Light-emitting element and driving element integrated packaged device, light board and display device

Abstract

The present application provides a light-emitting element and driving element integrated packaged device, a light board and a display device. In the packaged device, a package substrate has a first surface and a second surface, a light-emitting element and a driving element are both disposed on one side of the second surface, the orthographic projections of the driving element and the light-emitting element on the second surface do not overlap, and the distance between the first surface and the surface on the side of the light-emitting element facing away from the package substrate is greater than the distance between the first surface and the surface on the side of the driving element facing away from the package substrate.

Description

An integrated optical drive package, a lamp board, and a display device.

[0001] This application claims priority to Chinese Patent Application No. 202411770079.6, filed on December 4, 2024, entitled "An integrated optical drive packaging device, lamp board, and display device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of semiconductor technology, specifically to an integrated optical drive package, a lamp board, and a display device. Background Technology

[0003] A light-emitting diode (LED) is an electroluminescent semiconductor light-emitting device. Due to its advantages of low power consumption, small size, long life, good stability, fast response, and stable emission wavelength, it has been widely used in lighting, display, medical, and optical communication fields.

[0004] Taking the display industry as an example, the industry is currently developing towards higher resolution, ultra-thinness, high dynamic range imaging, high contrast, and wide color gamut. In display devices, the lamp panel, by employing smaller and more numerous Mini LEDs and combining them with local dimming technology, enables each zone within the lamp panel, and even each light-emitting element within each zone, to achieve independent switching or brightness adjustment through driving elements. This results in more distinct brightness levels in the displayed image, enhancing the user's visual experience. However, with the rapid increase in the number of light-emitting elements and the accompanying active addressing driving method, the demand for driving elements in the lamp panel has also increased accordingly.

[0005] Against this backdrop, to reduce manufacturing costs, printed circuit boards (PCBs) with fewer circuit layers are typically used; that is, single-sided mounting is employed, where the light-emitting elements and driving components are mounted on the same side of the PCB. Firstly, since both the light-emitting and driving components are independently packaged, they must be mounted separately onto the PCB during mounting. Furthermore, the mounting equipment and processes required for the light-emitting and driving components differ, leading to reduced mounting yield, especially when the number of both light-emitting and driving components increases dramatically. Secondly, because the lamp board is a surface light source, the light-emitting elements need to emit light from the sides to meet the requirements of wide-angle light emission. However, the driving components can block the side light emission of the light-emitting elements, resulting in dark areas on the lamp board and reducing optical uniformity, especially when the number of both light-emitting and driving components increases dramatically.

[0006] Therefore, how to improve yield, reduce the impact of driving components on the side light emission of the light-emitting chip, and improve the optical uniformity of the lamp board while taking into account production and manufacturing costs are technical problems that urgently need to be solved by those skilled in the art. Technical issues

[0007] This application provides an integrated optical drive package, lamp board, and display device, which can effectively solve the problems existing in related technologies, such as difficulty in improving yield, reducing the impact of driving components on the side light emission of light-emitting chips, and improving the optical uniformity of the lamp board while taking into account production and manufacturing costs. Technical solutions

[0008] In a first aspect, this application provides an integrated optical drive packaging device, the packaging device comprising: a packaging substrate having opposing first and second surfaces; a light-emitting element electrically connected to the packaging substrate; and a driving element electrically connected to the packaging substrate; wherein the light-emitting element and the driving element are both disposed on the side of the second surface opposite to the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap, and the distance between the surface of the light-emitting element opposite to the packaging substrate and the first surface is greater than the distance between the surface of the driving element opposite to the packaging substrate and the first surface.

[0009] Secondly, this application provides a lamp board, the lamp board including a substrate, a plurality of encapsulation structures, and a plurality of encapsulation devices as described in any one of the above, wherein the plurality of encapsulation structures and the plurality of encapsulation devices are disposed on the same side of the substrate; wherein, the encapsulation structure includes a light-emitting element, the light-emitting element in the encapsulation structure and the light-emitting element in the encapsulation device have the same light-emitting color, and the light-emitting element in the encapsulation structure is electrically connected to a driving element in one of the encapsulation devices.

[0010] Thirdly, this application provides a display device, which includes the aforementioned light panel. Beneficial effects

[0011] This application provides an integrated optical drive packaging device, a lamp board, and a display device. The packaging device includes a packaging substrate, a light-emitting element, and a driving element. The packaging substrate has a first surface and a second surface facing each other. The light-emitting element is electrically connected to the packaging substrate; the driving element is also electrically connected to the packaging substrate. Both the light-emitting element and the driving element are disposed on the side of the second surface opposite to the first surface. The orthographic projections of the driving element and the light-emitting element on the second surface do not overlap. Furthermore, the distance between the surface of the light-emitting element opposite to the packaging substrate and the first surface is greater than the distance between the surface of the driving element opposite to the packaging substrate and the first surface. This application can improve yield, reduce the impact of the driving element on the side light emission of the light-emitting chip, improve the optical uniformity of the lamp board, and enhance display quality while considering manufacturing costs. Attached Figure Description

[0012] Figure 1 is a schematic diagram of the film structure of a packaging device provided in the first embodiment of this application.

[0013] Figure 2 is a schematic diagram of the film structure of a packaging device provided in the second embodiment of this application.

[0014] Figure 3 is a schematic diagram of the film structure of a packaging device provided in the third embodiment of this application.

[0015] Figure 4 is a schematic diagram of the film structure of a packaging device provided in the fourth embodiment of this application.

[0016] Figure 5 is a schematic diagram of the film structure of a packaging device provided in the fifth embodiment of this application.

[0017] Figure 6 is a schematic diagram of the film structure of a packaging device provided in the sixth embodiment of this application.

[0018] Figure 7 is a schematic diagram of the film structure of a packaging device provided in the seventh embodiment of this application.

[0019] Figure 8 is a schematic diagram of the film structure of a packaging device provided in the eighth embodiment of this application.

[0020] Figure 9 is a schematic diagram of the film structure of a packaging device provided in the ninth embodiment of this application.

[0021] Figure 10 is a schematic diagram of the film structure of a packaging device provided in the tenth embodiment of this application.

[0022] Figure 11 is a schematic diagram of the film structure of a packaging device provided in the eleventh embodiment of this application.

[0023] Figure 12 is a schematic diagram of the film structure of a packaging device provided in the twelfth embodiment of this application.

[0024] Figure 13 is a schematic diagram of the film structure of a packaging device provided in the thirteenth embodiment of this application.

[0025] Figure 14 is a top view of a first type of light panel provided in some embodiments of this application.

[0026] Figure 15 is a top view of a second type of light panel provided in some embodiments of this application.

[0027] Figure 16 is a top view of a third type of light panel provided in some embodiments of this application.

[0028] Figure 17 is a top view of a fourth type of light panel provided in some embodiments of this application.

[0029] Figure 18 is a top view of a fifth type of light panel provided in some embodiments of this application.

[0030] Figure 19 is a top view of a sixth type of light panel provided in some embodiments of this application.

[0031] Figure 20 is a schematic diagram of the film structure of the lamp panel cut along line AB shown in Figure 15.

[0032] Figure 21 is a schematic diagram of the film structure of the lamp panel cut along line CD shown in Figure 16.

[0033] Figure 22 is a schematic diagram of the film structure of the lamp panel cut along line EF shown in Figure 17.

[0034] Explanation of reference numerals in the attached figures:

[0035] Encapsulation device 01; Encapsulation substrate 10; First surface 101; Second surface 102; Groove 103; First protrusion 11; Light-emitting element 20; LED chip 21; Encapsulating adhesive 22; Second protrusion 23; Carrier plate 24; Driving element 30; Driving chip 31; Reflective adhesive 32; Inclined sidewall 321; Transparent adhesive 40; Pad layer 50; Encapsulation structure 02; Encapsulation substrate 10'; Light-emitting element 20'; LED chip 21'; Encapsulating adhesive 22'; Carrier plate 24'; Transparent adhesive 40'; Substrate 03; Lamp board 100; Lamp assembly 101. Embodiments of the present invention

[0036] In a first aspect, this application provides an integrated optical drive packaging device, the packaging device comprising: a packaging substrate having opposing first and second surfaces; a light-emitting element electrically connected to the packaging substrate; and a driving element electrically connected to the packaging substrate; wherein the light-emitting element and the driving element are both disposed on the side of the second surface opposite to the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap, and the distance between the surface of the light-emitting element opposite to the packaging substrate and the first surface is greater than the distance between the surface of the driving element opposite to the packaging substrate and the first surface.

[0037] Optionally, the light-emitting element includes an LED chip, which does not overlap with the driving element in a direction parallel to the first surface.

[0038] Optionally, the packaging device further includes a pad layer, through which the LED chip is electrically connected to the packaging substrate, wherein the pad layer is disposed between the LED chip and the packaging substrate.

[0039] Optionally, the thickness of the packaging substrate is greater than the thickness of the driving element, and the packaging substrate has a groove on the side of the second surface opposite to the first surface, and the driving element is accommodated in the groove.

[0040] Optionally, the light-emitting element includes a carrier plate, an LED chip, and encapsulating adhesive. The carrier plate is welded and fixed to the encapsulation substrate. The LED chip is disposed on the side of the carrier plate opposite to the encapsulation substrate, and the encapsulating adhesive covers the LED chip.

[0041] Optionally, the light-emitting element includes an LED chip, which overlaps at least partially with the driving element in a direction parallel to the first surface. The driving element includes a driving chip and a reflective adhesive, which covers the driving chip and includes at least one inclined sidewall. In a direction away from the first surface from the second surface, the distance between the inclined sidewall and its adjacent light-emitting element gradually increases.

[0042] Optionally, the encapsulation device further includes a transparent adhesive that covers the light-emitting element and the driving element.

[0043] Optionally, the encapsulation device further includes a transparent adhesive that covers the light-emitting element. The orthographic projection of the transparent adhesive on the encapsulation substrate does not overlap with the orthographic projection of the driving element on the encapsulation substrate. The light-emitting surface of the transparent adhesive is curved.

[0044] Secondly, this application provides a lamp board, the lamp board including a substrate, a plurality of encapsulation structures, and a plurality of encapsulation devices as described in any one of the above, wherein the plurality of encapsulation structures and the plurality of encapsulation devices are disposed on the same side of the substrate; wherein, the encapsulation structure includes a light-emitting element, the light-emitting element in the encapsulation structure and the light-emitting element in the encapsulation device have the same light-emitting color, and the light-emitting element in the encapsulation structure is electrically connected to a driving element in one of the encapsulation devices.

[0045] Thirdly, this application provides a display device, which includes the aforementioned light panel.

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] The terms "first" and "second" used herein are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0050] In a first aspect, embodiments of this application provide a packaging device 01. Referring to Figures 1 to 13, various embodiments of this application illustrate different packaging devices 01 with different structures. The packaging device 01 includes a packaging substrate 10, a light-emitting element 20, and a driving element 30. The packaging substrate 10 has a first surface 101 and a second surface 102 facing each other. The light-emitting element 20 is electrically connected to the packaging substrate 10; the driving element 30 is electrically connected to the packaging substrate 10. Both the light-emitting element 20 and the driving element 30 are disposed on the side of the second surface 102 facing away from the first surface 101. The orthographic projection of the driving element 30 on the second surface 102 and the orthographic projection of the light-emitting element 20 on the second surface 102 do not overlap. Furthermore, the distance between the surface of the light-emitting element 20 facing away from the packaging substrate 10 and the first surface 101 is greater than the distance between the surface of the driving element 30 facing away from the packaging substrate 10 and the first surface 101.

[0051] In the packaging device 01 provided in this application embodiment, since the light-emitting element 20 and the driving element 30 are both disposed on the second surface 102 and are electrically connected to the packaging substrate 10, the packaging substrate 10 can be used as an adapter plate to transfer the electrical signal transfer ports of the light-emitting element 20 and the driving element 30 to a single circuit layer of the packaging substrate 10 and expose them through the first surface 101. Then, the first surface 101 of the packaging substrate 10 can be soldered and fixed to the printed circuit board in the lamp board by single-sided mounting, so as to realize the electrical connection between the light-emitting element 20, the driving element 30 and the printed circuit board without increasing the film layer structure of the printed circuit board, thereby effectively reducing the manufacturing cost.

[0052] Secondly, since the light-emitting element 20 and the driving element 30 are uniformly disposed on the packaging substrate 10, the light-emitting element 20 and the driving element 30 can be integrally mounted onto the printed circuit board in the lamp board using the packaging substrate 10 in the subsequent mounting process, thereby improving the problem of low yield caused by the independent mounting of the light-emitting element 20 and the driving element 30.

[0053] More importantly, since the distance between the surface of the light-emitting element 20 facing away from the packaging substrate 10 and the first surface 101 is greater than the distance between the surface of the driving element 30 facing away from the packaging substrate 10 and the first surface 101, the light emitted from the portion of the light-emitting element 20 above the driving element 30 will not be affected by the driving element 30. This helps to meet the large-angle light emission requirements of the light-emitting element 20 of the lamp board, reduces the problem of dark areas in the lamp board, and helps to improve optical uniformity.

[0054] Meanwhile, since the light-emitting element 20 and the driving element 30 are both disposed on the second surface 102, that is, the first surface 101 of the packaging substrate 10 does not need to be provided with electrical components, thereby ensuring the flatness of the first surface 101, improving the bonding quality, and avoiding structural interference during assembly.

[0055] Furthermore, since both the light-emitting element 20 and the driving element 30 are disposed on the second surface 102, it is possible to achieve electrical connection between the light-emitting element 20, the driving element 30 and the printed circuit board by utilizing the film layer structure of the front circuit layer of the first surface 101 + the back circuit layer of the second surface 102 + the connecting through-hole in the packaging substrate 10 when only two circuit layers are disposed in the packaging substrate 10. This is beneficial to simplifying the film layer structure of the packaging substrate 10 and reducing the cost of the packaging device 01.

[0056] Referring again to Figures 1 to 13, in some embodiments of this application, the driving element 30 includes a driving chip 31, and the light-emitting element 20 includes an LED chip 21, wherein the thickness of the driving chip 31 is less than the thickness of the LED chip 21.

[0057] In the packaging device 01 provided in this application embodiment, the driver chip 31 is a major component of the driver element 30. That is, the thickness of the driver chip 31 directly affects the distance between the surface of the driver element 30 facing away from the packaging substrate 10 and the first surface 101. Similarly, the LED chip 21 is the only component or a major component of the light-emitting element 20. That is, the thickness of the LED chip 21 directly affects the distance between the surface of the light-emitting element 20 facing away from the packaging substrate 10 and the first surface 101. Therefore, this application controls the specifications of the driver chip 31 and the LED chip 21, making the thickness of the driver chip 31 smaller than the thickness of the LED chip 21, to minimize the impact of the driver element 30 on the side light emission of the light-emitting element 20, thereby improving the dark area problem and enhancing optical uniformity.

[0058] Referring to Figures 1 and 2, in the packaged device 01 shown in Figure 1, its light-emitting element 20 is an LED chip 21, specifically a blue LED chip; in the packaged device 01 shown in Figure 2, its light-emitting element 20 is a chip-scale package (CSP), which includes an LED chip 21 and encapsulating adhesive 22. The LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer, which includes a color conversion material and silicone. The color conversion material can be phosphor or quantum dot material.

[0059] It should be noted that the advantages of the packaging device 01 shown in Figure 1 include that the structure of the light-emitting element 20 is simpler, the light-emitting element 20 does not need to be packaged in advance, and the manufacturing process of the packaging device 01 is simpler; the advantages of the packaging device 01 shown in Figure 2 are that the light-emitting element 20 is a chip-level package, and after the light-emitting element 20 is mounted, it can be sorted and tested to screen out defective products in advance, avoiding the waste of the driving element 30 and the increase in rework costs caused by the defect of the light-emitting element 20 after the driving element 30 is mounted.

[0060] Referring again to Figures 3 to 9, 12 and 13, in some embodiments of this application, the light-emitting element 20 includes an LED chip 21, and the LED chip 21 does not overlap with the driving element 30 in a direction parallel to the first surface 101.

[0061] The applicant further discovered in internal research that, since the light-emitting element 20 and the driving chip 31 are uniformly packaged in the packaging device 01, and the size of the packaging device 01 needs to be as small as possible, the spacing between the light-emitting element 20 and the driving element 30 is small, thereby enhancing the influence of the driving element 30 on the light emission angle of the light-emitting element 20 in the same packaging device 01. The LED chip 21 is the basic light-emitting element in the light-emitting element 20. This application ensures that the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101, thereby avoiding the driving element 30 from blocking the side light emission of the light-emitting element 20. This significantly improves the light emission angle and light pattern of the packaging device 01, thereby improving the optical uniformity of the lamp board using the packaging device 01 and eliminating dark area problems.

[0062] Referring to Figures 3 to 6, in some embodiments of this application, the packaging device 01 further includes a padding layer 50, and the LED chip 21 is electrically connected to the packaging substrate 10 through the padding layer 50, wherein the padding layer 50 is disposed between the LED chip 21 and the packaging substrate 10.

[0063] In the packaging device 01 provided in this application embodiment, a padding layer 50 of a certain thickness is provided between the LED chip 21 and the packaging substrate 10. The padding layer 50 is used to raise the height of the LED chip 21, thereby preventing the LED chip 21 from overlapping with the driving element 30 in the direction parallel to the first surface 101. This avoids the driving element 30 blocking the side light emission of the light-emitting element 20, greatly improving the light emission angle and light pattern of the packaging device 01, thereby improving the optical uniformity of the lamp board using the packaging device 01 and eliminating the dark area problem.

[0064] In addition, since the LED chip 21 is electrically connected to the packaging substrate 10 through the padding layer 50, the padding layer 50 does not affect the electrical connection between the light-emitting element 20 and the packaging substrate 10, thereby ensuring the electrical connection stability between the light-emitting element 20, the driving element 30, and the printed circuit board in the lamp board.

[0065] Referring to Figures 3 and 4, in some embodiments of this application, the padding layer 50 is a part of the encapsulation substrate 10, such as the padding layer 50 being the first protrusion 11 in the encapsulation substrate 10.

[0066] In the packaging device 01 provided in this application embodiment, the gasket layer 50 is part of the packaging substrate 10. That is, after the packaging substrate 10 is manufactured, the packaging substrate 10 has a protruding first protrusion 11 on its second surface 102. Since the gasket layer 50 is integrated into the packaging substrate 10, the types of materials can be reduced and the assembly efficiency can be improved.

[0067] In some embodiments of this application, the packaging substrate 10 includes a first metal layer, the first metal layer including the first protrusion 11 and a driving terminal, the driving terminal being electrically connected to the driving chip 31 in the driving element 30.

[0068] Referring again to Figures 3 and 4, in some embodiments of this application, the packaged device 01 further includes a first pad disposed between the pad layer 50 and the light-emitting element 20, and the thickness of the pad layer 50 is less than the thickness of the driving element 30.

[0069] In the packaging device 01 provided in this application embodiment, the thickness of the first pad of the light-emitting element 20 is used to fix the pad layer 50 and the light-emitting element 20 together with the pad layer 50 to raise the LED chip 21. This reduces the thickness of the pad layer 50 and lowers the cost while ensuring that the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0070] Referring again to Figures 3 and 4, in the encapsulation device 01 shown in Figure 3, its light-emitting element 20 is an LED chip 21, specifically a blue LED chip; in the encapsulation device 01 shown in Figure 4, its light-emitting element 20 is a chip-level package, the light-emitting element 20 includes an LED chip 21 and encapsulating adhesive 22, wherein the LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer, the color conversion adhesive layer includes a color conversion material and silicone, and the color conversion material can be phosphor or quantum dot material.

[0071] It should be noted that in other embodiments of this application, the first pad may be omitted, and / or the thickness of the first protrusion 11 may be greater than or equal to the thickness of the driving element 30.

[0072] Referring to Figures 5 and 6, in some embodiments of this application, the padding layer 50 is a part of the light-emitting element 20, such as the padding layer 50 being the second protrusion 23 in the light-emitting element 20.

[0073] In the packaging device 01 provided in this application embodiment, the padding layer 50 is part of the light-emitting element 20. That is, after the light-emitting element 20 is manufactured, the light-emitting element 20 has a protruding second protrusion 23 on its backlight side surface. Since the padding layer 50 is integrated into the light-emitting element 20, the types of materials can be reduced and the assembly efficiency can be improved.

[0074] In some embodiments of this application, the LED chip 21 in the light-emitting element 20 includes an electrode metal layer, and the electrode metal layer includes the second protrusion 23.

[0075] Referring again to Figures 5 and 6, in some embodiments of this application, the packaging device 01 further includes a second pad disposed between the pad layer 50 and the packaging substrate 10, and the thickness of the pad layer 50 is less than the thickness of the driving element 30.

[0076] In the packaging device 01 provided in this application embodiment, the thickness of the second pad of the packaging substrate 10 is used to fix the pad layer 50 and the packaging substrate 10 together with the pad layer 50 to raise the LED chip 21. This reduces the thickness of the pad layer 50 and lowers the cost while ensuring that the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0077] It should be noted that in other embodiments of this application, the second pad may be omitted, and / or the thickness of the second protrusion 23 may be greater than or equal to the thickness of the driving element 30.

[0078] Referring again to Figures 5 and 6, in the encapsulation device 01 shown in Figure 5, its light-emitting element 20 is an LED chip 21, specifically a blue LED chip; in the encapsulation device 01 shown in Figure 6, its light-emitting element 20 is a chip-level package, the light-emitting element 20 includes an LED chip 21 and encapsulating adhesive 22, wherein the LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer, the color conversion adhesive layer includes a color conversion material and silicone, and the color conversion material can be phosphor or quantum dot material.

[0079] Of course, except for the cases shown in Figures 3 to 6, the pad layer 50 can be independent of the encapsulation substrate 10 and the light-emitting element 20. For example, the pad layer 50 is a metal pad, and the metal pad has a solder material layer on the side facing the encapsulation substrate 10 and the side facing the light-emitting element 20, respectively.

[0080] Referring to Figures 7 and 8, in some embodiments of this application, the thickness of the encapsulation substrate 10 is greater than the thickness of the driving element 30, and the encapsulation substrate 10 has a groove 103 on the side of the second surface 102 opposite to the first surface 101, and the driving element 30 is accommodated in the groove 103.

[0081] In the packaging device 01 provided in this application embodiment, since the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, a groove can be made in a local area of ​​the packaging substrate 10 to form a recess 103 on the side of the second surface 102 opposite to the first surface 101, which can completely accommodate the driving element 30. That is, the depth of the recess 103 is greater than or equal to the thickness of the driving element 30. Furthermore, when the driving element 30 is subsequently installed, it can be placed within the recess 103, thereby preventing the LED chip 21 from overlapping with the driving element 30 in the direction parallel to the first surface 101. This avoids the driving element 30 blocking the side light emission of the light-emitting element 20, significantly improving the light emission angle and light pattern of the packaging device 01, thereby improving the optical uniformity of the lamp board using the packaging device 01 and eliminating dark area problems.

[0082] In some embodiments of this application, the bottom of the groove 103 is provided with a heat dissipation through hole.

[0083] In the packaged device 01 provided in this application embodiment, since the driving element 30 is housed within the groove 103, when the driving element 30 generates heat due to prolonged operation, the deep groove 103, which strongly encloses the driving element 30, severely restricts heat dissipation. This application improves the heat dissipation efficiency of the driving element 30, enhances its operational stability, and extends its service life by providing a heat dissipation hole at the bottom of the groove 103.

[0084] Referring again to Figures 7 and 8, in the encapsulation device 01 shown in Figure 7, its light-emitting element 20 is an LED chip 21, specifically a blue LED chip; in the encapsulation device 01 shown in Figure 8, its light-emitting element 20 is a chip-level package, the light-emitting element 20 includes an LED chip 21 and encapsulating adhesive 22, wherein the LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer, the color conversion adhesive layer includes a color conversion material and silicone, and the color conversion material can be phosphor or quantum dot material.

[0085] In other embodiments of this application, the depth of the groove 103 is less than the thickness of the driving element 30, that is, at least a portion of the driving element 30 is exposed from the groove 103. The advantage of this structural arrangement is that, on the one hand, it reduces the obstruction of the driving element 30 to the side light emission of the light-emitting element 20, and on the other hand, it allows at least a portion of the driving element 30 to be exposed, thereby improving the heat dissipation efficiency of the driving element 30, enhancing its operational stability, and extending its service life.

[0086] Optionally, the thickness of the welding material layer between the LED chip 21 and the packaging carrier 24 is a first thickness, and the thickness of the driving element 30 protruding from the groove 103 is a second thickness, wherein the first thickness is equal to the second thickness.

[0087] In the packaging device 01 provided in this application embodiment, since a welding material layer with a first thickness is provided between the LED chip 21 and the packaging carrier 24, that is, the welding material layer has raised the LED chip 21 by a height of the first thickness, when the thickness of the driving element 30 protruding from the groove 103 is equal to the first thickness, it can effectively improve the heat dissipation efficiency of the driving element 30, and also ensure that the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101, thereby greatly improving the light emission angle and light pattern of the packaging device 01, and further improving the optical uniformity of the lamp board using the packaging device 01, eliminating the dark area problem.

[0088] Referring to FIG9, in some embodiments of this application, the light-emitting element 20 includes a carrier plate 24, an LED chip 21, and an encapsulating adhesive 22. The carrier plate 24 is welded and fixed to the encapsulation substrate 10. The LED chip 21 is disposed on the side of the carrier plate 24 away from the encapsulation substrate 10. The encapsulating adhesive 22 covers the LED chip 21.

[0089] In the packaging device 01 provided in this application embodiment, the light-emitting element 20 includes a carrier plate 24, an LED chip 21, and encapsulating adhesive 22. That is, the light-emitting element 20 is a near-chip scale package (NCSP) including the carrier plate 24. The LED chip 21 is welded and electrically connected to the packaging substrate 10 through the carrier plate 24, and the encapsulating adhesive 22 is used to seal the LED chip 21. Since the carrier plate 24 is disposed between the LED chip 21 and the packaging substrate 10, the carrier plate 24 itself can increase the height of the LED chip 21, so that the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101. This greatly improves the light emission angle and light pattern of the packaging device 01, thereby improving the optical uniformity of the lamp board using the packaging device 01 and eliminating the dark area problem.

[0090] In some embodiments of this application, the carrier plate 24 is provided with a welding material layer on the side facing the packaging substrate 10 and the side facing the LED chip 21, wherein the thickness of the carrier plate 24 is less than the thickness of the driving element 30.

[0091] In the packaging device 01 provided in this application embodiment, since the welding material layer on the side of the carrier plate 24 facing the packaging substrate 10 and the welding material layer on the side of the carrier plate 24 facing the LED chip 21 both have a certain thickness, even if the thickness of the carrier plate 24 is less than the thickness of the driving element 30, it is still possible to make the sum of the thickness of the carrier plate 24 and the two welding material layers greater than the thickness of the driving element 30. This ensures that the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101, thereby significantly improving the light emission angle and light pattern of the packaging device 01, and further improving the optical uniformity of the lamp board using the packaging device 01, eliminating the dark area problem.

[0092] Of course, in other embodiments of this application, the side of the carrier plate 24 facing the packaging substrate 10 may not have a soldering material layer, the side of the carrier plate 24 facing the LED chip 21 may not have a soldering material layer, and the thickness of the carrier plate 24 may be greater than or equal to the thickness of the driving element 30.

[0093] Referring again to Figures 1, 10, and 11, in some embodiments of this application, the light-emitting element 20 includes an LED chip 21, which overlaps at least partially with the driving element 30 in a direction parallel to the first surface 101. The driving element 30 includes a driving chip 31 and a reflective adhesive 32, which covers the driving chip 31.

[0094] In the encapsulation device 01 provided in this application embodiment, since the LED chip 21 and the driving element 30 overlap at least partially in the direction parallel to the first surface 101, the driving element 30 will cause some obstruction to the side-emitted light of the LED chip 21. This application reduces the absorption of the side-emitted light of the LED chip 21 by the driving chip 31 by the driving chip 31 through the coating of the reflective adhesive 32, thereby improving the light extraction efficiency. Furthermore, the reflective adhesive 32 disposed on the top surface of the driving chip 31 allows the top surface of the driving element 30 to reflect some light, thereby reducing the dark area effect.

[0095] In some embodiments of this application, the reflective adhesive 32 includes at least one inclined sidewall 321, and the distance between the inclined sidewall 321 and the adjacent light-emitting element 20 gradually increases in the direction in which the second surface 102 is away from the first surface 101.

[0096] In the encapsulation device 01 provided in this application embodiment, since the distance between the inclined sidewall 321 and the adjacent light-emitting element 20 gradually increases in the direction of the second surface 102 away from the first surface 101, the inclined sidewall 321 can be used to adjust the reflection angle of the side-emitted light of the LED chip 21, adjust the side-emitted light to a large-angle emitted light, and make it emit from the encapsulation device 01, thereby further reducing the dark area effect and improving the optical uniformity of the lamp board using the encapsulation device 01.

[0097] Referring again to Figures 10 and 11, in the encapsulation device 01 shown in Figure 10, its light-emitting element 20 is an LED chip 21, specifically a blue LED chip; in the encapsulation device 01 shown in Figure 11, its light-emitting element 20 is a chip-level package, the light-emitting element 20 includes an LED chip 21 and encapsulating adhesive 22, wherein the LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer, the color conversion adhesive layer includes a color conversion material and silicone, and the color conversion material can be phosphor or quantum dot material.

[0098] Referring again to Figures 1 to 11, in some embodiments of this application, the encapsulation device 01 further includes a transparent adhesive 40, which covers the light-emitting element 20 and the driving element 30.

[0099] In the encapsulation device 01 provided in this application embodiment, the transparent adhesive 40 is used to seal the light-emitting element 20 and the driving element 30 to protect the light-emitting element 20 and the driving element 30 and improve the reliability of the encapsulation device 01.

[0100] Referring to Figures 12 and 13, in some embodiments of this application, the encapsulation device 01 further includes a transparent adhesive 40, which covers the light-emitting element 20. The orthographic projection of the transparent adhesive 40 on the encapsulation substrate 10 does not overlap with the orthographic projection of the driving element 30 on the encapsulation substrate 10. The light-emitting surface of the transparent adhesive 40 is curved.

[0101] In the encapsulation device 01 provided in this embodiment, since the transparent adhesive 40 covers the light-emitting element 20, and the orthographic projection of the transparent adhesive 40 on the encapsulation substrate 10 does not overlap with the orthographic projection of the driving element 30 on the encapsulation substrate 10, that is, the transparent adhesive 40 only covers the light-emitting element 20 and does not cover the driving element 30. Because the transparent adhesive 40 does not cover the driving element 30, the obstruction of heat dissipation by the transparent adhesive 40 on the driving element 30 can be avoided, reducing the risk of the smaller, less heat-dissipating driving element 30 failing due to overheating.

[0102] Based on this, since the transparent adhesive 40 only covers the light-emitting element 20, the transparent adhesive 40 can be designed with the light-emitting element 20 as the center, and by making the light-emitting surface of the transparent adhesive 40 curved, a curved lens is formed to adjust the emission angle of the light emitted from the side of the light-emitting element 20, thereby improving the dark area problem and enhancing the optical uniformity of the lamp board using the encapsulation device 01.

[0103] Furthermore, and more importantly, as shown in FIG12, since the driver chip 31 is not covered by the transparent adhesive 40, even if the light-emitting element 20 is an LED chip 21, the LED chip 21 can still be covered and encapsulated by the transparent adhesive 40, and then sorted, thereby screening out defective products in advance and avoiding the problem of increased production costs caused by scrapping the LED chip 21 and the driver element 30 together.

[0104] Referring again to Figures 12 and 13, in some embodiments of this application, the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101. The thickness of the encapsulation substrate 10 is greater than the thickness of the driving element 30. The encapsulation substrate 10 has a groove 103 on the side of the second surface 102 facing away from the first surface 101. The driving element 30 is housed in the groove 103. The thickness of the driving element 30 is the same as the depth of the groove 103. Furthermore, the light-emitting surface of the transparent adhesive 40 is curved.

[0105] In the encapsulation device 01 provided in this application embodiment, since the LED chip 21 and the driving element 30 do not overlap, and the driving element 30 is housed in the groove 103, and the thickness of the driving element 30 is the same as the depth of the groove 103, the driving element 30 and the encapsulation substrate 10 can jointly form a flat bearing surface. The driving element 30 will not affect the molding of the transparent adhesive 40, thereby facilitating the formation of a higher quality transparent adhesive 40 with a curved light-emitting surface, and thus improving the optical effect of the encapsulation device 01.

[0106] Referring again to Figures 12 and 13, in the encapsulation device 01 shown in Figure 12, its light-emitting element 20 is an LED chip 21, specifically a blue LED chip; in the encapsulation device 01 shown in Figure 13, its light-emitting element 20 is a chip-level package, the light-emitting element 20 includes an LED chip 21 and encapsulating adhesive 22, wherein the LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer, the color conversion adhesive layer includes a color conversion material and silicone, and the color conversion material can be phosphor or quantum dot material.

[0107] In some embodiments of this application, the number of light-emitting elements 20 in each of the encapsulation devices 01 is one.

[0108] In some embodiments of this application, the packaging substrate 10 may be a glass-based packaging substrate 10, a ceramic-based packaging substrate 10, or a printed circuit board. When the packaging substrate 10 includes a recess 103, the packaging substrate 10 is preferably a ceramic-based packaging substrate 10.

[0109] Secondly, embodiments of this application provide a lamp board 100. Referring to Figures 14 to 19, various embodiments of this application illustrate multiple lamp boards 100 with different structures. The lamp board 100 includes a substrate 03 and multiple encapsulation devices 01 as described above. The multiple encapsulation devices 01 are disposed on the same side of the substrate 03 and are electrically connected to the substrate 03.

[0110] In the lamp board 100 provided in this application embodiment, the substrate 03 includes a circuit film layer. Since multiple packaging structures 02 are disposed on the same side of the substrate 03, the substrate 03 can be a printed circuit board with fewer circuit film layers. Furthermore, the light-emitting element 20 and driving element 30 in each package device 01 can be mounted onto the substrate 03 in one go by single-sided mounting, thereby improving assembly efficiency and reducing the manufacturing cost of the substrate 03.

[0111] Referring to FIG14, in some embodiments of this application, in the lamp board 100, a plurality of the encapsulation devices 01 are arrayed on the substrate 03, and the driving element 30 in each encapsulation device 01 drives only the light-emitting element 20 in the corresponding encapsulation device 01.

[0112] Referring to Figures 15 to 19, in some embodiments of this application, the lamp board 100 includes a substrate 03, a plurality of encapsulation structures 02, and a plurality of encapsulation devices 01 as described above. The plurality of encapsulation structures 02 and the plurality of encapsulation devices 01 are disposed on the same side of the substrate 03. The encapsulation structure 02 includes a light-emitting element 20. The light-emitting element 20' in the encapsulation structure 02 and the light-emitting element 20 in the encapsulation device 01 have the same light-emitting color, and the light-emitting element 20' in the encapsulation structure 02 is electrically connected to a driving element 30 in one of the encapsulation devices 01.

[0113] In the lamp board 100 provided in this application embodiment, since the light-emitting element 20 in the encapsulation structure 02 and the light-emitting element 20' in the encapsulation device 01 have the same light-emitting color, the light-emitting element 20' in the encapsulation structure 02 can be electrically connected to a driving element 30 in the encapsulation device 01. This allows one driving element 30 to simultaneously drive the light-emitting element 20 in the encapsulation device 01 and at least one light-emitting element 20' in the encapsulation structure 02, thereby reducing the number of driving elements 30, lowering costs, further improving dark area problems, and enhancing the optical uniformity of the lamp board 100.

[0114] Referring to Figure 15, the lamp panel 100 can be divided into multiple lamp groups 101. Each lamp group 101 includes one encapsulation device 01 and three encapsulation structures 02. The light-emitting elements 20' in all the encapsulation structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the encapsulation device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has four driving channels to control the encapsulation device 01 and the encapsulation structure 02 to emit light individually.

[0115] Referring to Figure 16, the lamp panel 100 can be divided into multiple lamp groups 101. Each lamp group 101 includes one encapsulation device 01 and seven encapsulation structures 02. The light-emitting elements 20' in all the encapsulation structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the encapsulation device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has eight driving channels to control the encapsulation device 01 and the encapsulation structure 02 to emit light individually.

[0116] Referring to Figure 17, the lamp panel 100 can be divided into multiple lamp groups 101. Each lamp group 101 includes one encapsulation device 01 and eleven encapsulation structures 02. The light-emitting elements 20' in all the encapsulation structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the encapsulation device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has twelve driving channels to control the encapsulation device 01 and the encapsulation structure 02 to emit light individually.

[0117] Referring to Figure 18, the lamp panel 100 can be divided into multiple lamp groups 101. Each lamp group 101 includes one encapsulation device 01 and three encapsulation structures 02. The light-emitting elements 20 in all the encapsulation structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the encapsulation device 01 in the lamp group 101. In any two adjacent lamp groups 101, the driving element 30 in one of the encapsulation devices 01 is located on the first side of the corresponding light-emitting element 20, and the driving element 30 in the other encapsulation device 01 is located on the second side of the corresponding light-emitting element 20 (the second side is different from the first side). This arrangement of the driving elements 30 in the multiple encapsulation devices 01 is non-linear, improving the dark line problem caused by the relatively dark area and linear distribution of dark areas where the driving element 30 is located.

[0118] Referring to Figure 19, the lamp panel 100 can be divided into multiple lamp groups 101. Each lamp group 101 includes one encapsulation device 01 and three encapsulation structures 02. The light-emitting elements 20' in all the encapsulation structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the encapsulation device 01 in the lamp group 101. In any two adjacent lamp groups 101, the relative position of one of the encapsulation devices 01 in the lamp group 101 is different from the relative position of the other encapsulation device 01 in the lamp group 101. This allows the driving elements 30 in the multiple encapsulation devices 01 to be arranged non-linearly, improving the dark line problem caused by the relatively dark area and linear distribution of dark areas where the driving elements 30 are located.

[0119] Figure 20 is a schematic diagram of the film structure of the lamp panel cut along line AB shown in Figure 15. Referring to Figures 15 and 20, the encapsulation device 01 and the encapsulation structure 02 are disposed on the substrate 03. The encapsulation device 01 includes an encapsulation substrate 10, a light-emitting element 20, a driving element 30, and a transparent adhesive 40. The transparent adhesive 40 covers the light-emitting element 20. The orthographic projection of the transparent adhesive 40 onto the encapsulation substrate 10 does not overlap with the orthographic projection of the driving element 30 onto the encapsulation substrate 10. The light-emitting surface of the transparent adhesive 40 is curved. In a direction parallel to the first surface 101, the LED chip 21 and the driving element 30... The driving elements 30 do not overlap. The thickness of the encapsulation substrate 10 is greater than the thickness of the driving element 30. The encapsulation substrate 10 has a groove 103 on the side of the second surface 102 facing away from the first surface 101. The driving element 30 is housed within the groove 103, and the thickness of the driving element 30 is the same as the depth of the groove 103. The encapsulation structure 02 includes an encapsulation substrate 10', a light-emitting element 20', and a transparent adhesive 40'. The transparent adhesive 40' covers the light-emitting element 20', and the light-emitting surface of the transparent adhesive 40' is curved. Furthermore, the light-emitting element 20 in the encapsulation device 01 is an unencapsulated LED chip, and the light-emitting element 20' in the encapsulation structure 02 is also an unencapsulated LED chip.

[0120] In the lamp board 100 provided in this application embodiment, the encapsulation substrate 10 in the encapsulation device 01 can maintain the same structure as the encapsulation substrate 10' in the encapsulation structure 02, the light-emitting element 20 in the encapsulation device 01 can maintain the same structure as the light-emitting element 20' in the encapsulation structure 02, the structure of the transparent adhesive 40 in the encapsulation device 01 can maintain the same structure as the transparent adhesive 40' in the encapsulation structure 02, and the light-emitting element 20 in the encapsulation device 01 is not affected by the driving element 30. The light emission height of the encapsulation device 01 and the light emission height of the encapsulation structure 02 are consistent. Therefore, the light emission effect of the encapsulation device 01 and the light emission effect of the encapsulation structure 02 can be made to be consistent, which is beneficial to improving the optical effect of the lamp board 100. Based on this, since the transparent adhesive 40 in the encapsulation device 01 does not cover the driving element 30, and the light-emitting element 20 in the encapsulation device 01 and the light-emitting element 20' in the encapsulation structure 02 are both unencapsulated LED chips, the dispensing process of the transparent adhesive can be used as the encapsulation process for the LED chips. Therefore, after the encapsulation device 01 and the encapsulation structure 02 complete the encapsulation process corresponding to the dispensing of transparent adhesive together, they can perform sorting operations together to screen out defective products. After that, the mounting of the driving element 30 in the encapsulation device 01 can be completed, which can greatly improve production efficiency, avoid waste of the driving element 30, and reduce production costs.

[0121] Figure 21 is a schematic diagram of the film structure of the lamp panel cut along line CD shown in Figure 16. Referring to Figures 16 and 21, the encapsulation device 01 and the encapsulation structure 02 are disposed on the substrate 03. The encapsulation device 01 includes an encapsulation substrate 10, a light-emitting element 20, a driving element 30, and a transparent adhesive 40. The light-emitting element 20 includes a carrier plate 24, an LED chip 21, and encapsulating adhesive 22. The carrier plate 24 is welded and fixed to the encapsulation substrate 10. The LED chip 21 is disposed on the side of the carrier plate 24 facing away from the encapsulation substrate 10, and the encapsulating adhesive 22 covers the LED chip 21. The encapsulation structure 02 is a light-emitting element 20', which includes a carrier plate 24', an LED chip 21', and encapsulating adhesive 22'. The carrier plate 24' is welded and fixed to the substrate 03. The LED chip 21' is disposed on the side of the carrier plate 24' facing away from the substrate 03, and the encapsulating adhesive 22' covers the LED chip 21'.

[0122] In the lamp board 100 provided in this embodiment, the carrier plate 24 can raise the height of the LED chip 21, thereby ensuring that the packaged device 01 is positioned parallel to the first surface 101. The LED chip 21 and the driving element 30 do not overlap, thus preventing the light-emitting element 20 in the packaged device 01 from being affected by the driving element 30, thereby improving the dark area problem and giving the lamp board 100 a more uniform optical effect. Furthermore, since both the light-emitting element 20 in the packaged device 01 and the packaged structure 02 are near-chip-level packages including the carrier plate 24, they can be independently sorted to ensure their light-emitting quality. In addition, the light-emitting element 20 in the packaged device 01 can maintain the same structure as the packaged structure 02, i.e., correspond to the same material, thereby reducing material costs, simplifying process steps, and improving production efficiency.

[0123] Figure 22 is a schematic diagram of the film structure of the lamp panel cut along line EF shown in Figure 17. Referring to Figures 17 and 22, in some embodiments of this application, the encapsulation device 01 includes an encapsulation substrate 10, a light-emitting element 20, a driving element 30, and a transparent adhesive 40. The light-emitting element 20 includes an LED chip 21 and an encapsulating adhesive 22. The LED chip 21 can be a blue LED chip, and the encapsulating adhesive 22 can be a color conversion adhesive layer. The color conversion adhesive layer includes a color conversion material and silicone. The color conversion material can be phosphor or quantum dot material. The driving element 30 includes a driving chip 31 and a reflective adhesive 32, with the reflective adhesive 32 covering the driving chip 31. The reflective adhesive 32 includes at least one inclined sidewall 321. In the direction of the second surface 102 away from the first surface 101, the distance between the inclined sidewall 321 and the adjacent light-emitting element 20 gradually increases. The encapsulation structure 02 is a light-emitting element 20', which includes an LED chip 21' and an encapsulating adhesive 22'. The LED chip 21' can be a blue LED chip, and the encapsulating adhesive 22' can be a color conversion adhesive layer. The color conversion adhesive layer includes a color conversion material and silicone. The color conversion material can be phosphor or quantum dot material.

[0124] In the lamp board 100 provided in this embodiment, since the distance between the inclined sidewall 321 and the adjacent light-emitting element 20 gradually increases in the direction of the second surface 102 away from the first surface 101, the inclined sidewall 321 can be used to adjust the reflection angle of the side-emitted light from the LED chip 21, adjusting the side-emitted light to a large-angle emitted light, and making it emitted from the encapsulation device 01, thereby further reducing the dark area effect and improving the optical uniformity of the lamp board 100. Furthermore, since both the light-emitting element 20 in the encapsulation device 01 and the encapsulation structure 02 are chip-level packages, the light-emitting element 20 in the encapsulation device 01 and the encapsulation structure 02 can also be independently sorted to ensure their light emission quality. In addition, the light-emitting element 20 in the encapsulation device 01 can maintain the same structure as the encapsulation structure 02, i.e., correspond to the same material, thereby reducing material costs, simplifying process steps, and improving production efficiency.

[0125] Thirdly, embodiments of this application provide a display device, which includes the lamp panel 100 described above.

[0126] In some embodiments of this application, the display device may be a liquid crystal display device, which includes a backlight module and a liquid crystal display panel, wherein the backlight module includes the lamp board 100.

[0127] In some embodiments of this application, the display device may be an LED direct-display display device, and the encapsulation device 01 in the lamp board 100 may serve as a display pixel to directly perform the display function.

[0128] In summary, this application provides an integrated optical drive packaging device, a lamp board, and a display device. The packaging device includes a packaging substrate, a light-emitting element, and a driving element. The packaging substrate has a first surface and a second surface facing each other. The light-emitting element is electrically connected to the packaging substrate, and the driving element is also electrically connected to the packaging substrate. Both the light-emitting element and the driving element are disposed on the side of the second surface opposite to the first surface. The orthographic projections of the driving element and the light-emitting element on the second surface do not overlap. Furthermore, the distance between the surface of the light-emitting element opposite to the packaging substrate and the first surface is greater than the distance between the surface of the driving element opposite to the packaging substrate and the first surface. This application can improve yield, reduce the impact of the driving element on the side light emission of the light-emitting chip, improve the optical uniformity of the lamp board, and enhance display quality while considering manufacturing costs.

[0129] The above provides a detailed description of the integrated optical drive packaging device, lamp board, and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A packaged device, wherein, The packaging device includes: The packaging substrate has opposing first and second surfaces; The light-emitting element is electrically connected to the packaging substrate; A driving element is electrically connected to the packaging substrate; The light-emitting element and the driving element are both disposed on the side of the second surface away from the first surface. The orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap. Furthermore, the distance between the surface of the light-emitting element away from the packaging substrate and the first surface is greater than the distance between the surface of the driving element away from the packaging substrate and the first surface.

2. The packaged device of claim 1, wherein, The light-emitting element includes an LED chip, and the LED chip does not overlap with the driving element in a direction parallel to the first surface.

3. The packaged device of claim 2, wherein, The packaging device further includes a pad layer, through which the LED chip is electrically connected to the packaging substrate, wherein the pad layer is disposed between the LED chip and the packaging substrate.

4. The packaged device of claim 2, wherein, The thickness of the packaging substrate is greater than the thickness of the driving element. The packaging substrate has a groove on the side of the second surface opposite to the first surface, and the driving element is housed in the groove.

5. The packaged device of claim 2, wherein, The light-emitting element includes a carrier plate, an LED chip, and encapsulating adhesive. The carrier plate is welded and fixed to the encapsulation substrate. The LED chip is disposed on the side of the carrier plate away from the encapsulation substrate. The encapsulating adhesive covers the LED chip.

6. The packaged device of claim 1, wherein, The light-emitting element includes an LED chip, which overlaps at least partially with the driving element in a direction parallel to the first surface. The driving element includes a driving chip and a reflective adhesive, which covers the driving chip. The reflective adhesive includes at least one inclined sidewall, and the distance between the inclined sidewall and its adjacent light-emitting element gradually increases in a direction away from the first surface on the second surface.

7. The packaged device of claim 1, wherein, The encapsulation device also includes a transparent adhesive that covers the light-emitting element and the driving element.

8. The packaged device of claim 7, wherein, The light-emitting element includes an LED chip, and the LED chip does not overlap with the driving element in a direction parallel to the first surface.

9. The packaged device of claim 8, wherein, The packaging device further includes a pad layer, through which the LED chip is electrically connected to the packaging substrate, wherein the pad layer is disposed between the LED chip and the packaging substrate.

10. The packaged device of claim 8, wherein, The thickness of the packaging substrate is greater than the thickness of the driving element. The packaging substrate has a groove on the side of the second surface opposite to the first surface, and the driving element is housed in the groove.

11. The packaging device according to claim 8, wherein, The light-emitting element includes a carrier plate, an LED chip, and encapsulating adhesive. The carrier plate is welded and fixed to the encapsulation substrate. The LED chip is disposed on the side of the carrier plate away from the encapsulation substrate. The encapsulating adhesive covers the LED chip.

12. The packaging device according to claim 7, wherein, The light-emitting element includes an LED chip, which overlaps at least partially with the driving element in a direction parallel to the first surface. The driving element includes a driving chip and a reflective adhesive, which covers the driving chip. The reflective adhesive includes at least one inclined sidewall, and the distance between the inclined sidewall and its adjacent light-emitting element gradually increases in a direction away from the first surface on the second surface.

13. The packaging device according to claim 1, wherein, The encapsulation device further includes a transparent adhesive that covers the light-emitting element. The orthographic projection of the transparent adhesive on the encapsulation substrate does not overlap with the orthographic projection of the driving element on the encapsulation substrate. The light-emitting surface of the transparent adhesive is curved.

14. The packaging device according to claim 13, wherein, The light-emitting element includes an LED chip, and the LED chip does not overlap with the driving element in a direction parallel to the first surface.

15. The packaging device according to claim 14, wherein, The packaging device further includes a pad layer, through which the LED chip is electrically connected to the packaging substrate, wherein the pad layer is disposed between the LED chip and the packaging substrate.

16. The packaging device according to claim 14, wherein, The thickness of the packaging substrate is greater than the thickness of the driving element. The packaging substrate has a groove on the side of the second surface opposite to the first surface, and the driving element is housed in the groove.

17. The packaging device according to claim 14, wherein, The light-emitting element includes a carrier plate, an LED chip, and encapsulating adhesive. The carrier plate is welded and fixed to the encapsulation substrate. The LED chip is disposed on the side of the carrier plate away from the encapsulation substrate. The encapsulating adhesive covers the LED chip.

18. The packaging device according to claim 13, wherein, The light-emitting element includes an LED chip, which overlaps at least partially with the driving element in a direction parallel to the first surface. The driving element includes a driving chip and a reflective adhesive, which covers the driving chip. The reflective adhesive includes at least one inclined sidewall, and the distance between the inclined sidewall and its adjacent light-emitting element gradually increases in a direction away from the first surface on the second surface.

19. A light panel, wherein, The lamp board includes a substrate, multiple encapsulation structures, and multiple encapsulation devices as described in claim 1, wherein the multiple encapsulation structures and multiple encapsulation devices are disposed on the same side of the substrate; wherein, each encapsulation structure includes a light-emitting element, the light-emitting elements in the encapsulation structure and the light-emitting elements in the encapsulation devices have the same light-emitting color, and the light-emitting element in the encapsulation structure is electrically connected to a driving element in one of the encapsulation devices.

20. A display device, wherein, The display device includes the lamp panel as described in claim 19.

Images