Method of inspecting and / or processing a sample and system thereof

By generating an electrically conducting loop to manage surface charges, the method addresses charge accumulation issues in semiconductor inspection and processing, improving milling uniformity and image resolution.

WO2026114594A1PCT designated stage Publication Date: 2026-06-04CARL ZEISS SMT GMBH
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
CARL ZEISS SMT GMBH
Filing Date
2025-10-29
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

Charged particle beams used in semiconductor inspection and processing cause surface charge accumulation, leading to image distortion and milling inaccuracies due to the lack of grounding paths, especially in insulating materials, which complicates nanometer resolution tomography.

Method used

An electrically conducting loop is generated around the site of interest on the semiconductor sample, allowing accumulated charges to dissipate, and optionally connected to a ground or external capacity to manage surface charges, using charged particle beams for inspection and processing.

Benefits of technology

The method reduces surface charge effects, improving milling uniformity and image resolution by equalizing electric fields and preventing charge interference, thus enhancing the precision of semiconductor inspection and processing.

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Abstract

The present disclosure refers to a method of inspecting and / or processing a sample and a corresponding system. The method comprises generating an electrically conducting loop around a site of interest of a sample, and inspecting and / or processing the site of interest with at least one charged particle beam.
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