Integrated fluid device
By integrating the coolant-refrigerant condenser and high-temperature side valve, and the coolant-refrigerant evaporator and low-temperature side valve, with separate coolant flow paths, the integrated fluid device minimizes heat loss and optimizes flow paths, improving energy efficiency and reducing device size.
Patent Information
- Authority / Receiving Office
- WO ยท WO
- Patent Type
- Applications
- Current Assignee / Owner
- DENSO CORP
- Filing Date
- 2025-11-17
- Publication Date
- 2026-06-04
AI Technical Summary
Integrated fluid devices experience increased heat loss due to close proximity and overlapping flow paths of high-temperature and low-temperature coolant streams, leading to inefficient heat exchange and energy loss.
The components of the heat pump cycle and coolant circuit are arranged such that the coolant-refrigerant condenser and high-temperature side valve are integrally faced, while the coolant-refrigerant evaporator and low-temperature side valve are also integrally faced, with separate coolant flow paths for high-temperature and low-temperature streams, reducing direct heat exchange and optimizing flow path configurations.
This arrangement significantly reduces heat loss by minimizing direct heat exchange between high-temperature and low-temperature coolant streams, simplifies coolant flow paths, and reduces pressure loss, thereby enhancing energy efficiency and device size.
Smart Images

Figure JP2025040169_04062026_PF_FP_ABST