Mounting substrate, substrate unit, clothing processing device, and production method for substrate unit

Abstract

Provided are a mounting substrate, a substrate unit, a clothing processing device, and a production method for the substrate unit that make it possible to suppress the amount of potting resin used. A mounting substrate (103) has a plurality of through holes that pass from a first surface to a second surface in a plate thickness direction. An electronic component (104) is mounted in at least a portion of the through holes, and the through holes in which an electronic component (104) is not mounted are plugged with solder (115).

Description

Mounting Substrate, Substrate Unit, Clothing Treatment Apparatus, and Method for Manufacturing Substrate Unit

[0001] The present disclosure relates to a mounting substrate, a substrate unit, a clothing treatment apparatus, and a method for manufacturing a substrate unit.

[0002] Patent Document 1 discloses a substrate unit manufactured by forming a region sealed with a potting resin and a region not sealed on the upper surface of a substrate, and filling a part of the sealed region of the substrate with the potting resin.

[0003] Japanese Unexamined Patent Application Publication No. 2020 - 35939

[0004] The present disclosure provides a mounting substrate, a substrate unit, a clothing treatment apparatus, and a method for manufacturing a substrate unit that can suppress the amount of potting resin used.

[0005] The mounting substrate in the present disclosure is provided with a plurality of through - holes penetrating in the plate - thickness direction from the first surface to the second surface, at least a part of the through - holes is mounted with electronic components, and the through - holes where the electronic components are not mounted are blocked by solder.

[0006] The substrate unit in the present disclosure includes the mounting substrate and a bottomed case that houses the mounting substrate, and inside the case, the first surface side where the electronic components of the mounting substrate are arranged is filled with potting resin.

[0007] The clothing treatment apparatus in the present disclosure has the substrate unit housed in the apparatus main body.

[0008] The method for manufacturing a substrate unit in the present disclosure includes a preparation step of preparing the mounting substrate, a housing step of housing the mounting substrate in a bottomed case, and a filling step of filling potting resin on the first surface side where the electronic components of the mounting substrate are arranged inside the case.

[0009] According to the present disclosure, the amount of potting resin used can be suppressed.

[0010] A schematic cross-sectional view showing the configuration of the garment processing apparatus of the embodiment. A schematic cross-sectional view showing the substrate unit of the embodiment. A schematic cross-sectional view showing the through-holes of the mounted substrate of the embodiment before soldering. A schematic cross-sectional view showing the through-holes of the mounted substrate of the embodiment after soldering. A schematic cross-sectional view showing the non-through holes of the mounted substrate of the embodiment before soldering. A schematic cross-sectional view showing the non-through holes of the mounted substrate of the embodiment after soldering. A schematic diagram showing the flow equipment. A schematic cross-sectional view showing a conventional substrate unit.

[0011] (Knowledge and other information forming the basis of this disclosure) At the time the inventors conceived of this disclosure, as described in Patent Document 1, there was a technology to manufacture a substrate unit by forming a region to be sealed with potting resin and a region not to be sealed on the upper surface of a substrate, and filling a part of the sealed region of the substrate with potting resin.

[0012] However, the inventors discovered a problem in which, when using a double-sided substrate different from the single-sided substrate described in Patent Document 1, if the substrate is housed in a bottomed case and potting resin is filled into the component side of the substrate where the electronic components are placed inside the case, the potting resin may flow out to the opposite side of the substrate from the component side, making it difficult to control the amount of potting resin used. The subject matter of this disclosure was established in order to solve this problem.

[0013] Therefore, this disclosure provides a mounting substrate, a substrate unit, a clothing processing apparatus, and a method for manufacturing a substrate unit that can reduce the amount of potting resin used.

[0014] The embodiments will be described in detail below with reference to the drawings. However, some unnecessarily detailed explanations may be omitted. For example, detailed explanations of already well-known matters or redundant explanations of substantially identical configurations may be omitted.

[0015] The attached drawings and the following description are provided to enable those skilled in the art to fully understand this disclosure and are not intended to limit the subject matter described in the claims.

[0016] (Embodiment) [1-1. Configuration] [1-1-1. Configuration of the washing machine and dryer] Figure 1 is a schematic cross-sectional view showing the configuration of the washing machine and dryer 1 of the embodiment.

[0017] Washer dryer 1 is an example of a "clothing processing device".

[0018] Note that Figure 1 is merely a schematic diagram illustrating the configuration of the washing machine / dryer 1, and the installation location and size of each part of the washing machine / dryer 1 are not limited to those shown in Figure 1.

[0019] The washing machine 1 comprises a housing 10, a washing tub 11, a drive motor 12, a liquid supply unit 13, and a heating and blowing unit 15. The washing tub 11 includes an outer tub 21 and an inner tub 22, which will be described later.

[0020] An opening 16 is formed on the front of the housing 10, and a door 17 is provided in the opening 16. A water inlet 18 is formed on the top of the housing 10. The water inlet 18 is a connection port for connecting a hose that supplies water to the washing tub 11 via the liquid supply unit 13. A drain valve 19 is provided on the bottom of the housing 10. The drain valve 19 is a valve for draining the wash water stored in the washing tub 11 through the opening 20. The opening 20 is a drain port for draining the wash water from the washing tub 11 to the outside.

[0021] The outer tub 21 is a substantially cylindrical member located inside the housing 10 and has the function of storing washing water. The outer tub 21 comprises a cylindrical portion 23 and a bottom portion 24 that closes one end of the cylindrical portion 23. The central axis CA of the outer tub 21 is an axis that passes through the center of the bottom portion 24 and is inclined with respect to the installation surface.

[0022] An opening 25 is formed in the outer tank 21, facing the opening 16 of the housing 10. Openings 20 and 26 for water passage are formed in the outer tank 21. Opening 26 is connected to a flow path 27 that connects the liquid supply unit 13 and the outer tank 21.

[0023] The outer tank 21 has an exhaust port 28 and an air intake port 29. The exhaust port 28 and the air intake port 29 are openings connected to the drying path 33. The drying path 33 is equipped with a heat pump device 30 and a blower fan 31.

[0024] The heat pump device 30 includes, for example, a heating heat exchanger, a dehumidifying heat exchanger, a compressor, a throttling mechanism, and refrigerant piping. The blower fan 31 draws air from inside the washing tub 11 through the exhaust port 28 and sends the heated air through the heat pump device 30 towards the air intake port 29, thereby supplying air to the washing tub 11.

[0025] The inner tub 22 is a drum and is rotatably mounted inside the outer tub 21 with its central axis CA as the axis of rotation. The inner tub 22 is a substantially cylindrical member capable of containing the material to be processed PO. The inner tub 22 has numerous through holes 34 formed on its circumferential surface. The through holes 34 connect the inner tub 22 and the outer tub 21, allowing washing water and air to move between the inner tub 22 and the outer tub 21. The inner tub 22 has an opening 35 formed at a position opposite to the opening 16 of the housing 10 and the opening 25 of the outer tub 21.

[0026] The drive motor 12 is a motor that rotates the inner tank 22.

[0027] The liquid supply unit 13 is a unit that supplies a predetermined amount of liquid from a liquid storage tank 130 to the washing tub 11. The liquid supply unit 13 is located inside the housing 10, above the outer tub 21. The upper part of the liquid supply unit 13 faces an openable and closable cover 36 provided on the housing 10.

[0028] The liquid supply unit 13 comprises a tank 130, a case 131, a liquid supply device 132, and a water supply valve 134. Multiple tanks 130 may be provided inside the case 131.

[0029] The liquid supply device 132 draws a predetermined amount of the agent from the tank 130 and discharges it into the flow path 27.

[0030] The flow path 27 is connected to the liquid supply device 132, and supplies water supplied from the water inlet 18 and the liquid discharged by the liquid supply device 132 to the outer tank 21 via the case 131.

[0031] The water supply valve 134 controls the inflow of water from the water inlet 18. The water that flows in from the water inlet 18 flows into the outer tank 21 via the case 131.

[0032] The washing machine 1 includes a circuit board unit 100. The circuit board unit 100 is positioned vertically below the opening 16, close to the surface of the housing 10 where the opening 16 is provided. The circuit board unit 100 is the controller of the washing machine 1, which controls the overall operation of the washing machine 1. The circuit board unit 100 includes a case 101, a mounting circuit board 103 housed in the case 101, and a potting resin 105 (see Figure 2), described later, which covers one side of the mounting circuit board 103 inside the case 101.

[0033] [1-1-2. Configuration of the substrate unit] Figure 2 is a schematic cross-sectional view of the substrate unit 100. Figure 2 shows a longitudinal cross-section in the plane passing through the through-hole 113 and the non-through-hole 117.

[0034] The board unit 100 includes a bottomed case 101 that houses the mounting board 103. Multiple electronic components 104 are mounted on the component side 103A of the mounting board 103. The component side 103A is the side on which the electronic components 104 are placed when they are flow mounted. The mounting board 103 also has a solder side 103B located on the opposite side of the component side 103A. The solder side 103B is the side on which the lead terminals 106 of each electronic component 104 are soldered when they are flow mounted.

[0035] The component side 103A corresponds to the "first side" of this disclosure, and the solder side 103B corresponds to the "second side" of this disclosure.

[0036] A support 107 is provided on the inner wall of the case 101. The support 107 is formed in the shape of a rectangular frame in plan view and is integrally formed with the inner wall of the case 101, with a large opening at its inner circumference. Silicone resin 109 is applied to the upper surface of the support 107. The edge of the mounting substrate 103 is placed on the upper surface of the support 107 via the silicone resin 109.

[0037] At the edge of the mounting substrate 103, a flat surface portion 108 is provided at a position overlapping the silicon resin 109. The flat surface portion 108 is a layer with a flat upper surface formed by screen printing (silk printing). The flat surface portion 108 is formed with a width dimension larger than the width dimension of the silicon resin 109 in a plan view.

[0038] Thus, by providing the flat surface portion 108 on the mounting substrate 103, the portion in contact with the silicon resin 109 becomes flat, and the silicon resin 109 adheres closely.

[0039] In the present embodiment, the flat surface portion 108 is provided over the entire circumferential direction of the mounting substrate 103.

[0040] The edge of the mounting substrate 103 is adhered to the upper surface of the support 107 by the silicon resin 109.

[0041] Note that the mounting substrate 103 may be further fixed to the case 101 using fixing members such as screws and bolts.

[0042] The support 107 is at a position higher than the bottom of the bottomed case 101, and a space S is formed between the lower surface of the mounting substrate 103 and the bottom of the case 101.

[0043] The mounting substrate 103 is arranged substantially parallel to the bottom of the bottomed case 101.

[0044] Inside the case 101, the potting resin 105 is filled so as to cover the plurality of electronic components 104 on the component surface 103A side of the mounting substrate 103. Since the electronic components 104 are covered by the potting resin 105, the waterproof property is improved, it becomes possible to suppress the shortening of the life of the mounting substrate due to dirt, and the mounting substrate 103 is protected from vibration.

[0045] [1-1-3. Configuration of Substrate] FIG. 3 is a longitudinal sectional view of the mounting substrate 103 in a plane passing through the through hole 113 before soldering. FIG. 4 is a longitudinal sectional view of the mounting substrate 103 in a plane passing through the through hole 113 after soldering.

[0046] As shown in FIG. 3, a plurality of through-holes 113, which are through-holes for mounting a plurality of electronic components 104, are formed in the mounting substrate 103. In this specification, the mounting substrate 103 is assumed to have a plurality of electronic components 104 mounted thereon. However, hereinafter, for convenience of explanation, the so-called substrate body before mounting the plurality of electronic components 104 may be referred to as the mounting substrate 103.

[0047] The mounting substrate 103 includes a base material 120, copper foils 121 pasted on both sides of the base material 120, and a resist 123 covering the copper foils 121. Through-hole plating 125 is exposed on the hole wall of the through-hole 113. The through-hole plating 125 is formed by providing a copper foil 121 on the hole wall of the through-hole 113.

[0048] Note that the mounting substrate 103 is not limited to the copper foil 121, and any material may be provided as long as it is electrically conductive, such as various metal foils. Similarly, the mounting substrate 103 is not limited to the resist 123, and any insulating material may be provided.

[0049] The copper foil 121 corresponds to the "conductive layer" of the present disclosure, and the resist 123 corresponds to the "resist layer" of the present disclosure.

[0050] A variety of electronic components 104 are mounted on some of the plurality of through-holes 113.

[0051] The other through-holes 113 are provided for the purpose of electrically connecting the component surface 103A and the solder surface 103B of the mounting substrate 103, and are through-holes that are not intended for mounting electronic components 104. Through-holes, which are so-called vias, are also defined as through-holes 113.

[0052] In the mounting substrate 103, on the solder surface 103B, the resist 123 surrounding the periphery of the through-hole 113 remaining as a through-hole is removed, and the copper foil 121 and the through-hole plating 125 are not covered by the resist 123. As a result, lands 127 composed of the exposed copper foil 121 and the through-hole plating 125 are formed at locations surrounding the through-hole 113 on the solder surface 103B. Thereby, the through-hole 113 electrically connects the component surface 103A and the solder surface 103B of the mounting substrate 103.

[0053] As shown in Figure 4, on the mounted substrate 103 after soldering, solder alloy GK (see Figure 7, described later) is soldered to the lands 127 along with the soldering that is performed when the electronic components 104 are flow mounted. As a result, the through-holes 113 that remain are sealed with solder 115. Since solder 115 is conductive, it does not hinder electrical conductivity between the component surface 103A and the solder surface 103B through the through-holes 113.

[0054] Figure 5 is a longitudinal cross-sectional view of the mounting substrate 103 in the plane passing through the non-through holes 117 before soldering. Figure 6 is a longitudinal cross-sectional view of the mounting substrate 103 in the plane passing through the non-through holes 117 after soldering.

[0055] As shown in Figure 5, the mounting substrate 103 is provided with a number of non-through holes 117, which are through-holes other than the through-holes 113, for example, other than the lead terminals 106 of the electronic component 104. Fixing parts such as pins protruding from the electronic component 104 are inserted through the non-through holes 117, thereby positioning or fixing the electronic component 104 to the mounting substrate 103.

[0056] At the location where the non-through-hole 117 is provided, the mounting substrate 103 has a copper foil 121 attached around the non-through-hole 117 on one side (solder side 103B) of the base material 120, and a resist 123 that covers the copper foil 121 and the base material 120. Unlike the through-hole 113, the non-through-hole 117 does not have copper foil 121 attached to both sides of the base material 120 or through-hole plating 125 at that location.

[0057] The mounting substrate 103 has non-through holes 117 that may remain as through-holes in the mounting substrate 103 without electronic components 104 being mounted, depending on the design of the mounting substrate 103.

[0058] As shown in Figure 5, on the mounting substrate 103, the resist 123 surrounding the non-through holes 117 that remain as through holes is peeled off on the solder side 103B. Copper foil 121 is provided in the areas where the resist 123 has been peeled off. As a result, an additional land 128 made of copper foil 121 is formed on the solder side 103B in the area surrounding the non-through holes 117.

[0059] On the mounting board 103, along with the soldering performed when the electronic components 104 are flow mounted, solder alloy GK (see Figure 7, described later) is soldered to the additional lands 128. As a result, the non-through holes 117 that remain as through holes are sealed with solder 115.

[0060] The mounting substrate 103 also has through holes, such as via holes for interlayer connections and fixing holes through which fixing members such as screws are inserted. However, if the diameter of the holes is large, these through holes may be covered with tape or the like. For example, on the mounting substrate 103, through holes with a diameter larger than 1.5 mm may be covered with tape or the like.

[0061] [1-2. Manufacturing Method] [1-2-1. Process for Preparing Substrates] Figure 7 is a schematic diagram showing the flow equipment 151.

[0062] As shown in Figure 7, the flow equipment 151 is equipment that seals the through-holes 113 and non-through-holes 117 remaining on the mounting substrate 103 with solder 115.

[0063] The flow equipment 151 includes a transport line 153 for transporting the mounted substrates 103. The transport line 153 has a flux application zone 154, a heater zone 155, a soldering zone 156, and a cooling zone 157 arranged from upstream to downstream.

[0064] The flux application zone 154 is where the flux process is performed, in which flux is applied to the solder side 103B of the mounting substrate 103 as a soldering accelerator. The heater zone 155 is a preheating zone, where the preheating process is performed to heat the solder side 103B of the mounting substrate 103 and remove the oxide film. The soldering zone 156 is a solder alloy GK generation zone, where the soldering process is performed to seal the through-holes 113 and non-through-holes 117 with solder 115. The soldering zone 156 is equipped with a primary agitator 161 that provides a primary jet to the solder alloy GK accumulated in the tank 158, and a secondary agitator 162 that provides a secondary jet. In the cooling zone 157, a cooling process is performed to cool and solidify the solder 115.

[0065] A mounting board 103 is attached to the transport line 153. Various electronic components 104 are mounted on the mounting board 103 on both the component side 103A and the solder side 103B, and the aforementioned through-holes 113 and non-through-holes 117 remain on the mounting board 103.

[0066] As the mounted substrate 103 is transported on the transport line 153, and passes through the flux application zone 154 and the heater zone 155, it reaches the soldering zone 156. Thereafter, the solder alloy GK accumulated in the tank 158 is sprayed over the entire solder surface 103B of the mounted substrate 103 by the primary jet and secondary jet generated in two stages by the primary agitator 161 and the secondary agitator 162.

[0067] As shown in Figures 3 to 6, the solder alloy GK is soldered to each land 127 and 128 to form solder 115.

[0068] In this embodiment of flow soldering, for example, if the diameter of the through hole is 1.5 mm or less, the through hole can be suitably sealed by soldering. In this embodiment, for example, the through hole is 0.6 mm and the small diameter hole is 1.2 to 1.3 mm.

[0069] Each solder 115 is cooled and solidified when the mounting substrate 103 reaches the cooling zone 157.

[0070] This prepares the mounting board 103.

[0071] [1-2-2. Process for Manufacturing the Substrate Unit] This manufacturing process, referring to Figure 2, includes a housing step of housing the mounted substrate 103 in a bottomed case 101. In this case, the mounted substrate 103 has the through-holes 113 and non-through-holes 117 described above already sealed with solder 115.

[0072] Furthermore, this manufacturing process includes a filling step in which potting resin 105 is filled into the component side 103A of the mounting substrate 103 within the case 101.

[0073] Figure 8 is a schematic cross-sectional view of a conventional substrate unit 200. Figure 8 shows a longitudinal cross-section in the plane passing through the through-hole 113 and the non-through-hole 117.

[0074] Here, we will describe the filling process in which potting resin 105 is filled into the case 201 in the manufacturing process of a conventional substrate unit 200.

[0075] As shown in Figure 8, the process for manufacturing a conventional substrate unit 200 includes a housing step in which the mounted substrate 203 is housed in a bottomed case 201. The case 201 is formed in substantially the same shape as the case 101, and instead of a support 107, it has multiple support pins 207 that support the substrate at points rather than a surface.

[0076] The mounting board 203 is housed inside the case 201. Similar to the mounting board 103, the mounting board 203 has a component side 203A and a solder side 203B, on which multiple electronic components 104 are mounted, and through-holes 113 and non-through holes 117 are provided. The mounting board 203 does not have lands 127 or additional lands 128. Therefore, according to the design of the mounting board 203, there are through-holes 113 and non-through holes 117 that remain as through-holes in the mounting board 203 even after the soldering process, without the electronic components 104 being mounted.

[0077] The manufacturing process for a conventional circuit board unit 200 includes a filling step in which potting resin 105 is filled into the case 201 in which the mounted circuit board 203 is housed. The mounted circuit board 203 is supported at predetermined locations on its peripheral edge by support pins 207 inside the case 201. Once the potting resin 105 is filled into the case 201, it flows into the solder side 203B of the mounted circuit board 203 through the gap between the inner wall of the case 201 and the peripheral edge of the mounted circuit board 203. Furthermore, the potting resin 105 flows into the solder side 203B of the mounted circuit board 203 through through-holes 113 and non-through-holes 117 that remain as through-holes in the mounted circuit board 203. In the filling step, the potting resin 105 is filled until it covers the component side 203A of the mounted circuit board 203. Therefore, in the process of manufacturing the conventional substrate unit 200, potting resin 105 is filled in an amount that covers both the component side 203A and the solder side 203B of the mounting substrate 203.

[0078] In this embodiment 1, during the housing process, the support 107 is integrally formed with the inner wall of the case 101, and silicone resin 109 is applied to the upper surface of the support 107. The mounting substrate 103 is fixed with the silicone resin 109 in between, so there is no gap between the outer circumference of the mounting substrate 103 and the inner circumference of the case 101. Furthermore, since the remaining through-holes 113 and non-through-holes 117 of the mounting substrate 103 are sealed with solder 115, there are no openings on the surface of the mounting substrate 103. Therefore, when potting resin 105 is filled into the component side 103A of the mounting substrate 103 during the filling process, the potting resin 105 remains on the component side 103A of the mounting substrate 103 and does not flow out to the solder side 103B of the mounting substrate 103.

[0079] The support 107 is located at a high position above the bottom of the bottomed case 101, and a space S is formed between the lower surface of the mounting substrate 103 and the bottom of the case 101.

[0080] Since the potting resin 105 does not flow out into this space S, the amount of expensive potting resin 105 used in the filling process can be reduced.

[0081] As shown in Figure 2, if the amount of potting resin 105 used is set to be approximately equal to the volume of space S, the amount of potting resin 105 used can be reduced by approximately half compared to the state in which the potting resin 105 flows out to the solder side 103B of the mounting substrate 103 and fills the solder side 103B of the mounting substrate 103.

[0082] [1-3. Effects, etc.] As described above, in this embodiment, the mounting substrate 103 is provided with a plurality of through holes that penetrate in the thickness direction, electronic components 104 are mounted in at least a portion of the through holes, and the through holes on which electronic components 104 are not mounted are sealed with solder 115.

[0083] According to this, since the through holes on the surface of the mounting substrate 103 are sealed, even if potting resin 105 is filled into the component side 103A of the mounting substrate 103, for example, the potting resin 105 will not flow out to the back side, and the amount of potting resin 105 used can be reduced when manufacturing the substrate unit 100 in which the mounting substrate 103 is housed in the case 101.

[0084] As in this embodiment, the solder 115 that seals the through hole may be soldered together with the solder 115 used to solder the electronic component 104.

[0085] According to this method, the through-hole can be sealed at the same time as soldering the electronic component 104, thus suppressing an increase in the manufacturing process.

[0086] As in this embodiment, the mounting substrate 103 has copper foil 121 and resist 123 provided on the copper foil 121 on both the component side 103A and the solder side 103B. The copper foil 121 has lands 127 or additional lands 128 formed around the through holes that are not covered by the resist 123. The through holes may be sealed by solder 115 provided on the lands 127 or additional lands 128.

[0087] According to this, the through-holes can be easily sealed on the mounting substrate 103.

[0088] As in this embodiment, the through-hole may be a through-hole 113 provided with through-hole plating 125 on its inner wall, or a non-through-hole 117 not provided with copper foil 121 on its inner wall.

[0089] According to this, the through-holes in the mounted substrate 103 can be easily sealed regardless of whether or not there is through-hole plating 125 or copper foil 121.

[0090] As in this embodiment, the substrate unit 100 comprises a mounting substrate 103 and a bottomed case 101 that houses the mounting substrate 103, and the potting resin 105 may be filled inside the case 101 only on the component side of the mounting substrate 103 where the electronic components 104 are arranged.

[0091] According to this, since there are no holes penetrating the mounting substrate 103 in the thickness direction, even if potting resin 105 is filled into the component side 103A of the mounting substrate 103, the potting resin 105 will not flow out onto the solder side 103B, and the amount of potting resin 105 used can be reduced.

[0092] As in this embodiment, the substrate unit 100 may include a support 107 inside the case 101, and the mounting substrate 103 may be fixed by applying a silicone resin 109 to the upper surface of the support 107.

[0093] According to this, the outflow of potting resin 105 from the outer periphery of the mounting substrate 103 is suppressed, and thus the amount of potting resin 105 used can be reduced.

[0094] As in this embodiment, the mounting substrate 103 may be provided with a flat surface portion 108 by screen printing at the location in contact with the silicon resin 109.

[0095] According to this, the mounting substrate 103 has a flat surface portion 108, which makes the portion in contact with the silicone resin 109 flat and allows it to adhere closely to the silicone resin 109. As a result, in the substrate unit 100, the outflow of potting resin 105 from the outer periphery of the mounting substrate 103 is suppressed, and the amount of potting resin 105 used can be reduced.

[0096] As in this embodiment, the width dimension of the flat surface portion 108 may be formed to be larger than the width dimension of the silicone resin 109.

[0097] According to this, the outflow of potting resin 105 from the outer periphery of the mounted substrate 103 can be more reliably suppressed in the substrate unit 100, thereby reducing the amount of potting resin 105 used.

[0098] As in this embodiment, the circuit board unit 100 may be housed inside the main body of the washing machine 1.

[0099] According to this, a substrate unit 100 that reduces the amount of potting resin 105 used is available, which is suitable for clothing processing equipment such as a washing machine 1.

[0100] (Other Embodiments) As described above, Embodiment 1 has been explained as an example disclosed in this application. However, the technology in this disclosure is not limited to this and can be applied to embodiments that have been modified, replaced, added, or omitted. It is also possible to create new embodiments by combining the components described in Embodiment 1. Therefore, other embodiments are described below as examples.

[0101] In the above-described embodiment 1, the support 107 is integrally formed with the inner wall of the case 101. However, the support 107 may be a separate component from the case 101, and the separate component may be attached to the inner wall of the case 101 via a sealing material or the like. In addition, if the conventional method is called full potting, then embodiment 1 can be called half potting.

[0102] In the above-described embodiment 1, a drum-type washing machine and dryer 1 was given as an example of a "clothing processing device." However, the washing machine and dryer 1 may also be a vertical type. For example, the "clothing processing device" may also be a dryer, a washing machine without a drying function, or a device that stores clothes in a manner in which they are hung on hangers and can smooth out wrinkles by shaking the stored clothes. For example, the circuit board unit 1 may be installed in a dishwasher or a heated toilet seat.

[0103] The embodiments described above are for illustrative purposes only and may be modified, replaced, added, or omitted within the scope of the claims or equivalents thereof.

[0104] (Note) The above description of embodiments discloses the following technology.

[0105] (Technology 1) A mounting substrate having a plurality of through holes extending from the first surface to the second surface in the thickness direction, wherein electronic components are mounted in at least a portion of the through holes, and the through holes on which no electronic components are mounted are sealed with solder.

[0106] According to this method, since there are no holes that penetrate the substrate in the thickness direction, even if potting resin is filled into the component side of the substrate, for example, the potting resin will not flow out to the opposite side of the component side, and the amount of potting resin used can be reduced when manufacturing a substrate unit in which the substrate is housed in a case.

[0107] (Technology 2) The mounting substrate according to Technology 1, wherein the solder that seals the through-hole is soldered together with the solder used to solder the electronic component.

[0108] According to this method, through-holes can be sealed at the same time as soldering electronic components, thus suppressing the increase in manufacturing steps.

[0109] (Technical 3) The mounting substrate according to Technical 1 or Technical 2, wherein both the first and second surfaces have a conductive layer and a resist layer provided on the conductive layer, the conductive layer has land portions formed around the through holes that are not covered by the resist layer, and the through holes are sealed by the solder provided on the land portions.

[0110] According to this, through-holes can be easily sealed on the mounting board.

[0111] (Technical 4) The mounting substrate according to any one of Technical 1 to 3, wherein the through-hole is a through-hole in which a conductive layer is provided on the inner wall of the through-hole, or a non-through-hole in which the conductive layer is not provided on the inner wall of the through-hole.

[0112] According to this, in a mounting substrate, through-holes can be easily sealed regardless of whether or not there is a conductive layer inside the through-hole.

[0113] (Technical 5) A substrate unit comprising a mounting substrate as described in any one of Technical 1 to Technical 4, and a bottomed case for housing the mounting substrate, wherein potting resin is filled inside the case only on the first surface side of the mounting substrate on which the electronic components are arranged.

[0114] According to this method, since there are no holes on the surface of the circuit board, even if potting resin is filled into the component side of the circuit board, the potting resin will not flow out to the opposite side of the component side, thus reducing the amount of potting resin used.

[0115] (Technical 6) The substrate unit according to Technical 5, wherein a support is provided inside the case, and the mounting substrate is fixed by applying a silicone resin to the upper surface of the support.

[0116] According to this method, the outflow of potting resin from the outer edge of the substrate is suppressed, thus reducing the amount of potting resin used.

[0117] (Technical 7) The substrate unit according to Technical 6, wherein the mounting substrate has a flat surface portion provided by screen printing at the portion in contact with the silicon resin.

[0118] According to this, the mounting substrate has a flat surface, which makes the area in contact with the silicon resin flat and allows it to adhere tightly to the silicon resin. As a result, in the substrate unit, the outflow of potting resin from the outer edge of the mounting substrate is suppressed, and the amount of potting resin used can be reduced.

[0119] (Technical 8) The substrate unit according to Technical 7, wherein the width dimension of the flat surface portion is formed to be larger than the width dimension of the silicon resin.

[0120] According to this, the leakage of potting resin from the outer edge of the mounted substrate can be more reliably suppressed in the substrate unit, thus reducing the amount of potting resin used.

[0121] (Technical 9) A garment processing apparatus in which a substrate unit described in any one of Technical 5 to Technical 8 is housed inside the main body of the apparatus.

[0122] This makes it possible to provide a substrate unit that reduces the amount of potting resin used, making it suitable for clothing processing equipment such as washing machines.

[0123] (Technical 10) A method for manufacturing a substrate unit, comprising: a preparation step of preparing a mounting substrate according to any one of Technical 1 to Technical 4; a housing step of housing the mounting substrate in a bottomed case; and a filling step of filling the first surface side of the mounting substrate on which the electronic components are arranged inside the case with potting resin.

[0124] According to this method, even when potting resin is filled into the component side of the circuit board, the potting resin does not flow to the back side, making it possible to manufacture circuit board units with reduced potting resin usage.

[0125] (Technical 11) The method for manufacturing a substrate unit according to Technical 10, wherein the preparation step includes a step of sealing the through-hole with solder by soldering.

[0126] According to this method, through-holes and other such holes can be easily sealed.

[0127] The mounting substrate, substrate unit, clothing processing apparatus, and method for manufacturing the substrate unit relating to this disclosure can be used to reduce the amount of potting resin used.

[0128] 1 Washer-dryer 10 Housing 11 Washing tub 12 Drive motor 13 Liquid supply unit 15 Heating and blowing section 16, 20, 25, 26, 35 Opening 17 Door 18 Water inlet 19 Drain valve 21 Outer tub 22 Inner tub 23 Cylindrical section 24 Bottom section 27 Flow path 28 Exhaust port 29 Air inlet 30 Heat pump device 31 Blower fan 33 Drying path 34 Through hole 36 Cover 100, 200 Circuit board unit 101, 201 Case 103, 203 Mounted circuit board 103A, 203A Component side 103B, 203B Solder side 104 Electronic component 105 Potting resin 106 Lead terminal 107 Support 108 Flat surface section 109 Silicone resin 113 Through-hole 115 Solder 117 Non-through-hole 120 Substrate 121 Copper foil 123 Resist 125 Through-hole plating 127 Land 128 Additional land 130 Tank 131 Case 132 Flux supply device 134 Water supply valve 151 Flow equipment 153 Conveyor line 154 Flux application zone 155 Heater zone 156 Soldering zone 157 Cooling zone 158 Tank 161 Primary agitator 162 Secondary agitator 207 Support pin 207 CA Central axis GK Solder alloy PO Processed material S Space

Claims

1. A mounting substrate having a plurality of through holes extending from the first surface to the second surface in the thickness direction, wherein electronic components are mounted in at least a portion of the through holes, and the through holes on which no electronic components are mounted are sealed with solder.

2. The mounting substrate according to claim 1, wherein the solder sealing the through-hole is soldered together with the solder used to solder the electronic component.

3. The mounting substrate according to claim 1 or claim 2, wherein both the first and second surfaces have a conductive layer and a resist layer provided on the conductive layer, the conductive layer has land portions formed around the through holes that are not covered by the resist layer, and the through holes are sealed by the solder provided on the land portions.

4. The mounting substrate according to claim 1 or claim 2, wherein the through-hole is a through-hole in which a conductive layer is provided on the inner wall of the through-hole, or a non-through-hole in which the conductive layer is not provided on the inner wall of the through-hole.

5. A substrate unit comprising a mounting substrate according to claim 1 or claim 2, and a bottomed case for housing the mounting substrate, wherein potting resin is filled inside the case only on the first surface side of the mounting substrate on which the electronic components are arranged.

6. The substrate unit according to claim 5, wherein a support is provided inside the case, and the mounting substrate is fixed by applying a silicone resin to the upper surface of the support.

7. The substrate unit according to claim 6, wherein the mounting substrate is provided with a flat surface portion by screen printing at the portion in contact with the silicon resin.

8. The substrate unit according to claim 7, wherein the width dimension of the flat surface portion is formed to be larger than the width dimension of the silicone resin.

9. A garment processing apparatus in which the substrate unit described in claim 5 is housed inside the main body of the apparatus.

10. A method for manufacturing a substrate unit, comprising: a preparation step of preparing a mounting substrate according to claim 1 or claim 2; a housing step of housing the mounting substrate in a bottomed case; and a filling step of filling the first surface side of the mounting substrate on which the electronic components are arranged inside the case with potting resin.

11. The method for manufacturing a substrate unit according to claim 10, wherein the preparation step includes a step of sealing the through-hole with solder by soldering.

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