Light-emitting substrate and manufacturing method therefor, and display panel
By using a multi-layer conductive layer structure and step design, the problem of poor contact between the anode and the underlying signal line was solved, resulting in better conductivity and higher fabrication yield.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2025-10-14
- Publication Date
- 2026-06-04
AI Technical Summary
In the display substrate, during the electrical connection between the anode and the underlying signal lines, the signal lines are prone to corrosion, leading to poor contact, forming dark spots, which affects the display effect. Furthermore, the manufacturing process is complex and the yield is low.
A multi-layer conductive layer structure is adopted. The first conductive layer is used to connect the anode of the light-emitting sub-unit, and the second conductive layer is used to connect the body and cathode of the signal line. By setting a step difference, the light-emitting functional layer is naturally disconnected at the connection point, which simplifies the manufacturing process and improves the conductivity connection.
It improves the conductivity of the light-emitting substrate, simplifies the fabrication process, reduces costs, and increases yield.
Smart Images

Figure CN2025127641_04062026_PF_FP_ABST