Semiconductor device and manufacturing method for same

Abstract

A printed circuit board (2) is disposed on an upper surface of a metal plate (1). The printed circuit board (2) includes an opening (3) that exposes a portion of the upper surface of the metal plate (1), and wiring patterns (4, 5, 6). A semiconductor chip (9) is mounted on the upper surface of the metal plate (1) in the opening (3) and is connected to the wiring patterns (4, 5, 6). A signal terminal (12) is bonded to the wiring pattern (6) on the upper surface of the printed circuit board (2). A sealing resin (13) seals the printed circuit board (2), the semiconductor chip (9), and the signal terminal (12). An upper end portion of the signal terminal (12) is exposed from an upper surface of the sealing resin (13). The signal terminal (12) has a spring structure that is elastically deformable in a vertical direction.

Description

Semiconductor Device and Method for Manufacturing the Same

[0001] The present disclosure relates to a semiconductor device and a method for manufacturing the same.

[0002] There has been proposed a semiconductor device in which a printed circuit board is disposed on a metal plate, a semiconductor chip is mounted on the metal plate exposed from an opening of the printed circuit board, and these are mold-sealed with a sealing material (see, for example, Patent Document 1). In a conventional semiconductor device, heat dissipation is performed from the lower surface, and signal input / output is also performed from the lower surface.

[0003] Japanese Patent No. 7080322

[0004] There is a demand for performing signal input / output from the upper surface of the device. For this purpose, it is necessary to draw out signal terminals joined to a wiring pattern on the upper surface of the printed circuit board from the upper surface of the sealing material. However, due to variations in the member sizes of the metal plate, the printed circuit board, and the signal terminals, the height from the lower surface of the metal plate to the upper end of the signal terminals varies. Since the height of the cavity of the mold for accommodating these members during mold-sealing is fixed, the height variation of the members hinders mold-sealing.

[0005] The present disclosure has been made to solve the above-described problems, and an object thereof is to obtain a semiconductor device and a method for manufacturing the same that can absorb height variations of members during mold-sealing.

[0006] The semiconductor device according to the present disclosure includes a metal plate, a printed circuit board having an opening disposed on the upper surface of the metal plate and exposing a part of the upper surface of the metal plate, a wiring pattern, a semiconductor chip mounted on the upper surface of the metal plate in the opening and connected to the wiring pattern, signal terminals joined to the wiring pattern on the upper surface of the printed circuit board, and a sealing material for sealing the printed circuit board, the semiconductor chip, and the signal terminals, wherein a part of the signal terminals is exposed from the upper surface of the sealing material, and the signal terminals have a spring structure having elasticity in the vertical direction.

[0007] In the present disclosure, the signal terminals have a spring structure having elasticity in the vertical direction. Therefore, height variations of members during mold-sealing can be absorbed.

[0008] This is a cross-sectional view showing a semiconductor device according to Embodiment 1. This is a top view showing the interior of the semiconductor device according to Embodiment 1. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 1. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 1. This is a cross-sectional view showing a system according to Embodiment 1. This is a cross-sectional view showing a system according to a comparative example. This is a cross-sectional view showing a semiconductor device according to Embodiment 2. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 2. This is a top view showing the manufacturing process of the semiconductor device according to Embodiment 2. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 2. This is a cross-sectional view showing the signal terminals according to Embodiment 2. This is a perspective view showing the signal terminals according to Embodiment 2. This is a cross-sectional view showing a semiconductor device according to Embodiment 3. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 3. This is a top view showing the manufacturing process of the semiconductor device according to Embodiment 3. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 3. This is a cross-sectional view showing the signal terminals according to Embodiment 3. This is a side view showing the signal terminals according to Embodiment 3. This is a perspective view showing the signal terminals according to Embodiment 3. This is a cross-sectional view showing a semiconductor device according to Embodiment 4. This is a cross-sectional view showing the manufacturing process of the semiconductor device according to Embodiment 4. This is a top view showing the manufacturing process of the semiconductor device according to Embodiment 4. This is a cross-sectional view showing the manufacturing process of a semiconductor device according to Embodiment 4. This is a cross-sectional view showing a semiconductor device according to Embodiment 5. This is a cross-sectional view showing the manufacturing process of a semiconductor device according to Embodiment 5.

[0009] A semiconductor device according to an embodiment and a method for manufacturing the same will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repetition of the description may be omitted.

[0010] Embodiment 1 Figure 1 is a cross-sectional view showing a semiconductor device according to Embodiment 1. Figure 2 is a top view showing the inside of the semiconductor device according to Embodiment 1. The metal plate 1 is, for example, a thick copper member. A printed circuit board 2 is placed on the upper surface of the metal plate 1. The printed circuit board 2 has an opening 3 that exposes a part of the upper surface of the metal plate 1, and wiring patterns 4, 5, and 6. The wiring patterns 5 and 6 are connected to internal wiring 8 inside the board via vias 7.

[0011] A semiconductor chip 9 is mounted on the upper surface of a metal plate 1 within an opening 3. The semiconductor chip 9 is a transistor or the like that processes high-frequency signals. A back electrode is formed on the back surface of the semiconductor chip 9 by plating. The back electrode is a GND electrode such as a source electrode, and is soldered to the metal plate 1, allowing for heat dissipation from the back electrode. The signal electrode on the upper surface of the semiconductor chip 9 is connected to a wiring pattern 4 by a metal wire 10. Electronic components 11 are mounted on a printed circuit board 2 and connected to wiring patterns 4 and 5. The electronic components 11 are chip capacitors, resistors, or IC chips for bias control.

[0012] The signal terminal 12 is bonded to the wiring pattern 6 on the upper surface of the printed circuit board 2. The sealing resin 13, which is a sealing material, molds and seals the printed circuit board 2, the semiconductor chip 9, and the signal terminal 12. A bias is supplied to the semiconductor chip 9 from outside the device, or a signal is input or output, via the wiring patterns 4, 5, 6, via 7, internal wiring 8, electronic components 11, and signal terminal 12.

[0013] The signal terminal 12 is a thin metal plate bent in two or more places. Specifically, the thin metal plate is bent to form a lower plate 12a, an inclined plate 12b, and an upper plate 12c. The lower plate 12a extends along the upper surface of the printed circuit board 2, is soldered to the wiring pattern 6, and is connected to the lower end of the inclined plate 12b. The inclined plate 12b extends diagonally upward relative to the upper surface of the printed circuit board 2. The upper plate 12c extends along the upper surface of the sealing resin 13 and is connected to the upper end of the inclined plate 12b. This Z-shaped thin metal plate of the signal terminal 12 has a spring structure with elasticity in the vertical direction. The upper surface of the upper plate 12c, which is the upper end of the signal terminal 12, is exposed from the upper surface of the sealing resin 13. However, the tip of the upper plate 12c is bent downward. This tip bites into the inside of the sealing resin 13, preventing the signal terminal 12 from coming out of the sealing resin 13.

[0014] Figures 3 and 4 are cross-sectional views showing the manufacturing process of a semiconductor device according to Embodiment 1. First, as shown in Figure 3, a printed circuit board 2 is placed on a metal plate 1. A semiconductor chip 9 is mounted on the upper surface of the metal plate 1 exposed by the opening 3, and the semiconductor chip 9 and the wiring pattern 4 are connected by wires. Signal terminals 12 are soldered to the wiring pattern 6 on the upper surface of the printed circuit board 2.

[0015] Next, as shown in Figure 4, the metal plate 1, printed circuit board 2, semiconductor chip 9, and signal terminal 12 are sandwiched between the upper mold 14 and the lower mold 15 and housed in the cavity 16. Release films 17 are provided on the inner surfaces of the upper mold 14 and the lower mold 15. The upper end of the signal terminal 12 is pressed against the upper mold 14 via the release film 17. In this state, sealing resin 13 is injected into the cavity 16 to mold-seal it with the sealing resin 13.

[0016] Here, the height from the lower surface of the metal plate 1 to the upper end of the signal terminal 12 is affected by variations in the size of the metal plate 1, printed circuit board 2, wiring pattern 6, and signal terminal 12. However, in this embodiment, the signal terminal 12 has a spring structure that is elastic in the vertical direction. This spring structure can absorb variations in the height of the components during mold sealing. Also, because the signal terminal 12 is a thin metal plate, the sealing resin 13 flows in well during mold sealing.

[0017] The upper end of the signal terminal 12 is embedded in the release film 17, so after mold sealing, the upper end of the signal terminal 12 is exposed from the upper surface of the sealing resin 13. If there is no release film 17, the sealing resin 13 may seep into the small gap between the upper mold 14 and the signal terminal 12, potentially preventing the signal terminal 12 from being exposed. The thickness of the release film 17 is about 50 μm, so after mold sealing, the signal terminal 12 protrudes a few μm to more than 10 μm from the upper surface of the sealing resin 13.

[0018] Figure 5 is a cross-sectional view showing the system according to Embodiment 1. The semiconductor device 18 is the semiconductor device according to the above embodiment. A heat sink 19 is bonded to the metal plate 1 on the lower surface of the semiconductor device 18. A wiring board 20 is arranged on the upper side of the semiconductor device 18, and an antenna 21 is arranged above the wiring board 20. The signal terminal 12 on the upper surface of the semiconductor device 18 and the antenna 21 are connected by wiring 22 on the wiring board 20.

[0019] Next, the effects of the system of this embodiment will be explained in comparison with the comparative example. Figure 6 is a cross-sectional view showing the system of the comparative example. The semiconductor device 23 of the comparative example dissipates heat from its bottom surface while also inputting and outputting signals. For this reason, the wiring board 24 placed on the bottom side of the semiconductor device 23 is used for inputting and outputting signals. For this reason, it is necessary to embed a metal plate 25 in the wiring board 24. In addition, it is necessary to provide an electromagnetic shield 26 between the antenna 21 placed on the top side of the semiconductor device 23 and the semiconductor device 23.

[0020] In contrast, the semiconductor device 18 of this embodiment dissipates heat from the bottom while inputting and outputting signals from the top. Since signal input and output are performed on the wiring board 20 located on the top side of the semiconductor device 18, there is no need to embed a metal plate 25 in the wiring board 20. Furthermore, since the heat sink 19 also functions as a shield, there is no need to provide an electromagnetic shield 26. As a result, the system of this embodiment can be made smaller compared to the comparative example.

[0021] Embodiment 2 Figure 7 is a cross-sectional view showing a semiconductor device according to Embodiment 2. The signal terminal 12 has a projection 12d provided on the upper surface of the upper plate 12c. The upper plate 12c is not exposed from the sealing resin 13, while the projection 12d is exposed from the upper surface of the sealing resin 13. By exposing the projection 12d in this way to ensure contact, and embedding the upper plate 12c inside the sealing resin 13, it is possible to prevent the signal terminal 12 from coming out of the sealing resin 13. Other configurations and effects are the same as in Embodiment 1.

[0022] Figures 8, 10, and 11 are cross-sectional views showing the manufacturing process of a semiconductor device according to Embodiment 2. Figure 9 is a top view showing the manufacturing process of a semiconductor device according to Embodiment 2. First, as shown in Figures 8 and 9, a printed circuit board 2 is placed on a metal plate 1. The printed circuit board 2 has a plurality of device regions 27. The configuration of each device region 27 corresponds to the configuration of the printed circuit board 2 in Embodiment 1. In each device region 27, a semiconductor chip 9 is mounted on the upper surface of the metal plate 1 exposed by the opening 3, and the semiconductor chip 9 is connected to the wiring pattern 4. In each device region 27, a signal terminal 12 is joined to the wiring pattern 6 on the upper surface of the printed circuit board 2.

[0023] The lower plates 12a of the signal terminals 12 in adjacent device regions 27 are connected to each other by metal connecting parts 12e. The upper plates 12c of the signal terminals 12 in adjacent device regions 27 are separated from each other. In each device region 27, multiple signal terminals 12 are joined to multiple wiring patterns 6 arranged in a row, and are connected to each other by metal connecting parts 12e.

[0024] Figure 12 is a top view showing the signal terminals according to Embodiment 2. Figure 13 is a side view showing the signal terminals according to Embodiment 2. Figure 14 is a perspective view showing the signal terminals according to Embodiment 2. A pair of symmetrical signal terminals 12 are connected to each other by a metal connecting portion 12e, and multiple such pairs are arranged in a line at regular intervals and connected to each other by the metal connecting portions 12e.

[0025] Next, as shown in Figure 10, the metal plate 1, printed circuit board 2, semiconductor chip 9, and signal terminal 12 are sandwiched between the upper mold 14 and the lower mold 15 and housed in the cavity 16. At this time, the projection 12d, which is the upper end of the signal terminal 12, is pressed against the upper mold 14. Since the signal terminal 12 has a spring structure that is elastic in the vertical direction, it can absorb variations in the height of the components.

[0026] Next, as shown in Figure 11, the printed circuit board 2 and metal plate 1 are molded and sealed with sealing resin 13. The molded and sealed printed circuit board 2 and metal plate 1 are then diced to separate each device region 27. At this time, the metal connecting portion 12e is cut to separate the signal terminals 12 of adjacent device regions 27 from each other, and also separate the multiple signal terminals 12 of each device region 27 from each other.

[0027] In this embodiment, multiple signal terminals 12 are connected to each other by metal connecting parts 12e. Since the size of such a collection of multiple signal terminals 12 is large, the size of the transport mechanism can also be increased. The self-supporting nature of this collection of multiple signal terminals 12 improves handling. Furthermore, since the upper plates 12c of adjacent signal terminals 12 are separated from each other, the signal terminals 12 can bend easily and exhibit elasticity.

[0028] Embodiment 3 Figure 15 is a cross-sectional view showing a semiconductor device according to Embodiment 3. The orientation of the Z-shaped metal plate of the signal terminal 12 is reversed compared to Embodiment 2. The other configurations and effects are the same as in Embodiment 2.

[0029] Figures 16, 18, and 19 are cross-sectional views showing the manufacturing process of a semiconductor device according to Embodiment 3. Figure 17 is a top view showing the manufacturing process of a semiconductor device according to Embodiment 3.

[0030] First, as shown in Figures 16 and 17, the printed circuit board 2 is placed on the metal plate 1. The printed circuit board 2 has multiple device regions 27. In each device region 27, a semiconductor chip 9 is mounted on the upper surface of the metal plate 1 exposed by the opening 3, and the semiconductor chip 9 is connected to the wiring pattern 4. In each device region 27, the signal terminals 12 are joined to the wiring pattern 6 on the upper surface of the printed circuit board 2.

[0031] The upper plates 12c of the signal terminals 12 in adjacent device regions 27 are connected to each other by a metal connecting portion 12e. The lower plates 12a of the signal terminals 12 in adjacent device regions 27 are separated from each other. In each device region, multiple signal terminals 12 are soldered to multiple wiring patterns 6 arranged in a row.

[0032] Figure 20 is a top view showing the signal terminals according to Embodiment 3. Figure 21 is a side view showing the signal terminals according to Embodiment 3. Figure 22 is a perspective view showing the signal terminals according to Embodiment 3. A pair of symmetrical signal terminals 12 are connected to each other by a metal connecting portion 12e, and multiple such pairs are arranged in a line at regular intervals and connected to each other by the metal connecting portions 12e.

[0033] Next, as shown in Figure 18, the metal plate 1, printed circuit board 2, semiconductor chip 9, and signal terminal 12 are sandwiched between the upper mold 14 and the lower mold 15 and housed in the cavity 16. At this time, the upper end of the signal terminal 12 is pressed against the upper mold 14. Since the signal terminal 12 has a spring structure that is elastic in the vertical direction, it can absorb variations in the height of the components.

[0034] Next, as shown in Figure 19, the printed circuit board 2 and metal plate 1 are molded and sealed with sealing resin 13. The molded and sealed printed circuit board 2 and metal plate 1 are then diced to separate each device region 27. At this time, the metal connecting portion 12e is cut to separate the signal terminals 12 of adjacent device regions 27 from each other, and also separate the multiple signal terminals 12 of each device region 27 from each other.

[0035] In this embodiment, multiple signal terminals 12 are connected to each other by metal connecting parts 12e. Because this assembly of multiple signal terminals 12 is large in size, the size of the transport mechanism can also be increased. The self-supporting nature of this assembly of multiple signal terminals 12 improves handling. Furthermore, since the upper plates 12c of the signal terminals 12 in adjacent device regions 27 are connected to each other by metal connecting parts 12e, it is easy to check from above whether the metal connecting parts 12e have been cut during dicing.

[0036] Embodiment 4 Figure 23 is a cross-sectional view showing a semiconductor device according to Embodiment 4. The signal terminal 12 is embedded in the resin block 28. The sealing resin 13 molds and seals the printed circuit board 2, the semiconductor chip 9, and the resin block 28. The sealing resin 13 is made of epoxy resin with a dielectric constant of 4. The resin block 28 is made of LCP (liquid crystal polymer) with a dielectric constant of 3.5, PPS (polyphenylene sulfide) with a dielectric constant of 3.7, or PEE (polyphenylene ether) with a dielectric constant of 3.2. Since the resin block 28 and the sealing resin 13 are made of different materials, the dielectric constant around the signal terminal 12 can be adjusted by the material of the resin block 28. Other configurations and effects are the same as in Embodiment 2.

[0037] Figures 24, 26, and 27 are cross-sectional views showing the manufacturing process of a semiconductor device according to Embodiment 4. Figure 25 is a top view showing the manufacturing process of a semiconductor device according to Embodiment 4. First, as shown in Figures 24 and 25, the signal terminals 12 are embedded in the resin block 28. The signal terminals 12 embedded in the resin block 28 are soldered to the wiring pattern 6 on the top surface of the printed circuit board 2.

[0038] Next, as shown in Figure 26, the metal plate 1, printed circuit board 2, semiconductor chip 9, signal terminal 12, and resin block 28 are sandwiched between the upper mold 14 and the lower mold 15 and housed in the cavity 16. At this time, the upper end of the signal terminal 12 is pressed against the upper mold 14.

[0039] Next, as shown in Figure 27, the printed circuit board 2 and metal plate 1 are molded and sealed with sealing resin 13. The molded and sealed printed circuit board 2 and metal plate 1 are then diced to separate each device region 27. At this time, the metal connecting portion 12e is cut to separate the signal terminals 12 of adjacent device regions 27 from each other, and also separate the multiple signal terminals 12 of each device region 27 from each other.

[0040] In this embodiment, the signal terminals 12 are embedded in the resin block 28. The resin block 28 with the embedded signal terminals 12 has a larger handling area compared to the signal terminals 12 alone, making it easier to handle and allowing for transport by suction, etc.

[0041] Furthermore, since the resin block 28 is softer than the sealing resin 13, the resin block 28 in which the signal terminals 12 are embedded also has elasticity in the vertical direction. Therefore, when sandwiched between the upper mold 14 and the lower mold 15, the resin block 28 shrinks together with the signal terminals 12, absorbing variations in the height of the components.

[0042] Embodiment 5 Figure 28 is a cross-sectional view showing a semiconductor device according to Embodiment 5. The orientation of the Z-shaped metal plate of the signal terminal 12 is reversed compared to Embodiment 4. The other configurations and effects are the same as in Embodiment 4.

[0043] Figure 29 is a cross-sectional view showing the manufacturing process of a semiconductor device according to Embodiment 5. Similar to Embodiment 4, the signal terminals 12 embedded in the resin block 28 are soldered to the wiring pattern 6 on the upper surface of the printed circuit board 2. Next, the metal plate 1, printed circuit board 2, semiconductor chip 9, signal terminals 12, and resin block 28 are sandwiched between the upper mold 14 and the lower mold 15 and housed in the cavity 16. After that, the device is mold-sealed with sealing resin 13. The other steps and effects are the same as in Embodiment 4.

[0044] 1 Metal plate, 2 Printed circuit board, 3 Opening, 4, 5, 6 Wiring pattern, 9 Semiconductor chip, 12 Signal terminal, 12a Bottom plate, 12b Inclined plate, 12c Top plate, 12d Protrusion, 12e Metal connecting part, 13 Sealing resin (sealing material), 14 Upper mold, 15 Lower mold, 16 Cavity, 27 Device area, 28 Resin block (sealing material)

Claims

1. A semiconductor device comprising: a metal plate; a printed circuit board having an opening disposed on the upper surface of the metal plate and exposing a part of the upper surface of the metal plate, and a wiring pattern; a semiconductor chip mounted on the upper surface of the metal plate within the opening and connected to the wiring pattern; a signal terminal bonded to the wiring pattern on the upper surface of the printed circuit board; and a sealing material that seals the printed circuit board, the semiconductor chip, and the signal terminal, wherein the upper end of the signal terminal is exposed from the upper surface of the sealing material, and the signal terminal has a spring structure that is elastic in the vertical direction.

2. The semiconductor device according to claim 1, characterized in that the spring structure is a thin metal plate bent at two or more points.

3. The semiconductor device according to claim 2, characterized in that the thin metal plate is bent to form a lower plate, an inclined plate, and an upper plate; the lower plate extends along the upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to the lower end of the inclined plate; the inclined plate extends diagonally upward with respect to the upper surface of the printed circuit board; and the upper plate extends along the upper surface of the sealing material and is connected to the upper end of the inclined plate.

4. The semiconductor device according to claim 3, characterized in that the upper plate is exposed from the upper surface of the sealing material.

5. The semiconductor device according to claim 3, characterized in that the signal terminal has a projection provided on the upper surface of the upper plate, the upper plate is not exposed from the sealing material, and the projection is exposed from the upper surface of the sealing material.

6. The semiconductor device according to any one of claims 3 to 5, characterized in that the tip of the upper plate is bent downward.

7. The semiconductor device according to any one of claims 1 to 6, wherein the sealing material comprises a resin block in which the signal terminals are embedded, and a sealing resin that molds and seals the printed circuit board, the semiconductor chip, and the resin block, and the resin block and the sealing resin are made of different materials.

8. The semiconductor device according to claim 7, characterized in that the resin block is softer than the sealing resin.

9. A method for manufacturing a semiconductor device, comprising the steps of: placing a printed circuit board having a plurality of device regions having openings and wiring patterns on a metal plate; mounting a semiconductor chip on the upper surface of the metal plate exposed by the opening in each device region and connecting the semiconductor chip to the wiring pattern; joining a signal terminal to the wiring pattern on the upper surface of the printed circuit board in each device region; housing the metal plate, the printed circuit board, the semiconductor chip and the signal terminal in a cavity sandwiched between an upper mold and a lower mold and molding and sealing with a sealing material; and dicing the molded printed circuit board and the metal plate to separate the device regions, wherein the upper end of the signal terminal is pressed against the upper mold during molding and sealing, and the signal terminal has a spring structure that is elastic in the vertical direction.

10. The method for manufacturing a semiconductor device according to claim 9, characterized in that the signal terminals that join to the wiring pattern of adjacent device regions are connected to each other by a metal connecting portion, and the metal connecting portion is cut during dicing to separate the signal terminals of adjacent device regions from each other.

11. The method for manufacturing a semiconductor device according to claim 10, characterized in that the signal terminals are bent to form a lower plate, an inclined plate, and an upper plate; the lower plate extends along the upper surface of the printed circuit board, is joined to the wiring pattern, and is connected to the lower end of the inclined plate; the inclined plate extends diagonally upward with respect to the upper surface of the printed circuit board; and the upper plate extends along the upper surface of the sealing material and is connected to the upper end of the inclined plate.

12. The method for manufacturing a semiconductor device according to claim 11, characterized in that the lower plates of the signal terminals of adjacent device regions are connected to each other by the metal connecting portion, and the upper plates of the signal terminals of adjacent device regions are separated from each other.

13. The method for manufacturing a semiconductor device according to claim 12, characterized in that the tip of the upper plate is bent downward.

14. The method for manufacturing a semiconductor device according to claim 11, characterized in that the upper plates of the signal terminals of adjacent device regions are connected to each other by the metal connecting portion, and the lower plates of the signal terminals of adjacent device regions are separated from each other.

15. The method for manufacturing a semiconductor device according to any one of claims 11 to 14, characterized in that the signal terminal has a projection provided on the upper surface of the upper plate, and the projection is pressed against the upper mold during mold sealing.

16. A method for manufacturing a semiconductor device according to any one of claims 10 to 15, characterized in that a plurality of wiring patterns are provided in each device region, a plurality of signal terminals are joined to the plurality of wiring patterns in each device region, and are connected to each other by the metal connecting portion, and the metal connecting portion is cut during dicing to separate the plurality of signal terminals in each device region from each other.

17. The method for manufacturing a semiconductor device according to any one of claims 10 to 16, characterized in that the sealing material comprises a resin block made of different materials and a sealing resin, the signal terminals are embedded in the resin block, the signal terminals embedded in the resin block are joined to the wiring pattern on the upper surface of the printed circuit board, and the device is mold-sealed with the sealing resin.

18. The method for manufacturing a semiconductor device according to claim 17, characterized in that the resin block is softer than the sealing material.

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