Rigid carrier assemblies with conductive modifiers added to injection molding polymers for improved electrostatic discharge

Abstract

A carrier assembly for semiconductor components can include a patterned tray composed of carbon nanotubes – having disentangled conductive modifiers – that substantially conforms to the pattern. By aligning the disentangled conductive modifiers (e.g., using a chemical vapor deposition process, sonication, and / or a strong magnet) in a vertical arrangement, more consistent and effective discharge of static electricity can be achieved. When semiconductor components are loaded into the patterned tray for storage and / or transport, static electricity will naturally build up. Effective discharge is important to lessen the likelihood of the semiconductor components being damaged. With the vertically aligned conductive modifiers, the static electricity can be more readily discharged into the patterned tray.

Description

Our Ref. 129087.8006.W001(PATENT)RIGID CARRIER ASSEMBLIES WITH CONDUCTIVE MODIFIERS ADDED TO THE FORMULATION OF INJECTION MOLDING POLYMERS FOR IMPROVED ELECTROSTATIC DISCHARGECROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of US Provisional Application No. 63 / 726,139, titled “RIGID CARRIER ASSEMBLIES WITH CONDUCTIVE MODIFIERS ADDED TO THE FORMULATION OF INJECTION MOLDING POLYMERS FOR IMPROVED ELECTROSTATIC DISCHARGE” and filed on November 27, 2024, which is incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] Various embodiments concern carrier assemblies that incorporate conductive modifiers to facilitate dissipation of electrical charge along a surface on which semiconductor components rest, as well as methods for manufacturing and using the same.BACKGROUND

[0003] In electronics manufacturing, a wafer (also called a “slice” or “substrate”) is a thin section of semiconductor material, such as crystalline silicon, on which integrated circuits (ICs) are fabricated. The wafer serves as the substrate for forming microelectronic structures, which may undergo various microfabrication processes such as doping, ion implantation, etching, thin-film deposition, and photolithographic patterning. After fabrication, the individual microcircuits may be separated during a dicing process and subsequently packaged as integrated circuits. For simplicity, the term “semiconductor components” may be used to collectively refer to wafers, diced dies, and related microelectronic components.

[0004] Several types of carriers are commonly used to transport semiconductor components between manufacturing and assembly sites, including stick magazines, injection-molded trays, and carrier tapes. Such carriers often conform to standards established by the Joint Electron Device Engineering Council (JEDEC) for the safe handling, transport, and storage of ICs and related components.11845941 19.1Our Ref. 129087.8006.W001(PATENT)

[0005] Stick magazines (also called “shipping tubes”) can transport semiconductor components from fabrication sites to assembly sites and may also be configured to feed semiconductor components into automatic-placement machinery used for surfacemount and through-hole assembly processes.

[0006] Injection-molded trays (also called “process trays” or “shipping trays”) are frequently used to contain semiconductor components during handling, transport, and assembly operations. These trays are often used to present or “feed” semiconductor components to automatic-placement machines for surface mounting on printed circuit board assemblies (PCBAs). Injection-molded trays are typically designed for components with leads on multiple sides (e.g., quad flat package (QFP) or thin QFP (TQFP) devices) and provide lead isolation during shipping, handling, or processing.

[0007] Carrier tapes may likewise be used to transport or store semiconductor components and are typically wound around reels so that the components can be presented to automatic-placement machines for surface mounting on board assemblies.

[0008] Despite their widespread use, these carrier configurations exhibit limitations that affect semiconductor manufacturing throughput. For example, the achievable packing density of semiconductor components per unit area may be constrained by retention requirements for individual components. As another example, lateral movement of the components may be restricted by the size, geometry, or arrangement of cavities used to hold the components, which can increase the risk of damage during handling. Additionally, these carrier configurations generally offer limited protection against the buildup or discharge of static electricity generated during component contact or movement. Such limitations can reduce manufacturing and handling efficiency and increase the associated manufacturing, handling, and testing costs. Accordingly, improved carrier configurations are desired.21845941 19.1Our Ref. 129087.8006.W001(PATENT)BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Various features of the technology will become more apparent to those skilled in the art from a study of the Detailed Description in conjunction with the drawings. Embodiments of the technology are illustrated by way of example and not limitation in the drawings, in which like references may indicate similar elements.

[0010] Figure 1 depicts an example of a carrier assembly comprised of an injection- molded component (also referred to as the "substrate") with a deck and pocket area including electrostatic discharge (ESD) modifiers.

[0011] Figure 2A illustrates a top view of an example of the carrier assembly.

[0012] Figure 2B illustrates a bottom view of the carrier assembly of Figure 2A.

[0013] Figure 2C illustrates a top view of an example of the carrier assembly.

[0014] Figure 2D illustrates a bottom view of the carrier assembly of Figure 2C.

[0015] Figure 2E illustrates a top view of an example of the carrier assembly.

[0016] Figure 2F illustrates a bottom view of the carrier assembly of Figure 2E.

[0017] Figure 3 is a flowchart of a process for creating a carbon nanotube composite used to create an injection-molded component.

[0018] Figure 4A illustrates an example of entangled conductive modifiers.

[0019] Figure 4B illustrates an example of disentangled (also referred to as “aligned”) conductive modifiers.

[0020] Figure 5 includes information on which materials may be suitable as conductive modifiers (and which materials may not be suitable as conductive modifiers, but could instead be used as conductive isolators or insulators).

[0021] Figure 6 depicts an example of a carrier assembly comprised of an injection- molded component with a deck and pocket area including ESD modifiers.

[0022] Figure 7 illustrates a vertical section view of the carrier assembly taken along line B of Figure 6.31845941 19.1Our Ref. 129087.8006.W001(PATENT)

[0023] Figure 8 illustrates a horizontal sectional view of the carrier assembly taken along line A of Figure 6.

[0024] Figure 9 includes an exploded view of multiple carrier assemblies stacked in preparation for handling, transporting, and / or storing semiconductor components.

[0025] Figure 10 depicts an example of a carrier assembly that includes a primary injection-molded component including conductive modifiers with a continuous deck area and overmolded with a secondary injection-molded component.

[0026] Figure 11 illustrates a vertical section view of the carrier assembly taken along line B of Figure 10.

[0027] Figure 12 illustrates a horizontal sectional view of the carrier assembly taken along line A of Figure 10.

[0028] Figure 13 includes a top plane view of a carrier assembly that includes a primary injection-molded component with a deck area on which a secondary injection- molded component has been mounted.

[0029] Figure 14A includes a sectional view depicting the pre-forming of a carrier assembly that includes a secondary injection-molded component connected to a primary injection-molded component.

[0030] Figure 14B includes a sectional view depicting a carrier assembly with a secondary injection-molded component integrally molded onto a primary injection- molded component.

[0031] Figure 15 depicts an example of a carrier assembly that includes a primary injection-molded component (also referred to as the "substrate") with a continuous deck area that is overmolded with a secondary injection-molded component including conductive modifiers and a tertiary injection-molded component (also referred to as the "additional overmold").

[0032] Figure 16 illustrates a vertical section view of the carrier assembly taken along line B of Figure 15.41845941 19.1Our Ref. 129087.8006.W001 (PATENT)

[0033] Figure 17 illustrates a horizontal sectional view of the carrier assembly taken along line A of Figure 15.

[0034] Figure 18 includes a top plane view of a carrier assembly that includes a primary injection-molded component with a deck area on which a secondary injection- molded component including conductive modifiers and a tertiary injection-molded component has been mounted.

[0035] Figure 19A includes a sectional view depicting the pre-forming of a carrier assembly that includes a tertiary injection-molded component connected to a secondary injection-molded component including conductive modifiers connected to a primary injection-molded component.

[0036] Figure 19B includes a sectional view depicting a carrier assembly with a tertiary injection-molded component integrally molded onto a secondary injection- molded component including conductive modifiers integrally molded onto a primary injection-molded component.

[0037] Figure 20A includes a top plan view of a carrier assembly including conductive modifiers before the conductive modifiers are aligned using an alignment mechanism.

[0038] Figure 20B includes a top plan view of the carrier assembly of Figure 20A after the conductive modifiers are aligned using the alignment mechanism.

[0039] Figure 21 includes a top plan view of a carrier assembly showing how media can be injected into the deck area of a primary injection-molded component to form a secondary injection-molded component.

[0040] Figure 22 includes a sectional view of the layers of a carrier assembly that includes a secondary injection-molded component integrally mounted along the deck area of a primary injection-molded component.

[0041] Figure 23 includes a top plan view of a carrier assembly showing how media can be injected onto the secondary injection-molded component to form a tertiary injection-molded component.51845941 19.1Our Ref. 129087.8006.W001(PATENT)

[0042] Figure 24 includes a sectional view of the layers of a carrier assembly that includes a tertiary injection-molded component integrally mounted along a secondary injection-molded component.

[0043] Figure 25 includes a sectional view illustrating how liquified media (e.g., a thermoplastic elastomer) can be integrally mounted to a primary injection-molded component as part of a molding process.

[0044] Figure 26 is a flowchart of a process for creating a carrier assembly comprised of a primary injection-molded component and a secondary injection-molded component via overmolding.

[0045] Figure 27 is a flowchart of a process for creating a carbon nanotube composite used to create a primary injection-molded component.

[0046] Figure 28 is a flowchart of a process for creating a carbon nanotube elastomer concentrate used to create a secondary injection-molded component.

[0047] Figures 29-31 are flowcharts of other processes for creating a carrier assembly comprised of a primary injection-molded component and a secondary injection-molded component.

[0048] Figure 32 is a flowchart of a process for transporting semiconductor components using the carrier assemblies described herein.

[0049] The drawings depict various embodiments for the purpose of illustration only. Those skilled in the art will recognize that alternative embodiments may be employed without departing from the principles of the technology. Accordingly, while specific embodiments are shown in the drawings, the technology is amenable to various modifications.61845941 19.1Our Ref. 129087.8006.W001(PATENT)DETAILED DESCRIPTION

[0050] One option for handling, transporting, and storing semiconductor components is a carrier tray. Carrier trays may be designed to accommodate specific component geometries or dimensions, such as semiconductor wafers of a given diameter, thickness, or shape. For example, a carrier tray intended to protect circular semiconductor wafers may include circular cavities (also called “pockets”) sized to receive and retain the wafers. Conventional trays typically restrict movement of the stored semiconductor components by maintaining physical contact with the components along one or more surfaces.

[0051] Carrier trays are commonly used to transport semiconductor components between facilities during manufacturing, testing, and assembly operations. They may also be used to store components before, during, or after such operations. Carrier trays prevent the components from contacting one another, thereby reducing the likelihood of mechanical damage. Certain trays can also present the enclosed components to manual placement tools or automatic placement tools (e.g., pick-and-place machines) for testing, dicing, or other processing. Dicing may involve dividing a semiconductor wafer into individual dies or subcomponents that are subsequently used in the fabrication of an integrated circuit (IC).

[0052] Although widely used, conventional carrier trays exhibit limitations that can compromise their ability to protect sensitive semiconductor components. Carrier trays are often manufactured using injection molding, and an injection-molded tray may inadvertently damage a semiconductor component if external forces are transmitted through portions of the tray that contact the component. Additionally, many injection- molded trays provide limited dissipation of static electricity, which can subject the components to electrostatic discharge (ESD) and cause further damage. These limitations can lead to component damage, increased transport and handling costs, and reduced efficiency during manufacturing, testing, and assembly operations.

[0053] Certain industry standards require carrier trays to exhibit surface resistance values within specified ranges. Although conventional trays can satisfy some of these requirements, many manufacturers and applications demand significantly tighter71845941 19.1Our Ref. 129087.8006.W001 (PATENT) tolerances to further inhibit damage to semiconductor components. For example, some specifications call for surface resistance values within two to three orders of magnitude, such as between 105and 108ohms. These narrow tolerances can be difficult — and in some cases, impractical or impossible — to achieve using traditional tray materials and manufacturing methods.

[0054] Carbon nanotubes (CNTs) have demonstrated significant promise across multiple industries and represent one example of a conductive modifier. As used herein, the term “conductive modifier” refers to a material — or combination of materials — that is capable of promoting electron flow and improving electrical conductivity. Other examples of conductive modifiers include silver, copper, gold, aluminum, iron, carbon fiber, carbon black power, and combinations thereof (including combinations with less conductive materials).

[0055] At a high level, CNTs are hollow tubular structures comprised of carbon atoms, typically having diameters on the order of nanometers and lengths that may extend into the micrometer range. Due to their unique structure and strong carboncarbon bonding, CNTs exhibit exceptional tensile strength, thermal conductivity, and electrical conductivity. Accordingly, CNTs may offer at least a partial solution to electrostatic discharge (ESD) issues associated with carrier trays.

[0056] The electron— transfer properties of conductive modifiers can enable improved dissipation of static charge that accumulates on the surface of a carrier tray. However, CNTs are conventionally supplied in the form of bundled or entangled fibers or fibrils. Said another way, CNTs are commonly “clumped” together. In this aggregated state, the CNTs may provide inconsistent electrical pathways, resulting in irregular or localized discharge of static electricity — and in some cases, exacerbating ESD issues. With appropriate processing, the CNTs can be separated into individual fibers or fibrils and the separated “disentangled” or “discrete” CNTs can be aligned to form a percolation network formation. Once separated and aligned, the CNTs may be incorporated into one or more tray materials to provide enhanced electrical performance and, in some implementations, additional mechanical reinforcement.81845941 19.1Our Ref. 129087.8006.W001(PATENT)

[0057] Introduced here are carrier assemblies (or simply “assemblies”) that are designed to address the limitations of conventional carrier trays. A carrier assembly can include one or more forms of disentangled conductive modifiers, which may be applied as a CNT-based coating and / or incorporated into one or more materials to form a composite material (or simply “composite”) used in the assembly. The conductive modifiers in the coating and / or composite can be vertically aligned and homogenously dispersed using processes such as sonication, chemical vapor deposition (CVD), and / or application of a strong magnetic field. Such alignment can provide a more uniform distribution of discrete conductive modifiers, thereby enabling more consistent dissipation of electrostatic charge. These coatings and / or composites can mitigate electrostatic buildup on the carrier assembly’s upper surface and help prevent undesired electrostatic discharge (ESD) and associated damage to semiconductor components. In various embodiments, the conductive modifiers may serve as reinforcement for additional materials — such as urethane polymers and prepolymers used to form rigid or flexible foams, adhesives, sealants, coatings, or elastomers — used in the manufacture of rigid carrier assemblies.

[0058] As further discussed below, the conductive modifiers may be discrete, individualized conductive modifiers having selectively controlled oxidation levels on their exterior surfaces and / or interior surfaces. In some embodiments, discrete conductive modifiers can be produced through controlled and substantially simultaneous application of oxidation and shear forces, resulting in oxidation of both the inner and outer tube surfaces, often to comparable oxidation levels. In other embodiments, conductive modifiers may have little or no oxidation on the inner tube surface, or may exhibit different oxidation types and / or oxidation levels between the inner and outer surfaces. These selectively oxidized discrete conductive modifiers can be incorporated into rigid and / or non-rigid polymeric materials (e.g., rubber, elastomeric, thermoplastic, or thermoset composites) forming part of the carrier assembly to improve mechanical, electrical, and / or thermal performance.

[0059] In some embodiments, the carrier assembly is representative of a frame with one or more apertures (i.e., that extend entirely through the frame) or recesses (i.e., that91845941 19.1Our Ref. 129087.8006.W001(PATENT) extend partially through the frame), each of which is sized to receive a separate semiconductor component, as shown in Figure 1. In such embodiments, the carrier assembly may include a single injection-molded component. As further discussed below, the injection-molded component may comprise multiple materials. For example, the injection-molded component may comprise a composite formed from a first material (also called a “rigid material”) that provides mechanical strength and protection and a second material (also called an “anti-static material” or “static-dissipative material”) that facilitates dissipation of accumulated electrical charge. In some embodiments, the second material comprises a CNT-based coating that is sprayed onto, adhered to, or otherwise applied to one or more surfaces of the first material. In other embodiments, CNTs are incorporated into the first material during processing (e.g., during a molten mixing stage) or are provided in the form of a foam, sealant, or similar layer that is applied to at least a portion of the surface of the first material. Regardless of how it is incorporated into the carrier assembly, the CNTs are representative of conductive modifiers capable of dissipating electrostatic buildup originating from semiconductor components positioned on the carrier assembly.

[0060] The carrier assembly could include multiple components in some embodiments. In Figure 6, for example, the carrier assembly includes a primary injection-molded component — which may be akin to the frame of Figure 1 or a tray having a substantially planar deck — and a secondary injection-molded component that is secured thereto. The secondary injection-molded component may be formed from a flexible, thin material having a tacky upper surface that facilitates securement of semiconductor components to the secondary injection-molded component — and thereby to the primary injection-molded component — while allowing the semiconductor components to be detachably held with minimal risk of damage. Either the primary injection-molded component or the secondary injection-molded component could have conductive modifiers incorporated therein or adhered thereto.

[0061] Accordingly, the secondary injection-molded component may have CNTs embedded therein or may include a CNT-based coating in addition to, or instead of, CNTs being embedded in or adhered to the primary injection-molded component. For101845941 19.1Our Ref. 129087.8006.W001 (PATENT) example, the CNT-based coating may be provided as a flexible foam, adhesive, sealant, coating or elastomer containing conductive modifiers. Additionally or alternatively, the secondary injection-molded component may be formed from a polymeric material — such as a urethane polymer, urethane prepolymer, or thermoplastic elastomer — integrated with conductive modifiers. In some embodiments, the secondary injection- molded component includes a surface that is configured to secure or retain semiconductor components within the carrier assembly, such as a CNT-containing elastomer that provides a rubber-like, conformal surface that protects the components during transport.

[0062] In yet another embodiment, a tertiary injection-molded component may be secured to the primary injection-molded component — either above, below, or alongside the secondary injection-molded component, as shown in Figure 10, for example. The tertiary injection-molded component may have CNTs embedded therein or may include a CNT-based coating, much like the secondary injection-molded component.

[0063] Examples of semiconductor components include wafers (e.g., singulated wafers, diced wafers), dies (e.g., bumped dies, bare dies), and other microelectronic structures used in the fabrication of integrated circuits (ICs). While embodiments are described herein with reference to wafers for purposes of illustration, those skilled in the art will appreciate that the carrier assemblies described herein may be adapted to handle, transport, or store any suitable type of semiconductor component.

[0064] In some embodiments of the present disclosure, the conductive modifiers are contained within various compositions (e.g., a CNT-based coating). However, the conductive modifiers are not necessarily dispersed within a continuous matrix that maintains the modifiers in a dispersed state. Illustrative continuous matrices include solutions or polymer matrices capable of maintaining the modifiers in a partially or substantially disentangled condition. In various embodiments, the conductive modifiers are provided as a carbon nanotube mat or as aligned conductive modifiers that do not require a continuous matrix to maintain alignment. As such, the conductive modifiers described herein are distinguishable from those currently known in the art, which may re-agglomerate once removed from a solution or dispersion medium.1 11845941 19.1Our Ref. 129087.8006.W001 (PATENT)

[0065] Additionally or alternatively, the conductive modifiers can be incorporated into a coating — or even into the material or composite used to create the primary, secondary, or tertiary injection-molded components — by blending the conductive modifiers with a liquid to form a composite mixture (or simply “mixture”). In the case of CNTs, for example, the CNTs could be added to a liquid to form a liquid / fiber mixture. The liquid may include a solvent or media (e.g., acetone, ethanol, isopropanol), a surfactant (e.g., sodium dodecyl sulfate (SDS), cetyltrimethylammonium bromide (CTAB)), and / or a functional fluid (e.g., lubricant). The liquid / fiber mixture may be agitated (e.g., by sonication) to disperse and / or align the conductive modifiers. In some embodiments, the conductive modifiers constitute between 1 weight percent and 30 weight percent (i.e. , between 1 and 30 wt%) of the composition and may be present in the form of free-flowing particles. The liquid / fiber mixture can be applied to components of the carrier assembly via spraying, brushing, dipping, and / or a chemical vapor deposition (CVD) process. The conductive modifiers may additionally or alternatively be aligned after deposition on the component surfaces. As mentioned above, the liquid / fiber mixture could also be used to construct the primary, secondary, or tertiary injection-molded components. Accordingly, the liquid / fiber mixture could be deposited into a hopper and then extruded into a mold as part of an injection-molding process, as further discussed below. In such embodiments, the conductive modifiers could be aligned before or during the injection-molding process.

[0066] In embodiments where the conductive modifiers are incorporated into a coating, the coating may be in the form of a foam or sealant comprising the reaction product of a urethane-based polymer or prepolymer and the liquid / fiber mixture. The conductive modifiers may have an original aspect ratio between 2 and 1 ,000 (and preferably between 10 and 500 or between 25 and 250). Moreover, in some embodiments, the retained aspect ratio in the finished product is at least 80, 70, or 60% of the original aspect ratio, providing the carrier assembly with one or more of increased rigidity, increased strength, improved crush resistance, and / or enhanced static electricity transmission.121845941 19.1Our Ref. 129087.8006.W001(PATENT)

[0067] Additionally or alternatively, the conductive modifiers may be integrated into one or more components of the carrier assembly (e.g., the primary, secondary, and / or tertiary injection-molded components). For example, the primary-injection molded component may be formed from a composite, with CNTs included therein, that when cured or otherwise hardened, forms a structural frame that can support semiconductor components. As another example, the secondary and / or tertiary injection-molded components may be formed from a CNT-containing elastomer, such as a styrenecopolymer rubber comprising about 2 wt% to about 20 wt% of conductive modifiers.

[0068] In some embodiments, the conductive modifiers are incorporated into a rigid and / or non-rigid composite formed from a natural or synthetic polymer. The composite may include conductive modifiers having an aspect ratio between approximately 25 and 500 (and preferably between 25 and 250 or between 25 and 100). In some embodiments, the conductive modifiers are incorporated into non-rigid elastomers — like an elastic polymeric substance, such as rubber — by: (i) forming a solution of disentangled conductive modifiers at a pH of at least about 7, (ii) adding the solution to a rubber or elastomer to form a mixture also at a pH at least about 7, (iii) coagulating the mixture to form a concentrate, and (iv) melt-mixing the concentrate into rubbers and / or elastomers to form elastomeric composites.

[0069] The non-rigid elastomers can include natural or synthetic materials such as natural rubbers, polyisobutylene, polybutadiene, styrene-butadiene rubbers, butyl rubber, polyisoprene, styrene-isoprene rubbers, ethylene-propylene-diene rubbers (EPDM), silicones, polyurethanes, polyester-polyethers, hydrogenated ornon- hydrogenated nitrile rubbers (HNBR / NBR), halogen-modified elastomers, fluoroelastomers, and combinations thereof. Additionally or alternatively, other fillers (e.g., carbon black) may be incorporated into the composite to impart additional mechanical, electrical, or thermal properties.

[0070] As described herein, the solution can include one or more media, solvents, surfactants, and / or functional fluids configured to allow the conductive modifiers to be combined and uniformly dispersed in the mixture. Additionally or alternatively, sonication and / or magnet-induced alignment can be used to vertically align the131845941 19.1Our Ref. 129087.8006.W001(PATENT) disentangled conductive modifiers in the mixture prior to setting, curing, or molding the composite.

[0071] A generally similar process may be used with a rigid polymer and / or plastic — such as polycarbonate, polyphenylene ether (PPE), polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polyethylene, polypropylene, liquid-crystal polymer (LCP), or ethylene chlorotrifluoroethylene (ECTFE) — to form the primary injection-molded component.

[0072] In some embodiments, the primary injection-molded component and / or the secondary injection-molded component include conductive modifiers provided in the form of a dry liquid concentrate (DLC) incorporated into a composite material. For example, the secondary injection-molded component may be formed from a rubber composition that includes conductive modifiers supplied as a DLC. The DLC can comprise dispersed, individualized, discrete conductive modifiers. Said another way, the DLC may comprise conductive modifiers in a disentangled form. In some embodiments, dispersing the conductive modifiers using the DLC during composite processing offers advantages, including reduced energy requirements. For example, the conductive modifiers in the DLC may be as-manufactured raw conductive modifiers that do not require prior disentanglement before being formed into a DLC. Once in DLC form, the conductive modifiers can be disentangled and dispersed within the composite formulation. This surprising and unexpected result can reduce manufacturing cost and processing difficulty while still providing the physical property improvements imparted by disentangled conductive modifiers. By comparison, prior methods of disentangling conductive modifiers often require more energy and involve higher processing costs.

[0073] In one exemplary method, a DLC is produced by mixing raw, as- manufactured conductive modifiers in de-ionized water and heating the mixture to approximately 65 degrees Celsius (°C) while agitating with overhead stirring and a high- shear blade. Once the desired temperature is reached, an oil phase may be added to the water / conductive-modifier mixture, and the combined mixture is stirred until phase separation occurs. Following phase separation, the conductive modifiers reside primarily within the oil layer and the water phase may be removed (e.g., by filtering or141845941 19.1Our Ref. 129087.8006.W001(PATENT) decanting). The oil / conductive-modifier composition can then be dried in an oven to yield the DLC. During subsequent polymer-processing operations, the DLC may be incorporated into a polymer, wherein the previously raw conductive modifiers become disentangled, dispersed, and / or aligned throughout the polymer matrix.

[0074] As described herein, the carrier assemblies may include a secondary injection-molded component that is integrated with the primary injection-molded component, for example, through an overmolding process. Overmolding is a two-shot injection-molding technique that produces a single structure (e.g., a carrier assembly) by combining two complementary thermoplastic materials. For example, a first shot may form the primary injection-molded component — which can serve as a “substrate” — from a rigid thermoplastic material, and a second shot may create the secondary injection-molded component — which can serve as the “overmold” — from a softer or more flexible thermoplastic or elastomeric material. The overmold may include conductive modifiers to provide static-dissipative properties. Additionally or alternatively, the primary injection-molded component may include conductive modifiers, and the secondary injection-molded component may be formed from a material having a tacky surface on one or both sides to secure semiconductor components within the carrier assembly.

[0075] In some embodiments, an additional overmolding step may be performed to create a tertiary injection-molded component. For example, a third shot (also called an “additional overmold”) may be formed from a third thermoplastic material that is compatible with the first and second thermoplastic materials. The additional overmold may comprise a material having a tacky surface on one or both sides to secure semiconductor components to the carrier assembly. Additionally or alternately, the components of the carrier assembly may be formed in separate injection-molding processes and subsequently joined together using one or more coupling mechanisms (e.g., adhesives, clasps, clips, tabs, mechanical fasteners, interference-fit features, etc.).

[0076] As further discussed below, in embodiments where the primary injection- molded component is representative of a tray with a substantially planar deck area, the151845941 19.1Our Ref. 129087.8006.W001 (PATENT) secondary and / or tertiary injection-molded components may be bonded along the deck area of the primary injection-molded component as one or more continuous pieces or as a series of multiple pieces. Semiconductor components can then be secured to the carrier assembly based on the tackiness of the upper surface of the secondary or tertiary injection-molded component. Thus, proper securement of the semiconductor components to the carrier assembly may depend on the tackiness of the constituent material(s) used to form the secondary or tertiary injection-molded component. In some embodiments, the secondary and / or tertiary injection-molded components may be formed from a rubber-like elastomer and / or a thin film exhibiting adhesive or pressuresensitive adhesive properties.

[0077] In some embodiments, semiconductor components are detached from the secondary and / or tertiary injection-molded component(s) manually (e.g., by a human hand), while in other embodiments, semiconductor components are detached from the secondary and / or tertiary injection-molded component(s) automatically (e.g., by a computer-implemented system, such as a pick-and-place robotic transfer mechanism). Semiconductor components may therefore be readily separated from the carrier assembly at a manufacturing or testing facility, while remaining stably retained during transform even when the carrier assembly is rotated about any of the x-, y-, and z-axes.

[0078] One objective of the present invention is to provide a simple and reliable mechanism for quickly securing semiconductor components to a carrier assembly while limiting damage or failure modes such as ESD, mechanical abrasion, or undesired movement. In embodiments where the primary injection-molded component is representative of a frame with one or more apertures or recesses, those apertures or recesses can serve as positioning or seating locations for semiconductor components. In embodiments where the primary injection-molded component is representative of a tray with a deck area, the deck area can serve as a positioning or seating plane upon which semiconductor components are secured. For example, the upper surface of the deck area may include one or more cavities or recesses in which semiconductor components can be at least partially secured. Alternatively, the secondary and / or tertiary injection-molded components could conform to the shape of these cavities or recesses. One or more of the injection-molded components may incorporate conductive161845941 19.1Our Ref. 129087.8006.W001(PATENT) modifiers, which in turn enable the carrier assembly to offer improved electrostatic discharge capabilities while still allowing the carrier assembly to be rotated, translated, or otherwise manipulated without displacing or damaging the semiconductor components.Terminology

[0079] References in this description to “an embodiment” or “one embodiment” means that the feature, function, structure, or characteristic being described is included in at least one embodiment. Occurrences of such phrases do not necessarily refer to the same embodiment, nor are they necessarily referring to alternative embodiments that are mutually exclusive of one another.

[0080] Unless the context clearly requires otherwise, the words “comprise” and “comprising” are to be construed in an inclusive sense rather than an exclusive or exhaustive sense (i.e., in the sense of “including but not limited to”). The terms “connected,” “coupled,” or any variant thereof is intended to include any connection or coupling, either direct or indirect, between two or more elements. The coupling / connection can be physical, logical, or a combination thereof. For example, components may be electrically or communicatively coupled to one another despite not sharing a physical connection.

[0081] The term “based on” is also to be construed in an inclusive sense rather than an exclusive or exhaustive sense. Thus, unless otherwise noted, the term “based on” is intended to mean “based at least in part on.”

[0082] When used in reference to a list of multiple items, the word “or” is intended to cover all of the following interpretations: any of the items in the list, all of the items in the list, and any combination of items in the list.

[0083] The sequences of steps performed in any of the processes described here are exemplary. However, unless contrary to physical possibility, the steps may be performed in various sequences and combinations. For example, steps could be added to, or removed from, the processes described here. Similarly, steps could be replaced or reordered. Thus, descriptions of any processes are intended to be open-ended.171845941 19.1Our Ref. 129087.8006.W001(PATENT)Overview of Carrier Assembly with Improved ESP Properties

[0084] Figure 1 depicts an example of a carrier assembly 100 that includes an injection-molded component 102 (also called a “substrate”) with one or more apertures (i.e., that extend entirely through the injection-molded component 102) or recesses (i.e., that extend partially through the injection-molded component 102), each of which is sized to receive a separate semiconductor component. This type of injection-molded component may be called an “apertured-type frame,” “apertured frame,” or simply “frame.” More specifically, the injection-molded component 102 can be formed by mixing a first material with carbon nanotubes 114, also referred to as composites, to form a first mixture and then injection-molding the first mixture to form the injection- molded component 102. The carrier assembly 100 can be designed to handle semiconductor components of different sizes (e.g., different heights, widths, and lengths). Moreover, the carrier assembly 100 can be designed to accommodate different fabrication facilities, processes, etc. The carrier assembly 100 may be designed to maximize the density of semiconductor components and may include static- dissipative properties to improve the efficiency of transporting, shipping, or storing those semiconductor components.

[0085] In some embodiments, the carrier assembly 100 is designed to be compliant with Joint Electron Device Engineering Council (JEDEC), which sets standards for electrostatic discharge, handling, packing, and shipping of surface-mount devices. To comply with various JEDEC-imposed standards, the carrier assembly 100 may be comprised of disentangled conductive modifiers, also referred to as composites or uniform phase dispersion conductive modifiers, in the form of the carbon nanotubes 1 14. Additionally or alternatively, the carrier assembly 100 can be designed using certain materials, manufactured in certain shapes / sizes, and / or the like to comply with various JEDEC-imposed standards.

[0086] The shape and / or size of the carrier assembly 100 may be adapted to suit particular manufacturing, transporting, or storing needs. For example, the injection- molded component 102 may have a rectangular structural body as shown in Figure 1. Alternatively, the injection-molded component 102 may have a non-rectangular181845941 19.1Our Ref. 129087.8006.W001(PATENT) structural body in the form of, for example, a square, parallelogram, ellipse, etc. The size and / or shape of the injection-molded component 102 may be based on, for example, the design of a container in which the carrier assembly 100 is to be placed. For example, rectangular structural bodies may be desirable if the carrier assemblies are to be loaded into containers having rectangular footprints. As another example, non- rectangular structural bodies may be desirable if the carrier assemblies are to be loaded into containers having non-rectangular footprints.

[0087] In some embodiments, the structural body of the injection-molded component 102 includes an outer edge 108 that defines the periphery of the carrier assembly 100 and an inner edge 110 that defines the periphery of a deck area 104. Those skilled in the art will recognize that the apertures or recesses formed in the injection-molded component 102 are generally designed so as to hold semiconductor components along a plane that dissects (e.g., roughly bisects) the injection-molded component 102 between its bottom surface and top surface. For convenience, this plane may be called the “deck area” 104 along which semiconductor components are secured, though in embodiments where the injection-molded component 102 includes apertures that extend from its top surface to its bottom surface, the deck area 104 may largely comprise a void into which semiconductor components are situated. While the term “deck area” may generally be used to the surface, whether physical or not, upon which semiconductor components are loaded across the injection-molded component 102, the injection-molded component 102 could also be described as having multiple deck areas. Referring to Figure 1 , for example, the injection-molded component 102 could be described as having four separate deck areas 104.

[0088] The outer edge 108 may extend along the entire outer periphery of the injection-molded component 102 in an uninterrupted manner. The inner edge 1 10, meanwhile, may be substantially parallel to the outer edge 108. Together, the outer and inner edges 108, 110 may define opposing edges of a rim that extends around at least a portion of the deck area 104. Here, the rim extends around the entire periphery of the deck area 104 of the injection-molded component 102. Note, however, that the rim may include features that cause its height to vary. For example, the rim may include one or more interlock components to facilitate the connection with an upwardly adjacent carrier191845941 19.1Our Ref. 129087.8006.W001 (PATENT) assembly 100, as further discussed below. When a semiconductor component is set on the deck area 104 of the injection-molded component 102, a surface of the deck area 104 may be substantially parallel to the bottom surface of the semiconductor component and substantially perpendicular to the outer edge of the semiconductor component. In some embodiments, the sidewall of the rim that is defined by the inner edge 110 is substantially orthogonal to the surface of the deck area 104, while in other embodiments, the sidewall of the rim that is defined by the inner edge 110 has a pitch (i.e., is angled with respect to the surface of the deck area 104).

[0089] As further discussed below, the injection-molded component 102 may be comprised of a material known to be suitable for injection molding with the goal of producing a carrier assembly 100 that is resistant to moisture and / or electricity (e.g., to inhibit or even prevent static electricity collection and electrostatic discharge). For example, the structural body of the injection-molded component 102 may include an anti-static material or a static-dissipative material. Additionally or alternatively, the structural body may be comprised of a resilient material capable of protecting semiconductor components from physical damage.

[0090] The injection-molded component 102 can be comprised of a rigid material, such as molded plastic or molded resin. Examples of such materials include polycarbonates, polyphenylene ether (PPE), polyphenylene oxide (PPO), polyphenylene sulfide (PPS), thermoplastics such as polyethylene or polypropylene, liquid crystal polymer (LCP), ethylene chlorotrifluoroethylene (ECTFE), or any other material suitable for creating injection-molded objects. In some embodiments, the injection-molded component 102 is at least partially comprised of a conductive material, such as silver, copper, aluminum, or a ceramic. In some embodiments, the injection- molded component 102 is comprised of a single material, while in other embodiments, the injection-molded component 102 is comprised of multiple materials. For example, the injection-molded component 102 may be comprised of multiple materials that are mixed together before being injection into a mold to take its final form, as described in more detail with reference to Figures 10-12. As another example, the injection-molded component 102 may be created using a first material (also referred to as a “rigid material”) able to avoid physical damage and a second material (also referred to as an201845941 19.1Our Ref. 129087.8006.W001 (PATENT) “anti-static material” or a “static-dissipative material”) able to facilitate the dissipation of collected electricity. In some embodiments, the second material is the carbon nanotubes 114.

[0091] In some embodiments, the injection-molded component 102 can be composed of an LOP that is composed of: (i) about 50% to about 80% liquid crystal polymer, (ii) about 5% to about 30% carbon fiber, (iii) about 5% to about 30% milled carbon fiber, (iv) about 10% to about 40% glass fiber, (v) about 0.1% to about 10% carbon black powder, and (vi) about 0.1 % to about 10% anti-oxidant. In such embodiments, the liquid crystal polymer acts as a base material or resin for the other components; the carbon fiber, milled carbon fiber, and carbon black powder act as the conductive modifiers; and the anti-oxidant acts as a stabilizer. Further, the injection- molded component 102 can be manufactured at (i) an injection speed between about 40 millimeters per second (mm / s) and about 80 mm / s, (ii) an injection pressure between about 300 kgf / cm2and about 600 kgf / cm2. (iii) an injection time between about 1 .5 seconds and about 4.5 seconds, and (iv) a cylinder temperature (e.g., the cylinder housing the heated mixture) between about 330 degrees Celsius (C°) and about 360 C°.

[0092] In other embodiments, the injection-molded component 102 can be composed of a low particle modified polyphenylene oxide that is composed of: (i) about 50% to about 80% polyphenylene ether, (ii) about 5% to about 30% polystyrene, (iii) about 5% to about 30% carbon fiber, (iv) about 1 % to about 3% carbon powder or carbon black, (v) about 3% to about 30% wollastonite, (vi) about 0.1 % to about 10% rubber, and (vii) about 0.1 % to about 10% anti-oxidant. In such embodiments, polyphenylene ether and polystyrene act as a base material or resin for the other components; the carbon fiber and the carbon black powder act as conductive modifiers; the rubber act as a toughening modifier; the wollastonite acts as a structural filler; and the anti-oxidant acts as a stabilizer. Further, the injection-molded component 102 can be manufactured at (i) an injection speed between about 40 mm / s and about 80 mm / s, (ii) an injection pressure between about 300 kgf / cm2and about 600 kgf / cm2. (iii) an injection time between about 1.5 seconds and about 4 seconds, and (iv) a cylinder temperature between about 300 C° and about 330 C°.211845941 19.1Our Ref. 129087.8006.W001(PATENT)

[0093] As described herein, bundled conductive modifiers can be debundled or disentangled to produce individual conductive modifiers. The carbon nanotubes 114 can include a plurality of disentangled carbon nanotubes from the bundled conductive modifiers. The bundled conductive modifiers can be present in a variety of forms, including, for example, soot, powder, fibers, bucky paper, etc. Furthermore, the bundled conductive modifiers may be of any length, diameter, or chirality, and may be metallic, semi-metallic, semi-conducting, or non-metallic based on their chirality and number of walls. In various embodiments, the carbon nanotubes 114 include disentangled conductive modifiers from metallic, semi-metallic, or semi-conducting conductive modifiers such that the carbon nanotubes 114 can dissipate static electricity build up from the components of the carrier assembly 100 into the injection-molded component 102. The bundled and / or disentangled conductive modifiers may include, for example, single-wall conductive modifiers (SWNTs), double-wall conductive modifiers (DWNTs), multiwall conductive modifiers (MWNTs), shortened conductive modifiers, oxidized conductive modifiers, functionalized conductive modifiers, and combinations thereof. The conductive modifiers or combination of conductive modifiers selected to disentangle can depend on the size of the carrier assembly 100 and / or the number of semiconductors the carrier assembly 100 is configured to transport. It is worth noting that although some of the embodiments of the present disclosure are discussed utilizing a particular type of carbon nanotube, the embodiments of the present disclosure may be practiced equivalently or similarly utilizing other types of conductive modifiers.

[0094] The disentangled conductive modifiers can be electrically conductive and can dissipate static electricity buildup. For example, the disentangled conductive modifiers may be aligned vertically relative to the deck area 104 to ground static electricity built up from securement and / or movement of the semiconductor components secured to the deck area 104 of the carrier assembly 100. Said another way, the disentangled conductive modifiers may be aligned such that an axis defined through each carbon nanotube, from one end to another end, is roughly orthogonal to the substantially flat surface of the deck area 104. In some embodiments, the conductive modifiers can be disentangled into conductive modifiers by preparing a solution of conductive modifiers in an acid and filtering the solution through a filter to collect the disentangled conductive221845941 19.1Our Ref. 129087.8006.W001(PATENT) modifiers to mix with a polymer material. Additionally or alternatively, disentangled conductive modifiers may also be resuspended or incorporated into another solution (e.g., a media or surfactant) to form the carbon nanotubes 114. In yet an additional embodiment, the carbon nanotubes 1 14 can include a polymer composite and raw conductive modifiers in the form of a DLC and can be disentangled and dispersed during processing of the polymer composite.

[0095] In some embodiments, the carbon nanotubes 1 14 can be primarily located on the deck area 104 of the carrier assembly 100. The carbon nanotubes 114 can, for example, incorporated into the deck area 104 as molten materials during a mixing stage of the manufacturing process as described in more detail with reference to Figures I Q- 12. Additionally or alternatively, the carbon nanotubes can be incorporated into one or more additional sides of the injection-molded component 102 using identical or generally similar processes.

[0096] In some embodiments, the conductive modifiers may be further oriented in an alignment step. For example, the conductive modifiers may be shaped into a horizontally or vertically aligned form using one or more alignment mechanisms, such as sonication and / or magnet-induced alignment. Additionally or alternatively, the additional alignment step can be performed after the conductive modifiers are resuspended to form the carbon nanotubes 114.

[0097] In some embodiments, the conductive modifiers may be further associated or functionalized with an electroactive material before being disentangled. For example, the conductive modifiers can be associated or functionalized with an electroactive material to enhance the electrical conductivity of the carbon nanotubes 1 14, and thus, the ability of the injection-molded component 102 to dissipate static electricity. The conductive modifiers can be functionalized with one or more electroactive materials such as transition metals or oxides of transition metals (e.g., Ru, Ir, W, Mo, Mn, Ni, Co, etc.). In some embodiments, the electroactive material may be a conducting polymer such as, for example, polyaniline, polyvinyl pyrrole, or polyacetylene. In some embodiments, the electroactive material may be a nanoparticle or a plurality of nanoparticles bound to the conductive modifiers. For example, in some embodiments,231845941 19.1Our Ref. 129087.8006.W001(PATENT) an electroactive nanoparticle may include materials such as SnO2, Li4Ti50u, silicon nanotubes, silicon nanoparticles, and various combinations thereof.

[0098] The carrier assembly 100 may also include one or more carrier components 1 12. These carrier components 112 may be parts of the injection-molded component 102. These carrier components 112 may extend outward from the outer edge 108 of the carrier assembly 100 or upward from the upper edge of the rim defined by the outer and inner edges 108, 110 of the carrier assembly 100. Moreover, these carrier components 1 12 may be designed to allow for easier transportation. For example, a pair of carrier components 1 12 may be arranged along opposing sides of the carrier assembly 100 to allow it (as well as any other carrier assemblies to which it is connected) to be transported with greater ease and efficiency. Each carrier component 112 may be formed into a shape that can be readily held (e.g., by an individual or a machine). Examples of such shapes include rectangular tabs / handles, semicircular tabs / handles, etc. At least some of the carrier components 1 12 could include a handle, a latch, a tab, or another known mechanism for assisting in the transportation of the carrier assembly 100. In some embodiments, each carrier component 1 12 separately engages the carrier assembly 100 (e.g., with screws that extend into threaded holes in the injection-molded component 102), while in other embodiments the carrier assembly 100 and carrier components 1 12 form a single monolithic component.

[0099] Figure 2A illustrates a top view of an example of the carrier assembly 100. Figure 2B illustrates a bottom view of the carrier assembly 100 of Figure 2A. Figure 2C illustrates a top view of an example of the carrier assembly 100. Figure 2D illustrates a bottom view of the carrier assembly 100 of Figure 2C. Figure 2E illustrates a top view of an example of the carrier assembly 100. Figure 2F illustrates a bottom view of the carrier assembly 100 of Figure 2E. Referring to Figures 2A-2F together, the carrier assembly 100 can include features that reduce or increase the effective ESD properties of the carrier assembly 100, allowing a user to produce the ideal ESD properties for the carrier assembly 100 based on the carried semiconductor component. For example, referring to Figures 2C and 2D, the carrier assembly 100 includes multiple protruding features 204 that impact the ESD properties of the carrier assembly 100 to produce desired ESD properties.241845941 19.1Our Ref. 129087.8006.W001(PATENT)[000100] Figure 3 is a flowchart of a process 300 for creating a carbon nanotube composite used to create an injection-molded component. Initially, a manufacturer can combine disentangled carbon nanotube fibers with a liquid to form a liquid-fiber solution (step 301 ). Then, the manufacturer can combine the liquid-fiber solution with a composite to form a carbon nanotube composite mixture (step 302). Next, the manufacturer can coagulate the carbon nanotube composite mixture to form a carbon nanotube composite concentrate (step 303). Then, the manufacturer can melt-mix the carbon nanotube composite concentrate to form a liquified media (step 303). Then, the manufacturer can injection mold an injection-molded component with the liquified media (step 304). Finally, the manufacturer can injection mold an injection-molded component with the liquified media (step 305). For example, the injection-molded component can be the injection-molded component 102.Overview of Carbon Nanotube Manufacturing[000101] Carbon nanotubes are currently manufactured as agglomerated nanotube balls or bundles. To reach the full potential of performance enhancement of conductive modifiers, the aspect ratio, also referred to as the length-to-diameter ratio, should be maximized for a given tube length. The maximum aspect ratio is reached when each nanotube is fully separated from another. A bundle of conductive modifiers, for example, has an effective aspect ratio in composites of the average length of the bundle divided by the bundle diameter. Carbon nanotubes can be classified by the number of walls in the tube (e.g., single-wall, double-wall, and multi-wall). Each wall of a carbon nanotube can be further classified into chiral or non-chiral forms. Separation of the separated conductive modifiers by chirality, length, diameter, or a combination thereof would be of considerable interest in the art to further take advantage of conductive modifiers’ electrical and mechanical properties.[000102] Various methods have been developed to debundle or disentangle conductive modifiers in solution. For example, conductive modifiers may be shortened extensively by aggressive oxidative means and then dispersed as individual nanotubes in a dilute solution. However, these tubes have low aspect ratios that are not suitable for integration into high-strength composite materials. Carbon nanotubes may also be dispersed in a very dilute solution as individuals by sonication in the presence of a251845941 19.1Our Ref. 129087.8006.W001(PATENT) surfactant. Illustrative surfactants used for dispersing conductive modifiers in aqueous solution include, for example, sodium dodecyl sulfate or cetyltrimethyl ammonium bromide. In some instances, solutions of individualized conductive modifiers may be prepared from polymer-wrapped conductive modifiers. Individualized single-wall carbon nanotube solutions have also been prepared in very dilute solutions using polysaccharides, polypeptides, water-soluble polymers, nucleic acids, DNA, polynucleotides, polyimides, and polyvinylpyrrolidone.[000103] Nevertheless, utilization of conductive modifiers in these applications has been hampered due to the general inability to reliably produce individualized conductive modifiers. For example, the load transfer to conductive modifiers in polymer composites is typically less than would be expected if the conductive modifiers were fully separated as individual nanotubes. Likewise, in applications involving electrical conduction, conductivity is lower than anticipated due to reduced access to the carbon nanotube's surface when the conductive modifiers are agglomerated as opposed to being dispersed as individuals. Furthermore, when mixtures of conducting and non-conducting or semiconducting conductive modifiers (i.e. , conductive modifiers having a mixture of chirality) are used in applications involving electrical conduction, conductivity is less than could be achieved were all the conductive modifiers were electrical conductors. As noted above, current methods for producing separated conductive modifiers usually result in shortening or functionalization of the nanotubes. Thus, current methods for disentangling conductive modifiers contribute to the limited commercial application of conductive modifiers, especially for use in rigid apparatuses such as carrier assemblies for semiconductor components.[000104] Figure 4A illustrates an example of entangled conductive modifiers 402. Figure 4B illustrates an example of disentangled (also referred to as “aligned”) conductive modifiers 402. Figure 5 includes information on which materials may be suitable as conductive modifiers 402 (and which materials may not be suitable as conductive modifiers 402, but could instead be used as conductive isolators or insulators). More specifically, conductive modifiers 402 can be selected from materials that are conductors having low electrical resistance.261845941 19.1Our Ref. 129087.8006.W001(PATENT)Additional Embodiments of Carrier Assembly with Improved ESP Properties[000105] Figure 6 depicts an example of a carrier assembly 600 that includes a primary injection-molded component 602 with a continuous deck area 604 that includes a carbon nanotube coating 614 and is overmolded with a secondary injection-molded component 606 (also referred to as the “overmold”). The carrier assembly 600 can include some features that are at least generally similar in structure and function, or identical in structure and function, to the corresponding features of the carrier assembly 100 described in detail above with reference to Figures 1-2F, and can operate in a generally similar or identical manner to the carrier assembly 100. For example, to comply with various JEDEC-imposed standards, the carrier assembly 600 may be comprised of disentangled conductive modifiers in the form of the carbon nanotube coating 614.[000106] When a semiconductor component is set on the secondary injection-molded component 606 within the deck area 604 of the primary injection-molded component 602, the surface of the deck area 604 may be substantially parallel to the bottom surface of the semiconductor component and substantially perpendicular to the outer edge of the semiconductor component.[000107] As described herein, bundled conductive modifiers can be debundled or disentangled to produce individual conductive modifiers. The carbon nanotube coating 614 can include a plurality of disentangled carbon nanotube from the bundled conductive modifiers. The bundled conductive modifiers can be present in a variety of forms, including, for example, soot, powder, fibers, bucky paper, etc. Furthermore, the bundled conductive modifiers may be of any length, diameter, or chirality, and may be metallic, semi-metallic, semi-conducting, or non-metallic based on their chirality and number of walls. In various embodiments, the carbon nanotube coating 614 includes disentangled conductive modifiers from metallic, semi-metallic, or semi-conducting conductive modifiers such that the carbon nanotube coating 614 can dissipate static electricity build up from the components of the carrier assembly 600 into the primary injection-molded component 602. The bundled and / or disentangled conductive modifiers may include, for example, single-wall conductive modifiers (SWNTs), double-271845941 19.1Our Ref. 129087.8006.W001 (PATENT) wall conductive modifiers (DWNTs), multiwall conductive modifiers (MWNTs), shortened conductive modifiers, oxidized conductive modifiers, functionalized conductive modifiers, and combinations thereof. The conductive modifiers or combination of conductive modifiers selected to disentangle can depend on the size of the carrier assembly 600 and / or the number of semiconductors the carrier assembly 600 is configured to transport. It is worth noting that although some of the embodiments of the present disclosure are discussed utilizing a particular type of carbon nanotube, the embodiments of the present disclosure may be practiced equivalently or similarly utilizing other types of conductive modifiers.[000108] The disentangled conductive modifiers can be electrically conductive and can dissipate static electricity buildup. For example, the disentangled conductive modifiers may be aligned vertically relative to the deck area 604 to ground static electricity built up from securement and / or movement of the secondary injection-molded component 606 and / or the semiconductor components secured to the deck area 604 of the carrier assembly 600. Said another way, the disentangled conductive modifiers may be aligned such that an axis defined through each carbon nanotube, from one end to another end, is roughly orthogonal to the substantially flat surface of the deck area 604. The conductive modifiers can be disentangled using one or more processes including suspending the conductive modifiers in a solution containing nanocrystalline material, hydroxyapatite, and / or a nanorod material, precipitating the disentangled conductive modifiers from the solution, and isolating the disentangled conductive modifiers to mix with a polymer material and form a polymer composite (e.g., a carbon nanotube coating 614 in the form of a foam made from polyurethane). Additionally or alternatively, disentangled conductive modifiers may also be resuspended or incorporated into another solution (e.g., a media or surfactant) to form the carbon nanotube coating 614. In yet an additional embodiment, the carbon nanotube coating 614 can include a polymer composite and raw conductive modifiers in the form of a DLC can be disentangled and dispersed during processing of the polymer composite.[000109] In some embodiments, the conductive modifiers may be further oriented in an alignment step. For example, the conductive modifiers may be shaped into a horizontally or vertically aligned form using one or more alignment mechanisms, such281845941 19.1Our Ref. 129087.8006.W001(PATENT) as sonication and / or magnet induced alignment. Additionally or alternatively, the additional alignment step can be performed after the conductive modifiers are resuspended to form the carbon nanotube coating 614 and / or after the carbon nanotube coating 614 is applied to the deck area 604.[000110] In some embodiments the secondary injection-molded component 606 is overmolded along a portion of the deck area 604, while in other embodiments the secondary injection-molded component 606 is overmolded along the entirety of the deck area 604 (e.g., as a single continuous sheet). The secondary injection-molded component 606 may be tacky along both sides due to its constituent material(s). That is, the secondary injection-molded component 606 may have a first tacky surface in contact with the deck area 604 (e.g., the side of the deck area 604 covered by the carbon nanotube coating 614) and a second tacky surface in contact with the bottom surface(s) of the semiconductor component(s) affixed within the deck area 604. In some embodiments, an adhesive film is secured along the first tacky surface of the secondary injection-molded component 606 to promote adhesion to the primary injection-molded component 602. The adhesive film can be comprised of any suitable adhesive material having sufficient adhesiveness. For example, the adhesive film may be comprised of a polymer-based adhesive. An adhesive film may be placed between the primary and secondary injection-molded components 602, 606 if, for example, the fit of these components is imprecise, the components are created in separate injection molding processes, etc.[000111] In some embodiments, the secondary injection-molded component 606 is only tacky along a single side (e.g., the outward-facing side to which semiconductor components are secured). In such embodiments, the primary injection-molded component 602 may include one or more fastening mechanisms to hold the secondary injection-molded component 606 against the top surface of the deck area 604. Examples of fastening mechanisms include clasps, clips, and tabs. Additionally or alternatively, the primary injection-molded component 602 may include one or more anchor points to which the secondary injection-molded component 606 can be secured. For example, the primary injection-molded component 602 may include one or more holes within the deck area 604 that are capable of receiving protrusions along the291845941 19.1Our Ref. 129087.8006.W001(PATENT) bottom surface of the secondary injection-molded component 606. Those skilled in the art will recognize that a variety of structural features could be used to maintain the arrangement of the primary and secondary injection-molded components 602, 606. Examples of such structural features include indentations (also referred to as “notches”), flanges, kinematic nests, slots, shoulders, etc.[000112] In some embodiments, the primary injection-molded component 602 includes a pre-molded area to receive the secondary injection-molded component 606. For example, the deck area 604 may include a 10-inch by 10-inch depression in which the secondary injection-molded component 606 can be placed. In some embodiments, at least one side of the depression is aligned with the inner edge 610 of the rim, while in other embodiments, the depression is offset from the inner edge 610 of the rim. As another example, the deck area 604 may include a series of cavities, each of which is designed to hold a separate semiconductor component. In some embodiments each cavity includes a separate secondary injection-molded component, while in other embodiments a single secondary injection-molded component overlays all of the cavities.[000113] The secondary injection-molded component 606 may be sized in such a manner to restrict subsequent movement. For example, the secondary injection-molded component 606 may be injected / secured such that it contacts at least a portion of the sidewall defined by the inner edge 610. Alternatively, the secondary injection-molded component 606 may be injected / secured such that it does not contact the sidewall defined by the inner edge 610. Thus, the secondary injection-molded component 606 may only be in contact with the deck area 604 of the primary injection-molded component 602.[000114] The secondary injection-molded component 606 can be comprised of any suitable material having sufficient tackiness for securing semiconductor components placed thereon. For example, the secondary injection-molded component 606 may be comprised of a thermoplastic elastomer (also referred to as a “thermoplastic rubber”). Examples of thermoplastic elastomers include styrenic block copolymers (TPS), thermoplastic polyolefin elastomers (TPO), thermoplastic vulcanizates (TPV),301845941 19.1Our Ref. 129087.8006.W001(PATENT) thermoplastic polyurethanes (TPU), thermoplastic copolyesters (TPC), and thermoplastic polyamides (TPA). The secondary injection-molded component 606 can be ejected onto, or installed on, the primary injection-molded component 602 such that the entirety of the deck area 604 - including any structural features such as JEDEC- compliant punched cavities - is covered. Thus, the entire deck area 604 may be overmolded with the secondary injection-molded component 606. In some embodiments, the secondary injection-molded component 606 may itself include cavities designed to receive semiconductor components. For example, the secondary injection-molded component 606 may include one or more circular cavities that are sized to receive circular semiconductor components, one or more rectangular cavities that are sized to receive rectangular semiconductor components, or any combination thereof.[000115] The secondary injection-molded component 606 may be a rubber-like thermoplastic elastomer that is affixed to at least a portion of the top surface of the primary injection-molded component 602 as a single continuous sheet without any breaks. This can be done in several different ways, including via an overmolding process, a lamination process, a spray process, or a co-extrusion process. Additionally or alternatively, the carbon nanotube coating 614 can be applied to one or more sides of the secondary injection-molded component 606 in addition to or as opposed to the carbon nanotube coating 614 applied to the primary injection-molded component 602. In some embodiments, a top cover (not shown) is affixed to the top surface of the secondary injection-molded component 606. The top cover may be removed from the top surface of the secondary injection-molded component 606 before any semiconductor components are affixed to the secondary injection-molded component 606 (and thus to the carrier assembly 600). Those skilled in the art will recognize that the top cover may not always be present. For example, the top cover may be unnecessary if semiconductor components are to be secured to the secondary injection- molded component 606 soon after the secondary injection-molded component 606 is overmolded to the top surface of the primary injection-molded component 602.[000116] The carrier assembly 600 may also include one or more carrier components 612. These carrier components 612 may be parts of the primary injection-molded311845941 19.1Our Ref. 129087.8006.W001(PATENT) component 602 and / or the secondary injection-molded component 606. These carrier components 612 may extend outward from the outer edge 608 of the carrier assembly 600 or upward from the upper edge of the rim defined by the outer and inner edges 608, 610 of the carrier assembly 600. Moreover, these carrier components 612 may be designed to allow for easier transportation. For example, a pair of carrier components 612 may be arranged along opposing sides of the carrier assembly 600 to allow it (as well as any other carrier assemblies to which it is connected) to be transported with greater ease and efficiency. Each carrier component 612 may be formed into a shape that can be readily held (e.g., by an individual or a machine). Examples of such shapes include rectangular tabs / handles, semicircular tabs / handles, etc. At least some of the carrier components 612 could include a handle, a latch, a tab, or another known mechanism for assisting in the transportation of the carrier assembly 600. In some embodiments each carrier component 612 separately engages the carrier assembly 600 (e.g., with screws that extend into threaded holes in the primary or secondary injection- molded components 602, 606), while in other embodiments the carrier assembly 600 and carrier components 612 form a single monolithic component.[000117] Figure 7 illustrates a vertical section view of the carrier assembly 600 taken along line B of Figure 6. As noted above, the secondary injection-molded component 606 can be integrally mounted along the top surface of the primary injection-molded component 602 that includes the carbon nanotube coating 614. The secondary injection-molded component 606 may be secured to the primary injection-molded component 602 such that it is substantially flush with the deck area 604 of the carrier assembly 600. For example, the primary injection-molded component 602 may be overlaid with a thermoplastic elastomer that represents the secondary injection-molded component 606 during an overmolding process.[000118] Figure 8 illustrates a horizontal sectional view of the carrier assembly 600 taken along line A of Figure 6. As noted above, the carrier assembly 600 may include a rim 802 that extends around at least a portion of the periphery of the deck area 604 in which semiconductor components can be secured. In some embodiments, the rim 802 includes one or more interlock components to facilitate a stable connection with an adjacent carrier assembly. As shown in Figure 8, the interlock component(s) can include321845941 19.1Our Ref. 129087.8006.W001(PATENT) protruding features 804 and / or indentations 806 designed to complement protruding features. These interlock component(s) can be arranged along the upper surface of the rim 802, the bottom surface of the carrier assembly 600, or any combination thereof. Thus, the interlock component(s) may be useful in ensuring stable connections are made with upwardly adjacent carrier assemblies and / or downwardly adjacent carrier assemblies. The rim 802 and the protruding features 804 can also be covered in the carbon nanotube coating 614 on the top surface and / or bottom surface.[000119] The interlock component(s) may also make the carrier assembly 600 more suitable to be used in future processes. For example, when the carrier assembly 600 is used for storage or transport, it may be beneficial to stack a series of carrier assemblies on top of one another. Having a locking mechanism would ensure that these carrier assemblies do not move in such a manner that would damage the semiconductor components secured therein. While the interlock component(s) represent passive locking mechanisms, those skilled in the art will recognize that more active locking mechanisms could also be used. For example, each carrier assembly may include a latch that can be used to actively secure it to another carrier assembly. As another example, when a mechanical device is needed to remove the semiconductor components from the carrier assembly 600, the interlock component(s) may serve as a support structure capable of mechanically interfacing with the mechanical device. For instance, a robotic arm may use an indentation for balance, a protruding feature for positional reference, etc.[000120] In some embodiments, the top surface of the rim 802 is substantially coplanar with the top surface of any semiconductor components secured within the carrier assembly 600. Thus, the height of the rim 802 may be based on the thickness of the semiconductor components to be secured within the carrier assembly 600. In other embodiments, the top surface of the rim 802 is higher than the top surface of any semiconductor components secured within the carrier assembly 600. Such a design causes a space to be formed between the top surface of each semiconductor component and the bottom surface of an upwardly adjacent carrier assembly, which may limit the likelihood of damage to the semiconductor components due to an external force applied by the upwardly adjacent carrier assembly.331845941 19.1Our Ref. 129087.8006.W001(PATENT)[000121] Figure 9 includes an exploded view of multiple carrier assemblies 900a-b stacked in preparation for handling, transporting, and / or storing semiconductor components. The carrier assemblies 900a-b can be identical or generally similar to the carrier assembly 100 of Figures 1-2F or any of the other carrier assemblies described herein. A first interlock component 902 disposed along the top surface of one carrier assembly 900b may interface with a second interlock component 904 disposed along the bottom surface of another carrier assembly 900a when the carrier assemblies 900a- b are brought within close proximity of one another.[000122] Each carrier assembly 900a-b has a top surface 906a-b and a bottom surface 908a-b. The top surface 906a-b may be defined by the planar surface of the uppermost point of the carrier assembly 900a-b. For example, the top surface 906a-b may correspond to the planar surface of the rim (i.e., while ignoring any indentations). The top surfaces 906a-b can include carbon nanotube coatings 914a-b that are identical or generally similar to the carbon nanotubes 114 of Figures 1-2F, the carbon nanotube coating 614 of Figures 6-8, and / or any other carbon nanotube coating and / or composite discussed herein. The bottom surface 908a-b may be defined by the planar surface of the lowermost point of the carrier assembly 900a-b. In some embodiments, the lowermost point of the carrier assembly 900a-b is the bottom surface of the primary injection-molded component, while in other embodiments, the lowermost point of the carrier assembly 900a-b is the planar surface of an interlock component (e.g., a protruding feature) that extends away from the bottom surface of the primary injection- molded component. It is worth noting that although the carbon nanotube coatings 914a- b are depicted on the top surfaces 906a-b, the carbon nanotube coatings 914a-b can also be on the bottom surfaces 908a-b and / or on one or more additional surfaces of the carrier assemblies 900a-b. Additionally or alternatively, a plurality of disentangled conductive modifiers can be incorporated within the materials that make up one or more of the components of the carrier assemblies 900a-b, as described in greater detail above with reference to Figures 1-3.[000123] As shown in Figure 9, the bottom surface of each carrier assembly 900a-b may include interlock component(s) designed to engage complementary interlock component(s) of a downwardly adjacent carrier assembly. Similarly, the top surface of341845941 19.1Our Ref. 129087.8006.W001(PATENT) each carrier assembly may include interlock component(s) designed to engage complementary interlock component(s) of an upwardly adjacent carrier assembly. Together, these interlock components enable adjacent carrier assemblies to be mechanically coupled to each other in a detachable manner without increasing the risk of harming the semiconductor components stored therein. Additionally or alternatively, the carbon nanotube coatings 914a-b can provide improved mechanical, electrical, and / or thermal properties to the carrier assemblies 900a-b that can decrease the likelihood of harming the semiconductor components stored therein. For example, the carbon nanotube coatings 914a-b can dissipate static electricity build up from transporting multiple semiconductor components on multiple carrier assemblies.[000124] The interlock components 902, 904 may represent two different types of interlock components. The first type of interlock component extends away from a reference surface. Examples of the first type of interlock component include protrusions, projections, pins, etc. The second type of interlock component is designed to receive an interlock component of the first type. Examples of the second type of interlock component include notches, slots, recesses, etc.[000125] Generally, the first interlock component 902 and the second interlock component 904 are different types of interlock components. Here, for example, the first interlock component 902 is an interlock component of the first type (e.g., a protrusion), while the second interlock component is an interlock component of the second type (e.g., a notch). Accordingly, the first interlock component 902 can engage a corresponding interlock component of the second type on an upwardly adjacent carrier assembly, while the second interlock component 904 can engage a corresponding interlock component of the first type on a downwardly adjacent carrier assembly.[000126] While the interlock components shown in Figure 9 extend around the entirety of the top surfaces 906a-b and bottom surfaces 908a-b of the carrier assemblies 400a- b, those skilled in the art will recognize that other designs are possible. For example, each carrier assembly 900a-b may include a specified number of interlock components (e.g., one, two, four, or eight) arranged along the top surface 906a-b and / or the bottom surface 908a-b. These interlock component(s) can be positioned in different351845941 19.1Our Ref. 129087.8006.W001(PATENT) arrangements. For example, each carrier assembly 900a-b could include a pair of interlock components of the first type on opposing edges along the top surface 906a-b and a pair of interlock components of the second type on opposing edges along the bottom surface 908a-b. As another example, each carrier assembly 900a-b could include four interlock components equally distributed along the top surface 906a-b and four interlock components equally distributed along the bottom surface 908a-b. To allow for easier stacking, the number of interlock component(s) along the top surface 906a-b and the bottom surface 908a-b are usually the same. However, that need not necessarily be the case. For example, the carrier assemblies 900a-b may include two interlock components along the top surface 906a-b and four interlock components along the bottom surface 908a-b. Such a design may permit the interlock components along the top surface 906a-b to be engaged with the interlock components along the bottom surface 908a-b in several different ways (e.g., to allow for variation in arranging the carrier assemblies 900a-b).[000127] Figure 10 depicts an example of a carrier assembly 1000 that includes a primary injection-molded component 1002 with a continuous deck area 1004 that is overmolded to make the secondary injection-molded component 1006. The carrier assembly 1000 can be identical to or generally similar to the carrier assembly 100 of Figures 1-2F except that rather than having a carbon nanotube coating (e.g., the carbon nanotubes 1 14 of Figures 1-2F) applied to one or more surfaces of the carrier assembly 1000, the primary injection-molded component 1002 can include a plurality of disentangled conductive modifiers mixed into a substrate. For example, the primary injection-molded component 1002 may be comprised of multiple materials mixed together, such as a first material that is a polymer mixed together with a second material that includes conductive modifiers before being injection into a mold to take its final form.[000128] Multiple methods can be used to mix the conductive modifiers with a polymer to make the primary injection-molded component 1002. The polymer could be, for example, polycarbonate, PPE, PPO, PPS, a thermoplastic such as polyethylene or polypropylene, liquid crystal polymer, or ECTFE. Generally, the polymer selected for the primary injection-molded component 1002 is more rigid than the polymer selected for361845941 19.1Our Ref. 129087.8006.W001(PATENT) the secondary injection-molded component 1006. The process for dispersing the conductive modifiers into the polymer can include soaking and / or agitating entangled conductive modifiers in a first medium comprising at least one aqueous solution at a temperature above about 25°C. The entangled conductive modifiers in the first medium can be phase transferred into a second medium comprising an oil solution. In some embodiments, the oil solution can be the oil substance in a DLC containing conductive modifiers. As described herein, the DLC can include raw conductive modifiers dried in an oil substance (e.g., a processing oil) that can be readily incorporated into a polymer substance during processing and prior to injection molding. Additionally or alternatively, the conductive modifiers in the DLC can be oxidized and / or disentangled conductive modifiers. Once transferred, the conductive modifiers can be mixed into the second medium at a selected shear condition and at a temperature above about 25°C. Then excess or separated aqueous solution from the second medium can be removed, and the remaining substances can be mixed together using generally higher shear conditions to form a final polymer / dispersed conductive modifiers formulation. For example, the shear conditions can be the shear conditions used in standard polymer compounding equipment. The final polymer / dispersed conductive modifiers formulation may then be injected into a mold to form the primary injection-molded component 1002.[000129] Figure 11 illustrates a vertical section view of the carrier assembly 1000 taken along line B of Figure 10. As noted above and described in more detail with reference to Figure 2, the secondary injection-molded component 1006 can be integrally mounted along the top surface of the primary injection-molded component, including conductive modifiers 1 102 such that it is substantially flush with the deck area 1004 of the carrier assembly 1000. For example, the primary injection-molded component 1002 may be overlaid with a thermoplastic elastomer that represents the secondary injection-molded component 1006 during an overholding process. In some embodiments, the secondary injection-molded component 1006 can be a thermoplastic elastomer / carbon nanotube mixture made in a process generally similar to the process used to make the primary injection-molded component 1002 in Figure 10 and as described in more detail with reference to Figures 16-18.371845941 19.1Our Ref. 129087.8006.W001(PATENT)[000130] As shown in Figure 1 1 , the primary injection-molded component 1002 can include a plurality of conductive modifiers 11 10 in the form of continuous vertically aligned fibers. Additionally or alternatively, the conductive modifiers 11 10 can be discontinuously aligned, such that the conductive modifiers 11 10 are evenly dispersed and horizontally and / or vertically aligned, but not necessarily in complete fibril strands. It can be advantageous to have the conductive modifiers 1110 continuously aligned as fibril stands to provide generally greater reinforcement to the primary injection-molded component 1002. Additionally or alternatively, aligning the fibrils throughout the primary injection-molded component 1002 can enable the conductive modifiers 1 102 to direct static electricity from the top surface (i.e. , where the semiconductor components are located) to a ground (e.g., the bottom surface of the primary injection-molded component including conductive modifiers 1 102).[000131] Figure 12 illustrates a horizontal sectional view of the carrier assembly 1000 taken along line A of Figure 10. As noted above, the carrier assembly 1000 may include a rim 1202 that extends around at least a portion of the periphery of the deck area 1004 and protruding features 1204 and / or indentations 1206 designed to interlock with an adjacent carrier assembly. The rim 1202, the protruding features 1204, and the indentations 1206 can be identical or generally similar to the rim 802, the protruding features 804, and the indentations 806 of Figure 8, except that the primary injection component 1002 includes a plurality of vertically aligned, disentangled conductive modifiers.[000132] Figure 13 includes a top plane view of a carrier assembly 1300 that includes a primary injection-molded component 1302 with a deck area 1304 on which a secondary injection-molded component 1306 has been mounted. In some embodiments, the primary injection-molded component 1302 of the carrier assembly 1300 includes the carbon nanotubes, as described in more detail with reference to Figures 1-2F. Additionally or alternatively, the primary injection-molded component 1302 can be made of a polymer / carbon nanotube mixture, as described in more detail with reference to Figures 10-12.381845941 19.1Our Ref. 129087.8006.W001(PATENT)[000133] In some embodiments, the primary injection-molded component 1302 includes structural ejector features 1308 (or simply “ejector features”) that can be used to facilitate removal from the mold so as to prevent marking from the ejector pins (also called “push pins”). Rather than apply pressure to the deck area 1304, the ejector pins can instead apply pressure to these ejector features 1308. As shown in Figure 13, these ejector features 1308 may be arranged around the periphery of the deck area 1304 so as not to interfere with any semiconductor components mounted therein. Additionally or alternatively, ejector features may be located elsewhere on the primary injection-molded component 1302. The ejector features 1308 and / or the ejector pins can include a carbon nanotube coating or can be made from a polymer / carbon nanotube mixture to provide structural reinforcement, as described herein.[000134] In some embodiments, the secondary injection-molded component 1306 is affixed to the deck area 1304 using one or more securement mechanisms (not shown) configured to apply downward pressure to the secondary injection-molded component 1306. For example, a series of securement mechanisms designed to pinch the secondary injection-molded component 1306 in the form of a continuous sheet may be arranged along a periphery of the deck area 1304. Examples of securement mechanisms include components that operate similarly to paperclips, clamps, clasps, or binder clips. Additionally or alternatively, said components can include a carbon nanotube coating or can be made from a polymer / carbon nanotube mixture to enhance the structural properties of the components and / or to provide reinforcement. In many embodiments, the securement mechanisms are not necessary. Here, for example, the carrier assembly 1300 includes a series of cavities in which secondary injection-molded components 1306 have been integrated. Because the secondary injection-molded components 1306 are limited to the cavities in the deck area 1304, no securement mechanisms are necessary. Note that semiconductor components need not necessarily be secured to the series of secondary injection-molded components 1306 in a one-to- one manner. For example, a semiconductor component may be secured to a single secondary injection-molded component 1306 (and thus overlays a single cavity in the primary injection-molded component 1302), or a semiconductor component may be391845941 19.1Our Ref. 129087.8006.W001(PATENT) secured to multiple secondary injection-molded components 1306 (and thus overlays multiple cavities in the primary injection-molded component 1302).[000135] In some embodiments, the secondary injection-molded component 1306 is integrally secured along a central mounting portion of the carrier assembly 1300 during an overmolding process (also referred to as the “overmolding”) such that the secondary injection-molded component 1306 conforms to the deck area 1304 whose outer perimeter is defined by the inner edge 1312. As discussed above, the secondary injection-molded component 1306 may extend across the entire deck area 1304 as a single continuous sheet. Alternatively, a series of secondary injection-molded components (also referred to as “patches of secondary injection-molded media”) may be secured within the deck area 1304. When a semiconductor component is secured within the deck area 1304, a protruding feature disposed along the outer surface of the semiconductor component may pierce the secondary injection-molded component 1306. In such embodiments, the primary injection-molded component 1302 and / or secondary injection-molded component 1306 may include a complementary feature (e.g., a notch) designed to receive the protruding feature of the semiconductor component.[000136] The surface adhesion (also referred to as “tackiness”) of the secondary injection-molded component 1306 can hold the semiconductor components in place as the carrier assembly 1300 is moved. For example, the secondary injection-molded component 1306 can hold one or more semiconductor components in a specified orientation while handling, transporting, or storing the semiconductor component(s). Moreover, the secondary injection-molded component 1306 may be designed such that the semiconductor component(s) can be readily separated / detached from the carrier assembly 1300, either manually or automatically. The secondary injection-molded component 1306 can ensure that the semiconductor component(s) do not substantially move when the carrier assembly 1300 is rotated along the x-axis, y-axis, or z-axis, or moved vertically / ho rizontal ly with respect to, for example, an automatic-placement machine.401845941 19.1Our Ref. 129087.8006.W001 (PATENT) [000137] As further discussed below, the secondary injection-molded component 1306 can be overmolded to the deck area 1304 in a single continuous flow along the entire length of the carrier assembly 1300. For example, a liquified thermoplastic elastomer may be spread in the deck area 1304 such that the secondary injection-molded component 1306 is formed across the entire length of the carrier assembly 1300 including any cavities, such as pre-formed, JEDEC-compliant cavities. In some embodiments, the secondary injection-molded component 1306 comprises multiple overmolded materials. For example, multiple overmolding processes may be performed in succession to create a secondary injection-molded component 1306 with one or more layers and / or one or more additional injection-molded components. For example, an additional layer of thermoplastic elastomer can be overmolded on the deck area 1304 to form a tertiary injection-molded component, as described in more detail with reference to Figures 15-19B. Additionally or alternatively, the secondary injection-molded component 1306 can comprise a series of injection-molded sheets layered on the deck area 1304 of the primary injection-molded component 1302. For example, the secondary injection-molded component 1306 may be one or more layers of thermoplastic elastomer overmolded on the deck area 1304.[000138] Generally, the secondary injection-molded component 1306 does not cover the side portions along the outer edge 1310 of the carrier assembly 1300. Said another way, the secondary injection-molded component 1306 will typically not extend up the sidewall of the rim defined by the outer and inner edges 1310, 1312. However, in some embodiments, the secondary injection-molded component 1306 does at least partially cover the sidewalls of the rim extending around the deck area 1304. Together, the primary and secondary injection-molded components 1302, 1306 form the carrier assembly 1300 that can be used to universally transport items (e.g., singulated silicon components or silicon die of the same or different sizes) as necessary for manufacturing, shipping, and / or storing. The addition of the secondary injection-molded component 1306 may enable the carrier assembly 1300 to transport items of different sizes, unlike conventional carrier trays that are designed for semiconductor components of a particular size.411845941 19.1Our Ref. 129087.8006.W001(PATENT)[000139] As shown in Figure 13, the deck area 1304 of the primary injection-molded component 1302 may include a series of secondary injection-molded components 1306 in some embodiments. Here, for example, secondary injection-molded components 1306 are secured to structural mounting features (or simply “mounting features”) having a circular shape. Those skilled in the art will recognize that other shapes may be more appropriate in certain situations. For example, the deck area 1304 could instead include rectangular mounting features. Moreover, the deck area 1304 could include mounting features of multiple shapes if, for example, the carrier assembly 1300 is designed for multiple types of semiconductor components. The pattern of mounting features across the deck area 1304 may be regular or random. Here, for example, the mounting features are laid out in a columnar format. In other embodiments, the mounting features may be laid out in an offset columnar format (e.g., where the mounting features in one row or column are offset from the mounting features in the adjacent rows or columns). Alternatively, the mounting features may be randomly arranged about the deck area 1304. In some embodiments, the mounting features can include a carbon nanotube coating or can be made from a polymer / carbon nanotube mixture to enhance structural properties of the mounting features and / or to provide reinforcement.[000140] Mounting features may extend upward from the planar surface of the deck area 1304 so as to form extrusions upon which secondary injection-molded components 1306 can be secured. Additionally or alternatively, mounting features may extend downward from the planar surface of the deck area 1304 so as to form cavities in which secondary injection-molded components 1306 can be secured. A single carrier assembly may include “upward” mounting features, “downward” mounting features, or any combination thereof. The height of these mounting features may be random, regular, or a combination thereof. For example, all of the mounting features to which secondary injection-molded components 1306 are to be secured may have a consistent height. As another example, the mounting features to which secondary injection-molded components 1306 are to be secured may have random or semi-random heights. There may be a systematic pattern in how the heights are selected in some embodiments. For example, all of the mounting features in the same row or column may have the same height, though the mounting features in adjacent rows or columns may have different421845941 19.1Our Ref. 129087.8006.W001 (PATENT) heights. For instance, the heights of the mounting features may increase progressively from one side of the deck area 1304 to the other. Alternatively, the heights of the mounting features may be selected at random. Note that the term “height,” as used in this context, is also intended to cover depth. As such, the use of the term “height” does not refer solely to “upward” mounting features but also covers “downward” mounting features.[000141] In Figure 13, the material(s) from which the secondary injection-molded components 1306 are comprised are deposited only onto the mounting features. However, those skilled in the art will recognize that the material could instead be deposited over the mounting features and intervening spaces. In such a scenario, a single secondary injection-molded component could be described as being “draped over” the deck area of the primary injection-molded component 1302, including any mounting features.[000142] As noted above, a carrier assembly comprised of primary and secondary injection-molded components can be created in several different ways.[000143] Figure 14A includes a sectional view depicting the pre-forming of a carrier assembly 1400 that includes a secondary injection-molded component 1404 connected to a primary injection-molded component 1402. When the secondary injection-molded component 1404 overlays the primary injection-molded component 1402 as shown in Figure 14A, the carrier assembly 1400 may be described as “tiered.” This “tiering” will be especially notable if, as mentioned above, the secondary injection-molded component overlays one or more mounting components that extend upward from the deck area of the primary injection-molded component 1402.[000144] In some embodiments, the secondary injection-molded component 1404 is not perfectly integrated with the primary injection-molded component 1402. For example, if the secondary injection-molded component 1404 is formed by depositing a liquified thermoplastic elastomer on the primary injection-molded component 1402, then surface features may result in imperfections such as small air gaps between the primary and secondary injection-molded components 1402, 1404. As another example, a protruding feature disposed along the outer surface of a semiconductor component may431845941 19.1Our Ref. 129087.8006.W001(PATENT) pierce the secondary injection-molded component 1404 when interconnected with an indentation in the primary injection-molded component 1402.[000145] Figure 14B includes a sectional view depicting a carrier assembly 1400 with a secondary injection-molded component 1454 integrally molded onto a primary injection- molded component 1452 using one or more mounting components. In contrast to the carrier assembly 1400 of Figure 14A, the molded carrier assembly 1400 shown here may be formed by integrally molding the secondary injection-molded component 1454 onto the primary injection-molded component 1452 during a lamination process.[000146] Regardless of how the carrier assembly is formed, the secondary injection- molded component 1404, 1454 may take the form of the deck area of the primary injection-molded component 1402, 1452. For example, if the primary injection-molded component 1402, 1452 includes a series of cavities as shown in Figure 13, then the secondary injection-molded component 1404, 1454 may conform to each of those cavities. In some embodiments, the primary injection-molded component 1402, 1452 is formed from a polymer / carbon nanotube mixture as described in Figures 10-12. Additionally or alternatively, the deck area may be covered in a carbon nanotube coating as described in Figures 6-13. The conductive modifiers can be vertically aligned relative to the deck area of the primary injection-molded component 1402, 1452 such that static electricity built up from movement of the semiconductor components secured to the secondary injection-molded component 1404, 1454 and / or static electricity built up from movement of any other components of the carrier assembly 1400, 1450 is grounded.[000147] As shown in Figures 14A and 14B, the primary injection-molded component 1402, 1452 may include one or more cavities 1406, 1456 into which a material (e.g., liquified thermoplastic elastomer) that forms the secondary injection-molded component 1404, 1454 can flow. As the material hardens, anchoring features along the bottom of the secondary injection-molded component 1404, 1454 will form within these cavities 1406, 1456. In essence, these anchoring features are representative of “feet” that serve to anchor the secondary injection-molded component 1404, 1454 to the primary injection-molded component. The cavities could be, for example, notches, holes, or441845941 19.1Our Ref. 129087.8006.W001 (PATENT) slots. The shape of the cavities 1406, 1456 (and thus the resulting anchoring features of the secondary injection-molded component 1404, 1454) is generally not important as the material is sufficiently tacky to as to sufficiently adhere to the primary injection- molded component 1402, 1452. However, in some embodiments, it may be desirable to further improve adhesion by designing some or all of the cavities 1406, 1456 for improved gripping, reducing excess movement of components of the carrier assembly 1400, 1450, decreasing the amount of static electricity built up during transport, thereby decreasing the likelihood of damaging semiconductor components. For example, at least some of the cavities could be in the shape of an “L” or “+” to provide at least one horizontal channel in the primary injection-molded component 1402, 1452 into which the material can flow.[000148] Figure 15 depicts an example of a carrier assembly 1500 that includes a primary injection-molded component 1502 with a continuous deck area 1504 that is overmolded to make a secondary injection-molded component 1506. The carrier assembly 1500 can be identical to or generally similar to the carrier assemblies 100, 600, and 1000 of Figures 1-2E, 6-8, and 10-12, respectively, except that the secondary injection-molded component 1506 can include a plurality of disentangled conductive modifiers mixed into a substrate instead of, or in addition to, the conductive modifiers on or within the primary injection-molded component 1502. For example, the secondary injection-molded component 1506 may be comprised of a thermoplastic elastomer mixed together with conductive modifiers before being injected onto the deck area of the primary injection-molded component 1502 to take its final form. Additionally, the carrier assembly 1500 can include a tertiary injection-molded component 1516 that is overmolded onto the secondary injection-molded component 1506.[000149] The process for incorporating the conductive modifiers into the elastomer that comprises the secondary injection-molded component 1506 can be generally similar or identical to the processes described herein for incorporating conductive modifiers into a polymer / carbon nanotube mixture for the primary injection-molded component 1502. The secondary injection-molded component 1506 can be a thermoplastic elastomer, styrenic block copolymer, thermoplastic polyolefin elastomer, thermoplastic vulcanizate, thermoplastic polyurethane, thermoplastic copolyester, thermoplastic polyamide, and / or451845941 19.1Our Ref. 129087.8006.W001 (PATENT) the like. Similarly, the tertiary injection-molded component 1516 can be a thermoplastic elastomer, styrenic block copolymer, thermoplastic polyolefin elastomer, thermoplastic vulcanizate, thermoplastic polyurethane, thermoplastic copolyester, thermoplastic polyamide, and / or the like. Generally, the polymer selected for the primary injection- molded component 1502 is more rigid than the polymers selected for the secondary injection-molded component 1506 and the tertiary injection-molded component 1516. In some embodiments, the secondary injection-molded component 1506 is generally more rigid than the tertiary injection-molded component 1516. Additionally or alternatively, the secondary injection-molded component 1506 and the tertiary injection-molded component 1516 can have generally the same rigidity. For example, the secondary injection-molded component 1506 and the tertiary injection-molded component 1516 can both be made from a thermoplastic elastomer, but only the secondary injection- molded component 1506 includes the conductive modifiers. In some embodiments, the secondary injection-molded component 1506 is a rubber-like component used to secure the semiconductor components to the carrier assembly 1500 for transport. Additionally or alternatively, and as shown in Figure 15, the carrier assembly 1500 can include the tertiary injection-molded component 1516 to provide an additional tacky upper surface for the semiconductor components to adhere to. In some embodiments, the tertiary injection-molded component 1516 can provide additional securement of the semiconductor components to the carrier assembly 1500, reducing the likelihood of semiconductor damage during transport.[000150] Figure 16 illustrates a vertical section view of the carrier assembly 1500 taken along line B of Figure 15. As noted above, the secondary injection-molded component 1506 can be integrally mounted along the top surface of the primary injection-molded component 1502 such that it is substantially flush with the deck area of the carrier assembly 1500. The tertiary injection-molded component 1516 can be mounted along the top surface of the secondary injection-molded component 1506 such that it is substantially flush with the top surface of the secondary injection-molded component 1506. For example, the primary injection-molded component 1502 may be overlaid with a thermoplastic elastomer / carbon nanotube mixture that represents the secondary injection-molded component 1506 during an overmolding process, and an additional461845941 19.1Our Ref. 129087.8006.W001(PATENT) overmold of thermoplastic elastomer that represents the tertiary injection-molded component 1516 can be overlaid on the secondary injection-molded component 1506.[000151] As shown in Figure 15, the secondary injection-molded component 1506 can include a plurality of conductive modifiers 1510 in the form of continuous or discontinuous vertically aligned fibers. It can be advantageous to have the conductive modifiers 1510 continuously aligned and evenly dispersed as fibril stands to provide generally greater reinforcement to the secondary injection-molded component 1506 and / or to enable the plurality of conductive modifiers 1510 to direct static electricity away from the top surface (i.e., where the semiconductor components are located) to a ground (e.g., the primary injection-molded component 1502), thereby reducing the likelihood of damage to the semiconductor components due to electrostatic discharge.[000152] Figure 17 illustrates a horizontal sectional view of the carrier assembly 1500 taken along line A of Figure 15. As noted above, the carrier assembly 1500 may include a rim 1702 that extends around at least a portion of the periphery of the deck area 1504 and protruding features 1704 and / or indentations 1706 designed to interlock with an adjacent carrier assembly. The rim 1702, the protruding features 1704, and the indentations 1706 can be identical or generally similar to the rim 802, the protruding features 804, and the indentations 806 of Figure 8 except that the carrier assembly includes the tertiary injection-molded component 1516 overlaid on the secondary injection-molded component 1506, and the secondary injection-molded component 1506, rather than the primary injection-molded component 1502, includes a plurality of vertically aligned, disentangled conductive modifiers.[000153] Figure 18 includes a top plane view of a carrier assembly 1800 that includes a primary injection-molded component 1802 with a deck area 1804 on which a secondary injection-molded component 1806, including conductive modifiers, has been mounted. The carrier assembly 1800 can be identical to or generally similar to the carrier assembly 1300 of Figure 13 except that the carrier assembly 1800 includes a tertiary injection-molded component 1816 mounted to the secondary injection-molded component 1806.471845941 19.1Our Ref. 129087.8006.W001(PATENT)[000154] In some embodiments, the tertiary injection-molded component 1816 is affixed to the secondary injection-molded component 1806 using one or more securement mechanisms (not shown) configured to apply downward pressure to the tertiary injection-molded component 1816. For example, a series of securement mechanisms designed to pinch the secondary injection-molded component 1806 and / or the tertiary injection-molded component 1816 in the form of a continuous sheet may be arranged along a periphery of the deck area 1804. Examples of securement mechanisms include components that operate similarly to paperclips, clamps, clasps, or binder clips. Additionally or alternatively, the carrier assembly 1800 includes a series of cavities in the secondary injection-molded component 1806 for the tertiary injection- molded components 1816. Since the tertiary injection-molded components 1816 are limited to the cavities in the secondary injection-molded component 1806, no securement mechanisms are necessary. It is worth noting that semiconductor components need not necessarily be secured to the series of tertiary injection-molded components 1816 in a one-to-one manner. For example, a semiconductor component may be secured to a single tertiary injection-molded component 1816 (and thus overlays a single cavity in the secondary injection-molded component 1806), or a semiconductor component may be secured to multiple tertiary injection-molded components 1816 (and thus overlays multiple cavities in the secondary injection-molded component 1806).[000155] In some embodiments, the secondary injection-molded component 1806 and / or the tertiary injection-molded component 1816 are integrally secured along a central mounting portion of the carrier assembly 1800 during an overmolding process such that the secondary injection-molded component 1806 conforms to the deck area 1804 and the tertiary injection-molded component 1816 (also referred to as the “additional overmold”) conforms to the secondary injection-molded component 1806. As discussed herein, the secondary injection-molded component 1806 and / or the tertiary injection-molded component 1816 may extend across the entire deck area 1804 as continuous sheets. Alternatively, a series of secondary injection-molded components (also referred to as “patches of secondary injection-molded media”) may be secured within the deck area 1804, and a series of tertiary injection-molded components (also481845941 19.1Our Ref. 129087.8006.W001 (PATENT) referred to as “patches of tertiary injection-molded media”) may be secured to the series of secondary injection-molded components. When a semiconductor component is secured within the deck area 1804, a protruding feature disposed along the outer surface of the semiconductor component may pierce the tertiary injection-molded component 1816 and / or the secondary injection-molded component 1806. In such embodiments, the primary injection-molded component 1802, the secondary injection- molded component 1806, and / or the tertiary injection-molded component 1816 may include a complementary feature (e.g., a notch) designed to receive the protruding feature of the semiconductor component.[000156] Similar to embodiments where semiconductor components are held in place by the secondary injection-molded component 1806, the tertiary injection-molded component 1816 can provide surface adhesion for the semiconductor components to adhere to, holding the semiconductor components in place as the carrier assembly 1800 is moved. For example, the tertiary injection-molded component 1816 can hold one or more semiconductor components in a specified orientation while handling, transporting, or storing the semiconductor component(s). Moreover, the tertiary injection-molded component 1816 may be designed such that the semiconductor component(s) can be readily separated / detached from the carrier assembly 1800, either manually or automatically. The tertiary injection-molded component 1816 can ensure that the semiconductor component(s) do not substantially move when the carrier assembly 1800 is rotated or moved vertically / horizontally.[000157] As discussed herein, after the secondary injection-molded component 1806 is overmolded to the deck area 1804 the tertiary injection-molded component 1816 can be overmolded to the secondary injection-molded component 1806 in a single continuous flow along the entire length of the carrier assembly 1800. For example, a liquified thermoplastic elastomer / carbon nanotube mixture may be spread in the deck area 1804 such that the secondary injection-molded component 1806 is formed across the entire length of the carrier assembly 1800 including any cavities for the tertiary injection- molded components. Then a liquified thermoplastic elastomer mixture (e.g., without conductive modifiers) may be spread over the secondary injection-molded components 1806 such that the tertiary injection-molded component 1816 is formed across the entire491845941 19.1Our Ref. 129087.8006.W001(PATENT) length of the carrier assembly 1800 including any cavities for the semiconductor components, such as pre-formed, JEDEC-compliant cavities. In some embodiments, the secondary injection-molded component 1806 and / or the tertiary injection-molded component 1816 comprise multiple overmolded materials (i.e., as in multiple layers of overmolded material).[000158] Generally, the tertiary injection-molded component 1816 and the secondary injection-molded component 1806 do not cover the side portions along the outer edge 1810 of the carrier assembly 1800, thereby the tertiary injection-molded component 1816 and / or the secondary injection-molded component 1806 do not typically extend up the sidewall of the rim defined by the outer and inner edges 1810, 1812. However, in some embodiments, the secondary injection-molded component 1806 does at least partially cover the sidewalls of the rim extending around the deck area 1804. Together, the primary, secondary, and tertiary injection-molded components 1802, 1806, 1816 form the carrier assembly 1800 that can be used to universally transport items (e.g., singulated silicon components or silicon die of the same or different sizes) as necessary for manufacturing, shipping, and / or storing. The addition of the tertiary injection-molded component 1816 and the secondary injection-molded component 1806 may enable the carrier assembly 1800 to transport items of different sizes and decreases the likelihood that the items are unattached from the carrier assembly 1800 throughout transport.[000159] As shown in Figure 18, the deck area 1804 of the primary injection-molded component 1802 may include a series of secondary injection-molded components 1806 and tertiary injection-molded components 1816. Here, for example, the tertiary injection- molded components 1816 and the secondary injection-molded components 1806 are secured to structural mounting features (or simply “mounting features”) having a circular shape. Those skilled in the art will recognize that other shapes may be more appropriate in certain situations and certain types of semiconductors. Additionally or alternatively, the mounting features may be randomly arranged about the deck area 1804.[000160] Mounting features may extend upward from the planar surface of the deck area 1804 and / or from the top surface of the secondary injection-molded component501845941 19.1Our Ref. 129087.8006.W001 (PATENT) 1806 so as to form extrusions upon which the secondary injection-molded components 1806 and / or the tertiary injection-molded components 1816, respectively, can be secured. Additionally or alternatively, mounting features may extend downward from the planar surface of the deck area 1804 and / or from the top surface of the secondary injection-molded component 1806 so as to form cavities in which the secondary injection-molded components 1806 and / or the tertiary injection-molded components 1816, respectively, can be secured. A single carrier assembly may include “upward” mounting features, “downward” mounting features, or any combination thereof. The height of these mounting features may be random, regular, or a combination thereof, as described herein.[000161] In Figure 18, the material(s) from which the secondary injection-molded components 1806 and the tertiary injection-molded components 1816, respectively, are comprised are deposited only onto the mounting features. However, those skilled in the art will recognize that the material(s) could instead be deposited over the respective mounting features and intervening spaces. In such a scenario, a single secondary injection-molded component and / or tertiary injection-molded components 1816 could be described as being “draped over” the deck area of the primary injection-molded component 1802 and / or the secondary injection-molded component 1806, respectively, including any mounting features therein.[000162] Figure 19A includes a sectional view depicting the pre-forming of a carrier assembly 1900 that includes a tertiary injection-molded component 1908 connected to a secondary injection-molded component 1904 connected to a primary injection-molded component 1902. The carrier assembly 1900 can be identical to or generally similar to the carrier assembly 1400 of Figure 14A or any of the carrier assemblies described herein, except that the carrier assembly 1900 includes the tertiary injection-molded component. The primary, secondary, and tertiary injection-molded components 1902, 1904, and 1908 can be tiered. For example, the tertiary injection-molded component 1908 can extend upward from one or more mounting components that extend upward from the secondary injection-molded component 1904. Similarly, the secondary injection-molded component 1904 can extend upward from the one or more mounting511845941 19.1Our Ref. 129087.8006.W001(PATENT) components that extend upward from the deck area of the primary injection-molded component 1902.[000163] In some embodiments, the secondary injection-molded component 1904 and the tertiary injection-molded component 1908 are not perfectly integrated with the primary injection-molded component 1902 and the secondary injection-molded component 1904, respectively. For example, if the tertiary injection-molded component 1908 is formed by depositing a liquified thermoplastic elastomer on the secondary injection-molded component 1904, then surface features may result in imperfections such as small air gaps between the secondary and tertiary injection-molded components 1904, 1908. As another example, a protruding feature disposed along the outer surface of a semiconductor component may pierce one or more of the tertiary and / or secondary injection-molded components 1904, 1908 when interconnected with an indentation in the primary injection-molded component 1902.[000164] Figure 19B includes a sectional view depicting a carrier assembly 1900 with a tertiary injection-molded component 1958 integrally molded onto a secondary injection- molded component 1954 that is integrally molded onto a primary injection-molded component 1952. In contrast to the carrier assembly 1900 of Figure 19A, the molded carrier assembly 1950 can be formed by integrally molding the tertiary injection-molded component 1958 onto the secondary injection-molded component 1954 during a lamination process. In a similar manner, the secondary injection-molded component 1954 can be integrally molded onto the primary injection-molded component 1952.[000165] Regardless of how the carrier assembly 1900, 1950 is formed, the tertiary injection-molded component 1908, 1958 may take the form of the secondary injection- molded component 1904, 1954, which may take the form of the deck area of the primary injection-molded component 1902, 1952. For example, if the primary injection- molded component 1902, 1952 includes a series of cavities as shown in Figure 18, then the secondary injection-molded component 1904, 1954 may conform to each of those cavities. Similarly, if the secondary injection-molded component 1904, 1952 includes a series of cavities, then the tertiary injection-molded component 1908, 1958 may conform to each of those cavities. In some embodiments, the secondary injection-521845941 19.1Our Ref. 129087.8006.W001(PATENT) molded component 1904, 1954 is formed from a thermoplastic elastomer / carbon nanotube mixture as described in Figures 15-17, and the tertiary injection-molded component 1908, 1958 is formed from a thermoplastic elastomer to provide additional adhesive for the semiconductor components to adhere to. As discussed herein, the conductive modifiers of the secondary injection-molded component 1904, 1954 can be vertically aligned relative to the deck area of the primary injection-molded component 1902, 1952 such that static electricity built up from movement of the semiconductor components secured to the tertiary injection-molded component 1908, 1958 and / or static electricity built up from movement of any other components of the carrier assembly 1900, 1950 is grounded.[000166] As shown in Figures 19A and 19B, the primary injection-molded component 1902, 1952 may include one or more cavities 1906, 1956 into which a material (e.g., liquified thermoplastic elastomer, carbon nanotube mixture) that forms the secondary injection-molded component 1904, 1954 can flow. Similarly, the secondary injection- molded component 1904, 1954 may include one or more cavities 1910, 1960 into which a material (e.g., liquified thermoplastic elastomer) that forms the tertiary injection- molded component 1908, 1958 can flow. As the material hardens, anchoring features along the bottom of the secondary injection-molded component 1904, 1954, and the tertiary injection-molded component 1908, 1958 will form within these cavities 1906, 1956 and 1910, 1960, respectively. In essence, these anchoring features are representative of “feet” that serve to anchor the secondary injection-molded component 1904, 1954 to the primary injection-molded component and the tertiary injection-molded component 1908, 1958 to the secondary injection-molded component 1904, 1954. The cavities could be, for example, notches, holes, or slots. The shapes of the cavities 1906, 1956 and 1910, 1960 (and thus the resulting anchoring features of the secondary injection-molded component 1904, 1954 and the tertiary injection-molded component 1908, 1958) are generally not important as the material is sufficiently tacky enough to as to sufficiently adhere to the primary injection-molded component 1902, 1952 and the secondary injection-molded component 1904, 1954, respectively. However, in some embodiments, it may be desirable to further improve adhesion by designing some or all of the cavities 1906, 1956, 1910, and 1960 for improved gripping, reducing excess531845941 19.1Our Ref. 129087.8006.W001(PATENT) movement of components of the carrier assembly 1900, 1950, and decreasing the amount of static electricity built up during transport, thereby decreasing the likelihood of damaging semiconductor components.[000167] Figure 20A includes a top plan view of a carrier assembly 2000 including conductive modifiers 2002 before the conductive modifiers 2002 are aligned using an alignment mechanism. Figure 20B includes a top plan view of the carrier assembly 2000 of Figure 20A after the conductive modifiers 2002 are aligned using the alignment mechanism 2050.[000168] Figure 21 includes a top plan view of a carrier assembly 2100 showing how media can be injected into the deck area 2104 of a primary injection-molded component 2102 to form a secondary injection-molded component 2106. The deck area 2104 may be set within a rim 2108 that extends around a periphery of the carrier assembly 2100. In some embodiments, the secondary injection-molded component 2106 covers the entire deck area 2104, while in other embodiments, the secondary injection-molded component 2106 covers a portion of the deck area 2104. Here, for example, a portion of the deck area 2104 is left unmolded to create a non-adhesive border. One or both of the primary or secondary components 2102 or 2106 can be covered on one or more surfaces with a carbon nanotube coating to dissipate static electricity and prevent electrostatic discharge, as described herein. Additionally or alternatively, one or both the primary or secondary components 2102, 2106 can be made from a polymer / carbon nanotube mixture to prevent electrostatic discharge, as described herein.[000169] Figure 22 includes a sectional view of the layers of a carrier assembly 2200 that includes a secondary injection-molded component 2204 integrally mounted along the deck area of a primary injection-molded component 2202. In some embodiments, the primary injection-molded component 2202 is covered in a carbon nanotube coating or is made from a polymer / conductive modifiers mixture. Additionally or alternatively, the secondary injection-molded component 2204 is covered in a carbon nanotube coating or is made from an elastomer or another mixture that includes one or more conductive modifiers. Figure 22 depicts an example of a technique for coupling the secondary injection-molded component 2204 to the primary injection-molded541845941 19.1Our Ref. 129087.8006.W001(PATENT) component 2202. Here, the secondary injection-molded component 2204 is continuously slid onto the deck area of the primary injection-molded component 2202 over time. For example, the secondary injection-molded component 2204 may be created by injecting a liquified media (e.g., a thermoplastic elastomer with or without conductive modifiers) into a mold, and then the secondary injection-molded component 2204 may be slid into securement mechanism(s) arranged along the periphery of the deck area. Alternatively, the secondary injection-molded component 2204 may be slid into a cavity formed along the surface of the deck area.[000170] Figure 23 includes a top plan view of a carrier assembly 2300 showing how media can be injected into the deck area 2304 of a primary injection-molded component 2302 to form a secondary injection-molded component 2306, and how an additional media can be injected onto the secondary injection-molded component 2306 to form a tertiary injection-molded component 2310. The carrier assembly 2300 can be identical or generally similar to the carrier assembly 2100 of Figure 21 , or any of the carrier assemblies described herein, except that the carrier assembly 2300 includes the tertiary injection-molded component 2310. In some embodiments, the tertiary injection-molded component 2310 covers the entire secondary injection-molded component 2306, while in other embodiments, the tertiary injection-molded component 2310 covers a portion of the secondary injection-molded component 2306. Here, for example, a portion of the secondary injection-molded component 2306 is left unmolded to create a less-adhesive border. One or both the secondary or tertiary components 2306, 2310 can be covered on one or more surfaces with a carbon nanotube coating to dissipate static electricity and prevent electrostatic discharge, as described herein. Additionally or alternatively, one or both of the secondary or tertiary components 2306, 2310 can be made from a polymer / carbon nanotube mixture to prevent electrostatic discharge, as described herein.[000171] Figure 24 includes a sectional view of the layers of a carrier assembly 2400 that includes a tertiary injection-molded component 2408 integrally mounted along the top surface of a secondary injection-molded component 2404. The carrier assembly 2400 can be identical or generally similar to the carrier assembly 2200 of Figure 22, or any of the carrier assemblies described herein, except that the carrier assembly 2400551845941 19.1Our Ref. 129087.8006.W001(PATENT) includes the tertiary injection-molded component 2408. In some embodiments, the primary, secondary, and / or tertiary injection-molded components 2402, 2404, 2408 are covered in a carbon nanotube coating or are made from a polymer / conductive modifiers mixture. Figure 24 depicts an example of a technique for coupling the tertiary injection-molded component 2408 to the secondary injection-molded component 2404, which is coupled to the primary injection-molded component 2402. Here, the tertiary injection-molded component 2408 is continuously slid onto the top surface of the secondary injection-molded component 2404 over time. For example, the tertiary injection-molded component 2408 may be created by injecting a liquified media (e.g., a thermoplastic elastomer) into a mold, and then the tertiary injection-molded component 2408 may be slid into securement mechanism(s) arranged along the periphery of the top surface of the secondary injection-molded component 2404. Alternatively, the tertiary injection-molded component 2408 may be slid into a cavity formed along the surface of the secondary injection-molded component 2404.[000172] Figure 25 includes a sectional view illustrating how liquified media (e.g., a thermoplastic elastomer, a thermoplastic elastomer / conductive modifiers mixture, etc.) can be integrally mounted to a primary injection-molded component 2502 as part of a molding process. In particular, Figure 25 depicts the primary injection-molded component 2502 with a pre-formed deck area 2504 that is enclosed in a mold 2506. During the molding process, liquified media 2508 is injected onto the pre-formed deck area 2504 to form the secondary injection-molded component. As shown in Figure 25, the liquified media 2508 may be injected through an opening in the mold 2506 through a nozzle 2510. Generally, the nozzle 2510 is connected to a cylinder (not shown) in which the material(s) used to form the secondary injection-molded component are liquified. A similar technique can be used to inject an additional liquified media onto the secondary injection-molded component to form a tertiary injection-molded component.[000173] Figure 26 is a flowchart of a process 2600 for creating a carrier assembly comprised of a primary injection-molded component and a secondary injection-molded component via overmolding. Overmolding is a two-shot injection molding process that creates a single part (e.g., a carrier assembly) by combining two (or more) complementary materials. As discussed below, the first shot may create the primary561845941 19.1Our Ref. 129087.8006.W001 (PATENT) injection-molded component using a first material while the second shot may create the secondary injection-molded component using a second material.[000174] Initially, a manufacturer can create a primary injection-molded component by injecting a first liquified material into a mold (step 2601 ). The first liquified material could be, for example, polycarbonate, PPE, PPO, PPS, a thermoplastic such as polyethylene or polypropylene, liquid crystal polymer, or ECTFE. Generally, the first liquified material is selected by the manufacturer such that the primary injection-molded component is fairly rigid. For example, the liquified material can be a polymer / conductive modifiers mixture that enhances the mechanical and electrical conductivity properties of the primary injection-molded component.[000175] Then, the manufacturer can create a secondary injection-molded component by molding a second liquified material over / around the primary injection-molded component (step 2602). For example, if the primary injection-molded component takes the form of a tray with a substantially planar deck area as shown in Figures 1 , 10, 13, 15, and 18, the manufacturer may eject the second liquified material across the deck area to create a secondary injection-molded component that is chemically / mechanically integrated with the deck area. Generally, the secondary injection-molded component is comprised of a softer material than the primary injection-molded component. For example, the secondary injection-molded component may be comprised of a thermoplastic elastomer. Examples of thermoplastic elastomers include TPS, TPO, TPV, TPU, TPO, and TPA. In some embodiments, the manufacturer may simply obtain the second liquified material by applying heat to thermoplastic elastomer pellets. Additionally or alternatively, the thermoplastic elastomer pellets can be mixed with one or more forms of conductive modifiers (e.g., disentangled conductive modifiers suspended in a surfactant, raw conductive modifiers in a DLC, etc.) to enhance the mechanical and electrical conductivity properties of the secondary injection-molded component. In some embodiments, a carbon nanotube coating is applied (e.g., in the form of a spray or foam) to the deck area of the primary injection-molded component prior to overmolding the secondary injection-molded component. Additionally or alternatively, the carbon nanotube coating can be applied to a top surface of the secondary injection-molded component after overmolding.571845941 19.1Our Ref. 129087.8006.W001(PATENT)[000176] Thereafter, the manufacturer can remove the carrier assembly formed from the primary and secondary injection-molded components from the mold (step 2603). Alternatively, the manufacturer may remove the primary injection-molded component from the mold prior to creating the secondary injection-molded component. Thus, the secondary injection-molded component may be overmolded onto a freestanding primary injection-molded component. In such embodiments, one or more surfaces of the primary injection-molded component can be covered in a carbon nanotube coating.[000177] Those skilled in the art will recognize that the process 2600 could include other embodiments. For example, the manufacturer may opt to cure the first liquified material after it has been injected into the mold to quicken the pace with which the primary injection-molded component is made, improve crosslinking, etc. Additionally or alternatively, the manufacturer may opt to cure the second liquified material after it has been molded to the primary injection-molded component to quicken the pace with which the secondary injection-molded component is made, improve crosslinking, etc.[000178] Figure 27 is a flowchart of a process 2700 for creating a carbon nanotube composite used to create a primary injection-molded component. Initially, a manufacturer can combine disentangled carbon nanotube fibers with a liquid to form a liquid-fiber solution (step 2701 ). Then, the manufacturer can combine the liquid-fiber solution with a composite to form a carbon nanotube composite mixture (step 2702). Next, the manufacturer can coagulate the carbon nanotube composite mixture to form a carbon nanotube composite concentrate (step 2703). Then, the manufacturer can meltmix the carbon nanotube composite concentrate to form a first liquified media (step 2704).[000179] Figure 28 is a flowchart of a process 2800 for creating a carbon nanotube elastomer concentrate used to create a secondary injection-molded component. Initially, a manufacturer can combine disentangled carbon nanotube fibers with a liquid to form a liquid-fiber solution (step 2801 ). Then, the manufacturer can combine the liquid-fiber solution with a composite to form a carbon nanotube composite mixture (step 2802). Next, the manufacturer can coagulate the carbon nanotube composite mixture to form a carbon nanotube composite concentrate (step 2803). Then, the manufacturer can melt-581845941 19.1Our Ref. 129087.8006.W001 (PATENT) mix the carbon nanotube composite concentrate to form a second liquified media (step 2804).[000180] Figure 29 is a flowchart of another process 2900 for creating a carrier assembly comprised of a primary injection-molded component and a secondary injection-molded component. Initially, a manufacturer can combine a plurality of disentangled carbon nanotube fibers with a liquid to form a liquid-fiber solution (step 2901 ). Then, the manufacturer can combine the liquid-fiber solution with an elastomer to form a carbon nanotube elastomer mixture (step 2902). Next, the manufacturer can coagulate the carbon nanotube elastomer mixture to form a carbon nanotube elastomer concentrate (step 2903). Then, the manufacturer can melt-mix the carbon nanotube elastomer concentrate to form a second liquified media (step 2904).[000181] Figure 30 is a flowchart of another process 3000 for creating a carrier assembly comprised of a primary injection-molded component and a secondary injection-molded component. Initially, a manufacturer can acquire a primary injection- molded component (step 3001 ). Generally, the primary injection-molded component takes the form of a rigid tray with a deck area. While the deck area will often be substantially planar, the deck area may include structural features, such as cavities, designed to facilitate the securement of semiconductor components. In some embodiments, the manufacturer creates the primary injection-molded component via an injection molding process rather than acquiring it from another manufacturer. Thus, the manufacturer may create the primary injection-molded component by injecting a first liquified material into a first mold. The primary injection-molded component may be comprised of a rigid material, such as molded plastic or molded resin. Examples of such materials include polycarbonates, PPE, PPO, PPS, thermoplastics such as polyethylene or polypropylene, liquid crystal polymer, and ECTFE. In some embodiments, such materials are mixed with conductive modifiers to form a polymer / carbon nanotube mixture that reinforces the primary injection-molded component.[000182] The manufacturer can then secure a secondary injection-molded component to at least a portion of the primary injection-molded component (step 3002). For example, the secondary injection-molded component may be secured to the deck area591845941 19.1Our Ref. 129087.8006.W001(PATENT) of the rigid tray as a single continuous (i.e. , unbroken) sheet. This can be done in several different ways. For example, the secondary injection-molded component may be overmolded onto the primary injection-molded component as discussed above with respect to Figures 26-29. As another example, the secondary injection-molded component may be secured to the deck area of the rigid tray via a lamination process, spray process, or co-extrusion process. Alternatively, the secondary injection-molded component may be secured against the deck area of the rigid tray with securement mechanism(s), retained within a cavity defined in the deck area of the rigid tray, etc. Generally, the secondary injection-molded component has sufficient bonding strength to be mounted onto the deck area without adhesive. For example, the manufacturer may create the secondary injection-molded component by injecting a second liquified material into a second mold. The second liquified material may be tacky in its nonliquified state, which enables the manufacturer to simply secure the secondary injection- molded component against the primary injection-molded component without adhesive. As described above, the second liquified material may be mixed with conductive modifiers to form, for example, a thermoplastic elastomer / carbon nanotube mixture that reinforces the secondary injection-molded component.[000183] In some embodiments, the manufacturer causes static electricity to be discharged from the carrier assembly formed from the primary and secondary injection- molded components (step 3003). For example, the manufacturer may discharge static electricity from the carrier assembly by initiating contact between the primary injection- molded component and a grounded object. In some embodiments, one or more of the components can include a plurality of disentangled conductive modifiers that are vertically aligned with the grounded object. Additionally or alternatively, the one or more components, including disentangled and vertically aligned conductive modifiers, can serve as the grounded objects. As another example, the manufacturer may discharge static electricity from the carrier assembly by installing object(s), such as a ground plane, within the carrier assembly that will facilitate the discharge. Discharging static electricity reduces the likelihood of harming any semiconductor components stored in the carrier assembly due to static shock or electricity otherwise passing through when it should not.601845941 19.1Our Ref. 129087.8006.W001(PATENT)[000184] Thereafter, the manufacturer can allow a semiconductor component to be secured to the secondary injection-molded component (step 3004). Semiconductor components may utilize the surface energy and / or tackiness of the secondary injection- molded component for seating attachment at a certain density (e.g., a maximum continuous density) along the deck area of the primary injection-molded component. In some embodiments, the semiconductor component is simply secured to the top surface of the secondary injection-molded component. In other embodiments, the semiconductor component includes a protruding feature designed to mate with a recess formed in the primary injection-molded component and / or secondary injection-molded component. For example, if the secondary injection-molded component extends across a recess formed in the primary injection-molded component, the protruding feature may puncture the secondary injection-molded component as it enters the recess.[000185] Figure 31 is a flowchart of another process 3100 for creating a carrier assembly comprised of a primary injection-molded component and a secondary injection-molded component. Initially, a manufacturer can acquire a primary injection- molded component (step 3101 ). Generally, the primary injection-molded component takes the form of a rigid tray with a deck area. While the deck area will often be substantially planar, the deck area may include structural features, such as cavities, designed to facilitate the securement of semiconductor components. In some embodiments, the manufacturer creates the primary injection-molded component via an injection molding process rather than acquiring it from another manufacturer. Thus, the manufacturer may create the primary injection-molded component by injecting a first liquified material into a first mold. The primary injection-molded component may be comprised of a rigid material, such as molded plastic or molded resin. Examples of such materials include polycarbonates, PPE, PPO, PPS, thermoplastics such as polyethylene or polypropylene, liquid crystal polymer, and ECTFE. In some embodiments, such materials are mixed with conductive modifiers to form a polymer / carbon nanotube mixture that reinforces the primary injection-molded component.[000186] Then, the manufacturer can combine disentangled carbon nanotube fibers with a liquid to form a liquid-fiber mixture (step 3102). Next, the manufacturer can agitate the liquid-fiber mixture to evenly distribute the disentangled carbon nanotube fibers within the611845941 19.1Our Ref. 129087.8006.W001 (PATENT) liquid-fiber mixture (step 3103). Then, the manufacturer can apply the liquid-fiber mixture to the primary injection-molded component (step 3104). Next, the manufacturer can align the disentangled carbon nanotube fibers (step 3105). For example, the process 3100 can include subjecting the tray with the liquid-fiber mixture applied to ultrasonic waves such that the disentangled conductive modifiers vertically align relative to the substantially planar deck of the tray. In other embodiments, the process 3100 can include subjecting the tray with the liquid-fiber mixture applied to a magnetic field such that the disentangled conductive modifiers vertically align relative to the substantially planar deck of the tray.[000187] Then, the manufacturer can secure a secondary injection-molded component to at least a portion of the primary injection-molded component (step 3106). Next, static electricity can be discharged from the carrier assembly formed from the primary and secondary injection-molded components (step 3107). Finally, a semiconductor component can be secured to the secondary injection-molded component (step 3108).[000188] In some embodiments, the process 3100 can include reacting the liquid-fiber mixture with a urethane-based polymer or a urethane-based pre-polymer to form a carbon nanotube foam and applying the carbon nanotube foam to the substantially planar deck of a tray of the primary injection-molded component. In other embodiments, the process 3100 can include optionally dipping the tray into the liquid-fiber mixture, optionally brushing the liquid-fiber mixture onto the tray, or optionally spraying the liquid-fiber mixture onto the tray.[000189] Figure 32 is a flowchart of a process 3200 for transporting semiconductor components using the carrier assemblies described herein. Initially, an individual can obtain a semiconductor component (step 3201 ) that requires transport, storage, etc. Examples of semiconductor components include wafers (e.g., singulated wafers and diced wafers), dies (e.g., bumped dies or bare dies), and other microelectronic components used in the fabrication of ICs.[000190] Then, the individual can adhere the semiconductor component to the tacky injection-molded component of the carrier assembly (step 3202). For example, the individual may manually secure the semiconductor component to the tacky injection- molded component or prompt an automatic-placement machine to secure the621845941 19.1Our Ref. 129087.8006.W001(PATENT) semiconductor component to the tacky injection-molded component. Generally, the tacky injection-molded component is representative of an insert / addition to a primary injection-molded component and / or a secondary injection-molded component. For example, the tacky injection-molded component may be located within a deck area of the primary injection-molded component and / or on the top surface of the secondary injection-molded component. Semiconductor components may be secured to the tacky injection-molded component (or a series of tacky injection-molded components) in a matrix pattern designed to maximize the density of semiconductor components along the deck area of the primary injection-molded component. For example, the individual may secure the semiconductor component in a predetermined location (e.g., defined by a notch in which a protruding component of the semiconductor component is installed).[000191] The carrier assembly can then be transported to a desired location (step 3203). During transport, the carrier assembly can be moved along the x-axis, y-axis, or z-axis without substantially moving or damaging the semiconductor component(s) stored therein. Upon receipt of the carrier assembly by an intended recipient (e.g., an IC manufacturer), each semiconductor component can be removed by simply overcoming the surface energy of the tacky injection-molded component (step 3204). Removal may be done manually (e.g., by a human hand) or automatically (e.g., by an automaticplacement machine).[000192] Unless contrary to physical possibility, it is envisioned that the steps described above may be performed in various sequences and combinations. For example, a manufacturer may acquire a primary injection-molded component on which secondary and / or tertiary injection-molded components have already been overmolded. In such instances, the manufacturer may simply secure semiconductor component(s) to the secondary and / or tertiary injection-molded components and then provide the carrier assembly to another entity (e.g., a manufacturer of ICs).[000193] Additional steps could also be included in some embodiments. For example, after semiconductor component(s) have been secured to the secondary and / or tertiary injection-molded component, a cover tape may be secured over the deck area to hold the semiconductor component(s) in place. The cover tape may only be used in certain631845941 19.1Our Ref. 129087.8006.W001(PATENT) situations (e.g., long-distance transport or long-term storage) where the carrier assembly is expected to undergo bumping, shaking, etc. As another example, the manufacturer may emboss features on the secondary and / or tertiary injection-molded components that are intended to better secure semiconductor components. For instance, the manufacturer may stamp cavities for retaining semiconductor components into the secondary and / or tertiary injection-molded components.Remarks[000194] The foregoing examples of various embodiments have been provided for the purposes of illustration and description. These examples are not intended to be exhaustive. Many variations will be apparent to one skilled in the art. Certain embodiments were chosen in order to best describe the principles of the technology introduced herein, thereby enabling others skilled in the relevant art to understand the claimed subject matter, the various embodiments, and the variations that may be suited to particular uses.[000195] The language used in the specification has been principally selected for readability and instructional purposes. It may not have been selected to delineate or circumscribe the subject matter. Therefore, it is intended that the scope of the technology be limited not by this specification, but rather by any claims that issue based hereon. Accordingly, the disclosure of the technology is intended to be illustrative (rather than limiting) of the scope of the technology, which is set forth in the following claims.641845941 19.1

Claims

1. Our Ref. 129087.8006.W001(PATENT)CLAIMSWhat is claimed is:

1. A carrier assembly comprising: an injection-molded component that is formed from a composition that includes conductive modifiers and that includes: a frame that defines a deck area along which to receive semiconductor components, wherein the conductive modifiers, via incorporation into the composite, are configured to facilitate dissipation of static electricity collected on a surface of the frame, and a rim that extends around at least a portion of a periphery of the frame.

2. The carrier assembly of claim 1 , further comprising: a secondary injection-molded component affixed to the frame in such a manner that the secondary injection-moleded component conforms to at least a portion of the deck area, wherein the secondary injection-molded component has a tacky upper surface that facilitates securement of the semiconductor components to the injection-molded component.

3. The carrier assembly of claim 1 , wherein the conductive modifiers comprise between 1 weight percent and 30 weight percent of the composition.

4. The carrier assembly of claim 1 , wherein the conductive modifiers are functionalized in the composition with one or more electroactive materials such as transition metals or oxides of the transition metals.

5. The carrier assembly of claim 1 , wherein the composition is at least partially comprised of a conductive material.651845941 19.1Our Ref. 129087.8006.W001(PATENT)6. The carrier assembly of claim 1 wherein before or during formation of the injection-molded component, the conductive modifiers are agitated or treated to attain a desired alignment.

7. The carrier assembly of claim 6, wherein the conductive modifiers are aligned roughly orthogonal to a plane along which the deck area is defined.

8. The carrier assembly of claim 1 wherein the conductive modifiers provide the carrier assembly with at least one of (i) increased rigidity, (ii) increased strength, and / or (iii) improved crush resistance.

9. The carrier assembly of claim 1 wherein the conductive modifiers are added to the composition in the form of a dry liquid concentrate.

10. The carrier assembly of claim 1 wherein the injection-molded component is formed at least partially from a rigid polymer.1 1. A method for manufacturing a carrier assembly for semiconductor components, the method comprising: ejecting a first liquified media into a mold to create a tray having a substantially planar deck; ejecting a second liquified media onto the substantially planar deck of the tray to form an upper surface that covers at least a portion of the substantially planar deck; and enabling the semiconductor components to be detachably secured to the upper surface along the substantially planar deck of the tray, wherein at least one of the first liquified media or the second liquified media includes disentangled conductive modifiers.

12. The method of claim 1 1 , wherein the upper surface is at least one of a tacky surface or a rubber-like surface.661845941 19.1Our Ref. 129087.8006.W001(PATENT)13. The method of claim 11 , wherein the first liquified media is formed by - combining the disentangled conductive modifiers with a liquid to form a liquidfiber solution; combining the liquid-fiber solution with a material to form a composite mixture; coagulating the composite mixture to form a composite concentrate; and melt-mixing the composite concentrate to form the first liquified media.

14. The method of claim 11 , wherein the first liquified media includes polycarbonate, polyphenylene ether, polyphenylene oxide, polyphenylene sulfide, polyethylene, polypropylene, liquid crystal polymer, or ethylene chlorotrifluoroethylene.

15. The method of claim 11 , wherein the second liquified media is formed by - combining the disentangled conductive modifiers with a liquid to form a liquidfiber solution; combining the liquid-fiber solution with an elastomer to form an elastomer composite mixture; coagulating the elastomer composite mixture to form an elastomer composite concentrate; and melt-mixing the elastomer composite concentrate to form the second liquified media.

16. The method of claim 11 , wherein the second liquified media includes thermoplastic elastomer, a styrenic block copolymer, thermoplastic polyolefin elastomer, thermoplastic vulcanizate, thermoplastic polyurethane, thermoplastic copolyester, or thermoplastic polyamide.

17. The method of claim 11 , further comprising: ejecting a third liquified media onto the upper surface along the substantially planar deck of the tray to form a tacky surface that covers at least a portion of the upper surface; and671845941 19.1Our Ref. 129087.8006.W001(PATENT) enabling the semiconductor components to be detachably secured to the tacky surface.

18. The method of claim 11 , further comprising: combining the disentangled conductive modifiers with a liquid to form a liquid-fiber mixture; reacting the liquid-fiber mixture with a urethane-based polymer or a urethane- based pre-polymer to form a carbon nanotube foam; and applying the carbon nanotube foam to the substantially planar deck of the tray.

19. The method of claim 11 , further comprising: combining the disentangled conductive modifiers with a liquid to form a liquid-fiber mixture; and at least one of: dipping the tray into the liquid-fiber mixture; brushing the liquid-fiber mixture onto the tray; or spraying the liquid-fiber mixture onto the tray.

20. The method of claim 19, further comprising: aligning the disentangled conductive modifiers vertically relative to the substantially planar deck of the tray by subjecting the tray with the liquidfiber mixture applied to ultrasonic waves, such that the disentangled conductive modifiers vertically align relative to the substantially planar deck of the tray.21 . The method of claim 19, further comprising: aligning the disentangled conductive modifiers vertically relative to the substantially planar deck of the tray by subjecting the tray with the liquidfiber mixture applied to a magnetic field, such that the disentangled conductive modifiers vertically align relative to the substantially planar deck of the tray.681845941 19.1Our Ref. 129087.8006.W001(PATENT)22. A method comprising: combining disentangled conductive modifiers with a liquid to form a liquid-fiber solution; combining the liquid-fiber solution with a material to form a composite mixture; coagulating the composite mixture to form a composite concentrate; melt-mixing the composite concentrate to form a liquified media; and injection molding an injection-molded component with the liquified media; wherein the disentangled conductive modifiers facilitate transmission of static electricity from semiconductor components positioned on the injection-molded component to a ground in the injection-molded component.

23. The method of claim 22, further comprising: subjecting the injection-molded component to ultrasonic waves such that the disentangled conductive modifiers vertically align relative to a substantially planar deck of the injection-molded component.

24. The method of claim 22, further comprising: subjecting the injection-molded component to a magnetic field such that the disentangled conductive modifiers vertically align relative to a substantially planar deck of the injection-molded component.

25. The method of claim 22, further comprising: ejecting liquified thermoplastic elastomer onto a substantially planar deck of the injection-molded component; and forming the liquified thermoplastic elastomer into a second flexible injection- molded component.691845941 19.1

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