsulant material 210 may substantially encapsulate (e.g., overlie, contact) substantially the entire major surface 208 of the PCBA 202 between the boundary defined by the antenna 112 and the major surface 208. The encapsulant material 210 may directly contact and overlie the electronic components (e.g., the sensors 103, battery interface 124, the RF transceiver 114, the anemometer 116) of the PCBA 202. In some embodiments, the encapsulant material 210 directly contacts and overlies the RF transceiver 114. Further, the encapsulant material 210 may directly overlie and contact the electric components and circuitry of the PCBA 202 and the solder connections between the PCBA 202 and each of the sensors 103, the battery interface 124, the anemometer 116, the RF transceiver 114, and the terminals 214.

[0060] The encapsulant material 210 may directly contact a side of the antenna 112. An opposing side of the antenna 112 may be spaced from the encapsulant material 210. In some embodiments, an outside of the radio and sensor module 100 is defined by a side of the antenna 112 opposite the encapsulant material 210. In some such embodiments, the encapsulant material 210 may not substantially attenuate signals to and from the antenna 112, improving the operation of the radio and sensor module 100.

[0061] With continued reference to FIG. 2 A, the radio and sensor module 100 may include standoffs 220 configured to leave openings 222 in the encapsulant material 210. With reference to FIG. 2B, the openings 222 may be configured to receive fasteners 224 (FIG. 2B) for coupling the radio and sensor module 100 to the housing 250. In the view illustrated in FIG. 2B, the encapsulant material 210 (FIG. 2A) is not visible, but it will be understood that the encapsulant material 210 is located within the enclosure defined by the antenna 112.

[0062] The gas sensor module 102 may include one or more gas sensors configured to determine at least one property of the ambient air surrounding the radio and sensor module 100 (FIG. 1). For example, the gas sensor module 102 may include one or more of a microhotplate gas sensor, a microcantilever hotplate, a microcantilever, a thermal conductivity sensor, or another type of gas sensor device configured to determine at least one property (e.g., a concentration of at least one component of a gas sample, a composition of a gas sample) in the environment surrounding the radio and sensor module 100. By way of non-limiting example, the gas sensor module 102 may include one or more gas sensors, such as the devices described in U.S. Patent No. 11,041,838, titled “Gas Sensors Including Microhotplates with Resistive Heaters, and Related Methods,” issued June 22, 2021 to Rogers et al., the entire disclosure of which is incorporated herein in its entirety by this reference. In addition, the gas sensor module 102 may include one or more gas sensors, such as one or more of the devices described in U.S. Patent No. 10,724,976, titled “Systems and Methods for Determining at Least one Property of a Material,” issued July 28, 2020, to Rogers et al., the entire disclosure of which is incorporated herein in its entirety by this reference.

[0063] FIG. 3 A is a simplified, partial planar view of a gas sensor 300 of the gas sensor module 102 taken through section line A-A of FIG. 3B, in accordance with at least one embodiment of the disclosure; and FIG. 3B is a simplified, partial cross-sectional view of the gas sensor 300 taken through section line B-B of FIG. 3A. With collective reference to FIG. 3A and FIG. 3B, the gas sensor 300 may include a microhotplate 302 including a membrane 304 suspended over a cavity 306 formed in a substrate 308. As used herein, the term “substrate” means and includes not only silicon wafers, but also silicon-on-insulator (“SOI”) substrates, such as silicon-on-sapphire (“SOS”) substrates or silicon-on-glass (“SOG”) substrates, epitaxial layers of silicon on a base semiconductor foundation, or other semiconductor materials. In some embodiments, the substrate 308 comprises silicon. Inother embodiments, the substrate 308, or at least a portion thereof, may be oxidized and comprise, for example, a silicon oxide (e.g., SiCh).

[0064] As shown in FIG. 3B, the cavities 306 may be formed within the substrate 308 and the membrane 304 may be suspended over the cavity 306 by tethers 310 extending from a periphery of the microhotplate 302 to the center of the microhotplate 302. The tethers 310 may support electrically conductive traces 312 for providing a current to a resistive heater 316 and electrically conductive bond pads 320for measuring an electrical property (e.g., a current, a voltage) across the resistive heater 316. The electrically conductive traces 312 may be in electrical communication with bond pads 320 configured to provide power to the electrically conductive traces 312. Similarly, the electrically conductive traces 314 may be in electrical communication with the electrically conductive bond pads 318, which may be configured to facilitate measurement of the voltage drop across the resistive heater 316.

[0065] The resistive heater 316 may be configured to heat as chemical sensing material 322 (FIG. 3B), which may directly overlie and contact interdigitated electrodes 324 (FIG. 3B). As shown in FIG. 3B, the chemical sensing material 322 and the interdigitated electrodes 324 may be in a different vertical plane than the resistive heater 316, such as vertically above (e.g., farther from the substrate 308 than) the resistive heater 316. The chemical sensing material 322 and the interdigitated electrodes 324 may be electrically isolated from the resistive heater 316 by, for example, a first dielectric material 326, a second dielectric material 328, and a third dielectric material 330. In some embodiments, the resistive heater 316 exhibits a spiral shape with a continuously changing width W from a center of the membrane 304 to a periphery of the membrane 304.

[0066] The interdigitated electrodes 324 may be in electrical communication with bond pads 332 (FIG. 3A) by means of electrically conductive traces extending over the tethers 310 to the interdigitated electrodes 324. The chemical sensing material 322 may be in electrical contact with the interdigitated electrodes 324 such that the electrical characteristics of the chemical sensing material 322 (e.g., a resistivity between the interdigitated electrodes 324 due to the chemical sensing material 322) may be determined through the bond pads 332 (FIG. 3A).

[0067] The chemical sensing material 322 may comprise a material formulated and configured to exhibit a change in electrical resistance responsive to interaction with (e.g., reaction with, adsorption of, absorption of, oxidation by, reduction by, etc.) one or more chemicals (e.g., analytes) of interest, such as when an analyte is present thereon. Insome embodiments, the chemical sensing material 322 may be formulated and configured to adsorb, absorb, or chemically react with at least one analyte of interest. The chemical sensing material 322 may also be referred to herein as a metal oxide semiconductor (MOS) coating (“MOS coating”) and the gas sensor 300 may also be referred to herein as a “MOS microhotplate.”

[0068] The chemical sensing material 322 may comprise a metal oxide (e.g., tin oxide, zinc oxide, tungsten oxide (e.g., WO3), a manganese oxide (e.g., MnO, Mn02, MmCh), LaCoOs, LaNiOs, vanadium oxide (e.g., V2O5), phosphorous pentoxide (e.g., P2O5), molybdenum oxide (MOO2), cesium oxide (e.g., CS2O), etc.), a doped metal oxide (e.g., platinum-doped tin oxide), a polymer material (e.g., an electrically conductive polymer material), an ionic conductor (e.g., an electrochemical coating (also referred to as an e-chem coating)) material, an n-type semiconductor material, a p-type semiconductor material, a thermoelectric material, another material, or combinations thereof. In other embodiments, the chemical sensing material 322 comprises a semistor material formulated and configured to exhibit a change in one or more electrical properties responsive to reacting with an analyte. The semistor material may comprise, for example, tin oxide (e.g., SnCh), titanium oxide (e.g., TiCh), tungsten oxide (e.g., WO3), yttria-stabilized zirconia (YSZ), or combinations thereof.

[0069] FIG. 3C is a simplified top-down view of a gas sensor 300 including a plurality of the microhotplates 302. The microhotplates 302 may be the same as the microhotplate 302 described above with reference to FIG. 3A and FIG. 3B. In some embodiments, at least one of the microhotplates 302 may include an environmental sensor configured to measure an ambient condition proximate the gas sensor 300. For example, at least one of the microhotplates 302 may include a resistive heater 316, but may not include a chemical sensing material 322 or may include an inert material instead of the chemical sensing material 322.

[0070] FIG. 3D is a simplified perspective view illustrating an exploded view of the gas sensor module 102, according to at least one embodiment of the disclosure. The gas sensor module 102 may include a housing 350 configured to cover a sensor board 352 including the gas sensor 300 and one or more environmental sensors 360 (e.g., configured to measure one or more environmental conditions, such as one or more of a temperature, a pressure, or a relative humidity), a computer board 354 including drive electronics for driving the sensor board 352 and the microhotplate(s) 302 thereof; an interface board 356 including the terminals 214 (FIG. 2A); and an encapsulant material 358 surrounding thesensor board 352, the computer board 354, the interface board 356, and the terminals 214. The encapsulant material 358 may be substantially the same as the encapsulant material 210; or the encapsulant material 358 may comprise a different material composition than the encapsulant material 210.

[0071] As described above, the gas sensing instrument 175 may further include the battery pack 180. FIG. 4Ais a simplified exploded perspective view of the battery pack 180, according to at least one embodiment of the disclosure. The battery pack 180 includes a pack 402 including one or more batteries 182. The batteries 182 may be in electrically connected to a holder 404 by means of wires 406 and electrical connector 408. The battery 182 may be encapsulated in an encapsulant material 410, which may include one or more of the materials described above with reference to the encapsulant material 210. In some embodiments, the encapsulant material 410 is the same as the encapsulant material 210. In other embodiments, the encapsulant material 410 comprises a different material composition than the encapsulant material 210. Ahousing 412 may be configured to receive and house (e.g., enclose) the pack 402 including the batteries 182; the holder 404, the wires 406, the electrical connector 408, and the encapsulant material 410.

[0072] FIG. 4B is a simplified perspective view of a portion of the battery pack 180 of FIG. 4 A. The battery pack 180 may include a fuse 414 in electrical communication with the batteries 182. The fuse 414 may be configured to electrically short responsive to exposure to more than a predetermined electrical voltage and / or current. The fuse 414 may be configured to accommodate intrusion of electrically conductive particles into the port 218 (or connector) on the PCBA 202 to which the battery pack 180 operably couples (e.g., plugs into), which may occur after the gas sensing instrument 175 has been in service in environments that have atmospheric dust for extended periods of time (e.g., five years or more). The fuse 414 may be configured to electrically short responsive to exposure to a current higher than about 200 milliamps.

[0073] FIG. 4C is a simplified exploded perspective view of the gas sensing instrument 175, according to at least one embodiment of the disclosure. In the view of FIG. 4C, the battery pack 180 is received within the housing 412. The gas sensing instrument 175 may include the radio and sensor module 100 including the antenna 112. The radio and sensor module 100 may be received in the housing 412 proximate the battery pack 180. After the battery pack 180 and the radio and sensor module 100 are received in the housing 412, a bracket 416 may attach to the housing 412 and may be configured for securing the gas sensing instrument 175 to a wall or other surface.

[0074] Accordingly, the antenna 112 may be used as a dam during formation of the encapsulant material 210. Forming the radio and sensor module 100 to include the antenna 112 around the periphery of the radio and sensor module 100 may facilitate improved encapsulation of the PCB A 202 and other electrical components of the radio and sensor module 100, facilitating the formation of an intrinsically radio and sensor module 100. Filling the encapsulant material 210 to a level of the edge of the antenna 112 may facilitate covering critical electrical components of the PCBA 202 with the encapsulant material 210. After the electronic components of the PCBA 202 are covered with the encapsulant material 210, the radio and sensor module 100 may be operated in explosive environments. The antenna 112 may facilitate forming the encapsulant material 210 without masking materials or other mechanical barriers for the encapsulant material 210.

[0075] Although the radio and sensor module 100 and the gas sensing instrument 175 have been described and illustrated as including the gas sensor module 102 including a gas sensor comprising the microhotplate 302, the disclosure is not so limited. In other embodiments, the antenna 112 may dam an encapsulant material 210 over a PCBA including a radio and sensor module including a sensor other than a gas sensor and / or in addition to a gas sensor. For example, the radio and sensor module may include a non-gas sensing device. A radio and sensor module may include one or more other sensors (e.g., temperature sensors, pressure sensors, humidity sensors, anemometers, and / or other sensors) and a sensing instrument may be configured to remotely sense and provide information about an environment based on data received from the sensors. The antenna 112 may facilitate forming a dam around a PCBA during encapsulation operations.

[0076] Although the radio and sensor module 100 has been described as being used in an environment requiring intrinsic safety, it will be appreciated that the radio and sensor module 100 may be used in environments that do not require intrinsic safety. For example, the radio and sensor module 100 may be used in environmental protection applications.

[0077] Additional non-limiting example embodiments of the disclosure are set forth below.

[0078] Embodiment 1: A radio and sensor module, comprising: a printed circuit board assembly including electrical components; a sensor configured to determine at least one property of an environment surrounding the radio and sensor module; a radio device comprising: an antenna disposed around a periphery of the printed circuit board assembly, the antenna and the printed circuit board assembly defining a volume; and a radio frequencytransceiver in operable communication with the antenna and operably coupled to the printed circuit board assembly; and at least one encapsulant material overlying the printed circuit board assembly and filling at least a portion of the volume defined by the antenna, the antenna forming a barrier for the at least one encapsulant.

[0079] Embodiment 2: The radio and sensor module of Embodiment 1, wherein the radio and sensor module is intrinsically safe.

[0080] Embodiment 3: The radio and sensor module of Embodiment 1 or Embodiment 2, wherein the radio device comprises a long-range wide area network radio device.

[0081] Embodiment 4: The radio and sensor module of any one of Embodiments 1 through 3, wherein the antenna comprises a flexible antenna is in a circular shape around the periphery of the printed circuit board and configured to exhibit a circular electromagnetic radiation pattern.

[0082] Embodiment 5: The radio and sensor module of any one of Embodiments 1 through 4, wherein the antenna comprises projections configured to extend through openings in the printed circuit board assembly.

[0083] Embodiment 6: The radio and sensor module of Embodiment 5, wherein the projections and openings facilitate disposing the antenna around the periphery of the printed circuit board in a circular shape.

[0084] Embodiment 7: The radio and sensor module of any one of Embodiments 1 through 6, wherein the at least one encapsulant material comprises a two-part epoxy.

[0085] Embodiment 8: The radio and sensor module of any one of Embodiments 1 through 7, wherein the at least one encapsulant material exhibits a dielectric constant less than about 2.5.

[0086] Embodiment 9: The radio and sensor module of any one of Embodiments 1 through 8, wherein the at least one encapsulant material directly contacts a major surface of the antenna.

[0087] Embodiment 10: The radio and sensor module of any one of Embodiments 1 through 9, wherein the sensor comprises a microhotplate.

[0088] Embodiment 11 : The radio and sensor module of any one of Embodiments 1 through 10, wherein a major surface of the antenna is substantially perpendicular to a major surface of the printed circuit board assembly and an electromagnetic radiation pattern of the antenna is substantially parallel to the major surface of the printed circuit board.

[0089] Embodiment 12: The radio and sensor module of any one of Embodiments 1 through 11, wherein a major surface of the at least one encapsulant material is substantially parallel to the major surface of the printed circuit board assembly.

[0090] Embodiment 13 : The radio and sensor module of any one of Embodiments 1 through 12, wherein the sensor module comprises a gas sensor.

[0091] Embodiment 14: A gas sensing instrument, comprising: a radio and sensor module comprising: a gas sensor configured to measure at least one condition proximate the gas sensing instrument; a radio frequency transceiver; an antenna, wherein the antenna forms at least a part of an outer surface of the radio and sensor module; and at least one encapsulant material abutting the antenna and overlying the gas sensor and the radio frequency transceiver; and a battery pack comprising a battery in operable communication with the radio and sensor module.

[0092] Embodiment 15: The gas sensing instrument of Embodiment 14, wherein the radio and sensor module further comprises a printed circuit board assembly, the at least one encapsulant material overlying electrically active elements of the printed circuit board assembly.

[0093] Embodiment 16: The gas sensing instrument of Embodiment 14 or Embodiment 15, further comprising a housing surrounding the radio and sensor module and the battery.

[0094] Embodiment 17: The gas sensing instrument of any one of Embodiments 14 through 16, wherein a first portion of the antenna extends above the gas sensor a first height and a second portion of the antenna extends above the gas sensor a second height, the at least one encapsulant material having a height corresponding to the first height.

[0095] Embodiment 18: The gas sensing instrument of any one of Embodiments 14 through 17, wherein the battery pack comprises a fuse configured to electrically short responsive to exposure to a current higher than about 200 milliamp.

[0096] Embodiment 19: The gas sensing instrument of any one of Embodiments 14 through 18, further comprising an additional encapsulant material around the battery pack.

[0097] Embodiment 20: An intrinsically safe radio and sensor module, comprising: a printed circuit board assembly; at least one sensor coupled to the printed circuit board assembly; a radio device coupled to the printed circuit board assembly; an antenna disposed around a periphery of the printed circuit board assembly, the antenna and a surface of the printed circuit board assembly defining a volume; and an encapsulantmaterial overlying the printed circuit board assembly and contacting surfaces of the antenna.

[0098] One or more specific embodiments of the present disclosure are described herein. These described embodiments are examples of the presently disclosed techniques. Additionally, in an effort to provide a concise description of these embodiments, not all features of an actual embodiment may be described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous embodiment-specific decisions will be made to achieve the developers’ specific goals, such as compliance with system-related and business-related constraints, which may vary from one embodiment to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

[0099] The articles “a,” “an,” and “the” are intended to mean that there are one or more of the elements in the preceding descriptions. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one embodiment” or “an embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described in relation to an embodiment herein may be combinable with any element of any other embodiment described herein. Numbers, percentages, ratios, or other values stated herein are intended to include that value, and also other values that are “about” or “approximately” the stated value, as would be appreciated by one of ordinary skill in the art encompassed by embodiments of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to be expected in a suitable manufacturing or production process, and may include values that are within 5%, within 1%, within 0.1%, or within 0.01% of a stated value.

[0100] A person having ordinary skill in the art should realize in view of the present disclosure that equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made to embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional “means-plus-function” clausesare intended to cover the structures described herein as performing the recited function, including both structural equivalents that operate in the same manner, and equivalent structures that provide the same function. It is the express intention of the applicant not to invoke means-plus-function or other functional claiming for any claim except for those in which the words ‘means for’ appear together with an associated function. Each addition, deletion, and modification to the embodiments that falls within the meaning and scope of the claims is to be embraced by the claims.

[0101] The terms “approximately,” “about,” and “substantially” as used herein represent an amount close to the stated amount that still performs a desired function or achieves a desired result. For example, the terms “approximately,” “about,” and “substantially” may refer to an amount that is within less than 5% of, within less than 1% of, within less than 0.1% of, and within less than 0.01% of a stated amount. Further, it should be understood that any directions or reference frames in the preceding description are merely relative directions or movements. For example, any references to “up” and “down” or “above” or “below” are merely descriptive of the relative position or movement of the related elements.

[0102] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. Changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

CLAIMSWhat is claimed is:

1. A radio and sensor module, comprising:a printed circuit board assembly including electrical components;a sensor configured to determine at least one property of an environment surrounding the radio and sensor module;a radio device comprising:an antenna disposed around a periphery of the printed circuit board assembly, the antenna and the printed circuit board assembly defining a volume; and a radio frequency transceiver in operable communication with the antenna and operably coupled to the printed circuit board assembly; and at least one encapsulant material overlying the printed circuit board assembly and filling at least a portion of the volume defined by the antenna, the antenna forming a barrier for the at least one encapsulant.

2. The radio and sensor module of claim 1, wherein the radio and sensor module is intrinsically safe.

3. The radio and sensor module of claim 1, wherein the radio device comprises a long-range wide area network radio device.

4. The radio and sensor module of claim 1, wherein the antenna comprises a flexible antenna is in a circular shape around the periphery of the printed circuit board and configured to exhibit a circular electromagnetic radiation pattern.

5. The radio and sensor module of claim 1, wherein the antenna comprises projections configured to extend through openings in the printed circuit board assembly.

6. The radio and sensor module of claim 5, wherein the projections and openings facilitate disposing the antenna around the periphery of the printed circuit board in a circular shape.

7. The radio and sensor module of claim 1 , wherein the at least one encapsulant material comprises a two-part epoxy.

8. The radio and sensor module of claim 1, wherein the at least one encapsulant material exhibits a dielectric constant less than about 2.5.

9. The radio and sensor module of claim 1 , wherein the at least one encapsulant material directly contacts a major surface of the antenna.10 The radio and sensor module of claim 1, wherein the sensor comprises a microhotplate.

11. The radio and sensor module of claim 1, wherein a major surface of the antenna is substantially perpendicular to a major surface of the printed circuit board assembly and an electromagnetic radiation pattern of the antenna is substantially parallel to the major surface of the printed circuit board.

12. The radio and sensor module of claim 11, wherein a major surface of the at least one encapsulant material is substantially parallel to the major surface of the printed circuit board assembly.

13. The radio and sensor module of claim 1, wherein the sensor module comprises a gas sensor.

14. A gas sensing instrument, comprising:a radio and sensor module comprising:a gas sensor configured to measure at least one condition proximate the gas sensing instrument;a radio frequency transceiver;an antenna, wherein the antenna forms at least a part of an outer surface of the radio and sensor module; andat least one encapsulant material abutting the antenna and overlying the gas sensor and the radio frequency transceiver; anda battery pack comprising a battery in operable communication with the radio and sensor module.

15. The gas sensing instrument of claim 14, wherein the radio and sensor module further comprises a printed circuit board assembly, the at least one encapsulant material overlying electrically active elements of the printed circuit board assembly.

16. The gas sensing instrument of claim 14, further comprising a housing surrounding the radio and sensor module and the battery.

17. The gas sensing instrument of claim 14, wherein a first portion of the antenna extends above the gas sensor a first height and a second portion of the antenna extends above the gas sensor a second height, the at least one encapsulant material having a height corresponding to the first height.

18. The gas sensing instrument of claim 14, wherein the battery pack comprises a fuse configured to electrically short responsive to exposure to a current higher than about 200 milliamps.

19. The gas sensing instrument of claim 14, further comprising an additional encapsulant material around the battery pack.

20. An intrinsically safe radio and sensor module, comprising:a printed circuit board assembly;at least one sensor coupled to the printed circuit board assembly;a radio device coupled to the printed circuit board assembly;an antenna disposed around a periphery of the printed circuit board assembly, the antenna and a surface of the printed circuit board assembly defining a volume; and an encapsulant material overlying the printed circuit board assembly and contacting surfaces of the antenna.

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