High-resolution, acoustic-optical metrology system

The system uses shaped optical pulses to generate and detect acoustic waves for enhanced detection of sub-micron voids in semiconductor structures, addressing limitations of conventional methods.

WO2026126206A1 Publication Date: 2026-06-18NOVA MEASURING INSTR LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
NOVA MEASURING INSTR LTD
Filing Date
2025-12-11
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Conventional acoustic microscopy and picosecond ultrasonics struggle to detect sub-micron voids in semiconductor structures due to limited spatial resolution and weak signal return, respectively.

⚗Method used

A system utilizing shaped ultra-short optical pulses to generate converging acoustic waves and amplify diverging acoustic wave reflections through synchronized optical probe pulses, enhancing sensitivity for subsurface feature detection.

🎯Benefits of technology

Enables accurate detection of sub-micron voids by improving signal-to-noise ratio and resolution, facilitating reliable semiconductor manufacturing.

✦ Generated by Eureka AI based on patent content.

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Abstract

Systems and methods of optical metrology and inspection are provided, including shaping a pump pulse to have a concave wavefront that generates, in a sample, an acoustic wave that converges at a focal location. When a subsurface feature is at the focal location, a reflected acoustic wave is generated, with a convex acoustic wavefront. A probe assembly is configured to shape a probe pulse to have a spherical wavefront and to impinge on the surface simultaneously with the return to the surface of a reflected acoustic wave. A detection assembly is configured to receive a reflected probe pulse, reflected from the surface, and, responsively, to determine whether the reflected probe pulse is indicative of surface changes induced by a reflected acoustic wave from a subsurface feature at the focal location.
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