Light-emitting device and display apparatus

Abstract

The present application provides a light-emitting device and a display apparatus. The light-emitting device comprises a driving substrate, a light-emitting element, an adhesive film layer and a texture layer. The light-emitting element is located on the driving substrate; the adhesive film layer is arranged on the driving substrate, and the adhesive film layer covers the light-emitting element; the adhesive film layer is black, and the adhesive film layer has light transmittance; the adhesive film layer comprises a substrate and diffusion particles dispersed inside the substrate; a material of the texture layer comprises reflective ink, and the reflective ink forms a texture pattern on the side of the adhesive film layer away from the driving substrate.

Description

Light-emitting devices and display equipment

[0001] This application claims priority to Chinese patent application No. 202411874796.3, filed on December 18, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to, but is not limited to, the field of light-emitting device technology, such as a light-emitting device and a display device. Background Technology

[0003] New types of displays, capable of displaying natural textures such as wood grain and stone grain or special appearance textures when the screen is off, and displaying normally when the screen is on, are gradually being applied in automotive displays, commercial displays, and home displays. The main principle of the always-on textured display is to superimpose a semi-transparent plastic shell or film on the surface of the display, and then print semi-transparent colored ink on the surface of the semi-transparent plastic shell or film to form corresponding patterns. The display then displays the colored texture patterns by reflecting external ambient light through the ink.

[0004] In conventional textured displays, the texture pattern is typically positioned outside the area containing multiple light-emitting diode (LED) chips to create the effect of displaying a pattern when the screen is off and an image when the screen is on. In the aforementioned textured display, the high brightness of the LED chips covers the pattern in the non-light-emitting areas when the screen is on. Summary of the Invention

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] This application provides a light-emitting device and a display device. The light-emitting device has a small difference in ink color of the driving substrate and has high light emission uniformity, which can reduce the impact of texture patterns on the display screen.

[0007] In a first aspect, this application provides a light-emitting device, comprising: a driving substrate, a light-emitting element, an adhesive film layer, and a textured layer;

[0008] The light-emitting element is located on the driving substrate;

[0009] The adhesive film layer is disposed on the driving substrate and covers the light-emitting element; the adhesive film layer is black; the adhesive film layer is transparent; the adhesive film layer includes a substrate and diffusion particles dispersed inside the substrate;

[0010] The textured layer is made of reflective ink, which forms a textured pattern on the surface of the film layer away from the driving substrate.

[0011] In some embodiments, the adhesive film layer comprises the following components in parts by weight: 60 to 100 parts of epoxy resin, 6 to 10 parts of UV resin, 0.5 to 2 parts of photoinitiator, 1 to 10 parts of pigment carbon black, 1 to 10 parts of diffusion particles, 20 to 100 parts of first curing agent, 6 to 20 parts of diluent, and 1 to 10 parts of first filler.

[0012] In some embodiments, the light transmittance of the film layer is 40% to 80%.

[0013] In some embodiments, the thickness of the adhesive film layer is 120 μm to 200 μm.

[0014] In some embodiments, the particle size of the diffusion particles is 1 μm to 10 μm.

[0015] In some embodiments, the diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

[0016] In some embodiments, the reflective ink comprises the following components in parts by weight: 30 to 60 parts of acrylic resin, 30 to 50 parts of ethylene glycol diacetate, 1 to 5 parts of pigment, 1 to 5 parts of organosilicon micropowder, 5 to 10 parts of a second filler, and 5 to 20 parts of thinner.

[0017] In some embodiments, the reflective ink further includes a dispersant in the form of 0.1 to 1 parts by weight.

[0018] In some embodiments, the reflective ink further includes a leveling agent in the form of 0.1 to 1 parts by weight.

[0019] In some embodiments, the reflective ink further includes 0.1 to 1 part by weight of an antifoaming agent.

[0020] In some embodiments, the reflective ink further includes an adhesion agent in the form of 0.1 to 1 parts by weight.

[0021] In some embodiments, the particle size of the diffusion particles is 1 μm to 10 μm.

[0022] In some embodiments, the diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

[0023] In some embodiments, the light-emitting device further includes a protective layer disposed on the side of the adhesive film layer away from the driving substrate, the protective layer entirely covering the texture layer.

[0024] In some embodiments, the thickness of the protective layer is 5 μm to 10 μm.

[0025] In some embodiments, the protective layer includes a resin substrate and hardening particles and anti-reflective particles dispersed in the resin substrate.

[0026] In some embodiments, the protective layer comprises the following components in parts by weight: 80 to 100 parts of resin substrate, 40 to 100 parts of second curing agent, 0.1 to 1 part of silane coupling agent, 0.4 to 2 parts of polydimethylsiloxane, 0.4 to 2 parts of cellulose acetate propionate, 8 to 20 parts of hardening particles, and 1 to 10 parts of anti-reflective particles.

[0027] In some embodiments, the hardening particles include at least one of silica particles, titanium dioxide particles, zirconium dioxide particles, and alumina particles.

[0028] In some embodiments, the particle size of the hardening particles is 2 μm to 10 μm.

[0029] In some embodiments, the antireflective particles comprise hollow silica particles.

[0030] In some embodiments, the antireflective particles have a particle size of 20 nm to 100 nm.

[0031] In some embodiments, the resin substrate includes at least one of polyester-modified epoxy resin, silicone-modified epoxy resin, polysilazane, and polysiloxane.

[0032] In some embodiments, the hardening particles are fluorosilane-modified hardening particles.

[0033] In some embodiments, the antireflective particles are antireflective particles with fluorosilane surface modification.

[0034] Secondly, this application provides a display device including any of the light-emitting devices described above.

[0035] In the aforementioned light-emitting device, by covering the light-emitting element with a transparent black adhesive film layer disposed on the driving substrate, the ink color difference of the driving substrate can be reduced. Simultaneously, the diffusion particles dispersed within the substrate can scatter the light emitted by the light-emitting element, thereby improving the light emission uniformity of the light-emitting device. The reflective ink forming a textured pattern on the side of the adhesive film layer away from the driving substrate also reduces the impact of ink color differences on the driving substrate. The light-emitting device of this application achieves a textured display effect when the screen is off, while also reducing the impact of the textured pattern on the displayed image.

[0036] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0037] Figure 1 is a schematic diagram of the structure of a light-emitting device provided in an embodiment of this application;

[0038] Figure 2 is a sample diagram of the light-emitting device provided in Embodiment 1 of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10. Driving substrate; 20. Light-emitting element; 30. Adhesive film layer; 40. Texture layer; 50. Protective layer. Embodiments of the present invention

[0041] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0043] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] In implementing the embodiments of this application, the applicant discovered that when the textured screen displays a low grayscale image, the texture pattern in the area between two adjacent LED chips affects the clarity of the displayed image, resulting in a noticeable screen-off pattern in dark or black areas when the textured screen displays an image, which has a significant impact on the display effect.

[0047] Referring to FIG1, an embodiment of this application provides a light-emitting device, including: a driving substrate 10, a light-emitting element 20, an adhesive film layer 30, and a texture layer 40. The light-emitting element 20 is located on the driving substrate 10. The adhesive film layer 30 is disposed on the driving substrate 10 and covers the light-emitting element 20. The adhesive film layer 30 is black. The adhesive film layer 30 is transparent. The adhesive film layer 30 includes a substrate and diffusion particles dispersed within the substrate. The texture layer 40 is made of reflective ink, and the reflective ink forms a texture pattern on the side of the adhesive film layer 30 away from the driving substrate 10.

[0048] In the aforementioned light-emitting device, by covering the light-emitting element 20 with a transparent black adhesive film layer 30 disposed on the driving substrate 10, the ink color difference of the driving substrate 10 can be reduced. Simultaneously, the diffusion particles dispersed within the substrate can scatter the light emitted by the light-emitting element 20, thereby improving the light emission uniformity of the light-emitting device. Furthermore, the reflective ink forming a textured pattern on the side of the adhesive film layer 30 away from the driving substrate 10 can also reduce the impact of ink color difference on the driving substrate 10. The light-emitting device of this application achieves a textured display effect when the screen is off, while also reducing the impact of the textured pattern on the displayed image.

[0049] In some embodiments, a plurality of light-emitting elements 20 are spaced apart on the driving substrate 10.

[0050] In some embodiments, the light-emitting element 20 includes a light-emitting diode (LED) chip.

[0051] In some embodiments, the light-emitting element 20 includes a Mini / Micro LED in Package (MIP) lamp bead.

[0052] In some embodiments, the light-emitting element 20 includes discrete surface-mount (SMT) LEDs.

[0053] It is understandable that by forming textured patterns with reflective ink, light-emitting devices can present different natural textures. For example, natural textures can include text, icons, wood grain, marble patterns, floor tile patterns, water ripples, speckled patterns, or other decorative textures.

[0054] In some embodiments, the film layer 30 comprises the following components in parts by weight: 60 to 100 parts of epoxy resin, 6 to 10 parts of UV (ultraviolet) resin, 0.5 to 2 parts of photoinitiator, 1 to 10 parts of pigment carbon black, 1 to 10 parts of diffusion particles, 20 to 100 parts of first curing agent, 6 to 20 parts of diluent, and 1 to 10 parts of first filler.

[0055] In some embodiments, the mass fraction of epoxy resin in the film layer 30 can be 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts, 95 parts, or 100 parts, or the mass fraction of epoxy resin in the film layer 30 can be within the range of any two of the above mass fractions.

[0056] In some embodiments, the mass fraction of UV resin in the film layer 30 can be 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, 9.5 parts, or 10 parts, or the mass fraction of UV resin in the film layer 30 can be within the range of any two of the above mass fractions.

[0057] In some embodiments, the mass fraction of the photoinitiator in the film layer 30 can be 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.8 parts, or 2 parts, or the mass fraction of the photoinitiator in the film layer 30 can be within the range of any two of the above mass fractions.

[0058] In some embodiments, the mass fraction of the pigment carbon black in the film layer 30 can be 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the pigment carbon black in the film layer 30 can be within the range of any two of the above mass fractions.

[0059] In some embodiments, the mass fraction of the diffusing particles in the film layer 30 can be 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the diffusing particles in the film layer 30 can be within the range of any two of the above mass fractions.

[0060] In some embodiments, the mass fraction of the first curing agent in the adhesive film layer 30 can be 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, or 100 parts, or the mass fraction of the first curing agent in the adhesive film layer 30 can be within the range of any two of the above mass fractions.

[0061] In some embodiments, the mass fraction of the diluent in the film layer 30 can be 6 parts, 8 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, or 20 parts, or the mass fraction of the diluent in the film layer 30 can be within the range of any two of the above mass fractions.

[0062] In some embodiments, the mass fraction of the first filler in the film layer 30 can be 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the first filler in the film layer 30 can be within the range of any two of the above mass fractions.

[0063] In some embodiments, the epoxy resin may include at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, phenolic epoxy resin, and alicyclic epoxy resin.

[0064] In some embodiments, the UV resin may include at least one of polyether acrylate resin, polypropylene acrylate, unsaturated polyester resin, polyurethane acrylate resin, and polyester acrylate resin.

[0065] In some embodiments, the photoinitiator may include at least one selected from phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxycyclohexylphenyl ketone, 2,2-diethoxy-2-phenylacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,4-diethylthiazolidinone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, benzoin alkyl ether, and aminoacetophenone.

[0066] In some embodiments, the first curing agent may include an acid anhydride and a thermosetting accelerator.

[0067] In some embodiments, the thermosetting accelerator may include at least one of dicyandiamide and its modified compounds, imidazole compounds, modified imidazole compounds, organic amine compounds, phenylguanidine, guanidine resins, mercapto compounds, and amino resins.

[0068] In some embodiments, the diluent may include at least one of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethyl acetate, and butyl acetate.

[0069] In some embodiments, the second filler may include at least one of magnesium carbonate, calcium carbonate, kaolin, silica, barium sulfate, talc, clay, and alumina powder.

[0070] In some embodiments, the light transmittance of the film layer 30 can be 40% to 80%.

[0071] In some embodiments, the light transmittance of the film layer 30 can be 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80%, or the light transmittance of the film layer 30 can be within the range of any two of the above light transmittances.

[0072] In some embodiments, the thickness of the adhesive film layer 30 can be 120 μm to 200 μm.

[0073] In some embodiments, the thickness of the adhesive film layer 30 can be 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm or 200 μm, or the thickness of the adhesive film layer 30 can be within the range of the above thicknesses.

[0074] In some implementations, the thickness of the texture layer 40 can be 4 μm to 8 μm.

[0075] In some embodiments, the thickness of the texture layer 40 can be 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm or 8 μm, or the thickness of the texture layer 40 can be within any two of the above thicknesses.

[0076] In some embodiments, the reflective ink may include the following components in parts by weight: 30 to 60 parts of acrylic resin, 30 to 50 parts of ethylene glycol diacetate, 1 to 5 parts of pigment, 1 to 5 parts of silicone micropowder, 5 to 10 parts of a second filler, and 5 to 20 parts of thinner.

[0077] In some embodiments, the mass fraction of acrylic resin in the reflective ink can be 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, or 60 parts, or the mass fraction of acrylic resin in the reflective ink can be within the range of any two of the above mass fractions.

[0078] It is understood that ethylene glycol diacetate, as a solvent and diluent, can effectively adjust the viscosity and drying speed of reflective inks, improve their leveling and drying properties, thereby enhancing the quality of printed materials. Ethylene glycol diacetate has good solubility and can dissolve various resins, paints, and ink components. In some embodiments, the mass fraction of ethylene glycol diacetate in the reflective ink can be 30, 32, 34, 46, 38, 40, 42, 44, 46, 48, or 50 parts, or the mass fraction of ethylene glycol diacetate in the reflective ink can fall within any two of the aforementioned mass fractions.

[0079] In some embodiments, the mass fraction of pigment in the reflective ink can be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, or 5 parts, or the mass fraction of pigment in the reflective ink can be within the range of any two of the above mass fractions.

[0080] In some embodiments, the color of the pigment in the reflective ink may include at least one of black, white, transparent red, transparent yellow, transparent blue, transparent purple, and transparent green.

[0081] In some embodiments, the mass fraction of the silicone micropowder in the reflective ink can be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, or 5 parts, or the mass fraction of the silicone micropowder in the reflective ink can be within the range of any two of the above mass fractions.

[0082] In some embodiments, the mass fraction of the second filler in the reflective ink can be 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the second filler in the reflective ink can be within the range of any two of the above mass fractions.

[0083] In some embodiments, the mass fraction of the thinner in the reflective ink can be 5, 7, 9, 10, 11, 13, 15, 17, 19, or 20 parts, or the mass fraction of the thinner in the reflective ink can be within any two of the above-mentioned mass fractions.

[0084] In some embodiments, the reflective ink also includes a dispersant in parts by weight of 0.1 to 1.

[0085] In some embodiments, the mass fraction of the dispersant in the reflective ink can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the dispersant in the reflective ink can be within the range of any two of the above mass fractions.

[0086] In some embodiments, the reflective ink also includes 0.1 to 1 part by weight of a leveling agent.

[0087] In some embodiments, the mass fraction of the leveling agent in the reflective ink can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the leveling agent in the reflective ink can be within the range of any two of the above mass fractions.

[0088] In some implementations, the leveling agent may include an acrylate leveling agent.

[0089] In some embodiments, the reflective ink may also include 0.1 to 1 part by weight of an antifoaming agent.

[0090] In some embodiments, the defoamer in the reflective ink is 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part by mass, or the defoamer in the reflective ink may be within the range of any two of the above-mentioned parts by mass.

[0091] In some implementations, the defoamer may include a silicone defoamer.

[0092] In some embodiments, the reflective ink further includes 0.1 to 1 part by weight of an adhesion agent.

[0093] In some embodiments, the mass fraction of the adhesive in the reflective ink can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the adhesive in the reflective ink can be within the range of any two of the above mass fractions.

[0094] In some embodiments, the adhesive may include a polyester adhesive.

[0095] It is understood that thinner is a solvent that can be used to dilute ink, mainly to adjust the viscosity of the ink. In some embodiments, the mass fraction of thinner in the reflective ink can be 5 parts, 7 parts, 9 parts, 11 parts, 13 parts, 15 parts, 17 parts, 19 parts, or 20 parts, or the mass fraction of thinner in the reflective ink can be within any two of the above mass fractions.

[0096] In some implementations, the particle size of the diffusion particles can be 1 μm to 10 μm.

[0097] It is understood that within the aforementioned particle size range of the diffusing particles, the adhesive film layer 30 can achieve a good light diffusion effect, thereby enabling the light-emitting device to have good light emission uniformity. In some embodiments, the particle size of the diffusing particles can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, or the particle size of the diffusing particles can be within the range of any two of the aforementioned particle sizes.

[0098] In some embodiments, the diffusion particles may include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

[0099] It should be noted that textured displays using film or mask processes on the market may not be suitable for long-term use in semi-outdoor and outdoor scenarios due to risks such as film warping and mask bulging. In such cases, a more reliable optical functional layer combination solution is needed to improve the protective performance of the textured screen surface structure, including functions such as no warping, scratch resistance, impact resistance, water resistance, dust resistance, and fingerprint resistance.

[0100] In some embodiments, the light-emitting device further includes a protective layer 50, which is disposed on the side of the adhesive film layer 30 away from the driving substrate 10, and the protective layer 50 completely covers the texture layer 40.

[0101] It is understandable that by covering the texture layer 40 entirely with the protective layer 50, the texture layer 40 can be protected. At the same time, the surface protection performance of the light-emitting device is improved.

[0102] In some embodiments, the protective layer 50 includes a resin substrate and hardening particles and anti-reflective particles dispersed in the resin substrate.

[0103] Understandably, hardening particles can increase the protective performance of protective layer 50. Anti-reflective particles can improve the anti-reflective capability of protective layer 50.

[0104] In some implementations, the thickness of the protective layer 50 can be 5 μm to 10 μm.

[0105] In some embodiments, the thickness of the protective layer 50 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, or the thickness of the protective layer 50 may be within any two of the above thicknesses.

[0106] It is understandable that the hardness particles and anti-reflective particles in the protective layer 50 may be completely located inside the resin substrate, or may be partially exposed to the resin substrate.

[0107] In some embodiments, the protective layer 50 comprises the following components in parts by weight: 80 to 100 parts of a resin substrate, 40 to 100 parts of a second curing agent, 0.1 to 1 part of a silane coupling agent, 0.4 to 2 parts of polydimethylsiloxane, 0.4 to 2 parts of cellulose acetate propionate, 8 to 20 parts of hardening particles, and 1 to 10 parts of anti-reflective particles.

[0108] Understandably, polydimethylsiloxane can reduce the surface energy of the protective layer and improve its lubrication effect, which is beneficial for the spreading of the protective layer 50 during the preparation process. Cellulose acetate can provide toughening effect.

[0109] In some embodiments, the mass fraction of the resin substrate in the protective layer 50 can be 80 parts, 82 parts, 84 parts, 86 parts, 88 parts, 90 parts, 92 parts, 94 parts, 96 parts, 98 parts, or 100 parts, or the mass fraction of the resin substrate in the protective layer 50 can be within the range of any two of the above mass fractions.

[0110] In some embodiments, the mass fraction of the second curing agent in the protective layer 50 can be 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts, 95 parts, or 100 parts, or the mass fraction of the second curing agent in the protective layer 50 can be within the range of any two of the above mass fractions.

[0111] In some embodiments, the mass fraction of the silane coupling agent in the protective layer 50 can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, or 1 part, or the mass fraction of the silane coupling agent in the protective layer 50 can be within the range of any two of the above mass fractions.

[0112] In some embodiments, the silane coupling agent may include at least one of γ-aminopropyltriethoxysilane (KH550), γ-glycidoxypropyltrimethoxysilane (KH560), and γ-methacryloyloxypropyltrimethoxysilane (KH570).

[0113] In some embodiments, the mass fraction of polydimethylsiloxane in the protective layer 50 can be 0.4 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, or 2 parts, or the mass fraction of polydimethylsiloxane in the protective layer 50 can be within any two of the above-mentioned mass fractions.

[0114] In some embodiments, the mass fraction of cellulose acetate propionate in the protective layer 50 can be 0.4 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, or 2 parts, or the mass fraction of cellulose acetate propionate in the protective layer 50 can be within the range of any two of the above mass fractions.

[0115] In some embodiments, the mass fraction of the hardening particles in the protective layer 50 can be 8 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, or 20 parts, or the mass fraction of the hardening particles in the protective layer 50 can be within the range of any two of the above mass fractions.

[0116] In some embodiments, the mass fraction of the antireflective particles in the protective layer 50 can be 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the antireflective particles in the protective layer 50 can be within the range of any two of the above mass fractions.

[0117] In some embodiments, the hardening particles include at least one of silica particles, titanium dioxide particles, zirconium dioxide particles, and alumina particles.

[0118] In some implementations, the particle size of the hardening particles can be 2 μm to 10 μm.

[0119] In some embodiments, the particle size of the hardening particles can be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, or the particle size of the hardening particles can be within the range of any two of the above particle sizes.

[0120] In some implementations, the anti-reflective particles may include hollow silica particles.

[0121] Understandably, hollow silica particles have a unique hollow structure that can reduce light scattering and reflection and increase light transmission during light propagation.

[0122] In some implementations, the particle size of the antireflective particles can be 20 nm to 100 nm.

[0123] In some embodiments, the particle size of the anti-reflection particles is 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm or 100 nm, or the particle size of the anti-reflection particles may be within the range of any two of the above particle sizes.

[0124] In some embodiments, the resin substrate may include at least one of polyester-modified epoxy resin, silicone-modified epoxy resin, polysilazane, and polysiloxane.

[0125] In some implementations, the hardening particles can be hardening particles with fluorosilane surface modification.

[0126] In some implementations, the antireflective particles can be antireflective particles with fluorosilane surface modification.

[0127] It is understandable that the surface-modified hard particles and / or surface-modified anti-reflective particles of fluorosilane can enhance the anti-fouling and anti-fingerprint capabilities of the protective layer 50.

[0128] This application also provides a method for fabricating a light-emitting device, comprising the following steps:

[0129] A substrate is provided, the substrate including a driving substrate 10 and a light-emitting element 20 disposed on the driving substrate 10;

[0130] An adhesive film layer 30 is formed on the driving substrate 10, covering the light-emitting element 20; the adhesive film layer 30 is black; the adhesive film layer 30 is transparent; the adhesive film layer 30 includes a substrate and diffusion particles dispersed within the substrate; and

[0131] A textured layer 40 is formed on the side of the adhesive film layer 30 away from the driving substrate 10. The material of the textured layer 40 includes reflective ink, and the reflective ink forms a textured pattern on the side of the adhesive film layer 30 away from the driving substrate 10.

[0132] In some embodiments, the method for preparing the adhesive film layer 30 includes the following steps:

[0133] Prepare the raw materials for the adhesive film;

[0134] The adhesive film material is filled onto the surface of a release film with surrounding dams, and then cured by UV to obtain the adhesive film; and

[0135] The adhesive film is adhered to the surface of the driving substrate 10 on which the light-emitting element 20 is disposed, and vacuum heated until the adhesive film is completely cured.

[0136] In some implementations, the vacuum heating time is 2 to 4 hours.

[0137] In some embodiments, the vacuum heating time can be 2h, 2.2h, 2.4h, 2.6h, 2.8h, 3h, 3.2h, 3.4h, 3.6h, 3.8h or 4h, or the vacuum heating time can be within any two of the above times.

[0138] In some implementations, the vacuum heating temperature is 120°C to 150°C.

[0139] In some embodiments, the vacuum heating temperature is 120°C, 125°C, 130°C, 135°C, 140°C, or 150°C, or the vacuum heating temperature may be within the range of any two of the above temperatures.

[0140] In some embodiments, the method for preparing the texture layer 40 includes the following steps:

[0141] Configure reflective ink;

[0142] Reflective ink is applied to the surface of the adhesive film layer 30 to form a textured pattern; and

[0143] Curing the reflective ink yields texture layer 40.

[0144] In some embodiments, the method of applying reflective ink to the surface of the film layer 30 may include at least one of screen printing, gravure printing, and inkjet printing.

[0145] In some implementations, the mesh count of the screen printing mesh can be 200 to 400.

[0146] In some embodiments, the mesh count of the screen printing can be 200 mesh, 220 mesh, 240 mesh, 260 mesh, 280 mesh, 300 mesh, 320 mesh, 340 mesh, 360 mesh, 380 mesh, or 400 mesh, or the mesh count of the screen printing can be within the range of any two of the above mesh counts.

[0147] In some implementations, the curing temperature of the reflective ink can be 40°C to 80°C.

[0148] In some embodiments, the curing temperature of the reflective ink can be 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, or 80°C, or the curing temperature of the reflective ink can be within the range of any two of the above temperatures.

[0149] In some embodiments, the curing time of the reflective ink can be 5 to 10 minutes.

[0150] In some embodiments, the curing time of the reflective ink can be 5 min, 6 min, 7 min, 8 min, 9 min or 10 min, or the curing time of the reflective ink can be within the range of any two of the above times.

[0151] In some embodiments, after forming the textured layer 40 on the surface of the adhesive film layer 30 away from the driving substrate 10, the following steps are further included:

[0152] A protective layer 50 is formed on the side of the adhesive film layer 30 away from the driving substrate 10, and the protective layer 50 completely covers the texture layer 40.

[0153] In some embodiments, the method for preparing the protective layer 50 includes the following steps:

[0154] Configure the protective layer raw materials;

[0155] The protective layer material is disposed on the side of the adhesive film layer 30 away from the driving substrate 10; and

[0156] The curing protective layer material forms a protective layer 50.

[0157] In some embodiments, the curing of the protective layer material to form the protective layer 50 includes the following steps:

[0158] The protective layer material is heat-cured at 80 ℃~120 ℃ for 20 min~40 min, and then left to stand at room temperature for 24 h~72 h until fully cured.

[0159] In some embodiments, the protective layer material also includes 50 to 100 parts by weight of an organic solvent.

[0160] In some embodiments, the mass fraction of the organic solvent in the protective layer material can be 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, or 100 parts, or the mass fraction of the organic solvent in the protective layer material can be within the range of any two of the above mass fractions.

[0161] In some embodiments, the organic solvent may include at least one of ethanol, acetone, and isopropanol.

[0162] In some embodiments, the method for preparing the protective layer material includes the following steps:

[0163] The raw materials, excluding the second curing agent, are mixed and stirred at 60 ℃~80 ℃ for 30 min~60 min to obtain a mixed raw material; and

[0164] The second curing agent is added to the mixed raw materials and degassing is performed.

[0165] In some embodiments, the protective layer material is disposed on the surface of the adhesive film layer 30 away from the driving substrate 10 by atomization spraying.

[0166] In some embodiments, the preparation methods of fluorosilane-modified hardening particles and fluorosilane-modified antireflective particles include the following steps:

[0167] Mix 1 to 10 parts by weight of hardening particles, 1 to 10 parts by weight of antireflective particles, 0.1 to 1 part by weight of fluorosilane, and 100 parts by weight of organic solvent, and then ultrasonically disperse them;

[0168] The dispersed mixture is dried by solvent evaporation.

[0169] In some implementations, the ultrasonic dispersion time can be 30 min to 60 min.

[0170] In some embodiments, the temperature for solvent evaporation and drying of the dispersed mixture can be 60°C to 100°C.

[0171] This application also provides a display device, including any of the light-emitting devices described above or a light-emitting device prepared by the above-described method for preparing the light-emitting device.

[0172] The following are examples.

[0173] The method for fabricating the light-emitting device in this application embodiment is as follows:

[0174] (1) Preparation of adhesive film: 100 parts of bisphenol A epoxy resin, 10 parts of organosilicon modified acrylic resin, 10 parts of pigment carbon black, 10 parts of silica particles with a particle size of 5μm, 10 parts of ethylene glycol monoethyl ether, 5 parts of ethylene glycol dimethyl ester, 5 parts of barium sulfate and 5 parts of calcium carbonate are provided. After mechanical dispersion for 30 minutes using a high-speed mixer, 90 parts of acid anhydride, 10 parts of dicyandiamide and 0.05 parts of phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide are added. After planetary degassing and stirring for 10 minutes, the required adhesive solution is obtained. The adhesive solution is poured onto the surface of a release film with four-sided dams. The dam height is 150μm. The adhesive solution is filled into the dam and then covered with a release film. The film is placed in a vacuum chamber for degassing treatment. After curing by ultraviolet light, the film is demolded and the edges are trimmed.

[0175] (2) Texture setting: Provide 50 parts acrylic resin, 30 parts ethylene glycol diacetate, 10 parts thinner, 5 parts silicone micro powder, 3 parts talc powder, 3 parts carbon black, 2 parts yellow pigment, 1 part silicone defoamer, 1 part acrylic leveling agent, and 1 part polyester adhesion promoter. Mechanically mix and stir for 10 minutes, then grind three times using a three-roll mill to obtain texture ink. Screen print the texture ink onto the aforementioned film surface using a polyester 200-mesh screen with a screen printing thickness of 10 μm, and heat to 75°C for 5 minutes to cure.

[0176] (3) Adhesive film bonding: Provide an MLED light board with process edge, perform plasma cleaning treatment on the surface for 10 minutes, use roller pressing process to bond the aforementioned textured adhesive film to the surface of the light board, and then place it in a vacuum oven to degas and heat, with a maximum heating temperature of 120°C and a heating time of 3 hours until the adhesive film is completely cured.

[0177] (4) Preparation of hydrophobic nanoparticles: 1 part perfluorooctyltriethoxysilane, 3 parts silica particles with a particle size of 5 μm, 5 parts hollow silica particles with a particle size of 100 nm, and 100 parts anhydrous ethanol are provided. After being mixed evenly, the mixture is ultrasonically dispersed for 40 minutes and then placed in a drying oven at 100°C for solvent evaporation and drying. The fluorosilane and nanoparticles undergo a dehydration condensation reaction to generate hydrophobic nanoparticles.

[0178] (5) Preparation of coating solution: Provide 100 parts of silicone-modified epoxy resin, 50 parts of acid anhydride curing agent, 5 parts of hydrophobic nanoparticles, 2 parts of alumina particles, 0.5 parts of KH570 silane coupling agent, 0.5 parts of polydimethylsiloxane, 1 part of cellulose acetate propionate and 50 parts of anhydrous ethanol solvent. Mix the above materials except the curing agent evenly and heat them in a 60°C water bath with magnetic stirring for 30 minutes. Then mix them with the curing agent in proportion, stir evenly and degas under vacuum for 5 minutes.

[0179] (6) Coating: The process edge of the LED lamp board is cut off by a dicing machine, and the lamp surface is subjected to plasma activation treatment for 10 minutes. The coating liquid is sprayed onto the surface of the lamp board using atomizing spraying equipment with a coating thickness of 10μm. Then, it is heated at 80℃ for 30 minutes and left to stand at room temperature for 24 hours until it is completely cured.

[0180] Referring to Figure 2, which is a sample image of the light-emitting device provided in Example 1, it can be seen that the light-emitting device in Example 1 has a better screen-off texture effect. Furthermore, the ink color difference of the driving substrate in the light-emitting device is small, and the light-emitting device has high light emission uniformity, which can reduce the impact of the texture pattern on the displayed image.

[0181] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0182] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A light-emitting device, comprising: Drive substrate; The light-emitting element is located on the driving substrate; An adhesive film layer is disposed on the driving substrate, the adhesive film layer covers the light-emitting element, the adhesive film layer is black, the adhesive film layer is transparent, and the adhesive film layer includes a substrate and diffusion particles dispersed inside the substrate; and A textured layer, the material of which includes reflective ink, wherein the reflective ink forms a textured pattern on the side of the film layer away from the driving substrate.

2. The light-emitting device according to claim 1, wherein The adhesive film layer comprises the following components in parts by weight: 60 to 100 parts epoxy resin, 6 to 10 parts UV resin, 0.5 to 2 parts photoinitiator, 1 to 10 parts pigment carbon black, 1 to 10 parts diffusion particles, 20 to 100 parts first curing agent, 6 to 20 parts diluent, and 1 to 10 parts first filler.

3. The light emitting device according to claim 1 or 2, wherein The light transmittance of the adhesive film layer is 40%~80%; and / or, The thickness of the adhesive film layer is 120 μm to 200 μm.

4. A light emitting device according to any of claims 1-3, wherein The particle size of the diffused particles is 1 μm to 10 μm; and / or, The diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

5. A light emitting device according to any of claims 1-4, wherein The reflective ink comprises the following components in parts by weight: 30 to 60 parts of acrylic resin, 30 to 50 parts of ethylene glycol diacetate, 1 to 5 parts of pigment, 1 to 5 parts of organosilicon micro powder, 5 to 10 parts of a second filler, and 5 to 20 parts of thinner.

6. The light-emitting device according to claim 5, wherein The reflective ink also includes a dispersant in the form of 0.1 to 1 part by weight; And / or, 0.1 to 1 part of leveling agent; And / or, 0.1 to 1 part of defoamer; And / or, 0.1 to 1 part of an adhesive.

7. The light-emitting device according to any one of claims 1 to 6, wherein The light-emitting device further includes: A protective layer is disposed on the side of the adhesive film layer away from the driving substrate, and the protective layer completely covers the texture layer.

8. The light-emitting device according to claim 7, wherein The thickness of the protective layer is 5 μm to 10 μm.

9. The light emitting device according to claim 7 or 8, wherein The protective layer includes a resin substrate and hardening particles and anti-reflective particles dispersed in the resin substrate.

10. The light-emitting device according to any one of claims 7-9, wherein, The protective layer comprises the following components in parts by weight: 80 to 100 parts of resin substrate, 40 to 100 parts of second curing agent, 0.1 to 1 part of silane coupling agent, 0.4 to 2 parts of polydimethylsiloxane, 0.4 to 2 parts of cellulose acetate propionate, 8 to 20 parts of hardening particles, and 1 to 10 parts of anti-reflective particles.

11. The light-emitting device according to claim 10, wherein, The hardening particles include at least one of silica particles, titanium dioxide particles, zirconium dioxide particles, and alumina particles; and / or, The particle size of the hardening particles is 2 μm to 10 μm; and / or, The antireflective particles include hollow silica particles; and / or, The antireflective particles have a particle size of 20 nm to 100 nm; and / or, The resin substrate includes at least one of polyester-modified epoxy resin, silicone-modified epoxy resin, polysilazane, and polysiloxane.

12. The light-emitting device according to claim 10, wherein, The hardening particles are fluorosilane-modified hardening particles; and / or, The antireflective particles are fluorosilane-modified antireflective particles.

13. A display device comprising the light-emitting device according to any one of claims 1 to 12.

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