Electronic control unit

Abstract

This electronic control unit comprises: a housing; a cooling jacket disposed within the housing; and a first board having a first semiconductor device mounted thereon, the first board being in thermal contact with at least one of the housing and the cooling jacket, wherein the housing includes: a housing body in thermal contact with the first board and having a first space defined therein; and a heat dissipation member that seals the first space and has heat dissipation fins formed thereon, wherein a first phase-change material may be accommodated in the first space.

Description

Electronic control unit

[0001] The present invention relates to an electronic control unit.

[0002] Assemblies installed in the vehicle include an engine control assembly (or motor control assembly), a power transmission assembly, a brake assembly, a suspension assembly, a steering assembly, an instrument assembly, an information and communication control assembly, etc.

[0003] An Electronic Control Unit (ECU) is a control device that has the function of controlling and managing the major assemblies of a vehicle; multiple ECUs are installed in the vehicle according to the assemblies to control each assembly.

[0004] The electronic control unit may include an electronic control unit with a chip embedded for autonomous driving or infotainment (software or media that adds entertainment value to the delivery of information) installed in a vehicle, and it is desirable for such an electronic control unit to properly cool the chip or the substrate (control board) on which the chip is installed in order to prevent overheating of the chip.

[0005] An example of an electronic control unit being cooled is disclosed in U.S. Patent Publication US 5323292 A (registered June 21, 1994), which includes an electronic module that includes an aluminum heat sink that encloses an integrated circuit chip and a substrate, and the heat sink includes parallel fins that provide a larger surface area to dissipate heat to the surrounding atmosphere.

[0006] The present embodiment provides an electronic control unit in which a semiconductor device can efficiently dissipate heat through a cooling jacket and a phase change material.

[0007] The present embodiment provides an electronic control unit in which a phase change material can efficiently dissipate heat from a semiconductor device even when the temperature of the cooling water is high.

[0008] An electronic control unit according to the present embodiment may include a housing; a cooling jacket disposed in the housing; and a first board having a first semiconductor device mounted thereon that is in thermal contact with at least one of the housing and the cooling jacket.

[0009] The housing may include a housing body in which a first board is thermally contacted and a first space is formed; and a heat dissipation member that shields the first space and has heat dissipation fins formed therein.

[0010] The first space can accommodate the first phase change material.

[0011] The housing includes a lower housing; and an upper housing disposed on the upper side of the lower frame, and the upper housing may include a housing body; and a heat dissipation member.

[0012] The electronic control unit may further include a fastening member that penetrates the first board and is fastened to the housing body; and a spring disposed between the fastening member and the first board and presses the first board against the housing.

[0013] The electronic control unit may further include a sealer disposed between the housing body and the heat dissipation member.

[0014] The electronic control unit may further include a heat dissipation member and a fastening member that fastens the sealer and the housing body.

[0015] A first semiconductor device of an electronic control unit can be thermally contacted with the upper surface of a cooling jacket.

[0016] An example of an electronic control unit may further include a second board having a second semiconductor device mounted thereon that is in thermal contact with the lower surface of a cooling jacket; and a third board having a third semiconductor device mounted thereon that is in thermal contact with the lower surface of a cooling jacket.

[0017] In a cooling jacket of one example of an electronic control unit, a cooling water channel through which cooling water passes; a second space partitioned from the cooling water channel; and a third space partitioned from the cooling water channel and the second space may be formed, and a second phase change material may be accommodated in the second space, and a third phase change material may be accommodated in the third space.

[0018] A cooling jacket of one example of an electronic control unit may include a coolant cover; a cooling plate disposed below the coolant cover; and a lower cover disposed below the cooling plate.

[0019] The coolant passage can be formed between the coolant cover and the cooling plate.

[0020] The second space and the third space can be formed on the bottom surface of the cooling plate.

[0021] The lower cover can shield the second and third spaces.

[0022] The second semiconductor device and the third semiconductor device can be in thermal contact with the lower cover.

[0023] An example of an electronic control unit may further include a valve that closes or opens a coolant path and a controller that controls the valve.

[0024] The first semiconductor device may include a first temperature sensor.

[0025] The second semiconductor device may include a second temperature sensor.

[0026] The third semiconductor device may include a third temperature sensor.

[0027] The controller can close or open the valve according to the sensing value of the first temperature sensor, the sensing value of the second temperature sensor, and the sensing value of the third temperature sensor.

[0028] Another example of a cooling jacket for an electronic control unit may include: a lower cooling jacket having a first passage and a second passage spaced apart from the first passage, and a lower cooling water passage formed between the first passage and the second passage through which cooling water passes; and an upper cooling jacket having a third passage communicating with the second passage and a fourth passage spaced apart from the third passage, and an upper cooling water passage formed between the third passage and the fourth passage through which cooling water passes.

[0029] The housing of another example of an electronic control unit may be placed on the lower surface of the lower coolant jacket or on the upper surface of the upper coolant jacket.

[0030] Another example of an electronic control unit may further include a control board placed between the lower coolant jacket and the upper coolant jacket.

[0031] Another example of an electronic control unit includes a housing comprising a lower housing and an upper housing disposed above the lower housing, a first semiconductor device may be in thermal contact with either the lower housing or the upper housing, and a first board may be in thermal contact with the other of the lower housing and the upper housing.

[0032] According to the present embodiment, the first semiconductor device and the first board can be efficiently heat-dissipated by the cooling jacket and the first phase change material.

[0033] In addition, the heat transferred to the first phase change material can be air-cooled after being transferred to the heat dissipation member.

[0034] In addition, the transfer of heat from the heat dissipation member to the housing body can be minimized, and the housing body can be prevented from rising.

[0035] In addition, the fastening member connects the heat dissipation member, the sealer, and the housing body, thereby minimizing the number of parts.

[0036] In addition, the first semiconductor device is in thermal contact with the upper surface of the cooling jacket, so that the heat of the first semiconductor device can be efficiently dissipated by the cooling jacket.

[0037] In addition, the cooling jacket can dissipate heat from the first semiconductor device mounted on the first board, the second semiconductor device mounted on the second board, and the third semiconductor device mounted on the third board together, and the number of cooling jackets can be minimized.

[0038] In addition, since the second phase change material that absorbs heat from the second semiconductor device and the third phase change material that absorbs heat from the third semiconductor device are accommodated in the cooling jacket, the number of parts can be minimized and the structure is simple.

[0039] Additionally, a cooling water channel is formed between the coolant cover and the cooling plate, and a second space and a third space are formed between the cooling plate and the lower cover, so that the second semiconductor device and the third semiconductor device can be heat-dissipated by the cooling water passing through the cooling jacket, or by the second phase change material contained in the second space and the third phase change material contained in the third space.

[0040] In addition, heat from the second semiconductor device and the third semiconductor device can be transferred to the cooling water through the lower cover and the cooling plate, thereby minimizing the number of parts.

[0041] In addition, the valve closes or opens the cooling water path, and the controller controls the valve to block the inflow of high-temperature cooling water into the cooling water path, thereby minimizing the temperature rise of the first semiconductor device, the second semiconductor device, or the third semiconductor device caused by the high-temperature cooling water.

[0042] In addition, when the cooling water is at a high temperature, the cooling water does not flow into the cooling water path, and the heat from the first semiconductor device is transferred to the first phase change material, the heat from the second semiconductor device is transferred to the second phase change material, and the heat from the third semiconductor device is transferred to the third phase change material, thereby improving the reliability of the electronic control unit.

[0043] In addition, the cooling jacket includes a lower coolant jacket and an upper coolant jacket, and a control board is positioned between the lower coolant jacket and the upper coolant jacket so that heat from the control board can be distributed and transferred to the lower coolant jacket and the upper coolant jacket, and the control board can be rapidly dissipated.

[0044] FIG. 1 is a perspective view of an example of an electronic control unit according to the present embodiment,

[0045] FIG. 2 is a drawing showing the interior of an example of an electronic control unit according to the present embodiment.

[0046] FIG. 3 is an exploded perspective view of an example of an electronic control unit according to the present embodiment,

[0047] FIG. 4 is a diagram showing an example of an electronic control unit according to the present embodiment when it is cooled by a water-cooled loop system.

[0048] FIG. 5 is a control block diagram of an example of an electronic control unit according to the present embodiment,

[0049] FIG. 6 is a flowchart of an example of an electronic control unit according to the present embodiment,

[0050] FIG. 7 is a perspective view of another example of an electronic control unit according to the present embodiment,

[0051] FIG. 8 is a drawing showing the interior of another example of an electronic control unit according to the present embodiment,

[0052] FIG. 9 is a diagram showing another example of an electronic control unit according to the present embodiment when cooled by a water-cooled loop system,

[0053] FIG. 10 is a control block diagram of another example of an electronic control unit according to the present embodiment,

[0054] FIG. 11 is a flowchart of another example of an electronic control unit according to the present embodiment.

[0055] Specific embodiments of the present invention will be described in detail below with reference to the drawings.

[0056] FIG. 1 is a perspective view of an example of an electronic control unit according to the present embodiment, FIG. 2 is a view showing the interior of an example of an electronic control unit according to the present embodiment, and FIG. 3 is an exploded perspective view of an example of an electronic control unit according to the present embodiment.

[0057] An example of an electronic control unit according to the present embodiment may include a housing (1), a cooling jacket (2), and a first board (3).

[0058] The housing (1) can form the exterior of the electronic control unit.

[0059] An inner space (V1) may be formed inside the housing (1). Various components constituting the electronic control unit may be accommodated in the inner space (V1).

[0060] The cooling jacket (2) and the first board (3), etc., can be accommodated in the inner space (V1) and protected by the housing (1).

[0061] The housing (1) may be composed of a combination of multiple members.

[0062] The housing (1) may include an upper housing (11) and a lower housing (12).

[0063] The upper housing (11) can be positioned on the upper side of the lower housing (12).

[0064] The upper housing (11) can form the upper surface of the electronic control unit. A space may be formed inside the upper housing (11). The bottom surface of the upper housing (11) may be open.

[0065] The upper housing (11) may include an upper body (11a) and a perimeter body (11b) protruding from the edge of the upper body (11a).

[0066] Heat from the first board (3) can be transferred to the upper housing (11), and the upper housing (11) can dissipate heat transferred from the first board (3) to the upper housing (11) to the outside.

[0067] The upper housing (11) may be made of aluminum and may serve as a heat sink.

[0068] The lower housing (12) can form the lower surface of the electronic control unit. A space may be formed inside the lower housing (12). The upper surface of the lower housing (12) may be open.

[0069] The lower housing (12) may include a lower body (12a) and a perimeter body (12b) protruding from the edge of the lower body (12a).

[0070] The lower housing (12) may be made of aluminum and may serve as a heat sink.

[0071] One example of a housing (1) may include an upper housing (11) and a lower housing (12), and may further include a frame (13) disposed between the upper housing (11) and the lower housing (12).

[0072] One example of the frame (13) may be a middle frame placed between the upper housing (11) and the lower housing (12).

[0073] The frame (13) may include a perimeter body (13a).

[0074] An example of a perimeter body (13a) may be located between the perimeter body (11b) of the upper housing (11) and the perimeter body (12b) of the lower housing (12), or between the perimeter body (2c) of the cooling jacket (2) and the perimeter body (12b) of the lower housing (12), and the perimeter body (13a) may form the perimeter surface appearance of the electronic control unit.

[0075] Another example of the frame (13) may be accommodated in the inner space (S), surrounded by the upper housing (11) or lower housing (12), and concealed by the upper housing (11) or lower housing (12).

[0076] A mounting body (13b) on which a cooling jacket (2) is mounted may be formed on the frame (13), and the frame (13) may support the cooling jacket (2).

[0077] The frame (13) can be fastened to the upper housing (11) at the lower side of the upper housing (11). The frame (13) can be fastened to the upper housing (11) by means of a fastening member (13c), such as a screw, or a hook, etc.

[0078] Another example of the housing (1) may include an upper housing (11) and a lower housing (12) without further including a frame (13). If another example of the housing (1) includes an upper housing (11) and a lower housing (12), the upper housing (11) and the lower housing (12) may be fastened together by fastening members such as screws or hooks.

[0079] The cooling jacket (2) can be placed in the housing (1). The cooling jacket (2) can be placed outside the housing (1) or inside the housing (1).

[0080] One example of a cooling jacket (2) can be accommodated in an inner space (S) and protected by a housing (1).

[0081] A cooling water channel (21) through which cooling water, such as water, passes can be formed inside the cooling jacket (2).

[0082] The cooling jacket (2) may include a cooling plate (22), a coolant cover (23) positioned above the cooling plate (22), and a lower cover (24) positioned below the cooling plate (22).

[0083] The upper surface of the cooling plate (22) may face the coolant cover (23). The coolant passage (21) may be formed between the coolant cover (23) and the cooling plate (22). The coolant passage (21) may be formed inside the cooling plate (22).

[0084] The lower surface of the cooling plate (22) can face the lower cover (24).

[0085] The upper surface of the coolant cover (23) may be the upper surface (2a) of the cooling jacket (2).

[0086] The coolant cover (23) can cover the coolant passage (21) from the upper side of the coolant passage (21).

[0087] The lower surface of the lower cover (24) may be the lower surface (2b) of the cooling jacket (2).

[0088] The upper surface (2a) of the cooling jacket (2) and the lower surface (2b) of the cooling jacket (2) may each be heat-absorbing surfaces that absorb heat from the semiconductor device.

[0089] The cooling jacket (2) may include a circumference body (2c) exposed to the outside.

[0090] The cooling plate (22) can form the perimeter body (2c) of the cooling jacket (2).

[0091] A cooling water inlet (25) that guides cooling water into a cooling water channel (21) may be formed in the cooling jacket (2). The cooling water inlet (25) may be positioned to protrude from one side of the cooling jacket (2). The cooling water inlet (25) may be formed to protrude from the perimeter body (2c) of the cooling jacket (2).

[0092] A cooling water outlet (26) may be formed in the cooling jacket (2) to guide the cooling water passing through the cooling water channel (21). The cooling water outlet (26) may be positioned to protrude from one side of the cooling jacket (2). The cooling water outlet (26) may be formed to protrude from the perimeter body (2c) of the cooling jacket (2). The cooling water outlet (26) may be formed parallel to the cooling water inlet (25).

[0093] At least one of the cooling jacket (2) and the frame (13) can be fastened to the upper housing (11) by a fastening member (27), such as a screw.

[0094] The first board (3) can be placed between the upper housing (1) and the cooling jacket (2).

[0095] A first semiconductor device (31) may be mounted on the first board (3). The first semiconductor device (31) may be mounted on the lower surface of the first board (3).

[0096] The first semiconductor device (51) can be in thermal contact with the upper surface (2a) of the cooling jacket (2), and the heat of the first semiconductor device (51) can be transferred to the upper surface (2a) of the cooling jacket (2).

[0097] An example of the first semiconductor device (31) may be a system-on-chip (SoC) mounted on the first board (5).

[0098] An example of the first semiconductor device (31) may be a semiconductor chip that performs autonomous driving of a vehicle.

[0099] An example of the first semiconductor device (31) may be a neural network processing unit (NPU).

[0100] When the first semiconductor device (31) is a neural network processing unit (NPU), the amount of heat generated by the first semiconductor device (31) during operation may be large.

[0101] It is desirable for the cooling jacket (2) to balance the heat transfer between its upper surface (2a) and lower surface (2b).

[0102] The first board (3) and the first semiconductor device (31) may be placed between the cooling jacket (2) and the upper housing (11). The first board (3) and the first semiconductor device (31) may be cooled by the cooling jacket (2) and the upper housing (11) in a double-sided cooling manner.

[0103] The first semiconductor device (31) may be in thermal contact with the upper surface (2a) of the cooling jacket (2) and preferably dissipates heat by the cooling water passing through the cooling jacket (2), and the first board (3) may be in thermal contact with the upper housing (11) and preferably dissipates heat by the upper housing (11).

[0104] One example of the first semiconductor device (31) can be in direct contact with the upper surface (2a) of the cooling jacket (2).

[0105] Another example of the first semiconductor device (31) may be in contact with the upper surface (2a) of the cooling jacket (2) through the first thermal interface material. The first thermal interface material may be placed between the lower surface of the first semiconductor device (31) and the upper surface (2a) of the cooling jacket (2).

[0106] The upper housing (11) can be in contact with the upper surface of the first board (3).

[0107] It is preferable that the upper housing (11) dissipates heat from the first board (3) by air cooling.

[0108] The upper housing (11) may include a housing body (14) and a heat dissipation member (15).

[0109] The housing body (14) may include an upper body (11a) and a circumference body (11b).

[0110] A first space (V2) may be formed in the housing body (14). The first space (V2) may be separated from the inner space (V1) by the housing body (14).

[0111] The housing body (14) may include a receiving body (14a). The receiving body (14a) may be formed to protrude downward from the upper body (11a). The outer circumference of the receiving body (14a) may be spaced apart from the circumference body (11b).

[0112] The receiving body (14a) may have an open top surface. The perimeter and bottom surfaces of the receiving body (14a) may each be closed. A first space (S1) may be formed inside the receiving body (14a).

[0113] A stepped groove (14b) may be formed in the housing body (14) to receive and insert the fastening body (15c) of the heat dissipation member (15). The stepped groove (14b) may be formed so as to be recessed downward in the upper body (11a).

[0114] A first phase change material (PCM1) can be accommodated in the first space (S1). The first phase change material (PCM1) can be accommodated in the receiving body (14a).

[0115] The first phase change material (PCM1) may be a material that accumulates a large amount of thermal energy or releases stored thermal energy through a phase change process.

[0116] The first phase change material (PCM1) reaches its characteristic melting point as the temperature rises and can absorb a certain amount of heat known as the enthalpy of melting as it changes from a solid state to a liquid state.

[0117] Heat from the first board (3) can be transferred to the first phase change material (PCM1) through the receiving body (14a), and the first phase change material (PCM1) can change its phase from a solid state to a liquid state by the heat transferred from the first board (3) and can absorb the heat released from the first board (3).

[0118] The first phase change material (PCM1) can release heat as it changes phase from a liquid state to a solid state. The heat released from the first phase change material (PCM1) can be transferred to a heat dissipation member (15), and the heat dissipation member (15) can dissipate the transferred heat to the outside of the electronic control unit.

[0119] The heat dissipation member (15) may be a heat sink that dissipates heat to the outside of the electronic control unit. The heat dissipation member (15) may be made of aluminum.

[0120] The heat dissipation member (15) can be placed on the surface of the electronic control unit that is exposed to the outside. The heat dissipation member (15) can dissipate heat by air cooling.

[0121] The heat dissipation member (15) may include a heat dissipation plate (15a) that shields the first space (S1). The heat dissipation plate (15a) may cover the first space (S1) from the upper side of the first space (S1).

[0122] The heat of the first phase change material (PCM1) can be transferred to the heat dissipation plate (15a).

[0123] The heat dissipation member (15) may include a plurality of heat dissipation fins (15b). A plurality of heat dissipation fins (15b) may be formed on a heat dissipation plate (15b). A plurality of heat dissipation fins (15a) may be parallel to each other. Heat from the heat dissipation plate (15a) may be conducted to the plurality of heat dissipation fins (15b), and the plurality of heat dissipation fins (15b) may dissipate the heat transferred from the heat dissipation plate (15a) by air cooling.

[0124] The heat dissipation member (15) may further include a fastening body (15c) that is fastened to the housing body (14). The fastening body (15c) may be inserted into the stepped groove (14b) of the housing body (14) on the upper side of the housing body (14).

[0125] The heat dissipation member (15) can be fastened to the housing body (14) by means of a fastening member (16, hereinafter referred to as a fastening member) such as a screw.

[0126] The fastening member (16) passes through a through hole formed in the fastening body (15c) and can be fastened to a fastening hole formed in the housing body (14).

[0127] The electronic control unit may further include a sealer (17) disposed between the housing body (14) and the heat dissipation member (15).

[0128] The sealer (17) can bond the heat dissipation member (15) to the housing body (14). The sealer (17) can function as an adhesive.

[0129] The sealer (17) can prevent heat transferred to the heat dissipation member (15) from being transferred to the housing body (14). The sealer (17) can function as an insulating member.

[0130] Examples of sealers (17) may be sealants or sealing rubber.

[0131] The sealant may be a paint applied to the stepped groove (14b) of the housing body (14) or the fastening body (15c) of the heat dissipation member (15).

[0132] In electronic control units, sealing rubber can also be used instead of sealant.

[0133] The sealing rubber can be placed between the stepped groove (14b) of the housing body (14) and the fastening body (15c) of the heat dissipation member (15).

[0134] The fastening member (16) can fasten the heat dissipation member (15), the sealer (17), and the housing body (14).

[0135] If the sealer (17) is a sealant, after the sealant is applied, the fastening member (16) can pass through the heat dissipation member (15) and the sealant in sequence and can fasten the housing body (14).

[0136] If the sealer (17) is a sealing rubber, after the sealing rubber is seated in the stepped groove (14b), the fastening member (16) can pass through the heat dissipation member (15) and the sealing rubber in sequence and can be fastened to the housing body (14).

[0137] The first board (3) can be in thermal contact with the receiving body (14a), and it is preferable that heat is dissipated by the first phase change material (PCM1).

[0138] The electronic control unit may include a fastening member (18) that fastens the first board (3) to the housing body (14).

[0139] It is preferable that the first board (3) be fastened in close contact with the receiving body (14a) of the housing body (14).

[0140] The fastening member (18) passes through the through hole (32) formed in the first board (3) and can be fastened to the fastening hole (14d) formed in the housing body (14). The fastening hole (14d) of the housing body (14) can be formed in the receiving body (14a).

[0141] An example of the fastening member (18) may be a screw with a head portion (18a) protruding from the lower part.

[0142] The electronic control unit may include a spring (19) positioned between the fastening member (18) and the first board (3).

[0143] An example of a spring (19) can be a coil spring.

[0144] The lower end of the spring (19) can be placed on the head portion (18a) of the fastening member (18), and the upper end of the spring (19) can support the bottom surface of the first board (3).

[0145] The spring (19) can press the first board (3) in an upward direction and press the first board (3) into the housing (1).

[0146] The first board (3) can be pressed against the housing body (14), particularly the receiving body (14a), by means of a spring (19).

[0147] When a first phase change material (PCM1) is received in the housing body (14) and heat from the first board (3) is transferred to the first phase change material (PCM1), the heat from the first board (3) can be dissipated more quickly.

[0148] When a first phase change material (PCM1) is received in the housing body (14) and heat from the first board (3) is transferred to the first phase change material (PCM1), even if the temperature of the cooling water passing through the cooling water path (21) is high, the heat from the first board (3) can be efficiently dissipated.

[0149] The electronic control unit may further include a second board (4), a third board (5), and a control board (6).

[0150] A second semiconductor device (41) may be mounted on the second board (4). The second semiconductor device (41) may be mounted on the upper surface of the second board (4).

[0151] The second semiconductor device (41) can be in thermal contact with the lower surface (2b) of the cooling jacket (2), and the heat of the second semiconductor device (41) can be transferred to the lower surface (2b) of the cooling jacket (2).

[0152] One example of the second semiconductor device (41) can be in direct contact with the lower surface (2b) of the cooling jacket (2).

[0153] Another example of the second semiconductor device (41) may be in contact with the lower surface (2b) of the cooling jacket (2) through the second thermal interface material. The second thermal interface material may be placed between the upper surface of the second semiconductor device (41) and the lower surface (2b) of the cooling jacket (2).

[0154] An example of the second semiconductor device (41) may be a system-on-chip (SoC) mounted on the second board (4).

[0155] An example of the second semiconductor device (41) may be a semiconductor chip that performs autonomous driving of a vehicle.

[0156] The second semiconductor device (41) can be thermally contacted with the lower cover (24) of the cooling jacket (2).

[0157] The second board (4) can be fastened to the cooling jacket (2) or the frame (13). The first board (2) can be fastened to the cooling jacket (2) or the frame (13) by fastening members (43), such as screws.

[0158] The second board (4) can be connected to the control board (6) via a connector. An example of the connector may be a B2B connector having a female and a male.

[0159] The second board (4) can be connected to the control board (6) and the first connector (44).

[0160] A third semiconductor device (51) may be mounted on the third board (5). The third semiconductor device (51) may be mounted on the upper surface of the third board (5).

[0161] The third semiconductor device (51) can be in thermal contact with the lower surface (2b) of the cooling jacket (2), and the heat of the third semiconductor device (51) can be transferred to the lower surface (2b) of the cooling jacket (2).

[0162] One example of the third semiconductor device (51) can be in direct contact with the lower surface (2b) of the cooling jacket (2).

[0163] Another example of the third semiconductor device (51) may be in contact with the lower surface (2b) of the cooling jacket (2) through the third thermal interface material. The third thermal interface material may be placed between the upper surface of the third semiconductor device (51) and the lower surface (2b) of the cooling jacket (2).

[0164] An example of the third semiconductor device (51) may be a system-on-chip (SoC) mounted on the third board (5).

[0165] An example of the third semiconductor device (51) may be a semiconductor chip that performs autonomous driving of a vehicle.

[0166] The third semiconductor device (51) can be thermally contacted with the lower cover (24) of the cooling jacket (2).

[0167] The third board (5) can be fastened to the cooling jacket (2) or the frame (13). The third board (5) can be fastened to the cooling jacket (2) or the frame (13) by fastening members (53), such as screws.

[0168] The third board (5) can be connected to the control board (6) via a connector. An example of the connector may be a B2B connector having a female and a male.

[0169] The third board (5) can be connected to the control board (6) and the second connector (54).

[0170] The second semiconductor device (41) and the third semiconductor device (51) are CPUs of the same specifications, and can perform the same function by being divided into a primary node and a secondary node, and even if a hardware failure occurs in one node, they can perform normal functions by backing up each other.

[0171] The third board (5) may be parallel to the second board (4). The third board (5) may be spaced apart from the second board (4) in the horizontal direction (X).

[0172] The amount of heat generated by the second semiconductor device (41) and the amount of heat generated by the third semiconductor device (51) may be relatively smaller than the amount of heat generated by the neural network processing unit (NPU).

[0173] It is desirable to balance the heat transfer between the upper surface (2a) and the lower surface (2b) of the cooling jacket (2).

[0174] When the second semiconductor device (41) and the third semiconductor device (51) are in thermal contact with the lower surface (2b) of the cooling jacket (2), the first semiconductor device (31) may be in thermal contact with the upper surface (2a) of the cooling jacket (2).

[0175] Conversely, when the second semiconductor device (41) and the third semiconductor device (51) are in thermal contact with the upper surface (2a) of the cooling jacket (2), the first semiconductor device (31) may be in thermal contact with the lower surface (2b) of the cooling jacket (2).

[0176] The first semiconductor device (31) can be spaced apart from the second semiconductor device (41) or the second semiconductor device (51) with the cooling jacket (2) in between.

[0177] The first semiconductor device (31) may be spaced apart in the vertical direction (Z) from one of the second semiconductor device (41) and the third semiconductor device (51). Hereinafter, the first semiconductor device (51) is described as being spaced apart in the vertical direction (Z) from the third semiconductor device (51). The first semiconductor device (31) may be positioned horizontally on the upper surface (2a) of the cooling jacket (2).

[0178] That is, the upper surface (2a) of the cooling jacket (2) may be a heat-absorbing surface that absorbs heat from the first semiconductor element (31), and the lower surface (2b) of the cooling jacket (2) may be a heat-absorbing surface that absorbs heat from the second semiconductor element (41) and the third semiconductor element (51).

[0179] The cooling jacket (2) may form a second space (V3) partitioned from the cooling water channel (21).

[0180] The second space (V3) can accommodate a second phase change material (PCM2).

[0181] The cooling jacket (2) may have a cooling water channel (21) and a third space (V4) partitioned from the second space (S).

[0182] The third space (V4) can accommodate a third phase change material (PCM2).

[0183] Each of the second space (V3) and the third space (V4) can be formed on the lower surface of the cooling plate (22). Each of the second space (V3) and the third space (V4) can be formed by being recessed into the lower surface of the cooling plate (22).

[0184] The lower cover (24) can shield the second space (V3) and the third space (V4) from the lower side of the cooling plate (22).

[0185] The second space (V3) can be formed on the upper side of the second board (4).

[0186] The lower cover (24) may include a first heat transfer section located between the second board (4) and the second space (V3), and heat from the second semiconductor device (41) may be transferred to the second phase change material (PCM2) through the first heat transfer section.

[0187] Phase Change Material 2 (PCM2) can be a material that accumulates a large amount of thermal energy or releases stored thermal energy through a phase change process.

[0188] Phase Change Material 2 (PCM2) reaches its characteristic melting point as the temperature rises and can absorb a certain amount of heat known as the enthalpy of melting as it changes from a solid state to a liquid state.

[0189] The lower cover (24) may be a phase change material cover that blocks the second phase change material (PCM2) at the lower side of the second space (V3).

[0190] Heat from the second board (4) can be transferred to the second phase change material (PCM2) through the lower cover (24), and the second phase change material (PCM2) can change its phase from a solid state to a liquid state by the heat transferred from the second board (4), and can absorb the heat released from the second board (4).

[0191] The second phase change material (PCM2) can release heat as it changes phase from a liquid state to a solid state. The heat released from the second phase change material (PCM2) can be transferred to a cooling plate (22), and the cooling plate (22) can dissipate the transferred heat into cooling water flowing through the cooling water channel (21).

[0192] The third space (V4) can be located on the upper side of the third board (5).

[0193] The lower cover (24) may include a second heat transfer section located between the third board (4) and the third space (V4), and heat from the third semiconductor device (51) may be transferred to the third phase change material (PCM3) through the second heat transfer section.

[0194] Phase 3 change material (PCM3) can be a material that accumulates a large amount of thermal energy or releases stored thermal energy through a phase change process.

[0195] Phase 3 change materials (PCM3) reach their characteristic melting point as the temperature rises and can absorb a certain amount of heat known as the enthalpy of melting as they transition from a solid state to a liquid state.

[0196] The lower cover (24) may be a phase change material cover that blocks the third phase change material (PCM3) at the lower side of the third space (V4).

[0197] Heat from the third board (5) can be transferred to the third phase change material (PCM3) through the lower cover (24), and the third phase change material (PCM3) can change its phase from a solid state to a liquid state by the heat transferred from the third board (5) and can absorb the heat released from the third board (5).

[0198] The third phase change material (PCM3) can release heat as it changes phase from a liquid state to a solid state. The heat released from the third phase change material (PCM3) can be transferred to a cooling plate (22), and the cooling plate (22) can dissipate the transferred heat into cooling water flowing through the cooling water channel (21).

[0199] The control board (6) may be equipped with a controller that controls the overall operation of the electronic control unit. An example of the controller may be a microcontroller unit (61: Micro Controller Unit; MCU, see FIG. 5).

[0200] The control board (6) may be a back plane board.

[0201] The control board (6) can be in thermal contact with the cooling jacket (2).

[0202] The control board (6) can be fastened to the control board fastening part (2d) formed in the cooling jacket (2) or frame (13) with a fastening member (62), such as a screw.

[0203] The control board (6) can be in thermal contact with the lower housing (12).

[0204] The control board (6) can be attached to the lower housing (12).

[0205] The control board (6) can be fastened to the lower housing (12) by a fastening member (63), such as a screw.

[0206] The control board (6) can be connected to the first board (3) by a harness cable (64).

[0207] The upper surface of the control board (6) may be opposed in the vertical direction (Z) to the lower surface of the second board (4) and the lower surface of the third board (5), respectively.

[0208] The control board (6) can be spaced apart from the second board (4) in the vertical direction (Z).

[0209] The control board (6) can be connected to the second board (4) and the first connector (44).

[0210] The control board (6) can be spaced apart from the third board (5) in the vertical direction (Z).

[0211] The control board (6) can be connected to the third board (5) and the second connector (54).

[0212] The electronic control unit may further include a valve (8).

[0213] The valve (8) can close or open the coolant passage (21).

[0214] An example of the valve (8) may be an electric valve and may include a motor. An example of the valve (8) may be a motorized valve.

[0215] The valve (8) can be placed in the cooling jacket (2) and can close or open the cooling water inlet (25).

[0216] The valve (8) can be controlled by a controller.

[0217] The valve (8) can be controlled in an open mode or a closed mode by a micro control unit (61).

[0218] When the valve (8) is in the open mode, the valve (8) is opened so that the coolant inlet (25) can be opened and coolant can flow into the coolant passage (21).

[0219] In the closed mode of the valve (8), the valve (8) is closed so that the coolant inlet (25) can be blocked and coolant cannot flow into the coolant passage (21).

[0220] The valve (8) receives a signal from the micro control unit (61) and can actively control the flow rate so that the junction temperature, which varies according to the operating rate of the semiconductor device, does not exceed the allowable temperature (Max Tj) of the semiconductor device. Here, the junction temperature can be defined as the highest temperature of the semiconductor device and can be the temperature output from a temperature sensor installed in the semiconductor device.

[0221] When the valve (8) is in open mode, the heat of the first semiconductor element (31), the heat of the second semiconductor element (41), and the heat of the third semiconductor element (51) can be dissipated by cooling water flowing through the cooling water path (21), and the first semiconductor element (31), the second semiconductor element (41), and the third semiconductor element (51) can be water-cooled.

[0222] When the valve (8) is in the closed mode, the valve (8) is closed so that the coolant inlet (25) can be blocked and coolant cannot flow into the coolant passage (21).

[0223] The heat of the first semiconductor device (31) can be absorbed by the first phase change material (PCM1), the heat of the second semiconductor device (41) can be absorbed by the second phase change material (PCM2), and the heat of the third semiconductor device (51) can be absorbed by the third phase change material (PCM4).

[0224] The valve (8) can operate according to the type of failure of the water-cooled loop system (9, see FIG. 4) connected to the cooling jacket (2). The water-cooled loop system (9) will be described later with reference to FIG. 4.

[0225] FIG. 4 is a diagram of an example of an electronic control unit according to the present embodiment when it is cooled by a water-cooled loop system, FIG. 5 is a control block diagram of an example of an electronic control unit according to the present embodiment, and FIG. 6 is a flowchart of an example of an electronic control unit according to the present embodiment.

[0226] The water-cooled loop system (9) may include a heat exchanger (91), a cooling water tank (93) connected to the heat exchanger (91) via a heat exchanger outlet pipe (92), a pump (95) connected to the cooling water tank (93) via a pump inlet pipe (94), and a pump outlet pipe (96) connecting the pump (95) to an electronic control unit, and the electronic control unit and the heat exchanger (91) may be connected via a heat exchanger inlet pipe (97).

[0227] The heat exchanger (91) can dissipate the heat of the cooling water into the atmosphere in an air-cooled manner. An example of the heat exchanger (91) may be a radiator.

[0228] The pump outlet pipe (96) can be connected to the cooling water inlet (25) of the cooling jacket (2).

[0229] The heat exchanger inlet pipe (97) can be connected to the cooling water outlet (26) of the cooling jacket (2).

[0230] The cooling water can circulate through the heat exchanger (91) and the cooling jacket (2) and can dissipate heat from the electronic control unit.

[0231] The water-cooled loop system (9) may include a temperature sensor, a flow sensor, or a flow rate sensor.

[0232] A temperature sensor, a flow sensor, or a flow rate sensor can transmit a sensing value to a micro control unit (61), and the micro control unit (61) can control the valve (8) in an open mode or a closed mode according to the sensing value.

[0233] The water-cooled loop system (9) may not have a flow of cooling water due to a failure of the pump (95), and the flow rate of the water-cooled loop system (9) may be 0 m³ / hr or the flow velocity of the water-cooled loop system (9) may be 0 m / s.

[0234] In a water-cooled loop system (9), the temperature of the cooling water may rise due to a failure of the heat exchanger (91).

[0235] Meanwhile, when normal cooling water flows into the cooling water inlet (25) of the cooling jacket (2) and normal cooling water flows out through the cooling water outlet (26) of the cooling jacket (2), the junction temperature of the first semiconductor device (31), the junction temperature of the second semiconductor device (41), and the junction temperature of the third semiconductor device (51) may be within a normal range.

[0236] However, if normal cooling water cannot flow into the cooling water inlet (25) of the cooling jacket (2) due to a failure of the heat exchanger (91) or pump (95), the temperature of the semiconductor device may rise rapidly, the temperature of the semiconductor device may reach a limit temperature, and the semiconductor device may be thermally shut down.

[0237] Each of the first semiconductor device (31), the second semiconductor device (41), and the third semiconductor device (51) may include a temperature sensor.

[0238] The first semiconductor device (31) may include a first temperature sensor (36), the second semiconductor device (41) may include a second temperature sensor (46), and the third semiconductor device (51) may include a third temperature sensor (56).

[0239] The first temperature sensor (36) can be provided inside the first semiconductor device (31) and can measure the junction temperature of the first semiconductor device (31).

[0240] The second temperature sensor (46) can be provided inside the second semiconductor device (41) and can measure the junction temperature of the second semiconductor device (41).

[0241] The third temperature sensor (56) can be provided inside the third semiconductor device (51) and can measure the junction temperature of the third semiconductor device (51).

[0242] The electronic control unit may further include a micro control unit (61).

[0243] The micro control unit (61) can compare the temperature input from the temperature sensor with the set temperature in real time, and if the temperature input from the temperature sensor is higher than the set temperature, it can control the valve (8) to close the cooling water inlet (25) to prevent high-temperature cooling water from flowing into the cooling jacket (2) due to a failure of the heat exchanger (91).

[0244] That is, the micro control unit (61) can close or open the valve (8) according to the sensing value of the first temperature sensor (36), the sensing value of the second temperature sensor (46), and the sensing value of the third temperature sensor (56).

[0245] The micro control unit (61) can control the valve (8) to a closed mode if the temperature (Tsoc1) sensed by the first temperature sensor (36) is greater than or equal to the first set temperature (Tth). (S1)(S2)(S3)

[0246] The first set temperature (Tth) may be a temperature set lower than the critical temperature of the first semiconductor device (31). For example, if the critical temperature of the first semiconductor device (31) is 125 C°, the first set temperature (Tth) may be 120 C° or 110 C°.

[0247] Heat from the first semiconductor device (31) can be transferred to the first phase change material (PCM1) through the receiving body (14a), and when the temperature of the first phase change material (PCM1) reaches the phase change temperature, the first phase change material (PCM1) can be activated from a solid state to a liquid state, and the amount of heat absorbed can be increased due to the latent heat effect. The first phase change material (PCM1) can rapidly absorb heat from the first semiconductor device (31).

[0248] When the valve (8) is controlled in a closed mode, the valve (8) is closed so that coolant does not flow into the coolant inlet (25). (S3)

[0249] When the valve (8) is in the closed mode, the cooling water whose temperature has risen due to the failure of the heat exchanger (91) may no longer flow into the cooling water path (21) of the cooling jacket (2), and the cooling jacket (2) may dissipate heat from the first semiconductor device (31) without hindering the heat absorption of the first phase change material (PCM1) and without the first phase change material (PCM1) overheating the first semiconductor device (31).

[0250] The micro control unit (61) can control the valve (8) to a closed mode when the temperature (Tsoc2) sensed by the second temperature sensor (46) is greater than or equal to the second set temperature (Tth). (S4)(S5)(S3)

[0251] The second set temperature (Tth) may be a temperature set lower than the critical temperature of the second semiconductor device (41). For example, if the critical temperature of the second semiconductor device (41) is 125 C°, the second set temperature (Tth) may be 120 C° or 110 C°.

[0252] The second set temperature (Tth) may be set to be the same as or different from the first set temperature.

[0253] Heat from the second semiconductor device (41) can be transferred to the second phase change material (PCM2) through the cooling jacket (2), and when the temperature of the second phase change material (PCM2) reaches the phase change temperature, the second phase change material (PCM2) can be activated from a solid state to a liquid state, and the amount of heat absorbed can be increased due to the latent heat effect. The second phase change material (PCM2) can rapidly absorb heat from the second semiconductor device (41).

[0254] When the valve (8) is controlled in a closed mode, the valve (8) is closed so that coolant does not flow into the coolant inlet (25). (S3)

[0255] When the valve (8) is in the closed mode, the cooling water whose temperature has risen due to the failure of the heat exchanger (91) may no longer flow into the cooling water path (21) of the cooling jacket (2), and the cooling jacket (2) may dissipate heat from the second semiconductor device (41) without hindering the heat absorption of the second phase change material (PCM2) and without the second phase change material (PCM2) overheating the second semiconductor device (41).

[0256] The micro control unit (61) can control the valve (8) to a closed mode that closes the coolant inlet when the temperature (Tsoc3) sensed by the third temperature sensor (56) is greater than or equal to the third set temperature (Tth). (S6)(S7)(S3)

[0257] The third set temperature (Tth) may be a temperature set lower than the critical temperature of the third semiconductor device (51). For example, if the critical temperature of the third semiconductor device (51) is 125 C°, the third set temperature (Tth) may be 120 C° or 110 C°.

[0258] The third set temperature (Tth) can be set to be the same as the second set temperature.

[0259] The third set temperature (Tth) may be set to be the same as or different from the first set temperature.

[0260] Heat from the third semiconductor device (51) can be transferred to the third phase change material (PCM3) through the cooling jacket (2), and when the temperature of the third phase change material (PCM3) reaches the phase change temperature, the third phase change material (PCM3) can be activated from a solid state to a liquid state, and the amount of heat absorbed can be increased due to the latent heat effect. The third phase change material (PCM3) can rapidly absorb heat from the third semiconductor device (41).

[0261] When the valve (8) is controlled in a closed mode, the valve (8) is closed so that coolant does not flow into the coolant inlet (25). (S3)

[0262] When the valve (8) is in the closed mode, the cooling water whose temperature has risen due to the failure of the heat exchanger (91) may no longer flow into the cooling water path (21) of the cooling jacket (2), and the cooling jacket (2) may dissipate heat from the third semiconductor device (51) without hindering the heat absorption of the third phase change material (PCM3) and without the third phase change material (PCM3) overheating the third semiconductor device (51).

[0263] The micro control unit (61) can control the valve (8) to open mode if the temperature (Tsoc1) sensed by the first temperature sensor (36) is less than the first set temperature (Tth). (S8)(S9)(S10)

[0264] The micro control unit (61) can control the valve (8) to open mode if the temperature (Tsoc2) sensed by the second temperature sensor (46) is less than the second set temperature (Tth). (S11)(S12)(S10)

[0265] The micro control unit (61) can control the valve (8) to open mode if the temperature (Tsoc3) sensed by the third temperature sensor (56) is less than the third set temperature (Tth). (S13)(S14)(S10)

[0266] The micro control unit (61) can control the valve (8) to open mode if the temperature (Tsoc1) sensed by the first temperature sensor (36) is less than the first set temperature (Tth), the temperature (Tsoc2) sensed by the second temperature sensor (46) is less than the second set temperature (Tth), and the temperature (Tsoc3) sensed by the third temperature sensor (56) is less than the third set temperature (Tth).

[0267] When the valve (8) is controlled to open mode, the valve (8) is opened so that coolant can flow into the coolant inlet (25). (S10)

[0268] The first phase change material (PCM1) can be deactivated from a liquid state to a solid state, and the first phase change material (PCM1) can rapidly dissipate heat through the cooling water flowing through the cooling water channel (21).

[0269] The second phase change material (PCM2) can be deactivated from a liquid state to a solid state, and the second phase change material (PCM2) can rapidly dissipate heat through the cooling water flowing through the cooling water channel (21).

[0270] The third phase change material (PCM3) can be deactivated from a liquid state to a solid state, and the third phase change material (PCM3) can rapidly dissipate heat to the cooling water flowing through the cooling water channel (21).

[0271] One example of an electronic control unit is that it is possible to control the valve (8) in a closed mode according to the sensing value of the temperature sensor, flow sensor, or flow rate sensor of the water-cooled loop system (9).

[0272] One example of an electronic control unit is that if the temperature sensed by the temperature sensor is above the set temperature, the valve (8) can be controlled in a closed mode to close the coolant inlet (25).

[0273] One example of an electronic control unit is that if the flow rate sensed by the flow sensor is less than or equal to the set flow rate, the valve (8) can be controlled in a closed mode.

[0274] One example of an electronic control unit is that if the flow rate sensed by the flow rate sensor is less than or equal to the set flow rate, the valve (8) can be controlled in a closed mode.

[0275] FIG. 7 is a perspective view of another example of an electronic control unit according to the present embodiment, FIG. 1 is a perspective view of another example of an electronic control unit according to the present embodiment, and FIG. 8 is a view showing the interior of another example of an electronic control unit according to the present embodiment.

[0276] Another example of an electronic control unit includes at least one control unit and a cooling jacket (2').

[0277] The control unit may include a housing (1') and a board (3') housed inside the housing (1').

[0278] A semiconductor device (31') may be mounted on the board (3'). The semiconductor device (31') may be in thermal contact with at least one of the housing (1') and the cooling jacket (2').

[0279] The housing (1') may include an upper housing (11') and a lower housing (12').

[0280] Either the upper housing (11') or the lower housing (12') can be in thermal contact with a semiconductor device (31'), and the other of the upper housing (11') or the lower housing (12') can be in thermal contact with a board (3').

[0281] An inner space (V1') may be formed inside the housing (1'). The inner space (V1') may be formed between the upper housing (11') and the lower housing (12').

[0282] The board (3') can be accommodated in the inner space (V1').

[0283] The semiconductor device (31') can be mounted on one of the upper and lower surfaces of the board (3').

[0284] The board (3') can be thermally contacted with either the upper housing (11') or the lower housing (12'), and the semiconductor device (31') can be thermally contacted with the other of the upper housing (11') and the lower housing (12').

[0285] When a semiconductor device (31') is mounted on the lower surface of a board (3'), the semiconductor device (31') can be in thermal contact with a lower housing (12'), and the board (3) can be in thermal contact with an upper housing (11').

[0286] When the semiconductor device (31') is in thermal contact with the lower housing (12'), the board (3') may be in thermal contact with the upper housing (11'), and the upper housing (11') may accommodate a phase change material.

[0287] In this case, the phase change material can be activated by heat transferred from the board (3'). When the temperature of the phase change material rises due to the heat transferred from the board (3'), it can reach its intrinsic melting point and absorb a certain amount of heat known as melting enthalpy as it changes phase from solid to liquid.

[0288] The phase change material can release heat as it changes from a liquid state to a solid state and can be deactivated. The heat released from the phase change material can be transferred to the upper housing (11'), and the upper housing (11') can dissipate heat by air cooling.

[0289] When a semiconductor device (31') is mounted on the upper surface of a board (3'), the semiconductor device (31') can be thermally contacted with an upper housing (11'), and the board (3') can be thermally contacted with a lower housing (12').

[0290] When the semiconductor device (31') is in thermal contact with the upper housing (11'), the board (3') can be in thermal contact with the lower housing (12'), and the lower housing (12') can accommodate a phase change material.

[0291] In this case, the phase change material can be activated by heat transferred from the board (3'). When the temperature of the phase change material rises due to the heat transferred from the board (3'), it can reach its intrinsic melting point and absorb a certain amount of heat known as melting enthalpy as it changes phase from solid to liquid.

[0292] The phase change material can release heat as it changes from a liquid state to a solid state and can be deactivated. The heat released from the phase change material can be transferred to the lower housing (12'), and the lower housing (12') can dissipate heat by air cooling.

[0293] The housing (1') and the board (3') can form a control unit.

[0294] The cooling jacket (2') may be placed outside the housing (1'). The cooling jacket (2') may be an outer cooling jacket that cools the first semiconductor device (31') outside the housing (1').

[0295] The cooling jacket (2') may include a lower cooling water jacket (22') and an upper cooling water jacket (23').

[0296] A cooling water inlet (25') that guides cooling water (C) into the interior of the cooling jacket (2') may be formed in the cooling jacket (2').

[0297] A cooling water outlet (26') may be formed in the cooling jacket (2') to guide the cooling water that passes through the interior of the cooling jacket (2').

[0298] The coolant inlet (25') can be formed in either the lower coolant jacket (22') or the upper coolant jacket (23').

[0299] The coolant outlet (26') can be formed in either the lower coolant jacket (22') or the upper coolant jacket (23').

[0300] A first passage (22a) and a second passage (22b) spaced apart from the first passage (22a) may be formed in the lower cooling water jacket (22').

[0301] A lower cooling water channel (22c) through which cooling water such as water passes can be formed inside the lower cooling water jacket (22').

[0302] The lower cooling water passage (22c) can be formed between the first passage (22a) and the second passage (22b).

[0303] The lower coolant jacket (22') may include a lower plate (22d) and an upper plate (22e), and a lower coolant passage (22c) may be formed between the lower plate (22d) and the upper plate (22e).

[0304] In the upper cooling water jacket (23'), a third passage (23a) and a fourth passage (23b) spaced apart from the third passage (23a) may be formed.

[0305] An upper cooling water channel (23c) through which cooling water such as water passes can be formed inside the upper cooling water jacket (23').

[0306] The upper coolant passage (23c) can be formed between the third passage (23a) and the fourth passage (23b).

[0307] The upper coolant jacket (23') may include a lower plate (23d) and an upper plate (23e), and an upper coolant passage (23b) may be formed between the lower plate (23d) and the upper plate (23e).

[0308] A valve (8) for opening and closing a coolant flow path may be provided in at least one of the lower coolant jacket (22') and the upper coolant jacket (23'). Multiple valves (8) may be provided. Multiple valves (8a)(8b) may include a lower valve (8a) and an upper valve (8b).

[0309] A lower valve (8a) that opens and closes at least one of the first passage (22a) and the lower coolant flow path (22c) may be provided in the lower coolant jacket (22').

[0310] An example of the lower valve (8a) may be an electric valve and may include a motor. An example of the lower valve (8a) may be a motorized valve.

[0311] An upper valve (8b) that opens and closes at least one of the fourth passage (23b) and the upper coolant flow path (23c) may be provided in the upper coolant jacket (23').

[0312] An example of the upper valve (8b) may be an electric valve and may include a motor. An example of the upper valve (8b) may be a motorized valve.

[0313] The third passage (23a) can be connected to the second passage (22b).

[0314] Coolant flowing into the first passage (22a) can flow into the second passage (22b) after passing through the lower coolant passage (22c), then flow into the upper coolant passage (23c) through the third passage (23a), and after passing through the upper coolant passage (23c), pass through the fourth passage (23b).

[0315] A center space (V5) may be formed between the upper plate (22e) of the lower coolant jacket (22') and the lower plate (23d) of the upper coolant jacket (23').

[0316] A control board (6') can be accommodated in the center space (V5).

[0317] The upper plate (22e) of the lower coolant jacket (22') or the lower plate (23d) of the upper coolant jacket (23') can be in thermal contact with the control board (6').

[0318] A contact portion that contacts the control board (6') may be formed on the upper plate (22e) of the lower coolant jacket (22') or the lower plate (23d) of the upper coolant jacket (23').

[0319] A micro control unit (61') can be placed on the control board (6').

[0320] The control board (6') may be an autonomous driving control board for executing Level 1 or Level 2 of the autonomous driving levels.

[0321] The assembly of the cooling jacket (2') and the control board (6') can form a control unit. The assembly of the cooling jacket (2') and the control board (6') may be an autonomous driving control unit for executing Level 1 or Level 2 of the autonomous driving levels.

[0322] Another example of an electronic control unit may include multiple control units.

[0323] A plurality of control units (CU) may include a lower control unit disposed on the lower surface of the cooling jacket (2') and an upper control unit disposed on the upper surface of the cooling jacket (2').

[0324] At least one of the upper control unit and the lower control unit may be provided in multiple numbers.

[0325] A plurality of control units (CU) may include a lower control unit (CU1) disposed on the lower surface of the cooling jacket (2') and a pair of upper control units (CU2) (CU3) disposed on the upper surface of the cooling jacket (2').

[0326] A pair of upper control units (CU2) (CU3) includes a first upper control unit (CU2) and a second upper control unit (CU3).

[0327] Each of the lower control unit (CU1), the first upper control unit (CU2), and the second upper control unit (CU3) may include a housing (1') and a board (3') on which a semiconductor device (31') is mounted.

[0328] Hereinafter, the board (3') of the lower control unit (CU1) is referred to as the first board (3a), and the semiconductor device (31') mounted on the first board (3a) is referred to as the first semiconductor device (31a).

[0329] The lower control unit (CU1) may be an autonomous driving control unit for executing Level 2+ among autonomous driving levels, or an infotainment control unit capable of executing the vehicle's infotainment (software or media that adds entertainment to the delivery of information).

[0330] The housing (1') of the lower control unit (CU1) may include a housing body (14) in which the first board (3a) is thermally contacted and the first space (V2) is formed; and a heat dissipation member (15) that shields the first space (V2) and has heat dissipation fins formed therein.

[0331] The first phase change material (PCM1) can be accommodated in the first space (V2).

[0332] The housing (1') of the lower control unit (CU1) includes an upper housing (11') and a lower housing (12').

[0333] The upper housing (11') can be positioned on the upper side of the lower housing (12').

[0334] The first semiconductor device (31a) can be thermally contacted with the upper housing (11').

[0335] The lower housing (12') may include a housing body (14); a heat dissipation member (15) and a sealer (17).

[0336] The housing body (14) may include a receiving body in which the first phase change material (PCM1) is received, and since it is identical or similar to the housing body (14) of an example of an electronic control unit, the same reference numerals are used to avoid redundant descriptions and the description thereof is omitted.

[0337] The heat dissipation member (15) can shield the first space (V2) and dissipate heat to the outside. The heat dissipation member (15) can be fastened to the housing body (14) by a fastening member (16), and since it is identical or similar to the heat dissipation member (15) of an example electronic control unit, the same reference numerals are used to avoid redundant descriptions and the description thereof is omitted.

[0338] The sealer (17) can be placed between the housing body (14) and the heat dissipation member (15) and can prevent heat transferred to the heat dissipation member (15) from being transferred to the housing body (14). Since it is identical or similar to the sealer (17) of an example of an electronic control unit, the same reference numeral is used to avoid redundant descriptions, and the description thereof is omitted.

[0339] Hereinafter, the board (3') of the first upper control unit (CU2) is referred to as the second board (3b), and the semiconductor device (31') mounted on the second board (3b) is referred to as the second semiconductor device (31b).

[0340] The first upper control unit (CU2) may be an autonomous driving control unit for executing Level 3 of the autonomous driving levels.

[0341] The housing (1') of the first upper control unit (CU2) may include a housing body (14) in which the second board (3b) is thermally contacted and a second space (V3) is formed; and a heat dissipation member (15) that shields the second space (V3) and has heat dissipation fins formed therein.

[0342] The second space (V3) can accommodate a second phase change material (PCM2).

[0343] The housing (1') of the first upper control unit (CU2) includes an upper housing (11') and a lower housing (12').

[0344] The upper housing (11') can be positioned on the upper side of the lower housing (12').

[0345] The upper housing (11') may include a housing body (14); a heat dissipation member (15) and a sealer (17).

[0346] The housing body (14) may include a receiving body in which the second phase change material (PCM2) is received, and since it is identical or similar to the housing body (14) of an example of an electronic control unit, the same reference numerals are used to avoid redundant descriptions and the description thereof is omitted.

[0347] The heat dissipation member (15) can shield the second space (V3) and dissipate heat to the outside. The heat dissipation member (15) can be fastened to the housing body (14) by a fastening member (16), and since it is identical or similar to the heat dissipation member (15) of an example electronic control unit, the same reference numerals are used to avoid redundant descriptions and the description thereof is omitted.

[0348] The sealer (17) can be placed between the housing body (14) and the heat dissipation member (15) and can prevent heat transferred to the heat dissipation member (15) from being transferred to the housing body (14). Since it is identical or similar to the sealer (17) of an example of an electronic control unit, the same reference numeral is used to avoid redundant descriptions, and the description thereof is omitted.

[0349] The second semiconductor device (31b) can be thermally contacted with the lower housing (12').

[0350] Hereinafter, the board (3') of the second upper control unit (CU3) will be referred to as the third board (3c), and the semiconductor device (31') mounted on the third board (3c) will be referred to as the third semiconductor device (31c) for explanation.

[0351] The second upper control unit (CU3) may be an autonomous driving control unit for executing Level 4 of the autonomous driving levels.

[0352] The housing (1') of the second upper control unit (CU3) may include a housing body (14) in which the third board (3c) is thermally contacted and the third space (V4) is formed; and a heat dissipation member (15) that shields the third space (V4) and has heat dissipation fins formed therein.

[0353] The third space (V4) can accommodate a third phase change material (PCM3).

[0354] The housing (1') of the second upper control unit (CU3) includes an upper housing (11') and a lower housing (12').

[0355] The upper housing (11') can be positioned on the upper side of the lower housing (12').

[0356] The upper housing (11') may include a housing body (14); a heat dissipation member (15) and a sealer (17).

[0357] The housing body (14) may include a receiving body in which a third phase change material (PCM3) is received, and since it is identical or similar to the housing body (14) of an example of an electronic control unit, the same reference numerals are used to avoid redundant descriptions and the description thereof is omitted.

[0358] The heat dissipation member (15) can shield the third space (V4) and dissipate heat to the outside. The heat dissipation member (15) can be fastened to the housing body (14) by a fastening member (16), and since it is identical or similar to the heat dissipation member (15) of an example electronic control unit, the same reference numerals are used to avoid redundant descriptions and the description thereof is omitted.

[0359] The sealer (17) can be placed between the housing body (14) and the heat dissipation member (15) and can prevent heat transferred to the heat dissipation member (15) from being transferred to the housing body (14). Since it is identical or similar to the sealer (17) of an example of an electronic control unit, the same reference numeral is used to avoid redundant descriptions, and the description thereof is omitted.

[0360] The third semiconductor device (31c) can be thermally contacted with the lower housing (12').

[0361] FIG. 9 is a diagram of another example of an electronic control unit according to the present embodiment when cooled by a water-cooled loop system, FIG. 10 is a control block diagram of another example of an electronic control unit according to the present embodiment, and FIG. 11 is a flowchart of another example of an electronic control unit according to the present embodiment.

[0362] The water-cooled loop system (9') may include a heat exchanger (91), a cooling water tank (93) connected to the heat exchanger (91) via a heat exchanger outlet pipe (92), a pump (95) connected to the cooling water tank (93) via a pump inlet pipe (94), and a pump outlet pipe (96) connecting the pump (95) to a cooling jacket (2') of another example of an electronic control unit, and the cooling jacket (2) of one example of an electronic control unit and the heat exchanger (91) may be connected via a heat exchanger inlet pipe (97).

[0363] The cooling jacket (2') of another example of an electronic control unit and the cooling jacket (2) of one example of an electronic control unit can be connected by a cooling jacket connecting pipe (98).

[0364] For the water-cooled loop system (9') shown in FIG. 9 that has the same configuration as the water-cooled loop system (9) shown in FIG. 4, the same reference numerals are used to avoid redundant descriptions, and descriptions thereof are omitted.

[0365] The first semiconductor device (31a), the second semiconductor device (31b), and the third semiconductor device (31c) may each include a temperature sensor.

[0366] The first semiconductor device (31a) may include a first temperature sensor (36'), the second semiconductor device (31b) may include a second temperature sensor (46'), and the third semiconductor device (31c) may include a third temperature sensor (56').

[0367] The first temperature sensor (36') can be provided inside the first semiconductor device (31a) and can measure the junction temperature of the first semiconductor device (31a).

[0368] The second temperature sensor (46') can be provided inside the second semiconductor device (31b) and can measure the junction temperature of the second semiconductor device (31b).

[0369] The third temperature sensor (56') can be provided inside the third semiconductor device (31c) and can measure the junction temperature of the third semiconductor device (31c).

[0370] The electronic control unit may further include a micro control unit (61').

[0371] The micro control unit (61') can compare the temperature input from the temperature sensor with the set temperature in real time, and if the temperature input from the temperature sensor is higher than the set temperature, it can control the valve (8) to close the cooling water inlet (25) to prevent high-temperature cooling water from flowing into the cooling jacket (2') due to a failure of the heat exchanger (91).

[0372] That is, the micro control unit (61') can close or open the valve (8) according to the sensing value of the first temperature sensor (36'), the sensing value of the second temperature sensor (46'), and the sensing value of the third temperature sensor (56').

[0373] The micro control unit (61') can control the valve (8) to a closed mode if the temperature (Tsoc Lv.2+) sensed by the first temperature sensor (36) is greater than or equal to the first set temperature (Tth). (S21)(S22)(S23)

[0374] The first set temperature (Tth) may be a temperature set lower than the critical temperature of the first semiconductor device (31a). For example, if the critical temperature of the first semiconductor device (31a) is 125 C°, the first set temperature (Tth) may be 120 C° or 110 C°.

[0375] Heat from the first semiconductor device (31a) can be transferred to the first phase change material (PCM1) through the receiving body, and when the temperature of the first phase change material (PCM1) reaches the phase change temperature, the first phase change material (PCM1) can be activated from a solid state to a liquid state, and the amount of heat absorbed can be increased due to the latent heat effect. The first phase change material (PCM1) can rapidly absorb heat from the first semiconductor device (31a).

[0376] When the valve (8) is controlled in a closed mode, the valve (8) is closed so that coolant does not flow into the coolant inlet (25). (S23)

[0377] When the valve (8) is in the closed mode, the cooling water whose temperature has risen due to the failure of the heat exchanger (91) may no longer flow into the lower cooling water passage (22c) and upper cooling water passage (23c) of the cooling jacket (2'), and the cooling jacket (2') may not hinder the heat absorption of the first phase change material (PCM1), and the first phase change material (PCM1) may dissipate heat from the first semiconductor device (31a) so that the first semiconductor device (31a) does not overheat.

[0378] The micro control unit (61) can control the valve (8) to a closed mode when the temperature (Tsoc Lv.3) sensed by the second temperature sensor (46') is greater than or equal to the second set temperature (Tth). (S24)(S25)(S23)

[0379] The second set temperature (Tth) may be a temperature set lower than the critical temperature of the second semiconductor device (31b). For example, if the critical temperature of the second semiconductor device (31b) is 125°, the second set temperature (Tth) may be 120° or 110°.

[0380] The second set temperature (Tth) may be set to be the same as or different from the first set temperature.

[0381] Heat from the second semiconductor device (31b) can be transferred to the second phase change material (PCM2) through the cooling jacket (2'), and when the temperature of the second phase change material (PCM2) reaches the phase change temperature, the second phase change material (PCM2) can be activated from a solid state to a liquid state, and the amount of heat absorbed can be increased due to the latent heat effect. The second phase change material (PCM2) can rapidly absorb heat from the second semiconductor device (31b).

[0382] When the valve (8) is controlled in a closed mode, the valve (8) is closed so that coolant does not flow into the coolant inlet (25). (S23)

[0383] When the valve (8) is in the closed mode, the cooling water whose temperature has risen due to the failure of the heat exchanger (91) may no longer flow into the lower cooling water passage (22c) and the upper cooling water passage (23c) of the cooling jacket (2'), and the cooling jacket (2) may not hinder the heat absorption of the second phase change material (PCM2), and the second phase change material (PCM2) may dissipate heat from the second semiconductor device (31b) so that the second semiconductor device (31b) does not overheat.

[0384] The micro control unit (61) can control the valve (8) to a closed mode that closes the coolant inlet when the temperature (Tsoc Lv.4) sensed by the third temperature sensor (56') is greater than or equal to the third set temperature (Tth). (S26)(S27)(S23)

[0385] The third set temperature (Tth) may be a temperature set lower than the critical temperature of the third semiconductor device (31c). For example, if the critical temperature of the third semiconductor device (31c) is 125°, the third set temperature (Tth) may be 120° or 110°.

[0386] The third set temperature (Tth) can be set to be the same as the second set temperature.

[0387] The third set temperature (Tth) may be set to be the same as or different from the first set temperature.

[0388] Heat from the third semiconductor device (31c) can be transferred to the third phase change material (PCM3) through the cooling jacket (2'), and when the temperature of the third phase change material (PCM3) reaches the phase change temperature, the third phase change material (PCM3) can be activated from a solid state to a liquid state, and the amount of heat absorbed can be increased due to the latent heat effect. The third phase change material (PCM3) can rapidly absorb heat from the third semiconductor device (31c).

[0389] When the valve (8) is controlled in a closed mode, the valve (8) is closed so that coolant does not flow into the coolant inlet (25). (S23)

[0390] When the valve (8) is in the closed mode, the cooling water whose temperature has risen due to a failure of the heat exchanger (91) may no longer flow into the lower cooling water passage (22c) and the upper cooling water passage (23c) of the cooling jacket (2), and the cooling jacket (2') may not hinder the heat absorption of the third phase change material (PCM3), and the third phase change material (PCM3) may dissipate heat from the third semiconductor device (31c) so that the third semiconductor device (31c) does not overheat.

[0391] The micro control unit (61') can control the valve (8) to open mode if the temperature (Tsoc Lv.2+) sensed by the first temperature sensor (36') is less than the first set temperature (Tth). (S28)(S29)(S30)

[0392] The micro-control unit (61') can control the valve (8) to open mode if the temperature (Tsoc Lv.3) sensed by the second temperature sensor (46') is less than the second set temperature (Tth). (S31)(S32)(S30)

[0393] The micro control unit (61') can control the valve (8) to open mode if the temperature (Tsoc Lv.4) sensed by the third temperature sensor (56') is less than the third set temperature (Tth). (S33)(S34)(S30)

[0394] The micro control unit (61') can control the valve (8) to open mode if the temperature (Tsoc Lv.2+) sensed by the first temperature sensor (36') is less than the first set temperature (Tth), the temperature (Tsoc Lv.3) sensed by the second temperature sensor (46) is less than the second set temperature (Tth), and the temperature (Tsoc Lv.4) sensed by the third temperature sensor (56) is less than the third set temperature (Tth).

[0395] When the valve (8) is controlled to open mode, the valve (8) is opened so that coolant can flow into the coolant inlet (25). (S30)

[0396] The first phase change material (PCM1) can be deactivated from a liquid state to a solid state, and the first phase change material (PCM1) can rapidly dissipate heat through the cooling water flowing in the lower cooling water channel (22c) and the upper cooling water channel (23c).

[0397] The second phase change material (PCM2) can be deactivated from a liquid state to a solid state, and the second phase change material (PCM2) can rapidly dissipate heat through the cooling water flowing in the lower cooling water channel (22c) and the upper cooling water channel (23c).

[0398] The third phase change material (PCM3) can be deactivated from a liquid state to a solid state, and the third phase change material (PCM3) can rapidly dissipate heat through the cooling water flowing in the lower cooling water channel (22c) and the upper cooling water channel (23c).

[0399] Another example of an electronic control unit is that the valve (8) can be controlled in a closed mode according to the sensing values ​​of the temperature sensor, flow sensor, or flow rate sensor of the water-cooled loop system (9').

[0400] Another example of an electronic control unit is that if the temperature sensed by the temperature sensor is above the set temperature, the valve (8) can be controlled in a closed mode to close the coolant inlet (25).

[0401] Another example of an electronic control unit is that if the flow rate sensed by the flow sensor is less than or equal to the set flow rate, the valve (8) can be controlled in a closed mode.

[0402] Another example of an electronic control unit is that if the flow rate sensed by the flow rate sensor is less than or equal to the set flow rate, the valve (8) can be controlled in a closed mode.

[0403] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention.

[0404] Accordingly, the embodiments disclosed in this invention are intended to explain, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments.

[0405] The scope of protection of the present invention shall be interpreted by the claims below, and all technical ideas within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. Housing; A cooling jacket disposed in the above housing; and It includes a first board having a first semiconductor device mounted thereon that is in thermal contact with at least one of the housing and the cooling jacket, and The above housing is A housing body in which the first board is thermally contacted and a first space is formed; and It includes a heat dissipation member that shields the first space and has heat dissipation fins formed thereon, An electronic control unit containing a first phase change material in the first space above.

2. In Paragraph 1, The above housing is Lower housing; and It includes an upper housing positioned on the upper side of the lower frame, and The upper housing comprises the housing body and an electronic control unit including a heat dissipation member.

3. In Paragraph 2, A fastening member penetrating the first board and fastened to the housing body; and An electronic control unit further comprising a spring disposed between the fastening member and the first board and pressing the first board into the housing.

4. In Paragraph 2, An electronic control unit further comprising a sealer disposed between the housing body and the heat dissipation member.

5. In Paragraph 2, An electronic control unit further comprising the above-mentioned heat dissipation member and a fastening member for fastening the sealer and the housing body.

6. In Paragraph 1, The first semiconductor device is an electronic control unit that is in thermal contact with the upper surface of the cooling jacket.

7. In Paragraph 5, A second board having a second semiconductor device mounted thereon that is in thermal contact with the lower surface of the cooling jacket; and An electronic control unit further comprising a third board having a third semiconductor device mounted thereon that is in thermal contact with the lower surface of the cooling jacket.

8. In Paragraph 7, The cooling jacket comprises: a cooling water passage through which cooling water passes; a second space partitioned from the cooling water passage; and a third space partitioned from the cooling water passage and the second space. A second phase change material is accommodated in the second space above, and An electronic control unit containing a third phase change material in the above third space.

9. In Paragraph 8, The above cooling jacket is a coolant cover; A cooling plate disposed on the lower side of the above coolant cover and It includes a lower cover disposed on the lower side of the above cooling plate, and The above coolant passage is formed between the coolant cover and the cooling plate, and The second space and the third space are formed on the bottom surface of the cooling plate, and The lower cover above is an electronic control unit that shields the second space and the third space.

10. In Paragraph 9, The above second semiconductor device and third semiconductor device are electronic control units that are in thermal contact with the lower cover.

11. In Paragraph 8, A valve for closing or opening the above-mentioned cooling water path and An electronic control unit further comprising a controller for controlling the above valve.

12. In Paragraph 11, The first semiconductor device includes a first temperature sensor, and The above-mentioned second semiconductor device includes a second temperature sensor, and The above-mentioned third semiconductor device includes a third temperature sensor, and The above controller An electronic control unit that closes or opens the valve according to the sensing value of the first temperature sensor, the sensing value of the second temperature sensor, and the sensing value of the third temperature sensor.

13. In Paragraph 1, The cooling jacket mentioned above is A lower cooling water jacket having a first passage and a second passage spaced apart from the first passage, and a lower cooling water flow path formed between the first passage and the second passage through which cooling water passes; and It includes an upper cooling water jacket having a third passage communicating with the second passage and a fourth passage spaced apart from the third passage, and an upper cooling water flow path formed between the third passage and the fourth passage through which cooling water passes. The above housing is an electronic control unit disposed on the lower surface of the lower coolant jacket or on the upper surface of the upper coolant jacket.

14. In Paragraph 13, An electronic control unit further comprising a control board positioned between the lower coolant jacket and the upper coolant jacket.

15. In Paragraph 13, The above housing is Lower housing and It includes an upper housing positioned above the lower housing, and The first semiconductor device is in thermal contact with either the lower housing or the upper housing, and The first board above is an electronic control unit that is in thermal contact with the other of the lower housing and the upper housing.

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