Micro-electro-mechanical system module, optical transmission assembly, and optical transmission device

Abstract

A micro-electro-mechanical system module (100), an optical transmission assembly (20), and an optical transmission device (10), relating to the field of optical apparatuses, and aiming at improving the reliability of the micro-electro-mechanical system module (100). The micro-electro-mechanical system module (100) comprises a substrate (110), a transparent upper cover (120), and a plurality of micro-electro-mechanical system elements (130); the transparent upper cover (120) comprises a cover plate (121) and a surrounding frame (122); the surrounding frame (122) is connected to the outer periphery of the cover plate (121), one end of the surrounding frame (122) facing away from the cover plate (121) is connected to the substrate (110), and the cover plate (121), the surrounding frame (122) and the substrate (110) jointly define a sealed cavity (101); a surface (201) of the cover plate (121) facing away from the substrate (110) is parallel to a surface (204) of the substrate (110) facing away from the transparent upper cover (120); the plurality of micro-electro-mechanical system elements (130) are located in the sealed cavity (101); and the transparent upper cover (120) is an integrally formed piece. The strength of connection between each region of the surrounding frame (122) and the substrate (110) is uniform, and the structural strength at a position where the surrounding frame (122) is connected to the substrate (110) is uniform, thereby facilitating improvement of the airtightness of the sealed cavity (101) and improvement of the structural strength of the micro-electro-mechanical system module (100), avoiding bonding points introduced by welding between the cover plate (121) and the surrounding frame (122), improving the structural strength, and improving the reliability of the micro-electro-mechanical system module (100).

Description

A microelectromechanical system module, an optical transmission component, and an optical transmission device.

[0001] This application claims priority to Chinese Patent Application No. 202411878433.7, filed on December 18, 2024, entitled “A Microelectromechanical System Module, Optical Transmission Component and Optical Transmission Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of optical devices, and more particularly to a microelectromechanical system module, an optical transmission component, and an optical transmission device. Background Technology

[0003] Micro-electro-mechanical systems (MEMS) modules have attracted considerable attention in fields such as optical imaging, medical detection, micro-displays, and optical communications due to their advantages including large scanning angle, low driving voltage, low manufacturing cost, and ease of control. Particularly in the field of optical communications, MEMS modules are suitable for large-scale optical cross-connect (OXC) devices.

[0004] MEMS modules are key components of optical cross-connect devices, and their performance directly affects the performance of these devices. Summary of the Invention

[0005] This application provides a microelectromechanical system (MEMS) module, an optical transmission component, and an optical transmission device, aiming to improve the reliability of the MEMS module.

[0006] In a first aspect, embodiments of this application provide a microelectromechanical system (MEMS) module. The MEMS module includes a substrate, a transparent top cover, and a plurality of MEMS components. The transparent top cover includes a cover plate and a surrounding frame. The surrounding frame is connected to the outer periphery of the cover plate, and one end of the surrounding frame facing away from the cover plate is connected to the substrate. The cover plate, the surrounding frame, and the substrate together form a sealed cavity. The cover plate includes a first surface and a second surface disposed opposite to each other, the first surface facing away from the substrate. The first surface and the surface of the substrate facing away from the transparent top cover are parallel. The plurality of MEMS components are disposed on the substrate, and the plurality of MEMS components are located within the sealed cavity.

[0007] Since the first surface and the substrate surface facing away from the transparent top cover are parallel, they are equidistantly spaced. During the connection of the frame and the substrate, the substrate is placed on the operating table, and the counterweight is placed on the first surface. Because the first surface and the substrate surface facing away from the transparent top cover are equidistant, the counterweight is less prone to tilting, and the force exerted by the counterweight on various areas of the frame is more uniform. The connection strength between the frame and the substrate is uniform across all areas, resulting in uniform structural strength at the connection point. This improves the airtightness of the sealing cavity, enhances the structural strength of the microelectromechanical system (MEMS) module, and increases its reliability.

[0008] In conjunction with the first aspect, in some feasible embodiments, the first surface and the substrate surface facing the transparent top cover are not parallel. Thus, the light reflected by the first surface has a different exit angle than the light reflected by the microelectromechanical system (MEMS) components, which can reduce interference between the light reflected by the first surface and the light reflected by the MEMS components, thereby reducing signal crosstalk and noise.

[0009] In conjunction with the first aspect, in some feasible embodiments, the angle between the first surface and the surface of the substrate facing the transparent top cover is 3°-10°. This further reduces the amount of light beam reflected by the first surface and entering the output port, resulting in excellent noise reduction and further improving the performance of the microelectromechanical system module.

[0010] In conjunction with the first aspect, in some feasible embodiments, the angle between the first surface and the surface of the substrate facing the transparent top cover is 4.7°-8°. This results in excellent noise reduction for the microelectromechanical system (MEMS) module, while the maximum distance between the first and third surfaces is small, allowing for a reduction in the size of the MEMS module.

[0011] In conjunction with the first aspect, in some feasible embodiments, the second surface and the substrate surface facing the transparent top cover are not parallel. Thus, the light reflected by the second surface has a different exit angle than the light reflected by the microelectromechanical system (MEMS) components, which can reduce interference between the light reflected by the second surface and the light reflected by the MEMS components, thereby reducing signal crosstalk and noise.

[0012] In conjunction with the first aspect, in some feasible embodiments, the angle between the second surface and the surface of the substrate facing the transparent top cover is 3°-10°. This results in excellent noise reduction for the microelectromechanical system (MEMS) module, while the smaller maximum distance between the second and third surfaces reduces the overall size of the MEMS module.

[0013] In conjunction with the first aspect, in some feasible ways, the cover plate and the frame are connected as a single integral part.

[0014] Thus, the connection strength between the frame and the cover plate is relatively high. Compared with separate frame and cover plate designs, the one-piece molded transparent cover is less prone to forming air bubbles or bonding points at the connection between the frame and the cover plate. The connection strength between the frame and the cover plate is good, the airtightness at the connection is excellent, and the sealing performance of the sealing cavity is good. Moreover, the manufacturing process of the transparent cover is simple and has a high yield.

[0015] In conjunction with the first aspect, in some feasible embodiments, the vertical projection of the frame onto the second surface lies outside the second surface. Thus, the opening of the frame near the cover plate is smaller than the opening of the frame away from the cover plate. This facilitates demolding of the frame during molding.

[0016] In conjunction with the first aspect, in some feasible implementations, the minimum distance from the second surface to the substrate is 0.5mm-1mm. Thus, the greater the depth of the sealing cavity, the larger the outer peripheral surface of the frame, making it easier for signal light to be projected onto the outer peripheral surface of the frame, thus reducing signal light transmission efficiency and introducing losses. In the embodiments of this application, the minimum depth of the sealing cavity is 0.5mm-1mm. This can improve the problem of signal light loss due to projection onto the outer peripheral surface. Furthermore, in embodiments where the frame and cover are integrally molded, the minimum distance from the second surface to the substrate is within the above range, resulting in better structural strength at the connection between the frame and cover.

[0017] In conjunction with the first aspect, in some feasible embodiments, the minimum distance between the second surface and the first surface is 0.5 mm to 1 mm. This mitigates the problem of signal light loss due to projection onto the outer peripheral surface. Furthermore, this distance between the second surface and the first surface also provides better structural strength and reduces the likelihood of breakage.

[0018] In conjunction with the first aspect, in some feasible implementations, the first surface is rectangular, with the longer side measuring 30mm-60mm. This results in a relatively long first surface and a larger sealing cavity for the microelectromechanical system (MEMS) module. The sealing cavity can accommodate a greater number of MEMS components.

[0019] In conjunction with the first aspect, in some feasible embodiments, the microelectromechanical system module further includes a first antireflective coating, which is connected to the first surface. Thus, the first antireflective coating can increase the amount of light transmitted through the first surface and reduce optical signal loss.

[0020] In conjunction with the first aspect, in some feasible embodiments, the microelectromechanical system module further includes a second antireflective coating, which is connected to the second surface. Thus, the second antireflective coating can increase the amount of light transmitted through the second surface and reduce optical signal loss.

[0021] Secondly, this application provides a microelectromechanical system (MEMS) module. The MEMS module includes a substrate, a transparent top cover, and MEMS components. The transparent top cover is a single-piece molded part, connected to the substrate, and the transparent top cover and the substrate together form a sealed cavity. The MEMS components are disposed on the substrate and located within the sealed cavity.

[0022] Thus, the connection strength between the frame and the cover plate is high. Compared with separate frame and cover plate designs, the one-piece molded transparent cover is less prone to air bubble formation at the connection point. The connection strength between the frame and cover plate is good, the airtightness at the connection point is excellent, and the sealing performance of the sealing cavity is good. Moreover, the manufacturing process of the transparent cover is simple and has a high yield. The one-piece molded transparent cover avoids the risk of leakage points at the bonding point of the frame and cover plate connection. It also helps to improve the reliability of the microelectromechanical system module.

[0023] In conjunction with the second aspect, in some feasible ways, the first surface and the surface of the substrate facing the transparent top cover are not parallel.

[0024] In conjunction with the second aspect, in some feasible implementations, the angle between the first surface and the surface of the substrate facing the transparent top cover is 3°-10°. This reduces the amount of light beam reflected by the first surface and entering the output port, resulting in excellent noise reduction and further improving the performance of the microelectromechanical system module.

[0025] In conjunction with the second aspect, in some feasible ways, the second surface and the surface of the substrate facing the transparent top cover are not parallel.

[0026] In conjunction with the second aspect, in some feasible implementations, the angle between the second surface and the surface of the substrate facing the transparent top cover is 3°-10°. This reduces the amount of light beam reflected by the second surface and entering the output port, resulting in excellent noise reduction and further enhancing the performance of the microelectromechanical system module.

[0027] In conjunction with the second aspect, in some feasible ways, the vertical projection of the enclosure onto the second surface lies outside the second surface.

[0028] In conjunction with the second aspect, in some feasible ways, the minimum distance from the second surface to the substrate is 0.5 mm to 1 mm.

[0029] In conjunction with the second aspect, in some feasible implementations, the minimum distance between the second surface and the first surface is 0.5mm-1mm. This can mitigate the signal light loss caused by projection onto the outer peripheral surface. Furthermore, the cover plate exhibits superior structural strength within this thickness range, making it less prone to breakage.

[0030] In conjunction with the second aspect, in some feasible ways, the first surface is rectangular, and the length of the first surface is 30mm-60mm.

[0031] In conjunction with the second aspect, in some feasible ways, the microelectromechanical system module further includes: a first antireflection membrane, the first antireflection membrane being connected to the first surface.

[0032] In conjunction with the second aspect, in some feasible embodiments, the microelectromechanical system module further includes a second antireflection membrane, which is connected to the second surface.

[0033] Thirdly, this application provides an optical transmission component. The optical transmission system includes an input port, an output port, and any of the microelectromechanical systems (MEMS) modules provided in the first aspect above. The MEMS module is used to deflect a light beam from the input port to the output port.

[0034] Fourthly, this application provides an optical transmission device. The optical transmission device includes: a main body, an optical module, and any of the optical transmission components provided in the third aspect above, wherein the optical module is connected to the main body and the optical module is connected to the input port or the output port.

[0035] Regarding the beneficial effects of the second, third, and fourth aspects, please refer to the description of any optional implementation method in the first aspect, which will not be repeated here. Based on the implementation methods provided in the above aspects, this application can also be further combined to provide more implementation methods. Attached Figure Description

[0036] Figure 1 is a schematic diagram of the structure of an optical transmission device.

[0037] Figure 2 is a schematic diagram of the structure of the optical transmission component provided in an embodiment of this application.

[0038] Figure 3 is a schematic diagram of the structure of a microelectromechanical system module provided in an embodiment of this application.

[0039] Figure 4 is a schematic diagram of the exploded structure of the microelectromechanical system module shown in Figure 3.

[0040] Figure 5 is a schematic diagram of the fabrication process of a microelectromechanical system module.

[0041] Figure 6 is an optical path diagram of the microelectromechanical system module provided in the embodiment of this application.

[0042] Figure 7 is a schematic diagram of another microelectromechanical system module provided in an embodiment of this application.

[0043] In the diagram: 10-Optical transmission device; 11-Main body; 12-Optical module; 20-Optical transmission component; 100-Micro-electromechanical system module; 110-Substrate; 120-Transparent top cover; 130-Micro-electromechanical system component; 121-Cover plate; 122-Frame; 101-Sealed cavity; 201-First surface; 202-Second surface; 203-Third surface; 204-Fourth surface; 22-Output port; 21-Input port; 23-Converging light element; 24-Collimating lens; 102-Counterweight; g1-First beam; g2-Second beam; 140-First antireflective coating; 150-Second antireflective coating. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0045] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0046] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0047] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0048] Figure 1 is a schematic diagram of the structure of an optical transmission device 10. Exemplarily, the optical transmission device 10 may be an OXC or an array optical switch device, etc. Figure 1 illustrates this example using an OXC optical transmission device.

[0049] With the rapid upgrade of data centers, the requirements for interconnection within these centers have increased accordingly, with data transmission rates rising from 100G to 400G, and then to 800G. OXC (Optical Cross-Connect) devices, with their advantages of low power consumption and low latency, can handle these high-speed data transmissions. OXC devices support a smooth evolution of data from 400G to 800G. OXC can achieve large-scale service cross-connection through optical cross-connects, effectively shortening the transmission latency of service optical signals and improving service processing efficiency. Furthermore, OXC devices do not involve the conversion of optical signals to electrical signals and back to optical signals, with latency on the order of nanoseconds (ns), offering advantages of ultra-low latency and low power consumption.

[0050] Please refer to Figure 1. The optical transmission device 10 includes: a main body 11, an optical module 12, and an optical transmission assembly 20. The optical module 12 and the main body 11 are connected.

[0051] In some embodiments, the optical module 12 and the input port 21 of the optical transmission component 20 are connected (as shown in FIG2), and the optical transmission component 20 outputs the light beam of the main body 11 to other devices, such as to the optical transform unit (OTU).

[0052] In some embodiments, the output port 22 of the optical module 12 and the optical transmission component 20 are connected (as shown in FIG2). The light beams of other devices are output to the optical module 12 through the optical transmission component 20.

[0053] Figure 2 is a schematic diagram of the structure of the optical transmission component 20 provided in an embodiment of this application. Referring to Figure 2, the optical transmission component 20 includes an input port 21, an output port 22, and a microelectromechanical system (MEMS) module 100. The MEMS module 100 is used to deflect the light beam from the input port 21 to the output port 22.

[0054] For example, input port 21 has multiple ports, and input port 21 may also be referred to as an input port array. Output port 22 has multiple ports, and output port 22 may also be referred to as an output port array.

[0055] In the first state, the microelectromechanical system module 100 deflects the light beam from the first port of input port 21 to the first port of output port 22. In the second state, the microelectromechanical system module 100 deflects the light beam from the first port of input port 21 to the second port of output port 22. In this way, the switching of the light beam output port is realized.

[0056] For example, input port 21 is used to connect to a fiber array (FA). One port of input port 21 is connected to a corresponding fiber core of the fiber array (FA). Output port 22 is used to connect to the FA. One port of output port 22 is connected to a corresponding fiber core of the fiber array (FA).

[0057] In the example of Figure 2, the optical transmission component 20 includes two microelectromechanical systems (MEMS) modules 100, and also includes a focusing optical element 23. One MEMS module 100 deflects the light beam from the input port 21 to the focusing optical element 23, which then focuses the light beam and emits it to the other MEMS module 100, which deflects the light beam from the focusing optical element 23 to the output port 22.

[0058] For example, the light-converging element 23 may be a concave mirror.

[0059] In some embodiments, the microelectromechanical system module 100 can also be referred to as a passive optical pointing element, which has the function of adjusting the deflection direction of the light beam. For example, by changing the driving voltage of the microelectromechanical system module 100, the reflective surface of the microelectromechanical system module 100 can be deflected at an angle, thereby switching the light beam projected onto the reflective surface.

[0060] In some embodiments of this application, the optical transmission component 20 may further include two collimating lenses 24. One collimating lens 24 is used to collimate the light emitted from the input port 21 before transmitting it to the microelectromechanical system module 100. In some embodiments, this collimating lens 24 may also be referred to as an input collimator array, which has the function of collimating and expanding the light beam. The other collimating lens 24 is used to collimate the light beam emitted from the microelectromechanical system module 100 before transmitting it to the output port 22. In some embodiments, this collimating lens 24 may also be referred to as an output collimator array, which has the function of collimating and expanding the light beam.

[0061] The performance of the microelectromechanical system module 100 directly affects the performance of the optical transmission component 20, and further affects the performance of the optical transmission device 10. For example, the reliability of the microelectromechanical system module 100 may directly affect the insertion loss performance, response time, service life, and environmental tolerance of the optical transmission device 10.

[0062] This application provides a microelectromechanical system module 100 with better reliability.

[0063] Figure 3 is a schematic diagram of a microelectromechanical system (MEMS) module 100 provided in an embodiment of this application. Referring to Figure 3, the MEMS module 100 includes a substrate 110, a transparent top cover 120, and a plurality of MEMS components 130. The transparent top cover 120 covers the substrate 110, and the transparent top cover 120 and the substrate 110 form a sealed cavity 101. The plurality of MEMS components 130 are disposed on the substrate 110 and located within the sealed cavity 101.

[0064] In some embodiments, the microelectromechanical system element 130 is also referred to as a microelectromechanical system galvanometer.

[0065] As shown in Figure 3, the propagation path of the optical signal in the microelectromechanical system (MEMS) module 100 includes: the light beam is collimated by the collimating lens 24 (as shown in Figure 2) and then incident on the outer surface of the transparent cover 120 of the MEMS module 100. After refraction by the transparent cover 120, it continues to propagate and is incident on the MEMS element 130. After reflection by the MEMS element 130, the light beam re-enters the transparent cover 120 and is refracted by the transparent cover 120 before exiting from the outer surface of the transparent cover 120. The light beam incident on the MEMS element 130 is deflected by an external excitation voltage, thereby achieving the switching of the port of the optical transmission component 20 (as shown in Figure 2).

[0066] Figure 4 is an exploded view of the microelectromechanical system module 100 shown in Figure 3. Referring to Figure 4, the transparent top cover 120 includes a cover plate 121 and a frame 122. The frame 122 is connected to the outer periphery of the cover plate 121, and one end of the frame 122 facing away from the cover plate 121 is connected to the substrate 110. In other words, the frame 122 is located between the substrate 110 and the cover plate 121, with one end of the frame 122 connected to the cover plate 121 and the other end connected to the substrate 110. The frame 122, the substrate 110, and the cover plate 121 together form a sealed cavity 101.

[0067] Exemplarily, the cover plate 121 includes a first surface 201 and a second surface 202, which are disposed opposite to each other. The first surface 201 faces away from the substrate 110, and the second surface 202 is the surface of the cover plate 121 facing the substrate 110. In other words, the first surface 201 is the surface of the cover plate 121 located outside the sealing cavity 101, and the second surface 202 is the surface of the cover plate 121 located inside the sealing cavity 101. The first surface 201 and the surface of the substrate 110 facing away from the transparent top cover 120 are parallel.

[0068] In the embodiments of this application, the substrate 110 includes a third surface 203 and a fourth surface 204 disposed opposite to each other. The surface of the substrate 110 facing away from the transparent top cover 120 is the fourth surface 204, and the surface of the substrate 110 facing the transparent top cover 120 is the third surface 203. The first surface 201 and the fourth surface 204 are parallel.

[0069] Since the first surface 201 and the substrate 110 are parallel to the surface of the transparent top cover 120, they are equally spaced. During the connection of the frame 122 and the substrate 110, the substrate 110 is placed on the worktable, and the counterweight is placed on the first surface 201. Because the first surface 201 and the substrate 110 are equally spaced, the counterweight is less likely to tilt, and the force exerted by the counterweight on each area of ​​the frame 122 is more uniform. The uniform connection strength between each area of ​​the frame 122 and the substrate 110 contributes to the uniform structural strength at the connection point. This improves the airtightness of the sealing cavity 101 and also enhances the structural strength and reliability of the microelectromechanical system module 100.

[0070] For example, the aforementioned first surface 201 and substrate 110 are parallel to the surface of the transparent top cover 120, allowing for manufacturing and assembly errors. The included angle between the first surface 201 and substrate 110 and the surface of the transparent top cover 120 is 0° (degrees) to 1°, for example, the included angle between the first surface 201 and substrate 110 and the surface of the transparent top cover 120 is 0°, 30″ (seconds), 50″, 1′ (minutes), 10′, 20′, 30′, 40′, 50′, or 1°, etc.

[0071] Figure 5 is a schematic diagram of the fabrication process of a microelectromechanical system (MEMS) module 100. Referring to Figure 5, multiple substrates 110 are connected during the fabrication of the MEMS module 100. For example, in Figure 5, the substrate is a monolithic component composed of multiple substrates 110. For example, the substrate can be a silicon wafer. Each substrate 110 is connected to a transparent top cover 120 in a one-to-one correspondence.

[0072] During the connection of the substrate 110 and the frame 122 at the end away from the cover plate 121, a counterweight 102 is disposed on multiple transparent top covers 120. Each transparent top cover 120 supports one counterweight 102. Because the first surface 201 and the fourth surface 204 are parallel, the counterweight 102 is less likely to tilt relative to the substrate 110, ensuring good contact between the frame 122 and the substrate 110. Connecting the substrate 110 and the frame 122 in this state provides excellent connection performance.

[0073] Additionally, as shown in Figure 5, counterweights 102 are disposed on multiple transparent top covers 120. Since the first surface 201 and the fourth surface 204 are parallel, the counterweights 102 hardly slide relative to the cover plate 121. This prevents the counterweights 102 from sliding and pushing the transparent top covers 120 to move, thereby preventing the transparent top covers 120 from being misaligned relative to the substrate 110, ensuring good contact between the frame 122 and the substrate 110, and improving the airtightness of the sealing cavity 101 (as shown in Figure 4).

[0074] Thus, the parallelism of the first surface 201 and the fourth surface 204 is beneficial in the following ways: improving the connection performance between the transparent top cover 120 and the substrate 110 during the fabrication of the microelectromechanical system module 100, enhancing the airtightness of the sealed cavity 101, and physically reducing the airtightness risk of the microelectromechanical system module 100. This improves the yield and reliability of the microelectromechanical system module 100.

[0075] It is understandable that Figure 5 illustrates multiple microelectromechanical system modules 100. After the frame 122 and the substrate 110 are connected, multiple microelectromechanical system modules 100 can be obtained by cutting the substrate.

[0076] The material of the substrate 110 is not limited in this application embodiment. For example, the material of the substrate 110 may be glass, dielectric substrate or silicon, etc.

[0077] This application does not limit the material of the transparent top cover 120. For example, the transparent top cover 120 can be made of light-transmitting materials such as glass or sapphire. This application does not impose any limitations on this.

[0078] Please refer back to Figure 4. In the example in Figure 4, the first surface 201 and the surface of the substrate 110 facing the transparent top cover 120 are not parallel. In other words, the first surface 201 and the third surface 203 are not parallel. As a result, the light reflected by the first surface 201 has a different exit angle than the light reflected by the microelectromechanical system (MEMS) element 130. This can reduce the interference of the light reflected by the first surface 201 on the light reflected by the MEMS element 130, thereby reducing signal crosstalk and noise.

[0079] Figure 6 is an optical path diagram of the microelectromechanical system (MEMS) module 100 provided in an embodiment of this application. Referring to Figure 6, the transparent top cover 120 receives signal light, which includes a first beam g1 and a second beam g2. The first beam g1 is reflected by the first surface 201 and then emitted, while the second beam g2 is reflected by the MEMS component 130 and then emitted. The angle between the first beam g1 and the third surface 203 is the same as the angle between the second beam g2 and the third surface 203. Since the first surface 201 and the third surface 203 are not parallel, the emission directions of the first beam g1 reflected by the first surface 201 and the second beam g2 reflected by the third surface 203 are different, and the first beam g1 will no longer share the same optical path as the second beam g2. In other words, the non-parallelism of the first surface 201 and the third surface 203 reduces the amount of light beam reflected by the first surface 201 and entering the output port 22 (as shown in Figure 2), thus reducing crosstalk of this light beam to the second beam g2.

[0080] Please refer back to Figure 4. In the embodiments of this application, the included angle α between the first surface 201 and the third surface 203 is 3°-10°. This further reduces the amount of light beam reflected by the first surface 201 and entering the output port 22 (as shown in Figure 2), resulting in excellent noise reduction and further improving the performance of the microelectromechanical system module 100. In some embodiments, the included angle α between the first surface 201 and the third surface 203 is 4.7°-8°. This provides excellent noise reduction for the microelectromechanical system module 100, and the maximum distance between the first surface 201 and the third surface 203 is small, which can reduce the size of the microelectromechanical system module 100. For example, the included angle α between the first surface 201 and the third surface 203 is 3°, 4°, 4.7°, 5°, 6°, 7°, 8°, 9°, or 10°.

[0081] In some embodiments, the included angle α between the first surface 201 and the third surface 203 may be less than 3°, for example, it may be 2°, 2.5°, etc. In some embodiments, the included angle α between the first surface 201 and the third surface 203 may be greater than 10°, for example, it may be 11° or 12°, etc.

[0082] In some embodiments of this application, it is not necessary for the first surface 201 and the third surface 203 to be non-parallel; the first surface 201 and the third surface 203 may be parallel.

[0083] In some embodiments of this application, the second surface 202 and the surface of the substrate 110 facing the transparent top cover 120 are not parallel. In other words, the surfaces of the second surface 202 and the third surface 203 are not parallel.

[0084] Similar to the aforementioned non-parallelism of the first surface 201 and the third surface 203, the non-parallelism of the second surface 202 and the third surface 203 also results in a different exit angle for the light reflected by the second surface 202 compared to the light reflected by the microelectromechanical system (MEMS) component 130. This can mitigate the interference of the light reflected by the second surface 202 on the light reflected by the MEMS component 130, thereby reducing signal crosstalk and noise. Please refer to the aforementioned description of the first surface 201; it will not be repeated here.

[0085] In some embodiments of this application, the included angle β between the second surface 202 and the third surface 203 is 3°-10°. Similarly, this further reduces the amount of light beam reflected by the second surface 202 and entering the output port 22 (as shown in FIG. 2), resulting in excellent noise reduction and further improving the performance of the microelectromechanical system module 100. In some embodiments, the included angle α between the second surface 202 and the third surface 203 is 4.7°-8°. This provides excellent noise reduction for the microelectromechanical system module 100, and the smaller maximum distance between the second surface 202 and the third surface 203 reduces the size of the microelectromechanical system module 100. For example, the included angle α between the second surface 202 and the third surface 203 is 3°, 4°, 4.7°, 5°, 6°, 7°, 8°, 9°, or 10°.

[0086] In some embodiments, the second surface 202 and the third surface 203 may be parallel.

[0087] This application does not limit the connection method between the frame 122 and the substrate 110. Exemplarily, the frame 122 and the substrate 110 are connected by a solder layer or an adhesive layer. The sealed connection between the frame 122 and the substrate 110 reduces the entry of moisture, external dust, and other impurities into the sealed cavity 101, preventing these impurities from causing the microelectromechanical system (MEMS) component 130 to malfunction. Furthermore, the sealed cavity 101 also serves to protect the MEMS component 130.

[0088] In some embodiments of this application, the frame 122 and the cover plate 121 are connected by a weld or adhesive layer.

[0089] In some embodiments of this application, the frame 122 and the cover plate 121 are connected as a single molded part. In other words, the transparent top cover 120 is a single molded part. Thus, the connection strength between the frame 122 and the cover plate 121 is high. Compared to a separate frame 122 and cover plate 121, the single-molded transparent top cover 120 is less prone to forming bubbles or bonding points at the connection between the frame 122 and the cover plate 121. The connection strength between the frame 122 and the cover plate 121 is good, the airtightness at the connection is excellent, and the sealing performance of the sealed cavity is good. Furthermore, the manufacturing process of the transparent top cover 120 is simple and has a high yield.

[0090] Compared to a separate design of the frame 122 and cover plate 121, the one-piece transparent top cover 120 has lower requirements for the dimensional accuracy of the frame 122 and cover plate 121, lower manufacturing difficulty and cost, and better feasibility. Furthermore, the one-piece transparent top cover 120 avoids the risk of leakage at the bonding point between the frame 122 and cover plate 121. The welding efficiency and welding yield of the microelectromechanical system module 100 are significantly improved.

[0091] Furthermore, if the frame 122 and the cover plate 121 are separate components, there are height requirements for the frame 122 during the connection process. For example, if the frame 122 is too thin, it is prone to deformation during the connection process, which may affect the structural strength of the connection point. Connecting the frame 122 and the cover plate 121 as a single molded component effectively avoids this problem.

[0092] As shown in Figure 6, in some embodiments, the minimum distance d1 between the second surface 202 and the substrate 110 is 0.5mm-1mm. In other words, the minimum depth of the sealing cavity 101 is 0.5mm-1mm. Thus, the greater the depth of the sealing cavity 101, the larger the outer peripheral surface A of the frame 122, making it easier for signal light to be projected onto the outer peripheral surface A of the frame 122, thus reducing the signal light transmission efficiency and introducing losses. In the embodiments of this application, the minimum depth of the sealing cavity 101 is 0.5mm-1mm. This can improve the problem of signal light loss due to projection onto the outer peripheral surface A.

[0093] In addition, in the embodiment where the frame 122 and the cover plate 121 are connected as an integral molded part, the minimum distance d1 from the second surface 202 to the substrate 110 is within the above-mentioned range, and the connection between the frame 122 and the cover plate 121 has better structural strength.

[0094] For example, the minimum distance d1 between the second surface 202 and the substrate 110 can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.

[0095] In some embodiments of this application, the minimum distance d1 between the second surface 202 and the substrate 110 can be greater than 1 mm. For example, the minimum distance d1 between the second surface 202 and the substrate 110 can be 1 mm, 1.2 mm, 1.5 mm, or 2 mm, etc.

[0096] In some embodiments of this application, the minimum distance d2 between the second surface 202 and the first surface 201 is 0.5mm-1mm. In other words, the minimum thickness of the cover plate 121 is 0.5mm-1mm.

[0097] Similarly, the larger the minimum distance d2 between the second surface 202 and the first surface 201, the larger the outer peripheral surface B of the cover plate 121, making it easier for signal light to be projected onto the B surface and thus more prone to loss. In the embodiments of this application, the minimum thickness of the cover plate 121 is 0.5mm-1mm. This can improve the problem of loss caused by signal light being projected onto the outer peripheral surface B. In addition, the cover plate 121 also has better structural strength within this thickness range and is not easily broken.

[0098] For example, the minimum distance d2 between the second surface 202 and the first surface 201 can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm, etc. In some embodiments of this application, the minimum distance d2 between the second surface 202 and the first surface 201 can be greater than 1 mm. For example, the minimum distance d1 between the second surface 202 and the substrate 110 can be 1 mm, 1.2 mm, 1.5 mm, or 2 mm, etc.

[0099] Furthermore, in embodiments where the frame 122 and the cover plate 121 are integrally molded, there is no need to consider the impact of the bending deformation of the cover plate 121 on the connection performance of the frame 122 and the cover plate 121 during the connection process. Even with a small thickness of the cover plate 121, the frame 122 and the cover plate 121 still have excellent connection performance, and the sealing performance of the sealing cavity 101 is good.

[0100] The shape of the frame 122 is not limited in this embodiment. For example, the frame 122 can be a prism-shaped cylindrical structure, a cylindrical barrel structure, etc.

[0101] The shape of the first surface 201 is not limited in this application embodiment. For example, the shape of the first surface 201 can be rectangular, circular, elliptical, or irregular, etc. It can be understood that the length and width of the aforementioned rectangle can be equal or unequal.

[0102] In some embodiments of this application, the first surface 201 is rectangular, and the long side dimension d3 of the first surface 201 is 30mm-60mm. Thus, the first surface 201 is relatively long, and the sealed cavity 101 of the microelectromechanical system module 100 is relatively large. The sealed cavity 101 can accommodate a large number of microelectromechanical system components 130. For example, the sealed cavity 101 can accommodate more than 300 microelectromechanical system components 130.

[0103] Furthermore, in embodiments where the frame 122 and the cover plate 121 are integrally molded, since there is no need to consider the impact of the bending deformation of the cover plate 121 on the connection performance of the frame 122 and the cover plate 121 during the connection process, even if the long side dimension d3 of the first surface 201 is large, the strength of the transparent cover 120 is better. During the connection process between the frame 122 and the substrate 110, the transparent cover 120 is not easily deformed, which can increase the connection strength between the frame 122 and the substrate 110, thereby improving the reliability of the microelectromechanical system module 100.

[0104] For example, the long side dimension d3 of the first surface 201 can be 30mm, 35mm, 38mm, 40mm, 42mm, 45mm, 50mm, 55mm or 60mm, etc.

[0105] In some embodiments of this application, the long side dimension d3 of the first surface 201 may be less than or equal to 30 mm. For example, it may be 25 mm, 20 mm, or 15 mm, etc.

[0106] In some embodiments of this application, the dimension of the frame 122 near the cover plate 121 is smaller than the dimension of the frame 122 away from the cover plate 121. Exemplarily, the vertical projection of the frame 122 onto the second surface 202 is outside the second surface 202. Thus, the opening of the frame 122 near the cover plate 121 is smaller than the opening of the frame 122 away from the cover plate 121. This facilitates demolding of the frame 122 during the molding process. In embodiments where the transparent cover plate 121 is manufactured by molding, the opening of the frame 122 near the cover plate 121 is smaller than the opening of the frame 122 away from the cover plate 121. This also facilitates demolding of the transparent cover plate 121.

[0107] In some embodiments of this application, the angle between the thickness direction of the frame 122 and the direction perpendicular to the second surface 202 is 3°-10°. For example, the angle between the thickness direction of the frame 122 and the direction perpendicular to the second surface 202 is 3°, 4°, 5°, 6°, 7°, 8°, 9° or 10°, etc.

[0108] Please refer back to Figure 4. In the embodiments of this application, the microelectromechanical system module 100 may further include a first antireflection film 140, which is connected to the first surface 201. In this way, the first antireflection film 140 can increase the amount of light transmitted through the first surface 201 and reduce the loss of optical signals.

[0109] Exemplarily, in some embodiments, the first antireflection film 140 can be a physical vapor deposition (PVD) antireflection film or an atomic layer deposition (ALD) ultra-low reflection film. Exemplarily, the first antireflection film 140 with an optical surface reflectivity of less than or equal to 0.25% is prepared using a PVD process. For example, a pre-film is formed on the first surface 201 using PVD deposition, and the optical surface of the pre-film is hydrolyzed to form micron-scale microstructures. These micron-scale microstructures can further reduce reflected light and reduce interference with signals. The aforementioned micron-scale microstructures can also be referred to as grass-like structures.

[0110] The first antireflective coating 140 helps to improve the transmittance of the cover plate 111. In some embodiments, the first antireflective coating 140 can increase the transmittance of the cover plate 111 by 0.05%. When the reflectivity of both the first surface 201 and the second surface 202 is not greater than 0.25%, the signal speed delay of the microelectromechanical system module 100 with a transmission rate of 400 GHz is less than 3 ps (picoseconds), which has a small impact on the signal and can be ignored.

[0111] In some embodiments, the microelectromechanical system module 100 may further include a second antireflective coating 150, which is connected to the second surface 202. Thus, the second antireflective coating 150 can increase the amount of light transmitted through the second surface 202 and reduce optical signal loss.

[0112] Similarly, in the embodiments of this application, the second antireflection film 150 can be a PVD antireflection film or an ALD ultra-low reflection film.

[0113] In some embodiments of this application, the first surface 201 and the surface of the substrate 110 facing away from the transparent top cover 120 may not be parallel.

[0114] Figure 7 is a schematic diagram of another microelectromechanical system module 100 provided in an embodiment of this application. The differences between Figure 7 and Figure 3 include: the angles at which the first surface 201 and the substrate 110 face away from the surface of the transparent top cover 120 are different. The first antireflective film and the second antireflective film are not shown in Figure 7.

[0115] Referring to Figure 7, the first surface 201 and the surface of the substrate 110 that faces away from the transparent top cover 120 are not parallel. In other words, the first surface 201 is inclined relative to the fourth surface 204.

[0116] In the example of Figure 7, the transparent top cover 120 is a one-piece molded part. In other words, the frame 122 and the cover plate 121 are adjacent and are one-piece molded parts.

[0117] Thus, the connection strength between the frame 122 and the cover plate 121 is relatively high. Compared with separate frame 122 and cover plate 121, the one-piece molded transparent cover 120 is less prone to air bubbles forming at the connection between the frame 122 and the cover plate 121. The connection strength between the frame 122 and the cover plate 121 is good, the airtightness at the connection between the frame 122 and the cover plate 121 is excellent, and the sealing performance of the sealing cavity is good. Moreover, the manufacturing process of the transparent cover 120 is simple and has a high yield. The one-piece molded transparent cover 120 avoids the risk of leakage points at the bonding point of the connection between the frame 122 and the cover plate 121. It also helps to improve the reliability of the microelectromechanical system module 100.

[0118] In the example of Figure 7, the first surface 201 and the second surface 202 may be parallel. Alternatively, the first surface 201 and the second surface 202 may not be parallel.

[0119] For the remaining structures in Figure 7, please refer to the descriptions in Figures 2, 4 and 6 above, which will not be repeated here.

[0120] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0121] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A microelectromechanical system module (100), characterized in that, The microelectromechanical system module (100) includes: substrate(110); A transparent top cover (120) includes a cover plate (121) and a surrounding frame (122). The surrounding frame (122) is connected to the outer periphery of the cover plate (121), and one end of the surrounding frame (122) facing away from the cover plate (121) is connected to the substrate (110). The cover plate (121), the surrounding frame (122), and the substrate (110) together form a sealed cavity (101). The cover plate (121) includes a first surface (201) and a second surface (202) disposed opposite to each other. The first surface (201) faces away from the substrate (110). The first surface (201) and the surface of the substrate (110) facing away from the transparent top cover (120) are parallel. Multiple microelectromechanical system (MEMS) components (130) are disposed on the substrate (110) and located within the sealed cavity (101).

2. The microelectromechanical system module (100) according to claim 1, characterized in that, The first surface (201) and the substrate (110) are not parallel to the surfaces facing the transparent top cover (120).

3. The microelectromechanical system module (100) according to claim 2, characterized in that, The angle between the first surface (201) and the substrate (110) facing the transparent top cover (120) is 3°-10°.

4. The microelectromechanical system module (100) according to any one of claims 1-3, characterized in that, The second surface (202) and the surface of the substrate (110) facing the transparent top cover (120) are not parallel.

5. The microelectromechanical system module (100) according to claim 4, characterized in that, The angle between the second surface (202) and the surface of the substrate (110) facing the transparent top cover (120) is 3°-10°.

6. The microelectromechanical system module (100) according to any one of claims 1-5, characterized in that, The cover plate (121) and the frame (122) are connected as an integral molded part.

7. The microelectromechanical system module (100) according to any one of claims 1-6, characterized in that, The vertical projection of the frame (122) onto the second surface (202) is located outside the second surface (202).

8. The microelectromechanical system module (100) according to any one of claims 1-7, characterized in that, The minimum distance between the second surface (202) and the substrate (110) is 0.5mm-1mm.

9. The microelectromechanical system module (100) according to any one of claims 1-8, characterized in that, The minimum distance between the second surface (202) and the first surface (201) is 0.5mm-1mm.

10. The microelectromechanical system module (100) according to any one of claims 1-9, characterized in that, The first surface (201) is rectangular, and the length of the first surface (201) is 30mm-60mm.

11. The microelectromechanical system module (100) according to any one of claims 1-10, characterized in that, The microelectromechanical system module (100) further includes a first antireflective film (140), which is connected to the first surface (201).

12. The microelectromechanical system module (100) according to any one of claims 1-11, characterized in that, The microelectromechanical system module (100) further includes a second antireflective film (150), which is connected to the second surface (202).

13. A microelectromechanical system module (100), characterized in that, The microelectromechanical system module (100) includes: substrate(110); A transparent top cover (120), the transparent top cover (120) being an integrally molded part, the transparent top cover (120) being connected to the substrate (110), the transparent top cover (120) and the substrate (110) together forming a sealed cavity (101); and Microelectromechanical system (MEMS) component (130) is disposed on the substrate (110) and located within the sealed cavity (101).

14. An optical transmission component (20), characterized in that, The optical transmission component (20) includes an input port (21), an output port (22), and a microelectromechanical system module (100) according to any one of claims 1-13, wherein the microelectromechanical system module (100) is used to deflect a light beam from the input port (21) to the output port (22).

15. An optical transmission device (10), characterized in that, The optical transmission device (10) includes: a main body (11), an optical module (12) and the optical transmission component (20) as described in claim 14, wherein the optical module (12) is connected to the main body (11) and the optical module (12) is connected to the input port (21) or the output port (22).

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