Heat sink and power conversion apparatus

Abstract

Disclosed in the present disclosure are a heat sink and a power conversion apparatus. The solution comprises an evaporator, a first condenser and a connecting pipe, wherein the evaporator comprises an evaporation chamber filled with a phase change medium and a heat dissipation surface configured to dissipate heat of a power device; the connecting pipe communicates a condensation chamber of the first condenser with the evaporation chamber; and the projection of the connecting pipe on the evaporator is located in the area where the evaporation chamber is located. When the heat sink of the present application is in operation, the power device is arranged at the heat dissipation surface, the heat generated by the power device causes a phase change working medium in the evaporation chamber to evaporate and absorb heat to form a vapor, the vapor enters the condensation chamber to release heat and condense, the condensed working medium returns to the evaporator through the connecting pipe, and the cycle continues, thereby achieving the effect of dissipating heat of the power device. In addition, in the present application, the projection of the connecting pipe on the evaporator is located in the evaporation chamber, and therefore the volume occupied by the entire heat sink can be reduced.

Description

A heat sink and power conversion device

[0001] This disclosure claims priority to the following Chinese patent application, the entire contents of which are incorporated herein by reference. Application No.: 2024230728657, Application Date: December 11, 2024, Applicant: Sungrow Power Supply Co., Ltd., Invention Title: A Radiator and Power Conversion Device. Technical Field

[0002] This disclosure relates to the field of heat dissipation technology for electronic components, and in particular to a heat sink and power conversion device. Background Technology

[0003] Existing power conversion equipment such as inverters and power storage converters (PCS) mainly use air cooling. As the power density of power conversion equipment increases, the losses of power devices such as insulated gate bipolar transistors (IGBTs) also increase significantly. The ever-increasing power density poses a greater challenge to the heat dissipation design of power devices.

[0004] Therefore, how to improve the heat dissipation efficiency of power devices has become a technical problem that urgently needs to be solved by those skilled in the art.

[0005] Public content

[0006] This disclosure proposes a heat sink and a power conversion device to improve the heat dissipation efficiency of power devices.

[0007] To achieve the above objectives, the present disclosure provides the following technical solutions:

[0008] In a first aspect, this disclosure provides a heat sink, including an evaporator, a first condenser and a connecting pipe, wherein the evaporator includes an evaporation chamber filled with a phase change medium and a heat dissipation surface for dissipating heat from power devices.

[0009] The connecting pipe and the condensing chamber of the first condenser are connected to the evaporating chamber; and the projection of the connecting pipe on the evaporator is located within the area of ​​the evaporating chamber.

[0010] In some examples, there are at least two first condensers, and the at least two first condensers are arranged sequentially in the height direction;

[0011] There are at least two evaporation chambers, and the evaporation chambers are connected to the corresponding condensation chambers.

[0012] In some examples, the evaporator includes at least two sub-evaporators, each of which includes an evaporation chamber; the at least two sub-evaporators are joined together.

[0013] In some examples, adjacent sub-evaporators are connected by a connector, which includes a connector body and mounting holes at both ends of the connector body, one mounting hole being mounted on one sub-evaporator and the other mounting hole being mounted on another sub-evaporator.

[0014] In some examples, the joint surface between two adjacent sub-evaporators is a plane or a curved surface.

[0015] In some examples, the joint surface between two adjacent sub-evaporators also includes a concave-convex mating part, where one sub-evaporator has a concave part and the other sub-evaporator has a convex part.

[0016] In some examples, the evaporator includes at least two evaporation chambers;

[0017] The evaporator includes a shell and a partition, with the partition arranged inside the shell to separate at least two evaporation chambers.

[0018] In some examples, at least two condensers are arranged vertically in the vertical direction, with airflow channels between adjacent condensers.

[0019] In some examples, the connecting pipe includes a first connecting pipe and a second connecting pipe that are respectively connected to the evaporation chamber, and in the height direction, the connection point of the first connecting pipe to the evaporator is higher than the connection point of the second connecting pipe to the evaporator.

[0020] In some examples, there are two first condensers, with the axis of the upper first condenser forming an acute angle with the height direction, and the axis of the lower first condenser forming an obtuse angle with the height direction.

[0021] In some examples, the radiator also includes a second condenser, the condensation chamber of which is connected to the evaporation chamber of the evaporator through an opening.

[0022] In some examples, in the vertical direction, the end of the second condenser furthest from the evaporator is higher than the end where the second condenser and evaporator are connected.

[0023] In some examples, the evaporator is provided with an opening, and the condensing chamber of the first condenser communicates with the evaporating chamber of the evaporator through the opening;

[0024] The first condenser includes a first connecting pipe, and in the vertical direction, the connection point between the first connecting pipe and the evaporator is located at the end of the first condenser away from the evaporator.

[0025] In some examples, in the height direction, the end of the first condenser furthest from the evaporator is higher than the end where the first condenser and evaporator are connected.

[0026] Secondly, this application provides a power conversion device, including a heat sink, a power device, and a chassis. The heat sink is disposed outside the chassis, and the power device is disposed inside the chassis and is in direct or indirect contact with the heat dissipation surface of the heat sink; and the heat sink is the heat sink as described in any one of the claims.

[0027] In some examples, the power conversion device also includes a heat sink that covers the chassis and houses the heat sink inside the heat sink.

[0028] In some examples, the power conversion device also includes an air-cooling system, which includes a fan and multiple air duct openings. The fan is located inside a heat sink, and the air duct openings are located on the top, bottom, side, or back of the heat sink.

[0029] In some examples, the fan is located below the radiator in the vertical direction.

[0030] In some examples, when the radiator includes at least two first condensers, the fan is located between two adjacent first condensers.

[0031] As can be seen from the above technical solution, when the heat sink of this application is working, the power device is directly arranged at the heat dissipation surface. The heat generated by the device causes the phase change working fluid in the evaporation chamber to evaporate and absorb heat to form steam. The steam enters the condensation chamber, releases heat, and condenses. The condensed working fluid returns to the evaporator through the connecting pipe, and this cycle repeats, thereby achieving the effect of heat dissipation for the power device. In addition, in this application, the projection of the connecting pipe on the evaporator is located inside the evaporation chamber, thus reducing the overall volume occupied by the heat sink. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this disclosure can be applied to other similar scenarios based on the provided drawings. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0033] Figure 1 is a perspective view of a heat sink provided in an embodiment of this disclosure;

[0034] Figure 2 is a side view of the radiator shown in Figure 1;

[0035] Figure 3 is a perspective view of a heat sink provided in an embodiment of this disclosure;

[0036] Figure 4 is an exploded view of the radiator shown in Figure 3;

[0037] Figure 5 is a side view of the radiator shown in Figure 3;

[0038] Figure 6a is a rear view of the radiator shown in Figure 3;

[0039] Figure 6b is a second rear view of the radiator shown in Figure 3;

[0040] Figure 6c is the rear view of the radiator shown in Figure 3.

[0041] Figure 7 is a perspective view of a power conversion device provided in an embodiment of this disclosure;

[0042] Figure 8 is a perspective view of a power conversion device with the heat sink removed, according to an embodiment of this disclosure;

[0043] Figure 9 is a perspective view of another heat sink provided in an embodiment of this disclosure;

[0044] Figure 10 is a side view of the radiator shown in Figure 9;

[0045] Figure 11 is a perspective view of another power conversion device provided in an embodiment of this disclosure;

[0046] Figure 12 is a perspective view of another power conversion device provided in an embodiment of this disclosure, with the heat sink removed;

[0047] Figure 13 is a perspective view of a third type of heat sink provided in an embodiment of this disclosure;

[0048] Figure 14 is a side view of the figure shown in Figure 13;

[0049] Figure 15 is a perspective view of a third power conversion device provided in an embodiment of this disclosure;

[0050] Figure 16 is a perspective view of the third power conversion device provided in the embodiments of this disclosure without the heat sink;

[0051] Figure 17 is a perspective view of the fourth type of heat sink provided in the embodiments of this disclosure;

[0052] Figure 18 is a sectional view of section AA in Figure 15;

[0053] Figure 19 is a side view of a fourth type of heat sink provided in an embodiment of this disclosure;

[0054] Figure 20 is a perspective view of a fourth power conversion device provided in an embodiment of this disclosure;

[0055] Figure 21 is a perspective view of the fourth power conversion device provided in the embodiments of this disclosure without the heat sink;

[0056] In the diagram: 10 - Heat sink; 20 - Power device; 30 - Chassis; 40 - Heat sink cover; 50 - Magnetic device; 60 - Fan;

[0057] 100 - Evaporator; 200 - First condenser; 300 - Connecting pipe; 400 - Connector; 500 - Second condenser;

[0058] 110 - Condensation surface; 120 - Heat dissipation surface; 130 - Evaporation chamber; 140 - Joint surface; 150 - Shell; 160 - Partition; 141 - Concave-convex mating part; 100a - Sub-evaporator;

[0059] 210 - Condensation chamber;

[0060] 310-First connecting pipe; 320-Second connecting pipe; 410-Connector; 420-Mounting hole; 430-Mounting hole; 510-Condensation chamber; 41-Air inlet; 42-Air outlet. Detailed Implementation

[0061] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant disclosure and not intended to limit the disclosure. The described embodiments are only a part of the embodiments of the present disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without inventive effort are within the scope of protection of the present disclosure.

[0062] As described in the background section, the power density of existing power conversion devices is increasing, and the heat dissipation requirements of power devices are also increasing. Relying solely on air cooling cannot fully meet the heat dissipation requirements of power devices. Therefore, improving the efficient heat dissipation of power devices is an urgent problem to be solved.

[0063] To alleviate the above problems, this application provides a radiator in which the power device is placed on the heat dissipation surface of the evaporator when it is working. The heat generated by the power device causes the phase change working fluid in the evaporation chamber to evaporate and absorb heat. The steam enters the condenser on the other side of the evaporator, releases heat and condenses. It returns to the evaporator through the connecting pipe located in the projection of the evaporation chamber. The phase change circuit is short, so it can absorb more heat per unit time and improve the heat dissipation efficiency of the power device.

[0064] In addition, the connecting pipe allows for easy return of the condensed liquid phase change medium to the evaporation chamber, improving the return efficiency of the phase change medium.

[0065] The radiator provided in the embodiments of this application will be described in detail below. According to one or more embodiments of this application, referring to Figures 1 to 2, the radiator 10 provided in the embodiments of this application may include an evaporator 100, a first condenser 200 and a connecting pipe 300, wherein the evaporator 100 includes an evaporation chamber 130 filled with a phase change medium and a heat dissipation surface 120 for dissipating heat from power devices; the connecting pipe 300 connects the condensation chamber 210 of the first condenser 200 with the evaporation chamber 130; and the projection of the connecting pipe 300 on the evaporator is located in the area where the evaporation chamber 130 is located.

[0066] When the heat sink 10 of this application is in operation, the power device 20 is installed at the heat dissipation surface 120. The heat generated by the device causes the phase change working fluid in the evaporation chamber 130 to evaporate and absorb heat to form steam. The steam enters the condensation chamber 210, releases heat, and condenses. The condensed working fluid returns to the evaporator 100 through the connecting pipe 300. This cycle repeats, improving the heat dissipation efficiency of the power device. In addition, in this application, the projection of the connecting pipe 300 on the evaporator 100 is located in the area of ​​the evaporation chamber 130, thereby absorbing more heat per unit time, improving the heat dissipation efficiency of the power device, and reducing the overall volume occupied by the heat sink 10.

[0067] The radiator 10 disclosed herein has a height direction Z, a length direction X, and a thickness direction Y, with the height direction Z, length direction X, and thickness direction Y intersecting each other. For example, the radiator 10 of this application utilizes gravity, and in use, the radiator 10 can be arranged with its height direction parallel to the direction of gravity. The corresponding evaporator 100 has a height direction, a length direction, and a thickness direction, wherein the height direction, length direction, and thickness direction of the evaporator 100 correspond to the height direction, length direction, and thickness direction of the radiator 10, respectively. Of course, if a drive pump is added to the system, and the power of the drive pump is used to complete the circulation of the phase change medium, this is also within the scope of protection of this application; in this case, the setting direction and position of the heat dissipation are not required.

[0068] The heat dissipation surface 120 of the evaporator 100 is used to dissipate heat from the power device 20. The power device 20 can be directly or indirectly mounted on the heat dissipation surface 120, or arranged near the heat dissipation surface 120, or the power device can contact the phase change medium through an opening on the evaporator surface. Additionally, the surface opposite the heat dissipation surface 120 is the condensation surface 110, and the first condenser 200 is mounted on the condensation surface 110. In the height direction, the height of the uppermost heat dissipation surface 120 is lower than the liquid level of the phase change medium in the evaporation chamber 130. This ensures that the power device 20 mounted at the mounting location always has a corresponding phase change working medium, reducing the risk of dry burning.

[0069] The number of the aforementioned first condensers 200 can be one or at least two, as shown in Figures 3 to 5, 9, 10, 13, and 14. At least two first condensers 200 are arranged sequentially in the vertical direction, corresponding to at least two evaporation chambers 130, each of which is connected to a corresponding condensation chamber 210. This application focuses on describing the scheme with two first condensers 200; for other cases where the number of first condensers 200 is different, the scheme with one first condenser 200 can be referred to.

[0070] At least two first condensers 200 are arranged along the height direction on the condensing surface 110, which can effectively reduce the problem of high size layout caused by the arrangement of multi-layer power devices 20, and improve the space utilization of the evaporator 100 in the overall layout. At the same time, different condensers are used for power devices 20 in different areas, which can release the temperature margin of power devices 20 and further reduce the cost of radiator 10. In the prior art, radiators designed with a single evaporator and a single condenser typically have the condenser positioned above the evaporator to facilitate the reflux of the phase change medium. When there are many power devices, multiple layers are arranged on the heat dissipation surface of the evaporator, which increases the overall size of the evaporator. This requires a corresponding increase in the heat exchange volume of the condenser, occupying more space above it. At the same time, the heat dissipation requirements of multiple power modules are different. The integrated evaporator structure has a larger margin for the heat dissipation requirements of power modules with lower losses, and there is room for further optimization of design costs. Therefore, the corresponding arrangement of at least two first condensers 200 and at least two evaporators 100 provided in the embodiments of this application can not only alleviate the problem of radiator design space, but also allow for the design of different radiators 10 for different power device heat dissipation requirements, thereby reducing design costs.

[0071] An evaporator 100 may be provided with one evaporation chamber 130 or at least two evaporation chambers 130. In Figures 3, 4, 5, 9, 10, 13 and 14, an evaporator 100 is provided with one evaporation chamber 130. In Figures 17 and 18, an evaporator 100 is provided with at least two evaporation chambers 130. The evaporator 100 includes a shell 150 and a partition 160, which divides the interior of the shell 150 into at least two evaporation chambers 130.

[0072] In some examples, at least two first condensers 200 are mounted on separate evaporators 100, as shown in Figures 3, 4, 5, 9, 10, 13, and 14. In still other examples, at least two first condensers 200 are mounted on the same evaporator 100.

[0073] To facilitate differentiation, the different evaporators 100 are defined as sub-evaporators 100a. Each sub-evaporator 100a is equipped with a first condenser 200, as shown in Figures 3, 9, and 13. The first condenser 200 corresponding to the power device 20 can be adjusted according to requirements. After the first condenser 200 and the corresponding sub-evaporator 100a are assembled, the sub-evaporators 100a connected to the corresponding first condenser 200 are finally spliced ​​together. This can reduce the height of the radiator 10, improve space utilization, and further reduce the cost of the radiator 10.

[0074] The design elements of multiple sub-evaporators 100a can be different. For example, the size of the evaporation plates can be different, the size of the evaporation chamber can be different, and the size and number of condensing plates of the condenser of the sub-evaporator 100a can be different. Different first condensers 200 and sub-evaporators 100a can be designed according to power devices 20 with different power ratings. The size of the condensing chamber 210 and evaporation chamber 130 of the first condenser 200 and sub-evaporator 100a, the number of heat dissipation fins, and the number of evaporation plates or microchannels can be adjusted. The corresponding first condenser 200 and sub-evaporator 100a can also be selected according to the requirements and heat dissipation requirements of the power device 20, as shown in Figures 3, 4, 5, 9, 10, 13, and 14.

[0075] Taking a first condenser 200 installed in a sub-evaporator 100a as an example, the evaporator 100 includes multiple sub-evaporators 100a, each sub-evaporator 100a including an evaporation chamber 130; two adjacent sub-evaporators 100a are spliced ​​together.

[0076] [Correction 10.10.2025 according to Rule 91] Referring to Figures 6a, 6b and 6c, Figures 6a, 6b and 6c show the projection of the radiator 10 on the ZX plane. Two adjacent sub-evaporators 100a are spliced ​​together in the first direction to form a splicing surface 140. The splicing surface 140 can be a plane or a curved surface. In the structures shown in Figures 6a and 4, the splicing surface 140 between the two sub-evaporators 100a is a plane, while in the structure shown in Figure 6c, the splicing surface 140 between the two sub-evaporators 100a is a curved surface.

[0077] [Correction 10.10.2025 based on Rule 91] To improve the connection strength between adjacent sub-evaporators 100a and facilitate installation, the splicing surface 140 between two adjacent sub-evaporators 100a may further include a concave-convex mating part 141, wherein one sub-evaporator 100a is provided with a concave part 141a and the other sub-evaporator 100a is provided with a convex part 141b. In the structure shown in Figure 4, the upper sub-evaporator 100a is provided with a rectangular concave part 141a, and the lower sub-evaporator 100a is provided with a rectangular convex part 141b that is flat; in the structure shown in Figure 4, the upper sub-evaporator 100a is provided with an arc-shaped concave part 141a, and the lower sub-evaporator 100a is provided with an arc-shaped convex part 141b. The concave portion 141a and convex portion 141b are fitted together so that the two sub-evaporators 100a do not overlap on the same plane when projected onto the YZ plane, thereby improving the connection strength of the splicing surface 140.

[0078] Adjacent sub-evaporators 100a can be mechanically connected, welded or bonded together by connector 400. In the radiator 10 shown in Figures 3 and 9, two sub-evaporators 100a are connected by connector 400. In the radiator 10 shown in Figure 13, two sub-evaporators 100a are connected together by welding or bonding.

[0079] For example, connector 400 includes connector 410 and mounting holes 420, 430 located at both ends of connector 410, one mounting hole 420 being mounted on one sub-evaporator 100a and the other mounting hole 430 being mounted on another sub-evaporator 100a.

[0080] The connecting pipe 300 serves to connect the evaporation chamber 130 and the condensation chamber 210. Using the connecting pipe 300 to connect the first condenser 200 and the evaporator 100 offers convenient installation. Furthermore, the length of the connecting pipe 300 can be adjusted according to actual needs, making it more versatile. In addition, the connecting pipe 300 can be a flexible pipe or a rigid material pipe. When it is a flexible pipe, the first condenser 200 can be supported by other structural components; when it is a rigid material pipe, the connecting pipe 300 has the capacity to support the first condenser 200, simplifying the connection structure of the radiator 10.

[0081] Referring to Figures 3 to 5, as well as Figures 9 and 10, the connecting pipe 300 may include a first connecting pipe 310 and a second connecting pipe 320 that are respectively connected to the evaporation chamber 130. In the height direction, the connection point between the first connecting pipe 310 and the evaporator 100 is higher than the connection point between the second connecting pipe 320 and the evaporator 100.

[0082] The first connecting pipe 310 carries steam from the evaporation chamber 130 into the condensation chamber 210, while the second connecting pipe 320 carries the condensing medium back from the condensation chamber 210 to the evaporation chamber 130. The first connecting pipe 310 facilitates the flow of phase-change steam from the evaporation chamber 130 to the condensation chamber 210, and the second connecting pipe 320 facilitates the flow of the condensing medium from the condensation chamber 210 to the evaporation chamber 130. The return flow of the phase-change medium has an independent pipeline, eliminating interference between the steam and condensing medium return flows.

[0083] In some examples, the axis O1 of the first condenser 200 is parallel to the height direction, as shown in Figure 5, where the axes O1 of both first condensers 200 are parallel to the height direction. In other examples, the axis O1 of the first condenser 200 forms an angle with the height direction, which can be acute, right, or obtuse. When there are two first condensers 200, there is an airflow channel between them. Referring to Figure 10, in the height direction, the angle α between the axis of the upper first condenser 200 and the height direction is acute, and the angle b between the axis of the lower first condenser 200 and the height direction is obtuse. The ends of the two first condensers 200 away from the evaporator are far apart, which expands the space of the airflow channel between them. This allows for the installation of structures such as fans, improving the space utilization of the radiator 10. In addition, the angled condensers increase the contact area with the airflow from the fan, improving heat dissipation efficiency. The axis O1 of the first condenser 200 is determined by its constituent structures. For example, when the first condenser 200 includes multiple heat dissipation pipes arranged along the length of the first condenser 200, the axis O1 of the first condenser 200 is the center line of the heat dissipation pipes, as shown in Figures 5, 10, 14, and 19. In Figure 5, the axis O1 of the first condenser 200 is parallel to the height direction, and the center line of the heat dissipation pipes constituting the first condenser 200 is parallel to the height direction. In Figure 10, the axes O1 of the two first condensers 200 are arranged at an angle relative to the height direction, and the center line of the heat dissipation pipes constituting the first condenser 200 is arranged at an angle relative to the height direction. The first condenser located at the top has an axis O1 that is inclined relative to the height direction. The axis O1 of the condenser 200 is inclined upward, and the axis O1 of the first condenser 200 located below is inclined downward; in Figure 14, the axes O1 of the two first condensers 200 are arranged to be inclined downward relative to the height direction, and the center line of the heat dissipation tubes that make up the first condenser 200 is arranged to be inclined downward relative to the height direction; in Figure 19, the axis O1 of the first condenser 200 is arranged to be inclined downward relative to the height direction, and the center line of the heat dissipation tubes that make up the first condenser 200 is arranged to be inclined downward relative to the height direction, while the axis O2 of the second condenser 500 is arranged to be inclined upward relative to the height direction, and the center line of the heat dissipation tubes that make up the second condenser 500 is arranged to be inclined upward relative to the height direction.

[0084] Referring to Figures 13 and 14, in some examples of this application, the evaporator 100 is provided with an opening, and the condensing chamber 210 of the first condenser 200 communicates with the evaporating chamber 130 through the opening; the first condenser 200 includes a first connecting pipe 310, and in the height direction, the connection point between the first connecting pipe 310 and the evaporator 100 is located at the end of the first condenser 200 away from the evaporator 100.

[0085] The vaporized steam in the evaporation chamber 130 directly enters the condensation chamber 210. After heat exchange, the condensed medium in the condensation chamber 210 flows back to the evaporation chamber 130 through the first connecting pipe 310.

[0086] In the vertical direction, the end of the first condenser 200 furthest from the evaporator 100 is lower than the end where the first condenser 200 and the evaporator 100 are connected. Because the first condenser 200 is arranged at an angle, the condensing medium can quickly flow back to the evaporation chamber 130 through the first connecting pipe 310 under its own gravity, shortening the circulation time of the cooling medium and improving heat dissipation efficiency.

[0087] The condensing chamber 210 of the first condenser 200 is composed of multiple plates or flat tubes with internal flow channels. One end of each plate or flat tube is open and connected to an opening on the evaporator 100. Steam from the evaporator chamber 130 can directly pass through the opening of the evaporator chamber 130 and the condensing chamber 210 of the first condenser 200 with flow channels. In this case, no piping is needed to connect the evaporator chamber 130 and the condensing chamber 210.

[0088] The function of the first connecting pipe 310 here is to facilitate reflux. In order to accelerate the reflux, in the height direction, the end of the first condenser 200 that is closer to the evaporator 100 is higher than the end of the first condenser that is farther away from the evaporator 100. That is, the end of the first condenser 200 that is farther away from the evaporator is arranged downwards, so that the condensing medium can flow back into the evaporation chamber 130 through the first connecting pipe 310, thereby improving the reflux efficiency.

[0089] Referring to Figures 17 to 19, the radiator 10 of this application may further include a second condenser 500, and the evaporator 100 includes an opening. The condensing chamber 510 of the second condenser 500 is connected to the evaporating chamber 130 through the opening. By directly connecting the evaporating chamber 130 and the condensing chamber 510, all or part of the connecting pipes can be eliminated, further reducing the return path and improving the heat dissipation efficiency of the radiator.

[0090] To improve the liquid reflux efficiency within the condensing chamber 510, the end of the second condenser 500 furthest from the evaporator 100 is positioned higher than the end of the second condenser 500 connected to the evaporator 100 in the vertical direction. Because the second condenser 500 is arranged at an angle, the condensing medium can quickly reflux back into the evaporating chamber 130 under its own gravity, shortening the circulation time of the cooling medium and improving heat dissipation efficiency.

[0091] In the case where the radiator 10 includes a first condenser 200 and a second condenser 500, the second condenser 500 is located above the first condenser 200 in the height direction. Since the far end of the second condenser 500 is higher than the near end, the space between the second condenser 500 and the first condenser 200 is larger, making it easier to arrange other structures and improving space utilization. In other embodiments, the second condenser 500 may also be arranged below the first condenser; this application does not specifically limit this arrangement.

[0092] Referring to Figures 17 to 21, this disclosure also provides a power conversion device, which may include a heat sink 10, a power device 20, and a chassis 30. The power device 20 is disposed on the heat dissipation surface 120 of the heat sink 10 and located inside the chassis 30. The power device directly contacts the heat dissipation surface through an opening in the chassis housing, or is disposed on the housing and indirectly contacts the heat dissipation surface through the housing. The heat sink 10 is disposed outside the chassis 30, and the heat sink 10 is any of the aforementioned heat sinks. Since the heat sink 10 has the above-mentioned beneficial effects, the power conversion device including the heat sink 10 has corresponding effects, which will not be elaborated here.

[0093] In some examples, the power conversion device may also include a heat sink 40, which covers the chassis 30 to enclose the heat sink 10 within the space enclosed by the heat sink 40 and the chassis 30. By providing the heat sink 40, the heat sink 10 and other structures can be protected from accidental contact.

[0094] The magnetic device 50 of the power conversion device of this application can also be placed inside the heat sink 40.

[0095] The heat sink 10 disclosed herein can be used for heat dissipation in power conversion equipment such as photovoltaic inverters, PCS, and wind power converters. In this case, the power conversion equipment includes power devices such as IGBTs, magnetic devices such as reactors, and other electronic devices, capacitors, etc.

[0096] It should be noted that the power devices 20 include insulated-gate bipolar transistors (IGBTs). The IGBTs and other power devices 20 are housed in a high-protection enclosure 30, while magnetic devices 50, such as reactors, are housed in a heat sink 40. This arrangement of the internal layout of the power conversion equipment is tailored to the protection level and improves heat dissipation efficiency.

[0097] To further improve the heat dissipation efficiency of the power conversion device, the power conversion device also includes an air-cooling system to dissipate heat from the condenser 200 and the magnetic device 50.

[0098] Specifically, the aforementioned air-cooling system may include a fan 60 and an air duct opening, wherein the air duct opening is formed on the wall of the heat sink 40, and the fan 60 may be arranged at the air duct opening as needed.

[0099] The chassis 30 and the heat sink 40 are arranged side by side in the thickness direction. The side of the chassis 30 that contacts the heat sink 40 is the back side, and the side opposite to the back side is the front side of the chassis 30. The side of the heat sink 40 that contacts the chassis 30 is the front side, and the side opposite to the front side is the back side. In the height direction, the top and bottom surfaces of the chassis 30 are arranged opposite to each other, and the top and bottom surfaces of the heat sink 40 are arranged opposite to each other.

[0100] The air-cooling system can adopt a bottom air intake structure, in which the air duct opening is located on the bottom surface of the heat sink 40, and the air outlet 42 is located on the top surface of the heat sink 40. The fan 60 is installed at the air duct opening to form a heat dissipation airflow from the air duct opening to the air outlet 42, carrying the heat from the condenser 200 and the evaporator 100 to the heat sink 40. Alternatively, a back air intake structure can be adopted, in which the air duct opening is located on the back of the heat sink 40, and the air outlet 42 is located on the bottom and top surfaces of the heat sink 40. The fan 60 is installed at the air duct opening to form two heat dissipation airflows from the air duct opening to the two air outlets 42, carrying the heat from the condenser 200 and the evaporator 100 to the heat sink 40.

[0101] When a heat dissipation air duct is formed between multiple condensers 200, the air duct opening near the fan 60 is the air inlet 41, and the remaining air duct openings are the air outlets 42. The air duct opening on the back of the heat dissipation shroud 40 is the air inlet 41, and the remaining air duct openings are the air outlets 42.

[0102] Example 1

[0103] Referring to Figures 1 and 2, the radiator 10 shown includes a first condenser 200 and an evaporator 100. The first condenser 200 is connected to the evaporator 100 via two connecting pipes 300, namely a first connecting pipe 310 and a second connecting pipe 320. One end of the first connecting pipe 310 is connected to the top of the condenser 200, and the other end is connected to the evaporator 100. Alternatively, one end of the first connecting pipe 310 is connected to the bottom of the condenser 200, and the other end is connected to the evaporator 100. The connection point of the first connecting pipe 310 to the evaporator 100 is higher than the connection point of the second connecting pipe 320 to the evaporator 100. Multiple first connecting pipes 310 and second connecting pipes 320 can be arranged along the length of the first condenser 200.

[0104] The power device 20 installed on the heat dissipation surface 120 of the evaporator 100 generates heat, causing the phase change working fluid in the evaporation chamber 130 of the evaporator 100 to evaporate and absorb heat to form steam. The steam enters the condensation chamber 210 through the first connecting pipe 310, releases heat and condenses. The condensed working fluid returns to the evaporator 100 through the second connecting pipe 320. This cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 on the evaporator 100.

[0105] Example 2

[0106] Referring to Figures 3 to 5, the radiator 10 shown includes a structure comprising two first condensers 200 and two sub-evaporators 100a. The connection structure between the two first condensers 200 and the evaporators 100 is identical, i.e., the first condensers 200 are connected to the evaporators 100 via two connecting pipes 300, namely a first connecting pipe 310 and a second connecting pipe 320. One end of the first connecting pipe 310 is connected to the top of the condenser 200, and the other end is connected to the evaporator 100. Alternatively, one end of the first connecting pipe 310 is connected to the bottom of the condenser 200, and the other end is connected to the evaporator 100. The connection point of the first connecting pipe 310 to the evaporator 100 is higher than the connection point of the second connecting pipe 320 to the evaporator 100. Multiple first connecting pipes 310 and second connecting pipes 320 can be arranged along the length of the first condenser 200.

[0107] In addition, the evaporator 100 shown in the figure is composed of two sub-evaporators 100a spliced ​​together, and the spliced ​​evaporator 100 is connected and fixed by connector 400.

[0108] The power device 20, installed on the heat dissipation surface 120 of the upper sub-evaporator 100a, generates heat that causes the phase change working fluid in the evaporation chamber 130 of the upper sub-evaporator 100a to evaporate and absorb heat, forming steam. The steam moves upward through the first connecting pipe 310 into the condensation chamber 210, where it releases heat and condenses. The condensed working fluid returns to the evaporator 100 through the second connecting pipe 320. This cycle repeats, thereby achieving the purpose of dissipating heat from the power device 20 on the upper sub-evaporator 100a. Similarly, the power device 20, installed on the heat dissipation surface 120 of the lower sub-evaporator 100a, generates heat that causes the phase change working fluid in the evaporation chamber 130 of the lower sub-evaporator 100a to evaporate and absorb heat, forming steam. The steam moves upward through the first connecting pipe 310 into the condensation chamber 210, where it releases heat and condenses. The condensed working fluid returns to the evaporator 100 through the second connecting pipe 320. This cycle repeats, thereby achieving the purpose of dissipating heat from the power device 20 on the lower sub-evaporator 100a.

[0109] Figures 7 and 8 show a power conversion device including the aforementioned heat sink 10.

[0110] Example 3

[0111] Referring to Figures 9 and 10, the radiator 10 shown in Figures 9 and 10 differs from the radiator 10 shown in Figures 3 to 5 in that, in the radiator 10 shown in Figures 7 and 8, the angle α between the axis O1 of the upper first condenser 200 and the height direction is an acute angle, and the angle b between the axis O1 of the upper first condenser 200 and the height direction is an obtuse angle.

[0112] Figures 11 and 12 disclose a power conversion device including the aforementioned heat sink 10.

[0113] Example 4

[0114] Referring to Figures 13 and 14, the radiator 10 shown in the figures includes a structure comprising two first condensers 200 and two sub-evaporators 100a. The connection structure between the two first condensers 200 and the evaporator 100 is the same; that is, while the two first condensers 200 are directly connected to the evaporator 100, the first condensers 200 are also connected to the evaporator 100 via a first connecting pipe 310. Here, multiple connecting pipes 300 can be arranged along the length of the first condenser 200.

[0115] In addition, the evaporator 100 is composed of two sub-evaporators 100a joined together.

[0116] The power device 20 installed on the heat dissipation surface 120 of the upper sub-evaporator 100a generates heat, causing the phase change working fluid in the evaporation chamber 130 of the upper sub-evaporator 100a to evaporate and absorb heat to form steam. The steam moves upward into the condensation chamber 210, where it releases heat and condenses. The condensed working fluid returns to the evaporator 100 under gravity through the connecting pipe 300. This cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 on the upper sub-evaporator 100a. Similarly, the power device 20 installed on the heat dissipation surface 120 of the lower sub-evaporator 100a generates heat, causing the phase change working fluid in the evaporation chamber 130 of the lower sub-evaporator 100a to evaporate and absorb heat to form steam. The steam moves upward into the condensation chamber 210, where it releases heat and condenses. The condensed working fluid returns to the evaporator 100 through the connecting pipe 300. This cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 on the lower sub-evaporator 100a.

[0117] Figures 15 and 16 disclose a power conversion device including the aforementioned heat sink 10.

[0118] Example 5

[0119] Referring to Figures 17 to 19, the radiator 10 shown includes a structure comprising a first condenser 200, a second condenser 500, and an evaporator 100. In the height direction, the first condenser 200 is located below the second condenser 500. Here, multiple connecting pipes 300 can be arranged along the length of the first condenser 200.

[0120] In addition, the evaporator 100 includes a housing 150 and a partition 160, which divides the interior of the housing 150 into two evaporation chambers 130.

[0121] The power device 20 at the heat dissipation surface 120 corresponding to the evaporator 100 and the second condenser 500 generates heat, causing the phase change working fluid in the evaporation chamber 130 to evaporate and absorb heat to form steam. The steam moves upward into the condensation chamber 210, releases heat, and condenses. The condensed working fluid returns to the evaporator 100 under gravity, and this cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 above. The power device 20 at the heat dissipation surface 120 corresponding to the evaporator 100 and the first condenser 200 generates heat, causing the phase change working fluid in the evaporation chamber 130 to evaporate and absorb heat to form steam. The steam moves upward into the condensation chamber 210, releases heat, and condenses. The condensed working fluid returns to the corresponding evaporation chamber 130 through the connecting pipe 300, and this cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 below.

[0122] Figures 20 and 21 disclose a power conversion device including the aforementioned heat sink 10.

[0123] In the above context, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0124] In the description of the embodiments of this disclosure, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this document is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0125] For ease of description, only the parts relevant to the disclosure are shown in the accompanying drawings. Unless otherwise specified, embodiments and features described herein can be combined with each other.

[0126] The above description is merely a preferred embodiment of this disclosure and an explanation of the technical principles employed, and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. The scope of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this disclosure.

Claims

1. A radiator, wherein, It includes an evaporator (100), a first condenser (200) and a connecting pipe (300), wherein the evaporator (100) includes an evaporation chamber (130) filled with a phase change medium and a heat dissipation surface (120) for dissipating heat from power devices; The connecting pipe (300) and the condensing chamber (210) of the first condenser (200) are connected to the evaporating chamber (130); and the projection of the connecting pipe (300) on the evaporator (100) is located in the area of ​​the evaporating chamber (130).

2. The radiator as claimed in claim 1, wherein, The number of the first condenser (200) is at least two, and the at least two first condensers (200) are arranged sequentially in the height direction; There are at least two evaporation chambers (130), and each evaporation chamber (130) is connected to a corresponding condensation chamber (210).

3. The radiator as described in claim 2, wherein, The evaporator (100) includes at least two sub-evaporators (100a), each of the sub-evaporators (100a) including one of the evaporation chambers (130); the at least two sub-evaporators (100a) are joined together.

4. The radiator as claimed in claim 3, wherein, The adjacent sub-evaporators (100a) are connected by a connector (400), which includes a connector (410) and mounting holes at both ends of the connector (410). One mounting hole is installed on one sub-evaporator (100a), and the other mounting hole is installed on another sub-evaporator (100a).

5. The radiator as described in claim 3, wherein, The splicing surface (140) between two adjacent sub-evaporators (100a) is either a plane or a curved surface.

6. The radiator as claimed in claim 5, wherein, The splicing surface (140) between two adjacent sub-evaporators (100a) further includes a concave-convex mating part (141), one sub-evaporator (100a) is provided with a concave part (141a), and the other sub-evaporator (100a) is provided with a convex part (141b).

7. The radiator as claimed in claim 2, wherein, The evaporator (100) includes at least two evaporation chambers (130); The evaporator (100) includes a housing and a partition, the partition being arranged within the housing to separate at least two of the evaporation chambers (130).

8. The radiator as claimed in claim 2, wherein, In the vertical direction, at least two of the condensers (200) are arranged vertically, with an airflow passage between adjacent condensers.

9. The radiator as claimed in claim 1, wherein, The connecting pipe includes a first connecting pipe (310) and a second connecting pipe (320) that are respectively connected to the evaporation chamber (130). In the height direction, the connection point between the first connecting pipe (310) and the evaporator (100) is higher than the connection point between the second connecting pipe (320) and the evaporator (100).

10. The radiator as claimed in claim 9, wherein, There are two first condensers (200). In the height direction, the axis of the upper first condenser (200) makes an acute angle with the height direction, and the axis of the lower first condenser (200) makes an obtuse angle with the height direction.

11. The radiator as claimed in claim 1, wherein, The radiator also includes a second condenser (500), the condensation chamber (510) of the second condenser (500) being connected to the evaporation chamber (130) of the evaporator (100) through an opening.

12. The radiator as claimed in claim 11, wherein, In the vertical direction, the end of the second condenser (500) away from the evaporator (100) is higher than the end where the second condenser (500) and the evaporator (100) are connected.

13. The radiator as claimed in claim 11, wherein, The evaporator (100) is provided with an opening, and the condensing chamber of the first condenser (200) is connected to the evaporating chamber of the evaporator (100) through the opening; The first condenser (200) includes a first connecting pipe, and in the height direction, the connection point between the first connecting pipe and the evaporator (100) is located at the end of the first condenser (200) away from the evaporator (100).

14. The radiator as claimed in claim 13, wherein, In the vertical direction, the end of the first condenser (200) away from the evaporator (100) is lower than the end where the first condenser (200) and the evaporator (100) are connected.

15. The radiator as claimed in claim 13, wherein, In the vertical direction, the end of the second condenser (500) away from the evaporator (100) is higher than the end of the second condenser (500) near the evaporator (100).

16. A power conversion device, wherein, The device includes a heat sink (10), a power device (20), and a chassis (30). The heat sink (10) is disposed outside the chassis (30), and the power device (20) is disposed inside the chassis (30) and is in direct or indirect contact with the heat dissipation surface (120) of the heat sink. The heat sink (10) is a heat sink (10) as described in any one of claims 1 to 15.

17. The power conversion device as described in claim 16, wherein, The power conversion device also includes a heat sink (40), which covers the chassis (30), and the heat sink is located inside the heat sink.

18. The power conversion device as described in claim 17, wherein, The power conversion device also includes an air-cooling system, which includes a fan (60) and multiple air duct openings. The fan (60) is located inside the heat sink (40), and the air duct openings are located at the top, bottom, side, or back of the heat sink (40).

19. The power conversion device as described in claim 18, wherein, In the vertical direction, the fan (60) is located below the radiator.

20. The power conversion device as described in claim 18, wherein, When the radiator includes at least two first condensers (200), the fan (60) is located between two adjacent first condensers (200).

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