Bypass diode storage package, bypass diode device using same and solar cell module
The bypass diode housing package with a high thermal conductivity housing and low thermal conductivity lid structure addresses inefficient heat dissipation in solar cell modules, enhancing performance and compactness by effectively dissipating heat away from the bypass diode, thus reducing localized degradation and maintaining efficiency.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- KYOCERA CORP
- Filing Date
- 2025-12-08
- Publication Date
- 2026-06-25
AI Technical Summary
Existing solar cell modules face issues with localized performance degradation due to inefficient heat dissipation from the bypass diode, which is exacerbated by the use of materials with high thermal conductivity in the junction box, leading to increased temperatures and reduced output.
A bypass diode housing package with a cavity structure featuring a housing portion made of high thermal conductivity material, such as aluminum nitride ceramics, and a lid portion made of lower thermal conductivity material, such as aluminum oxide ceramics, to facilitate efficient heat dissipation away from the bypass diode, thereby reducing temperature rise and maintaining device performance.
The solution effectively suppresses localized degradation of the bypass diode and solar cell performance by enhancing heat dissipation, maintaining device efficiency and reducing the risk of overheating, while also allowing for a compact design that does not compromise the module's flatness or power generation efficiency.
Smart Images
Figure JP2025042811_25062026_PF_FP_ABST