Electronic device comprising coupler

Abstract

An embodiment of the present disclosure relates to an electronic device comprising a coupler. The electronic device comprises: a power amplifier; a plurality of antennas; and a coupler disposed on an electrical path connecting the plurality of antennas to the power amplifier, and disposed on a substrate including a plurality of layers, wherein the coupler comprises: a first conductive pattern including a first RF path corresponding to a first frequency band in a first layer among the plurality of layers; a second conductive pattern including, in a third layer that is different from the first layer, a second RF path corresponding to a second frequency band that is different from the first frequency band; and a third conductive pattern including a coupling path in a second layer between the first layer and the third layer. Other embodiments may also be possible.

Description

Electronic device including a coupler

[0001] An embodiment of the present disclosure relates to an electronic device comprising a coupler.

[0002] With the advancement of information and communication technology and semiconductor technology, electronic devices can provide various functions. For example, electronic devices can provide near-field wireless communication functions (e.g., Bluetooth, wireless LAN and / or NFC (near field communication)) and / or mobile communication functions (LTE (long term evolution) and / or 5G NR (5th generation new radio)).

[0003] The electronic device may include an antenna, an RFFE (radio frequency front end), and an RFIC (radio frequency integrated circuit) for wireless communication.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] The electronic device can monitor the power and / or voltage standing wave ratio (VSWR) of a signal transmitted and / or received between the power amplifier and the antenna by using a coupler placed on the electrical path between the antenna and the power amplifier.

[0006] An electronic device may include multiple couplers corresponding to each frequency band to monitor signals in multiple frequency bands supported by the electronic device. As the number of frequency bands supported by the electronic device increases, the number of couplers increases, which may require a relatively large physical space (or area) for arranging the couplers.

[0007] In electronic devices where multiple couplers are connected in a cascade configuration, a deviation in the coupling factor may exceed a specified reference value depending on changes in antenna impedance.

[0008] Embodiments of the present disclosure disclose an electronic device comprising a coupler corresponding to a plurality of frequency bands.

[0009] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs from the description below.

[0010] According to one embodiment, the electronic device may include a power amplifier, a plurality of antennas, and a coupler disposed on a substrate comprising a plurality of layers and positioned on an electrical path connecting the plurality of antennas and the power amplifier. According to one embodiment, the coupler may include a first conductive pattern comprising a first RF (radio frequency) path corresponding to a first frequency band in a first layer among the plurality of layers. According to one embodiment, the coupler may include a second conductive pattern comprising a second RF path corresponding to a second frequency band different from the first frequency band in a third layer among the plurality of layers that is different from the first layer. According to one embodiment, the coupler may include a third conductive pattern comprising a coupling path in a second layer between the first layer and the third layer among the plurality of layers.

[0011] According to one embodiment, the coupling device may include a first conductive pattern comprising a first RF (radio frequency) path corresponding to a first frequency band in a first layer of a substrate comprising a plurality of layers. According to one embodiment, the coupling device may include a second conductive pattern comprising a second RF path corresponding to a second frequency band different from the first frequency band in a third layer different from the first layer of the substrate. According to one embodiment, the coupling device may include a third conductive pattern comprising a coupling path in a second layer between the first layer and the third layer of the substrate.

[0012] According to an exemplary embodiment of the present disclosure, an electronic device has RF (radio frequency) paths of different frequency bands disposed on different layers of a substrate comprising a plurality of layers, and a coupling path disposed on a layer (e.g., a second layer) between layers where the RF paths are disposed (e.g., a first layer and a third layer), so that the RF paths of different frequency bands share a single coupling path, thereby reducing the size of the physical space (or area) where the coupler is disposed and causing a relatively small deviation in the coupling factor due to changes in antenna impedance.

[0013] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0014] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0015] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0017] FIG. 2 is a block diagram of an electronic device including a coupler according to one embodiment.

[0018] FIG. 3 is a perspective view of a substrate having a coupler arranged thereon according to one embodiment.

[0019] FIG. 4a is a diagram showing a first RF path included in a coupler according to one embodiment.

[0020] FIG. 4b is a diagram showing a coupling path included in a coupler according to one embodiment.

[0021] FIG. 4c is a diagram showing a second RF path included in a coupler according to one embodiment.

[0022] FIG. 4d is a diagram showing a third RF path included in a coupler according to one embodiment.

[0023] FIG. 5 is a diagram showing a magnetic field induced in a first RF path according to one embodiment.

[0024] FIG. 6 is a drawing showing a coupler disposed on a substrate including a plurality of layers according to one embodiment.

[0025] FIG. 7a is a diagram showing the coupling result of a signal in a first frequency band in a coupler according to one embodiment.

[0026] FIG. 7b is a diagram showing the coupling result of a signal in a second frequency band in a coupler according to one embodiment.

[0027] FIG. 8a is a diagram showing the deviation of the coupling variable of the first frequency band in a coupler according to one embodiment.

[0028] FIG. 8b is a diagram showing the deviation of the coupling variable in the second frequency band in a coupler according to one embodiment.

[0029] The following embodiments are described in detail with reference to the attached drawings.

[0030] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through the server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0031] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof. The processor (120) may include various processing circuits and / or a plurality of processors. For example, the processor used in the present invention (or claims) may include at least one processor including various processing circuits. One or more processors may be configured to perform various functions in a distributed manner, individually and / or collectively.In one embodiment of this document, the terms “processor,” “at least one processor,” and “one or more processors” used are described as being configured to perform multiple functions, including but not limited to situations where one processor performs some of the cited functions and another processor performs other of the cited functions, and situations where a single processor can perform all of the cited functions. Additionally, at least one processor may include a combination of processors that perform various functions in a distributed manner. At least one processor may execute program instructions for performing various functions.

[0032] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0033] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0034] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0037] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0038] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0039] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0043] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0045] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. The NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate (or throughput), for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate for eMBB realization (e.g., 20 Gbps or more), loss coverage for mMTC realization (e.g., 164 dB or less), or U-plane latency for URLLC realization (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).According to one embodiment, the subscriber identification module (196) may include a plurality of subscriber identification modules. For example, the plurality of subscriber identification modules may store different subscriber identification information.

[0048] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0049] According to one embodiment, the antenna module (197) may form a high frequency (e.g., mmWave) antenna module. According to one embodiment, the high frequency (e.g., mmWave) antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band. For example, the plurality of antennas may include a patch array antenna and / or a dipole array antenna.

[0050] At least some of the components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0051] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0053] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0054] As used in one embodiment of this document, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0055] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0056] A method according to one embodiment disclosed in this document may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0057] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0058] FIG. 2 is a block diagram of an electronic device including a coupler according to one embodiment. For example, the electronic device (101) of FIG. 2 may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0059] According to one embodiment with reference to FIG. 2, the electronic device (101) may include at least one of a processor (e.g., including a processing circuit) (200), a transceiver (210), a power amplifier (PA) (220), a coupler (230), or an antenna (241 and / or 243). For example, the processor (200) may be substantially the same as the processor (120) of FIG. 1 (e.g., an application processor and / or a communication processor) or may include the processor (120). At least one of the transceiver (210), the power amplifier (220), the coupler (230), or the antenna (241 and / or 243) may be included in the wireless communication module (192) of FIG. 1. For example, the processor (200) may include at least one processor including a processing circuit. For example, the electronic device (101) of FIG. 2 is illustrated as including a first antenna (241) and / or a second antenna (243), but is not limited thereto and may include three or more antennas.

[0060] According to one embodiment, the processor (200) can perform various operations related to wireless communication between the electronic device (101) and the network. For example, the processor (200) can generate a baseband signal for transmission to an external device through at least one frequency band supported by the electronic device (101) and transmit it to a transceiver (210).

[0061] According to one embodiment, the transceiver (210) may perform various processing to output a signal (e.g., a baseband signal) received from the processor (200) through at least one antenna (e.g., a first antenna (241) and / or a second antenna (243)). For example, the various processing may include at least one of converting the baseband signal into a signal in the RF (radio frequency) band or modulating the signal.

[0062] For example, the transceiver (210) can convert a baseband signal received from the processor (200) into a signal of a first frequency band supported by the electronic device (101) and provide it to the power amplifier (220). For example, the first frequency band is a frequency band of about 1 GHz or higher, and may include a frequency band higher than at least one of a second frequency band, such as a mid band (e.g., about 1.7 GHz to about 2.2 GHz band) or a high band (e.g., about 2.3 GHz to about 2.7 GHz band).

[0063] For example, the transceiver (210) can convert a baseband signal received from the processor (200) into a signal of a second frequency band supported by the electronic device (101) and provide it to the power amplifier (220). For example, the second frequency band may include at least one frequency band lower than the first frequency band, such as an intermediate frequency band or a low band (e.g., a band of about 700 MHz to about 900 MHz).

[0064] According to one embodiment, the power amplifier (220) can amplify a transmission signal (e.g., RF signal) provided by the transceiver (210). For example, the power amplifier (220) can amplify a transmission signal (e.g., RF signal) of a first frequency band provided by the transceiver (210) so that it can be output at a relatively high level (e.g., power) at the first antenna (241). For example, the power amplifier (220) can amplify a transmission signal (e.g., RF signal) of a second frequency band provided by the transceiver (210) so that it can be output at a relatively high level (e.g., power) at the second antenna (243). For example, the power amplifier (220) may be formed as a single module for amplifying signals corresponding to a plurality of frequency bands supported by the electronic device (101). For example, the power amplifier (220) may include a plurality of power amplifiers corresponding to each frequency band supported by the electronic device (101).

[0065] According to one embodiment, a coupler (230) is positioned on an electrical path connecting a power amplifier (220) and antennas (241 and 243) to extract or couple a portion of a transmission signal transmitted from the power amplifier (220) to at least one antenna (241 and / or 243). For example, the coupler (230) may extract or couple transmission signals of multiple frequency bands output from the power amplifier (220). The coupler (230) may transmit the extracted or coupled signal to the transceiver (210) through a designated feedback path (232) to enable at least one of power sensing of the transmission signal or monitoring of the voltage standing wave ratio (VSWR) at the transceiver (210). For example, the coupler (230) may include an RF path corresponding to a first frequency band (e.g., the first RF path (402) of FIG. 4a), a coupling path (e.g., the coupling path (412) of FIG. 4b), and an RF path corresponding to a second frequency band (e.g., the second RF path (422) of FIG. 4c and / or the third RF path (432) of FIG. 4d) implemented in different shapes on different layers of a substrate (e.g., the substrate (300) of FIG. 3) that includes a plurality of layers.

[0066] According to one embodiment, the electronic device (101) may process signals received through antennas (241 and / or 243). For example, the electronic device (101) may use a low-noise amplifier, a transceiver (210), and a processor (200) to perform down-conversion and de-modulation of a first frequency band RF signal received through a first antenna (241) into a baseband signal. For example, the electronic device (101) may use a low-noise amplifier, a transceiver (210), and a processor (200) to perform down-conversion and de-modulation of a second frequency band RF signal received through a second antenna (243) into a baseband signal.

[0067] FIG. 3 is a perspective view of a substrate having a coupler arranged thereon according to one embodiment.

[0068] According to one embodiment with reference to FIG. 3, the coupler (230) may be disposed on a substrate (300) (or a part of the substrate (300)) comprising a plurality of layers. For example, the coupler (230) may be implemented with different types of conductive patterns on each layer (310, 320, 330, or 340) of the substrate (300).

[0069] According to one embodiment, a first layer (310) of a substrate (300) may include a first conductive pattern (e.g., a first conductive pattern (400) of FIG. 4a) comprising a first RF path (e.g., a first RF path (402) of FIG. 4a) corresponding to a first frequency band. For example, the first conductive pattern may be implemented in a portion of the first layer (310) of the substrate (300). For example, the first RF path of the first conductive pattern may be electrically connected to the output port of a power amplifier (220) and a first antenna (241) in the first layer (310).

[0070] According to one embodiment, the third layer (330) and the fourth layer (340) of the substrate (300) may include a second conductive pattern (e.g., the second conductive pattern (420) of FIG. 4c) and a fourth conductive pattern (e.g., the fourth conductive pattern (430) of FIG. 4d) comprising a second RF path (e.g., the second RF path (422) of FIG. 4c) and a third RF path (e.g., the third RF path (432) of FIG. 4d) corresponding to a second frequency band. For example, the second conductive pattern and the fourth conductive pattern may be implemented in a portion of the third layer (330) and the fourth layer (340) located at the bottom of the first layer (310) on the substrate (300). For example, the second RF path may be electrically connected to the output port of the power amplifier (220) at the third layer (330) of the substrate (300). The third RF path may be electrically connected to the second antenna (243) at the fourth layer (340) of the substrate (300). For example, the second RF path placed on the third layer (330) and the third RF path placed on the fourth layer (340) may be electrically connected through vias (e.g., vias (424 and 434) of FIG. 4c and FIG. 4d).

[0071] According to one embodiment, the second layer (320) of the substrate (300) may include a third conductive pattern (e.g., the third conductive pattern (410) of FIG. 4b) comprising a coupling path (e.g., the coupling path (412) of FIG. 4b). For example, the third conductive pattern may be implemented in a portion of the second layer (320) disposed between the first layer (310) and the third layer (330) in the substrate (300). For example, the coupling path of the third conductive pattern may be electrically connected to a transceiver (210) through a designated feedback path (232) in the second layer (320).

[0072] For example, the coupling path of the second layer (320) can extract or couple a signal from the first RF path of the first layer (310) based on an inductive coupling method. For example, the coupling path of the second layer (320) may not overlap with or may only partially overlap with the first RF path of the first layer (310) when the substrate (300) is viewed from above, in order to prevent or reduce the generation of a signal from the first RF path of the first layer (310) by capacitive coupling. For example, the state of being viewed from above may include a state of being viewed from a direction orthogonal to the first layer (310) of the substrate (300). For example, a state in which the coupling path of the second layer (320) and the first RF path of the first layer (310) overlap only partially may include a state in which a portion of the coupling path of the second layer (320) and the first RF path of the first layer (310) overlap to a level where the signal generated from the first RF path of the first layer (310) by capacitive coupling is negligible (or does not affect other signals).

[0073] For example, the coupling path of the second layer (320) can extract or couple a signal based on a capacitive coupling method from the second RF path of the third layer (330) and / or the third RF path of the fourth layer (340). For example, the coupling path of the second layer (320) may overlap with at least a portion of the second RF path of the third layer (330) and / or the third RF path of the fourth layer (340) when the substrate (300) is viewed from above to extract or couple a signal of the second frequency band in a capacitive coupling manner.

[0074] According to one embodiment, the coupler (230) may implement a second RF path corresponding to a second frequency band in one layer of the substrate (300) (e.g., the third layer (330)). For example, the second RF path corresponding to the second frequency band may be electrically connected to the output port of the power amplifier (220) and the second antenna (243) in the third layer (330) of the substrate (300).

[0075] According to one embodiment, the first layer (310) on which the first RF path of the coupler (230) is disposed in the substrate (300) may be disposed at the bottom of the third layer (320) and the fourth layer (330) on which the second RF path and the third RF path of the coupler (230) are disposed.

[0076] FIG. 4a is a diagram showing a first RF path included in a coupler according to one embodiment. FIG. 4b is a diagram showing a coupling path included in a coupler according to one embodiment. FIG. 4c is a diagram showing a second RF path included in a coupler according to one embodiment. FIG. 4d is a diagram showing a third RF path included in a coupler according to one embodiment. FIG. 5 is a diagram showing a magnetic field induced in the first RF path according to one embodiment.

[0077] According to one embodiment with reference to FIG. 4a, FIG. 4b, FIG. 4c, FIG. 4d and FIG. 5, a first layer (310) of a substrate (300) may include a first conductive pattern (400) comprising a first RF path (402) corresponding to a first frequency band. For example, the first conductive pattern (400) may be implemented in a part of the first layer (310) of the substrate (300) and may include a first RF path (402) and a first loop (404) through which a signal of the first frequency band is transmitted. For example, the first conductive pattern (400) may be implemented on one side or inside the first layer (310).

[0078] For example, when a signal is transmitted to the first direction (500) of FIG. 5 through the first RF path (402), the first loop (404) can induce (or couple) a coupling signal in the second direction (510) opposite to the first direction (500), thereby inducing a magnetic field in the fourth direction (e.g., -Z-axis direction) (512) opposite to the magnetic field in the third direction (e.g., Z-axis direction) (502) induced by the first RF path (402), so as to reduce the strength of the signal induced from the first RF path (402) to the second RF path (422) to below a specified reference value. For example, one end (402-1) (e.g., RF input 1) of the first RF path (402) can be electrically connected to the output port of the power amplifier (220). The other end (402-2) of the first RF path (402) (e.g., RF output 1) may be electrically connected to the first antenna (241). For example, the first loop (404) is placed (or located) inside (or on the inner side) of the first RF path (402) and may be implemented (or configured) in various shapes (e.g., circular, square, or triangular).

[0079] According to one embodiment, the third layer (330) and the fourth layer (340) of the substrate (300) may include a second conductive pattern (420) and a fourth conductive pattern (430) comprising a second RF path (422) and a third RF path (432) corresponding to a second frequency band. For example, the second conductive pattern (420) may be implemented in the third layer (330) disposed below the first layer (310) in the substrate (300). For example, the second conductive pattern (420) may be implemented on one side or inside the third layer (330). For example, the fourth conductive pattern (430) may be implemented in a part of the fourth layer (340) disposed below the third layer (330) in the substrate (300). For example, the fourth conductive pattern (430) may be implemented on one side or inside the fourth layer (340). For example, one end (422-1) of the second RF path (422) (e.g., RF input 2) may be electrically connected to the output port of the power amplifier (220) in the third layer (330) of the substrate (300). One end (432-1) of the third RF path (432) (e.g., RF output 2) may be electrically connected to the second antenna (243) in the fourth layer (340) of the substrate (300). For example, the second RF path (422) placed in the third layer (330) and the third RF path (432) placed in the fourth layer (340) may be electrically connected through vias (424 and 434).

[0080] According to one embodiment, the second layer (320) of the substrate (300) may include a third conductive pattern (410) comprising a coupling path (412). For example, the third conductive pattern (410) may be implemented in a portion of the second layer (320) disposed between the first layer (310) and the third layer (330) in the substrate (300) and may include a coupling path (412) and a second loop (414). For example, one end (412-2) of the coupling path (412) (e.g., RF coupling) may be electrically connected to a transceiver (210) through a designated feedback path (232). The other end (412-1) (e.g., term) of the coupling path (412) may be formed with a resistance of a specified value (e.g., about 50 Ω) so that a signal extracted or coupled from the coupling path (412) can be transmitted to one end (412-2) (e.g., RF coupling) of the coupling path (412). For example, the second loop (414) is placed (or located) inside (or on the inner side) of the coupling path (412) and may be implemented (or configured) in substantially the same shape (e.g., circular, square, or triangular) as the first loop (404). For example, the third conductive pattern (410) may be implemented on one side or inside the second layer (320).

[0081] For example, the coupling path (412) of the third conductive pattern (410) implemented in the second layer (320) of the substrate (300) can extract or couple a signal from the first RF path (402) of the first conductive pattern (400) implemented in the first layer (310) based on an inductive coupling method. For example, the third conductive pattern (410) may not overlap with or may only partially overlap with the first conductive pattern (400) when the substrate (300) is viewed from above in order to prevent or reduce the generation of a signal from the first RF path (402) by capacitive coupling. For example, the state of being viewed from above may include a state of being viewed from a direction orthogonal to the first layer (310) of the substrate (300).

[0082] For example, the coupling path (412) of the third conductive pattern (410) implemented in the second layer (320) of the substrate (300) can extract or couple signals based on a capacitive coupling method from the second RF path (422) and / or the third RF path (432) of the second conductive pattern (420) and / or the fourth conductive pattern (430) implemented in the third layer (330) and / or the fourth layer (340). For example, the third conductive pattern (410) may overlap at least partially with the second conductive pattern (420) and / or the fourth conductive pattern (430) when the substrate (300) is viewed from above to couple signals of the second frequency band in a capacitive coupling manner. For example, the coupling path (412) of the third conductive pattern (410) may overlap with at least a portion of the second RF path (422) of the second conductive pattern (420).

[0083] FIG. 6 is a drawing showing a coupler disposed on a substrate including a plurality of layers according to one embodiment.

[0084] According to one embodiment with reference to FIG. 6, the coupler (230) may be disposed on a substrate (300) (or a part of the substrate (300)) comprising a plurality of layers. For example, the first RF path (402) of the coupler (230) may be implemented as a first conductive pattern (400) of a first layer (310) of the substrate (300). The second RF path (422) of the coupler (230) may be implemented as a second conductive pattern (420) of a third layer (330) of the substrate (300). The coupling path (412) of the coupler (230) is implemented as a third conductive pattern (410) of the second layer (320) between the first layer (310) and the third layer (330) of the substrate (300), and can extract or couple at least one of a transmission signal of the first frequency band from the first RF path (402) or a transmission signal of the second frequency band from the second RF path (422) and transmit it to the transceiver (210).

[0085] According to one embodiment, the third conductive pattern (410) of the coupler (230) may not overlap with or may only partially overlap with the first conductive pattern (400) when the substrate (300) is viewed from above in order to prevent or reduce the generation of a signal of the first RF path (402) by capacitive coupling. For example, the state of being viewed from above may include a state of being viewed from a direction orthogonal to the first layer (310) of the substrate (300).

[0086] For example, the coupling path (412) of the third conductive pattern (410) can be positioned between the first RF path (402) and the first loop (404) of the first conductive pattern (400) when viewed from above the substrate (300).

[0087] For example, the second loop (414) of the third conductive pattern (410) may be placed inside (or inside) the first loop (404) of the first conductive pattern (400) when viewed from above the substrate (300).

[0088] For example, the first RF path (402) of the first conductive pattern (400) may be positioned so as not to overlap with the ground area (600) and coupling path (422) of the second layer (320) on which the third conductive pattern (410) is placed when viewed from above the substrate (300).

[0089] FIG. 7a is a diagram showing the coupling result of a signal in a first frequency band in a coupler according to one embodiment.

[0090] According to one embodiment with reference to FIG. 7a, when the coupler (230) transmits a signal (700) of a first frequency band (e.g., about 1.7 GHz to about 2.7 GHz band) through a first RF path (402) implemented in a first layer (310) of the substrate (300), a signal (702) of a first magnitude (e.g., about -27.48 dB to about -23.55 dB) can be coupled from the first RF path (402) through a coupling path (412) implemented in a second layer (320) of the substrate (300). For example, as shown in FIG. 4a and FIG. 6, the coupler (230) implements a first conductive pattern (400) of the first layer (310) and a third conductive pattern (410) of the second layer (320) to reduce the strength of the signal induced in the first RF path (402) of the first layer (310), so that only a signal (704) of strength (e.g., about -38.26 dB to about -34.58 dB) is induced in the first RF path (402) with a strength lower than or equal to a value specified in the third layer (330) (and / or the fourth layer (340)) (e.g., about -38.26 dB to about -34.58 dB), thereby isolating the first RF path (402) and the second RF paths (422 and 432) in the first frequency band (e.g., about 11 dB).

[0091] FIG. 7b is a diagram showing the coupling result of a signal in a second frequency band in a coupler according to one embodiment.

[0092] According to one embodiment with reference to FIG. 7b, when the coupler (230) transmits a signal (710) of a second frequency band (e.g., about 700 MHz to about 900 MHz band) through a second RF path (422 and / or 432) implemented in a third layer (330) (and / or a fourth layer (340)) of the substrate (300), a signal (712) of a second magnitude (e.g., about -28.32 dB to about -26.16 dB) can be coupled from the second RF path (422 and / or 432) through a coupling path (412) implemented in a second layer (320) of the substrate (300). For example, only a signal (714) of a strength lower than or equal to the value specified by the first layer (310) (e.g., about -45.63 dB to about -43.53 dB) may be induced in the second RF path (422 and / or 432) of the coupler (230) so that the first RF path (402) and the second RF path (422 and 432) may be isolated (e.g., about 17 dB to about 18 dB) in the second frequency band.

[0093] FIG. 8a is a diagram showing the deviation of the coupling variable of the first frequency band in a coupler according to one embodiment.

[0094] According to one embodiment with reference to FIG. 8a, the coupler (230) may be relatively less affected by reflected waves from the first antenna (241) by generating a coupling factor of the first frequency band (e.g., about 2.7 GHz band) (810) below a specified reference value (e.g., about 0.653 dB) depending on the change in impedance of the first antenna (241) and / or the second antenna (243). For example, the coupling factor of the first frequency band may be detected based on the maximum value (max) and minimum value (min) of the coupling factor as shown in Table 1 below.

[0095] Frequency Band Max / Min Delta 2.7GHz - 22.778 - 23.4300.653

[0096] FIG. 8b is a diagram showing the deviation of the coupling variable in the second frequency band in a coupler according to one embodiment.

[0097] According to one embodiment with reference to FIG. 8b, the coupler (230) may be relatively less affected by reflected waves from the second antenna (243) by the coupling coefficient of the second frequency band (e.g., about 900 MHz band) (820) occurring below a specified reference value (e.g., about 1.167 dB) depending on the change in impedance of the first antenna (241) and / or the second antenna (243). For example, the coupling coefficient of the second frequency band may be detected based on the maximum value (max) and minimum value (min) of the coupling coefficient as shown in Table 2 below.

[0098] Frequency Band Max / Min Delta 900 MHz - 25.85 MHz - 27.01 91.16 MHz

[0099] According to one embodiment, the electronic device includes a coupler implemented (or configured) such that a plurality of RF paths corresponding to different frequency bands share a single coupling path, thereby reducing the size (or area) of the physical space (or region) where the coupler is placed compared to when couplers corresponding to each RF path are used.

[0100] According to one embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1 or FIG. 2) may include a power amplifier (e.g., a power amplifier (220) of FIG. 2), a plurality of antennas (e.g., a first antenna (241) and a second antenna (243) of FIG. 2), and a coupler (e.g., a coupler (230) of FIG. 2) disposed on a substrate (e.g., a substrate (300) of FIG. 3 or FIG. 6) comprising a plurality of layers and disposed on an electrical path connecting the plurality of antennas and the power amplifier. According to one embodiment, the coupler may include a first conductive pattern (e.g., a first conductive pattern (400) of FIG. 4a) comprising a first RF (radio frequency) path (e.g., a first RF path (402) of FIG. 4a) corresponding to a first frequency band in a first layer (e.g., a first layer (310) of FIG. 3 or FIG. 4a) among the plurality of layers. According to one embodiment, the coupler may include a second conductive pattern (e.g., a second conductive pattern (420) of FIG. 4c) comprising a second RF path (e.g., a second RF path (422) of FIG. 4c) corresponding to a second frequency band different from a first frequency band, in a third layer (e.g., a third layer (330) of FIG. 3 or FIG. 4c) among a plurality of layers that is different from a first layer. According to one embodiment, the coupler may include a third conductive pattern (e.g., a third conductive pattern (410) of FIG. 4b) comprising a coupling path (e.g., a coupling path (412) of FIG. 4b)) in a second layer (e.g., a second layer (320) of FIG. 3 or FIG. 4b) between a first layer and a third layer among a plurality of layers.

[0101] According to one embodiment, the first conductive pattern may include a first RF path corresponding to a first frequency band and a first loop of a designated shape inside the first RF path (e.g., the first loop (404) of FIG. 4a).

[0102] According to one embodiment, the third conductive pattern may include a coupling path and a second loop of a specified shape on the inner side of the coupling path (e.g., the second loop (414) of FIG. 4b).

[0103] According to one embodiment, the third conductive pattern may not overlap with the first conductive pattern or may only partially overlap when viewed from a direction orthogonal to the first layer.

[0104] According to one embodiment, the coupling path of the third conductive pattern may be positioned between the first RF path and the first loop of the first conductive pattern when viewed from a direction orthogonal to the first layer. According to one embodiment, the second loop of the third conductive pattern may be positioned inside the first loop of the first conductive pattern when viewed from a direction orthogonal to the first layer.

[0105] According to one embodiment, the first RF path may be positioned so as not to overlap with the ground area and coupling path of the second layer when viewed from a direction orthogonal to the first layer.

[0106] According to one embodiment, at least a portion of the third conductive pattern may overlap at least partially with the second conductive pattern when viewed from a direction orthogonal to the first layer.

[0107] According to one embodiment, the coupling path of the third conductive pattern may overlap with at least a portion of the second RF path of the second conductive pattern when viewed from a direction orthogonal to the first layer.

[0108] According to one embodiment, the second conductive pattern may include an input port of a second RF path corresponding to a second frequency band electrically connected to a power amplifier.

[0109] According to one embodiment, the coupler may include a fourth conductive pattern (e.g., a fourth conductive pattern (430) of FIG. 4d) that includes a third RF path (e.g., a third RF path (432) of FIG. 4d) corresponding to a second frequency band in a fourth layer (e.g., a fourth layer (340) of FIG. 3 or FIG. 4d) that is different from the first, second, and third layers among the plurality of layers. According to one embodiment, the second RF path of the third layer and the third RF path of the fourth layer may be electrically connected through vias (e.g., vias (424 and 434) of FIG. 4c and FIG. 4d). According to one embodiment, the fourth conductive pattern may include an output port of the third RF path corresponding to the second frequency band.

[0110] According to one embodiment, a plurality of antennas may include a first antenna that outputs a signal of a first frequency band output through a first RF path of a first conductive pattern to the outside, and a second antenna that outputs a signal of a second frequency band output through a second RF path of a second conductive pattern (or a third RF path of a fourth conductive pattern) to the outside.

[0111] According to one embodiment, the power amplifier may include a plurality of power amplifiers corresponding to a first frequency band and a second frequency band.

[0112] According to one embodiment, a coupling device (e.g., a coupler (230) of FIG. 2) may include a first conductive pattern (e.g., a first conductive pattern (400) of FIG. 4a) comprising a first RF (radio frequency) path (e.g., a first RF path (402) of FIG. 4a) corresponding to a first frequency band in a first layer (e.g., a first layer (310) of FIG. 3 or FIG. 4a) of a substrate (e.g., a substrate (300) of FIG. 6) comprising a plurality of layers. According to one embodiment, the coupling device may include a second conductive pattern (e.g., a second conductive pattern (420) in FIG. 4c) that includes a second RF path (e.g., a second RF path (422) in FIG. 4c) corresponding to a second frequency band different from a first frequency band, in a third layer (e.g., a third layer (330) in FIG. 3 or FIG. 4c) that is different from a first layer of the substrate. According to one embodiment, the coupling device may include a third conductive pattern (e.g., a third conductive pattern (410) in FIG. 4b) that includes a coupling path (e.g., a coupling path (412) in FIG. 4b)) in a second layer (e.g., a second layer (320) in FIG. 3 or FIG. 4b) between the first layer and the third layer of the substrate.

[0113] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of an embodiment of the present disclosure should be interpreted as including all modifications or variations derived based on the technical concept of an embodiment of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (101), Power amplifier (220), A plurality of antennas (241 and 243), and It includes a coupler (230) disposed on a substrate (300) comprising a plurality of layers and positioned on an electrical path connecting the plurality of antennas (241 and 243) and the power amplifier (220). The above coupler (230) is, A first conductive pattern (400) comprising a first RF (radio frequency) path (402) corresponding to a first frequency band in a first layer (310) among the plurality of layers; A second conductive pattern (420) comprising a second RF path (422) corresponding to a second frequency band different from the first frequency band in a third layer (330) different from the first layer (310) among the plurality of layers; and An electronic device comprising a third conductive pattern (410) including a coupling path (412) in a second layer (320) between the first layer (310) and the third layer (330) among the plurality of layers.

2. In Paragraph 1, The first conductive pattern (400) is an electronic device comprising a first RF path (402) corresponding to the first frequency band and a first loop (404) of a designated shape inside the first RF path (402).

3. In Paragraph 2, The above third conductive pattern (410) is an electronic device comprising the coupling path (412) and the second loop (414) of the specified shape inside the coupling path (412).

4. In Paragraph 3, The third conductive pattern (410) is an electronic device that does not overlap with or only partially overlaps with the first conductive pattern (400) when viewed from a direction orthogonal to the first layer (310).

5. In Paragraph 4, The coupling path (412) of the third conductive pattern (410) is positioned between the first RF path (402) and the first loop (404) of the first conductive pattern (400) when viewed from a direction orthogonal to the first layer (310), and The second loop (414) of the third conductive pattern (410) is an electronic device positioned inside the first loop (404) of the first conductive pattern (400) when viewed from a direction orthogonal to the first layer (310).

6. In Paragraph 3, The first RF path (402) is an electronic device positioned so as not to overlap with the ground area (600) of the second layer (320) and the coupling path (412) when viewed from a direction orthogonal to the first layer (310).

7. In Paragraph 1, An electronic device in which at least a portion of the third conductive pattern (410) overlaps with at least a portion of the second conductive pattern (420) when viewed from a direction orthogonal to the first layer (310).

8. In Paragraph 7, The coupling path (412) of the third conductive pattern (410) overlaps at least partially with the second RF path (422) of the second conductive pattern (420) when viewed from a direction orthogonal to the first layer (310).

9. In Paragraph 1, The above second conductive pattern (420) is an electronic device comprising an input port (422-1) of the second RF path (422) corresponding to the second frequency band electrically connected to the power amplifier (220).

10. In Paragraph 9, The second conductive pattern (420) is an electronic device electrically connected to the power amplifier (220) through the input port (422-1) of the second RF path (422).

11. In Paragraph 9, The coupler (230) comprises a fourth conductive pattern (430) including a third RF path (432) corresponding to the second frequency band in a fourth layer (340) that is different from the first layer (310), the second layer (320), and the third layer (330) among the plurality of layers, and The second RF path of the third layer (330) and the third RF path of the fourth layer are electrically connected through vias (424 and 434), and The above-mentioned fourth conductive pattern (430) is an electronic device comprising an output port (432-1) of the third RF path (432) corresponding to the second frequency band.

12. In Paragraph 11, The above plurality of antennas is an electronic device comprising a first antenna (241) that outputs a signal of the first frequency band to the outside through the first RF path (402) of the first conductive pattern (400), and a second antenna (243) that outputs a signal of the second frequency band to the outside through the third RF path (432) of the second conductive pattern (420).

13. In Paragraph 11, The coupling path (412) of the third conductive pattern (410) overlaps at least partially with the second RF path (422) of the second conductive pattern (420) and / or the third RF path (432) of the fourth conductive pattern (430) when viewed from a direction orthogonal to the first layer (310).

14. In Paragraph 1, The above power amplifier (220) is an electronic device comprising a plurality of power amplifiers corresponding to the first frequency band and the second frequency band.

15. In Paragraph 1, The first conductive pattern (400) is an electronic device electrically connected to the power amplifier (220) through the first RF path (402).

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