Heating device and thermal footprint modulator

Abstract

The present invention relates to an induction heating device and thermal footprint modulator 100 for machinery or parts thereof or heating appliances for civil, professional or industrial use. Said induction heating device and thermal footprint modulator 100 modifies the amount of heat in specific areas, modulating the thermal footprint and the heating or cooling rate. Devices and related methods of this type make it possible to direct heat precisely and functionally according to the required activity, reducing thermal masses and shortening process time.

Description

Heating device and Thermal Footprint ModulatorField of the invention

[0001] The present invention relates to an electromagnetic induction heating device and thermal footprint modulator 100 suitable for modifying and thus controlling the thermal profile of a heating surface.

[0002] Said induction device 100 can be integrated into heating devices for civil, professional or industrial use and can be employed to heat flowing or stationary materials, solid, liquid or gaseous, or mixtures thereof.

[0003] An example of application may be the heating of films or sheets in polymeric or composite material, fluid or solid foodstuffs, textiles, paper, non-woven fabrics, sheets destined for lamination or for finishing thermosensitive surfaces, thermoforming molds, granules, etc.

[0004] State of the art

[0005] In many civil, professional and industrial processes it is required to heat a process target element (90) characterized by a specific surface and a volume delimited by this surface.

[0006] An example of a device that heats a target element from a specific surface and from a volume delimited thereby is disclosed in US2024 / 397585.

[0007] The choice of heating method depends heavily on process requirements and the materials involved. Generally the following heating systems are used: Electric Resistance Heating, Infrared Heating, Heat Transfer Fluid Heating, Burner (gas) Heating, Convective Heating (e.g. hot air), Electromagnetic Induction Heating (known for hardening, cooking, annealing, melting, etc.).

[0008] In all cases where dynamic thermal control and a specific thermal footprint are required — different from that obtainable with existing heating systems — the above solutions show significant limitations.

[0009] In electric resistances the thermal response is relatively slow and less controllable, making it difficult to manage rapid temperature changes. Electromagnetic induction works only with electrically conductive materials and the thermal footprint is strongly conditioned by the geometry of the inductor. In infrared the heat distribution is less uniform because it depends on the surface’s ability to absorb infrared radiation. Use of heat transfer fluids severely limits the thermal response, which is slower and more complex to control, since it depends on fluid movement and heat transmission. Radiant heat (e.g. gas combustion) requires a ventilated environment for combustion and has a less controlled heat distribution, making it difficult to obtain a precise thermal footprint. Convection is less efficient in heating specific surfaces directly because the heat is distributed in the air, limiting the precision of the thermal footprint.

[0010] In conclusion, if management of the thermal footprint is required both dynamically and geometrically, all existing solutions would meet one of the two challenges well, but not both simultaneously. For example, to obtain a uniformly distributed thermal footprint (geometric control), one could increase the thickness of the heating element. However, this would reduce the ability to respond rapidly to temperature variations (thermal responsiveness control). Conversely, if thin heating elements are chosen to ensure a faster thermal response, one would sacrifice the ability to maintain a homogeneous thermal footprint on the surface. Consequently, simultaneous control of distribution and thermal responsiveness remains an unresolved challenge with current technologies.

[0011] Electromagnetic induction offers high reactivity and power density, ideal for thermal transients. However, the inductor’s thermal footprint and the use of ferromagnetic metals, necessary to improve magneto-thermal efficiency, limit possible applications, affecting design and use in specific contexts.

[0012] It is therefore desirable to overcome the above limits by providing a device that, in addition to the advantages of electromagnetic induction, offers possibilities for modulation of the thermal footprint.

[0013] It is also desirable to develop a heating device that can be easily integrated into a wide range of processes and applications. This device could find use in machinery and equipment for industrial, professional and civil sectors, covering areas such as welding of metallic and plastic materials, cooking of food in appliances and machines, thermoforming, local modification of surface properties of materials, drying of agricultural and food products, etc.

[0014] It is desirable to realize a system capable of reproducing the desired thermal footprint precisely and ensuring a high thermal reactivity of the material; such a device would represent a significant step toward greater efficiency of modern heating systems.

[0015] Exposition of the invention

[0016] The object of the present invention is to provide an electromagnetic induction heating device and thermal footprint modulator 100 for optimal and punctual control of the thermal footprint, comprising:at least one inductor element 50at least one dielectric element 60at least one metallic element (or induced element) 10at least two structured metallic thermal elements acting as thermal modulators, hereinafter also referred to as thermal modulators, 20 and 21 andat least one heating element 30characterized in that the thermal footprint of the induced element 10 differs from the thermal footprint of the heating element 30 and in that the thermal modulators and / or at least one induced element 10 and / or at least one heating element 30 define at least one interspace 40, wherein the structural relationship between the parts being defined in the appended claims.

[0017] For the purposes of the present invention, the expression "thermal footprint" or "thermal profile" is used to describe the specific distribution of heat, understood as the spatial distribution of temperature and / or power density, i.e., the topology, of the heat generated or transferred on elements 10 and 30.

[0018] For the purposes of the present invention, the expression "induced element" is used to describe an element which, positioned inside an oscillating electromagnetic field, transduces, wholly or partially, the field into thermal energy according to the principles of electromagnetic induction.

[0019] For the purposes of the present invention, the expression "thermal modulator" is used to describe metallic elements which, placed between a thermal source “A” and a heat-accepting element “B”, transport heat from “A” to “B”; the "thermal modulators", due to their geometric and / or material characteristics, vary the thermal footprint of “A” on “B”, individually and / or cooperatively.

[0020] Thanks to the presence of the thermal modulators, it is possible to customize the thermal footprint generated on the heating element 30 starting from a different thermal footprint generated on the induced element 10 and also dependent on the inductor element 50 emitting electromagnetic waves. Moreover, the presence of the thermal modulators, unlike traditional solutions mainly composed of monolithic induced elements with large thickness and / or mass, allows, for the same volume, faster heating and faster cooling, making device 100 thermally highly responsive.

[0021] In one implementation form, the thermal modulators 20 and 21 are structured metallic elements that have at least one direct contact with the metallic element 10 and the heating element 30. Thanks to this implementation form, the induced element 10, heated by the inductive phenomenon produced by the inductor 50, generates heat that is transferred rapidly to the heating element 30 at strategic positions and concentrations.

[0022] Depending on the specific thermal profile requirements of the heating element 30, the thermal modulators can transfer thermal energy from the induced element 10 to the heating element 30, expanding or concentrating the heat in specific zones, uniformizing or differentiating the thermal footprint of the heating element 30. Specifically, they can:

[0023] Channel heat toward a heating element 30 of smaller dimensions compared to the induced element 10, concentrating and uniformizing the thermal footprint or creating zones with differential thermal concentration;

[0024] Widen and distribute the thermal footprint of the induced element 10, uniformizing the thermal profile or creating differential thermal concentration zones on the heating element 30.

[0025] In one implementation form at least part of the heating element 30 represents the active thermal element of a process and therefore transfers thermal energy to the process target element 90 which passes by or is stationary externally to device 100 or within at least one of the interspaces 40. The process target element 90 (the material to be heated) may be a solid or a liquid or a suspension or a gel or a gas or a mixture of at least two of these. By way of example, heating element 30 may be the interface for a welding, thermoforming, cooking, annealing process, etc. Alternatively it could be the bottom of a cooking utensil for heating and cooking food. Alternatively it could be the heating element of the liquid contained in a stratified-temperature tank such as accumulators for solar thermal systems. Alternatively it could be the profile of a thermoforming mold, etc.

[0026] Another object of the present invention is to produce a device 100 that, thanks to the pronounced lightness made possible by the thermal modulators, is able to guarantee simultaneously precise control of heat distribution and rapid thermal responsiveness.

[0027] Another object of the present invention is to realize an induction heating device and thermal footprint modulator 100 capable of optimizing energy consumption and improving process thermal dynamics through reduction of the heat-transport masses and a more accurate and punctual management of thermal transients (in heating and cooling).

[0028] Another object of the present invention is to realize an induction device 100 able to improve process quality by ensuring an optimal thermal profile of the heating surface 30, further reducing waste and thermal losses.

[0029] In one implementation form the inductor element 50 can be any element capable of generating a variable magnetic field, for example a coil, a spiral, or more generally a conductive element or any device configured so as to be able to generate a variable magnetic field.

[0030] In one implementation form the metallic element 10 has ferromagnetic properties and comprises a ferromagnetic metal or an alloy of ferromagnetic metals. By way of example the metallic element 10 can be made of ferritic steel, a ferromagnetic alloy of iron and / or nickel and / or cobalt, thanks to this implementation, the electromagnetic-to-thermal conversion exhibits very high efficiency.

[0031] In one implementation form the metallic element 10 has non-ferromagnetic properties and comprises a non-ferromagnetic metal or an alloy of non-ferromagnetic metals. By way of example the metallic element 10 can be made of non-ferritic steel (e.g. AISI 316, AISI 304, etc.), a non-ferromagnetic alloy of iron and / or nickel and / or cobalt, gold and its alloys, titanium and its alloys, aluminum and its alloys, copper and its alloys, etc. Thanks to this implementation the thermal reactivity of Device 100 is rapid and facilitates thermodynamic control of the device.

[0032] In one implementation form the metallic element 10 has thickness between 6 microns and 2 cm depending on the energy requirements of the process and the ferromagnetic characteristics of induced element 10; thanks to this configuration, the thermal response can be modulated to obtain greater or lesser reaction speed.

[0033] In one implementation form, the thermal modulators are separate and in direct contact or monolithically joined with the induced element 10 and / or with the heating element 30, forming a single body; thanks to this configuration, a more direct and efficient heat transfer is obtained, improving thermal reactivity and system performance (e.g. resistance to deformation, pressure, etc.).

[0034] In one implementation form the device 100 features “n” structured thermal modulators (with “n” greater than 2) which reproduce the desired thermal footprint on heating element 30. Thanks to this implementation form it is possible to concentrate or extend the thermal footprint of element 10 onto heating element 30, making device 100 light and responsive.

[0035] In one implementation form of device 100, the thermal modulators define interspaces (40, 41, 42 ) for the passage of a fluid intended as process target 90 or thermal element (e.g. air); in the latter case it will be possible to further control device 100 by heating or cooling via air, water, steam or oil.

[0036] In one implementation form of device 100, the induced element 10 and the heating element 30 define at least one interspace 40 and at least one thermal modulator 20 extends only partially along the height of induced 10 and / or heating element 30, allowing concentration or diffusion of heat and making the thermal footprint on heating element 30 even more specific.

[0037] In one implementation form the element 30 is a metallic element chosen according to the technical specifications of the process. The skilled person may therefore choose, by way of example, steel for corrosion resistance, AISI 316L steel for food-related processes, titanium for high-temperature resistance and lightness, copper or aluminum for rapid heat release, etc.

[0038] In one implementation form the inductor element 50 has a solenoidal or pancake shape and may present variable or constant pitch. Thanks to this implementation the expert may choose the thermal footprint on the metallic induced element 10 which will in turn be optimized by the thermal modulators.

[0039] In one implementation form the heating element 30 has a planar or curvilinear or variably curvilinear development, with open or closed perimeter; thanks to this implementation the device 100 can better adapt to the heating needs of the process.

[0040] In one implementation form the entire device 100 has a three-dimensional solid shape (a parallelepiped, a frustum of cone or pyramid ) or hollow (e.g. a tube with circular or polygonal section, regular or irregular); in this latter case the inductor element 50 may be positioned externally or internally to device 100 to make it more functional to the process.

[0041] In one implementation form the inductor element 50 is stationary, while the dielectric element 60, the induced metallic element 10, the thermal modulators and the heating element 30 are in synchronous or asynchronous motion. Thanks to this implementation form it is possible to heat elements in motion.

[0042] In one implementation form the device 100 is equipped with multiple heating elements (30), allowing a single thermal source to distribute heat simultaneously to multiple process targets 90 or to a single target 90 but in thermally differentiated areas.

[0043] In a further implementation form the heating element 30 and the induced element 10 form an angle between 0° and 180° which allows decoupling the heat generation part (induced 10) from the heat delivery part (heating element 30), making the use of Device 100 more flexible.

[0044] In one implementation form, the thermal modulators 20 and 21 are joined together to form a network, flexible and adaptable to process requirements.

[0045] In one implementation form, on the heating element 30 the same combination / sequence of device elements can be applied at least once, consisting of at least two thermal modulators 20’, 21’, similar or dissimilar both among themselves and with respect to modulators 20 and 21, at least one interspace 40’ defined by the thermal modulators and at least one further heating element 30’; thanks to this implementation, an improvement in heat distribution is obtained, optimizing the overall thermal response of the system.

[0046] The object of the present invention is also to describe a method to customize the thermal footprint of a heating element 30, which uses a device 100 according the invention, which includes the following steps:provide an element 30 intended to heat a process target element 90;provide an inductor element 50 configured to emit electromagnetic waves;provide a metallic induced element 10;provide a dielectric element 60 between the inductor element 50 and the metallic induced element 10;provide at least two thermal modulators 20 and 21 in direct contact or monolithically joined with the induced element 10 and / or the heating element 30 and which define at least one interspace 40;optionally provide an airflow passing through the interspace 40;energize alternating current in the inductor 50 and wait for heating of the induced element 10, followed by distribution of heat according to the thermal transfer lines defined by the thermal modulators and concentrated or distributed on the surface of heating element 30;optionally actuate the airflow or another fluid passing through interspace 40 to modulate the temperature on surface 30, cooling or heating it more rapidly.

[0047] Method and device 100 object of this invention present different implementation forms that may include one or more of the characteristics described hereafter.

[0048] Despite different implementation forms being described separately, it will be clear to the skilled person that they may be combined with one another, without necessarily combining all the characteristics, but only those necessary to obtain a desired effect.

[0049] The method and device object of the present invention may be used, by way of example, to cook, heat industrial molds, extruders, mold-holder plates, plates for thermoforming, plates for sealing and vacuum welding, generate steam, trigger chemical reactions, dry organic or inorganic material, distill, iron, weld, seal, stationary or moving materials. Indeed, thanks to electromagnetic induction heating it is possible to decouple the inductor element 50 from induced element 10, thermal modulators and heating element 30, allowing the latter to move freely (translate, rotate) and proving an excellent solution for rotating rollers, moving elements of a production line, etc.

[0050] For the purposes of the present invention the expression "process target element 90" is used to identify any element receiving thermal transfer from the heating element 30. An example of a process target element 90, whether internal or external to device 100, may for instance be a polymeric and / or composite film, a technical polymer, a food, a food or non-food semi-finished product, ceramics, a granulate of any nature, a textile, a cellulose element, a rubber, a food liquid, an inorganic or organic fluid.

[0051] Brief list of figures

[0052] Further characteristics and advantages of the invention will be better highlighted from the examination of the following detailed description of a preferred, but not exclusive, embodiment illustrated by way of example and not limiting, supported by the attached drawings, in which:

[0053] shows an example schematic sectional view of an electromagnetic induction heating device and thermal footprint modulator 100 comprising an inductor element 50, a dielectric element 60, a metallic induced element 10, two structured metallic thermal elements 20 and 21, a interspace 40 and a heating element 30 in contact with the process target 90;

[0054] schematically shows a view of device 100 where extractor elements 20, 21, 22 and 23 are monolithically joined with the induced element 10 and extractor elements 22 and 23 are monolithically joined also with the heating element 30, while extractor elements 20 and 21 are separate in direct contact with the heating element 30 partially in contact with the process target element 90;

[0055] schematically shows the sectional view of a planar development device 110 where a second sequence of thermal modulators 20’ and 21’ and heating element 30’ entirely in contact with the process target 90 is present;

[0056] schematically shows the sectional view of a tubular development device 120 where the inductor element 10 is internal to device 120 and a first sequence of thermal modulators 20 and heating element 30 and a second sequence of thermal modulators 20’ and heating element 30’ partially in contact with target element 90 are present;

[0057] Figures 5 and 6 schematically show a three-dimensional view of a Device 100 with parallelepiped development () having two heating elements 30 and 31 and of a Device 101 with tubular development with external inductor element 10 ().

[0058] schematically shows a sectional view of a Device 120 having two heating elements 30 and 31 partially in contact with the process target element 90 shaped as an "L", one parallel and the other orthogonal to the induced element 10, two thermal modulators 20 and 21, two interspaces 40 and 41 delimited by elements 10, 20, 21, 30 and 31.

[0059] To facilitate understanding, identical reference numbers have been used, where possible, to identify identical common elements in the figures.

[0060] Detailed description of the invention

[0061] The present invention will now be described with reference to the attached drawings, which illustrate a non-limiting embodiment. For example, the features illustrated or described as part of one embodiment may be adopted on, or in association with, other embodiments to produce a further embodiment. It is understood that the present invention will include such modifications and variants.

[0062] shows an example schematic sectional view of an electromagnetic induction heating device and thermal footprint modulator 100, according to claim 1, comprising an inductor element 50, a dielectric element 60, a metallic induced element 10, two structured metallic thermal elements 20 and 21, a interspace 40 and a heating element 30 in contact with a process target element 90.

[0063] Advantageously, in one implementation the inductor element 50 has a solenoidal or pancake or ring shape, or saddle or concentrator or multi-spiral, etc., single-order or “n” orders (with “n” integer greater than one); such a configuration allows obtaining a characteristic thermal footprint configuration on induced 10.

[0064] For even more precise tuning of the thermal footprint, in one implementation the inductor 50 may present constant or variable pitch, enabling concentration of heating on precise areas or modulation of the thermal profile.

[0065] In some implementations, the dielectric element 60 may have a thickness from 5 μm to 50 cm and prevents short-circuiting of inductor 50 onto induced 10. Choice of the most convenient dielectric material for installation of device 100 (e.g. air, plastic, sheaths, resin, …) is left to the skilled person.

[0066] Advantageously, in one implementation, the metallic element 10 has ferromagnetic properties and comprises a ferromagnetic metal or a ferromagnetic alloy. By way of example metallic element 10 may be iron, ferritic steel (e.g. AISI 400 series such as AISI 409 and AISI 430), a ferromagnetic alloy of iron and / or nickel and / or cobalt such as carbon steels, silicon steels, martensitic steels, Permalloy alloys, Invar alloys, Permendurm alloys, Cupro-Nickel alloys, Hiperco alloys and cast iron.

[0067] Thanks to this implementation the induced element 10 transduces electromagnetic fields into thermal energy with high efficiency.

[0068] In another implementation the induced element 10 has non-ferromagnetic properties and comprises a non-ferromagnetic metal or a non-ferromagnetic metal alloy. By way of example metallic element 10 may be a non-ferromagnetic iron alloy (e.g. austenitic steels such as AISI 316, AISI 316L, AISI 304) and / or nickel alloys (e.g. Hastelloy, Inconel), gold and its alloys, titanium and its alloys, aluminum and its alloys (e.g. series 1000, 2000, 6000, 7000), silver and its alloys, copper and its alloys (brass, bronze, copper-beryllium), zinc alloys, magnesium alloys, nickel-based and cobalt-based superalloy, thanks to this implementation induced element 10 can transfer heat more effectively and quickly than ferromagnetic metals and alloys and / or confers to induced 10 chemical and mechanical characteristics specific to the desired process.

[0069] In one implementation the induced metallic element 10 and / or heating element 30 advantageously have thickness between 10 microns and 5 cm, preferably between 500 microns and 10 mm. thanks to this implementation thin thicknesses (below 1 mm) present reduced thermal inertia and ensure high responsiveness to magneto-thermal transduction, while larger thicknesses favor more accurate temporal control and more stable thermal response.

[0070] In one implementation, the induced element 10 may have dimensions (surface area and / or thickness and / or volume) smaller or larger than that of heating element 30; this surface difference advantageously allows modulation of the intensity and distribution of heat transferred to heating element 30, optimizing the heating profile according to the specific application needs. Ininduced element 10, for example, has thickness greater than heating element 30 which, thanks to thermal modulators 20 and 21, will return two distinct thermal spots compared to the almost uniform thermal footprint of induced element 10 derived from the large thickness.

[0071] Advantageously thermal modulators 20 and 21 are in direct contact covering fully or partially induced element 10 and / or heating element 30, absorbing and transferring heat quickly and effectively.reports an example of Device 100 where thermal modulators 22 and 23 lie integrally on the lower portion of induced element 10 and of heating element 30, while thermal modulators 20 and 21 lie partially and modestly on induced 10 and almost integrally on heating element 30. Moreover,shows an example of thermal modulators 22 and 23 that are monolithically joined with induced element 10 and heating element 30, while elements 20 and 21 are monolithically joined with induced element 10 and separate in direct contact with heating element 30. Thanks to this configuration heat is extracted in a topologically selective way corresponding to partial and localized coverages.

[0072] In one implementation, advantageously, induced element, thermal modulators and heating element are composed of similar or dissimilar metals or metal alloys among themselves or relative to the composition of induced element 10; thanks to this implementation heat transfer is more efficient and / or more modulated and easily controllable.

[0073] In one implementation thermal modulators 20 and 21 have polygonal or continuously curvilinear section and are advantageously orthogonal or skewed with respect to induced element 10 and / or heating element 30. Thanks to this implementation extraction of heat from induced element 10 or supply of heat to heating element 30 is more efficient and allows more accurate heat modulation. Intwo examples of thermal modulators are reported: thermal modulator 20 has a right trapezoidal polygonal section and thermal modulator 21 has a partially curvilinear sinusoidal section.

[0074] In one implementation the thermal modulators are separate or partially joined among themselves and have equal or different shapes and sizes allowing greater customization of the thermal footprint on heating element 30. Ina Device 100 is represented having two separate thermal modulators of equal geometry (20 and 21) and two thermal modulators (22 and 23) partially joined and of dissimilar geometries (rectangular polygonal and triangular polygonal).

[0075] Advantageously in one implementation the thermal modulators are more than 2 allowing greater customization of the thermal footprint on heating element 30. An example of a multitude of thermal modulators is reported inwhere device 120 presents sixteen thermal modulators 20 and eight thermal modulators 20’, identical to each other in geometry and installation topology.

[0076] Advantageously the heating element 30 in one implementation is present in more than one number allowing greater customization in the release of heat to the process target element 90, whether it is internal to the interspaces or external to device 100. Inan example is reported where device 100 presents two heating elements 30 and 31 and two thermal modulators 20 and 21.

[0077] In one implementation the thermal modulators are monolithically joined together and / or to induced element 10 and / or to heating element 30, forming a single body, without joints or welds and making heat transport faster and more efficient.reports an example of Device 100 in which the heat modulators 20, 21, 22 and 23 are monolithic with the heat emitter element 30, while they are separate and in direct contact with induced element 10.

[0078] In one implementation the interspace 40 is traversed by a passing fluid capable of transporting thermal energy (e.g. air); said fluid allows quick removal (cold fluid) of thermal energy or, alternatively, apporting (hot fluid) of thermal energy. Thanks to this implementation device 100 becomes a highly responsive device in heating and cooling, ensuring perfect temperature control.

[0079] In one implementation the heating element 30 is metallic or in insulating material (e.g. ceramics, glass, cementitious materials, mica, polymers, technical polymers …), allowing faster diffusion of heat from the thermal modulators to its surface or hindering diffusion and concentrating focal thermal spots.

[0080] shows an example schematic sectional view of an electromagnetic induction heating device and thermal footprint modulator 100 composed of four thermal modulators (20, 21, 22 and 23) and three interspaces (40, 41 and 42). Thermal modulators 20 and 21 have equal shape and dimensions and are monolithically joined with induced element 10; thermal modulators 22 and 23 are dissimilar and are monolithically joined to each other and with induced element 10 and heating element 30. Interspaces 40 and 41 are confined by induced element 10, thermal modulators 20, 21 and 22 and by the heating element 30. Interspace 42 is confined by thermal modulators 22 and 23. The device 100 thus realized will present a distribution of the thermal footprint on heating element 30 that allows precise control of the generated heat and targeted thermal modulation in areas of interest.

[0081] In one implementation the entire device 100 has a three-dimensional shape such as a parallelepiped, frustum of cone, frustum of pyramid, a hollow tube (with circular or polygonal section). Figures 5 and 6 report two examples of Devices having a right parallelepiped shape (- Device 100) and tubular shape (hollow cylinder –- Device 101). Advantageously the inductor element 50 of a tubular device can be located in the innermost or outermost part of the device, as in the case of Device 101 ofwhich presents an external inductor element 50 allowing easier decoupling with induced element 10 and / or a more versatile ease of integration. In the case instead of Device 100 of, the inductor element 50 is internal and allows a greater surface extension of the heating element 30 with respect to induced element 10 and, therefore, of heat exchange with the process target element 90.

[0082] In one implementation the heating element 30 may present a smooth surface or partially or entirely textured, advantageously offering different heat transfer properties: a smooth surface enables uniform heat distribution and facilitates cleaning (heating element 30 and), while a textured surface (- heating element 31) increases the contact area, improving heat exchange efficiency and favoring faster or concentrated heating, adaptable to specific process applications.

[0083] In one implementation, on heating element 30 the same combination / sequence of device 100 elements may be applied at least once, constituted by at least two thermal modulators (20’, 21’), similar or dissimilar, both among themselves and with modulators 20 and 21, at least one interspace 40’ defined by the thermal modulators and at least one additional heating element 30’; in this implementation the active thermal element of the process is heating element 30’, while heating element 30 constitutes the thermal source of thermal modulators 20’ and 21’; thanks to this implementation an improvement in heat distribution is obtained, optimizing the overall thermal response of the system.

[0084] presents four thermal modulators (20, 21, 22 and 23) monolithically joined with heating element 30 and similar in pairs (20 and 23, 21 and 23), with two symmetrical interspaces (40 and 42) and one of reduced size (41); on heating element 30 two orthogonally placed, separate and dissimilar thermal modulators 20’ and 21’ lie, separated by interspace 40’ and separate and in direct contact with heating element 30’. Thanks to thermal modulators structured in this way, the device 100 ofpresents a thermal footprint different from that generated on induced element 10.

[0085] shows instead a device 120 with circular development, in which the thermal modulators 20 and 20’, arranged like the spokes of a wheel and dissimilar in size, the induced element 10 and the heating elements 30 and 30’ are joined monolithically. The device thus composed presents the advantage of greater temperature control and optimized cooling speed.

[0086] In one implementation the induced element 10 and the heating element 30 form, between them or between their projections, an angle between 0° and 180°.shows a Device 120 having two heating elements 30 and 31, partially in contact with the process target element 90, which relative to induced element 10 present angles of 180° and 90°, respectively. Thanks to this implementation the planar thermal footprint of induced 10, thanks to thermal modulators 20 and 21 that transfer it to heating elements 30 and 31, assumes an "L" shape.

[0087] Interspaces 40 and 41 are also presented respectively as:Interspace 40 delimited on four sides (induced 10, modulators 20 and 21 and heating elements 30 and 31);Interspace 41 delimited on three sides (induced 10, modulator 21 and partially heating element 31);Thanks to this implementation it is possible to introduce longitudinal and tangential heating or cooling flows.

[0088] In one implementation the heat-modulating elements 20 and 21 are rigid or flexible or hinged to induced element 10 and / or to the heat-emitting element 30. Thanks to this implementation it is advantageously possible to vary the mutual angle of inclination between elements 10 and 30 and / or the distance between elements 10 and 30 making Device 100 more flexible in its use and installation.

Claims

An electromagnetic induction heating device and thermal footprint modulator (100) for optimal and punctual control of the thermal footprint, comprising:at least one inductor element (50);at least one metallic element, or induced element, (10);said metallic element, or induced element (10), being heated by induction by said inductor element (50);at least one dielectric element (60);said dielectric element (60) being interposed between said inductor element (50) and said metallic element, or induced element (10);at least two structured metallic thermal elements acting as thermal modulators, called thermal modulators, (20) and (21); andat least one heating element (30);said heating element (30) being in thermal contact, through said thermal modulators (20, 21), with said induced element (10);and wherein the heating element (30) further heats a process target element (90), which may be a solid, a liquid, a suspension, a gel, a gas or a mixture of at least two thereof and which passes by or is at least partially stationary in contact with the heating element (30), externally or internally to the device (100);characterized in that the thermal footprint of the induced element (10) differs from the thermal footprint of the heating element (30) and in that the thermal modulators and / or at least one induced element (10) and / or at least one heating element 30 define at least one interspace (40), said thermal modulators (20, 21) being separate and in direct contact or monolithically joined to the induced element (10) and / or to the heating element (30).Device (100) according to claim 1 in which metallic element (10) has ferromagnetic properties and comprises a ferromagnetic metal or a ferromagnetic alloy of metals or alternatively has non-ferromagnetic properties and comprises a non-ferromagnetic metal or a non-ferromagnetic alloy of metals.Device (100) according to claim 1 in which the induced element (10) and / or the heating element (30) have thickness between 10 microns and 5 cm, preferably between 500 microns and 10 mm.Device (100) according to claim 1 in which induced element (10) may have dimensions smaller or larger than those of heating element (30).Device (100) according to claim 1 in which thermal modulators (20, 21) have polygonal or continuously curvilinear cross-section and are orthogonal or skewed with respect to induced element (10) and / or heating element (30).Device (100) according to claim 1 in which the thermal modulators (20, 21) and / or interspaces (40) are in a number greater than or equal to 2.Device (100) according to claim 1 in which interspace (40) is traversed by a fluid.Device (100) according to claim 1 in which heating element (30) is metallic or made of insulating material.Device (100) according to claim 1 in which device (100) has a three-dimensional shape such as a parallelepiped, frustum of cone, frustum of pyramid, a hollow tube, etc.Device (100) according to claim 1 comprising at least additional two thermal modulators (20', 21'), similar or dissimilar to each other and / or to first two modulators (20 and 21), at least one additional interspace (40') and at least one additional heating element (30') all arranged on heating element (30).Device (100) according to claim 1 or claim 10 in which inductor element (50) is stationary and the induced metallic element (10), the thermal modulators (20, 21, or 20, 21, 20' and 21') and the heating element (30, or 30 and 30') are in synchronous or asynchronous motion relative to one other and / or with inductor element (50).Device (100) according to any of the preceding claims 1, 10, 11 in which induced element, thermal modulators (20, 21, or 20, 21, 20' and 21') and heating element (30, or 30 and 30') are made of heterogeneous or homogeneous materials among themselves.Device (100) according to any of the preceding claims 1, 11, 12 in which at least one induced element (10) and at least one heating element (30, 30') present an inclination angle between them or between their projections comprised between 0° and 180°.Method to customize the thermal footprint of a heating element (30),which uses a device (100) according to claim 1,comprising the following steps:provide an element (30) intended to heat a process target element (90);-provide an inductor element (50) configured to emit electromagnetic waves;provide a metallic induced element (10);provide a dielectric element (60) between inductor element (50) and metallic induced element (10);provide at least two thermal modulators (20, 21) in direct contact or monolithically joined with induced element (10) and / or heating element (30) and which define at least one interspace (40);optionally provide a fluid passing through interspace (40);energize alternating current in inductor (50) and wait for heating of induced element (10), followed by heat distribution along the thermal transfer paths defined by the thermal modulators and concentrated or distributed on the surface of heating element (30);optionally activate fluid flow through interspace (40) to modulate the temperature on surface (30), cooling or heating it more rapidly.

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