Electronic device

Abstract

The present application provides an electronic device, for use in solving the technical problem of deteriorated heat dissipation performance of existing electronic devices after meeting the requirements for thinness and light weight. The electronic device comprises a screen, a battery cover, and a middle frame. The middle frame is arranged between the screen and the battery cover. The middle frame comprises a middle frame body and a first vapor chamber connected to the middle frame body. The middle frame body is provided with a battery compartment. The first vapor chamber is located between the battery compartment and the screen and forms the bottom wall of the battery compartment.

Description

An electronic device

[0001] This application claims priority to Chinese Patent Application No. 202422961000.X, filed with the State Intellectual Property Office of China on November 30, 2024, entitled “An Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0003] As electronic device technology is updated and iterated, users have higher and higher requirements for the thinness and lightness of electronic devices. The connectors between the various components of electronic devices must not only meet the support requirements of each component, but also meet the heat dissipation requirements of the electronic devices during use.

[0004] In related technologies, especially within the internal space of foldable phones, some supporting components, while meeting space utilization requirements, suffer from poor heat dissipation, failing to meet the demands. Furthermore, while some devices do meet the heat dissipation requirements, their space utilization is inefficient. Summary of the Invention

[0005] This application provides an electronic device to solve the technical problem that the heat dissipation performance of existing electronic devices deteriorates after achieving the requirements of thinness and lightness.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, an electronic device is provided, the electronic device including a screen, a battery cover; and a mid-frame, the mid-frame being disposed between the screen and the battery cover, the mid-frame including a mid-frame body and a first heat spreader connected to the mid-frame body, the mid-frame body having a battery compartment, the first heat spreader being located between the battery compartment and the screen, and forming the bottom wall of the battery compartment.

[0008] In some embodiments, the first heat spreader includes a plate body and a heat spreader cavity disposed within the plate body, wherein the yield modulus of the plate body is greater than or equal to 200 MPa and less than or equal to 1200 MPa.

[0009] In some embodiments, the plate body includes a first cover plate and a second cover plate that are stacked and fixedly connected, and a heat dissipation cavity is disposed between the first cover plate and the second cover plate.

[0010] In some embodiments, the first cover plate includes a first central portion and a first edge portion disposed around the first central portion; the second cover plate includes a second central portion and a second edge portion disposed around the second central portion; the first edge portion and the second edge portion are fixedly connected, and a heat dissipation cavity is disposed between at least a portion of the first central portion and at least a portion of the second central portion.

[0011] In some embodiments, the heat exchange cavity is provided with at least one connecting portion, which connects the first middle portion and the second middle portion.

[0012] In some embodiments, this application further includes a main circuit board assembly; the middle frame body includes a motherboard support portion located on the periphery of the battery compartment, and the main circuit board assembly is disposed between the motherboard support portion and the battery cover; at least one connecting portion includes at least one first connecting portion, and at least one first connecting portion is disposed at one end of the heat dissipation cavity away from the support area of ​​the motherboard support portion.

[0013] In some embodiments, this application further includes a hinge structure; the middle frame body has a first edge, the first edge is connected to the hinge structure, and at least one connecting portion includes at least one second connecting portion, the at least one second connecting portion being disposed in the end of the heat exchange cavity away from the first edge.

[0014] In some embodiments, the first cover plate is located between the second cover plate and the screen, the first middle portion includes a first middle portion and a second middle portion, and the heat dissipation cavity is disposed between the first middle portion and the second middle portion; the screen includes a screen body and a bent portion connected to the screen body, the bent portion is located between the second middle portion and the screen body, and the second middle portion is closer to the second middle portion relative to the first middle portion.

[0015] In some embodiments, the present application further includes a mid-frame body including a motherboard support portion, the motherboard support portion being located on the periphery of the battery compartment, and the main circuit board assembly being disposed between the motherboard support portion and the battery cover.

[0016] The motherboard support is provided with an avoidance opening, and the middle frame also includes a second heat dissipation plate. A portion of the second heat dissipation plate is located between the avoidance opening and the screen, and a portion of the second heat dissipation plate is thermally connected to at least a portion of the main circuit board assembly through the avoidance opening; another portion of the second heat dissipation plate is located between the first heat dissipation plate and the screen, and is thermally connected to the first heat dissipation plate.

[0017] In some embodiments, a thermally conductive adhesive is provided between another portion of the second heat spreader and the first heat spreader, and the thermal conductivity of the thermally conductive adhesive is greater than or equal to 3W / (m*K).

[0018] In some embodiments, a first annular sealing layer is provided between the second heat spreader and the main board support and the first heat spreader. The first annular sealing layer includes a first part and a second part. The first part is located between the second heat spreader and the first heat spreader, and the second part is located between the second heat spreader and the main board support. The two ends of the first part are respectively connected to the two ends of the second part, and the clearance opening is located between the first part and the second part.

[0019] In some embodiments, the surface of the first heat spreader facing the screen includes a first surface region and a second surface region. The second surface region is located at the end of the first heat spreader facing the motherboard support and is farther from the screen than the first surface region. A first portion is disposed between the second heat spreader and the second surface region.

[0020] In some embodiments, a second annular sealant layer is provided between the second heat spreader and the first surface region.

[0021] In some embodiments, the height difference between the first surface region and the second surface region is greater than or equal to 1 mm and less than or equal to 3 mm.

[0022] In some embodiments, the first heat spreader is detachably connected to the middle frame body.

[0023] In some embodiments, the thickness of the first heat spreader is less than or equal to 0.3 mm. Attached Figure Description

[0024] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0025] Figure 2 is one of the cross-sectional schematic diagrams of the first heat spreader provided in the embodiments of this application;

[0026] Figure 3 is a schematic diagram of the heat dissipation cavity provided in an embodiment of this application;

[0027] Figure 4 is a second cross-sectional schematic diagram of the first heat spreader provided in the embodiment of this application;

[0028] Figure 5 is a schematic diagram of the structure of the connecting part provided in an embodiment of this application;

[0029] Figure 6 is one of the stacked diagrams of the first heat spreader and the second heat spreader provided in the embodiments of this application;

[0030] Figure 7 is a second stacking diagram of the first and second heat dissipation plates provided in the embodiments of this application;

[0031] Figure 8 is a schematic diagram of the unfolded folding phone provided in an embodiment of this application;

[0032] Figure 9 is a schematic diagram of the storage of the foldable mobile phone provided in an embodiment of this application;

[0033] Figure 10 is a cross-sectional view corresponding to the stacked view of the first heat exchanger and the second heat exchanger provided in the embodiment of this application.

[0034] Reference numerals: 100, electronic device; 10, screen; 11, display screen; 12, light-transmitting cover; 101, screen body; 102, bending part; 20, middle frame; 211, battery compartment; 212, middle frame body; 212a, first edge; 213, motherboard support part; 22, first heat spreader; 22a, first surface area; 22b, second surface area; 221, plate; 221a, first cover plate; 221b, second cover plate; 221c, first connecting part; 221d, second connecting part; 222, heat spreader cavity; 222a, capillary structure; 222b, support column; 23, second heat spreader; 24, first annular sealant layer; 25, second annular sealant layer; 30, battery; 40, battery cover; 50, main circuit board assembly; 60, hinge structure; 70, adhesive layer or other components; 80, graphite layer. Detailed Implementation

[0035] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0036] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0037] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0038] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0039] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0040] In the embodiments of this application, it should be noted that the descriptions "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. This error range can be a range where the deviation angle relative to absolute verticality and absolute parallelism is less than or equal to 5°, 8°, or 10°, respectively, and is not specifically limited here. In addition, the shapes of various components described below as "rectangular," "square," etc., indicate approximate shapes, and rounded corners may or may not be provided between adjacent sides.

[0041] This application provides an electronic device 100, which includes, but is not limited to, mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, laptops, in-vehicle devices, and wearable devices. Wearable devices include, but are not limited to, smart bracelets, smartwatches, smart head-mounted displays, and smart glasses.

[0042] Please refer to Figure 1, which is a structural diagram of an electronic device 100 provided in some embodiments of this application. This embodiment and the following embodiments use a mobile phone as an example for illustrative purposes. The electronic device 100 is approximately rectangular in shape.

[0043] Based on this, for the convenience of describing the embodiments below, an XYZ coordinate system is established, defining the width direction of the electronic device 100 as the X-axis direction, the length direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction. It is understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here.

[0044] In other embodiments, the shape of the electronic device 100 may also be a square plate, a circular plate, an elliptical plate, etc., and no specific limitation is made here.

[0045] Please refer to Figure 1, which is an exploded structural diagram of the electronic device 100 in this application. In the embodiment shown in Figure 1, the electronic device 100 may include a screen 10, a battery cover 40, a battery 30, a main circuit board assembly 50, and a mid-frame 20. It should be noted that Figure 1 only schematically shows some components included in the electronic device 100, and the actual shape, size, position, and structure of these components are not limited by Figure 1.

[0046] Screen 10 is used to display images, videos, etc. Screen 10 includes a light-transmitting cover 12 and a display screen 11 (English name: panel, also known as display panel).

[0047] The light-transmitting cover 12 is stacked on top of the display screen 11. The light-transmitting cover 12 is mainly used to protect the display screen 11 and prevent dust. The material of the light-transmitting cover 12 includes, but is not limited to, glass. The display screen 11 can be a flexible display screen 11 or a rigid display screen 11.

[0048] For example, the display screen 11 can be an organic light-emitting diode (OLED) display screen 11, an active-matrix organic light-emitting diode (AMOLED) display screen 11, a mini organic light-emitting diode (MLED) display screen 11, a microorganic light-emitting diode (MOLED) display screen 11, a quantum dot light-emitting diode (QLED) display screen 11, a capacitive touch panel (TP), or a liquid crystal display (LCD).

[0049] In some embodiments, please continue to refer to FIG1. ​​The middle frame 20 is disposed between the screen 10 and the battery cover 40. The middle frame 20 includes a middle frame body 212 and a first heat dissipation plate 22 connected to the middle frame body 212. The middle frame body 212 is provided with a battery compartment 211. The first heat dissipation plate 22 is located between the battery compartment 211 and the screen 10 and forms the bottom wall of the battery compartment 211.

[0050] Understandably, the light-transmitting cover 12, the mid-frame 20, and the battery cover 40 constitute the housing of the mobile phone, which is used to protect the internal electronic components of the electronic device 100. The battery cover 40 is located on the side of the display screen 11 away from the light-transmitting cover 12, and is stacked and spaced apart from the light-transmitting cover 12 and the display screen 11.

[0051] Referring to Figure 1 and in conjunction with Figure 2, the main body of the middle frame 20 divides the housing into two areas. One area is the area between the light-transmitting cover 12 and the main body of the middle frame 212, where the screen body 101 is located. The other area is the area between the main body of the middle frame 212 and the battery cover 40, where the battery 30 and the motherboard circuit components are located. The main body of the middle frame 212 has a battery compartment 211 in this area.

[0052] Based on this, the first heat dissipation plate 22 can dissipate heat from the battery 30 while forming the bottom wall of the battery compartment 211, thus preventing local overheating.

[0053] At this point, the "bottom wall" refers to the wall of the battery compartment 211 that is away from the battery cover 40 along the Z-axis. After the battery 30 is installed, the heat spreader forms the bottom wall of the battery compartment 211, and the battery cover 40 forms the top wall of the battery compartment 211.

[0054] The first heat dissipation plate 22 is connected to the main body of the middle frame 212 and is located between the battery compartment 211 and the screen 10, forming the bottom wall of the battery compartment 211. This design cleverly integrates the heat dissipation plate into the structure of the middle frame 20.

[0055] Compared to setting up separate heat dissipation components that would take up space inside the phone, setting part of the mid-frame 20 as a first heat dissipation plate 22 with thermal conductivity, this integrated design saves valuable space resources inside the phone. This allows for more space to be used for the layout of other key components or further space optimization in the design of foldable screen phones that pursue extreme thinning and weight reduction.

[0056] When the battery 30 generates heat during use, the heat spreader plate can act as a medium for heat conduction. Due to its excellent thermal conductivity, the heat spreader plate can quickly absorb and evenly distribute the heat generated by the battery 30, preventing heat from accumulating locally in the battery compartment 211, thereby reducing the impact of localized overheating on the performance and safety of the battery 30.

[0057] Meanwhile, the uniform distribution of heat by the first heat dissipation plate 22 can also reduce the direct conduction of heat to the screen 10, which could lead to excessively high screen temperatures. Excessive screen temperature may affect the display effect and touch sensitivity of the screen 10, while the presence of the first heat dissipation plate 22 helps maintain the screen 10 within a suitable temperature range, ensuring its normal operation.

[0058] In addition, for foldable screen phones, the screen is divided into a first sub-screen and a second sub-screen. In order to improve the user experience, the thickness of the first sub-screen and the second sub-screen needs to be very thin so that the thickness of the phone in the folded state can meet the user's needs.

[0059] In this application, the middle frame 20 is divided into the middle frame body 212 and the first heat dissipation plate 22 connected to the middle frame body 212. It is no longer necessary to add a special heat dissipation component in the first sub-screen or the second sub-screen, which greatly improves the internal space utilization.

[0060] While ensuring efficient use of the overall machine space, it also guarantees the machine's heat dissipation capabilities.

[0061] In some embodiments, the first heat dissipation plate 22 includes a plate body 221 and a heat dissipation cavity 222 disposed in the plate body 221. The heat dissipation cavity 222 can effectively dissipate heat from the mobile phone. Meanwhile, in order to ensure that the first heat dissipation plate 22 can provide effective support for the battery 30, the yield modulus of the plate body 221 is greater than or equal to 200 MPa and less than or equal to 1200 MPa.

[0062] Yield modulus is a physical quantity that measures a material's resistance to elastic deformation. When the yield modulus is within this range, the plate 221 will not easily deform excessively when bearing the weight of the battery 30 and any external forces it may encounter. If the yield modulus is too low, the plate 221 will undergo significant elastic deformation under relatively small external forces, failing to provide stable support for the battery 30; conversely, if the yield modulus is too high, the material may be too rigid and lack necessary flexibility, making it prone to cracking during actions such as folding the phone.

[0063] For example, the yield modulus of the plate 221 can be 200 MPa, 300 MPa, 400 MPa, 500 MPa, 550 MPa, 600 MPa, 700 MPa, 800 MPa, 900 MPa, 1000 MPa, 1100 MPa, 1200 MPa, etc.

[0064] In some embodiments, the material of the first heat-spreading plate 22 includes at least one of stainless steel, titanium alloy, high-modulus aluminum, etc., so as to effectively ensure that the yield modulus of the first heat-spreading plate 22 is within a suitable range.

[0065] Stainless steel, with its complex crystal structure and chemical bonds composed of elements such as iron, chromium, and nickel, allows for different types (such as austenitic and martensitic) to undergo specific processing. For example, martensitic stainless steel uses heat treatment to refine the grains and regulate the microstructure to meet the required yield modulus. Titanium alloys are based on titanium and incorporate elements such as aluminum and vanadium to form special solid solutions or compounds. Common Ti-6Al-4V alloys, through adjusting the alloy ratio and undergoing forging and rolling processes, have a denser microstructure, strengthening the interatomic bonding force and ensuring that the yield modulus meets the requirements. High-modulus aluminum, as a specially treated aluminum alloy, incorporates trace elements such as zinc, magnesium, and copper. The 7xxx series (such as 7075 aluminum alloy) undergoes aging treatment to significantly improve its strength and yield modulus. In this way, through reasonable material selection and appropriate processing, a stable and compliant yield modulus is provided for the first heat spreader 22, enabling it to provide reliable support for the battery 30.

[0066] In some embodiments, please refer to FIG3, the plate body 221 includes a first cover plate 221a and a second cover plate 221b that are stacked and fixedly connected, and a heat dissipation cavity 222 is disposed between the first cover plate 221a and the second cover plate 221b.

[0067] The first cover plate 221a and the second cover plate 221b are kept in close contact by a fixed connection to prevent leakage of the heat transfer medium in the heat dissipation cavity 222. At the same time, this connection method also allows the two cover plates to work together to withstand external pressure, such as the weight of the battery 30 and possible external impacts.

[0068] For example, the first cover plate 221a and the second cover plate 221b are connected by adhesive.

[0069] The following example illustrates the arrangement of the first cover plate 221a near the battery 30 and the second cover plate 221b near the screen 10.

[0070] When heat is generated on one side of the battery 30, the heat will be conducted to the first cover plate 221a through the part of the battery 30 that contacts the first cover plate 221a, and then the first cover plate 221a will transfer the heat to the heat dissipation cavity 222. The heat dissipation cavity 222 can conduct the heat in a timely manner.

[0071] Meanwhile, when heat is generated on one side of the inner screen, the heat will be conducted to the heat dissipation cavity 222 through the part of the component on the inner screen side that contacts the second cover plate 221b, and the heat dissipation cavity 222 can conduct the heat in a timely manner.

[0072] For example, the first cover plate 221a and the second cover plate 221b are fixedly connected by welding.

[0073] In some embodiments, referring to FIG3, the first cover plate 221a includes a first central portion and a first edge portion disposed around the first central portion, and the second cover plate 221b includes a second central portion and a second edge portion disposed around the second central portion.

[0074] It can be seen that the heat dissipation cavity 222 is formed by the fastening of the first cover plate 221a and the second cover plate 221b.

[0075] For example, the heat dissipation cavity 222 is connected to the first chamber and the second chamber along the thickness direction of the first heat dissipation plate 22. The first cover plate 221a is provided with the first chamber, and the second cover plate 221b is provided with the second chamber. The first chamber is formed by etching the first cover plate 221a, and the second chamber is formed by etching the second cover plate 221b.

[0076] On the one hand, the first chamber and the second chamber are located on the first cover plate 221a and the second cover plate 221b, respectively. This structure is similar to a "sandwich" stacked structure, with the connecting part between the two chambers and the other parts of the chambers and the cover plates supporting each other. When the first heat dissipation plate 22 is subjected to external pressure (such as the squeezing, impact or pressure of the battery 30 during the use of the mobile phone), the first cover plate 221a and the second cover plate 221b can share the pressure, avoiding deformation or damage caused by excessive local stress.

[0077] On the other hand, for the first cover plate 221a and the second cover plate 221b, etching is performed separately to form the cavity and control the processing accuracy, which further avoids the processing error of the heat dissipation cavity 222 due to the processing of two separate parts. Furthermore, since the opening size of the first cover plate 221a and the second cover plate 221b at the communication position is the same, the first cover plate 221a and the second cover plate 221b can be etched using the same mold, and the thickness of the cavity can be adjusted according to the processing method of controlling the mold.

[0078] It should be noted that the thickness of the first chamber and the second chamber may be the same or different along the thickness direction of the first heat spreader 22. This application does not limit this.

[0079] For example, the thickness of the first chamber is less than the thickness of the second chamber. Therefore, the thickness of the first middle part corresponding to the first cover plate 221a is thicker. That is, the corresponding position where the first cover plate 221a is connected to the battery 30 can quickly introduce heat into the heat dissipation chamber 222.

[0080] Furthermore, the first edge portion and the second edge portion are fixedly connected, and the heat dissipation cavity 222 is disposed between at least a portion of the first middle portion and at least a portion of the second middle portion.

[0081] The first edge portion and the second edge portion are fixedly connected, which allows the first cover plate 221a and the second cover plate 221b to be tightly joined together to form a complete plate structure 221. The heat dissipation cavity 222 is located between at least a portion of the first middle portion and at least a portion of the second middle portion, and the heat is mainly conducted and evenly distributed between the middle regions of the two cover plates.

[0082] The fixed connection between the first and second edge portions forms a stable frame structure. This frame structure, like a framework, surrounds the central heat-spreading cavity 222, providing good support and protection for it. Simultaneously, the fixed connection method of the edge portions also helps ensure the airtightness of the heat-spreading cavity 222.

[0083] For example, the first edge portion and the second edge portion are connected by welding.

[0084] In some embodiments, the heat dissipation cavity 222 is provided with at least one connecting portion, which is connected between the first middle portion and the second middle portion.

[0085] For example, the connecting part is a welding area that is fixedly connected to the first middle part and the second middle part, effectively connecting the metal materials of the first middle part and the second middle part, ensuring the strength and stability of the connection.

[0086] The welding process provides a strong connection, ensuring a tight bond between the first and second central sections. This tight connection can withstand significant external forces, such as the pressure and impacts experienced by the phone during daily use, or the stress generated during the folding and unfolding of the foldable screen phone. The welding area effectively prevents separation or misalignment of the first and second central sections, ensuring the structural integrity of the heat dissipation cavity 222 and thus guaranteeing that the heat dissipation function of the heat dissipation plate is not affected.

[0087] In some embodiments, the mid-frame body 212 includes a motherboard support portion 213, which is a connection position on the mid-frame body 212 corresponding to the circuit board assembly, providing effective support for the circuit board assembly.

[0088] For example, the circuit board assembly is the main circuit board of the electronic device 100.

[0089] In some embodiments, referring to FIG1 and in conjunction with FIG2 and FIG5, the motherboard support portion 213 is located on the periphery of the battery compartment 211, and the main circuit board assembly 50 is disposed between the motherboard support portion 213 and the battery cover 40. At least one connection portion includes at least one first connection portion 221c, and at least one first connection portion 221c is disposed in one end of the heat dissipation cavity 222 away from the support area of ​​the motherboard support portion.

[0090] Wherein, at least one first connecting part 221c is located in the support area of ​​the heat dissipation cavity 222 away from the motherboard support part, that is, along the Y direction shown in FIG1, the first connecting part 221c corresponds to the support area away from the motherboard support part, that is, the two are located at opposite ends in the direction of the first heat dissipation plate 22.

[0091] It should be noted that the welding wire corresponding to the first connecting part 221c in this application is longer than that of a normal welding wire.

[0092] In some embodiments, the electronic device 100 provided in this application is a foldable screen mobile phone. In this case, the application includes a hinge structure 60, a middle frame body 212 having a first edge 212a, the first edge 212a being connected to the hinge structure 60, and at least one connecting part including at least one second connecting part 221d, the at least one second connecting part 221d being disposed in the end of the heat dissipation cavity 222 away from the first edge 212a.

[0093] Referring to Figures 8 and 9, Figure 8 shows a schematic diagram of the structure of the foldable screen phone in its unfolded state, and Figure 9 shows a schematic diagram of the structure of the foldable screen phone in its folded state.

[0094] In some embodiments, the middle frame body 212 has a first edge 212a, which is connected to the hinge structure 60, and at least one connection portion includes at least one second connection portion 221d, which is disposed in the end of the heat dissipation cavity 222 away from the first edge 212a.

[0095] Wherein, at least one first connecting part 221c is located in the support area of ​​the heat dissipation cavity 222 away from the motherboard support part, that is, along the X direction shown in FIG1, the first connecting part 221c corresponds to the support area away from the motherboard support part, that is, the two are located at opposite ends in the direction of the first heat dissipation plate 22.

[0096] Correspondingly, the welding wire corresponding to the second connection part 221d in this application is longer than that of a normal welding wire.

[0097] This application will be described by way of example with the first connecting part 221c and the second connecting part 221d having the same structure.

[0098] First, regarding the first heat dissipation plate 22 in this application, the first heat dissipation plate 22 is part of the middle frame 20, and its corresponding thickness is very small. This application can strengthen the internal connection strength of the first heat dissipation plate 22 through the first connecting part 221c and the second connecting part 221d. As the internal strength of the first heat dissipation plate is strengthened, even if the thickness of the first heat dissipation plate 22 is reduced, the strengthened first heat dissipation plate 22 can still meet the strength requirements for bonding between the first heat dissipation plate 22 and the battery 30.

[0099] Secondly, the reason why this application specifies the positions of the first connecting part 221c and the second connecting part 221d is that their corresponding positions are actually the positions of the first heat spreader 22 away from the heat source.

[0100] In the heat source area corresponding to the first heat spreader 22, the heat conduction path needs to be kept unobstructed and efficient. If welding reinforcement is performed in this area, the newly added reinforcement may change the heat conduction path, or thermal resistance may be generated because the thermal conductivity of the reinforcement material is different from that of the heat spreader body.

[0101] Secondly, the placement of the connecting rib at this location will not conflict with the contact area between the heat dissipation cavity 222 or the first heat dissipation plate 22 and the heat source. Moreover, from the perspective of structural mechanics, the reasonable arrangement of connecting ribs in the non-heat source area can better balance the stress distribution of the heat dissipation plate when subjected to external forces.

[0102] For example, the first connecting portion 221c and the second connecting portion 221d include a plurality of welding protrusions, which form a rectangle with a size of 6mm*2mm.

[0103] It should be noted that the corresponding dimensions can be adjusted according to the specific dimensions of the first heat spreader 22; this application is merely an illustrative example.

[0104] Specifically, this application conducted a three-point bending simulation test on the first heat spreader 22, which has the first connecting part 221c and the second connecting part 221d (the specific location and size can be adjusted according to the simulated drop stress and weak points of the battery 30 to improve reliability), and analyzed its simulated stiffness and reaction force.

[0105] For example, when the first heat-spreading plate 22 in this application is a high-modulus aluminum plate with a thickness of 0.15mm, the simulated stiffness corresponding to the three-point bending is 29.26N / mm, and the reaction force under a displacement of 1.5mm is 44.783N.

[0106] For example, when the first heat-spreading plate 22 in this application is a stainless steel heat-spreading plate with a thickness of 0.20 mm, the simulated stiffness corresponding to the three-point bending is 28.53 N / mm, and the reaction force under a displacement of 1.5 mm is 44.1882 N.

[0107] For example, when the first heat-spreading plate 22 in this application is a titanium alloy heat-spreading plate with a thickness of 0.31 mm, the simulated stiffness corresponding to the three-point bending is 28.26 N / mm, and the reaction force under a displacement of 1.5 mm is 43.8234 N.

[0108] For example, when the first heat-spreading plate 22 in this application is a titanium alloy heat-spreading plate with a thickness of 0.35 mm, the simulated stiffness corresponding to the three-point bending is 28.84 N / mm, and the reaction force under a displacement of 1.5 mm is 44.7006 N.

[0109] Further, please refer to Figure 3. The following is an exemplary description of the structure of the heat dissipation cavity 222 of this application. The heat dissipation cavity 222 includes a connected cavity portion and a support column portion 222b. The cavity portion is provided with a capillary structure 222a, and a heat-conducting medium (e.g., water) is collected inside the capillary structure 222a.

[0110] When the heat in the heat distribution cavity 222 rises, the heat-conducting medium gathered in the capillary structure 222a evaporates and enters the support column 222b, thereby dissipating the heat received by the first heat distribution plate 22. After the temperature in the support column 222b drops, the heat-conducting medium turns into a liquid and returns to the capillary structure 222a under the guidance of the wall of the support column 222b.

[0111] The capillary structure 222a includes a porous medium (such as a copper mesh), within which a heat-conducting medium is concentrated. When the electronic components inside the mobile phone (such as the battery 30 during charging and discharging, or the main circuit board assembly 50 during high-intensity operation) continuously generate heat, which is then conducted to the first heat-spreading plate 22, the heat rapidly accumulates within the heat-spreading cavity 222, causing the temperature of the cavity to rise steadily. At this time, the temperature of the heat-conducting medium within the capillary structure 222a is converted into water vapor. Under the influence of a small pressure difference and thermal convection, the water vapor flows smoothly and orderly through the connecting part into the support column 222b, thereby dissipating the heat carried by the first heat-spreading plate 22.

[0112] Meanwhile, the support column 222b can be a hollow column structure, which can further enhance the support strength of the first heat spreader 22.

[0113] In some embodiments, to meet space requirements, the thickness of the first heat spreader 22 is less than or equal to 0.3 mm.

[0114] For example, the thickness of the first heat spreader 22 is 0.1 mm, 0.2 mm, 0.3 mm, etc.

[0115] For example, by setting the material and structure of the first heat dissipation plate 22 of the mid-frame 20, this application can achieve the effect of reducing the thickness of the first heat dissipation plate 22 to 0.26mm. Thus, the first heat dissipation plate 22 in this application can both improve the utilization rate of the stacking space inside the mobile phone and meet the strength requirements of the mobile phone for the mid-frame 20.

[0116] Accordingly, this application provides an exemplary description of the dimensions of the support column 222b and the capillary structure 222a.

[0117] Along the thickness direction of the first heat spreader 22, the thickness of the chamber containing the capillary structure 222a is 0.05 mm, the thickness of the bottom wall of the chamber containing the capillary structure 222a corresponding to the first cover plate 221a is 0.05 mm, and the thickness of the bottom wall of the chamber containing the capillary structure 222a corresponding to the second cover plate 221b is 0.03 mm. The height of the support column 222b is 0.13 mm.

[0118] Since the first heat spreader 22 replaces the area of ​​the connection part corresponding to the battery 30 in the original battery compartment 211, the first cover plate 221a needs to provide the overall strength of the battery compartment 211 area and the bonding strength of the battery 30. Therefore, the bottom wall thickness of the chamber where the first cover plate 221a corresponds to the capillary structure 222a in this application is relatively large.

[0119] In some embodiments, the second cover plate 221b is located between the first cover plate 221a and the screen 10, the second middle portion includes a first middle portion and a second middle portion, and the heat dissipation cavity 222 is disposed between the first middle portion and the second middle portion.

[0120] The screen 10 includes a screen 10 body and a bent portion 102 connected to the screen 10 body. The bent portion 102 is located between the second middle portion and the screen 10 body. The second middle portion is closer to the first middle portion than the first middle portion.

[0121] For example, the bending portion 102 is a flexible printed circuit board.

[0122] The second middle section is closer to the first middle section than the first middle section. This positional relationship allows heat generated by the bending section 102 during operation to be more easily conducted to the heat dissipation cavity 222 through the second middle section. Because the second middle section is closer to the heat dissipation cavity 222 in its layout, it can accelerate the heat dissipation speed of the first heat dissipation plate 22.

[0123] In some other embodiments, referring to FIG4, the main frame 212 of this application includes a motherboard support 213, which is located on the periphery of the battery compartment 211, and the main circuit board assembly 50 is disposed between the motherboard support 213 and the battery cover 40.

[0124] The motherboard support 213 is provided with an avoidance opening, and the middle frame 20 also includes a second heat dissipation plate 23. A part of the second heat dissipation plate 23 is located between the avoidance opening and the screen 10, and a part of the second heat dissipation plate 23 is thermally connected to at least part of the main circuit board assembly 50 through the avoidance opening. Another part of the second heat dissipation plate 23 is located between the first heat dissipation plate 22 and the screen 10, and is thermally connected to the first heat dissipation plate 22.

[0125] It should be noted that the location of the clearance opening will vary depending on the internal structure of different motor equipment.

[0126] For example, the heat conduction methods mentioned in this application are all heat conduction through a graphite layer, that is, a graphite layer is arranged between two components.

[0127] Referring to Figure 2 and Figure 4, part 70 shown in the figures is the adhesive layer or other components of the electronic device, and part 80 shows the graphite layer in this application.

[0128] It should be noted that the components corresponding to parts 70 and 80 may differ in different electronic devices, and this application does not impose any restrictions on this.

[0129] In addition, when the second heat spreader 23 conflicts with the aforementioned bent portion 102 (i.e., the space between the first heat spreader 22 and the screen 10 cannot simultaneously accommodate the second heat spreader 23 and the aforementioned bent portion 102 along the Z-axis), the second heat spreader 23 and the aforementioned bent portion 102 are spaced apart along the X-axis and Y-axis, and a graphite layer is filled between the second heat spreader 23 and the aforementioned bent portion 102 along the Y-axis.

[0130] The second heat spreader 23 can form a specific heat conduction path with the screen 10 and other components near the clearance opening. At the same time, the second heat spreader 23 achieves thermal conductivity with at least a portion of the main circuit board assembly 50 through the clearance opening, and heat can be transferred between the main circuit board assembly 50 and this portion of the second heat spreader 23, thereby achieving effective heat management of the main circuit board assembly 50 and avoiding performance degradation and failure of the main circuit board assembly 50 due to overheating.

[0131] The first heat spreader 22 and the second heat spreader 23 are shown as a whole heat conduction system. When the battery 30 or other components generate heat and it is initially evenly distributed through the first heat spreader 22, the heat can be further conducted through this part of the second heat spreader 23 that is thermally connected to the first heat spreader 22. Then, combined with the part of the second heat spreader 23 located between the clearance opening and the screen 10, the heat is more comprehensively diffused and managed inside the phone, ultimately achieving a better heat dissipation effect to address the problem of reduced heat capacity and decreased heat dissipation capacity in foldable screen phones under extreme thinning and weight reduction conditions.

[0132] In some embodiments, a thermally conductive adhesive is provided between another portion of the second heat spreader 23 and the first heat spreader 22, and the thermal conductivity of the thermally conductive adhesive is greater than or equal to 3W / (m*K).

[0133] For example, the thermal conductivity of the thermally conductive adhesive can be 3W / (m*K), 4W / (m*K), 5W / (m*K), 6W / (m*K), etc.

[0134] By placing a thermally conductive adhesive with a thermal conductivity greater than or equal to 3 W / (m*K) between the second heat spreader 23 and the first heat spreader 22, it is possible to ensure rapid and efficient heat transfer between the two heat spreaders. This is because a higher thermal conductivity means that the adhesive offers less resistance to heat conduction. When a certain area of ​​the first heat spreader 22 absorbs heat, the heat can be quickly conducted to the second heat spreader 23 through the adhesive, and vice versa.

[0135] In the pursuit of extreme thinness and weight reduction in foldable screen phones, internal space is extremely precious. Thermal conductive adhesive can achieve good heat conduction in a very thin layer, ensuring effective heat transfer, maintaining the connection between components, and not taking up too much space, which meets the compact internal space design requirements of foldable screen phones.

[0136] In some embodiments, a first annular sealing layer 24 is provided between the second heat spreader 23, the main board support portion 213, and the first heat spreader 22. The first annular sealing layer 24 includes a first portion and a second portion.

[0137] The first part is located between the second heat exchange plate 23 and the first heat exchange plate 22, and the second part is located between the second heat exchange plate 23 and the main board support part 213. The two ends of the first part are respectively connected to the two ends of the second part, and the clearance opening is located between the first part and the second part.

[0138] The hinge structure 60 is relatively complex, typically consisting of multiple movable components such as pivots and connecting arms. These components have gaps between them to allow the screen 10 to fold and unfold. However, these gaps become channels through which moisture can easily enter. For example, when the phone is in a humid environment or accidentally comes into contact with liquid, water can slowly seep into the hinge through these gaps, entering the space between the first heat dissipation plate 22 and the second heat dissipation plate 23, and subsequently into the various electronic components within the phone.

[0139] The first annular sealing layer 24, comprising a first part and a second part, can effectively seal the gap between the first heat dissipation plate 22 and the second heat dissipation plate 23, preventing moisture from entering the inside of the phone.

[0140] In some embodiments, referring to FIG7 and in conjunction with FIG10, the surface of the first heat spreader 22 facing the screen 10 includes a first surface region 22a and a second surface region 22b. The second surface region 22b is located at the end of the first heat spreader 22 facing the motherboard support portion 213, and the second surface region 22b is farther from the screen 10 than the first surface region 22a. A first portion is disposed between the second heat spreader 23 and the second surface region 22b.

[0141] It is understandable that, along the thickness direction of the first heat spreader 22, the first surface and the second surface form a slope-like depression. This depression acts as a "buffer area" or "stress dispersion area". When external pressure is applied to the heat spreader, the pressure will first act on the depression. The depression can absorb and disperse some of the pressure through its shape and structural characteristics.

[0142] Referring to Figure 6, after the conventional dispensing process is completed, the first heat exchange plate 22 or the second heat exchange plate 23 will be squeezed to achieve a better adhesive effect. The pre-set recess can prevent the first heat exchange plate 22 and the second heat exchange plate 23 from collapsing during the squeezing process.

[0143] In some embodiments, referring to FIG7, a second annular sealant layer 25 is provided between the second heat spreader 23 and the first surface region 22a.

[0144] In this way, in addition to preventing collapse, the recessed area also ensures airtightness. During the extrusion process, the adhesive after dispensing is further compacted around the recessed area and at the contact points between the heat spreader and other components. The presence of the recessed area allows for a more rational distribution of the adhesive in these areas, better filling any potential micro-gaps. Furthermore, the shape and structure of the recessed area itself help create a seal-like effect, preventing external air and moisture from entering the heat spreader or the connection areas between components connected to it through gaps that may appear during extrusion, thus ensuring the airtightness of the entire electronic device 100.

[0145] In some embodiments, the height difference between the first surface region 22a and the second surface region 22b is greater than or equal to 1 mm and less than or equal to 3 mm.

[0146] For example, the height difference can be 1mm, 1.5mm, 2mm, 3mm, etc.

[0147] This height difference area can guide the pressure to be distributed along the slope (i.e., the recessed part), so that the pressure will not be concentrated on a certain point or a certain plane, thereby enhancing the pressure resistance of the first heat spreader 22 and effectively avoiding deformation or damage caused by excessive local pressure.

[0148] At the same time, it provides a space for the first annular sealant layer 24 and the second annular sealant layer 25.

[0149] In some embodiments, the first heat spreader 22 is detachably connected to the middle frame body 212.

[0150] For example, the first heat spreader 22 is connected to the middle frame body 212 by bolts.

[0151] During the use of foldable screen phones, the first heat spreader 22 may malfunction for various reasons, such as leakage of the heat-conducting medium within the heat spreader cavity 222, physical damage to the heat spreader, or a decrease in its heat dissipation performance. Because it is detachably connected to the main frame 212, repair personnel can easily remove the first heat spreader 22 from the phone for repair or directly replace it with a new one, without needing to perform a large-scale disassembly of the entire phone. This significantly reduces repair costs and difficulty, shortens repair time, and improves the user experience.

[0152] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0153] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: Screen; Battery cover; as well as, A mid-frame is disposed between the screen and the battery cover. The mid-frame includes a mid-frame body and a first heat spreader connected to the mid-frame body. The mid-frame body has a battery compartment. The first heat spreader is located between the battery compartment and the screen and forms the bottom wall of the battery compartment.

2. The electronic device according to claim 1, characterized in that, The first heat spreader includes a plate body and a heat spreader cavity disposed within the plate body. The yield modulus of the plate body is greater than or equal to 200 MPa and less than or equal to 1200 MPa.

3. The electronic device according to claim 2, characterized in that, The plate body includes a first cover plate and a second cover plate that are stacked and fixedly connected, and the heat dissipation cavity is located between the first cover plate and the second cover plate.

4. The electronic device according to claim 3, characterized in that, The first cover plate includes a first central portion and a first edge portion disposed around the first central portion; The second cover plate includes a second central portion and a second edge portion disposed around the second central portion; The first edge portion is fixedly connected to the second edge portion, and the heat dissipation cavity is disposed between at least a portion of the first middle portion and at least a portion of the second middle portion.

5. The electronic device according to claim 4, characterized in that, The heat exchange cavity is provided with at least one connecting part, which connects the first middle part and the second middle part.

6. The electronic device according to claim 5, characterized in that, It also includes the main circuit board assembly; The main frame includes a motherboard support, which is located on the periphery of the battery compartment, and the main circuit board assembly is disposed between the motherboard support and the battery cover. The at least one connecting portion includes at least one first connecting portion, which is located at one end of the heat exchange cavity away from the support area of ​​the motherboard support portion.

7. The electronic device according to claim 5 or 6, characterized in that, It also includes hinge structures; The middle frame body has a first edge, which is connected to the hinge structure. The at least one connecting part includes at least one second connecting part, which is located in the heat dissipation cavity at the end away from the first edge.

8. The electronic device according to any one of claims 4-7, characterized in that, The second cover plate is located between the first cover plate and the screen, and the second middle part includes a first middle part and a second middle part. The heat dissipation cavity is disposed between the first middle part and the second middle part. The screen includes a screen body and a bent portion connected to the screen body. The bent portion is located between the second middle portion and the screen body, and the second middle portion is closer to the second middle portion relative to the first middle portion.

9. The electronic device according to any one of claims 1-8, characterized in that, It also includes the main circuit board assembly; The main frame includes a motherboard support, which is located on the periphery of the battery compartment, and the main circuit board assembly is disposed between the motherboard support and the battery cover. The motherboard support portion is provided with an avoidance opening, and the middle frame further includes a second heat dissipation plate. A portion of the second heat dissipation plate is located between the avoidance opening and the screen, and the portion of the second heat dissipation plate is thermally connected to at least a portion of the main circuit board assembly via the avoidance opening. Another portion of the second heat spreader is located between the first heat spreader and the screen, and is thermally connected to the first heat spreader.

10. The electronic device according to claim 9, characterized in that, A thermally conductive adhesive is provided between the other part of the second heat spreader and the first heat spreader, and the thermal conductivity of the thermally conductive adhesive is greater than or equal to 3W / (m*K).

11. The electronic device according to claim 9, characterized in that, A first annular sealant layer is provided between the second heat spreader, the main board support, and the first heat spreader. The first annular sealant layer includes a first part and a second part. The first part is disposed between the second heat spreader and the first heat spreader, the second part is disposed between the second heat spreader and the main board support, the two ends of the first part are respectively connected to the two ends of the second part, and the clearance opening is located between the first part and the second part.

12. The electronic device according to claim 11, characterized in that, The surface of the first heat spreader facing the screen includes a first surface area and a second surface area. The second surface area is located at the end of the first heat spreader facing the motherboard support and is farther from the screen than the first surface area. The first portion is located between the second heat spreader and the second surface area.

13. The electronic device according to claim 12, characterized in that, A second annular sealant layer is provided between the second heat spreader and the first surface area.

14. The electronic device according to claim 12, characterized in that, The height difference between the first surface region and the second surface region is greater than or equal to 1 mm and less than or equal to 3 mm.

15. The electronic device according to any one of claims 1-14, characterized in that, The first heat spreader is detachably connected to the main body of the middle frame.

16. The electronic device according to any one of claims 1-15, characterized in that, The thickness of the first heat spreader is less than or equal to 0.3 mm.

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