Packaging structure and electronic device

Abstract

A packaging structure and an electronic device. The packaging structure comprises: a substrate (300) having a first side surface; a heat dissipation structure (100) comprising a heat dissipation main body (110), support bodies (120) and reinforcing ribs (130), wherein the plurality of support bodies (120) protrude from the heat dissipation main body (110) at intervals in the circumferential direction of the heat dissipation main body, each support body (120) has one end in contact with the heat dissipation main body (110) and the other end in contact with the first side surface, such that a mounting gap (140) is formed between the substrate (300) and the heat dissipation main body (110), in which mounting gap (140) the reinforcing ribs (130) are arranged, and each reinforcing rib (130) has one end in contact with the first side surface and the other end in contact with the heat dissipation main body (110); and an optical module (200) arranged in the mounting gap (140), the optical module (200) being fixed to the substrate (300) and abutting against the heat dissipation main body (110), and the heat dissipation structure (100) and the optical module (200) being arranged on the same side of the first side surface.

Description

Packaging structure and electronic devices

[0001] Cross-references

[0002] This application claims priority to Chinese Patent Application No. 202422895385.4, filed on November 26, 2024, entitled "Packaging Structure and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of optical module technology, and in particular to a packaging structure and electronic device. Background Technology

[0004] With the rapid development of technologies such as artificial intelligence (AI) and high-performance computing (HPC), data centers are undertaking increasingly heavy data processing tasks, placing higher demands on service quality with high bandwidth, low power consumption, and low latency. Currently, Co-Packaged Optics (CPO) structures are rapidly developing and being applied, gradually replacing traditional pluggable optical modules. While CPO structures can reduce power consumption in data centers, they are prone to warping during packaging or use. Summary of the Invention

[0005] The main objective of this application is to provide a packaging structure and an electronic device.

[0006] This application proposes a packaging structure, which includes: a substrate having a first side surface; a heat dissipation structure including a heat dissipation body, a support body, and reinforcing ribs, wherein the support body has multiple protrusions spaced circumferentially along the heat dissipation body, one end of the support body contacts the heat dissipation body, and the other end of the support body contacts the first side surface, thereby forming an installation gap between the substrate and the heat dissipation body, the reinforcing ribs being disposed in the installation gap, one end of the reinforcing ribs contacting the first side surface, and the other end of the reinforcing ribs contacting the heat dissipation body; and an optical module disposed in the installation gap, the optical module being fixed to the substrate and abutting against the heat dissipation body, the heat dissipation structure and the optical module being disposed on the same side of the first side surface.

[0007] This application provides an electronic device that includes the packaging structure described above. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0009] Figure 1 is a schematic diagram of a packaging structure according to an embodiment of the present application;

[0010] Figure 2 is a top view of Figure 1;

[0011] Figure 3 is a schematic diagram of another embodiment of the packaging structure of this application;

[0012] Figure 4 is a top view of Figure 3;

[0013] Figure 5 is a schematic diagram of another embodiment of the packaging structure of this application;

[0014] Figure 6 is a side view of an embodiment of the packaging structure of this application.

[0015] Explanation of reference numerals: 100, heat dissipation structure; 110, heat dissipation body; 111, annular heat sink; 112, heat sink cover; 120, support body; 130, reinforcing rib; 140, installation gap; 200, optical module; 300, substrate; 400, chip; 500, thermally conductive layer; 600, first blocking part; 700, circuit board.

[0016] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0018] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0019] Furthermore, in the embodiments of this application, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the embodiments of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0020] In the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0021] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the embodiments of this application.

[0022] With the rapid development of AI, HPC, and other technologies, data centers are facing increasing pressure. After the bandwidth of switches increased to 51.2T, the power consumption of optical modules increased by approximately 26 times, and the power consumption of switching chips increased by approximately 8 times. Therefore, data centers have an increasingly strong demand for high bandwidth, low power consumption, and low latency. Co-Packaged Optics (CPO) structures can effectively reduce power consumption in data centers.

[0023] Currently, optoelectronic co-packaging structures typically involve directly interconnecting the optical module and integrated chip on the substrate, and then soldering them onto a PCB circuit board. The inventors discovered that traditional heat dissipation structures require hollowing out the area where the optical module is located, reducing the contact area between the heat dissipation structure and the substrate, making the overall structure prone to significant warping.

[0024] In view of this, the embodiments of this application provide a packaging structure in which reinforcing ribs are provided in the mounting gap. Specifically, the reinforcing ribs are located below the heat sink and connect the substrate and the heat sink, providing support for the heat sink and applying pressure to the substrate, thus reducing the degree of warping of the heat sink or the substrate due to heat. Furthermore, compared to reinforcing ribs penetrating the heat sink, this reduces the space occupied, increases the mounting space for chips on the substrate, and allows for larger chip sizes.

[0025] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0026] As shown in Figures 1 to 4, this application proposes a packaging structure, which includes a substrate 300. The substrate 300 has a first side surface for mounting electronic components such as a chip 400 and an optical module 200, enabling interconnection between different electronic components. Specifically, the substrate 300 is an organic thick substrate 300, which can reduce signal transmission losses. Of course, in other embodiments, the substrate 300 can also be other types of substrates, which are not limited here.

[0027] The heat dissipation structure 100 includes a heat dissipation body 110, a support body 120, and reinforcing ribs 130. Multiple support bodies 120 protrude circumferentially from the heat dissipation body 110. One end of the support body 120 contacts the heat dissipation body 110, and the other end contacts a first side surface, forming a mounting gap 140 between the substrate 300 and the heat dissipation body 110. The mounting gap 140 provides mounting space for the optical module 200. In one embodiment, the heat dissipation body 110 can be rectangular, square, or other irregularly shaped, with at least two corners. The support body 120 is positioned at the corners to better support the heat dissipation body 110 and avoid the mounting position of the optical module 200. In other embodiments, the heat dissipation body 110 can also be ring-shaped, and can be a solid single-ring, double-ring, or multi-ring metal, or a hollow single-ring, double-ring, or multi-ring metal; no limitation is made here. A reinforcing rib 130 is disposed in the mounting gap 140, with one end of the reinforcing rib 130 contacting the first side surface and the other end of the reinforcing rib 130 contacting the heat dissipation body 110. Optionally, the heat dissipation body 110 is made of an alloy material such as stainless steel. In one embodiment, the width of the support body 120 is greater than the width of the reinforcing rib 130, which can provide more mounting space for other components while ensuring that the warping effect of the substrate 300 is reduced; and the optical module 200 is disposed in the mounting gap 140, the optical module 200 is fixed to the substrate 300 and abuts against the heat dissipation body 110, and the heat dissipation structure 100 and the optical module 200 are disposed on the same side of the first side surface. Optionally, the optical module 200 is soldered to the substrate 300.

[0028] In this embodiment, the support 120 creates a mounting gap 140 between the heat dissipation body 110 and the substrate 300, facilitating the mounting of the optical module 200 onto the substrate 300. Furthermore, the support 120 physically connects the substrate 300 and the heat dissipation body 110, applying force to the substrate 300 and reducing warping. Simultaneously, a reinforcing rib 130 is provided within the mounting gap 140, positioned below the heat dissipation body 110 and physically connecting the substrate 300 and the heat dissipation body 110. This provides support for the heat dissipation body 110 and applies pressure to the substrate 300, further reducing the degree of warping caused by heat on either the heat dissipation body 110 or the substrate 300. Moreover, compared to the reinforcing rib 130 penetrating the heat dissipation body 110, this reduces space occupation, increases the mounting space for chips on the substrate, and allows for larger chip sizes. In addition, the width of the support 120 is greater than the width of the reinforcing rib 130, which can improve the effect of optimizing substrate warping; the width of the reinforcing rib 130 is small, which can provide more installation space for the optical module 200.

[0029] In the embodiments of this application, referring to Figures 1 and 3, a plurality of reinforcing ribs 130 are spaced apart between two adjacent supports 120, and at least one optical module 200 is disposed between two adjacent reinforcing ribs 130. This allows for simultaneous support at multiple different locations, further increasing the contact area between the substrate 300 and the heat dissipation body 110, effectively preventing warping. Furthermore, the presence of at least one optical module 200 between two adjacent reinforcing ribs 130 provides support on both sides of the optical module 200, further reducing the degree of warping near the optical module 200 due to heat.

[0030] In an embodiment of this application, referring to FIG5, the heat dissipation body 110 includes an annular heat sink 111, a reinforcing rib 130 disposed on the side of the annular heat sink 111 facing the first side, one end of the reinforcing rib 130 contacting the annular heat sink 111, and the other end of the reinforcing rib 130 contacting the first side, one end of the support body 120 contacting the annular heat sink 111, and the other end of the support body 120 contacting the first side. Optionally, the annular heat sink 111 can be a circular ring, a square ring, etc., and is not limited here.

[0031] In an embodiment of this application, referring to FIG5, the heat dissipation body 110 further includes a heat dissipation cover 112. The heat dissipation cover 112 is disposed on the side of the annular heat sink 111 away from the first side and covers the central cavity of the annular heat sink 111. In this way, the heat from the heat-generating element (chip 400 in this embodiment) mounted on the substrate 300 can be transferred to the heat dissipation cover 112 and the annular heat sink 111 through the thermal interface material. The heat dissipation cover 112 and the annular heat sink 111 together form a heat dissipation surface, increasing the heat exchange area with the external heat sink and effectively improving the heat dissipation efficiency.

[0032] In the embodiments of this application, referring to FIG6, the packaging structure further includes a thermally conductive layer 500, through which the optical module 200 abuts against the heat dissipation body 110. This improves the heat transfer efficiency between the optical module 200 and the heat dissipation body 110, allowing the heat from the optical module 200 to be better transferred to the heat dissipation body 110 for cooling, thereby improving the heat dissipation effect of the optical module 200. Optionally, the thermally conductive layer 500 is made of a thermal interface material, including an organosilicon layer, an indium metal layer, or a graphene layer, or other types of thermal interface materials, which are not limited here. It is understood that the thermally conductive layer 500 can be an organosilicon layer, an indium metal layer, a graphene layer, or a combination of any two or three, which are not limited here.

[0033] In the embodiments of this application, an adhesive layer is provided at the connection between the optical module 200 and the substrate 300. After the optical module 200 is soldered to the substrate 300 via BUMP bumps, adhesive is applied at the BUMP bump locations to form an adhesive layer, which can improve the connection reliability between the optical module 200 and the substrate 300. Optionally, adhesive can be applied to a single optical module 200 individually, or two or more optical modules 200 can be applied simultaneously; this is not limited to this method.

[0034] Referring to Figure 6, a first blocking portion 600 is provided on the substrate 300. The first blocking portion 600 is disposed near the optical module 200 and located at the edge of the substrate 300. In this way, it can prevent the glue from overflowing when the BUMP bump is dispensing. And / or, the packaging structure also includes a second blocking portion, which is provided on the substrate 300 and located between the optical module 200 and the reinforcing rib 130. In this way, it can prevent the glue from overflowing into the reinforcing rib 130 when the BUMP bump is dispensing.

[0035] In the embodiments of this application, referring to Figures 1 to 4 and Figure 6, the packaging structure further includes a chip 400, with a heat dissipation body 110 surrounding the chip 400. The chip 400 and the heat dissipation cover 112 are in contact through a thermal interface material. It is understood that the chip 400 transfers heat to the heat dissipation cover 112, which is then further cooled by an external heat sink. Optionally, the chip 400 is soldered to a substrate 300 and can be interconnected with the optical module 200. Specifically, the chip 400 is located in the middle of the substrate 300. In one embodiment, the chip 400 is a bare chip. Of course, in other embodiments, the chip 400 can also be other forms of chip structure, which are not limited here.

[0036] In the embodiments of this application, the support body 120, the heat dissipation body 110, and the reinforcing rib 130 are integrally formed, which saves on the use of parts, simplifies the process, and makes the structure more stable and reliable. Optionally, they can be processed by stamping or milling.

[0037] In the embodiments of this application, the reinforcing rib 130 is fixed to the heat dissipation body 110 or the substrate 300 by an adhesive structure. This facilitates the fixing of the reinforcing rib 130. Optionally, the adhesive structure can be an adhesive structure, a double-sided adhesive structure, etc. In one embodiment, one end of the reinforcing rib 130 is bonded to the heat dissipation body 110, and the other end of the reinforcing rib 130 abuts against the substrate 300; or, one end of the reinforcing rib 130 abuts against the heat dissipation body 110, and the other end of the reinforcing rib 130 is bonded to the substrate 300; or, one end of the reinforcing rib 130 is bonded to the heat dissipation body 110, and the other end of the reinforcing rib 130 is bonded to the substrate 300.

[0038] In the embodiments of this application, one end of the optical module 200 extends to the outside of the substrate 300. It can be understood that one end of the optical module 200 is suspended on the outside of the substrate 300, which facilitates the optical fiber output of the optical module 200.

[0039] This application also proposes an electronic device, which includes the above-described packaging structure. Specifically, the specific structure of the packaging structure refers to the above embodiments. Since this electronic device adopts all the technical solutions of the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be elaborated further here. Optionally, the electronic device can be a data exchange device.

[0040] In embodiments of this application, the electronic device further includes a circuit board 700. Referring to FIG6, the substrate 300 has a second side disposed opposite to the first side, and the circuit board 700 is disposed on the second side of the substrate 300. It is understood that the substrate 300 is connected to the circuit board 700 by solder balls, which enables signal interconnection between the circuit board 700 and the substrate 300.

[0041] The above description is merely an exemplary implementation of this application and does not limit the patent scope of the embodiments of this application. Any equivalent structural transformations made based on the technical concept of the embodiments of this application and the contents of the specification and drawings of the embodiments of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the embodiments of this application.

Claims

1. A packaging structure, wherein, The packaging structure includes: A substrate having a first side surface; A heat dissipation structure includes a heat dissipation body, a support body, and reinforcing ribs. The support body has multiple protruding sections spaced circumferentially along the heat dissipation body. One end of the support body contacts the heat dissipation body, and the other end contacts the first side surface, forming a mounting gap between the substrate and the heat dissipation body. The reinforcing ribs are disposed in the mounting gap, with one end contacting the first side surface and the other end contacting the heat dissipation body. An optical module is disposed in the mounting gap. The optical module is fixed to the substrate and abuts against the heat dissipation body. The heat dissipation structure and the optical module are disposed on the same side of the first side.

2. The packaging structure as described in claim 1, wherein, Multiple reinforcing ribs are spaced apart between two adjacent supports, and at least one optical module is provided between two adjacent reinforcing ribs.

3. The packaging structure as described in claim 1, wherein, The heat dissipation body includes an annular heat dissipation fin, and the reinforcing rib is disposed on the side of the annular heat dissipation fin facing the first side. One end of the reinforcing rib contacts the annular heat dissipation fin, and the other end of the reinforcing rib contacts the first side. One end of the support body contacts the annular heat dissipation fin, and the other end of the support body contacts the first side.

4. The packaging structure as described in claim 3, wherein, The heat dissipation body also includes a heat dissipation cover, which is disposed on the side of the annular heat sink away from the first side and covers the central cavity of the annular heat sink.

5. The packaging structure as described in claim 1, wherein, The packaging structure also includes a thermally conductive layer, through which the optical module abuts against the heat dissipation body.

6. The packaging structure as described in claim 5, wherein, The thermally conductive layer is made of a thermal interface material.

7. The packaging structure as described in claim 1, wherein, An adhesive layer is provided at the connection between the optical module and the substrate; The substrate is provided with a first blocking portion, which is disposed near the optical module and located at the edge of the substrate; and / or, the packaging structure further includes a second blocking portion, which is provided on the substrate and located between the optical module and the reinforcing rib.

8. The packaging structure as described in claim 1, wherein, The packaging structure also includes a chip, which is disposed on the substrate, and the heat dissipation body is arranged around the chip.

9. The packaging structure as described in claim 8, wherein, The chip is located in the middle of the substrate.

10. The packaging structure as described in claim 1, wherein, The support, the heat dissipation body, and the reinforcing rib are integrally formed; or, the reinforcing rib is fixed to the heat dissipation body or the substrate by an adhesive structure.

11. The packaging structure as described in claim 1, wherein, One end of the optical module extends to the outside of the substrate.

12. An electronic device, wherein, The electronic device includes the packaging structure as described in any one of claims 1 to 11.

13. The electronic device of claim 12, wherein, The electronic device further includes a circuit board, the substrate having a second side disposed opposite to the first side, and the circuit board being disposed on the second side of the substrate.

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