Thermal management component and battery pack
By using adhesive bonding to connect the thermal management board and the current collector in the thermal management system, the problems of high assembly difficulty and cost caused by welding are solved, and efficient, low-cost assembly of thermal management components and improved reliability are achieved.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- EVE ENERGY CO LTD
- Filing Date
- 2025-03-14
- Publication Date
- 2026-06-04
AI Technical Summary
In existing technologies, the thermal management plate and the current collector in the thermal management system are connected by welding, which results in high assembly difficulty, low efficiency and high cost.
The thermal management board and the current collector are connected by adhesive bonding. The connecting adhesive layer consists of a sealing adhesive layer and a structural adhesive layer, which simplifies the assembly process and improves the reliability of the connection.
It simplifies the assembly process of thermal management components, improves assembly efficiency, reduces material costs, enhances sealing and reliability, adapts to temperature changes, and reduces the risk of fluid leakage.
Smart Images

Figure CN2025082619_04062026_PF_FP_ABST
Abstract
Description
Thermal management components and battery pack
[0001] This application claims priority to Chinese Patent Application No. 202422911406.7, filed on November 27, 2024, the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of battery technology, specifically to a thermal management component and a battery pack. Background Technology
[0003] To maintain battery operation within a suitable temperature range, a thermal management system is required to heat or cool the battery. In related technologies, the thermal management system includes piping, heat pipe components connected to the piping, and a temperature regulation module that regulates the temperature of the heat exchange medium within the piping. Multiple heat pipe components are connected in parallel within the piping. The thermal management components are thermally coupled to the battery cell to regulate its temperature.
[0004] The thermal management component includes a current collector and a thermal management plate that is plugged into the current collector at one end. The thermal management plate has a flow channel inside, which is connected to the inner cavity of the current collector, so that the current collector can supply and drain liquid to the flow channel of the thermal management plate to realize the circulation of the heat exchange medium. Invention Overview
[0005] Because the current collector and the heat management plate are connected and sealed by welding, the assembly of the current collector and the heat management plate is difficult and the assembly efficiency is low, resulting in a high assembly cost of the heat management system.
[0006] In a first aspect, this application provides a thermal management component, which includes a current collector, a thermal management plate, and a connecting adhesive layer; the current collector has an inner cavity and a plug hole communicating with the inner cavity; the thermal management plate has a flow channel, one end of the thermal management plate is inserted into the plug hole, and the flow channel communicates with the inner cavity; the connecting adhesive layer includes a sealing adhesive layer and a structural adhesive layer, both of which are located between the hole wall of the plug hole and the outer peripheral surface of the thermal management plate, and both the sealing adhesive layer and the structural adhesive layer extend in an annular shape along the circumferential direction of the plug hole.
[0007] Secondly, this application provides a battery pack, which includes a battery cell array and the aforementioned thermal management components; there are multiple battery cell arrays arranged sequentially along a first direction, and each battery cell array includes multiple battery cells arranged sequentially along a second direction; there are multiple thermal management components; along the first direction, the multiple thermal management components and the multiple battery cell arrays are sequentially and alternately distributed. Beneficial effects
[0008] This application simplifies the assembly steps of the thermal management components by bonding the thermal management plate to the current collector, thereby shortening the time for connecting and fixing the thermal management plate to the current collector, and thus improving the assembly efficiency of the thermal management components. Attached Figure Description
[0009] Figure 1 is a schematic diagram of the structure of the thermal management component provided in an embodiment of this application;
[0010] Figure 2 is a top view of the thermal management component provided in an embodiment of this application;
[0011] Figure 3 is a cross-sectional view along AA in Figure 2;
[0012] Figure 4 is an enlarged view of point B in Figure 2;
[0013] Figure 5 is a cross-sectional view along CC in Figure 2;
[0014] Figure 6 is an enlarged view of point D in Figure 5;
[0015] Figure 7 is an enlarged schematic diagram of another structure at point B provided in the embodiment of this application;
[0016] Figure 8 is a schematic diagram of the current collector structure provided in an embodiment of this application;
[0017] Figure 9 is a schematic diagram of the structure of two current collector plug-in connections provided in an embodiment of this application;
[0018] Figure 10 is a cross-sectional view of a current collector provided in an embodiment of this application;
[0019] Figure 11 is a schematic diagram of the battery pack structure provided in an embodiment of this application;
[0020] Figure 12 is a schematic diagram of the connection between the thermal management component and the temperature regulation module provided in an embodiment of this application.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1-Current collector; 11-Current collector unit;
[0023] 12-Main body; 121-Inner cavity; 122-Insertion hole; 123-First hole; 124-Second hole;
[0024] 13-Male end fitting; 133-Wedge block;
[0025] 14-Female end pipe fitting; 142-Second equal diameter section; 143-Second flared section;
[0026] 15-Flexible sleeve; 152-First equal diameter section; 153-First trumpet section;
[0027] 2-Thermal management component; 21-Thermal management plate; 211-Connecting end face; 22-Flow channel; 23-Plug-in end;
[0028] 24-Connecting adhesive layer; 243-Sealant layer; 244-Structural adhesive layer;
[0029] 3-Heat pipe system; 31-Liquid inlet pipe; 32-Liquid outlet pipe; 33-Temperature control module;
[0030] 4-Battery pack; 41-Battery cell. Embodiments of the present invention
[0031] The following describes in detail, with reference to Figures 1 to 12, an embodiment of the present application that provides a thermal management component and a battery pack.
[0032] Please refer to Figures 1 to 3. Figure 1 is a structural schematic diagram of the thermal management component 2 provided in an embodiment of this application. Figure 2 is a top view of the thermal management component 2 provided in an embodiment of this application. Figure 3 is a cross-sectional view along line AA in Figure 2. An embodiment of this application provides a thermal management component 2. The thermal management component 2 includes a current collector 1, a thermal management plate 21, and a connecting adhesive layer 24. The current collector 1 has an inner cavity 121 and a insertion hole 122 communicating with the inner cavity 121. The thermal management plate 21 has a flow channel 22. One end of the thermal management plate 21 is inserted into the insertion hole 122. The flow channel 22 communicates with the inner cavity 121. The connecting adhesive layer 24 includes a sealing adhesive layer 243 and a structural adhesive layer 244, as shown in Figure 4, which is an enlarged view of point B in Figure 2. Both the sealing adhesive layer 243 and the structural adhesive layer 244 are located between the wall of the insertion hole 122 and the outer peripheral surface of the thermal management plate 21. Both the sealant layer 243 and the structural adhesive layer 244 extend in annular shape along the circumference of the insertion hole 122.
[0033] The adhesive used to form the bonding layer 24 can be made of materials such as silane system, epoxy system, or polyurethane.
[0034] As can be understood, sealant is a flowable adhesive that is applied to joints. Its flow facilitates coverage of the sealing surface; after curing, it forms a structurally stable adhesive layer, improving the reliability of the connection between two components. After curing, sealant typically possesses a degree of elasticity, allowing it to accommodate joint expansion and contraction caused by temperature changes or other factors.
[0035] As is understandable, structural adhesive is a high-strength adhesive used for structural bonding, capable of withstanding large loads and stresses.
[0036] Optionally, the heat management plate 21 has a harmonica tube structure and multiple parallel flow channels 22 inside.
[0037] It is understood that when the two ports of the flow channel 22 are located at the two ends of the heat management plate 21, one port of the flow channel 22 is connected to the inner cavity 121 of a current collector 1. The other end of the flow channel 22 can be connected to the inner cavity 121 of another current collector 1, or to other components.
[0038] When the two ports of the flow channel 22 are located at the same end of the thermal management plate 21, the flow channel 22 is U-shaped. In this case, the inner cavity 121 can be divided into an inlet chamber and an outlet chamber, and the two ports of the flow channel 22 are connected to the inlet chamber and the outlet chamber, respectively. In this way, the inlet and outlet of the thermal management plate 21 can be located on the same side, thereby controlling the size of the thermal management plate 21 to reduce the space occupied by the thermal management plate 21 within the entire battery pack 4.
[0039] It is understood that when assembling the heat management plate 21 and the current collector 1, adhesive can be applied to the wall of the insertion hole 122, and then one end of the heat management plate 21 can be inserted into the insertion hole 122 to form a connecting adhesive layer 24, thereby sealing the outer wall of the heat management plate 21 with the inner wall of the insertion hole 122. Alternatively, adhesive can be applied to the part of the outer wall of the heat management plate 21 that mates with the insertion hole 122, and then one end of the heat management plate 21 can be inserted into the insertion hole 122 to form a connecting adhesive layer 24, thereby sealing the outer wall of the heat management plate 21 with the inner wall of the insertion hole 122.
[0040] In this embodiment, by bonding the thermal management plate 21 to the current collector 1, the assembly steps of the thermal management component 2 can be simplified, thereby shortening the time for connecting and fixing the thermal management plate 21 and the current collector 1, and thus improving the assembly efficiency of the thermal management component 2.
[0041] Meanwhile, by using a sealing layer 243 and a structural adhesive layer 244 to form a connecting adhesive layer 24, the connection between the thermal management plate 21 and the current collector 1 has good sealing performance to avoid fluid leakage, and the connection between the thermal management plate 21 and the current collector 1 has high strength, so as to withstand a large load and improve the reliability of the thermal management component 2.
[0042] Furthermore, by using adhesive bonding, the current collector 1, which does not exchange heat with the battery 4, can be made of other materials, such as plastic. This reduces the material cost of the current collector 1 and the weight of the thermal management component 2, facilitating a lightweight design for the thermal management system.
[0043] Furthermore, by using adhesive bonding, the adhesive can fill the tiny gaps between the heat management plate 21 and the current collector 1, thereby providing a good sealing effect and effectively preventing leakage of the heat exchange medium.
[0044] Referring to Figure 4, in one embodiment, the sealant layer 243 and the structural adhesive layer 244 are sequentially disposed along the direction away from the bottom of the insertion hole 122. This effectively avoids the influence of the heat exchange medium on the structural adhesive, thereby improving the stability of the structural adhesive and thus enhancing the structural reliability of the thermal management component 2.
[0045] Please refer to Figure 4. In one embodiment, along the axial direction of the insertion hole 122, the thermal management plate 21 is inserted into the insertion hole 122 with a length dimension A, the sealant layer 243 has a length dimension B, and the structural adhesive layer 244 has a length dimension C, satisfying: 1mm≤B≤A-1mm, C=AB.
[0046] In this embodiment, the above solution can ensure the minimum length of the sealant layer 243 to guarantee the sealing between the heat management plate 21 and the current collector 1, and also provide space for the structural adhesive between the heat management plate 21 and the current collector 1, so that the bonded part between the heat management plate 21 and the current collector 1 has both sealing performance and high strength to withstand large loads.
[0047] Please refer to Figures 5 and 6. Figure 5 is a cross-sectional view along CC in Figure 2, and Figure 6 is an enlarged view of point D in Figure 5. In one embodiment, the portion of the adhesive layer 24 located between the wall of the insertion hole 122 and the outer peripheral surface of the thermal management plate 21 along the radial direction of the insertion hole 122 has a thickness dimension D1, satisfying: 1mm ≤ D1 ≤ 15mm.
[0048] It is understood that the thickness dimension D1 includes, but is not limited to, 2mm, 3mm, 4mm, 6mm, 7mm, 8mm, 10mm, 12mm, 13mm, 14mm, and 15mm.
[0049] It is understood that the connecting adhesive layer 24 is located between the hole wall of the insertion hole 122 and the outer peripheral surface of the heat management plate 21. Specifically, it can be a sealing adhesive layer 243, a structural adhesive layer 244, or a combination of sealing adhesive layer 243 and structural adhesive layer 244.
[0050] In this embodiment, the above-mentioned settings can improve the connection strength and sealing between the thermal management plate 21 and the current collector 1, thereby improving the reliability of the thermal management component 2; and can also avoid the thermal management component 2 being too large, thus helping to ensure the compact design of the battery 4.
[0051] In addition to the structure of the connecting adhesive layer 24 shown in Figure 4, other embodiments of this application may also employ a connecting adhesive layer 24 with the following structure. Please refer to Figure 7, which is an enlarged schematic diagram of another structure at point B provided in an embodiment of this application. In one embodiment, the thermal management plate 21 has a connecting end face 211 facing the bottom of the insertion hole 122. Along the axial direction of the insertion hole 122, the portion of the connecting adhesive layer 24 located between the connecting end face 211 and the bottom of the insertion hole 122 has a length dimension L1, satisfying: 2mm ≤ L1 ≤ 50mm.
[0052] The length dimension L1 includes, but is not limited to, 2mm, 3mm, 4mm, 6mm, 7mm, 8mm, 10mm, 12mm, 13mm, 14mm, 16mm, 17mm, 18mm, 20mm, 22mm, 23mm, 24mm, 26mm, 27mm, 28mm, 30mm, 32mm, 33mm, 34mm, 36mm, 37mm, 38mm, 40mm, 42mm, 43mm, 44mm, 46mm, 47mm, 28mm, and 50mm.
[0053] It can be understood that the length L1 of the part of the connecting adhesive layer 24 located between the connecting end face 211 and the bottom of the insertion hole 122 specifically refers to the total length of the adhesive layer composed of the sealing adhesive layer 243 and the structural adhesive layer 244.
[0054] In this embodiment, the above-mentioned settings can improve the connection strength and sealing between the thermal management plate 21 and the current collector 1, thereby improving the reliability of the thermal management component 2; and can also avoid the thermal management component 2 being too large, thus helping to ensure the compact design of the battery 4.
[0055] The insertion hole 122 is a tapered hole, and its diameter gradually decreases as it approaches the inner cavity 121. When the insertion hole 122 is a tapered hole, the thickness dimension D1 refers to the thickness dimension of the part of the connecting adhesive layer 24 located between the end periphery of the heat management plate 21 and the wall of the tapered hole.
[0056] Please refer to Figure 7. In one embodiment, the connecting adhesive layer 24 has a length dimension L2 along the axial direction of the insertion hole 122, and the depth dimension of the thermal management plate 21 inserted into the insertion hole 122 is A, which satisfies: A+2mm≤L2≤A+50mm.
[0057] The length dimension L2 of the connecting adhesive layer 24 includes, but is not limited to, A+2mm, A+6mm, A+12mm, A+18mm, A+25mm, A+29mm, A+30mm, A+35mm, A+39mm, A+40mm, A+42mm, A+45mm, A+48mm, and A+50mm.
[0058] In this embodiment, the above-mentioned limitations can improve the connection strength and sealing between the thermal management plate 21 and the current collector 1, thereby improving the reliability of the thermal management component 2; and can also avoid the thermal management component 2 being too large, thus helping to ensure the compact design of the battery 4.
[0059] Please refer to Figure 7. In one embodiment, the length of the thermal management plate 21 inserted into the plug hole 122 is A, which satisfies: 2mm≤A≤100mm.
[0060] The length dimension A of the heat management plate 21 inserted into the plug hole 122 includes, but is not limited to, 2mm, 3mm, 4mm, 6mm, 7mm, 8mm, 10mm, 12mm, 16mm, 18mm, 20mm, 24mm, 26mm, 27mm, 30mm, 32mm, 37mm, 38mm, 40mm, 43mm, 44mm, 28mm, 50mm, 52mm, 54mm, 58mm, 60mm, 62mm, 63mm, 66mm, 68mm, 70mm, 73mm, 76mm, 77mm, 80mm, 84mm, 86mm, 88mm, 90mm, 94mm, 96mm, 98mm, and 100mm.
[0061] In the embodiments of this application, by limiting the length dimension A of the thermal management plate 21 inserted into the plug hole 122, on the one hand, the fitting strength between the thermal management plate 21 and the plug hole 122 can be guaranteed, thereby improving the reliability of the connection between them; on the other hand, the size of the thermal management component 2 can be avoided from being too large, thus helping to ensure the compact design of the battery 4.
[0062] Please refer to Figure 8, which is a structural schematic diagram of the current collector 1 provided in an embodiment of this application. In one embodiment, the current collector 1 includes a current collection unit 11. The current collection unit 11 includes a main body 12, a male end connector 13, a female end connector 14, and a flexible sleeve 15. The main body 12 is provided with an inner cavity 121, a insertion hole 122, and a first hole 123 and a second hole 124 communicating with the inner cavity 121. The male end connector 13 is connected to the current collector 1 and communicates with the first hole 123. The female end connector 14 is connected to the current collector 1 and communicates with the second hole 124. The flexible sleeve 15 is connected to one of the male end connector 13 and the female end connector 14. The flexible sleeve 15 is disposed on the inner wall of the female end connector 14. The flexible sleeve 15 is configured to be sleeved on the male end connector 13 when the female end connector 14 of one thermal management component 2 is inserted into the male end connector 13 of another thermal management component 2, and is in an elastically compressed state in the radial direction, as shown in FIG9. FIG9 is a schematic diagram of the structure of two current collectors 1 inserted according to an embodiment of the present application.
[0063] It is understandable that when the two current collectors 1 are connected, the flexible sleeve 15 is located between the inner circumferential surface of the female end connector 14 and the outer circumferential surface of the male end connector 13.
[0064] The inner diameter of the flexible sleeve 15 is smaller than the outer diameter of the male end connector 13, and the interpolation between them is the radial compression amount E of the flexible sleeve 15, which satisfies: 2mm≤E≤8mm. In this way, both sealing stability and operability of connecting the male end connector 13 of one manifold 1 to the female end connector 14 of another manifold 1 can be effectively guaranteed.
[0065] Furthermore, when the current collector 1 includes one current collector unit 11, the current collector unit 11 can serve as either the liquid inlet end or the liquid outlet end of the flow channel 22 of the heat management plate 21. When the current collector 1 includes two current collector units 11, the two current collector units 11 serve as the liquid inlet end and the liquid outlet end of the flow channel 22 of the heat management plate 21, respectively. Optionally, the two current collector units 11 can be connected to allow liquid inlet and outlet at the same end of the heat management plate 21, thereby improving the structural compactness of the heat management system.
[0066] In this embodiment, by setting the flexible sleeve 15, not only can the sealing of the two manifold 1 insertion parts be achieved, but also the flexible sleeve 15 can make the male end pipe joint 13 and the female end pipe joint 14 have a longer sealing length. Thus, the elastic deformation of the flexible sleeve 15 can be used to absorb assembly tolerances and material tolerances, thereby reducing assembly difficulty and improving assembly efficiency.
[0067] Furthermore, by absorbing assembly tolerances and material tolerances through the elastic deformation of the flexible sleeve 15, the stress state of related components can be improved, thereby enhancing the connection reliability of related components and thus improving the reliability of the thermal management system.
[0068] Optionally, the hardness of the flexible sleeve 15 is 40~90 Shore A. This allows the flexible sleeve 15 to meet the sealing requirements between the male end fitting 13 and the female end fitting 14.
[0069] Optionally, the flexible sleeve 15 may be made of one of the following materials: EPDM (ethylene propylene diene monomer rubber), TPE (thermoplastic elastomer), or TPU (thermoplastic polyurethane). EPDM exhibits excellent aging resistance, a long service life, and good flexibility even at low temperatures. TPE is a thermoplastic material with good flowability and plasticity, allowing for various processing methods such as injection molding, extrusion, and blow molding. The processing is simple, quick, and efficient. Furthermore, TPE's good flexibility allows it to better adapt to irregular surfaces in sealing applications, ensuring a good seal. TPU possesses high tensile strength, tear strength, and abrasion resistance, along with good elasticity and resilience.
[0070] Please refer to Figure 10, which is a cross-sectional view of the current collector 1 provided in an embodiment of this application. In one embodiment, the flexible sleeve 15 includes a first equal-diameter section 152 and a first flared section 153 connected to each other. The outer peripheral surface of the first equal-diameter section 152 is connected to the inner peripheral surface of the female end connector 14. The first flared section 153 is located at the end of the first equal-diameter section 152 away from the main body 12. Along the direction away from the main body 12, the first flared section 153 gradually increases in size. In this way, when the male end connector 13 and the female end connector 14 are inserted, the first flared section 153 can guide the male end connector 13, thereby improving the smoothness of the insertion between them and thus improving the assembly efficiency.
[0071] Referring to Figure 10, in one embodiment, the female end connector 14 includes a second equal-diameter section 142 and a second flared section 143. The outer peripheral surface of the first equal-diameter section 152 is connected to the inner peripheral surface of the second equal-diameter section 142. The outer peripheral surface of the first flared section 153 is connected to the inner peripheral surface of the second flared section 143. This increases the connection surface area between the female end connector 14 and the flexible sleeve 15, thereby improving the reliability of their connection.
[0072] Referring to Figure 10, in one embodiment, a wedge-shaped block 133 is provided on the outer peripheral surface of the male end connector 13. The inclined wedge surface of the wedge-shaped block 133 faces away from the main body 12, and the wedge-shaped block 133 extends in a ring shape along the circumference of the male end connector 13. In this way, not only can the wedge-shaped block 133 guide the insertion between the male end connector 13 and the female end connector 14, improving assembly efficiency, but the wedge-shaped block 133 can also increase the interference fit between the flexible sleeve 15 and the male end connector 13, thereby improving the sealing performance between the male end connector 13 and the female end connector 14.
[0073] Referring to Figures 11 or 10, in one embodiment, there are two current collector units 11. The bodies 12 of the two current collector units 11 are connected. The insertion holes 122 of the two current collector units 11 are located on the same side of the current collector 1. The male end connectors 13 of the two current collector units 11 face the same direction. The female end connectors 14 of the two current collector units 11 face the same direction. One end of the heat management plate 21 is inserted into the insertion hole 122, which is called the insertion end 23. A portion of the insertion end 23 is located in the insertion hole 122 of one current collector unit 11, and the other portion is located in the insertion hole 122 of the other current collector unit 11. The flow channel 22 is U-shaped, and its two ports communicate with the inner cavities 121 of the two current collector units 11, respectively.
[0074] Optionally, in each current collection unit 11, the male end connector 13 and the female end connector 14 are coaxially arranged.
[0075] In this embodiment, the two flow collection units 11 can be used as the inlet and outlet of the flow channel 22 of the thermal management plate 21, respectively, so that liquid can be fed and discharged at the same end of the thermal management plate 21, thereby improving the structural compactness of the thermal management system and reducing the space occupied by the thermal management system.
[0076] In addition, the U-shaped flow channel 22 can also give the thermal management component 2 better temperature uniformity.
[0077] In one embodiment, the current collector 1 is an injection-molded part, and / or, the thermal management plate 21 is a metal plate.
[0078] In this embodiment, the current collector 1 is an injection-molded part, which can improve the molding efficiency of the current collector 1 and control the weight and manufacturing cost of the thermal management system. The thermal management plate 21 is a metal plate, which can effectively ensure the heat exchange efficiency between the thermal management plate 21 and the battery cell 41.
[0079] The main body 12, male end connector 13, and female end connector 14 are injection molded together. After these three components are formed, the flexible sleeve 15 is then injection molded onto either the male end connector 13 or the female end connector 14.
[0080] Optionally, the material of the heat management plate 21 is aluminum alloy. The coefficient of thermal expansion of the current collector 1 is 15×10⁻⁶ / ℃ to 30×10⁻⁶ / ℃. Optionally, the material of the current collector 1 is one of the following: PA66 / GF25 (polyamide 66 material containing 25% glass fiber), PA66 / GF30 (polyamide 66 material containing 30% glass fiber), or PC / ABS (a plastic alloy material composed of polycarbonate and acrylonitrile-butadiene-styrene copolymer). This not only ensures that the heat management plate 21 has good thermal conductivity, but also makes the coefficient of thermal expansion of the current collector 1 similar to that of the heat management plate 21, effectively preventing cracks at the interface between them during thermal expansion and contraction.
[0081] In one embodiment, the thermal management plate 21 is a serpentine plate. This allows for a larger contact surface with the cylindrical battery cell 41 when applied, thereby improving thermal management efficiency.
[0082] For example, the heat management board 21 has a harmonica tube structure, and an insulating layer is provided on the surface of the harmonica tube structure.
[0083] Optionally, the insulating layer may be epoxy resin powder sprayed onto the surface of the thermal management plate 21, or it may be an insulating film attached to the surface of the thermal management plate 21. The materials of the insulating film include, but are not limited to, PET, PI, PVC, and PI+PET composite materials.
[0084] Compared to spraying epoxy resin powder, the insulating film allows for higher precision in the thickness of the insulation layer formed on the surface of the thermal management plate 21, and the cost of setting the insulation layer is lower, which helps to improve the yield of incoming materials for the thermal management plate 21. The use of PET, PI, PVC, and PI+PET composite materials can effectively ensure the insulation stability and pressure resistance and puncture resistance of the insulating film attached to the serpentine tube.
[0085] Please refer to Figure 11, which is a schematic diagram of the structure of a battery pack 4 provided in an embodiment of this application. Accordingly, an embodiment of this application provides a battery pack 4. The battery pack 4 includes rows of battery cells 41 and a thermal management system provided in some embodiments of this application. There are multiple rows of battery cells 41. The multiple rows of battery cells 41 are arranged sequentially along a first direction. Each row of battery cells 41 includes multiple battery cells 41 arranged sequentially along a second direction. There are multiple thermal management components 2. Along the first direction, the multiple thermal management components 2 and the multiple rows of battery cells 41 are distributed alternately.
[0086] The first direction is parallel to the direction in which the male end connector 13 and the female end connector 14 are inserted. The second direction is parallel to the extension direction of the liquid cooling plate.
[0087] Specifically, the inlet ends of the flow channels 22 of two adjacent thermal management components 2 are connected, and the outlet ends of the flow channels 22 of two adjacent thermal management components 2 are connected. Specifically, in two adjacent thermal management components 2, the male end connector 13 of one thermal management component 2 is inserted into the female end connector 14 of the other thermal management component 2, thereby connecting the inlet ends of the flow channels 22 of two adjacent thermal management components 2 and the outlet ends of the flow channels 22 of two adjacent thermal management components 2.
[0088] It is understood that the battery pack 4 also includes components such as a battery box and connecting strips. The battery cells 41 and the thermal management components 2 are located inside the battery box. The connecting strips connect multiple battery cells 41 in series or in parallel.
[0089] In this embodiment, by employing the thermal management system provided in some embodiments of this application, the thermal management plate 21 is bonded to the current collector 1, thereby simplifying the assembly steps of the thermal management component 2 and shortening the time required to connect and fix the thermal management plate 21 to the current collector 1. This improves the assembly efficiency of the battery pack 4.
[0090] The battery pack 4 may further include an inlet pipe 31, an outlet pipe 32, and a temperature regulation module 33. The inlet pipe 31 is connected to the inlet end of the flow channel 22 of a thermal management component 2. The outlet pipe 32 is connected to the outlet end of the flow channel 22 of a thermal management component 2. The two ports of the temperature regulation module 33 are connected to the inlet pipe 31 and the outlet pipe 32, respectively, as shown in Figure 12. Figure 12 is a schematic diagram of the connection between the thermal management component 2 and the temperature regulation module 33 provided in the embodiment of this application. The temperature regulation module 33 is configured to regulate the temperature of the heat exchange medium from the outlet pipe 32 and send the regulated heat exchange medium to the inlet pipe 31.
[0091] It is understood that the temperature regulation module 33 may include a compressor, condenser and evaporator connected by pipes, and is equipped with a valve body to achieve cooling or heating of the battery cell.
Claims
1. A thermal management component (2), comprising: The current collector (1) has an inner cavity (121) and a plug hole (122) communicating with the inner cavity (121); A heat management plate (21) has a flow channel (22), one end of the heat management plate (21) is inserted into the insertion hole (122), and the flow channel (22) communicates with the inner cavity (121); The connecting adhesive layer (24) includes a sealant layer (243) and a structural adhesive layer (244). The sealant layer (243) and the structural adhesive layer (244) are both located between the hole wall of the insertion hole (122) and the outer peripheral surface of the heat management plate (21). The sealant layer (243) and the structural adhesive layer (244) both extend in annular shape along the circumference of the insertion hole (122).
2. The thermal management component (2) according to claim 1, wherein, The sealant layer (243) and the structural adhesive layer (244) are sequentially arranged along the direction away from the bottom of the insertion hole (122).
3. The thermal management component (2) according to claim 2, wherein, Along the axial direction of the insertion hole (122), the length of the thermal management plate (21) inserted into the insertion hole (122) is A, the length of the sealant layer (243) is B, and the length of the structural adhesive layer (244) is C, satisfying: 1mm≤B≤A-1mm, C=AB.
4. The thermal management component (2) according to claim 1, wherein, Along the radial direction of the insertion hole (122), the thickness D1 of the portion of the connecting adhesive layer (24) located between the hole wall of the insertion hole (122) and the outer peripheral surface of the thermal management plate (21) satisfies: 1mm≤D1≤15mm.
5. The thermal management component (2) according to any one of claims 1-4, wherein, The thermal management plate (21) has a connecting end face (211) facing the bottom of the plug hole (122). Along the axial direction of the plug hole (122), the connecting adhesive layer (24) located between the connecting end face (211) and the bottom of the plug hole (122) has a length dimension L1, which satisfies: 2mm≤L1≤50mm.
6. The thermal management component (2) according to claim 5, wherein, Along the axial direction of the insertion hole (122), the connecting adhesive layer (24) has a length dimension L2, and the depth dimension of the thermal management plate (21) inserted into the insertion hole (122) is A, satisfying: A+2mm≤L2≤A+50mm.
7. The thermal management component (2) according to any one of claims 1-6, wherein, Along the axial direction of the insertion hole (122), the length of the thermal management plate (21) inserted into the insertion hole (122) is A, which satisfies: 2mm≤A≤100mm.
8. The thermal management component (2) according to any one of claims 1-7, wherein, The current collector (1) includes a current collection unit (11), which comprises: The main body (12) is provided with the inner cavity (121), the insertion hole (122), and a first hole (123) and a second hole (124) communicating with the inner cavity (121); The male end pipe connector (13) is connected to the current collector (1) and communicates with the first hole (123); The female end pipe connector (14) is connected to the current collector (1) and communicates with the second hole (124); A flexible sleeve (15) is disposed on the inner wall of the female end pipe joint (14); The flexible sleeve (15) is configured to be sleeved on the male end connector (13) when the female end connector (14) of one thermal management component (2) is inserted into the male end connector (13) of another thermal management component (2), and is in an elastically compressed state in the radial direction.
9. The thermal management component (2) according to claim 8, wherein, The flexible sleeve (15) includes a first equal diameter section (152) and a first flared section (153) connected to each other. The outer circumferential surface of the first equal diameter section (152) is connected to the inner circumferential surface of the female end pipe joint (14). The first flared section (153) is located at the end of the first equal diameter section (152) away from the main body (12). Along the direction away from the main body (12), the first flared section (153) gradually increases in size.
10. The thermal management component (2) according to claim 9, wherein, The female end connector (14) includes a second equal diameter section (142) and a second horn section (143). The outer circumferential surface of the first equal diameter section (152) is connected to the inner circumferential surface of the second equal diameter section (142), and the outer circumferential surface of the first horn section (153) is connected to the inner circumferential surface of the second horn section (143).
11. The thermal management component (2) according to claim 8 or 9, wherein, The male end pipe connector (13) is provided with a wedge block (133) on its outer peripheral surface. The inclined wedge surface of the wedge block (133) is away from the main body (12), and the wedge block (133) extends in a ring along the circumference of the male end pipe connector (13).
12. The thermal management component (2) according to any one of claims 9-11, wherein, There are two current collector units (11), and the main bodies (12) of the two current collector units (11) are connected. The insertion holes (122) of the two current collector units (11) are located on the same side of the current collector (1). The male end connectors (13) of the two current collector units (11) face the same direction, and the female end connectors (14) of the two current collector units (11) face the same direction. The portion of the heat management plate (21) inserted into the insertion hole (122) is the insertion end (23). A portion of the insertion end (23) is located in the insertion hole (122) of one of the current collection units (11), and the other portion is located in the insertion hole (122) of another current collection unit (11). The flow channel (22) is U-shaped, and its two ports are respectively connected to the inner cavity (121) of the two current collection units (11).
13. A battery pack (4), comprising: Multiple battery cells (41) are arranged in a first direction, and each battery cell (41) column includes multiple battery cells (41) arranged in a second direction. And, the thermal management component (2) as described in any one of claims 1-12, there are multiple thermal management components (2), and along the first direction, the multiple thermal management components (2) and the multiple battery cells (41) are arranged alternately.