Housing comprising dissimilar metal bonding structure and electronic device comprising same

Abstract

According to one embodiment disclosed herein, an electronic device comprises: a housing; a display disposed on the housing; and a battery disposed in the housing. The housing may include: a first metal portion forming at least a portion of the exterior of the electronic device; a second metal portion disposed inward of the first metal portion and made of a different material than the first metal portion; a filler metal disposed between the first metal portion and the second metal portion and coupled to the first metal portion and the second metal portion; and a plurality of dendrites at least partially diffused into the second metal portion from the filler metal. Various other embodiments are also possible.

Description

Housing including a heterogeneous metal bonding structure and electronic device including the same

[0001] The present disclosure relates to a housing comprising a heterogeneous metal bonding structure and an electronic device comprising the same.

[0002] Driven by the remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. Electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device comprises: a housing; a display disposed on the housing; and a battery disposed within the housing, wherein the housing may comprise: a first metal portion forming at least a portion of the exterior of the electronic device; a second metal portion disposed inwardly with respect to the first metal portion and having a material different from that of the first metal portion; a filler metal disposed between the first metal portion and the second metal portion and coupled to the first metal portion and the second metal portion; and a plurality of dendrites that are at least partially diffused from the filler metal into the second metal portion.

[0006] According to one embodiment of the present disclosure, the housing of an electronic device may comprise: a first metal part forming at least a portion of the exterior of the electronic device; a second metal part disposed inwardly with respect to the first metal part (410) and having a material different from that of the first metal part; a filler metal disposed between the first metal part and the second metal part and coupled to the first metal part and the second metal part; and a plurality of dendrites that are at least partially diffused from the filler metal into the second metal part.

[0007] According to one embodiment of the present disclosure, a method for manufacturing a housing of an electronic device may include: a process of preparing a first metal part and a second metal part having a material different from that of the first metal part; a process of aligning the first metal part and the second metal part; and a process of brazing by injecting a molten filler metal between the first metal part and the second metal part.

[0008] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0010] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is a plan view showing a housing according to one embodiment of the present disclosure.

[0015] FIG. 7 is a cross-sectional view taken along the line AA' of FIG. 6 according to one embodiment of the present disclosure.

[0016] FIG. 8 is an enlarged view of part B of FIG. 7 according to one embodiment of the present disclosure.

[0017] FIG. 9 is a flowchart illustrating a method for manufacturing a housing having a heterogeneous metal bonding structure according to one embodiment of the present disclosure.

[0018] FIGS. 10, FIGS. 11, FIGS. 12 and FIGS. 13 are schematic diagrams illustrating a state in which a filler metal is introduced between a first metal part and a second metal part through capillary action according to one embodiment of the present disclosure.

[0019] FIGS. 14 and 15 are drawings showing cross-sectional images of a housing including a heterogeneous metal bonding structure according to one embodiment of the present disclosure, taken through a scanning electron microscope (SEM).

[0020] FIG. 16 is a cross-sectional view of a housing including a double bond structure according to one embodiment of the present disclosure.

[0021] FIG. 17 is a cross-sectional view of a housing including a double bond structure according to one embodiment of the present disclosure.

[0022] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0023] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0025] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0026] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0027] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0031] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0032] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0033] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0037] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0039] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0042] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0044] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0047] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0048] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0049] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0050] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0051] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0052] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0053] The embodiments of FIGS. 2 and 3 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 17. The configurations of the embodiments of FIGS. 2 and 3 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 or the configurations of FIGS. 4 to 17.

[0054] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment, the housing (210) may refer to a structure forming some of the first surface (210A) of FIG. 2, the second surface (210B) and the side (210C) of FIG. 3. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side structure (or "side bezel structure") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as titanium or aluminum).

[0055] Although not illustrated, the front plate (202) may include region(s) that are curved and seamlessly extended toward the rear plate (211) at least a portion of the edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the regions that are curved and extended toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). Depending on the embodiment, the front plate (202) or the rear plate (211) may be substantially flat. For example, the front plate (202) or the rear plate (211) may not include the curved and extended region. If the front plate (202) or the rear plate (211) includes the curved and extended region, the thickness of the electronic device (101) in the portion containing the curved and extended region may be smaller than the thickness of the other portion.

[0056] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (216, 217), a light-emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (216, 217), or a light-emitting element (206)) or additionally include other components.

[0057] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of the side (210C). In one embodiment, the corners of the display (220) may be formed to be generally identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), to expand the area where the display (220) is visually exposed, the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be generally identical.

[0058] In one embodiment, a recess or opening is formed in a part of the screen display area of ​​the display (220), and the electronic device (101) may include at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) aligned with the recess or the opening. In one embodiment, at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor, and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (220). In one embodiment, the display (220) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0059] According to one embodiment, the camera module (205) may be configured to photograph the front of the display (220) through a camera opening formed in the display (220). The camera module (205) may be covered by a front plate (202). The camera module (205) may include a hidden under-display camera (UDC) that may not be visually exposed through the display (220). The under-display camera may be configured to photograph an external object through the camera opening of the display (220).

[0060] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound through the microphone hole (203) may be placed inside the housing (210), and in one embodiment, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0061] According to one embodiment, the call receiver hole (214) can form a passage for transmitting sound generated from a speaker placed inside the housing (210) to the outside of the electronic device (101).

[0062] According to one embodiment, the call receiver hole (214) may be defined by the housing (210). According to one embodiment, the call receiver hole (214) may be formed between a part of the housing (210) (e.g., at least a part of the edge facing the +Y direction in FIG. 2 and FIG. 3) and the top edge of the display (220), but is not limited thereto.

[0063] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the second surface (210B) or side (210C) as well as on the first surface (210A) (e.g., display (220)) of the housing (210). The electronic device (101) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] The camera module (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through a third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the time when infrared light is received from the third sensor module (219).

[0065] The key input device (216, 217) may be placed on one surface of the housing (210). For example, the key input device (216, 217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (216, 217), and the key input device not included may be implemented in another form, such as a soft key, on the display (220). In one embodiment, the key input device (216, 217) may include a sensor module placed on the second surface (210B) of the housing (210).

[0066] According to one embodiment, the key input device (216, 217) may be defined and / or referred to as a side key, a key input module, or a button assembly.

[0067] According to one embodiment, the key input device (216, 217) may include a volume key (216) or a power key (217). The volume key (216) may be a key capable of adjusting the intensity of an acoustic signal output from the electronic device (101). The volume key (216) may have an elongated shape when viewed from the side of the electronic device (101) (e.g., when viewed from the +X direction to the -X direction in FIG. 2 and FIG. 3). As the volume key (216) is provided in an elongated shape, a key input for volume up may be possible on one side of the volume key (216), and a key input for volume down may be possible on the other side of the volume key (216). For example, when viewed from the side of the electronic device (101), the volume key (216) may be visually seen as a single component, but the volume key (216) may provide two key input points. The volume key (216) may be configured to adjust the intensity of the sound signal, but is not limited thereto, and may provide scroll up-down control, text size adjustment, or other key input functions.

[0068] According to one embodiment, the power key (217) may be spaced apart from the volume key (216). The power key (217) may be configured to control the on-off of the electronic device (101) or to control the standby mode and active mode of the electronic device (101).

[0069] A light-emitting element (206) may be disposed, for example, on a first surface (210A) of a housing (210). The light-emitting element (206) may, for example, provide state information of an electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of a camera module (205). The light-emitting element (206) may include, for example, an LED (light emitting diode), an IR (infrared) LED, and a xenon lamp.

[0070] The connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0071] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0072] The embodiments of FIGS. 4 and 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 17. The configurations of the embodiments of FIGS. 4 and 5 may be partially or entirely identical to the configurations of the embodiments of FIGS. 6 to 17.

[0073] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 1, or the electronic device (101) of FIGS. 2 to 3) may include a side structure (310), a first bracket (311), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (220) of FIG. 2), at least one printed circuit board (or board assembly) (341, 343), a battery (350), a second bracket (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (341, 343), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible connection member (345). For example, the printed circuit boards (341, 343) may include a first circuit board (341) positioned above (e.g., +Y-axis direction) the battery (350) and a second circuit board (343) positioned below (e.g., -Y-axis direction), and the flexible connection member (345) can electrically connect the first circuit board (341) and the second circuit board (343).

[0074] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the second bracket (360)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and redundant descriptions are omitted below.

[0075] According to one embodiment, the electronic device (101) may include a housing (301) (e.g., the housing (210) of FIG. 2 and FIG. 3).

[0076] According to one embodiment, the housing (301) may include a first bracket (311) and a side structure (310) (e.g., the side structure (218) or side (210C) of FIG. 2 and FIG. 3).

[0077] According to one embodiment, the first bracket (311) may be provided in a flat shape for at least a portion. In one embodiment, the first bracket (311) may be placed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first bracket (311) may be formed from, for example, a metal material (e.g., aluminum or magnesium) and / or a non-metal material (e.g., a polymer). When the first plate (311) is formed at least partially from a metal material, the side structure (310) or a portion of the first bracket (311) may function as an antenna. The first bracket (311) may be defined and / or referred to as a first support member (311), a first support plate (311), or a first plate.

[0078] According to one embodiment, the first bracket (311) may include a front side (311a) and a rear side (311b) opposite to the front side (311a). The front side (311a) may be defined and / or referred to as a first surface (311a) or a front surface (311a). The rear side (311b) may be defined and / or referred to as a second surface (311b) or a rear surface (311b).

[0079] According to one embodiment, the front surface (311a) may face the display (330). For example, the display (330) may be supported by the front surface (311a). The rear surface (311b) may face the rear plate (380).

[0080] According to one embodiment, a display (330) may be coupled to the front surface (311a) of the first plate (311), and a printed circuit board (341, 343) may be coupled to the rear surface (311b) of the first plate (311). A processor, memory, and / or interface may be mounted on the printed circuit board (341, 343). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0081] According to one embodiment, the first bracket (311) and the side structure (310) may be combined and referred to as a front case or housing (301). According to one embodiment, the housing (301) may be understood as a structure for generally accommodating, protecting, or housing a printed circuit board (341, 343) or a battery (350). In one embodiment, the housing (301) may be understood to include a structure that a user can visually or tactilely perceive from the exterior of the electronic device (101), such as a side structure (310), a front plate (320), and / or a rear plate (380). In one embodiment, the phrase “front or rear of the housing (301)” may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3. In one embodiment, the first bracket (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 2) and the rear plate (380) (e.g., the second surface (210B) of FIG. 3), and can function as a structure for positioning electrical / electronic components such as printed circuit boards (341, 343) or a camera assembly (307).

[0082] According to one embodiment, the memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a non-volatile memory (e.g., the non-volatile memory (134) of FIG. 1).

[0083] According to one embodiment, the interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD (secure digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0084] According to one embodiment, the second bracket (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be positioned to surround a printed circuit board (341, 343) (e.g., the first circuit board (341)) together with a part of the first bracket (311). For example, the upper support member (360a) of the second bracket (360) may be positioned to face the first bracket (311) with the first circuit board (341) in between. In one embodiment, the lower support member (360b) of the second bracket (360) may be positioned to face the first bracket (311) with the second circuit board (343) in between. Circuit devices (e.g., processors, communication modules, or memory) implemented in the form of integrated circuit chips or various electrical / electronic components may be placed on the circuit board (341, 343), and according to the embodiment, the circuit board (341, 343) may be provided with an electromagnetic shielding environment from the second bracket (360). In one embodiment, the lower support member (360b) may be utilized as a structure for placing electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not shown. For example, the lower support member (360b) may be placed to wrap around an additional circuit board together with another part of the first bracket (311). A speaker module or interface placed on an additional circuit board or lower support member (360b) that is not shown may be placed correspondingly to the audio module (207) or connector holes (208, 209) of FIG. 2.The second bracket (360) may be defined and / or referred to as a second support member (360), a second support plate (360), or a second plate.

[0085] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, a printed circuit board (341, 343). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0086] Although not illustrated, the antenna may include a conductive pattern implemented on the surface of the second bracket (360) through, for example, a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the antenna in the form of a thin film may be placed between the rear plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, other antenna structures may be formed by the side structure (310) and / or a part or combination thereof of the first bracket (311).

[0087] According to one embodiment, the camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be placed on a first plate (311) at a location adjacent to a printed circuit board (341, 343). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with any one of the camera windows (312, 313, 319) and may be at least partially wrapped in a second bracket (360) (e.g., an upper support member (360a)).

[0088] According to one embodiment, the electronic device (101) may include a flexible connection member (345). The flexible connection member (345) may include a flexible flat cable (FFC), a flexible printed circuit board (FPCB), or a board-to-board connector (B2B connector).

[0089] According to one embodiment, the flexible connecting member (345) can be bent at least partially. For example, the flexible connecting member (345) can be configured to be folded or unfolded at least partially.

[0090] According to one embodiment, the flexible connection member (345) can electrically connect at least one electrical component to a first circuit board (341) (e.g., a main circuit board). For example, one end of the flexible connection member (345) may be physically and / or electrically connected to at least a part of the first circuit board (341). For example, the other end of the flexible connection member (345) may be physically and / or electrically connected to at least a part of the at least one electrical component. The at least one electrical component may include, for example, a second circuit board (343) (e.g., a sub circuit board). However, the at least one electrical component may include various electrical components (e.g., an antenna, a speaker, a battery, a display, or a sensor), but is not limited thereto.

[0091] According to one embodiment, the flexible connection member (345) may be configured to transmit power or an electrical signal from the first circuit board (341) to at least one electrical component. The flexible connection member (345) may be configured to transmit power or an electrical signal from at least one electrical component to the first circuit board (341). The electrical signal may include a control signal, a power signal, or a communication signal.

[0092] According to one embodiment, the electronic device (101) may include a key input device (316, 317) (e.g., the key input device (216, 217) of FIG. 2). The key input device (316, 317) may include a volume key (316) (e.g., the volume key (216) of FIG. 2), or a power key (e.g., the power key (217) of FIG. 2).

[0093] According to one embodiment, the volume key (316) may be placed on one surface of the housing (301). For example, the volume key (316) may be placed on a part of the lateral surface of the housing (301) (e.g., the lateral structure (310) of FIG. 4), but is not limited thereto.

[0094] According to one embodiment, the volume key (316) may include a haptic module (e.g., the haptic module (179) of FIG. 1). The haptic module may include a piezo actuator. The piezo actuator may be configured to provide a mechanical stimulus (e.g., vibration or movement) that can be perceived by the user through tactile or kinesthetic sense when the user presses or touches the volume key (316).

[0095] According to one embodiment, the volume key (316) may have an elongated shape when viewed from the side of the electronic device (101) (e.g., when viewed from the +X direction to the -X direction of FIG. 4). The volume key (316) may be spaced apart from the power key (317).

[0096] FIG. 6 is a plan view showing a housing according to one embodiment of the present disclosure. FIG. 7 is a cross-sectional view taken along line AA' of FIG. 6 according to one embodiment of the present disclosure. FIG. 8 is an enlarged view of part B of FIG. 7 according to one embodiment of the present disclosure.

[0097] The embodiments of FIGS. 6 to 8 may be combined with the embodiments of FIGS. 1 to 5 or the embodiments of FIGS. 9 to 17. The configurations of the embodiments of FIGS. 6 to 8 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 5 or the configurations of FIGS. 9 to 17.

[0098] Referring to FIG. 6, the housing (401) (e.g., the housing (301) of FIG. 4 and FIG. 5) may include a first metal part (410) and a second metal part (420).

[0099] According to one embodiment, the first metal part (410) may form at least a portion of the exterior of an electronic device (e.g., the electronic device (101) of FIGS. 2 to 5). The first metal part (410) may form at least a portion of the side of the housing (401). For example, the first metal part (410) may form at least a portion of the plurality of side walls of the housing (401).

[0100] According to one embodiment, the first metal part (410) may form a side structure of the housing (401) (e.g., the side structure (310) of FIG. 4 and FIG. 5). According to one embodiment, the first metal part (410) may be configured to be exposed to the outside of the electronic device and to be grasped by a user.

[0101] According to one embodiment, the first metal part (410) may form at least a portion of the appearance of the electronic device that is visually exposed to the user. The first metal part (410) may include at least one of titanium and / or stainless steel. As the first metal part (410) includes titanium and / or stainless steel, the side of the electronic device (e.g., the side formed by the first metal part (410)) may be able to ensure durability against external impact. Additionally, as the first metal part (410) includes titanium and / or stainless steel, the side of the electronic device that is visually exposed to the user (e.g., the side formed by the first metal part (410)) may provide a luxurious appearance design due to a distinctive metallic texture (e.g., a glossy surface or a matte surface).

[0102] According to one embodiment, the second metal part (420) may be configured to be disposed inside the electronic device to support the electrical / electronic components of the electronic device. The second metal part (420) may be formed in a substantially flat shape.

[0103] According to one embodiment, the second metal part (420) may form at least a part of a bracket (e.g., the first bracket (311) of FIG. 4 and FIG. 5) for mounting electrical / electronic components of an electronic device.

[0104] According to one embodiment, the second metal part (420) may be connected and / or combined with the side structure of the housing (401) (e.g., the first metal part (410)).

[0105] According to one embodiment, the metal material of the second metal part (420) may be different from the metal material of the first metal part (410). For example, the first metal part (410) and the second metal part (420) may be formed of different metal materials.

[0106] According to one embodiment, the second metal part (420) may comprise at least one of aluminum and / or magnesium. For example, as the second metal part (420) comprises relatively light aluminum and / or magnesium, a lightweight electronic device may be provided. Additionally, as the second metal part (420) comprises relatively easy-to-form aluminum and / or magnesium, the bracket formed by the second metal part (420) (e.g., the first bracket (311) of FIG. 4 and FIG. 5) may have a complex shape. Accordingly, a space may be provided for efficiently supporting and arranging a number of electrical / electronic components placed inside the electronic device.

[0107] According to one embodiment, the first metal part (410) and the second metal part (420) may be joined by a brazing method. For example, the brazing method may be defined as a method of joining the first metal part (410) and the second metal part (420) through a filler metal (e.g., the filler metal (430) of FIG. 7), but is not limited thereto.

[0108] According to one embodiment, the housing (401) may include a segment portion (482). The segment portion (482) may divide the first metal portion (410) into a plurality of parts. For example, at least one of the plurality of parts of the first metal portion (410) divided by the segment portion (482) may be provided as an antenna of an electronic device. For example, the segment portion (482) may separate an adjacent pair of antennas exposed to the outside of the electronic device so that they are not electrically connected to each other. The segment portion (482) may include a non-metallic material (e.g., plastic), but is not limited thereto.

[0109] Referring to FIG. 7, the housing (401) may include a first metal part (410), a second metal part (420), a filler metal (430), and a cover part (440).

[0110] According to one embodiment, the first metal part (410) may include a first surface (411) and a second surface (412) opposite to the first surface (411). The first surface (411) of the first metal part (410) may be exposed to the outside of the electronic device. For example, the first surface (411) of the first metal part (410) may form at least a portion of the outer surface of the electronic device. The second surface (412) of the first metal part (410) may face the inside of the electronic device and may be connected and / or coupled to the second metal part (420) through a filler metal (430).

[0111] According to one embodiment, the first metal part (410) may be at least partially exposed to the outside of the electronic device and may be defined and / or referred to as the outer frame of the housing (401).

[0112] According to one embodiment, the second metal portion (420) may include a first region (423) coupled to the first metal portion (410) and a second region (424) extending from the first region (423). The first region (423) of the second metal portion (420) may be connected and / or coupled to the first metal portion (410) through a filler metal (430). The first region (423) of the second metal portion (420) may also be referred to as a perpendicular portion. According to one embodiment, the first metal portion (410) and the first region (423) coupled thereto may be interpreted as forming at least a part of the sidewall or side of the electronic device. The second region (424) of the second metal portion (420) may extend from the first region (423). The second region (424) may be substantially perpendicular to the first region (423), but is not limited thereto. The second region (424) may also be referred to as a horizontal portion. The second region (424) may support electrical / electronic components (450) of an electronic device. For example, electrical / electronic components may be placed and / or mounted on the front (e.g., front (311a) in FIG. 4) and rear (e.g., rear (311b) in FIG. 5)) of the second region (424).

[0113] According to one embodiment, the second metal part (420) may be placed inside the electronic device to support electrical / electronic components and may be defined and / or referred to as an inner bracket of the housing (401).

[0114] According to one embodiment, the shape of the first metal part (410) and the second metal part (420) may be realized using at least one of an extrusion process, a rolling process, a forging process, a CNC machining process, a metal-injection molding (MIM) process, and a 3D printing process, but is not limited thereto.

[0115] According to one embodiment, the first region (423) of the second metal part (420) may include a third surface (421) and a fourth surface (422) opposite to the third surface (421). The third surface (421) of the first region (423) may be joined to the second surface (412) of the first metal part (410) through a filler metal (430). The fourth surface (422) of the first region (423) may face the interior of the electronic device.

[0116] According to one embodiment, the second metal part (420) may be disposed inwardly with respect to the first metal part (410). The statement that the second metal part (420) is disposed inwardly with respect to the first metal part (410) may be interpreted as the first metal part (410) being exposed to the outside of the electronic device and the second metal part (420) being located inside the electronic device and not exposed to the outside of the electronic device, but is not limited thereto.

[0117] According to one embodiment, a filler metal (430) may be disposed between a first metal part (410) and a second metal part (420). The filler metal (430) may be bonded to the first metal part (410) and the second metal part (420). For example, the boundary between the first metal part (410) and the second metal part (420) may be defined by the filler metal (430).

[0118] According to one embodiment, the filler metal (430) may include at least one of aluminum (Al), silicon (Si), copper (Cu), and / or zinc (Zn). According to one embodiment, the filler metal (430) may be named a filler material.

[0119] According to one embodiment, the housing (401) may be formed by brazing dissimilar metals (e.g., a first metal part (410) and a second metal part (420)) through a filler metal (430). For example, the housing (401) may include a dissimilar metal joining structure.

[0120] According to one embodiment, the cover portion (440) may include a non-metallic material (e.g., resin). The cover portion (440) may include a first cover portion (441) and a second cover portion (442).

[0121] According to one embodiment, one end or one edge of the filler metal (430) may be covered by a first cover portion (441). The first cover portion (441) is connected to the first metal portion (410) and the second metal portion (420) and may cover one end of the filler metal (430). Accordingly, one end of the filler metal (430) may be sealed by the first metal portion (410), the second metal portion (420), and the first cover portion (441). Accordingly, exposure of one end of the filler metal (430) to moisture or air may be limited and / or reduced, thereby limiting and / or reducing oxidation or corrosion of the filler metal (430). For example, the first cover portion (441) may be configured to limit and / or reduce the occurrence of galvanic corrosion at the boundary between the first metal portion (410) and the second metal portion (420) (e.g., a bonding boundary defined by the filler metal (430)). The first cover portion (441) may be placed wholly or partially at the boundary between the first metal portion (410) and the second metal portion (420).

[0122] According to one embodiment, another end or another edge of the filler metal (430) may be covered by a second cover portion (442). The second cover portion (442) is connected to the first metal portion (410) and the second metal portion (420) and may cover the other end of the filler metal (430). Accordingly, the other end of the filler metal (430) may be sealed by the first metal portion (410), the second metal portion (420), and the second cover portion (442). Accordingly, exposure of the other end of the filler metal (430) to moisture or air may be limited and / or reduced, thereby limiting and / or reducing oxidation or corrosion of the filler metal (430). For example, the second cover portion (442) may be configured to limit and / or reduce the occurrence of galvanic corrosion at the boundary between the first metal portion (410) and the second metal portion (420) (e.g., a bonding boundary defined by the filler metal (430)). The second cover portion (442) may be placed wholly or partially at the boundary between the first metal portion (410) and the second metal portion (420).

[0123] According to one embodiment, the first cover portion (441) may be bonded to the boundary and adjacent portions of the first metal portion (410) and the second metal portion (420) through a first organic bonding film (443). The first organic bonding film (443) may comprise at least one of a polymer, a resin, and / or an epoxy. The first organic bonding film (443) may be formed by pre-treating the surfaces of the first metal portion (410) and the second metal portion (420) and disposed between the surfaces of the first metal portion (410) and the second metal portion (420) and the first cover portion (441) to firmly bond the surfaces of the first metal portion (410) and the second metal portion (420) and the first cover portion (441).

[0124] According to one embodiment, the second cover portion (442) may be bonded to the boundary and adjacent portions of the first metal portion (410) and the second metal portion (420) through a second organic bonding film (444). The second organic bonding film (444) may comprise at least one of a polymer, a resin, and / or an epoxy. The second organic bonding film (444) may be formed by pre-treating the surfaces of the first metal portion (410) and the second metal portion (420) and disposed between the surfaces of the first metal portion (410) and the second metal portion (420) and the second cover portion (442) to firmly bond the surfaces of the first metal portion (410) and the second metal portion (420) and the second cover portion (442).

[0125] According to one embodiment, the first organic bonding film (443) and the second organic bonding film (444) may each be formed by a pretreatment such as anodic oxidation at the boundary between the first metal portion (410) and the second metal portion (420). For example, the first organic bonding film (443) and the second organic bonding film (444) formed by the pretreatment such as anodic oxidation may each include a porous oxide film (e.g., TiO2, or Al2O3) formed by annodic oxidation treatment under acid treatment conditions at the boundary between the first metal portion (410) and the second metal portion (420), but are not limited thereto. The thickness of the first organic bonding film (443) and the second organic bonding film (444) may be about 90 nm to about 110 nm (nanometer), but is not limited thereto. The first organic bonding film (443) and the second organic bonding film (444) can be configured to strengthen the bonding force by pre-treating the surface of the first metal part (410) and the second metal part (420) so that the surface energy of the first metal part (410) and the second metal part (420) is not reduced, thereby increasing the contact area between the first metal part (410) and the second metal part (420) and the cover parts (441, 442).

[0126] According to one embodiment, the boundary between the first metal part (410) and the second metal part (420) may be pretreated by silane treatment, chromate treatment, chromic acid treatment, or zincate treatment to increase the contact area with the cover parts (441, 442), but is not limited thereto.

[0127] According to one embodiment, the first cover portion (441) and the second cover portion (442) may be formed by insert injection molding into the housing (401), but are not limited thereto. The first cover portion (441) and the second cover portion (442) may cover both ends of the filler metal (430) so that a smut or oxide film is not formed on both ends of the filler metal (430) through pretreatment such as anodic oxidation.

[0128] Referring to FIG. 8, the housing (401) may include a first metal part (410), a second metal part (420), a filler metal (430), and a plurality of dendrites (433).

[0129] According to one embodiment, the filler metal (430) may be connected and / or combined with the first metal part (410) and the second metal part (420).

[0130] According to one embodiment, a plurality of dendrites (433) can be defined and / or interpreted as part of the composition of the filler metal (430). For example, the filler metal (430) may include a plurality of dendrites (433).

[0131] According to one embodiment, a plurality of dendrites (433) may be formed by diffused into a second metal part (420) (e.g., base material) and cooling and / or solidifying the molten filler metal (430) and / or elements of the first metal part (410). For example, a plurality of dendrites (433) may be formed by diffused into the interior of the surface of the second metal part (420) (e.g., the third surface (421) of FIG. 7) and solidifying together with the second metal part (420). The plurality of dendrites (433) may be formed in a sharp and elongated branch shape, but are not limited thereto. The length of the dendrites (433) may be about 1 µm to about 30 µm (micrometer), but is not limited thereto. For example, the length of the dendrites (433) may be about 1 µm to about 20 µm (micrometer), but is not limited thereto.

[0132] According to one embodiment, a plurality of dendrites (433) can form an intermetallic compound (e.g., TiAl3) with the second metal part (420) inside the second metal part (420).

[0133] According to one embodiment, a plurality of dendrites (433) may be diffused at least partially from the filler metal (430) to the second metal portion (420). The plurality of dendrites (433) may be formed by the diffusion of elements of the first metal portion (410) to the second metal portion (420), but are not limited thereto.

[0134] According to one embodiment, a plurality of dendrites (433) may diffuse at least partially from the filler metal (430) to the second metal part (420). For example, the plurality of dendrites (433) may be an intermetallic compound (e.g., TiAl3) formed by the elements of the first metal part (410) diffusing into the filler metal (430) and the second metal part (420) together with the elements of the second metal part (420), but are not limited thereto. If the material of the first metal part (410) is titanium, the elements of the first metal part (410) may be titanium elements, and if the material of the second metal part (420) is aluminum, the elements of the second metal part (420) may be aluminum elements, but are not limited thereto.

[0135] According to one embodiment, the housing (301, 401) may have an element of the first metal part (410) (e.g., titanium) in an area where the filler metal (430) is located, and an element of the first metal part (410) (e.g., titanium) in an area where the dendrites (433) are formed, but is not limited thereto.

[0136] According to one embodiment, a plurality of dendrites (433) may be diffused into at least partially from the filler metal (430) to the second metal portion (420). For example, the plurality of dendrites (433) may include an intermetallic compound (e.g., TiAl3), and the intermetallic compound may include the material of the first metal portion (410) (e.g., titanium (Ti)), but is not limited thereto.

[0137] According to one embodiment, the bonding area between the filler metal (430) and the second metal part (420) can be increased through a plurality of dendrites (433) diffused into the interior of the second metal part (420). Accordingly, the bonding area between the filler metal (430) and the second metal part (420) is increased, and the mechanical bonding strength can be improved. That is, the filler metal (430) and the second metal part (420) can be defined and / or interpreted as having a bonded interface facing each other and an increased bonding area through the dendrites (433).

[0138] According to one embodiment, the filler metal (430) can be bonded to the first metal part (410). For example, an element of the filler metal (430) can diffuse into the interior of the surface of the first metal part (410) (e.g., the second surface (412) in FIG. 7) to form a metal-to-metal bond with the first metal part (410) inside the first metal part (410).

[0139] According to one embodiment, the thickness (t1) of the filler metal (430) (e.g., the thickness of the remaining portion excluding the dendrites (433)) may be about 0.005 mm to about 0.5 mm, but is not limited thereto. For example, the thickness (t1) of the filler metal (430) may be about 0.01 mm to about 0.4 mm, but is not limited thereto.

[0140] FIG. 9 is a flowchart illustrating a method for manufacturing a housing having a heterogeneous metal bonding structure according to one embodiment of the present disclosure. FIG. 10, FIG. 11, FIG. 12, and FIG. 13 are schematic diagrams illustrating a state in which a filler metal is introduced between a first metal part and a second metal part through capillary action according to one embodiment of the present disclosure.

[0141] The embodiments of FIGS. 9 to 13 may be combined with the embodiments of FIGS. 1 to 8 or the embodiments of FIGS. 14 to 17. The configurations of the embodiments of FIGS. 9 to 13 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 8 or the configurations of FIGS. 14 to 17.

[0142] Referring to FIG. 9, a method for manufacturing a housing having a heterogeneous metal bonding structure may include a process (P11) for preparing a first metal part (e.g., the first metal part (410) of FIG. 7 and 8) and a second metal part (e.g., the second metal part (420) of FIG. 7 and 8).

[0143] According to one embodiment, the process (P11) may include a process of preparing a first metal part (410) containing titanium. The process of preparing the first metal part (410) containing titanium may include a process of processing the first metal containing titanium to have a designed shape through extrusion and / or shape processing. The process of preparing the first metal part (410) containing titanium may include a process of cleaning the shaped first metal.

[0144] According to one embodiment, the first metal portion (410) may comprise at least one of pure titanium (e.g., commercially pure (CP)) or a titanium alloy. The titanium alloy may be, as an example, a titanium alloy comprising about 90 weight percent titanium, about 6 weight percent vanadium (V), and about 4 weight percent aluminum (Al) (e.g., Ti-6V-4Al), but is not limited thereto and may be other types of titanium alloys.

[0145] According to one embodiment, the process (P11) may include a process of preparing a second metal part (420) comprising an aluminum alloy. The process of preparing the second metal part (420) comprising aluminum may include a process of processing the second metal comprising aluminum to have a designed shape through extrusion and / or shape processing. The process of preparing the second metal part (420) comprising aluminum may include a process of washing the shaped second metal.

[0146] According to one embodiment, the second metal part (420) may include an aluminum alloy. The aluminum alloy may include at least one of a 6xxx series aluminum alloy or a 7xxx series aluminum alloy.

[0147] According to one embodiment, the first metal part (410) may comprise at least one of titanium or stainless steel, and the second metal part (420) may comprise an aluminum alloy. In such a case, the filler metal (e.g., the filler metal (430) of FIGS. 6 and 7) may comprise at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, and an aluminum-zinc alloy. For example, the aluminum-silicon alloy, the aluminum-copper-silicon alloy, and the aluminum-zinc alloy may be alloys having a composition ratio having a melting point lower than the melting point of the first metal part (410) or the melting point of the second metal part (420), but are not limited thereto. As an example, the filler metal (430) may include, but is not limited to, a 4xxx series aluminum-silicon alloy containing about 6 to 12 weight percent silicon, an aluminum-copper-silicon alloy containing about 6 to 12 weight percent silicon and about 10 to 20 weight percent copper, and an aluminum-zinc alloy containing less than about 1 weight percent zinc. The filler metal (430) may include an aluminum alloy containing less than about 1 weight percent iron, zinc, or magnesium, but is not limited thereto. The filler metal (430) may include about 12 weight percent aluminum-silicon alloy, but is not limited thereto. The iron of the filler metal (430) may form an intermetallic compound such as Fe3Al or FeAl with the aluminum of the second metal part (420), but is not limited thereto.

[0148] According to one embodiment, the first metal part (410) may comprise at least one of titanium or stainless steel, and the second metal part (420) may comprise a magnesium alloy. In this case, the filler metal (430) may comprise at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, a tin alloy, and an aluminum-zinc alloy. For example, the aluminum-silicon alloy, the aluminum-copper-silicon alloy, the tin alloy, and the aluminum-zinc alloy may be alloys having a composition ratio having a melting point lower than the melting point of the first metal part (410) or the melting point of the second metal part (420), but are not limited thereto.

[0149] According to one embodiment, the first metal part (410) may comprise at least one of titanium or stainless steel, and the second metal part (420) may comprise a magnesium alloy. In this case, the filler metal (430) may comprise at least one of tin or a tin alloy. For example, tin and tin alloys may have a melting point lower than the melting point of the first metal part (410) or the melting point of the second metal part (420). The tin of the filler metal (430) may form intermetallic compounds such as FeSn2, FeSn, Fe3Sn2, Fe5Sn3, and Fe3Sn with the iron of the second metal part (420), but is not limited thereto. The filler metal (430) may form an intermetallic compound such as Ti3Sn with the first metal part (410) and an intermetallic compound such as Mg2Sn with the second metal part (420). It may include an aluminum alloy containing less than about 1 weight percent of iron, zinc, or magnesium, but is not limited thereto. The iron of the filler metal (430) and the filler metal (430) of the second metal part (420) may include about 12 weight percent of an aluminum-silicon alloy, but are not limited thereto.

[0150] According to one embodiment, the filler metal (430) may include, but is not limited to, an aluminum-silicon-magnesium alloy (e.g., Al-Si-Mg).

[0151] According to one embodiment, a method for manufacturing a housing including a heterogeneous metal bonding structure may include a process (P13) of aligning a first metal part (410) and a second metal part (420).

[0152] According to one embodiment, the process (P13) may include a process of arranging a first metal part (410) and a second metal part (420) so as to face each other, and aligning them so that a designated gap (e.g., a brazing gap) is formed between them. This will be described later with reference to FIGS. 10 to 13.

[0153] According to one embodiment, a method for manufacturing a housing including a heterogeneous metal bonding structure may include a process (P13) of brazing bonding by injecting molten filler metal (430) between a first metal part (410) and a second metal part (420).

[0154] According to one embodiment, when the first metal part (410) comprises at least one of titanium or stainless steel and the second metal part (420) comprises an aluminum alloy, the molten filler metal (430) may comprise at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, and an aluminum-zinc alloy.

[0155] According to one embodiment, when the first metal part (410) comprises at least one of titanium or stainless steel and the second metal part (420) comprises a magnesium alloy, the molten filler metal (430) may comprise at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, a tin alloy, and an aluminum-zinc alloy.

[0156] According to one embodiment, the filler metal (430) may be selected as a metal having a melting point lower than the melting point of the first metal part (410) and / or the melting point of the second metal part (420), but is not limited thereto.

[0157] According to one embodiment, the filler metal (430) may be selected as a metal that can effectively act as a flowable, wettable, and / or capillary action with base materials (e.g., a first metal part (410) and a second metal part (420)), but is not limited thereto.

[0158] According to one embodiment, the filler metal (430) may be selected as a metal capable of being metallically bonded with the base materials (e.g., the first metal part (410) and the second metal part (420)) through brazing, but is not limited thereto.

[0159] According to one embodiment, the filler metal (430) may be provided in a bent wire shape, a pressed shape, a 3D shape formed by die casting, or a state in which it is pre-coated or applied to the first metal part (410) or the second metal part (420) through plating and / or cladding, and subsequently melted and used, but is not limited thereto.

[0160] According to one embodiment, the process (P13) and the process (P15) may be arranged such that the first metal part (410) and the second metal part (420) are maintained separated from each other by a specified gap inside the furnace, and a molten filler metal (430) is introduced or injected between them (e.g., the gap) so that it can flow between the surface of the first metal part (410) and the surface of the second metal part (420) through capillary action. For example, when the interior of the furnace is heated while the unmolten filler metal (430) is placed adjacent to the gap between the first metal part (410) and the second metal part (420), the filler metal (430) melts and can flow deeper between the first metal part (410) and the second metal part (420) through capillary action caused by surface tension and / or wettability. In such a case, elements of the filler metal (430) and / or elements of the first metal part (410) may diffuse into the interior of the second metal part (420) through the surface and voids of the second metal part (420), and then cool and / or solidify to form a plurality of dendrites (e.g., dendrites (433) of FIG. 8). That is, through brazing diffusion bonding, the filler metal (430) may be bonded to the second metal part (420) and the dendrites (433). For example, when cooling and / or solidifying while the elements of the filler metal (430) and / or the elements of the first metal part (410) have diffused into the second metal part (420), the filler metal (430) and / or the first metal part (410) are separated from the second metal part (420) by a difference in composition, and the filler metal (430) and / or the first metal part (410) may aggregate to form dendrites (433). When cooling and / or solidifying after the elements of the filler metal (430) have diffused into the first metal part (410) through the surface and pores of the first metal part (410), dendrites may not be formed.

[0161] According to one embodiment, the filler metal (430) can be joined to the first metal part (410) and the second metal part (420) through a brazing joining process.

[0162] According to one embodiment, the brazing joining process may be performed in a state where the interior of the furnace has a vacuum atmosphere or an inert atmosphere, but is not limited thereto. The brazing joining process may be performed as a dip brazing joining process, but is not limited thereto.

[0163] According to one embodiment, when the interior of the furnace has a specified temperature (e.g., about 580 degrees to about 600 degrees, or about 580 degrees or less), the filler metal (430) can be heated and melted and flow into the space between the first metal part (410) and the second metal part (420). At this time, from the surface of the first metal part (410) and the surface of the second metal part (420), the molten filler metal (430) can flow into the depths of the first metal part (410) and the second metal part (420) through capillary action.

[0164] According to one embodiment, when sufficient time has elapsed for the molten filler metal (430) to diffuse through the surface of the first metal part (410) and the surface of the second metal part (420) (e.g., about 5 to 20 minutes), a diffusion bonding structure or a diffusion bonding surface may be formed between the filler metal (430) and the metal parts (e.g., the first metal part (410) and the second metal part (420)), but is not limited thereto. For example, when such brazing is completed, the filler metal (430) and the metal parts (e.g., the first metal part (410) and the second metal part (420)) may be slow-cooled so that the diffusion structure does not break or defects occur. When slow cooling is completed, a housing (401) including a heterogeneous metal bonding structure may be formed.

[0165] According to one embodiment, a method for manufacturing a housing including a heterogeneous metal bonding structure may include a process (P17) for post-processing a heterogeneous metal housing (e.g., a housing including a heterogeneous metal bonding structure).

[0166] According to one embodiment, the process (P17) may include a process of pre-treating the ends of a filler metal (430) that are combined with the first metal part (410) and the second metal part (420) and are exposed to the outside, such as anodizing, and a process of injecting a cover part (e.g., the cover part (440) of FIG. 8) into a manufactured heterogeneous metal housing.

[0167] According to one embodiment, the process (P17) may include a process of machining the manufactured heterogeneous metal housing into a desired shape, a process of chromatizing or anodizing the aluminum-containing portion of the manufactured heterogeneous metal housing, and a process of surface treating the exterior of the manufactured heterogeneous metal housing. According to one embodiment, the process (P17) may further include a process of combining and / or assembling the manufactured heterogeneous metal housing with electrical / electronic components and other mechanisms.

[0168] FIGS. 10 to 13 are schematic diagrams for explaining the state in which, when manufacturing a heterogeneous metal housing (401), a molten filler metal (430) flows between the first metal part (410) and the second metal part (420) through capillary action while the first metal part (410) and the second metal part (420) are aligned inside a furnace.

[0169] Referring to FIG. 10, the first metal part (410) and the second metal part (420) may be spaced apart by a specified gap (g). The gap (g) may be defined as a brazing gap.

[0170] According to one embodiment, the thickness (d1) of the gap (g) may be about 0.04 mm to about 0.5 mm, but is not limited thereto, and may be about 0.05 mm to about 0.4 mm. The thickness (d1) of the gap (g) may correspond to the thickness of the filler metal (430) in the finished housing (e.g., thickness (t1) of FIG. 8), but is not limited thereto.

[0171] According to one embodiment, the surface of the first metal part (410) and the surface of the second metal part (420) may be surface-treated surfaces so that molten filler metal (430) can flow in efficiently during brazing.

[0172] According to one embodiment, if the gap (g) is too large, a void may occur in a part of the molten filler metal (430), and if the gap (g) is too small, the molten filler metal (430) may not flow in efficiently, so a gap (g) of an appropriate size may be required.

[0173] According to one embodiment, when the first metal part (410) and the second metal part (420) are fixed in position with a gap (g) formed between them and facing each other, the molten filler metal (430) can flow into the space between the first metal part (410) and the second metal part (420) through the gap (g). In this case, the molten filler metal (430) (e.g., liquid filler metal (430)) can move in a first direction (F1) along the surfaces of the first metal part (410) and the second metal part (420) due to surface tension and capillary action. Meanwhile, at the end facing the first direction, a concave portion (431) may be formed due to the contact angle resulting from the wettability and surface tension of the base materials (e.g., the first metal part (410) and the second metal part (420)) and the molten filler metal (430).

[0174] Referring to FIG. 11, the first metal part (410) may include a protrusion (415). The protrusion (415) may protrude from the surface of the first metal part (410). The protrusion (415) may come into contact with the second metal part (420). Accordingly, when the molten filler metal (430) flows in during brazing, the thickness (d1) of the gap (g) between the first metal part (410) and the second metal part (420) can be maintained without decreasing.

[0175] Referring to FIG. 12, the first metal part (410) and the second metal part (420) can be fixed to the rack (10). Accordingly, when the molten filler metal (430) flows in during brazing, the thickness (d1) of the gap (g) between the first metal part (410) and the second metal part (420) can be maintained without increasing.

[0176] Referring to FIG. 13, the first metal part (410) and the second metal part (420) can be connected through a pre-bonding member (470). Accordingly, when the molten filler metal (430) flows in during brazing, the thickness (d1) of the gap (g) between the first metal part (410) and the second metal part (420) can be maintained without decreasing.

[0177] A housing (401) including a heterogeneous metal bonding structure manufactured as described with reference to FIGS. 10 to 13 may have a tensile strength of about 140 MPa to about 210 MPa, but is not limited thereto. For example, a housing (401) including a heterogeneous metal bonding structure may have a tensile strength of about 150 MPa to about 200 MPa.

[0178] The heterogeneous metal bonding housing (401) described with reference to FIGS. 10 to 13 can be applied to a bar-type electronic device (e.g., a smartphone) as shown in FIGS. 2 to 4, but is not limited thereto, and can also be applied to various types of electronic devices (e.g., a foldable electronic device, a sliderable electronic device, or a cradle for wireless earphones).

[0179] The heterogeneous metal bonding housing (401) described with reference to FIGS. 10 to 13 may have a first metal part (410) comprising at least one of a titanium alloy, a stainless steel alloy, or a metallized ceramic, and a second metal part (420) comprising at least one of a titanium alloy or an iron alloy. In such a case, the filler metal (430) may comprise at least one of a silver (Ag) alloy, a nickel (Ni) alloy, an aluminum-silicon alloy, an aluminum-copper-silicon alloy, or an aluminum-silicon-zinc alloy.

[0180] According to one embodiment, when the first metal part (410) comprises metallized ceramic and the second metal part (420) comprises aluminum or magnesium, the first metal part (410) may be bonded and / or joined only to the filler metal (430), and the second metal part (420) may be bonded and / or joined only to the filler metal (430). For example, elements of the first metal part (410) may not diffuse to the second metal part (420), and dendrites may not be formed.

[0181] FIGS. 14 and 15 are drawings showing cross-sectional images of a housing including a heterogeneous metal bonding structure according to one embodiment of the present disclosure, taken through a scanning electron microscope (SEM).

[0182] The embodiments of FIGS. 14 and 15 may be combined with the embodiments of FIGS. 1 to 13, or the embodiments of FIGS. 16 and 17. The configurations of the embodiments of FIGS. 14 and 15 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 13, or the configurations of FIGS. 16 and 17.

[0183] Referring to FIG. 14, a housing (401) including a heterogeneous metal bonding structure may include a first metal part (410), a second metal part (420), and a filler metal (430) disposed between the first metal part (410) and the second metal part (420).

[0184] According to one embodiment, at least a portion of the filler metal (430) may diffuse into the first metal portion (410) to form a plurality of dendrites (433). The plurality of dendrites (433) increase the bonding area between the filler metal (430) and the second metal portion (420), thereby improving the bonding strength between the filler metal (430) and the second metal portion (420).

[0185] Referring to FIG. 15, a housing (401) including a heterogeneous metal bonding structure may include a first metal part (410), a second metal part (420), and a filler metal (430) disposed between the first metal part (410) and the second metal part (420).

[0186] According to one embodiment, the second metal part (420) and the filler metal (430) can be joined by dendrites (405).

[0187] According to one embodiment, when the first metal part (410) and the filler metal (430) are brazed together, the boundary (406) between the first metal part (410) and the filler metal (430) may be unclear. In such a case, at the boundary (406) between the second metal part (420) and the filler metal (430), elements of the filler metal (430) may be diffused by the brazed joining and thus identified. As an example, if the filler metal (430) contains tin (Sn), tin (Sn) may be identified at the boundary (406).

[0188] According to one embodiment, when the first metal part (410) comprises titanium (Ti), the filler metal (430) comprises tin (Sn), and the second metal part (420) comprises stainless steel, dendrites may not be formed between the second metal part (420) and the filler metal (430) during brazing, but are not limited thereto. For example, when dendrites are not formed between the second metal part (420) and the filler metal (430), titanium (Ti) may be identified in a part of the second metal part (420) or a part of the filler metal (430) at the boundary between the second metal part (420) and the filler metal (430) or in an area adjacent to the boundary (e.g., through ESD (Electro-Static Discharge) analysis), but is not limited thereto.

[0189] According to one embodiment, when the first metal part (410) includes titanium (Ti), the filler metal (430) includes tin (Sn), and the second metal part (420) includes stainless steel, dendrites may not be formed between the second metal part (420) and the filler metal (430) during brazing.

[0190] FIG. 16 is a cross-sectional view of a housing including a double bond structure according to one embodiment of the present disclosure. FIG. 17 is a cross-sectional view of a housing including a double bond structure according to one embodiment of the present disclosure.

[0191] The embodiments of FIGS. 16 and 17 can be combined with the embodiments of FIGS. 1 to 15. The configurations of the embodiments of FIGS. 16 and 17 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 15.

[0192] Referring to FIG. 16, a housing (401) including a heterogeneous metal bonding structure may include a first metal part (410) and a second metal part (420). The boundary between the first metal part (410) and the second metal part (420) may be formed by a filler metal (e.g., the filler metal (430) of FIG. 7 and FIG. 8).

[0193] According to one embodiment, the housing (401) may further include a non-metallic member (480) having a non-metallic material. The non-metallic member (480) may include, for example, an injection molded material, but is not limited thereto.

[0194] According to one embodiment, a portion (481) of the non-metallic member (480) may be insert-molded into the second metal portion (420), but is not limited thereto. The remainder (482) of the non-metallic member (480) may divide the first metal portion (410) so as to separate the first metal portion (410) into a plurality of regions. As an example, the remainder of the non-metallic member (480) may be defined as a segment (e.g., the segment (482) of FIG. 6).

[0195] According to one embodiment, the boundary (492) between the segment (482) and the first metal part (410) may include a first boundary (492a) and a second boundary (492b) connected to the first boundary (492a).

[0196] According to one embodiment, the first boundary (492a) may be extended in a straight line. The second boundary (492b) may be formed in a curve. Accordingly, the boundary distance between the first boundary (492a) and the second boundary (492b) is formed longer compared to the case where only a straight line boundary is included, thereby limiting and / or reducing the leakage reaching the filler metal in the event of leakage.

[0197] Referring to FIG. 17, a first metal part (510) (e.g., the first metal part (410) of FIG. 16) may be joined to a second metal part (520) (e.g., the second metal part (420) of FIG. 16) and a filler metal (e.g., the filler metal (430) of FIG. 7 and FIG. 8). The first metal part (510) may include a plurality of protruding parts (511) and a plurality of concave parts disposed between the plurality of protruding parts (511). The second metal part (520) may include a plurality of protruding parts (521) and a plurality of concave parts disposed between the plurality of protruding parts (521). The protruding portions (511) of the first metal part (510) can be inserted into the concave portions of the second metal part (520), and the protruding portions (521) of the second metal part (520) can be inserted into the concave portions of the first metal part (510). In this case, the first metal part (510) and the second metal part (520) can be joined in an interlocking structure. Additionally, since the filler metal can flow between the first metal part (510) and the second metal part (520) through capillary action via brazing, even when the first metal part (510) and the second metal part (520) are joined in a complex shape as illustrated, the filler metal can flow between them to perform brazing diffusion joining with the first metal part (510) and the second metal part (520).

[0198] In the case of smart devices, the overall housing structure can be formed by combining an outer metal, such as titanium, or an inner metal, such as aluminum, to enhance external rigidity, design, and overall weight reduction. However, since it is difficult to directly bond dissimilar metals of different materials, methods such as laser-treating their surfaces for insert die-casting, clad bonding, or joining them using other fastening components like bolts have been proposed. Nevertheless, in the case of the above methods for joining dissimilar metals, sufficient bonding strength is not ensured at the joint, which may lead to cracks occurring inside the device or at the joint when the smart device is dropped.

[0199] According to one embodiment of the present disclosure, a housing and an electronic device including the same may be provided, comprising a heterogeneous metal joint structure in which a filler metal is joined to base materials (e.g., a first metal part and a second metal part) through brazing, so that the joint strength of the joint area is sufficiently secured to provide high rigidity and high airtightness.

[0200] However, the problems to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0201] According to one embodiment of the present disclosure, a housing and an electronic device including the same may be provided, comprising a heterogeneous metal bonding structure such that the filler metal and the base materials can be bonded with high strength and airtightness and corrosion resistance can be ensured at the bonding boundary, as the filler metal forms a diffusion bonding structure with the base materials (e.g., a first metal part and a second metal part).

[0202] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0203] According to one embodiment of the present disclosure, the electronic device (101) may include a housing (301, 401).

[0204] According to one embodiment, the electronic device (101) may include a display (330) disposed on the housing (301, 401).

[0205] According to one embodiment, the electronic device (101) may include a battery (350) disposed within the housing (301, 401).

[0206] According to one embodiment, the housing (301, 401) may include a first metal part (410) that forms at least a part of the exterior of the electronic device (101).

[0207] According to one embodiment, the housing (301, 401) may include a second metal part (420) which is disposed inside the first metal part (410) and has a material different from that of the first metal part (410).

[0208] According to one embodiment, the housing (301, 401) may include a filler metal (430) that is disposed between the first metal part (410) and the second metal part (420) and is coupled to the first metal part (410) and the second metal part (420).

[0209] According to one embodiment, the housing (301, 401) may include a plurality of dendrites (433) that are at least partially diffused from the filler metal (430) into the second metal portion (420).

[0210] According to one embodiment, the plurality of dendrites (433) may have an elongated branch shape.

[0211] According to one embodiment, the filler metal (430) and the second metal part (420) can be joined by the plurality of dendrites (433).

[0212] According to one embodiment, the length of the plurality of dendrites (433) may be in the range of 1 µm to 20 µm (micrometer).

[0213] According to one embodiment, the housing (301, 401) may further include a cover portion (440) that covers the filler metal (430) so that the filler metal (430) is not exposed, and the housing may include a non-metallic material.

[0214] According to one embodiment, the cover portion (440) may include a first cover portion (441) that covers one end of the filler metal (430).

[0215] According to one embodiment, it may include a second cover portion (442) that covers the other end of the filler metal (430).

[0216] According to one embodiment, the housing (301, 401) may include a first organic bonding film (443) disposed between the end of the filler metal (430) and the first cover portion (441).

[0217] According to one embodiment, the housing (301, 401) may include a second organic bonding film (444) disposed between the other end of the filler metal (430) and the second cover portion (442).

[0218] According to one embodiment, the first metal part (410) may comprise at least one of titanium or stainless steel.

[0219] According to one embodiment, the second metal part (420) may include at least one of aluminum or magnesium.

[0220] According to one embodiment, the filler metal (430) may include at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, or an aluminum-zinc alloy.

[0221] According to one embodiment, the thickness of the filler metal (430) may be in the range of 0.05 mm to 0.4 mm.

[0222] According to one embodiment, the filler metal (430) can be joined to the first metal portion (410) and the second metal portion (420) through brazing diffusion bonding.

[0223] According to one embodiment of the present disclosure, the housing (401) of an electronic device may include a first metal part (410) that forms at least a part of the exterior of the electronic device.

[0224] According to one embodiment, the housing (401) may include a second metal part (420) disposed on the inside relative to the first metal part (410) and having a material different from that of the first metal part (410).

[0225] According to one embodiment, the housing (401) may include a filler metal (430) disposed between the first metal part (410) and the second metal part (420) and coupled to the first metal part (410) and the second metal part (420).

[0226] According to one embodiment, the housing (401) may include a plurality of dendrites (433) that are at least partially diffused from the filler metal (430) into the second metal portion (420).

[0227] According to one embodiment, the plurality of dendrites (433) may have an elongated branch shape.

[0228] According to one embodiment, the filler metal (430) and the second metal part (420) can be joined by the plurality of dendrites (433).

[0229] According to one embodiment, the length of the plurality of dendrites (433) may be in the range of 1 µm to 20 µm (micrometer).

[0230] According to one embodiment, the housing (401) may further include a cover portion (440) that covers the filler metal (430) so that the filler metal (430) is not exposed, and the housing (401) may include a non-metallic material.

[0231] According to one embodiment, the cover portion (440) may include a first cover portion (441) that covers one end of the filler metal (430).

[0232] According to one embodiment, the cover portion (440) may include a second cover portion (442) that covers the other end of the filler metal (430).

[0233] According to one embodiment, the housing (401) may include a first organic bonding film (443) disposed between one end of the filler metal (430) and the first cover portion (441).

[0234] According to one embodiment, the housing (401) may include a second organic bonding film (444) disposed between the other end of the filler metal (430) and the second cover portion (442).

[0235] According to one embodiment, the first metal part (410) may comprise at least one of titanium or stainless steel.

[0236] According to one embodiment, the second metal part (420) may include at least one of aluminum or magnesium.

[0237] According to one embodiment, the filler metal (430) may include at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, or an aluminum-zinc alloy.

[0238] According to one embodiment, the filler metal (430) can be joined to the first metal portion (410) and the second metal portion (420) through brazing diffusion bonding.

[0239] According to one embodiment of the present disclosure, a method for manufacturing a housing (401) of an electronic device may include a process (P11) of preparing a first metal part (410) and a second metal part (420) having a material different from that of the first metal part (410).

[0240] According to one embodiment, the manufacturing method may include a process (P13) of aligning the first metal part (410) and the second metal part (420).

[0241] According to one embodiment, the manufacturing method may include a process (P15) of brazing by injecting molten filler metal (430) between the first metal part (410) and the second metal part (420).

[0242] According to one embodiment of the present disclosure, the electronic device (101) may include a housing (301, 401).

[0243] According to one embodiment, the electronic device (101) may include a display (330) disposed on the housing (301, 401).

[0244] According to one embodiment, the electronic device (101) may include a battery (350) disposed within the housing (301, 401).

[0245] According to one embodiment, the housing (301, 401) may include a first metal part (410) that forms at least a part of the exterior of the electronic device (101).

[0246] According to one embodiment, the housing (301, 401) may include a second metal part (420) which is disposed inside the first metal part (410) and has a material different from that of the first metal part (410).

[0247] According to one embodiment, the housing (301, 401) may include a filler metal (430) that is disposed between the first metal part (410) and the second metal part (420) and is coupled to the first metal part (410) and the second metal part (420).

[0248] According to one embodiment, the filler metal (430) can be joined to the first metal part (410) and the second metal part (420) through brazing.

[0249] According to one embodiment, the first metal part (410) may include metallized ceramic.

[0250] According to one embodiment, the second metal part (420) may include at least one of aluminum or magnesium.

[0251] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of this document.

Claims

1. In an electronic device (101), Housing(301, 401); A display (330) disposed on the above housing (301, 401); and It includes a battery (350) disposed within the above housing (301, 401), and The above housing (301, 401) is, A first metal part (410) forming at least a portion of the exterior of the electronic device (101); A second metal part (420) disposed on the inner side of the first metal part (410) and having a material different from that of the first metal part (410); A filler metal (430) disposed between the first metal part (410) and the second metal part (420) and coupled to the first metal part (410) and the second metal part (420); and An electronic device (101) comprising a plurality of dendrites (433) that are at least partially diffused from the filler metal (430) into the second metal portion (420).

2. In Paragraph 1, The above plurality of dendrites (433) have an elongated branch shape, The above filler metal (430) and the above second metal part (420) are an electronic device (101) joined by the above plurality of dendrites (433).

3. In Paragraph 1 or 2, The length of the plurality of dendrites (433) is in the range of 1 µm to 20 µm (micrometer) for the electronic device (101).

4. In any one of paragraphs 1 to 3, The above housing (301, 401) is, An electronic device (101) comprising a non-metallic material and further comprising a cover portion (440) that covers the filler metal (430) so as not to expose the filler metal (430).

5. In any one of paragraphs 1 through 4, The above cover portion (440) is an electronic device (101) comprising a first cover portion (441) covering one end of the filler metal (430) and a second cover portion (442) covering the other end of the filler metal (430).

6. In any one of paragraphs 1 through 5, The above housing (301, 401) further comprises a first organic bonding film (443) disposed between the one end of the filler metal (430) and the first cover portion (441), and a second organic bonding film (444) disposed between the other end of the filler metal (430) and the second cover portion (442).

7. In any one of paragraphs 1 through 6, The first metal part (410) comprises at least one of titanium or stainless steel, and The second metal part (420) above is an electronic device (101) comprising at least one of aluminum or magnesium.

8. In any one of paragraphs 1 through 7, The above filler metal (430) comprises at least one of an aluminum-silicon alloy, an aluminum-copper-silicon alloy, or an aluminum-zinc alloy in an electronic device (101).

9. In any one of paragraphs 1 through 8, The thickness of the filler metal (430) is in the range of 0.05 mm to 0.4 mm for the electronic device (101).

10. In any one of paragraphs 1 through 9, The above filler metal (430) is, An electronic device (101) joined to the first metal part (410) and the second metal part (420) through brazing diffusion bonding.

11. In the housing (401) of an electronic device, A first metal part (410) forming at least a part of the exterior of the electronic device; A second metal part (420) disposed on the inner side of the first metal part (410) and having a material different from the material of the first metal part (410); and A filler metal (430) disposed between the first metal part (410) and the second metal part (420) and coupled to the first metal part (410) and the second metal part (420); and A housing (401) comprising a plurality of dendrites (433) that are at least partially diffused into the second metal portion (420) from the filler metal (430).

12. In Paragraph 11, The above plurality of dendrites (433) have an elongated branch shape, The above filler metal (430) and the above second metal part (420) are a housing (401) joined by the above plurality of dendrites (433).

13. In Article 11 or Article 12, The length of the plurality of dendrites (433) is in the range of 1 µm to 20 µm (micrometer) for the housing (401).

14. In any one of paragraphs 11 through 13, The above housing (401) is, It further includes a cover portion (440) that covers the filler metal (430) so that the filler metal (430) is not exposed, and includes a non-metallic material. The above cover portion (440) is a housing (401) comprising a first cover portion (441) covering one end of the filler metal (430) and a second cover portion (442) covering the other end of the filler metal (430).

15. A method for manufacturing a housing (401) of an electronic device, A process (P11) for preparing a first metal part (410) and a second metal part (420) having a different material from the first metal part (410); A process (P13) for aligning the first metal part (410) and the second metal part (420); and A manufacturing method comprising a process (P15) of brazing joining by injecting molten filler metal (430) between the first metal part (410) and the second metal part (420).

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