Encapsulation structure for display apparatus, and display apparatus and electronic device

Abstract

An encapsulation structure for a display apparatus, and a display apparatus and an electronic device. The encapsulation structure comprises: a display chip, which has a light emission side, wherein the display chip comprises a display region and a first electrode region located on the outer side of the display region; a heat dissipation layer, wherein the surface of the heat dissipation layer is partially in contact with the display chip; a circuit board, which comprises a second electrode region, wherein the second electrode region is arranged on a side surface of the heat dissipation layer, the first electrode region is electrically connected to the second electrode region, and the extension direction of the circuit board intersects with the extension direction of the display chip; and an encapsulation layer, which covers the periphery of the display chip and at least covers the electrical connection part between the first electrode region and the second electrode region, and exposes the display region. In the encapsulation structure, the extension direction of the circuit board intersects with the extension direction of the display chip, and therefore the bezel size is effectively reduced, thereby achieving a narrow bezel design for a display apparatus.

Description

Packaging structures for display devices, display devices, and electronic devices. Technical Field

[0001] This application relates to the field of display technology, and in particular to a packaging structure for a display device and a display device. Background Technology

[0002] LED miniaturization technology refers to integrating a high-density, micrometer-sized LED array onto a single driver chip, with pixels at the micrometer level. Miniaturized LEDs feature high efficiency, high brightness, fast response speed, and energy saving, while eliminating the need for a backlight, thus offering broad application prospects.

[0003] In related technologies, during LED chip packaging, both the LED chip and the circuit board are mounted on a heat sink, and wires are used to connect the FPC electrodes to the electrodes on the chip. Then, the wires are protected through a packaging process.

[0004] However, in the above solution, if the packaged chip is used as the display, the edge size formed by the package is relatively large, which does not meet the user's demand for narrow bezel displays. Summary of the Invention

[0005] This application provides a packaging structure for a display device, a display device, and an electronic device. In the packaging structure, the extension direction of the circuit board and the display chip intersects, which can reduce the size of the second electrode area and reduce the width of the bezel of the packaging structure, thus meeting the user's demand for narrow bezel displays.

[0006] In a first aspect, embodiments of this application provide a packaging structure for a display device, applied to a miniaturized display device, the packaging structure comprising:

[0007] The display chip has a light-emitting side, and the display chip includes a display area and a first electrode area located outside the display area;

[0008] A heat dissipation layer, with a portion of its surface in contact with the display chip;

[0009] The circuit board includes a second electrode region disposed on one side of the heat dissipation layer, and the first electrode region is electrically connected to the second electrode region; and the extension direction of the circuit board intersects the extension direction of the display chip.

[0010] An encapsulation layer covers the periphery of the display chip and at least the electrical connection between the first electrode region and the second electrode region, and exposes the display area.

[0011] In one possible implementation, the heat dissipation layer includes a first heat dissipation segment and a second heat dissipation segment, the first heat dissipation segment being connected to the second heat dissipation segment, and the extending direction of the first heat dissipation segment intersecting the extending direction of the second heat dissipation segment.

[0012] The first heat dissipation section covers at least a portion of the surface of the display chip on the side opposite to the light-emitting side, and the second heat dissipation section covers at least the second electrode area.

[0013] In one possible implementation, the angle between the extending direction of the first heat dissipation segment and the extending direction of the second heat dissipation segment is a right angle.

[0014] In one possible implementation, both the second heat dissipation section and the second electrode region are located on the side of the display chip away from the light-emitting side;

[0015] Along the surface extension direction of the display chip, the second heat dissipation section is located between the second electrode region and the first heat dissipation section.

[0016] In one possible implementation, the end of the second electrode region facing the light-emitting side is not higher than the plane where the light-emitting side is located;

[0017] And / or,

[0018] The end of the second electrode region facing the light-emitting side is not lower than the plane of the end of the second heat dissipation section facing away from the light-emitting side.

[0019] In one possible implementation, the end of the second electrode region facing the light-emitting side is flush with the plane containing the light-emitting side;

[0020] or,

[0021] The end of the second electrode region facing the light-emitting side is flush with the plane of the end of the first heat dissipation section facing the light-emitting side.

[0022] In one possible implementation, along the extension direction perpendicular to the display chip,

[0023] The orthographic projection of the second heat dissipation section onto the display chip is covered by the display chip;

[0024] or,

[0025] The second heat dissipation section is interleaved with the display chip in its orthographic projection onto the display chip.

[0026] or,

[0027] The first heat dissipation segment is interleaved with the display chip in its orthogonal projection onto the display chip.

[0028] In one possible implementation, the circuit board further includes an external area.

[0029] The external region is located on the side of the circuit board away from the second electrode region, and the external region is used to connect to external circuits.

[0030] In one possible implementation, along an extension direction perpendicular to the display chip, the orthographic projection of the outer region onto the display chip is covered by the display chip;

[0031] The second heat dissipation section is located away from the light-emitting side and abuts against the external area.

[0032] In one possible implementation, both the second heat dissipation section and the second electrode region are located on the light-emitting side of the display chip;

[0033] Along the surface extension direction of the display chip, the second electrode region and the first heat dissipation section are both located on the same side of the second heat dissipation section;

[0034] The second heat dissipation section covers the second electrode area and part of the display chip.

[0035] Secondly, embodiments of this application provide a display device, including a connecting clip and the aforementioned encapsulation structure;

[0036] The connecting clip is attached to the edge of the outer area of ​​the circuit board.

[0037] Thirdly, embodiments of this application also provide an electronic device, including the aforementioned display device.

[0038] The packaging structure, display device, and electronic device provided in this application embodiment, by setting intersecting circuit boards and display chips, reduce the size of the second electrode area and the bezel size compared to the electrode width of the electrode area and the electrode width of the display chip in related technologies, enabling the display device to achieve a narrower bezel design. The heat dissipation layer effectively and quickly conducts heat generated by the display chip, improving the heat dissipation performance of the display device and extending its lifespan. The packaging layer protects the wires, circuit boards, and electrodes on the circuit boards from external environmental influences and prevents mechanical damage, improving the reliability and durability of the display device and electronic device. Attached Figure Description

[0039] To more clearly illustrate the implementation methods in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0040] Figure 1 is a bottom-view structural diagram of a display device provided in an embodiment of this application;

[0041] Figure 2 is a top view of one of the display devices provided in the embodiments of this application;

[0042] Figure 3 is a schematic diagram of the first type of cross-sectional structure at point A-A' in Figure 2;

[0043] Figure 4 is a schematic diagram of the second cross-sectional structure at point A-A' in Figure 2;

[0044] Figure 5 is a schematic diagram of the third cross-sectional structure at point A-A' in Figure 2;

[0045] Figure 6 is a schematic diagram of the fourth cross-sectional structure at point A-A' in Figure 2;

[0046] Figure 7 is a schematic diagram of the fifth cross-sectional structure at point A-A' in Figure 2;

[0047] Figure 8 is a schematic diagram of the sixth cross-sectional structure at point A-A' in Figure 2;

[0048] Figure 9 is a schematic diagram of the seventh cross-sectional structure at point A-A' in Figure 2.

[0049] Explanation of reference numerals in the attached drawings: 10, Display device; 100, Package structure; 110, Display chip; 111, Display area; 112, Non-display area; 113, First electrode area; 120, Heat dissipation layer; 121, First heat dissipation section; 122, Second heat dissipation section; 130, Circuit board; 131, Second electrode area; 132, External area; 140, Package layer; 150, Wire; 200, Connecting clip.

[0050] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0051] In related technologies, the edge of the encapsulated structure is the bezel of the display. During the encapsulation process, the connection points between the circuit board and the LED chip (or OLED chip) need to be encapsulated, meaning the electrodes connected by the wires need to be encapsulated. Therefore, the resulting display bezel includes the electrode width of the circuit board and the electrode width of the LED chip (or OLED chip). If the dimensions are too large, the display bezel will be large.

[0052] To address this, this application provides a packaging structure, display device, and electronic device for a display device, wherein the circuit board intersects with the extension direction of the display chip. Compared to related technologies, the bezel size is effectively reduced, enabling the display device to achieve a narrower bezel design. The heat dissipation layer can effectively and quickly conduct heat generated by the display chip, improving the heat dissipation performance of the display device and extending its lifespan. The packaging layer protects the wires, circuit board, and electrodes on the circuit board from external environmental influences, and also prevents mechanical damage, improving the reliability and durability of the display device and electronic device.

[0053] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only some embodiments of this application, and not all embodiments.

[0054] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0055] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclusively include, for example, a product or device that includes a series of components is not necessarily limited to those that are explicitly listed, but may include other components that are not explicitly listed or that are inherent to such product or device.

[0056] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0057] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0058] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0059] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0060] Referring to any of the figures in Figures 3-9, in a first aspect, embodiments of this application provide a display device 10, including a connecting clip 200 and an encapsulation structure 100. The connecting clip 200 is connected to the edge of the outer region 132 of a circuit board 130. The connecting clip 200 is a mechanical component for fixing and connecting the encapsulation structure 100.

[0061] It is understood that the connecting buckle 200 can be used to connect the encapsulation structure 100 to other devices. For example, other devices include projection devices, on which the encapsulation structure 100 can be mounted via the connecting buckle 200, and the projection device can display a projected image through the encapsulation structure 100. Another example is a watch strap, on which the encapsulation structure 100 can be connected via the connecting buckle 200 and secured to the user's wrist, and which is used to display information such as time. This application does not limit the selection of other devices, nor is it limited to the examples described above.

[0062] Secondly, embodiments of this application also provide an electronic device (not shown in the figures), which may include the aforementioned display device 10. The display device 10 is used to display information, which may include, but is not limited to, text, images, etc. The electronic device may be any device with the function of displaying information, such as a smartwatch, projector, smartphone, tablet computer, laptop computer, smart glasses, in-vehicle display, e-book reader, smart home device, etc. Embodiments of this application do not limit the specific type of electronic device, nor are they limited to the examples described above.

[0063] Referring to FIG1, in a third aspect, embodiments of this application provide a packaging structure 100 for a display device 10, which is applied to a miniaturized display device 10.

[0064] Specifically, the packaging structure 100 includes a display chip 110, a heat dissipation layer 120, a circuit board 130, and a packaging layer 140.

[0065] Referring to Figures 1 and 2, the display chip 110 has a light-emitting side for emitting a light beam. The display chip 110 includes a display area 111, which is used to display image information, text information, or video information.

[0066] In some embodiments, the display chip 110 further includes a non-display area 112, which is typically located around the display area 111.

[0067] In some embodiments, the display chip 110 includes a first electrode region 113, the electrodes of which are used to electrically connect the display area 111 to other structures. The first electrode region 113 is located in the non-display area 112.

[0068] It is understandable that the display chip 110 will generate heat during operation, and if it is not dissipated in time, it may affect the performance and lifespan of the device.

[0069] Therefore, a portion of the surface of the heat dissipation layer 120 can contact the display chip 110, and the heat dissipation layer 120 can effectively conduct away the heat generated by the display chip 110 quickly, thereby improving heat dissipation performance and extending the service life of the display device 10.

[0070] On the other hand, if the heat dissipation layer 120 is a rigid structure, the heat dissipation layer 120 can also be used to support the display chip 110, which can enhance the structural strength of the packaging structure 100.

[0071] Referring to FIG3, the circuit board 130 is used to connect and support the display chip 110. The circuit board 130 includes a second electrode region 131, which is disposed on one side of the heat dissipation layer 120, and the first electrode region 113 is electrically connected to the second electrode region 131.

[0072] It is understandable that the second electrode region 131 and the first electrode region 113 can be electrically connected by a wire 150.

[0073] The second electrode region 131 is disposed on one side of the heat dissipation layer 120, that is, at the edge of the circuit board 130, so as to mate with the first electrode region 113. The first electrode region 113 is used to transmit electrical signals inside the display chip 110 to the circuit board 130.

[0074] It should be noted that the electrodes are typically made of conductive materials (such as gold, silver, copper, etc.), which have good conductivity and reliability. The wire 150 can be a metal wire, solder wire, or other conductive material, which transmits electrical signals from the display chip 110 to the circuit board 130, or from the circuit board 130 to the display chip 110.

[0075] The extension direction of the circuit board 130 intersects with the extension direction of the display chip 110.

[0076] By aligning the extension direction of the circuit board 130 with the extension direction of the display chip 110, i.e., setting the extension direction of the circuit board 130 and the extension direction of the display chip 110 at an angle, space can be utilized and the bezel size can be reduced. If there is no angle, the circuit board 130 will occupy more bezel space, resulting in a wider bezel.

[0077] In this way, the circuit board 130 is arranged vertically or diagonally, and the bezel size is reduced compared to the width of the second electrode region 131 and the width of the first electrode region 113 in the related art, so that the display device 10 can achieve a narrower bezel design.

[0078] It should be noted that the encapsulation layer 140 covers the entire perimeter of the display chip 110, meaning the encapsulation layer 140 protects the display chip 110. The encapsulation layer 140 at least covers the electrical connection between the first electrode region 113 and the second electrode region 131, meaning the encapsulation layer 140 protects the electrical connection between the first electrode region 113 and the second electrode region 131. However, to ensure the display chip 110 can display normally, the encapsulation layer 140 needs to expose the display area.

[0079] It is understandable that the encapsulation layer 140 covers the wire 150 to protect the wire 150, thereby ensuring the connection between the display chip 110 and the second electrode region 131, so that the display chip 110 can display normally.

[0080] As can be seen from the above, the encapsulation layer 140 can protect the electrical connection between the display chip 110 and the circuit board 130 to ensure that the display chip 110 can work normally. In addition, the encapsulation layer 140 can protect the light-emitting side of the display chip 110 to ensure that the display chip 110 is protected from the influence of the external environment, prevent mechanical damage, and improve the reliability and durability of the encapsulation structure 100 and the display device 10.

[0081] The encapsulation structure 100 of this application embodiment intersects the extension direction of the circuit board 130 with the extension direction of the display chip 110. This allows the circuit board 130 to be vertically or obliquely positioned. Compared to the width of the second electrode region 131 and the width of the first electrode region 113 in related technologies, the bezel size is effectively reduced, enabling the display device 10 to achieve a narrower bezel design. A heat dissipation layer 120 is added to the encapsulation structure 100. The heat dissipation layer 120 can effectively and quickly conduct away the heat generated by the display chip 110, improving the heat dissipation performance of the display device 10 and extending its service life. The encapsulation layer 130 protects the wires 150, the circuit board 130, and the electrodes on the circuit board 130 from external environmental influences and prevents mechanical damage, improving the reliability and durability of the display device 10.

[0082] Referring to FIG3, in some embodiments, the heat dissipation layer 120 includes a first heat dissipation segment 121 and a second heat dissipation segment 122. The first heat dissipation segment 121 and the second heat dissipation segment 122 can jointly form the heat dissipation layer 120, and the first heat dissipation segment 121 and the second heat dissipation segment 122 can be connected to each other.

[0083] It is understood that the angle between the extending direction of the first heat dissipation segment 121 and the extending direction of the second heat dissipation segment 122 can be selected according to the actual situation, such as 15°, 30°, 45°, 60°, 75°, 90°, 130°, 145°, 120°, 175°, etc. That is, the angle between the extending direction of the first heat dissipation segment 121 and the extending direction of the second heat dissipation segment 122 can be an acute angle, a right angle, or an obtuse angle. The embodiments of this application do not limit the value of the above-mentioned angle, nor are they limited to the above examples.

[0084] The first heat dissipation section 121 covers at least a portion of the surface of the display chip 110 away from the light-emitting side, that is, the first heat dissipation section 121 covers part or all of the surface of the light-emitting side, and is used to conduct the heat generated by the display chip 110 to improve heat dissipation efficiency.

[0085] It is understandable that the display chip 110 will generate heat during operation, and if it is not dissipated in time, it may affect the performance and lifespan of the device.

[0086] Based on this, the second heat dissipation section 122 at least covers the second electrode region 131. That is, the heat dissipation layer 120 at least covers the portion of the circuit board 130 corresponding to the electrical connection. In this way, the heat dissipation layer 120 can effectively and quickly conduct away the heat generated between the display chip 110 and the circuit board 130, which can also improve heat dissipation performance and further improve heat dissipation efficiency.

[0087] In one possible implementation, the extending direction of the first heat dissipation section 121 intersects the extending direction of the second heat dissipation section 122, that is, the extending direction of the second electrode region 131 intersects the extending direction of the display chip 110.

[0088] In this way, the circuit board 130 is arranged vertically or diagonally, and the bezel size is effectively reduced compared to the width of the second electrode region 131 and the width of the first electrode region 113 in the related art, so that the display device 10 can achieve a narrower bezel design.

[0089] The packaging structure 100 provided in this application embodiment uses intersecting first heat dissipation section 121 and second heat dissipation section 122 to fix the display chip 110 and the circuit board 130, respectively. By bending the second heat dissipation section 122, the extension directions of the display chip 110 and the circuit board 130 intersect. This reduces the size of the second electrode region 131, effectively reducing the bezel size compared to the width of the second electrode region 131 and the width of the first electrode region 113 in related technologies, enabling the display device 10 to achieve a narrower bezel design.

[0090] Referring to Figures 3-6, in one possible embodiment, the angle between the extending direction of the first heat dissipation section 121 and the extending direction of the second heat dissipation section 122 is a right angle. That is, the angle between the extending direction of the second electrode region 131 and the extending direction of the display chip 110 is a right angle. Thus, the bezel size of the display device 10, including the thickness of the second electrode region 131 and the thickness of the upper electrode of the second electrode region 131, is effectively reduced compared to the width of the second electrode region 131 and the width of the first electrode region 113 in related technologies, enabling the display device 10 to achieve a narrower bezel design.

[0091] Referring to FIG3, in one possible embodiment, the second electrode region 131 is located on the side of the display chip 110 away from the light-emitting side, and the second heat dissipation section 122 is located on the side of the display chip 110 away from the light-emitting side. In this case, the first heat dissipation section 121 and the second heat dissipation section 122 are located on different sides of the display chip 110.

[0092] Extending along the surface of the display chip 110, the second heat dissipation section 122 is located between the second electrode region 131 and the first heat dissipation section 121. That is, the second heat dissipation section 122 is located between the display chip 110 and the circuit board 130. The second heat dissipation section 122 can effectively conduct the heat generated by the display chip 110, protect the circuit board 130 from the heat generated by the display chip 110, improve heat dissipation performance, and thus extend the service life of the circuit board 130 and the display device 10.

[0093] Referring to FIG3, in one possible embodiment, the end of the second electrode region 131 facing the light-emitting side is not higher than the plane where the light-emitting side is located.

[0094] With the above arrangement, the second electrode region 131 is flush with or lower than the plane where the light-emitting side is located, making the overall packaging structure 100 more compact. This facilitates the integration of more functions or components while maintaining the overall size of the display device 10. Secondly, the above arrangement avoids structural protrusion, which helps protect the integrity of the display device 10 during transportation and use, improving reliability and durability.

[0095] Understandably, "not higher than" means lower than or equal to.

[0096] Referring to Figure 4, in some embodiments, the end of the second electrode region 131 facing the light-emitting side is flush with the plane where the light-emitting side is located.

[0097] With the above settings, on the one hand, the second electrode area 131 can be avoided from blocking the light emitted by the display chip 110 too much, thereby preventing the circuit board 130 from affecting the display effect; on the other hand, the flatness between the second electrode area 131 and the display chip 110 is relatively high, which is conducive to forming a stable packaging structure 100.

[0098] It should be noted that, based on this, the circuit board 130 can be positioned as high as possible to avoid the bottom of the circuit board 130 occupying a large thickness, which facilitates the miniaturization of the package structure 100.

[0099] Referring to FIG5, in some other embodiments, the end of the second electrode region 131 facing the light-emitting side is lower than the plane where the light-emitting side is located.

[0100] The above design avoids the second electrode region 131 from obstructing the light emitted by the display chip 110, thus preventing the circuit board 130 from affecting the display effect. Furthermore, the relatively low position of the second electrode region 131 provides more space for the heat dissipation layer 120, enhancing the design flexibility of the heat dissipation path. Additionally, since the second electrode region 131 is lower than the plane of the light-emitting side, the flatness requirements during manufacturing and assembly are easier to meet. This simplifies the production process and improves production efficiency and yield.

[0101] In one possible implementation, the end of the second electrode region 131 facing the light-emitting side is not lower than the plane of the end of the second heat dissipation section 122 facing away from the light-emitting side.

[0102] With the above configuration, the second electrode region 131 can at least contact the second heat dissipation section 122. When the second heat dissipation section 122 bends, it can cause the second electrode region 131 to intersect with the extension direction of the display chip, thereby reducing the size of the second electrode region 131.

[0103] It is understandable that "not lower than" means "higher than" or "on par with".

[0104] In some embodiments, the end of the second electrode region 131 facing the light-emitting side is flush with the plane of the end of the second heat dissipation section 122 away from the light-emitting side, indicating that there is a line contact between the second electrode region 131 and the second heat dissipation section 122.

[0105] In some embodiments, the end of the second electrode region 131 facing the light-emitting side is higher than the plane of the end of the second heat dissipation section 122 away from the light-emitting side, that is, the second electrode region 131 covers at least the second heat dissipation section 122, and the second electrode region 131 and the second heat dissipation section 122 are in surface contact, thereby increasing the heat dissipation efficiency.

[0106] In one possible implementation, the side of the second electrode region 131 facing the light-emitting side can simultaneously satisfy both of the above-mentioned positions. That is, the side of the second electrode region 131 facing the light-emitting side is not higher than the plane where the light-emitting side is located and not lower than the plane where the end of the second heat dissipation section 122 is located away from the light-emitting side.

[0107] It should be noted that, in the above positional relationship, there is a different positional relationship between the plane where the second electrode region 131 and the plane where the first heat dissipation section 121 faces the light-emitting side.

[0108] In some embodiments, the end of the second electrode region 131 facing the light-emitting side is higher than the plane of the end of the first heat dissipation section 121 facing the light-emitting side, that is, while the second electrode region 131 covers the second heat dissipation section 122, it also covers part of the end of the display chip 110.

[0109] In some embodiments, the end of the second electrode region 131 facing the light-emitting side is flush with the plane of the end of the first heat dissipation section 121 facing the light-emitting side, meaning that the second electrode region 131 only covers the second heat dissipation section 122.

[0110] Referring to FIG6, as one possible implementation, along the extension direction perpendicular to the display chip 110, the orthographic projection of the second heat dissipation section 122 on the display chip 110 is covered by the display chip 110.

[0111] It is understandable that the orthographic projection of the second heat dissipation section 122 onto the display chip 110 refers to the plate segment formed by projecting the second heat dissipation section 122 onto the display chip 110 in a direction perpendicular to the extension direction of the display chip 110, that is, the second heat dissipation section 122 is covered by the display chip 110.

[0112] By completely covering the display chip 110 with the orthographic projection of the second heat dissipation section 122, the bezel size of the display device 10 can be reduced, the integration of the display device 10 can be improved, the complexity of external connections can be reduced, and the space occupancy rate can be lowered, thereby achieving a narrow bezel design for the display device 10.

[0113] It is understandable that when the second heat dissipation section 122 is covered by the display chip 110, there may be different positions between the end surface of the second electrode region 131 facing the light-emitting side and the display chip 110.

[0114] In some embodiments, along a direction perpendicular to the extension of the display chip 110, the orthographic projection of the second electrode region 131 onto the display chip 110 is staggered with that of the display chip 110. That is, the display chip 110 covers the second heat dissipation section 122 and a portion of the second electrode region 131.

[0115] In other embodiments, along the extension direction perpendicular to the display chip 110, the orthographic projection of the second electrode region 131 onto the display chip 110 does not overlap with the display chip 110. That is, only the second heat dissipation section 122 is covered by the display chip 110.

[0116] It should be noted that if the second heat dissipation section 122 is covered by the display chip 110 along an extension direction perpendicular to the display chip 110, the end of the second electrode region 131 facing the light-emitting side needs to be lower than the display chip 110. In this case, the second electrode region 131 can have different positions.

[0117] In some embodiments, the end of the second electrode region 131 facing the light-emitting side may be higher than the plane of the end of the first heat dissipation section 121 facing the light-emitting side, while being lower than the display chip 110.

[0118] In some embodiments, the end of the second electrode region 131 facing the light-emitting side may be flush with the plane containing the end of the first heat dissipation section 121 facing the light-emitting side. In this case, the top of the second electrode region 131 abuts against the display chip 110.

[0119] Referring to FIG7, in one possible embodiment, the orthographic projection of the second heat dissipation section 122 onto the display chip 110 is staggered with that onto the display chip 110 along the extending direction perpendicular to the display chip 110. That is, the second heat dissipation section 122 is exposed on the display chip 110.

[0120] By interleaving the orthographic projection of the second heat sink 122 with the display chip 110, the interleaving arrangement can effectively cover the display area of ​​the display chip 110 with the second heat sink 122, while avoiding unnecessary overlap.

[0121] Referring to FIG8, in one possible embodiment, along the extending direction perpendicular to the display chip 110, the orthographic projection of the first heat dissipation section 121 on the display chip 110 is staggered with that of the display chip 110. That is, the first heat dissipation section 121 is exposed on the display chip 110.

[0122] By interleaving the orthographic projection of the first heat dissipation section 121 with the display chip 110, the interleaving arrangement can effectively cover the display area of ​​the display chip 110 with the first heat dissipation section 121, while avoiding unnecessary overlap.

[0123] It should be noted that the position of the end of the second electrode region 131 facing the light-emitting side along the extension direction perpendicular to the display chip 110 can be arbitrary. This has been described above and can be arbitrarily combined with embodiments of the first heat dissipation section 121 or the second heat dissipation section 122 exposed in the display chip 110, and will not be repeated here.

[0124] Referring to FIG3, in one possible embodiment, the circuit board 130 further includes an external region 132 located on the side of the circuit board 130 away from the second electrode region 131, the external region 132 being used for connection to an external circuit.

[0125] By providing an external area 132, the encapsulation structure 100 can be electrically connected to an external electronic device for displaying information.

[0126] Referring to FIG5, in one possible embodiment, along the extension direction perpendicular to the display chip 110, the orthographic projection of the outer region 132 on the display chip 110 is covered by the display chip 110.

[0127] It is understandable that the orthographic projection of the outer region 132 onto the display chip 110 refers to the segment formed by projecting the outer region 132 onto the display chip 110 along a direction perpendicular to the extension direction of the display chip 110.

[0128] Furthermore, the orthographic projection of the outer region 132 onto the display chip 110 is within the range of the display chip 110, that is, it is covered by the display chip 110.

[0129] By completely covering the display chip 110 with the orthographic projection of the outer area 132, the thickness of the display device 10 can be reduced, the integration of the display device 10 can be improved, the space occupancy rate can be reduced, and thus the miniaturization of the display device 10 can be achieved.

[0130] Referring to FIG9, in one possible embodiment, the second electrode region 131 is located on the light-emitting side of the display chip 110; the heat dissipation layer 120 is located on the outside of the display chip 110. By placing the heat dissipation layer 120 on the outside of the display chip 110, the heat generated by the display chip 110 can be effectively conducted and dissipated, improving heat dissipation performance, protecting the display chip 110 from overheating, and extending the service life of the display chip 110 and the display device 10.

[0131] The heat dissipation layer 120 is located on the outside of the circuit board 130. By placing the heat dissipation layer 120 on the outside of the circuit board 130, the heat dissipation layer 120 can protect the circuit board 130 from the heat generated by the display chip 110, and extend the service life of the circuit board 130 and the display device 10.

[0132] Specifically, the second heat dissipation section 122 and the second electrode region 131 are both located on the light-emitting side of the display chip 110. Along the surface extension direction of the display chip 110, the second electrode region 131 and the first heat dissipation section 121 are both located on the same side of the second heat dissipation section 122.

[0133] The above configuration helps to create a centralized heat dissipation and packaging area, which optimizes structural compactness. Furthermore, the same-side layout reduces the complexity and size of the package structure 100, contributing to miniaturization and weight reduction, and improving portability and installation flexibility.

[0134] The second heat dissipation section 122 covers the second electrode area 131 and part of the display chip 110. That is, the second heat dissipation section 122 can contact the second electrode area 131 and the display chip 110. The contact area between the display chip 110 and the heat dissipation layer 120 is large, which can reduce the probability of the display chip 110 overheating, help reduce the failure rate, and improve the reliability and durability of the display device 10.

[0135] With the above settings, the heat generated by the display chip 110 during operation can be effectively absorbed and dissipated, which helps to maintain the stable performance of the display device 10, especially in high brightness and high power applications.

[0136] In one possible implementation, the circuit board is a flexible circuit board. Flexible circuit boards are characterized by being thin, lightweight, flexible, and heat-resistant.

[0137] The flexibility of the flexible circuit board allows it to fit tightly to the outer periphery of the display chip 110 and can be bent and folded as needed. By setting the second electrode region 131 on the outer periphery of the display chip 110 and ensuring that the angle between its extension direction and the extension direction of the display chip 110 is no higher than 90°, space can be maximized and bezel size reduced.

[0138] Compared to traditional rigid circuit boards, the use of flexible circuit boards makes the bezels of the display device 10 narrower, which can improve the screen-to-body ratio and meet users' needs for narrow-bezel display devices 10.

[0139] In one possible implementation, the heat dissipation layer 120 is made of one of metal, ceramic, and glass.

[0140] In some embodiments, the heat dissipation layer 120 is made of a metal. On one hand, metal materials have high thermal conductivity, enabling rapid heat conduction. For example, copper has a thermal conductivity of approximately 400 W / m·K, and aluminum has a thermal conductivity of approximately 237 W / m·K. On the other hand, metal materials have high mechanical strength and durability, enabling the encapsulation structure 100 and the display device 10 to maintain structural stability during use.

[0141] In some embodiments, the heat dissipation layer 120 is made of ceramic. Ceramic materials achieve heat conduction through lattice vibrations (phonon conduction). For example, aluminum nitride (AlN) is a commonly used ceramic heat dissipation material. Aluminum nitride has high thermal conductivity and good electrical insulation properties.

[0142] In some embodiments, the heat dissipation layer 120 is made of glass. Part of the glass can dissipate heat through radiation and convection. For example, in some optical devices, borosilicate glass can serve as a transparent protective layer, exchanging heat through contact with air. Glass possesses high chemical stability and electrical insulation properties.

[0143] In this embodiment, the heat dissipation layer 120 is disposed on the side of the display chip 110 away from the light-emitting side and covers at least part of the second electrode area 131. This can effectively conduct heat from the display chip 110 to the heat dissipation layer 120, and then diffuse it into the surrounding environment through the heat dissipation layer 120, thus avoiding performance degradation and shortened service life caused by overheating.

[0144] The aforementioned display chip 110 has a very small volume, with length and width dimensions between 500 μm and 50,000 μm.

[0145] The area of ​​the light-emitting region of the aforementioned display chip 110 is very small, such as 1mm×1mm, 2.64mm×2.02mm, 3mm×5mm, etc.

[0146] The light-emitting area of ​​the aforementioned display chip 110 includes multiple micro LED pixels arranged in an array. The specific pixel arrangement can be one of 320×240, 640×480, 1600×1200, 1920×1080, or 2560×1440.

[0147] The size of a single micro LED pixel is between 100 nm and 100 micrometers.

[0148] In some implementations, the size of a single microLED pixel is between 150 nm and 15 micrometers.

[0149] In some implementations, the size of a single micro-LED pixel can be less than 10 micrometers.

[0150] A driving backplane is disposed on the back of the micro-LED pixel array. The driving backplane is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplane can acquire signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not emit light. The driving backplane is a TFT (Thin Film Transistor) board or an IC (Integrated Circuit) board.

[0151] For example, the driving backplane of the aforementioned display chip 110 integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscale levels. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently, or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation of this application.

[0152] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0153] For ease of explanation, the above description has been provided in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Various modifications and variations can be obtained based on the above teachings. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, thereby enabling those skilled in the art to better utilize the described embodiments and various different variations of embodiments suitable for specific use considerations.

Claims

1. A packaging structure (100) for a display device (10), characterized in that, A miniaturized display device (10), the packaging structure (100) comprising: The display chip (110) has a light-emitting side, and the display chip (110) includes a display area (111) and a first electrode area (113) located outside the display area (111); A heat dissipation layer (120) has a portion of its surface in contact with the display chip (110); The circuit board (130) includes a second electrode region (131); the second electrode region (131) is disposed on one side of the heat dissipation layer (120), and the first electrode region (113) is electrically connected to the second electrode region (131); and the extension direction of the circuit board (130) intersects the extension direction of the display chip (110); An encapsulation layer (140) covers the periphery of the display chip (110) and at least covers the electrical connection between the first electrode region (131) and the second electrode region (131), and exposes the display area (111).

2. The packaging structure (100) for the display device (10) according to claim 1, characterized in that, The heat dissipation layer (120) includes a first heat dissipation section (121) and a second heat dissipation section (122), the first heat dissipation section (121) and the second heat dissipation section (122) are connected, and the extension direction of the first heat dissipation section (121) intersects the extension direction of the second heat dissipation section (122). The first heat dissipation section (121) covers at least a portion of the surface of the display chip (110) away from the light-emitting side, and the second heat dissipation section (122) covers at least the second electrode region (131).

3. The packaging structure (100) for the display device (10) according to claim 2, characterized in that, The angle between the extension direction of the first heat dissipation section (121) and the extension direction of the second heat dissipation section (122) is a right angle.

4. The packaging structure (100) for the display device (10) according to claim 2 or 3, characterized in that, The second heat dissipation section (122) and the second electrode region (131) are both located on the side of the display chip (110) away from the light-emitting side; Along the surface extension direction of the display chip (110), the second heat dissipation section (122) is located between the second electrode region (131) and the first heat dissipation section (121).

5. The packaging structure (100) for the display device (10) according to claim 4, characterized in that, The end of the second electrode region (131) facing the light-emitting side is not higher than the plane where the light-emitting side is located; And / or, The end of the second electrode region (131) facing the light-emitting side is not lower than the plane of the end of the second heat dissipation section (122) away from the light-emitting side.

6. The packaging structure (100) for the display device (10) according to claim 5, characterized in that, The end of the second electrode region (131) facing the light-emitting side is flush with the plane of the light-emitting side; or, The end of the second electrode region (131) facing the light-emitting side is flush with the plane of the end of the first heat dissipation section (121) facing the light-emitting side.

7. The packaging structure (100) for the display device (10) according to claim 4, characterized in that, Along the extension direction perpendicular to the display chip (110), The orthographic projection of the second heat dissipation section (122) onto the display chip (110) is covered by the display chip (110); or, The second heat dissipation section (122) is projected onto the display chip (110) in an alternating manner with the display chip (110); or, The first heat dissipation section (121) is projected onto the display chip (110) in an alternating manner with the display chip (110).

8. The packaging structure (100) for the display device (10) according to claim 4, characterized in that, The circuit board (130) also includes an external area (132). The external region (132) is located on the side of the circuit board (130) away from the second electrode region (131), and the external region (132) is used to connect to an external circuit.

9. The packaging structure (100) for a display device (10) according to claim 8, characterized in that, Along the extension direction perpendicular to the display chip (110), the orthographic projection of the outer region (132) onto the display chip (110) is covered by the display chip (110); The second heat dissipation section (122) is located away from the light-emitting side and abuts against the external region (132).

10. The packaging structure (100) for the display device (10) according to claim 2 or 3, characterized in that, The second heat dissipation section (122) and the second electrode region (131) are both located on the light-emitting side of the display chip (110); Along the surface extension direction of the display chip (110), the second electrode region (131) and the first heat dissipation section (121) are both located on the same side of the second heat dissipation section (122); The second heat dissipation section (122) covers the second electrode area (131) and part of the display chip (110).

11. A display device (10), characterized in that, It includes a connecting snap-fit ​​(200) and an encapsulation structure (100) as described in any one of claims 1-10; The connecting buckle (200) is connected to the edge of the outer area (132) of the circuit board (130).

12. An electronic device, characterized in that, Includes the display device as described in claim 11.

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