Light detection device, optical element, and electronic apparatus

Abstract

A light detection device according to one embodiment of the present disclosure comprises: a first filter and a second filter respectively having a first reflective layer and a second reflective layer, and having an intermediate layer provided between the first reflective layer and the second reflective layer; a first pixel having a first light-receiving element for receiving light via the first filter; a second pixel having a second light-receiving element for receiving light via the second filter; and a boundary member provided between the first filter and the second filter.

Description

Optical Detection Device, Optical Element, and Electronic Device

[0001] The present disclosure relates to an optical detection device, an optical element, and an electronic device.

[0002] An image sensor having a pixel array including a plurality of pixels and a resonator structure provided on the pixel array has been proposed (Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2023-164392

[0004] In a device for detecting light, it is desirable to improve the optical characteristics.

[0005] It is desired to provide an optical detection device capable of improving the optical characteristics.

[0006] An optical detection device according to one embodiment of the present disclosure comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer and an intermediate layer provided between the first and second reflective layers; a first pixel having a first photodetector that receives light through the first filter; a second pixel having a second photodetector that receives light through the second filter; and a boundary member provided between the first and second filters. An optical detection device according to one embodiment of the present disclosure comprises a filter array having a first reflective layer and a second reflective layer and an intermediate layer provided between the first and second reflective layers; a first pixel and a second pixel adjacent to each other, each having a photodetector that receives light through the filter array; and a boundary member provided on the filter array. At least a portion of the boundary member is provided at the boundary between the first pixel and the second pixel in the intermediate layer. An optical element according to one embodiment of the present disclosure comprises a substrate and an optical layer provided laminated on the substrate. The optical layer comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer, and an intermediate layer provided between the first reflective layer and the second reflective layer, and a boundary member provided between the first filter and the second filter. An electronic device according to one embodiment of the present disclosure comprises an optical system and a photodetector that receives light transmitted through the optical system. The photodetector comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer, and an intermediate layer provided between the first reflective layer and the second reflective layer, a first pixel having a first photodetector that receives light through the first filter, a second pixel having a second photodetector that receives light through the second filter, and a boundary member provided between the first filter and the second filter.

[0007] Figure 1 is a block diagram showing an example of the schematic configuration of an imaging device, which is an example of a photodetector according to the first embodiment of this disclosure. Figure 2 is a diagram showing an example of the pixel section of an imaging device according to the first embodiment of this disclosure. Figure 3 is a diagram showing an example of the circuit configuration of a pixel in an imaging device according to the first embodiment of this disclosure. Figure 4 is a diagram for explaining an example of the configuration of an imaging device according to the first embodiment of this disclosure. Figure 5 is a diagram for explaining an example of the configuration of an imaging device according to the first embodiment of this disclosure. Figure 6 is a diagram for explaining an example of the configuration of an imaging device according to the first embodiment of this disclosure. Figure 7A is a diagram for explaining an example of the planar configuration of an imaging device according to the first embodiment of this disclosure. Figure 7B is a diagram for explaining an example of the planar configuration of an imaging device according to the first embodiment of this disclosure. Figure 7C is a diagram for explaining an example of the planar configuration of an imaging device according to the first embodiment of this disclosure. Figure 8A is a diagram for explaining an example of the configuration of an imaging device according to the first embodiment of this disclosure. Figure 8B is a diagram for explaining an example of the configuration of an imaging device according to the first embodiment of this disclosure. Figure 9 is a diagram for explaining an example of the transmittance of a filter in an imaging device according to the first embodiment of this disclosure. Figure 10A is a diagram illustrating an example configuration of an imaging device according to the first embodiment of this disclosure. Figure 10B is a diagram illustrating an example configuration of an imaging device according to the first embodiment of this disclosure. Figure 10C is a diagram illustrating an example configuration of an imaging device according to the first embodiment of this disclosure. Figure 11 is a diagram illustrating an example configuration of an imaging device according to Modification 1 of this disclosure. Figure 12 is a diagram illustrating an example configuration of an imaging device according to Modification 1 of this disclosure. Figure 13 is a diagram illustrating an example configuration of an imaging device according to Modification 2 of this disclosure. Figure 14 is a diagram illustrating an example configuration of an imaging device according to Modification 2 of this disclosure. Figure 15 is a diagram illustrating an example configuration of an imaging device according to Modification 2 of this disclosure. Figure 16 is a diagram illustrating an example configuration of an imaging device according to Modification 3 of this disclosure. Figure 17 is a diagram illustrating an example configuration of an imaging device according to Modification 3 of this disclosure. Figure 18 is a diagram illustrating an example configuration of an imaging device according to Modification 4 of this disclosure. Figure 19 is a diagram illustrating an example configuration of an imaging device according to Modification 5 of this disclosure.Figure 20 is a diagram illustrating an example configuration of an imaging device according to Modification 5 of the present disclosure. Figure 21 is a diagram illustrating an example configuration of an imaging device according to Modification 5 of the present disclosure. Figure 22 is a diagram illustrating an example configuration of an imaging device according to Modification 5 of the present disclosure. Figure 23 is a diagram illustrating an example configuration of an optical element according to the second embodiment of the present disclosure. Figure 24 is a block diagram showing an example configuration of an electronic device having an imaging device. Figure 25 is a block diagram illustrating an example of a schematic configuration of a vehicle control system. Figure 26 is an explanatory diagram showing an example of the installation positions of an external information detection unit and an imaging unit. Figure 27 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system. Figure 28 is a block diagram illustrating an example of the functional configuration of a camera head and a CCU.

[0008] The embodiments of this disclosure will be described in detail below with reference to the drawings. The description will be in the following order: 1. First Embodiment 2. Second Embodiment 3. Application Example 4. Application Example

[0009] <1. First Embodiment> Figure 1 is a block diagram showing an example of the schematic configuration of an imaging device, which is an example of a photodetector according to the first embodiment of the present disclosure. Figure 2 is a diagram showing an example of the pixel section of an imaging device according to the first embodiment. A photodetector is a device capable of detecting incident light. An imaging device 1, which is an example of a photodetector, has a plurality of pixels P including a light-receiving element and is configured to receive incident light and generate a signal.

[0010] The imaging device 1, for example, generates a signal by receiving light transmitted through an optical system (not shown). The imaging device 1 is constructed using, for example, a substrate on which the light-receiving elements of each pixel P are provided (for example, a semiconductor substrate such as a Si (silicon) substrate or an SOI (Silicon On Insulator) substrate). The imaging device 1 may also have a structure (layered structure) composed of multiple semiconductor layers stacked on top of each other.

[0011] The light-receiving element (light-receiving part) of each pixel P is, for example, a photodiode (PD) and is configured to convert light into photoelectric energy. The light-receiving element of each pixel P can also be called a photoelectric conversion element (photoelectric conversion part) or a photoelectric conversion region. The imaging device 1 has a region (pixel section 100) where a plurality of pixels P are provided, as shown in the example in Figure 1 or Figure 2. The imaging device 1 has, for example, a pixel section 100 in which a plurality of pixels P are arranged in a matrix in two dimensions as an imaging area.

[0012] The imaging device 1 captures incident light (image light) from the subject to be measured through an optical system that includes, for example, an optical lens and an aperture (diaphragm). The imaging device 1 captures an image of the subject formed by the optical lens. The imaging device 1 can generate a pixel signal by photoelectric conversion of the received light (for example, visible light, infrared light, or ultraviolet light). The imaging device 1, which is a light detection device, is a device that can receive light and generate a signal, and can also be called a light receiving device.

[0013] The imaging device 1 (light detection device) can be used as an image sensor, distance measuring sensor, etc. The imaging device 1 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge Coupled Device) image sensor, etc. The imaging device 1 can be used in various electronic devices such as digital still cameras, video cameras, and mobile phones.

[0014] The imaging device 1 is configured to detect light (multispectral) in multiple wavelength ranges (for example, four or more wavelength ranges). The imaging device 1 has, for example, a filter (i.e., a multispectral filter) that can selectively transmit light in multiple wavelength ranges. The imaging device 1 is configured as a multispectral sensor and can generate image data containing, for example, four or more wavelength components.

[0015] As shown in Figure 2, the direction of incidence of light from the subject being measured is defined as the Z-axis direction, the left-right direction perpendicular to the Z-axis direction is defined as the X-axis direction, and the up-down direction perpendicular to both the Z-axis and X-axis directions is defined as the Y-axis direction. In subsequent figures, directions may also be indicated based on the direction of the arrows in Figure 2.

[0016] [Outline Configuration of the Imaging Device] The imaging device 1, as an example, includes a pixel unit 100, a pixel control unit 111, a signal processing unit 112, and a control unit 113, as shown in Figure 1. The imaging device 1 is also provided with, for example, a plurality of control lines L1 and a plurality of signal lines L2. The pixel unit 100 is a pixel array in which a plurality of pixels P are arranged. The number and arrangement of pixels P provided in the pixel unit 100 (i.e., the pixel array) can be changed as appropriate.

[0017] Control line L1 is a signal line capable of transmitting signals to control pixels P, and is connected to the pixel control unit 111 and the pixels P of the pixel unit 100. In the example shown in Figure 1, multiple control lines L1 are wired to each pixel row of the pixel unit 100, which is composed of multiple pixels P arranged horizontally (in the row direction). Control line L1 is configured to transmit control signals for reading signals from pixels P. Control line L1 can also be called a drive line (or pixel drive line) that transmits signals to drive pixels P.

[0018] The signal line L2 is a signal line capable of transmitting signals from the pixel P, and is connected to the pixel P of the pixel unit 100 and the signal processing unit 112. In the pixel unit 100, for example, one or more signal lines L2 are wired to each pixel row, which is composed of multiple pixels P arranged vertically (in the column direction). The signal line L2 is electrically connected to the pixel P and is configured to transmit signals output from the pixel P. Note that the number and arrangement of control lines L1 and signal lines L2 are not limited to the illustrated example and can be changed as appropriate.

[0019] The pixel control unit 111 is configured to control each pixel P of the pixel unit 100. The pixel control unit 111 is a control circuit (pixel control circuit) and is composed of multiple circuits, such as a buffer, a shift register, and an address decoder. The pixel control unit 111 generates a signal for controlling the pixels P and outputs it to each pixel P of the pixel unit 100 via the control line L1. The pixel control unit 111 is controlled by the control unit 113 and controls the pixels P of the pixel unit 100.

[0020] The pixel control unit 111 generates signals to control pixels P, such as signals to control the readout circuit for pixels P, and supplies them to each pixel P via the control line L1. The pixel control unit 111 can control the reading of pixel signals from each pixel P. The pixel control unit 111 can also be described as a pixel drive unit (pixel drive circuit) configured to drive each pixel P.

[0021] The control unit 113 is configured to control each part of the imaging device 1. The control unit 113 receives data such as a clock and operating mode commands from an external source, and can output data such as internal information of the imaging device 1. The control unit 113 is a control circuit and, for example, has a timing generator configured to generate various timing signals.

[0022] The control unit 113 controls the operation of the pixel control unit 111 and the signal processing unit 112, etc., based on various timing signals (pulse signals, clock signals, etc.) generated by the timing generator. The control unit 113 may include circuits such as a PLL (Phase Locked Loop) and a DAC (Digital to Analog Converter).

[0023] The signal processing unit 112 is configured to acquire the signal from each pixel P and perform signal processing. The signal processing unit 112 is a signal processing circuit and is composed of circuits that perform various signal processing on the input pixel signals. The signal processing unit 112 includes an arithmetic circuit, a memory circuit, etc. The signal processing unit 112 is configured to include, for example, an AD (Analog Digital) conversion circuit.

[0024] The signals output from each pixel P selected and scanned by the pixel control unit 111 are input to the signal processing unit 112 via the signal line L2. The signal processing unit 112 (signal processing circuit) can perform various signal processing operations, such as AD conversion, noise reduction, and interpolation of the pixel P signals.

[0025] The signal processing unit 112 can perform signal processing on the pixel signal and output the processed pixel signal. The signal processing unit 112 may include a processor and memory. Note that some or all of the pixel control unit 111, signal processing unit 112, and control unit 113 may be configured as a single unit.

[0026] The pixel unit 100, pixel control unit 111, signal processing unit 112, control unit 113, etc., described above may be provided on a single substrate or divided and provided on multiple substrates. The pixel control unit 111, signal processing unit 112, control unit 113, etc., may be provided, for example, as peripheral circuits in the peripheral region of the pixel unit 100. The imaging device 1 may have a stacked structure formed by stacking multiple substrates.

[0027] [Pixel Configuration] Figure 3 shows an example of the circuit configuration of a pixel in an imaging device according to the first embodiment. A pixel P includes, for example, a light-receiving element 11 and a readout circuit 15. The readout circuit 15 is provided, for example, for each light-receiving element 11 or for each of a group of light-receiving elements 11. The light-receiving element 11 is configured to receive light and generate a signal. The readout circuit 15 is configured to output a signal based on the photoelectrically converted charge.

[0028] The light-receiving element 11 is configured to generate electric charge through photoelectric conversion. The light-receiving element 11 can also be described as a photoelectric conversion element (photoelectric conversion unit) configured to convert light into electric charge. In the example shown in Figure 3, the light-receiving element 11 is a photodiode (PD) that converts incident light into electric charge. The light-receiving element 11 can generate an electric charge corresponding to the amount of light received by performing photoelectric conversion.

[0029] The readout circuit 15 includes, as an example, a transistor TRG, a floating diffusion FD, a transistor AMP, a transistor SEL, and a transistor RST. The readout circuit 15 can read out pixel signals based on the charge photoelectrically converted by the photodetector 11.

[0030] The transistor TRG is configured to transfer the charge converted by the photodetector 11 to the floating diffusion FD. The transistor TRG is controlled by the signal STRG to electrically connect or disconnect the photodetector 11 and the floating diffusion FD. The transistor TRG is a transfer transistor. The transistor TRG can transfer the charge converted and stored by the photodetector 11 to the floating diffusion FD.

[0031] The floating diffusion FD is a storage unit and is configured to store the transferred charge. The floating diffusion FD can store the charge photoelectrically converted by the photodetector 11. The floating diffusion FD stores the transferred charge and converts it into a voltage corresponding to the capacitance of the floating diffusion FD. The floating diffusion FD can also be described as a storage unit capable of holding charge.

[0032] The transistor AMP is configured to generate and output a signal based on the charge stored in the floating diffusion FD. The transistor AMP is an amplifying transistor. The transistor AMP can generate and output a signal based on the charge converted by the photodetector 11 (i.e., the photoelectric conversion element).

[0033] The gate of the transistor AMP is electrically connected to the floating diffusion diode (FD), and the voltage converted by the floating diffusion diode is input to it. The drain of the transistor AMP is connected to a power line that supplies, for example, the power supply voltage (the power supply voltage VDD in the example shown in Figure 3).

[0034] The source of the transistor AMP is connected to signal line L2, for example, via transistor SEL. The transistor AMP is configured to generate a signal based on the charge stored in the floating diffusion FD, i.e., a signal based on the voltage of the floating diffusion FD, and output it to signal line L2.

[0035] The transistor SEL is configured to control the output of the pixel signal. The transistor SEL is electrically connected in series with the transistor AMP, for example, as shown in Figure 3. The transistor SEL is controlled by the signal SSEL and is configured to output the signal from the transistor AMP to the signal line L2. The transistor SEL is a selection transistor. The transistor SEL can control the timing of the pixel signal output.

[0036] The transistor SEL is configured to output a signal based on the charge converted by the photodetector 11. The transistor SEL can output the pixel signal of pixel P to the signal line L2. The transistor SEL may also be electrically connected in series between the power line to which the power supply voltage (power supply voltage VDD in the example shown in Figure 3) is supplied and the transistor AMP. The transistor SEL may be omitted if necessary.

[0037] The transistor RST is configured to reset the voltage of the floating diffusion FD. In the example shown in Figure 3, the transistor RST is electrically connected to a power line to which the power supply voltage VDD is supplied and is configured to perform a reset of the charge of pixel P. The transistor RST is a reset transistor.

[0038] The transistor RST is controlled by the signal SRST and can reset the charge accumulated in the floating diffusion FD and reset the voltage of the floating diffusion FD. The transistor RST electrically connects the power line and the floating diffusion FD and discharges the charge accumulated in the floating diffusion FD. In addition, the transistor RST can reset the charge accumulated in the photodetector 11 via the transistor TRG.

[0039] The transistors TRG (transfer transistor), AMP (amplifier transistor), SEL (selection transistor), and RST (reset transistor) mentioned above are, for example, MOS transistors (MOSFETs) having gate, source, and drain terminals.

[0040] In the example shown in FIG. 3, the transistor TRG, the transistor AMP, the transistor SEL, and the transistor RST are each constituted by an NMOS transistor. Note that the transistor of the pixel P may be constituted by a PMOS transistor as necessary.

[0041] The pixel control unit 111 (see FIG. 1) of the imaging device 1 supplies a control signal to the gates of the transistors TRG, SEL, RST, etc. of each pixel P via the control line L1 described above, and turns the transistor on (conductive state) or off (non-conductive state).

[0042] As an example, the plurality of control lines L1 for each pixel row of the imaging device 1 include a wiring for transmitting a signal STRG for controlling the transistor TRG, a wiring for transmitting a signal SSEL for controlling the transistor SEL, a wiring for transmitting a signal SRST for controlling the transistor RST, and the like.

[0043] The transistors TRG, SEL, RST, etc. are turned on and off by the pixel control unit 111. The pixel control unit 111 outputs a pixel signal from each pixel P to the signal line L2 by controlling the readout circuit 15 of each pixel P. The pixel control unit 111 can perform control to read the pixel signal of each pixel P to the signal line L2.

[0044] Note that the imaging device 1 may have a configuration in which a plurality of pixels P share one readout circuit 15. The readout circuit 15 is provided for, for example, a plurality of pixels P. In the imaging device 1, the readout circuit 15 may be arranged for each of the plurality of pixels P, and one readout circuit 15 may be shared by the plurality of pixels P. As an example, a 2×2 pixel constituted by four adjacent pixels P may share one readout circuit 15.

[0045] [Configuration of Imaging Device] FIG. 4 is a diagram for explaining a configuration example of an imaging device according to the first embodiment. FIG. 4 shows an example of a cross-sectional configuration of the imaging device 1. The imaging device 1 has, for example, an optical layer 80, an insulating layer 20, and a semiconductor layer 10. The imaging device 1 has a configuration in which the optical layer 80, the insulating layer 20, and the semiconductor layer 10 are stacked in the Z-axis direction.

[0046] In the example shown in FIG. 4, an optical layer 80, an insulating layer 20, and a semiconductor layer 10 are provided from the side where light is incident. The semiconductor layer 10 is composed of, for example, a semiconductor substrate such as a Si substrate or a SOI substrate. The semiconductor layer 10 has opposing surfaces 11S1 and 11S2. The surface 11S2 is the surface on the opposite side of the surface 11S1. The surface 11S1 of the semiconductor layer 10 is, for example, a light receiving surface (light incident surface).

[0047] The surface 11S2 of the semiconductor layer 10 is, for example, an element formation surface on which elements such as transistors and capacitor elements are formed. A gate electrode, a gate insulating film (for example, a gate oxide film), etc. are provided on the surface 11S2 of the semiconductor layer 10. The element formation surface of the semiconductor layer 10, that is, the surface 11S2, is a surface on which various circuit elements are provided, and can also be called a circuit surface.

[0048] The insulating layer 20 and the optical layer 80 are provided laminated on the semiconductor layer 10 in the thickness direction orthogonal to the surface 11S1 of the semiconductor layer 10. Note that the semiconductor layer 10 may be a SiGe (silicon germanium) substrate, a SiC (silicon carbide) substrate, or the like. The semiconductor layer 10 may be composed of other semiconductor materials, for example, III-V compound semiconductor materials. The semiconductor layer 10 may be formed using other materials.

[0049] On the surface 11S1 side of the semiconductor layer 10, an insulating layer 20 and an optical layer 80 are provided. On the surface 11S2 side of the semiconductor layer 10, for example, a wiring layer 90 is provided as in the example shown in FIG. 5. The optical layer 80 is provided on the side where light from the optical system is incident, and the wiring layer 90 is provided on the side opposite to the side where light is incident. Light from a subject as a measurement target is incident on the optical layer 80 through, for example, an optical system (imaging lens, aperture, etc.).

[0050] For example, the semiconductor layer 10 is provided with a light-receiving element 11 for each pixel P. The light-receiving element 11 (i.e., photoelectric conversion element) is provided between surfaces 11S1 and 11S2 of the semiconductor layer 10. Multiple light-receiving elements 11 are provided in the semiconductor layer 10 so as to be aligned with surfaces 11S1 and 11S2 of the semiconductor layer 10. For example, multiple light-receiving elements 11 are embedded in the semiconductor layer 10. The light-receiving element 11 can also be called a photoelectric conversion region or photoelectric conversion layer.

[0051] The wiring layer 90 is provided laminated on the semiconductor layer 10. The wiring layer 90 includes, for example, a conductive film and an insulating film, and has a plurality of wirings and a plurality of vias (also called contacts). The wiring layer 90 has a configuration in which a plurality of wirings are laminated with an insulating film acting as an interlayer insulating film (interlayer insulating layer). The wiring layer 90 is composed of, for example, two or more or three or more layers of wiring, and is provided as a multilayer wiring layer.

[0052] The wiring of the wiring layer 90 is formed using metallic materials such as aluminum (Al), copper (Cu), cobalt (Co), or ruthenium (Ru). The wiring of the wiring layer 90 may also be made of tungsten (W), polysilicon (Poly-Si), or other conductive materials. The interlayer insulating film may be formed using silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), or other insulating materials.

[0053] For example, the above-described readout circuit 15 (see Figure 3) is provided in the semiconductor layer 10 and the wiring layer 90 for each pixel P or for each of multiple pixels P. Furthermore, the above-described pixel control unit 111, signal processing unit 112, control unit 113 (see Figure 1), etc., may be provided in the semiconductor layer 10 and the wiring layer 90, or they may be provided on a substrate separate from the semiconductor layer 10.

[0054] The insulating layer 20 is provided between the optical layer 80 and the semiconductor layer 10. The insulating layer 20 is composed of an insulating film such as an oxide film, a nitride film, or an oxynitride film. The insulating layer 20 may be composed of an insulating material such as silicon oxide, silicon oxynitride, silicon nitride, or aluminum oxide (AlO), or it may be composed of other materials.

[0055] The insulating layer 20 may be made of a low refractive index material such as silicon oxide. The insulating layer 20 may also be formed using other materials that transmit light in the wavelength range to be measured. The insulating layer 20 can also be called a light-transmitting transparent layer or a spacer layer. The insulating layer 20 may be configured to have a flat top surface, for example, and can also be called a planarization layer. Note that the imaging device 1 may be configured without an insulating layer 20.

[0056] The optical layer 80 has a filter 70 and is configured to selectively transmit incident light to the photodetector 11. The filter 70 is configured to selectively transmit light in a predetermined wavelength range from the incident light. The optical layer 80 includes, for example, a plurality of filters 70 and is configured as a filter array. The filter 70 is provided for each pixel P or for a plurality of pixels P (i.e., for a predetermined number of pixels P), as shown in the example in Figure 4.

[0057] In the optical layer 80, for example, multiple filters 70 are arranged in a matrix in a two-dimensional manner. Each filter 70 in the optical layer 80 may be configured as a narrowband filter capable of transmitting light in at least one specific wavelength band. The optical layer 80 is, for example, a layer (region) containing multiple filters 70, which are narrowband filters, and is provided as a narrowband filter array. The filters 70 (or optical layer 80) can be described as multispectral filters.

[0058] The optical layer 80 has a reflective layer 61, an intermediate layer 50, and a reflective layer 62, as shown in the example in Figure 4. Each filter 70 of the optical layer 80 includes, for example, a reflective layer 61, an intermediate layer 50, and a reflective layer 62, and is configured as a Fabry-Perot filter. The filter 70 has a configuration in which the reflective layer 61, the intermediate layer 50, and the reflective layer 62 are stacked in the Z-axis direction. The reflective layer 61, the intermediate layer 50, and the reflective layer 62 are provided from the side where light is incident.

[0059] The reflective layers 61 and 62 are provided on the intermediate layer 50. The reflective layers 61 and 62 are provided facing each other with the intermediate layer 50 in between. For example, each of the reflective layers 61 and 62 is a reflective member (reflective film) and is configured to have a predetermined reflectance with respect to incident light.

[0060] The reflective layers 61 and 62 are arranged apart from each other in the thickness direction of the intermediate layer 50, i.e., in the stacking direction (Z-axis direction in Figure 4). Reflective layer 61 is provided on one side of the intermediate layer 50, and reflective layer 62 is provided on the other side of the intermediate layer 50. In the example shown in Figure 4, reflective layer 61 is the upper reflective layer of the intermediate layer 50, and reflective layer 62 is the lower reflective layer of the intermediate layer 50.

[0061] The intermediate layer 50 is provided between the reflective layer 61 and the reflective layer 62. The intermediate layer 50 is an intermediate member between the reflective layer 61 and the reflective layer 62, and is also called a resonant layer or resonator layer. The filter 70, for example, includes the intermediate layer 50 as a resonator (Fabry-Perot resonator) and is provided as a Fabry-Perot type filter. The filter 70 can be configured as an optical filter that utilizes Fabry-Perot resonance.

[0062] The filter 70 resonates light in a specific wavelength range between the reflective layers 61 and 62, i.e., in the intermediate layer 50, and selectively transmits light in that specific wavelength range. Light incident on the intermediate layer 50 from above via the reflective layer 61 is reflected and interfered with by the reflective layers 61 and 62, and the light in the resonant wavelength range is transmitted through the reflective layer 62 and output.

[0063] The filter 70, for example, has multiple resonance modes and can transmit multiple narrowband light signals that resonate in the intermediate layer 50 to the photodetector 11. In the imaging device 1, the resonance wavelength can be controlled by adjusting the effective refractive index of the intermediate layer 50, the thickness of the intermediate layer 50, etc., so that, for example, different wavelength spectra can be obtained for each pixel.

[0064] The reflective layer 61 and the reflective layer 62 are each composed of a metallic material such as Ag (silver), Au (gold), copper (Cu), Al (aluminum), or Ti (titanium). Each of the reflective layer 61 and the reflective layer 62 may be formed using other metallic materials or other materials. The reflective layer 61 and the reflective layer 62 may be formed by laminating multiple dielectric films (dielectric films) having different refractive indices.

[0065] Each of the reflective layers 61 and 62 may be constructed as a dielectric multilayer film using SiO (silicon oxide), TiO (titanium oxide), SiN (silicon nitride), a-Si (amorphous silicon), Poly-Si (polysilicon), etc. As an example, each of the reflective layers 61 and 62 has multiple stacked films and is constructed as a Bragg reflective layer.

[0066] The intermediate layer 50 is, for example, silicon oxide (SiO ２ It is constructed using dielectric materials such as silicon oxynitride (SiON) and silicon nitride (SiN). The intermediate layer 50 may be formed using a semiconductor material, or it may be formed using other materials that transmit light in the wavelength range to be measured.

[0067] In the imaging device 1, the pixel section 100 is provided with multiple types of pixels P (pixels P1, P2, P3, and P4 in Figure 4), each having a light-receiving element 11. Pixels P1 to P4 have filters 70 and are configured to generate electric charge by photoelectric conversion of light in different wavelength ranges. Pixels P1 to P4 are positioned adjacent to each other, for example, in the X-axis or Y-axis direction. In the pixel section 100, for example, multiple pixels P1 to multiple pixels P4 are repeatedly arranged.

[0068] The pixel section 100 (i.e., pixel array) of the imaging device 1 may be provided with multiple types of pixels P, for example, pixels P1 to P4, arranged in the X-axis direction (or Y-axis direction). Alternatively, pixels P1 to P4 may be arranged in both the X-axis direction and the Y-axis direction. For example, in the pixel section 100, a 2x2 pixel arrangement, consisting of pixels P1, P2, P3, and P4, may be repeatedly provided.

[0069] Pixel P1 receives light in the first wavelength range at the photodetector 11 and converts it into photoelectric energy. Pixel P2 receives light in the second wavelength range at the photodetector 11 and converts it into photoelectric energy. Pixel P3 receives light in the third wavelength range at the photodetector 11 and converts it into photoelectric energy. Pixel P4 receives light in the fourth wavelength range at the photodetector 11 and converts it into photoelectric energy.

[0070] Pixel P1 generates a pixel signal for the first wavelength component, pixel P2 generates a pixel signal for the second wavelength component, pixel P3 generates a pixel signal for the third wavelength component, and pixel P4 generates a pixel signal for the fourth wavelength component. The imaging device 1 receives each spectrum in the wavelength range of visible light or infrared light, and can obtain pixel signals of multiple types of wavelength components. By using the pixel signals of each pixel P, image data containing, for example, four or more wavelength components can be generated.

[0071] The types and arrangement of pixels P in the imaging device 1 can be arbitrarily set. The pixel section 100 may be provided with five or more types of pixels P that receive light of different wavelengths and perform photoelectric conversion. For example, eight types of pixels P may be repeatedly arranged in the pixel section 100, or sixteen types of pixels P may be repeatedly arranged. A multispectral image containing eight wavelength components or sixteen wavelength components can be obtained.

[0072] Each filter 70 of multiple types of pixels (for example, pixels P1 to P4) is configured such that the refractive index and thickness of the intermediate layer 50 differ so as to transmit light in a specific wavelength range to be detected. The intermediate layer 50 in each of pixels P1 to P4 may be made of the same material or of different materials. The intermediate layer 50 may be made up of multiple layers.

[0073] The filter 70 may have a structure 51, as shown in the example in Figure 4. The imaging device 1 has, for example, a structure 51 provided in the intermediate layer 50 of the optical layer 80 in some or all of the pixels P. The intermediate layer 50 includes, as an example, the structure 51 and a member 52 provided around the structure 51. The structure 51 and the member 52 are made of materials having different refractive indices.

[0074] The intermediate layer 50 (or optical layer 80) includes a structure 51 as a nanostructure and has a metasurface structure (or metamaterial structure). For example, one or more structures 51 and members 52 are formed in the intermediate layer 50 for each pixel P. The filter 70 is configured to propagate light in a predetermined wavelength range to the photodetector 11 side using the intermediate layer 50 having the structures 51.

[0075] In the filter 70 of each pixel P, for example, the effective refractive index of the structure 51 and member 52 is adjusted according to the occupancy rate (volume fraction) of the structure 51, and the wavelength band (and center wavelength) of light transmitted by the filter 70 is determined. By adjusting the size and number of structures 51 in each filter 70, the transmitted wavelength band in each filter 70 can be set.

[0076] Each filter 70 of pixels P1 to P4 may be configured to selectively transmit light of different wavelengths (and center wavelengths) in the visible light region, for example. Alternatively, each filter 70 of pixels P1 to P4 may be configured to selectively transmit light of different wavelengths in the infrared light region, for example.

[0077] As an example, the structure 51 has a cylindrical shape. As another example, the structure 51 has a prismatic shape. In plan view (i.e., when viewed in the XY plane), the structure 51 may be circular, elliptical, or quadrilateral. The shape of the structure 51 can be changed as appropriate, and may be polygonal, cross-shaped, or other shapes.

[0078] The structure 51, in plan view (i.e., viewed in the XY plane), has a size that is, for example, less than or equal to a predetermined wavelength of incident light. When viewed in the XY plane, the structure 51 may have a size that is less than or equal to the wavelength range of the light to be measured. The size of the structure 51 when viewed in the XZ plane or YZ plane (for example, the height of the structure 51) may be less than or equal to the predetermined wavelength of incident light, or it may be greater than the wavelength of incident light.

[0079] In the intermediate layer 50 of the optical layer 80, for example, multiple structures 51 are arranged two-dimensionally in the X-axis and Y-axis directions. As an example, the multiple structures 51 of each filter 70 are arranged so as to be aligned with each other in the X-axis or Y-axis direction, with a part of the member 52 in between. In the optical layer 80, for each pixel P, the size (width, height, etc.), number of structures 51, spacing between structures, material of structures 51, etc. are determined so that light in the wavelength range to be detected is transmitted to the photodetector 11.

[0080] Member 52 is provided between a plurality of adjacent structures 51. Member 52 is a member located around the structure 51. Member 52 has a different refractive index than the structure 51 and can be called a material layer. Member 52 is provided, for example, to fill the space between a plurality of adjacent structures 51 and can be called a filling member. A part of member 52 may be provided above and below the structure 51. The structure 51 may be arranged to be embedded in member 52 (i.e., the material layer).

[0081] The structure 51 and the member 52 may be made of different materials. For example, the structure 51 may be made of a material having a relatively high refractive index. The structure 51 may be made of a material having a higher refractive index than the member 52, and thus have a higher refractive index than the member 52. The structure 51 may be made of a high refractive index material and can be called a high refractive index part. The member 52 may be made of a low refractive index material and can be called a low refractive index part.

[0082] The structure 51 is, for example, made of titanium oxide (TiO). The structure 51 may also be formed using silicon, polysilicon (Poly-Si), amorphous silicon (a-Si), germanium (Ge), etc. The structure 51 may be made of a metal compound or a silicon compound, or it may be formed using other materials.

[0083] Component 52 is, for example, silicon oxide (SiO ２ The member 52 is composed of silicon nitride (SiN), silicon oxynitride (SiON), or silicon carbide (SiC). The member 52 may be composed of other silicon compounds or formed from other materials.

[0084] Each pixel P's light-receiving element 11 receives incident light through the filter 70 of the optical layer 80 and generates a pixel signal. For example, pixels P1 to P4 can generate and output pixel signals of the first wavelength component to the fourth wavelength component. The imaging device 1 can use the pixel signals obtained from each pixel P to generate, for example, image data showing the subject image, image data relating to the distance to the measurement target (object) (distance image data), and the like.

[0085] The number and arrangement of structures 51 in each filter 70, the constituent materials of each structure 51 and member 52, etc., are selected according to the wavelength range of the light to be measured, the refractive index difference with the surrounding material, etc. In the imaging device 1, for example, as shown in the example in Figure 6, pixels having structures 51 (pixels P2, P4) and pixels without structures 51 (pixels P1, P3) may be arranged.

[0086] The imaging device 1 has a boundary member 40, as shown in the example in Figure 4 or Figure 6. The boundary member 40 is provided between a plurality of adjacent filters 70. The boundary member 40 is positioned, for example, adjacent to the end (side) of the filter 70. As an example, the boundary member 40 has a shape that extends in the thickness direction (i.e., the Z-axis direction) of the optical layer 80. The boundary member 40 can also be called a boundary layer or boundary wall.

[0087] At least a portion of the boundary member 40 is provided at the boundary between a plurality of adjacent pixels P in the optical layer 80 (i.e., filter array). For example, the boundary member 40 is formed in the intermediate layer 50 so as to be located at the boundary between a plurality of adjacent pixels P in the X-axis direction (or Y-axis direction). The boundary member 40 is provided at the boundary between pixel P1 and pixel P2, the boundary between pixel P2 and pixel P3, the boundary between pixel P3 and pixel P4, etc.

[0088] The boundary member 40 has, for example, a trench structure and is provided around the pixel P (or filter 70). In the example shown in Figure 4, the boundary member 40 is provided so as to penetrate the intermediate layer 50. The boundary member 40 is provided between the structure 51 of one of two adjacent pixels P and the structure 51 of the other pixel P.

[0089] Furthermore, a portion of the boundary member 40 may be provided within the reflective layer 61 or within the reflective layer 62. The boundary member 40 may be provided so as to penetrate at least one of the reflective layer 61 and the reflective layer 62. The boundary member 40 is formed, for example, by embedding (filling) a low refractive index material into a trench.

[0090] The boundary member 40 is configured to have a refractive index lower than that of the material constituting the intermediate layer 50. For example, the boundary member 40 is configured to have a refractive index lower than that of the effective refractive index of the intermediate layer 50. For example, the boundary member 40 has a refractive index lower than that of the structure 51 of the intermediate layer 50. The boundary member 40 may also be configured to have a refractive index lower than that of the member 52 of the intermediate layer 50.

[0091] Furthermore, the boundary member 40 may be made of a material that absorbs little light, for example, it may be configured not to absorb light in the wavelength range to be measured. The boundary member 40 may be provided to have a low extinction coefficient in the transmission wavelength range of the filter 70. The extinction coefficient k of the boundary member 40 may be, for example, 0.001 or less.

[0092] The boundary member 40 is, for example, made of a fluoride (magnesium fluoride (MgF), aluminum fluoride (AlF), etc.). The boundary member 40 may also be made of a fluoropolymer (e.g., Teflon®). The boundary member 40 may be made of other resin materials, or may be formed using other materials. The boundary member 40 may be made using voids (air). For example, voids (cavities) may be provided within the boundary member 40.

[0093] The boundary member 40 is made of silicon oxide (SiO ２ The boundary member 40 may be configured to have a refractive index lower than that of the other member. The refractive index of the boundary member 40 may be, for example, 1.4 or less. The refractive index of the boundary member 40 for visible light (or infrared light) may be 1.4 or less, and may be 1.45 or less or 1.35 or less. The boundary member 40 may be made of a material having a low refractive index in the wavelength range of visible light or infrared light.

[0094] Figures 7A to 7C are diagrams illustrating an example of the planar configuration of an imaging device according to the first embodiment. Each pixel P has a filter 70 including one or more structures 51, as shown in the example in Figures 7A, 7B, or 7C. As shown in the example in Figure 7B or 7C, the multiple structures 51 may be arranged in the X-axis and Y-axis directions in a plan view.

[0095] In the imaging device 1, the boundary members 40 may be arranged to surround the pixels P in a plan view (i.e., when viewed in the XY plane). The boundary members 40 may be formed in a grid pattern so as to surround each pixel P having a filter 70 in a plan view. The number and shape of the structures 51 are not limited to the illustrated example and can be set arbitrarily.

[0096] In the imaging device 1 according to this embodiment, a boundary member 40 is provided as described above. This makes it possible to suppress the interaction between the filters 70 (i.e., between the resonators). This makes it possible to suppress the deterioration of the transmittance and wavelength resolution of the filters 70 caused by the interaction between the filters 70. This makes it possible to realize an optical detection device (imaging device) that can improve optical characteristics.

[0097] Figures 8A and 8B are diagrams illustrating an example of the configuration of an imaging device according to the first embodiment. In Figures 8A and 8B, the central pixel P of a 3x3 pixel array is designated as the pixel to be evaluated (referred to as pixel Pc), and an example is shown in which pixels P having structures 51 are arranged above, below, to the left, and to the right of pixel Pc. Figure 9 shows an example of the transmittance of the filter of the imaging device. In Figure 9, the vertical axis represents transmittance, and the horizontal axis represents wavelength.

[0098] If the imaging device 1 does not have a boundary member 40, the transmittance and wavelength resolution of the pixel Pc filter 70 may decrease due to the interaction between the pixel Pc filter 70 and the surrounding pixel P filters 70, as shown by the dashed line S2 in Figure 9. In particular, when the effective refractive index of the pixel Pc filter 70 is relatively low and the effective refractive difference between the pixel Pc filter 70 and the surrounding pixel P filters 70 is large, a decrease in transmittance and a decrease in wavelength resolution tend to occur.

[0099] In the imaging device 1 according to this embodiment, the interaction between filters 70 can be suppressed by providing a boundary member 40 as shown in the example in Figure 8A, etc. As shown by the solid line S1 in Figure 9, the transmittance and wavelength resolution of the filter 70 can be improved. It becomes possible to narrow (reduce) the full width at half maximum of the transmittance peak.

[0100] In this embodiment, the provision of boundary members 40 improves the degree of freedom of the effective refractive index for each pixel. The transmission wavelength range of each filter 70 can be appropriately set, enabling accurate light detection. Furthermore, for example, it is possible to suppress the degradation of pixel signal quality and improve image quality.

[0101] The refractive index n of the boundary member 40 may be, for example, 1.4 or less. Furthermore, the extinction coefficient k of the boundary member 40 may be 0.001 or less. By configuring the imaging device 1 in this way, the interaction between a pixel P and its surrounding pixels P can be effectively suppressed. This makes it possible to effectively improve the transmittance and wavelength resolution of the filter 70.

[0102] In the pixel section 100, boundary members 40 may be provided at the boundaries of adjacent pixels P in the X-axis direction (or Y-axis direction), depending on, for example, the volume fraction of the structure 51 in each filter 70, the effective refractive index of each filter 70, etc. The boundary members 40 may be provided for some or all of the sides of the pixels P.

[0103] The boundary member 40 is provided, for example, along at least one end face (side surface) of the pixel P (or filter 70). For example, the boundary member 40 may be provided at the left end of the pixel P, as shown in the example in Figure 10A. The boundary member 40 may be arranged as shown in the example in Figure 10B or Figure 10C.

[0104] As an example, the boundary member 40 is provided so as to sandwich at least a portion of the filter 70 of the pixel P. Alternatively, for example, multiple boundary members 40 may be provided so as to surround the pixel P (or filter 70). The shape and arrangement of the boundary members 40 are not limited to the example described above and can be changed as appropriate.

[0105] [Function and Effects] The light detection device according to this embodiment comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer (reflective layer 61, reflective layer 62), and an intermediate layer (intermediate layer 50) provided between the first reflective layer and the second reflective layer; a first pixel (e.g., pixel P1) having a first light-receiving element (light-receiving element 11) that receives light through the first filter (filter 70); a second pixel (e.g., pixel P2) having a second light-receiving element that receives light through the second filter; and a boundary member (boundary member 40) provided between the first filter and the second filter.

[0106] The light detection device (imaging device 1) according to this embodiment includes a filter 70 having reflective layers 61, 62 and an intermediate layer 50, and a boundary member 40. The boundary member 40 is provided, for example, between the filter 70 of pixel P1 and the filter 70 of pixel P2. This makes it possible to realize a light detection device capable of improving optical characteristics.

[0107] Next, modified examples of the present disclosure will be described. In the following, components similar to those in the above embodiments will be denoted by the same reference numerals, and their descriptions will be omitted as appropriate.

[0108] (Modification 1) Figures 11 and 12 are diagrams illustrating an example of the configuration of an imaging device according to Modification 1 of the present disclosure. The imaging device 1 may be configured such that, for example, the thickness of the intermediate layer 50 differs for each filter 70 or for each of the multiple filters 70. The optical layer 80 may have a plurality of intermediate layers 50 having different thicknesses from each other. For example, the thickness (height) of the intermediate layer 50 in the Z-axis direction may differ for each of the multiple pixels P.

[0109] In the example shown in Figure 11 or Figure 12, the thickness of the intermediate layer 50 (referred to as intermediate layer 50a) in each filter 70 of pixels P1 to P4 is different from the thickness of the intermediate layer 50 (referred to as intermediate layer 50b) in each filter 70 of pixels P5 to P8. For example, intermediate layer 50b has a greater thickness than intermediate layer 50a.

[0110] By adjusting the thickness of the intermediate layers 50a and 50b, the transmission wavelength range of each filter 70 for pixels P1 to P4 and the transmission wavelength range of each filter 70 for pixels P5 to P8 can be adjusted, respectively. The intermediate layers 50a and 50b may be made of the same material or different materials. By using intermediate layers 50a and 50b with different thicknesses, it is possible to expand the range in which the transmission wavelength range (and center wavelength) can be adjusted.

[0111] Furthermore, as shown in the example in Figure 12, the structure 51 may be provided in the intermediate layers 50a and 50b. Alternatively, only one of the intermediate layers 50a or 50b may have the structure 51. In the imaging device 1, for example, the thickness of the intermediate layers 50a and 50b, the volume fraction of the structure 51 in each filter 70, etc., are determined so that the resonant wavelength in each filter 70 becomes a desired wavelength.

[0112] (Modification 2) Figures 13 to 15 are diagrams illustrating an example of the configuration of an imaging device according to Modification 2. A part of the boundary member 40 (i.e., boundary layer) may be provided on at least one of the reflective layer 61 and the reflective layer 62. The boundary member 40 may be provided so as to penetrate the reflective layer 61, for example, as shown in the example in Figure 13. In the example shown in Figure 13, the boundary member 40 is provided so as to penetrate the reflective layer 61 and the intermediate layer 50.

[0113] The boundary member 40 may be provided so as to penetrate the reflective layer 62, as shown in the example in Figure 14. In the example in Figure 14, the boundary member 40 is provided so as to penetrate the intermediate layer 50 and the reflective layer 62. Alternatively, the boundary member 40 may be provided so as to penetrate the reflective layer 61, the intermediate layer 50, and the reflective layer 62, as shown in the example in Figure 15. The imaging device 1 according to this modified example can also obtain the same effects as the embodiment described above.

[0114] (Modification 3) Figures 16 and 17 are diagrams illustrating an example of the configuration of an imaging device according to Modification 3. The imaging device 1 may have, for example, a filter 35. The filter 35 is configured to selectively transmit light in a specific wavelength range from the incident light. The filter 35 is configured as a broadband filter, for example, to have a transmission wavelength range wider than the transmission wavelength range of the filter 70. As an example, the filter 35 has a transmission wavelength range wider than one of the multiple transmission wavelength ranges of the filter 70.

[0115] The filter 35 is provided, for example, for each pixel P or for each of several pixels P (i.e., for each of a predetermined number of pixels P). The filter 35 is, for example, an RGB color filter. As an example, each pixel P is provided with a filter 35 that transmits red (R) light, a filter 35 that transmits green (G) light, or a filter 35 that transmits blue (B) light.

[0116] Furthermore, the filter 35 provided at each pixel P is not limited to primary color (RGB) color filters, but may also be complementary color (CMY) color filters, infrared light-transmitting filters, etc. The filter 35 may be a bandpass filter or any other type of filter.

[0117] In the example shown in Figure 16 or Figure 17, the imaging device 1 has an optical layer 30 on which filters 35 are provided. The optical layer 30 includes, for example, a plurality of filters 35 and is configured as a filter array. In the optical layer 30, the plurality of filters 35 can be arranged in a matrix in a two-dimensional manner. The optical layer 30 is a layer (region) containing a plurality of filters 35 that are broadband filters, and is provided as a broadband filter array.

[0118] Filter 35 is, for example, located on the light incident side of filter 70. In the example shown in Figure 16, the optical layer 30 (i.e., broadband filter array) is arranged to be stacked with the optical layer 80 (i.e., narrowband filter array). Filter 35 is located above filter 70. In the example shown in Figure 16, the imaging device 1 has a configuration in which the optical layer 30, the optical layer 80, the insulating layer 20, and the semiconductor layer 10 are stacked in the Z-axis direction.

[0119] The filter 35 may be provided between the filter 70 and the light-receiving element 11. As shown in the example in Figure 17, the filter 35 is provided, for example, on the surface 11S1 of the semiconductor layer 10 and is located between the filter 70 and the light-receiving element 11. In the example shown in Figure 17, the imaging device 1 has a configuration in which an optical layer 80, an optical layer 30, an insulating layer 20, and a semiconductor layer 10 are stacked in the Z-axis direction. The optical layer 30 may include at least a part of the insulating layer 20.

[0120] (Modification 4) Figure 18 is a diagram illustrating an example of the configuration of an imaging device according to Modification 4. The reflective layer 61 and the reflective layer 62 each have a plurality of stacked films, as shown in the example in Figure 18, and may be provided as a dielectric multilayer film. Each of the reflective layer 61 and the reflective layer 62 may be configured as a Bragg reflective layer. The boundary member 40 may be provided so as to penetrate at least one of the reflective layer 61 and the reflective layer 62.

[0121] (Modification 5) Figures 19 to 21 are diagrams illustrating an example of the configuration of an imaging device according to Modification 5. The structure 51 of the imaging device 1 may have a cylindrical shape, as shown in the example in Figure 19 or Figure 20, or it may have a rectangular prism shape. The structure 51 may be circular, elliptical, or polygonal in plan view, for example. The structure 51 may have a grid shape in plan view, as shown in the example in Figure 21.

[0122] The structure 51 may be made of a material having a relatively low refractive index. In the example shown in Figure 22, the structure 51 is made of a material having a lower refractive index than member 52, and thus has a lower refractive index than member 52. The structure 51 is made of a low refractive index material and can be called a low refractive index part. Member 52 is made of a high refractive index material and can be called a high refractive index part.

[0123] The boundary member 40 is configured to have a refractive index lower than, for example, the refractive index of member 52, which is the high refractive index portion. Alternatively, the boundary member 40 may be configured to have a refractive index lower than the refractive index of structure 51, which is the low refractive index portion. In the case of the imaging device 1 according to this modified example, the provision of the boundary member 40 makes it possible to suppress deterioration of the transmittance and wavelength resolution of the filter 70.

[0124] <2. Second Embodiment> Next, a second embodiment of the present disclosure will be described. The technology relating to the present disclosure is applicable to various electronic devices, optical devices, etc. The filter 70 and optical layer 80 described above are applicable to various optical elements (optical members). In the following, components similar to those in the above-described embodiment will be denoted by the same reference numerals, and their descriptions will be omitted as appropriate.

[0125] Figure 23 is a diagram illustrating an example of the configuration of an optical element according to a second embodiment of the present disclosure. The optical element 300 includes, for example, a substrate 120 and an optical layer 80 including a filter 70. The optical element 300 is configured as an optical filter capable of selectively transmitting light in multiple wavelength ranges. The optical element 300 may be configured as a multispectral filter. The optical element 300 may be configured, for example, as part of the optical system of various devices.

[0126] The substrate 120 is a light-transmitting substrate (transparent substrate), and is made of, for example, a glass substrate. The substrate 120 (base material) may be made of a material having a refractive index lower than that of the structure 51 or member 52, as an example. The substrate 120 may be made of, for example, quartz glass, borosilicate glass, etc., or it may be made of a resin substrate. The substrate 120 may be made of other materials that transmit the light to be measured.

[0127] As shown in Figure 23, the substrate 120 has opposing surfaces 12S1 and 12S2. Surface 12S2 is the surface opposite to surface 12S1. The optical layer 80 is provided, for example, on the side of the substrate 120 to which light is incident. In the example shown in Figure 23, an optical layer 80 including a plurality of filters 70 is formed on surface 12S1 of the substrate 120.

[0128] The optical layer 80 may be provided on the side of the substrate 120 opposite to the side where light is incident (i.e., the side where light is emitted). The optical layer 80 may be laminated on the substrate 120 via an insulating layer on either the light incident side or the light emission side of the substrate 120. The shape of the substrate 120 is not particularly limited and may be circular, rectangular, or other shapes. Furthermore, the configuration of each filter 70 is not limited to the illustrated example and can be modified as appropriate, as in the first embodiment.

[0129] In the optical element 300, boundary members 40 are provided between multiple adjacent filters 70. This suppresses interaction between the filters 70, improving the transmittance and wavelength resolution of the filters 70. It also makes it possible to narrow the full width at half maximum of the transmittance peak. This makes it possible to realize an optical element with improved optical characteristics.

[0130] [Function and Effects] The optical element according to this embodiment comprises a substrate (substrate 120) and an optical layer (optical layer 80) provided laminated on the substrate. The optical layer comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer (reflective layer 61, reflective layer 62), and an intermediate layer (intermediate layer 50) provided between the first reflective layer and the second reflective layer, and a boundary member (boundary member 40) provided between the first filter and the second filter.

[0131] The optical element (optical element 300) according to this embodiment comprises a plurality of filters 70, each having a reflective layer 61 and a reflective layer 62 and an intermediate layer 50, and a boundary member 40 provided between the plurality of filters 70. Therefore, it is possible to realize an optical element capable of improving optical characteristics.

[0132] <3. Examples of Application> The above-described imaging device 1 can be applied to any type of electronic device equipped with an imaging function, such as camera systems like digital still cameras and video cameras, or mobile phones with imaging capabilities. Figure 24 shows a schematic configuration of the electronic device 1000.

[0133] The electronic device 1000 includes, for example, a lens group 1001, an imaging device 1, a DSP (Digital Signal Processor) circuit 1002, a frame memory 1003, a display unit 1004, a recording unit 1005, an operation unit 1006, and a power supply unit 1007, all of which are interconnected via a bus line 1008.

[0134] The lens group 1001 captures incident light (image light) from the subject and forms an image on the imaging surface of the imaging device 1. The imaging device 1 converts the amount of incident light formed on the imaging surface by the lens group 1001 into an electrical signal on a pixel-by-pixel basis and supplies it as a pixel signal to the DSP circuit 1002.

[0135] The DSP circuit 1002 is a signal processing circuit that processes signals supplied from the imaging device 1. The DSP circuit 1002 outputs image data obtained by processing the signals from the imaging device 1. The frame memory 1003 temporarily holds the image data processed by the DSP circuit 1002 in frame units.

[0136] The display unit 1004 consists of, for example, a panel-type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and records the video or still image data captured by the imaging device 1 onto a recording medium such as a semiconductor memory or a hard disk.

[0137] The operation unit 1006 outputs operation signals for various functions possessed by the electronic device 1000 in accordance with user operations. The power supply unit 1007 appropriately supplies various power sources to the DSP circuit 1002, frame memory 1003, display unit 1004, recording unit 1005, and operation unit 1006.

[0138] <4. Application Examples> (Application Examples to Mobile Devices) The technology relating to this disclosure (this technology) can be applied to various products. For example, the technology relating to this disclosure may be implemented as a device mounted on any type of mobile device such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, and robots.

[0139] Figure 25 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0140] The vehicle control system 12000 comprises a plurality of electronic control units connected via a communication network 12001. In the example shown in Figure 25, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0141] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0142] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0143] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0144] The imaging unit 12031 is a light sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0145] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that captures images of the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0146] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking device based on information inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including collision avoidance or impact mitigation, following driving based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0147] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0148] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0149] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 25, the output devices include an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0150] Figure 26 shows an example of the installation position of the imaging unit 12031.

[0151] In Figure 26, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0152] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 installed on the upper part of the windshield inside the vehicle is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0153] Figure 26 shows an example of the imaging range of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0154] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0155] For example, the microcomputer 12051, based on distance information obtained from the imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to the vehicle 12100). In particular, it can extract the closest object on the vehicle 12100's path that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained before the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, where the vehicle drives autonomously without driver intervention, can be performed.

[0156] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0157] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0158] The above describes an example of a mobile control system to which the technology described herein can be applied. The technology described herein can be applied to, for example, the imaging unit 12031 of the configuration described above. Specifically, for example, the imaging device 1 can be applied to the imaging unit 12031. By applying the technology described herein to the imaging unit 12031, it becomes possible to obtain high-definition captured images. This makes it possible to perform high-precision control using captured images in the mobile control system.

[0159] (Examples of application to endoscopic surgical systems) The technology described herein (the technology) can be applied to various products. For example, the technology described herein may be applied to endoscopic surgical systems.

[0160] Figure 27 is a diagram showing an example of a schematic configuration of an endoscopic surgical system to which the technology described herein (the technology) may be applied.

[0161] Figure 27 illustrates a surgeon (physician) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgical system 11000. As shown in the figure, the endoscopic surgical system 11000 consists of an endoscope 11100, other surgical instruments 11110 such as a pneumoperitoneum tube 11111 and an energy treatment device 11112, a support arm device 11120 for supporting the endoscope 11100, and a cart 11200 equipped with various devices for endoscopic surgery.

[0162] The endoscope 11100 consists of a barrel 11101, the tip of which is inserted into the body cavity of the patient 11132 for a predetermined length, and a camera head 11102 connected to the base end of the barrel 11101. In the illustrated example, the endoscope 11100 is shown as a so-called rigid endoscope having a rigid barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible endoscope having a flexible barrel.

[0163] An opening into which an objective lens is fitted is provided at the tip of the microscope tube 11101. A light source device 11203 is connected to the endoscope 11100, and the light generated by the light source device 11203 is guided to the tip of the microscope tube by a light guide extending inside the microscope tube 11101, and is irradiated through the objective lens towards the object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a straight-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0164] The camera head 11102 contains an optical system and an image sensor. Reflected light from the object being observed (observation light) is focused onto the image sensor by the optical system. The image sensor converts the observation light into electrical signals, generating an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. This image signal is transmitted as RAW data to the camera control unit (CCU) 11201.

[0165] The CCU 11201 is composed of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and other components, and comprehensively controls the operation of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various image processing operations on that image signal, such as development processing (demosaic processing), to display the image based on that image signal.

[0166] The display device 11202 displays an image based on an image signal that has been processed by the CCU 11201, under control from the CCU 11201.

[0167] The light source device 11203 consists of a light source such as an LED (Light Emitting Diode) and supplies illumination light to the endoscope 11100 when photographing the surgical area, etc.

[0168] The input device 11204 is an input interface for the endoscopic surgical system 11000. The user can input various types of information and instructions to the endoscopic surgical system 11000 via the input device 11204. For example, the user can input instructions to change the imaging conditions (type of light, magnification, focal length, etc.) of the endoscope 11100.

[0169] The treatment instrument control device 11205 controls the drive of the energy treatment instrument 11112 for purposes such as tissue cauterization, incision, or blood vessel sealing. The insufflation device 11206 injects gas into the body cavity of the patient 11132 via the insufflation tube 11111 to inflate the body cavity for the purpose of securing a field of view by the endoscope 11100 and securing the operator's workspace. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various formats such as text, images, or graphs.

[0170] The light source device 11203 that supplies illumination light to the endoscope 11100 when photographing the surgical area can be configured as a white light source consisting of, for example, an LED, a laser light source, or a combination thereof. When the white light source is configured as a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so the white balance of the captured image can be adjusted in the light source device 11203. In this case, it is also possible to capture images corresponding to each of the RGB colors in time-division by irradiating the observation target with laser light from each of the RGB laser light sources in time-division and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter on the image sensor.

[0171] Furthermore, the light source device 11203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. By controlling the drive of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity, images can be acquired in time-division order, and these images can be combined to generate high dynamic range images without so-called black crushing and white clipping.

[0172] Furthermore, the light source device 11203 may be configured to supply light in a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue and irradiating with narrow-band light compared to the irradiation light used in normal observation (i.e., white light), so-called narrow-band imaging is performed to image predetermined tissues such as blood vessels on the surface of mucosa with high contrast. Alternatively, in special light observation, fluorescence observation may be performed to obtain an image from fluorescence generated by irradiation with excitation light. In fluorescence observation, excitation light is irradiated onto body tissue and fluorescence from the body tissue is observed (autofluorescence observation), or a reagent such as indocyanine green (ICG) is injected into body tissue and excitation light corresponding to the fluorescence wavelength of the reagent is irradiated onto the body tissue to obtain a fluorescence image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0173] Figure 28 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU 11201 shown in Figure 27.

[0174] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with each other.

[0175] The lens unit 11401 is an optical system provided at the connection point with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and then incident on the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses, including a zoom lens and a focus lens.

[0176] The imaging unit 11402 is composed of image sensors. The imaging unit 11402 may consist of one image sensor (a so-called single-chip type) or multiple image sensors (a so-called multi-chip type). If the imaging unit 11402 is composed of multiple chips, for example, each image sensor may generate image signals corresponding to RGB, and these may be combined to obtain a color image. Alternatively, the imaging unit 11402 may be configured to have a pair of image sensors for acquiring image signals for the right eye and left eye, respectively, corresponding to 3D (Dimensional) display. By performing 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical area. In addition, if the imaging unit 11402 is composed of multiple chips, multiple lens units 11401 may also be provided corresponding to each image sensor.

[0177] Furthermore, the imaging unit 11402 does not necessarily have to be located on the camera head 11102. For example, the imaging unit 11402 may be located inside the lens barrel 11101, directly behind the objective lens.

[0178] The drive unit 11403 is composed of actuators and, under control from the camera head control unit 11405, moves the zoom lens and focus lens of the lens unit 11401 along the optical axis by a predetermined distance. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted as appropriate.

[0179] The communication unit 11404 is composed of communication devices for sending and receiving various types of information with the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

[0180] Furthermore, the communication unit 11404 receives a control signal from the CCU 11201 to control the drive of the camera head 11102 and supplies it to the camera head control unit 11405. The control signal includes information about imaging conditions, such as information to specify the frame rate of the captured image, information to specify the exposure value at the time of imaging, and / or information to specify the magnification and focus of the captured image.

[0181] The imaging conditions such as frame rate, exposure value, magnification, and focus may be specified by the user as appropriate, or they may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 will be equipped with so-called AE (Auto Exposure), AF (Auto Focus), and AWB (Auto White Balance) functions.

[0182] The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal received from the CCU 11201 via the communication unit 11404.

[0183] The communication unit 11411 is comprised of a communication device for sending and receiving various types of information with the camera head 11102. The communication unit 11411 receives image signals transmitted from the camera head 11102 via the transmission cable 11400.

[0184] Furthermore, the communication unit 11411 transmits control signals to the camera head 11102 to control the driving of the camera head 11102. Image signals and control signals can be transmitted by telecommunications, optical communications, etc.

[0185] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102.

[0186] The control unit 11413 performs various controls related to imaging the surgical area, etc., by the endoscope 11100, and the display of the images obtained from imaging the surgical area, etc. For example, the control unit 11413 generates a control signal to control the driving of the camera head 11102.

[0187] Furthermore, the control unit 11413 displays the captured image showing the surgical area, etc., on the display device 11202 based on the image signal processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical instruments such as forceps, specific biological sites, bleeding, mist when using the energy treatment device 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When the control unit 11413 displays the captured image on the display device 11202, it may use the recognition results to superimpose various surgical support information onto the image of the surgical area. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced, and the surgeon 11131 can proceed with the surgery reliably.

[0188] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable compatible with electrical signal communication, an optical fiber compatible with optical communication, or a composite cable thereof.

[0189] In the illustrated example, communication was performed via a wired connection using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

[0190] The above describes an example of an endoscopic surgical system to which the technology described herein may be applied. The technology described herein can be suitably applied, for example, to the imaging unit 11402 provided on the camera head 11102 of the endoscope 11100. By applying the technology described herein to the imaging unit 11402, it becomes possible to provide a high-definition endoscope 11100.

[0191] Although the present disclosure has been described above with reference to embodiments, modifications, application examples, and application examples, the present technology is not limited to the above embodiments, and various modifications are possible. For example, although the above modifications were described as modifications of the above embodiments, the configurations of each modification can be combined as appropriate.

[0192] In the embodiments described above, an imaging device was used as an example; however, the light detection device of this disclosure may be any device that receives incident light and converts the light into an electric charge. The output signal may be an image information signal or a distance measurement information signal. The light detection device (imaging device) can be applied to an image sensor, a distance measurement sensor, etc. Furthermore, this disclosure is not limited to back-illuminated image sensors, but is also applicable to front-illuminated image sensors.

[0193] The light detection device according to this disclosure can also be used as a distance measuring sensor capable of measuring distance using the TOF (Time Of Flight) method. The light-receiving element (photoelectric conversion unit) of each pixel may be an APD (Avalanche Photo Diode). The light-receiving element may be composed of, for example, a SPAD (Single Photon Avalanche Diode). The light detection device (imaging device) can also be used as a sensor capable of detecting events, for example, an event-driven sensor (also called an EVS (Event Vision Sensor), EDS (Event Driven Sensor), DVS (Dynamic Vision Sensor), etc.).

[0194] An optical detection device according to one embodiment of the present disclosure comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer, and an intermediate layer provided between the first and second reflective layers; a first pixel having a first photodetector that receives light through the first filter; a second pixel having a second photodetector that receives light through the second filter; and a boundary member provided between the first and second filters. This makes it possible to realize an optical detection device capable of improving optical characteristics.

[0195] An optical detection device according to one embodiment of the present disclosure comprises a filter array having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer, and a first pixel and a second pixel adjacent to each other, each having a photodetector that receives light through the filter array, and a boundary member provided on the filter array. At least a portion of the boundary member is provided at the boundary between the first pixel and the second pixel in the intermediate layer. This makes it possible to realize an optical detection device capable of improving optical characteristics.

[0196] An optical element according to one embodiment of the present disclosure comprises a substrate and an optical layer provided laminated on the substrate. The optical layer includes a first filter and a second filter, each having a first reflective layer and a second reflective layer, and an intermediate layer provided between the first and second reflective layers, and a boundary member provided between the first and second filters. This makes it possible to realize an optical element capable of improving optical characteristics.

[0197] The effects described herein are merely illustrative and not limited to those described herein, and other effects may also exist. Furthermore, this disclosure may also take the following configurations: (1) A light detection device comprising: a first filter and a second filter, each having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer; a first pixel having a first photodetector that receives light through the first filter; a second pixel having a second photodetector that receives light through the second filter; and a boundary member provided between the first filter and the second filter. (2) The light detection device according to (1), wherein at least a portion of the boundary member is provided at the boundary between the first pixel and the second pixel in the intermediate layer. (3) The light detection device according to (1) or (2), wherein the boundary member is provided so as to penetrate the intermediate layer. (4) The light detection device according to any one of (1) to (3), wherein the boundary member is provided so as to surround the first pixel in the intermediate layer. (5) The photodetector according to any one of (1) to (4), wherein the first filter is a narrowband filter capable of transmitting light in at least a first wavelength range, and the second filter is a narrowband filter capable of transmitting light in at least a second wavelength range. (6) The photodetector according to any one of (1) to (5), wherein the boundary member has a refractive index lower than that of the material constituting the intermediate layer. (7) The photodetector according to any one of (1) to (6), wherein the intermediate layer comprises a first member and a second member having a refractive index lower than that of the first member, and the boundary member has a refractive index lower than that of the first member. (8) The photodetector according to any one of (1) to (7), wherein the intermediate layer comprises a first member and a second member having a refractive index lower than that of the first member, and the boundary member has a refractive index lower than that of the second member. (9) The light detection device according to any one of (1) to (8), wherein the intermediate layer has a plurality of first members each having a columnar shape, and the boundary member is provided in the intermediate layer between a plurality of adjacent first members.(10) The optical detection device according to any one of (1) to (9), wherein the thickness of the intermediate layer in the first pixel is different from the thickness of the intermediate layer in the second pixel. (11) The optical detection device according to any one of (1) to (10), wherein a part of the boundary member is provided in at least one of the first reflective layer and the second reflective layer. (12) The optical detection device according to any one of (1) to (11), wherein the boundary member is provided so as to penetrate the first reflective layer and the intermediate layer. (13) The optical detection device according to any one of (1) to (12), wherein the boundary member is provided so as to penetrate the intermediate layer and the second reflective layer. (14) The optical detection device according to any one of (1) to (13), wherein the boundary member is provided so as to penetrate the first reflective layer, the intermediate layer and the second reflective layer. (15) The photodetector according to any one of (1) to (14), wherein the extinction coefficient of the boundary member is 0.001 or less. (16) The photodetector according to any one of (1) to (15), wherein the boundary member is configured using an air gap. (17) The photodetector according to any one of (1) to (16), further comprising a third filter provided above or below the first filter, wherein the first filter is a narrowband filter and the third filter is a broadband filter. (18) The photodetector comprising a filter array having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer, a first pixel and a second pixel adjacent to each other and each having a photodetector that receives light through the filter array, and a boundary member provided on the filter array, wherein at least a part of the boundary member is provided at the boundary between the first pixel and the second pixel in the intermediate layer. (19) An optical element comprising a substrate and an optical layer provided laminated on the substrate, wherein the optical layer comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer, and a boundary member provided between the first filter and the second filter.(20) Electronic device comprising an optical system and a light detection device for receiving light transmitted through the optical system, wherein the light detection device comprises a first filter and a second filter each having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer, a first pixel having a first light-receiving element that receives light through the first filter, a second pixel having a second light-receiving element that receives light through the second filter, and a boundary member provided between the first filter and the second filter.

[0198] This application claims priority based on Japanese Patent Application No. 2024-221605, filed with the Japan Patent Office on 18 December 2024, and all contents of that application are incorporated herein by reference.

[0199] Those skilled in the art will understand that various modifications, combinations, subcombinations, and changes can be conceived depending on design requirements and other factors, and that these fall within the scope of the attached claims and their equivalents.

Claims

1. A light detection device comprising: a first filter and a second filter, each having a first reflective layer and a second reflective layer, and an intermediate layer provided between the first reflective layer and the second reflective layer; a first pixel having a first light-receiving element that receives light through the first filter; a second pixel having a second light-receiving element that receives light through the second filter; and a boundary member provided between the first filter and the second filter.

2. The photodetector according to claim 1, wherein at least a portion of the boundary member is provided at the boundary between the first pixel and the second pixel in the intermediate layer.

3. The light detection device according to claim 1, wherein the boundary member is provided so as to penetrate the intermediate layer.

4. The light detection device according to claim 1, wherein the boundary member is provided in the intermediate layer so as to surround the first pixel.

5. The photodetector according to claim 1, wherein the first filter is a narrowband filter capable of transmitting light in at least a first wavelength range, and the second filter is a narrowband filter capable of transmitting light in at least a second wavelength range.

6. The photodetector according to claim 1, wherein the boundary member has a refractive index lower than that of the material constituting the intermediate layer.

7. The photodetector according to claim 1, wherein the intermediate layer comprises a first member and a second member having a refractive index lower than that of the first member, and the boundary member has a refractive index lower than that of the first member.

8. The photodetector according to claim 1, wherein the intermediate layer comprises a first member and a second member having a refractive index lower than that of the first member, and the boundary member has a refractive index lower than that of the second member.

9. The light detection device according to claim 1, wherein the intermediate layer has a plurality of first members, each having a columnar shape, and the boundary member is provided in the intermediate layer between a plurality of adjacent first members.

10. The photodetector according to claim 1, wherein the thickness of the intermediate layer in the first pixel is different from the thickness of the intermediate layer in the second pixel.

11. The light detection device according to claim 1, wherein a part of the boundary member is provided on at least one of the first reflective layer and the second reflective layer.

12. The light detection device according to claim 1, wherein the boundary member is provided so as to penetrate the first reflective layer and the intermediate layer.

13. The light detection device according to claim 1, wherein the boundary member is provided so as to penetrate the intermediate layer and the second reflective layer.

14. The light detection device according to claim 1, wherein the boundary member is provided so as to penetrate the first reflective layer, the intermediate layer, and the second reflective layer.

15. The photodetector according to claim 1, wherein the extinction coefficient of the boundary member is 0.001 or less.

16. The light detection device according to claim 1, wherein the boundary member is configured using a gap.

17. The photodetector according to claim 1, further comprising a third filter provided above or below the first filter, wherein the first filter is a narrowband filter and the third filter is a broadband filter.

18. A light detection device comprising: a filter array having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer; a first pixel and a second pixel adjacent to each other, each having a light-receiving element that receives light through the filter array; and a boundary member provided on the filter array, wherein at least a portion of the boundary member is provided at the boundary between the first pixel and the second pixel in the intermediate layer.

19. An optical element comprising a substrate and an optical layer provided laminated on the substrate, wherein the optical layer comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer, and an intermediate layer provided between the first reflective layer and the second reflective layer, and a boundary member provided between the first filter and the second filter.

20. Electronic device comprising an optical system and a light detection device for receiving light transmitted through the optical system, wherein the light detection device comprises a first filter and a second filter, each having a first reflective layer and a second reflective layer and an intermediate layer provided between the first reflective layer and the second reflective layer, a first pixel having a first light-receiving element that receives light through the first filter, a second pixel having a second light-receiving element that receives light through the second filter, and a boundary member provided between the first filter and the second filter.

Images