Heating member and camera module comprising same

Abstract

A heating member is disclosed. A heating member according to an embodiment of the present invention may comprise: a first substrate; a second substrate facing the first substrate; and a heating layer disposed between the first substrate and the second substrate, wherein the heating layer includes: a heating element composition including a polymer containing a thermosetting resin, conductive particles having conductivity within the polymer, and an additive; and an electrode in contact with the heating element composition, wherein the volume percentage of the conductive particles in the heating element composition is higher than the volume percentage of the polymer.

Description

Heating element and camera module including the same

[0001] The present invention relates to a heating element and a camera module including the same.

[0002] Recently, ultra-small camera modules are being developed and are widely used in small electronic products such as smartphones, laptops, and game consoles.

[0003] With the popularization of automobiles, micro cameras are widely used not only in small electronic devices but also in vehicles. For example, they are equipped with dashcam cameras for vehicle protection or objective data regarding traffic accidents, rear-view cameras that allow the driver to monitor blind spots behind the vehicle via a screen to ensure safety when reversing, and surrounding detection cameras that monitor the vehicle's vicinity.

[0004] The camera includes a lens, a lens barrel that houses the lens, an image sensor that converts the image of a subject gathered by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing forming the exterior of the camera is constructed with a structure that is completely sealed to prevent internal components from being contaminated by foreign substances containing moisture.

[0005] In the case of camera modules, since they are placed on the exterior of the vehicle and are heavily affected by the outside air, frost, condensation, and ice frequently occur on the lenses during the winter. When frost, condensation, and ice occur on the lenses, there is a problem in that the performance of the camera module is significantly degraded.

[0006] The problem that the present invention aims to solve is to provide a heating element that has high repeatability and does not exhibit the POST NTC phenomenon, in which resistance decreases with increasing temperature.

[0007] In addition, the invention provides a camera module that can quickly remove frost or ice formed on the lens surface through a heating function and improve heat generation efficiency.

[0008] In addition, it is to provide a camera module that can concentrate heat onto the lens by preventing heat loss to the outside.

[0009] A heating element according to one embodiment of the present invention for achieving the objective comprises: a first substrate; a second substrate facing the first substrate; and a heating layer disposed between the first substrate and the second substrate, wherein the heating layer comprises a heating element composition comprising a polymer including a thermosetting resin, conductive particles having conductivity within the polymer, and an additive, and an electrode in contact with the heating element composition, and wherein the volume percentage of the conductive particles in the heating element composition may be higher than the volume percentage of the polymer.

[0010] In addition, the composition may have 39 to 46 Vol% of the polymer, 49 to 51 Vol% of the conductive particles, and 5 to 10 Vol% of the additive relative to 100 Vol% of the heating element composition.

[0011] In addition, the thermosetting resin may include a polymer resin having a glass transition temperature of 100 to 110 degrees.

[0012] In addition, the thermosetting resin may be a material in which the coefficient of thermal expansion in the glass state is at least three times higher than the coefficient of thermal expansion in the solid state.

[0013] In addition, the polymer resin may include one or more of glycidyl-ether epoxy and non-glycidyl cyclo-aliphatic epoxy.

[0014] In addition, the glycidyl-based ether epoxy may include one or more of DGEBA (Bisphenol A glycidyl ether) epoxy and novolac glycidyl ether.

[0015] In addition, the conductive particles may include one or more of carbon black and graphite.

[0016] A camera module according to another embodiment of the present invention comprises: a first body; a lens module disposed within the first body and including a barrel and a lens disposed within the barrel; a substrate module disposed within the first segment; and a heating member having one end connected to the surface of the lens and the other end connected to the substrate module to provide heat to the lens, wherein the heating member comprises a first substrate, a second substrate facing the first substrate, and a heating layer disposed between the first substrate and the second substrate, wherein the heating layer comprises a heating element composition comprising a polymer including a thermosetting resin, conductive particles having conductivity within the polymer, and an additive, and an electrode in contact with the heating element composition, wherein the volume percentage of the conductive particles in the heating element composition may be higher than the volume percentage of the polymer.

[0017] In addition, the composition may have 39 to 46 Vol% of the polymer, 49 to 51 Vol% of the conductive particles, and 5 to 10 Vol% of the additive relative to 100 Vol% of the heating element composition.

[0018] In addition, the thermosetting resin may include a polymer resin having a glass transition temperature of 100 to 110 degrees.

[0019] In addition, the thermosetting resin may be a material in which the coefficient of thermal expansion in the glass state is at least three times higher than the coefficient of thermal expansion in the solid state.

[0020] The heating element according to the present embodiment utilizes a polymer composed solely of thermosetting resin, thereby having high repeatability and the effect of reducing the Post-NTC phenomenon, in which resistance decreases when a specific temperature is exceeded, due to increased fluidity.

[0021] In particular, considering that the fluidity of conductive particles may be reduced when heating due to the exclusion of thermoplastic resins generally used in polymers and the use of only thermosetting resins, the fluidity of conductive particles can be ensured by configuring the heating element composition such that the volume percentage of conductive particles is higher than the volume percentage of the polymer, thereby providing a heating element using a thermosetting resin as a polymer that enables normal heating performance.

[0022] In addition, to solve the problem where PTC characteristics do not appear when using a thermosetting resin for the polymer in the heating element composition, the volume percentage of conductive particles is limited to 49 to 51 Vol% relative to 100 Vol% of the heating element composition. This ensures an increase in resistance at a set temperature, which is a key characteristic of the PTC element, thereby providing a heating element with a high PTC ratio. If the volume percentage of conductive particles deviates from the proposed range, the PTC ratio decreases rapidly, causing the heating element to lose its function. By appropriately adjusting this ratio, it is possible to ultimately provide a heating element with a high PTC ratio without using a thermoplastic resin for the polymer.

[0023] In addition, the heating element according to the present embodiment has the effect of increasing the maximum PTC heating temperature to a high temperature of 120 to 140 degrees by using a thermoplastic resin with a melting point of 130 degrees or higher as a polymer.

[0024] In particular, since the point where the PTC ratio increases dramatically is a high temperature of 120 to 140 degrees, not only is the heating performance at high temperatures excellent, but when the resistance increases rapidly beyond a certain high temperature, the PTC effect is exhibited excellently.

[0025] In addition, when the crystallinity of the heating element composition is 5% or higher, not only is the increase in the PTC ratio at high temperatures of 120 degrees or higher high, but the Post NTC phenomenon, in which resistance decreases with increasing temperature, occurs at high temperatures of 150 degrees or higher, so there is no problem with the decrease in resistance and the PTC effect is excellently exhibited at 120 to 140 degrees.

[0026] FIG. 1 is a perspective view of a vehicle according to an embodiment of the present invention.

[0027] FIG. 2 is a cross-sectional view of a camera module according to an embodiment of the present invention.

[0028] FIG. 3 is a plan view illustrating one region of a heating element according to an embodiment of the present invention.

[0029] FIG. 4 is a drawing showing A-A' of FIG. 3.

[0030] FIG. 5 is an enlarged view of A in FIG. 2.

[0031] FIG. 6 is a graph showing the polymer glass transition temperature of a heating element according to an embodiment of the present invention.

[0032] FIGS. 7 and 8 are graphs showing the characteristics of the polymer of the heating element at the glass transition temperature according to an embodiment of the present invention.

[0033] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0034] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0035] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0036] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0037] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0038] In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0039] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0040] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0041] As used below, 'optical axis direction' is defined as the optical axis direction of the lens. Meanwhile, 'optical axis direction' may correspond to 'vertical direction', 'z-axis direction', etc.

[0042] The present invention will be described in more detail below with reference to the attached drawings.

[0043] FIG. 1 is a perspective view of a vehicle according to an embodiment of the present invention.

[0044] Referring to FIG. 1, a vehicle (1) according to an embodiment of the present invention may include a body (2), a door (3), a glass (4), a headlamp (5), a taillamp (6), and a camera module (10).

[0045] The body (2) may be an exterior member of the vehicle (1). The body (2) may have various forms, such as a frame type or a monocoque type. One or more doors (3) may be attached to the side of the body (2). In addition, glass (4) may be attached to the front and rear (where the pillar is formed) of the upper part of the body (2) and to the doors (3). A headlamp (5) may be mounted on the front of the lower part of the body (2). A taillamp (6) may be mounted on the rear of the lower part of the body (2).

[0046] A camera module (10) may be installed on the side of the body (2) or on the front of one or more doors (3). The camera module (10) may be installed in front of the glass (4) attached to the door (3). That is, in the vehicle (1) of the present embodiment, the side mirror may be replaced with the camera module (10).

[0047] The camera module (10) can capture images of both rear sides of the vehicle. Images captured by the camera module (10) can be electrically connected to a display unit (not shown) through an electronic control unit (ECU), etc. Therefore, images captured by the camera module (10) can be controlled by the electronic control unit (ECU) and played back on the display unit.

[0048] An interior space for a driver may be formed inside the body (2). A display unit may be installed inside the body (2). The display unit may output an image captured by the camera module (10). The display unit may be installed on a dashboard (not shown) inside the body (2).

[0049] The installation form of the camera module (10) in the vehicle (1) described above is exemplary, and the camera module (10) can be used in one or more of the front camera, side camera, rear camera and black box of the vehicle (1).

[0050] Hereinafter, a camera module according to the present embodiment will be described with reference to the drawings.

[0051] FIG. 2 is a cross-sectional view of a camera module according to an embodiment of the present invention, FIG. 3 is a plan view showing one region of a heating element according to an embodiment of the present invention, FIG. 4 is a drawing showing A-A' of FIG. 3, and FIG. 5 is an enlarged drawing of A of FIG. 3.

[0052] Referring to FIGS. 2 to 5, a camera module (10) according to an embodiment of the present invention may include a first body (100), a second body (200), a lens module (300), a lens holder (400), a substrate module (500), and a heating element (700).

[0053] The first body (100) can form the outer shape of the camera module (10). The first body (100) can be defined as any one of a front body, an upper housing, or a first housing. A space can be formed inside the first body (100) to accommodate a lens module (300), a lens holder (400), and a substrate module (500).

[0054] The first body (100) may include a body portion (110) and a protrusion (120). The body portion (110) and the protrusion (120) may be formed integrally.

[0055] The body portion (110) may be formed of a metal material. The body portion (110) may be placed on the second body (200). The body portion (110) may be joined to the second body (200). The lower end of the body portion (110) may be fixed on the second body (200). The body portion (110) may be joined to the second body (200) by welding. Alternatively, the body portion (110) may be joined to the second body (200) by adhesive or fusion.

[0056] The body portion (110) may be formed in a rectangular shape with an open bottom. At this time, the corners of the body portion (110) may be formed rounded. The body portion (110) may include a top plate (112) and a first side plate (114) extending downward from the edge of the top plate (112). The top plate (112) may be formed in a rectangular shape. The top plate (112) may extend outward from the lower outer surface of the protrusion (120). The first side plate (114) may extend downward from the outer edge of the top plate (112). The first side plate (114) may be provided in multiple numbers. The first side plate (114) may include four side plates. The first side plate (114) may be formed in the shape of a rectangular plate. For example, the first side plate (114) may include a first-1 side plate and a first-2 side plate, a first-3 side plate positioned opposite the first-1 side plate, and a first-4 side plate positioned opposite the first-2 side plate. The first side plate (114) may include first-1 to first-4 corners positioned between the first-1 to first-4 side plates, respectively. Each of the first-1 to first-4 corners may have a rounded shape in at least a portion.

[0057] A space portion separated from other areas may be formed on the inner side of the body portion (110). The space portion has an open bottom and its upper portion may be covered through the protrusion portion (120) and the lower surface of the lens module (300).

[0058] The first body (100) may include a protrusion (120). The protrusion (120) may be formed of a metal material. The protrusion (120) may have a circular cross-sectional shape. The protrusion (120) may be placed on the body part (110). The protrusion (120) may extend upward from the upper surface of the body part (110). The protrusion (120) may be formed integrally with the body part (110). As a variation, the protrusion (120) may be coupled to the body part (110). In this case, the protrusion (120) may be fixed to the body part (110) by an adhesive. The protrusion (120) may accommodate a lens module (300) inside. A space for coupling the lens module (300) may be formed in the center of the protrusion (120). A lens module (300) can be placed in the space within the protrusion (120).

[0059] The camera module (10) may include a second body (200). The second body (200) may be defined as a rear body, a lower housing, a second housing, or a rear cover. The second body (200) may be formed in a rectangular shape with an open top. The second body (200) may be formed of a metal material. The second body (200) may be placed below the first body (100). The second body (200) may be combined with the first body (100). The second body (200) may form an internal space through combination with the first body (100). The second body (200) may include a space portion with an open top surface.

[0060] The second body (200) may include a bottom plate (220). The bottom plate (220) may face the top plate (114) of the first body (100) in the optical axis direction. The bottom plate (220) may be spaced apart from the top plate (114) of the first body (110) in the optical axis direction. The bottom plate (220) may be parallel to the top plate (114) of the first body (100). The bottom plate (220) may be formed in a square shape. At this time, the corners of the bottom plate (220) may include a round shape in at least a part.

[0061] The second body (200) may include a second side plate (210). The second side plate (210) may extend from the bottom plate (220). The second side plate (210) may extend upward from the outer edge of the bottom plate (220). A shield member (not shown) may be disposed on the second side plate (210). The shield member may be in surface contact with the inner surface of the second side plate (210). The top of the second side plate (210) may be joined to the first body (100). The inner surface of the second side plate (210) may be arranged to wrap around the outer surface of the first side plate (114). The inner surface of the second side plate (210) and the outer surface of the first side plate (114) may be joined to each other by at least one of welding, adhesive, or fusion.

[0062] The second body (200) may include a connector outlet (290). The connector outlet (290) may have a shape that protrudes downward from the lower surface of the bottom plate (220). A connector (490), which will be described later, may be disposed inside the connector outlet (290). The connector outlet (290) may be formed of a metal material. The connector outlet (290) may have a hollow pipe shape inside.

[0063] The camera module (10) may include a lens module (300). The lens module (300) may be coupled to the first body (100). The lens module (300) may be coupled to a hole in the protrusion (120). The lens module (300) may be positioned such that at least a portion is placed inside the protrusion (120), and the remaining portion protrudes upward from the first body (100).

[0064] The lens module (300) may include a barrel (310) and one or more lenses (330) accommodated within the barrel (310). The lenses (330) may be positioned facing the image sensor in the optical axis direction within the substrate module (500) to be described later. The lenses (330) may be aligned with the image sensor in the optical axis. The lenses (330) may be provided in multiple numbers and arranged spaced apart from each other along the optical axis direction within the barrel (310). The lenses (330) may include an outermost lens and a rear lens positioned behind the outermost lens. Although FIG. 1 illustrates the rear lens as a single lens, this is not limited thereto, and the rear lenses may also be provided in multiple numbers and arranged along the optical axis direction within the barrel (310). At least a portion of the outermost lens may protrude upward from the camera module (10).

[0065] The barrel (310) may include a space on the inside with upper and lower openings. A lens (330) may be placed in the space of the barrel (310). The barrel (310) may have a circular cross-sectional shape. The barrel (310) may be made of metal.

[0066] The barrel (310) may include a first body (312) and a second body (316). The first body (312) and the second body (316) may be formed as a single body. The outer surface of the first body (312) and the outer surface of the second body (316) may form a plane in the direction of the optical axis. The second body (316) may have a shape in which a portion of the upper surface of the first body (312) protrudes upward. As shown in FIG. 5, with respect to the direction perpendicular to the direction of the optical axis, the thickness (t7+t8+t9) of the first body (312) may be greater than the thickness (t6) of the second body (316). Accordingly, the cross-sectional area of ​​the placement area of ​​the lens (330) formed within the first body (316) may be larger than the cross-sectional area of ​​the placement area of ​​the lens (330) formed within the second body (316). A rear lens may be placed in the space within the first body (316), and an outermost lens may be placed in the space within the second body (316). The rear lens may be placed in the space within the second body (316) with at least a portion protruding upward.

[0067] As shown in FIGS. 1 and 5, a through hole may be formed in the second body (316) so as to penetrate from the inner surface to the outer surface of the second body (316) with respect to a direction perpendicular to the optical axis, through which the connecting part (730) of the heating member (700) described later passes.

[0068] The lens module (300) may include a retainer (380). The retainer (380) may be attached to the outer surface of the barrel (310). The retainer (380) may be screw-coupled to the barrel (310). Alternatively, the retainer (380) and the barrel (310) may be coupled to each other via epoxy. The retainer (380) may be attached to the top of the barrel (310). At least a portion of the retainer (380) may be positioned within the first body (100). The incident surface of the outermost lens of the lens (330) may protrude upward above the upper surface of the retainer (380).

[0069] The combined structure of the barrel (310) and the retainer (380) described above is exemplary, and the camera module (10) can be implemented as an integrated structure in which the barrel (310) and the retainer (380) are one body.

[0070] The retainer (380) may have a ring-shaped cross-section. The retainer (380) may be positioned so that at least a portion covers the edge of the outermost lens. The retainer (380) may be positioned to wrap around the edge of the outermost lens. The retainer (380) may be positioned to cover the edge of the outermost lens incident surface. The retainer (380) may be in contact with a portion of the incident surface of the outermost lens.

[0071] The retainer (380) may include a first region (382) in which the lower surface supports the incident surface of the outermost lens, and a second region (384) extending downward from the edge of the first region (382). The second region (384) may be positioned between the barrel (310) and the first body (100). The first region (382) and the second region (384) may be positioned perpendicular to each other.

[0072] The camera module (10) may include a lens holder (400). The lens holder (400) may be positioned between the first body (100) and the barrel (310). The lens holder (400) may be positioned to surround the outer surface of the barrel (310). The lens holder (400) may be formed in a cylindrical shape having a hollow that penetrates from the upper surface to the lower surface. Screw threads or screw grooves may be formed on the inner surface of the lens holder (400). Screw grooves or screw threads may be formed on the outer surface of the barrel (310) facing the inner surface of the lens holder (400). The barrel (310) may be screw-coupled within the lens holder (400).

[0073] A substrate coupling portion may be formed on the lower surface of the lens holder (400) to which the first substrate (510) of the substrate module (500) to be described later is coupled. The substrate coupling portion may have a groove shape that is concave upward from other regions.

[0074] The lens holder (400) may be omitted. In this case, the substrate module (500) may be coupled to the space within the first body (100).

[0075] The camera module (10) may include a substrate module (500). The substrate module (500) may be placed in a space within the camera module (10). The substrate module (500) may be placed between the first body (100) and the second body (200).

[0076] The substrate module (500) may include a first substrate (510), a second substrate (520), and a connecting substrate (not shown).

[0077] The first substrate (510) may be a printed circuit board (PCB). An image sensor may be placed on the upper surface of the first substrate (510). The image sensor may be placed on the first substrate (510) and positioned to face the lens (330) within the lens module (300) in the direction of the optical axis. The first substrate (510) may be placed within the substrate coupling portion of the lens holder (400).

[0078] The second substrate (520) may be a printed circuit board (PCB). The second substrate (520) may be spaced apart from the first substrate (510) in the direction of the optical axis. The second substrate (520) may be placed below the first substrate (510). A connector (not shown) may be attached to the lower surface of the second substrate (520). The upper end of the connector may be soldered to the lower surface of the second substrate (520).

[0079] A terminal (525) may be disposed on the lower surface of the second substrate (520). The terminal (525) may be electrically and physically connected to the lower surface of the heating element (700) to be described later.

[0080] The second substrate (520) can be electrically connected to the first substrate (510). The second substrate (520) and the first substrate (510) can be electrically connected through a connecting substrate. The connecting substrate may be a flexible printed circuit board (FPCB). The upper and lower ends of the connecting substrate are respectively connected to the first substrate (510) and the second substrate (520), thereby electrically connecting the first substrate (510) and the second substrate (520).

[0081] The substrate module (500) may further include a shield can (not shown) disposed between the first substrate (510) and the second substrate (520). Through the shield can, the first substrate (510) and the second substrate (520) may be separated in the optical axis direction.

[0082]

[0083] Hereinafter, the heat generation structure of the lens according to an embodiment of the present invention will be described.

[0084] The camera module (10) may include a heating element (700). The heating element (700) may provide heat to the surface of the lens (330). The heating element (700) may provide heat to the surface of the outermost lens among the plurality of lenses (330). Accordingly, frost formed on the surface of the lens (330) may be removed.

[0085] The heating element (700) may be a PTC heater (positive temperature coefficient heater). One end of the heating element (700) may be connected to the surface of the lens (330), and the other end may be connected to the substrate module (500).

[0086] In detail, the outermost lens (330) disposed on the barrel (310) may include an incident surface (331) into which light is incident, an exit surface (333) opposite to the incident surface (331) into which the incident light is emitted toward an image sensor, and a connecting surface (335) connecting the incident surface (331) and the exit surface (333). The connecting surface (335) may form the lower surface of the lens (330). The connecting surface (335) may form the side surface of the lens (330). One end of the heating element (700) may be coupled to the connecting surface (335).

[0087] The connecting surface (335) may include a plurality of surfaces arranged at a mutual step difference in the direction of the optical axis. The plurality of surfaces may include a first surface and a second surface arranged on the inner side of the first surface. The plurality of surfaces may include a first side connecting the first surface and the second surface. The plurality of surfaces may include a second side arranged on the outer side of the first surface. The first surface may be arranged above the second surface. One end of the heating element (700) may be connected to the first surface. One end of the heating element (700) may be connected to the second side.

[0088] The heating element (700) may be in the shape of a film. The heating element (700) may be a substrate on which a circuit pattern is formed. The heating element (700) may be a flexible printed circuit board (FPCB).

[0089] The heating element (700) may include an upper portion (710), a lower portion (720), and a connecting portion (730). The upper portion (710) is positioned at the top of the heating element (700) and may be coupled to the surface of the lens (330). As shown in FIG. 3, the upper portion (710) has a ring-shaped cross-section and may be coupled to the connecting surface (335). The upper portion (710) may generate heat by providing power. The upper portion (710) may have a circular shape corresponding to the shape of the lens (330) or the barrel (310).

[0090] The lower portion (720) is positioned at the bottom of the heating element (700) and can be coupled with the substrate module (500). The lower portion (720) can be coupled to the lower surface of the second substrate (520) of the substrate module (500). The lower portion (720) can be coupled to a terminal (525) positioned on the lower surface of the second substrate (520). Accordingly, power can be supplied from the substrate module (500) to the heating element (700), or a driving signal can be transmitted and received.

[0091] The connecting portion (730) can connect the upper portion (710) and the lower portion (720). The connecting portion (730) may include a region that is bent at least once. At least a portion of the connecting portion (730) may be positioned between the outer surface of the barrel (310) and the inner surface of the first body (100). A hole (not shown) may be formed in the barrel (310) to allow the connecting portion (730) to pass through.

[0092] As illustrated in FIG. 3, the width (W3-2) of the electrode of the connection portion (730) may be larger than the width (W3-1) of the electrode of the upper portion (710). Accordingly, the loss of power provided from the substrate module (500) can be minimized.

[0093] The upper portion (710) may include a plurality of electrodes spaced apart in the radial direction. Likewise, the connecting portion (730) may include a plurality of electrodes each connected to a plurality of electrodes. The spacing (W2-1) between the plurality of electrodes in the upper portion (710) may be larger than the spacing (W2-2) between the plurality of electrodes in the connecting portion (730). Accordingly, power loss can be minimized in the connecting portion (730) by using relatively wide electrodes, and the thermal efficiency of the heating area can be improved in the upper portion (710) by maximizing the spacing (W2-1) between the plurality of electrodes.

[0094] Between the connecting part (730) and the upper part (710), there may be a region where the width of the electrode decreases. Since a crack may occur due to a rapid change in current amount when the width of the electrode (W3-2) in the connecting part (730) decreases rapidly to the width of the electrode (W3-1) in the upper part (710), in this embodiment, as shown in FIG. 3, a region where the width between the connecting part (730) and the upper part (710) gradually decreases can be formed to prevent cracking.

[0095] As illustrated in FIG. 3, the upper portion (710) is connected to the connecting portion (730), and the other end of the upper portion (710) can be spaced apart from the connecting portion (730) by a first separation distance (d1). Accordingly, assembly reliability can be ensured when attaching the heating element (700) to the lens (330). The other end of the upper portion (710) and the end of the electrode inside the upper portion (710) can be spaced apart by a second separation distance (d2). Accordingly, the electrode inside the upper portion (710) can be prevented from being exposed to the outside, thereby improving the heat transfer reliability of the heating element (700).

[0096] Here, to ensure assembly reliability, the first separation distance (d1) may be smaller than the second separation distance (d2). Additionally, the radial width (W1) between the electrode positioned radially outward among the plurality of electrodes within the upper part (710) and the outer surface of the upper part (710) may be smaller than the second separation distance (d2). Additionally, the radial spacing (W2-1) between the plurality of electrodes within the upper part (710) may be larger than the first separation distance (d1). As illustrated in FIG. 4, the heating element (700) may include a first substrate (712), a second substrate (714), a heating layer (716), and an adhesive layer (719).

[0097] The first substrate (712) and the second substrate (714) are each formed in the shape of a film and can form a space between them in which a heating layer (716) is formed. The first substrate (712) can be positioned relatively closer to the surface of the lens (330) than the second substrate (714). Accordingly, the first substrate (712) can be defined as the upper substrate and the second substrate (714) can be defined as the lower substrate.

[0098] The first substrate (712) and the second substrate (714) may have different materials. For example, the material of the first substrate (712) may be polyimide. The material of the second substrate (714) may be PET.

[0099] Based on the optical axis direction, the thickness (t2) of the first substrate (712) may be smaller than the thickness (t1) of the second substrate (714). For example, the thickness (t2) of the first substrate (712) may be less than 1 / 4 of the thickness (t1) of the second substrate (714). The thickness (t1) of the first substrate (712) may be 20 µm to 30 µm. The thickness (t2) of the second substrate (714) may be 80 µm to 120 µm. According to the above structure, the thickness of the first substrate (712), which is positioned relatively close to the surface of the lens (330), is formed thinly so that heat generated from the heat-generating layer (716) can be efficiently transferred to the surface of the lens (330). In addition, heat loss through the second substrate (714) can be prevented.

[0100] The thermal conductivity of the first substrate (712) may be greater than the thermal conductivity of the second substrate (714). Accordingly, heat can be concentrated to the lens (330) through the first substrate (712).

[0101] A heating layer (716) may be disposed between a first substrate (712) and a second substrate (714). The heating layer (716) may include a heating element composition and an electrode (718). The heating element composition may include a polymer and a conductive particle (717). Here, the heating element composition may be defined as a heating element paste, a liquid heating element, or a heating element ink.

[0102] The electrode (718) may be positioned to contact the heating element composition (717). Specifically, the electrode (718) may be positioned to contact the conductive particles (717) of the heating element composition. The electrode (718) may include a plurality of electrodes with different polarities. The heating layer (716) may generate heat due to a change in the resistance of the conductive particles (717) caused by power supply from the substrate module (500). One side of the first substrate (712) may be in direct contact with the plurality of electrodes (718).

[0103] As shown in FIG. 4, the radial distance (W1) between any one of the plurality of electrodes (718) and the inner or outer surface of the heating layer (716) may be smaller than the distance (W2) between the plurality of electrodes (718). Accordingly, heat transfer can be more easily achieved in the direction of the lens (330) than in the side of the heating member (700).

[0104] Additionally, the thickness (t5) of the electrode (718) in the optical axis direction may be larger than the diameter of the conductive particle (717). Accordingly, heat transfer to the region between the multiple electrodes (718) can be made more easily.

[0105] The thickness (t3) of the heating layer (716) may be greater than the thickness (t2) of the first substrate (712) and less than or equal to the thickness (t1) of the second substrate (714).

[0106] The adhesive layer (719) may be disposed on the first substrate (712). The adhesive layer (719) may be formed on the other surface opposite to the one surface of the first substrate (712) that is in contact with the electrode (718). An adhesive may be disposed on the surface of the adhesive layer (719). The heating element (700) and the lens (330) may be combined through the adhesive layer (719). The thickness (t4) of the adhesive layer (719) may be thicker than the thickness (t2) of the first substrate (712). The thickness (t4) of the adhesive layer (719) may be thinner than the thickness (t1) of the second substrate (714). The thickness of the adhesive layer (719) may be 40 µm to 60 µm. The material of the adhesive layer (719) may be an alumina or a carbon-based material that is not electrically conductive.

[0107] The thermal conductivity of the adhesive layer (719) may be greater than the thermal conductivity of the second substrate (714). The thermal conductivity of the adhesive layer (719) may be greater than the thermal conductivity of the first substrate (712). Accordingly, heat can be concentrated to the lens (330) through the adhesive layer (719).

[0108] Meanwhile, a release film (not shown) may be placed on the adhesive layer (719), and the strength of the heating element (700) may be reinforced through the release film.

[0109] According to the above structure, in accordance with the thermal resistance formula in which thermal resistance is inversely proportional to the length of the heat transfer path, the heating element (700) according to the present embodiment has the advantage of being able to easily transfer heat toward the lens (330) by adjusting the thickness of the first substrate (712) and the second substrate (714), and also prevent heat loss to other areas, thereby improving the heating efficiency of the lens (330).

[0110] Hereinafter, the heating element composition among the components of the heating layer (716) of the camera module (10) according to an embodiment of the present invention will be described. FIG. 6 is a graph showing the polymer glass transition temperature of a heating element according to an embodiment of the present invention, and FIGS. 7 and 8 are graphs showing the characteristics of the polymer at the glass transition temperature of a heating element according to an embodiment of the present invention.

[0111] The heating element composition may include a polymer and conductive particles (717). Additionally, the heating element composition may further include additives as needed. The heating element composition may include a polymer, conductive particles (717), and additives. Based on the heating element composition, the volume percentage of the polymer may have a lower value than the volume percentage of the conductive particles (717). For example, based on 100 vol% of the heating element composition, the composition may have 39 to 46 vol% of the polymer, 49 to 51 vol% of the conductive particles, and 5 to 10% of the additives.

[0112] The polymer is a means that can serve as a binder to control the flow of the conductive particles (717) in a space where the conductive particles (717) can flow. The polymer may have a lower volume percentage than the conductive particles (717) in the heating element composition. For example, the polymer may have a composition of 39 to 46 vol% relative to 100 vol% of the heating element composition. Since the flow of the conductive particles (717) is controlled by the polymer, a change in resistance occurs, which has the effect of preventing damage to the electronic circuit when a specific temperature is exceeded or an overcurrent flows. The polymer may be defined as a polymer matrix.

[0113] The polymer may consist only of a thermosetting resin. In general, polymers are composed of thermoplastic resins, whereas embodiments of the present invention may consist of a thermosetting resin. In this case, the polymer may have a shape that encloses the conductive particles (717).

[0114] Referring to FIGS. 6 to 8, a polymer resin having a glass transition temperature (Tg) of 90 degrees or more and less than 120 degrees may be used as the thermosetting resin. When analyzing the differential scanning calorimetry (DSC) characteristics at the glass transition temperature (Tg) of the thermosetting resin, it may exist in a glass state in the region where a phase change occurs, and as the volume expands in the glass state, the internal conductive particles (717) flow and generate heat through resistance. When the glass transition temperature (Tg) is less than 90 degrees, there is a problem that high-temperature heat generation is impossible because the temperature at which the PTC effect occurs is lowered, and when it is 120 degrees or more, there is a problem that the PTC characteristic does not appear because the resistance does not increase above the set temperature depending on the composition ratio of the conductive particles (717).

[0115] For thermosetting resins, a material can be used in which the coefficient of thermal expansion (CTE) in the glass state increases rapidly compared to the solid state. Accordingly, the degree of volume expansion (a2) in the glass state can be dramatically higher than the degree of volume expansion (a1) in the solid state. For example, a material can be used in which the coefficient of thermal expansion of the thermosetting resin is at least three times greater in the glass state than in the solid state based on the glass transition temperature.

[0116] Thermosetting resins may include epoxy. In this case, the epoxy has a glass transition temperature between 90 and 120 degrees, and based on the glass transition temperature, the coefficient of thermal expansion in the glass state may be more than three times greater than in the solid state.

[0117] Among glycidyl-ether epoxy, one or more of DGEBA (Bisphenol A glycidyl ether) epoxy and Novolac glycidyl ether may be used, and among non-glycidyl epoxy, cyclo-aliphatic epoxy may be used.

[0118] Conductive particles (717) may be mixed and placed in the polymer of the heating element composition. The conductive particles (717) may flow by providing power through the electrode (718), and thus heat may be generated as a change in resistance occurs. The conductive particles (717) are particles capable of transmitting electricity and may include metal particles, carbon-based particles, and composite metal oxide particles. The metal particles may include one or more metals among Au, Cu, and Ni, but are not limited thereto as long as they are conductive metals. The carbon-based particles may include one or more of carbon black and graphite, but are not limited thereto as long as they are coated on the outside with a carbon-containing and conductive material. The composite metal oxide particles are manufactured by complexly mixing metal oxides, and can be used without limitation as long as they are conductive materials.

[0119] The conductive particles (717) may be composed of 49 to 51 vol% relative to 100 vol% of the heating element composition. When the polymer consists only of a thermosetting resin, the conductive particles (717) in the heating element composition may have a higher volume percentage (Vol%) than the polymer. When the thermosetting resin is in a glassy state, the volume expansion at a specific temperature is smaller compared to the thermoplastic resin, so there is a characteristic that the conductive particles (717) are arranged at a high density even if their fluidity is low. In this case, resistance may increase due to collisions between the conductive particles (717) during the flow process of the conductive particles (717) at the set temperature, so the Post-NTC phenomenon, in which resistance decreases even when the temperature rises, is prevented. Furthermore, since the thermosetting resin maintains a glassy state at the glass transition temperature, the repeated phenomena of crystal structure collapse and recrystallization do not occur, resulting in high repeatability.

[0120] The heating element composition may have a film shape. Specifically, the heating element composition may have a film shape cured into a paste form. A method for manufacturing the heating element composition is described.

[0121] Additives are used to maintain the properties of the heating element composition and may include one or more of the following: a dispersant for uniform dispersion of the conductive particles (717), a thixotropic agent for controlling the viscosity of the polymer and the conductive particles (717) and improving dispersibility, a leveling agent for flattening the surface of the heating element composition and forming a uniform thickness, a crosslinking agent for increasing the crosslinkability of the polymer, a plasticizer for increasing the flexibility of the polymer and improving processability, and a characterizing additive for increasing heat resistance, chemical resistance, and conductivity. However, additives may be omitted as necessary.

[0122] The following describes a method for manufacturing a heating element composition. To manufacture the heating element composition, a polymer thermosetting resin and conductive particles are mixed and stirred. In this case, a melt mixing method, in which the thermosetting resin is melted and mixed with conductive particles and stirred, or a solution mixing method, in which the thermosetting resin is dissolved in a solvent and then mixed with conductive particles, may be used. The stirring method may be physical or chemical and is not limited to a specific method. Subsequently, additives may be added as needed. Afterward, the heating element composition can be manufactured by utilizing a three-roll mill process to homogenize the internal composition through mixing, grinding, and dispersion, and then forming it into a paste in the form of a film.

[0123] The following describes the measurement experiment and results regarding the Positive Temperature Coefficient Ratio (PTC) of a heating element composition according to an embodiment of the present invention. The PTC ratio is a ratio calculated by using the resistance value at a set temperature as the numerator and the resistance value at room temperature as the denominator; it is a measure indicating how efficiently the resistance changes at the set temperature. A higher PTC ratio indicates that the heating element composition is a material with more sensitive and faster responsiveness, as it prevents heat generation by increasing resistance as the temperature rises. Consequently, it can be determined that the material possesses higher temperature control and stability.

[0124] The PTC ratio measurement experiment was conducted based on an example and two comparative examples of the heating element composition. The polymer of the heating element composition was epoxy, and the conductive particles (717) were carbon black. Based on 100 vol% of the heating element composition, 10 vol% of the additive was used, and the PTC ratio was measured by adjusting only the volume percentage of carbon black. In the case of the example, the volume percentage of carbon black was adjusted to 50 vol%; in the case of Comparative Example 1, the volume percentage of carbon black was adjusted to 48 vol%; and in the case of Comparative Example 2, the volume percentage of carbon black was adjusted to 52 vol% to measure the PTC ratio. In addition, for the PTC ratio, the resistance value was measured by setting the temperature of the numerator to 140 degrees, and the resistance value was measured based on the room temperature of the denominator at 25 degrees. The results of the PTC ratio calculation are shown in Table 1 below.

[0125] Carbon Black Vol%485052PTC Ratio 0.922.31.0

[0126] Looking at Table 1, in the case of Comparative Example 1, the PTC ratio was calculated to be 0.9, confirming that the resistance value at 140 degrees was lower than that at room temperature, and in the case of Comparative Example 2, the PTC ratio was calculated to be 1.0, so the resistance value at 140 degrees and the resistance value at room temperature were calculated to be the same. In contrast, in the case of the Example, the PTC ratio was calculated to be relatively high at 22.3. According to the table above, when the volume percentage of carbon black, which is the conductive particle (717), is 48% or 52%, there is a variation in the PTC ratio depending on the volume percentage at room temperature and high temperature. In particular, when the volume percentage of carbon black is 49 to 51 Vol%, preferably 50 Vol%, it can be confirmed that the PTC ratio shows a significantly high value. This is interpreted as being due to the fact that the flow control power of the conductive particle of the polymer differs extremely depending on the volume percentage of the conductive particle (717) because only the thermosetting resin (717) is used in the polymer. That is, when the volume percentage of the conductive particles (717) is greater than the volume percentage of the thermosetting resin which is a polymer, and the volume percentage range of the conductive particles (717) is 49 to 51 Vol%, the PTC ratio increases extremely, and the heating element composition may cause resistance above the set temperature to produce a PTC effect. Below, the heating element composition among the components of the heating layer (716) of the camera module (10) according to another embodiment of the present invention will be described. FIG. 9 is a graph showing the melting point of the polymer of the heating element according to an embodiment of the present invention, and FIG. 10 is a graph showing the PTC ratio by temperature of the heating element according to an embodiment of the present invention and a comparative example.

[0127] The heating element composition may include a polymer, conductive particles (717), a solvent, and an additive. Based on 100 wt% of the heating element composition, the composition may have 30 to 40 wt% of polymer, 5 to 10 wt% of conductive particles, 40 to 60 wt% of solvent, and 5 to 10 wt% of additive.

[0128] The heating element composition can be formed to have a crystallinity of 5% or more. In this case, since the ratio of the polymer, conductive particles (717), solvent, and additive is determined, the crystallinity of the thermoplastic resin of the polymer can be formed to have 45% or more. Depending on the crystallinity of the thermoplastic resin, the crystallinity value of the heating element composition can be formed to be 5% or more.

[0129] The polymer is a means capable of acting as a binder to control the flow of the conductive particles (717) in a space where the conductive particles (717) can flow. The polymer may have a composition of 30 to 40 wt% relative to 100 wt% of the heating element composition. Since the flow of the conductive particles (717) is controlled by the polymer, a change in resistance occurs, which has the effect of preventing damage to the electronic circuit when a specific temperature is exceeded or an overcurrent flows. The polymer may be defined as a polymer matrix.

[0130] The polymer may include a thermoplastic resin.

[0131] Thermoplastic resin is a resin capable of repeatedly softening and hardening by heat within a specific temperature range. Due to this characteristic, it has the property of increasing resistance by controlling the flow of conductive particles as it softens or hardens within the heating element composition, thereby enabling the temperature of the heating element to be controlled. As an example, the thermoplastic resin may include one or more of high-density polyethylene (HDPE), polyvinylidene fluoride (PVDF), and polypropylene (PP). In the case of high-density polyethylene, it may be a polyethylene resin having a density of 0.94 to 0.97 g / cm³.

[0132] Thermoplastic resins with a melting point of 130 degrees or higher may be used. If the melting point is less than 130 degrees, the PTC effect occurs at low temperatures below 100 degrees, which causes a problem in that the heat generation performance at high temperatures is not achieved.

[0133] A thermoplastic resin with a crystallinity of 45% or more may be used. To achieve a crystallinity of 45% or more, polyethylene may be melted at 200 to 230 degrees and then cooled to 100 to 120 degrees at a cooling rate of 1 to 5 degrees / min, followed by cooling for 40 to 230 minutes. Afterward, in the annealing step, the crystal structure may be stabilized by heat treatment at 80 to 100 degrees for 1 to 4 hours, and in the extrusion molding step, extrusion may be performed by maintaining conditions of 200 to 230 degrees at a pressure of 3000 to 5000 psi.

[0134] Conductive particles (717) may be mixed and placed in the polymer of the heating element composition. The conductive particles (717) may flow by providing power through the electrode (718), and thus heat may be generated as a change in resistance occurs. The conductive particles (717) are particles capable of transmitting electricity and may include metal particles, carbon-based particles, and composite metal oxide particles. The metal particles may include one or more metals among Au, Cu, and Ni, but are not limited thereto as long as they are conductive metals. The carbon-based particles may include one or more of carbon black and graphite, but are not limited thereto as long as they are coated on the outside with a carbon-containing and conductive material. The composite metal oxide particles are manufactured by complexly mixing metal oxides, and can be used without limitation as long as they are conductive materials.

[0135] To prevent electrical short circuits between electrodes through the conductive particles (717), the conductive particles (717) may be composed of 5 to 15 wt% relative to 100 wt% of the heating element composition.

[0136] The solvent is a means used to mix the polymer and the conductive particles (717). The solvent is not limited as long as the polymer resin can be dissolved, and as an example, methylpyrrolidone (NMP) solvent may be used. The solvent may have a composition of 40 to 60 wt% relative to 100 wt% of the heating element composition.

[0137] The additive is intended to maintain the characteristics of the heating element composition and may be one or more of the following: a dispersant for uniform dispersion of the conductive particles (717); a thixotropic agent for controlling the viscosity of the polymer and the conductive particles (717) and improving dispersibility; a leveling agent for flattening the surface of the heating element composition and forming a uniform thickness; a crosslinking agent for increasing the crosslinkability of the polymer; a plasticizer for increasing the flexibility of the polymer and improving processability; and a characterizing additive for increasing heat resistance, chemical resistance, and conductivity. The additive may have a composition of 5 to 10 wt% relative to 100 wt% of the heating element composition.

[0138] The heating element composition may have a film shape. Specifically, the heating element composition may have a film shape cured into a paste form. A method for manufacturing the heating element composition is described.

[0139] A method for manufacturing a heating element composition is described. To manufacture the heating element composition, a thermoplastic polymer resin is dissolved in a heating solvent at 120 to 150 degrees. Conductive particles are mixed and stirred in this state. In this case, a melt mixing method in which the thermoplastic resin is melted and the conductive particles are mixed and stirred, or a solution mixing method in which the thermoplastic resin is dissolved in a solvent and then the conductive particles are mixed, may be used. The stirring method may be physical or chemical and is not limited to a specific method. Afterwards, additives may be added as needed. Subsequently, the heating element composition can be manufactured by homogenizing the internal composition through mixing, grinding, and dispersion using a three-roll mill method, and then forming it into a paste in the form of a film.

[0140] The following describes the melting point of the heating element composition according to the degree of crystallization, the temperature at which the PTC effect occurs, and the measurement experiment and results of the PTC ratio (Positive Temperature Coefficient Ratio) according to the embodiment of the present invention. Here, the PTC temperature refers to the temperature at which the PTC effect, that is, the resistance, begins to increase rapidly. The PTC ratio is a ratio calculated by using the resistance value at the PTC temperature as the numerator and the resistance value at room temperature as the denominator, serving as a measure of how efficiently the resistance changes at the PTC temperature. A higher PTC ratio indicates that the heating element composition is a material with more sensitive and faster responsiveness, as it prevents heat generation by increasing resistance as the temperature rises; consequently, it can be judged to be a material with higher temperature control and stability.

[0141] PTC ratio measurement experiments were conducted based on the example and three comparative examples of the heating element composition, and the polymer of the heating element composition was high-density polyester (HDPE), and the conductive particles (717) were carbon black. Based on 100 wt% of the heating element composition, 10 wt% of the additive was used, and the melting point, PTC temperature, and PTC ratio were measured while adjusting only the ratio of the crystallinity of the entire heating element composition by controlling the crystallinity of the HDPE.

[0142] Melting Point, PTC Temperature Measurement Experiment Method

[0143] The crystallinity of the heating element composition was varied between the examples and comparative examples. The experiment was conducted with a crystallinity of 5.18% for the example, less than 0.1% for Comparative Example 1, 3.15% for Comparative Example 2, and 3.55% for Comparative Example 3. The crystallinity of the heating element composition was measured through DSC analysis. Specifically, the crystallinity of the heating element composition was determined and measured from the melting peak of the DSC curve. The crystallinity of the heating element composition was measured by dividing the result by 193 J / g, which is the change in heat of the % crystallinity at the melting peak, and then multiplying by 100.

[0144] Table 2 shows the measurement results for the melting point, PTC temperature, and PTC ratio according to the degree of crystallization of the heating element compositions of the examples and comparative examples.

[0145] Classification Polymer Heating Element Composition Degree of Crystallinity (%) Heating Element Composition Melting Point (°C) PTC Temperature (°C) PTC Ratio Comparative Example 1 HDPE < 0.1 N / AN / AN / A Comparative Example 2 3.15 85.89 89.38.73 Comparative Example 3 3.55 109.86 104.69.6 Example 5 5.18 124.91 120.13 0.14

[0146] Referring to Table 2, in the case of Comparative Example 1, neither the melting point nor the PTC temperature was measured, which indicates that the heating element composition lacking internal crystallinity does not exhibit a substantial PTC effect. Furthermore, in the case of Comparative Examples 2 and 3, when the crystallinity was 3 to 4%, the melting points were 85.89 and 109.86 degrees, respectively, and the PTC temperatures were 89.3 and 104.6 degrees, respectively. It appeared that the melting point and PTC temperature increased as the crystallinity increased, but the PTC ratios were 8.73 and 9.6, respectively, showing no significant difference, confirming that a rapid increase in the PTC ratio did not occur. In contrast, in the case of the Example, the melting point was 124.91 degrees and the PTC temperature was 120.1 degrees, which is higher than that of the Comparative Example. Additionally, it was confirmed that the PTC ratio increased dramatically to 30.14, having a value of 20 or higher. That is, when the degree of crystallization of the heating element composition exceeds 5%, it can be confirmed that the melting point and PTC temperature rise, and the PTC ratio rises rapidly, and accordingly, it can be confirmed that the PTC effect due to the change in resistance at high temperatures is effectively achieved. FIG. 9 is a graph showing the PTC ratio by temperature of the heating element composition according to an embodiment of the present invention and the heating element composition according to a comparative example, and FIG. 10 is a graph showing the PTC ratio by temperature of the heating element according to an embodiment of the present invention and the comparative example. Among the heating element compositions used in FIG. 9 and FIG. 10, the heating element composition of the comparative example (Ref) has a degree of crystallization of 3.15%, and the heating element composition of the embodiment has a degree of crystallization of 6.24%.

[0147] As can be seen through Figures 9 and 10, in the case of the comparative example (Ref), the PTC ratio decreases at 120 to 140 degrees, which is the high temperature condition for using the heating element composition. In other words, although the absolute PTC ratio value may be high, it can be seen that a Post NTC phenomenon occurs in which resistance decreases rapidly as the temperature increases, and consequently, there is a problem in that the PTC effect does not occur properly and heat generation may continue.

[0148] However, in the case of the example, it can be seen that the resistance begins to increase from 130 degrees and the PTC ratio decreases at 150 degrees, and as the Post NTC phenomenon occurs at high temperatures above 150 degrees, it can be seen that the PTC ratio at 120 to 140 degrees, for which the heating element composition is practically used, shows a continuously increasing trend. In fact, it can be seen through Fig. 6 that the melting point of the example is 136.37 degrees.

[0149] That is, when the degree of crystallinity is 5% or more, the melting point and PTC temperature can be maintained at 120 to 140 degrees, and at that temperature, the PTC ratio increases rapidly while the Post NTC effect does not occur, thereby providing a heating element composition.

[0150] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0151] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. First entry; A second material facing the first material above; and It includes a heating layer disposed between the first substrate and the second substrate, and The above heating layer is, A heating element composition comprising a polymer including a thermosetting resin, conductive particles having conductivity within the polymer, and an additive, and It includes an electrode in contact with the above heating element composition, and A heating element in which the volume percentage of the conductive particles in the above heating element composition is higher than the volume percentage of the polymer.

2. In Paragraph 1, A heating element having a composition of 39 to 46 Vol% of the polymer, 49 to 51 Vol% of the conductive particle, and 5 to 10 Vol% of the additive relative to 100 Vol% of the heating element composition.

3. In Paragraph 1, The above thermosetting resin is a heating element comprising a polymer resin having a glass transition temperature of 100 to 110 degrees.

4. In Paragraph 3, The above thermosetting resin is a heating element in which a material having a coefficient of thermal expansion in the glass state that is at least three times higher than the coefficient of thermal expansion in the solid state is used.

5. In Paragraph 3, The above polymer resin is a heat-generating element comprising one or more of glycidyl-ether epoxy and non-glycidyl cyclo-aliphatic epoxy.

6. In Paragraph 5, The above glycidyl-based ether epoxy is an exothermic material comprising one or more of DGEBA (Bisphenol A glycidyl ether) epoxy and novolac glycidyl ether.

7. In Paragraph 1, The above conductive particles are a heating element comprising one or more of carbon black and graphite.

8. First body; A lens module disposed within the first body and comprising a barrel and a lens disposed within the barrel; A substrate module disposed within the first node; and It includes a heating element having one end connected to the surface of the lens and the other end connected to the substrate module to provide heat to the lens. The above heating element is, It includes a first substrate, a second substrate facing the first substrate, and a heating layer disposed between the first substrate and the second substrate, The heating layer comprises a heating element composition consisting of a polymer including a thermosetting resin, conductive particles having conductivity within the polymer and an additive, and an electrode in contact with the heating element composition. A camera module in which the volume percentage of the conductive particles in the above heating element composition is higher than the volume percentage of the polymer.

9. In Paragraph 8, A camera module having a composition of 39 to 46 Vol% of the polymer, 49 to 51 Vol% of the conductive particle, and 5 to 10 Vol% of the additive relative to 100 Vol% of the heating element composition.

10. In Paragraph 8, The above thermosetting resin is a camera module comprising a polymer resin having a glass transition temperature of 100 to 110 degrees.

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