Copper-based plate material
A copper-based sheet material with 99.98% copper and controlled additives achieves high thermal conductivity and low Young's modulus, addressing delamination issues in power module heat sinks by optimizing crystal grain orientation and manufacturing processes.
WO2026133785A1PCT designated stage Publication Date: 2026-06-25FURUKAWA ELECTRIC CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- FURUKAWA ELECTRIC CO LTD
- Filing Date
- 2025-11-07
- Publication Date
- 2026-06-25
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Abstract
The present invention provides a copper-based plate material which has high electrical conductivity (or thermal conductivity), and has a small Young's modulus difference from aluminum due to a low Young's modulus. This makes it less likely for the copper-based plate material to develop separation due to thermal stress at a junction interface even if joined with an aluminum material that constitutes a heat sink or the like. The copper-based plate material contains 99.98 mass% or more of copper (Cu). In crystal orientation analysis by an EBSD method performed in a measurement region of a rolled surface of the copper-based plate material, the area of crystal grains oriented in Cube orientation of {001}<100> accounts for 30% or more of the area of the measurement region, the electrical conductivity is 99% IACS or more, and the residual resistance ratio is within the range of 80 to 200 inclusive.
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