A fluid delivery apparatus for chemical mechanical polisher

Abstract

A fluid delivery apparatus for use in chemical mechanical polishing includes a housing having a plurality of nozzle pockets. A manifold is disposed above the plurality of nozzle pockets. A plurality of nozzles are disposed in a respective nozzle pocket and are in fluid communication with the manifold. The plurality of nozzles have a bottom surface in a flush arrangement with a bottom surface of the housing.

Description

PATENTAttorney Docket No.: 44025281 WO01A FLUID DELIVERY APPARATUS FOR CHEMICAL MECHANICAL POLISHERBACKGROUNDField

[0001] Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In particular, embodiments herein relate to a fluid delivery apparatus for CMP systems.Description of the Related Art

[0002] In a typical CMP process, a polishing pad is mounted to a rotatable polishing platen. A material surface of a substrate is urged against the polishing pad in the presence of a polishing fluid. Typically, the polishing fluid is an aqueous solution of one or more chemically active components and abrasive particles suspended in the aqueous solution, e.g., a CMP slurry. The material surface of the substrate is urged against the polishing pad using a substrate carrier. The substrate carrier applies a downforce against the substrate while the substrate carrier rotates about a carrier axis. Material is removed across the surface of the substrate in contact with the polishing pad through a combination of chemical and mechanical activity which is provided by the polishing fluid, the relative motion of the substrate and the polishing pad, and the downforce exerted on the substrate against the polishing pad.

[0003] The polishing fluid is typically supplied onto the polishing pad using a slurry arm during polishing. The slurry arm includes a plurality of nozzles for directing the polishing fluid onto the polishing pad. The nozzles protrude from the bottom surface of the slurry arm. During polishing, particles such as removed substrate material and polishing fluid may deposit onto the slurry arm. The protruding nozzles make the cleaning of the slurry arm more challenging.

[0004] There is, therefore, a need for an improved fluid delivery apparatus to deliver polishing fluid and to facilitate cleaning of the deposited particles from the fluid delivery apparatus.PATENTAttorney Docket No.: 44025281 WO01SUMMARY

[0005] Embodiments herein generally relate to a fluid delivery apparatus for a chemical mechanical polishing (CMP) system. The fluid delivery apparatus includes nozzles arranged in a flush configuration with the bottom surface of a dispensing arm.

[0006] In one embodiment, a fluid delivery apparatus for use in chemical mechanical polishing includes a housing having a plurality of nozzle pockets. A manifold is disposed above the plurality of nozzle pockets. A plurality of nozzles are disposed in a respective nozzle pocket and are in fluid communication with the manifold. The plurality of nozzles have a bottom surface in a flush arrangement with a bottom surface of the housing.

[0007] In another embodiment, an apparatus for polishing a substrate includes a polishing platen having a polishing pad disposed thereon and a substrate carrier for urging a substrate against the polishing pad. The apparatus also includes a dispensing arm for dispensing fluid onto the polishing pad. The dispensing arm includes a housing having a plurality of nozzle pockets and a manifold in fluid communication with the housing. The dispensing arm also includes a plurality of nozzles disposed in a respective nozzle pocket and in fluid communication with the manifold. The plurality of nozzles have a bottom surface in a flush arrangement with a bottom surface of the housing.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

[0009] Figure 1 is a schematic view of a polishing apparatus, according to some embodiments.PATENTAttorney Docket No.: 44025281 WO01

[0010] Figure 1A is a schematic, partial cross-sectional side view of Figure 1 .

[0011] Figure 1 B is a schematic, partial cross-sectional side view of Figure 1.

[0012] Figure 2A is a top view of an exemplary dispensing arm, according to some embodiments

[0013] Figure 2B is a bottom view of the dispensing arm of Figure 2A.

[0014] Figure 3 is a cross-sectional view of the dispensing arm of Figure 2A.

[0015] Figure 4 is an enlarged, partial view of the dispensing arm of Figure 3.

[0016] Figure 5 illustrates an exemplary nozzle, according to some embodiments.

[0017] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.DETAILED DESCRIPTION

[0018] Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In some embodiments, a fluid delivery apparatus includes a housing having a plurality of nozzle pockets. A manifold is disposed above the plurality of nozzle pockets. A plurality of nozzles are disposed in a respective nozzle pocket and are in fluid communication with the manifold. The plurality of nozzles have a bottom surface in a flush arrangement with a bottom surface of the housing. The flush arrangement advantageously facilitates the cleaning of the fluid delivery apparatus. The fluid arrangement also reduces the surface area at the bottom of the housing that is available to accumulate slurry or removed material.

[0019] Figure 1 is a schematic view of a polishing apparatus 100, such as a chemical mechanical polishing (CMP) tool for processing one or more substrates. The polishing apparatus 100 includes a polishing platform, or base 102 that at leastPATENTAttorney Docket No.: 44025281 WO01 partially supports and houses a plurality of polishing stations 124. For example, the polishing apparatus 100 shown includes four polishing stations 124a, 124b, 124c and 124d. Each polishing station 124 is adapted to polish a substrate that is retained in a substrate carrier 126. An exemplary substrate is a wafer.

[0020] The polishing apparatus 100 also includes a plurality of substrate carriers 126, each of which is configured to carry a substrate. The number of substrate carriers can be a number equal to or greater than the number of polishing stations, e.g., four substrate carriers or six substrate carriers. For example, the number of substrate carriers can be two greater than the number of polishing stations. This permits loading and unloading of substrates to be performed from two of the substrate carriers while polishing occurs with the other substrate carriers at the remainder of the polishing stations, thereby providing improved throughput.

[0021] The polishing apparatus 100 also includes a transfer station 122 for loading and unloading substrates from the substrate carriers 126. The transfer station 122 can include a plurality of load cups 123, e.g., two load cups 123a and 123b, adapted to facilitate transfer of a substrate between the substrate carriers 126 and a factory interface (not shown) or other device (not shown) by a transfer robot 110. The load cups 123 generally facilitate transfer between the robot 110 and each of the substrate carriers 126.

[0022] The stations of the polishing apparatus 100, including the transfer station 122 and the polishing stations 124, can be positioned at substantially equal angular intervals around the center of the base 102. This is not required, but can provide the polishing apparatus 100 with a reduced footprint.

[0023] Each polishing station 124 includes a polishing pad 130 supported on a platen 120 (shown in Figures 1A-1 B). For a polishing operation, one substrate carrier 126 is positioned at each polishing station 124. Two additional substrate carriers can be positioned in the transfer station 122 to exchange polished substrates for unpolished substrates while the other substrates are being polished at the polishing stations 124.PATENTAttorney Docket No.: 44025281 WO01

[0024] The substrate carrier 126 is adapted to hold a substrate against a polishing surface of the polishing pad 130, while relative motion is provided between the substrate carrier 126 and the platen 120 to polish the substrate. The relative motion may be rotational, lateral, or some combination thereof, and is provided by at least one of the substrate carrier 126 and the platen 120. Each substrate carrier 126 can have independent control of the polishing parameters, for example pressure, associated with each respective substrate.

[0025] The substrate carriers 126 are held by a support structure that can cause each substrate carrier to move along a path that passes, in order, the first polishing station 124a, the second polishing station 124b, the third polishing station 124c, and the fourth polishing station 124d. This permits each substrate carrier to be selectively positioned over each of the polishing stations 124 and load cups 123.

[0026] In some implementations, each substrate carrier 126 is coupled to a carriage 108 that is mounted to an overhead track 128. By moving a carriage 108 along the overhead track 128, the respective substrate carrier 126 can be positioned over a selected polishing station 124 or load cup 123. A substrate carrier 126 that moves along the overhead track 128 traverses the path past each of the polishing stations 124.

[0027] In the implementation shown in Figure 1 , the overhead track 128 has a circular configuration (shown in phantom) which allows the carriages 108 retaining the substrate carriers 126 to be selectively orbited over and / or clear of the load cups 123 and the polishing stations 124. The overhead track 128 may have other configurations including elliptical, oval, linear or other suitable orientation. Alternatively, in some implementations (not shown) the substrate carriers 126 are suspended from a carousel, and rotation of the carousel moves all of the substrate carriers 126 simultaneously along a circular path. Although the polishing apparatus illustrated herein is outfitted with an overhead track, the present disclosure may utilize any suitable polishing apparatus. In one example, the polishing apparatus may have a robot which provides the same functionality as the overhead track.PATENTAttorney Docket No.: 44025281 WO01

[0028] Each polishing station 124 of the polishing apparatus 100 includes a fluid delivery apparatus 134 to dispense polishing fluid, such as abrasive slurry, onto the polishing pad 130 as shown in more detail in Figure 1A. Each polishing station 124 of the polishing apparatus 100 includes a pad conditioning apparatus 112 to abrade the polishing surface 131 of the polishing pad 130 to maintain the polishing pad 130 in a consistent abrasive state as shown in more detail in Figure 1 B.

[0029] A controller 190, such as a programmable computer, is connected to respective motors to independently control the rotation of the platen 120, movement of the substrate carriers 126, and movement of the fluid delivery apparatus 134 as described in more detail below. For example, each motor can include an encoder that measures the angular position or rotation rate of the associated drive shaft. Similarly, the controller 190 is connected to an actuator in each carriage 108 to independently control the lateral motion of each substrate carrier 126. For example, each actuator can include a linear encoder that measures the position of the carriage 108 along the overhead track 128.

[0030] The controller 190 includes a programmable central processing unit (CPU) 192, which is operable with a memory 194 (e.g., non-volatile memory) and support circuits 196. The support circuits 196 are conventionally coupled to the CPU 192 and comprise cache, clock circuits, input / output subsystems, power supplies, and the like, and combinations thereof coupled to the various components of the polishing apparatus 100.

[0031] In some embodiments, the CPU 192 is one of any form of general purpose computer processor used in an industrial setting, such as a programmable logic controller (PLC), for controlling various monitoring system component and sub-processors. The memory 194, coupled to the CPU 192, is non-transitory and is typically one or more of readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk drive, hard disk, or any other form of digital storage, local or remote.

[0032] Herein, the memory 194 is in the form of a computer-readable storage media containing instructions (e.g., non-volatile memory), that when executed byPATENTAttorney Docket No.: 44025281 WO01 the CPU 192, facilitates the operation of the polishing apparatus 100. The instructions in the memory 194 are in the form of a program product such as a program that implements the methods of the present disclosure (e.g., middleware application, equipment software application, etc.). The program code may conform to any one of a number of different programming languages. In one example, the disclosure may be implemented as a program product stored on computer-readable storage media for use with a computer system. The program(s) of the program product define functions of the embodiments (including the methods described herein).

[0033] Illustrative computer-readable storage media include, but are not limited to: (i) non-writable storage media (e.g., read-only memory devices within a computer such as CD-ROM disks readable by a CD-ROM drive, flash memory, ROM chips or any type of solid-state non-volatile semiconductor memory) on which information is permanently stored; and (ii) writable storage media (e.g., floppy disks within a diskette drive or hard-disk drive or any type of solid-state random-access semiconductor memory) on which alterable information is stored. Such computer- readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are embodiments of the present disclosure.

[0034] Although illustrated as a single computer, the controller 190 could be a distributed system, e.g., including multiple independently operating processors and memories. The computer architecture is adaptable to various polishing operations based on programming of the controller 190 to control the order and timing that the substrate carriers are positioned at the polishing stations.

[0035] For example, a mode of operation is for the controller to cause a substrate to be loaded into a substrate carrier 126 at one of the load cups 123, and for the substrate carrier 126 to be positioned in turn at each polishing station 124a, 124b, 124c and 124d so that the substrate is polished at each polishing station in sequence. After polishing at the last station, the substrate carrier 126 is returned to one of the load cups 123 and the substrate is unloaded from the substrate carrierPATENTAttorney Docket No.: 44025281 WO01126. In another example, a mode of operation is for the controller to cause the fluid delivery apparatus 134 to supply fluid onto the polishing pad 130.

[0036] Figure 1A is a schematic, partial cross-sectional side view of Figure 1 illustrating an exemplary fluid delivery apparatus 134 in combination with polishing station 124. The polishing apparatus 100 has a housing 101. The housing 101 generally includes the base 102, an upper wall 103, and a sidewall 104 between the base 102 and the upper wall 103. The base 102, upper wall 103, and sidewall 104 define a processing region 105 of the polishing apparatus 100.

[0037] The substrate carrier 126 has a housing 129. The substrate carrier 126 is coupled to the overhead track 128 which is coupled to a column 162 and which extends over the platen 120. A drive system 106 is coupled the substrate carrier 126 by a drive shaft 107. The drive system 106 provides at least rotational motion to the substrate carrier 126. The drive system 106 may also provide lateral motion to the substrate carrier 126 to impart a sweeping motion to the substrate carrier 126 relative to the platen 120, e.g., by driving the carriage 108 on the overhead track 128. The substrate carrier 126 is actuatable toward and away from the platen 120 such that a substrate 114 retained in the substrate carrier 126 may be disposed against the polishing pad 130 during polishing.

[0038] The platen 120 at each polishing station 124 is rotatable about an axis 121. For example, a motor 160 turns a drive shaft 163 to rotate the platen 120. The platen 120 is rotationally disposed on the base 102. A bearing 154 is disposed between the platen 120 and the base 102 to facilitate rotation of the platen 120 relative to the base 102.

[0039] Each fluid delivery apparatus 134 delivers polishing fluid, such as slurry 135, to an associated polishing pad 130 to facilitate the substrate polishing operation. In addition, the fluid delivery apparatus 134 can deliver a cleaning fluid, e.g., deionized water, to the polishing pad 130 to rinse polishing byproducts from the polishing surface 131. The fluid delivery apparatus 134 includes a dispensing arm 136 having a plurality of fluid dispensing nozzles 340 in a distal end for spraying fluid, such as slurry 135, onto the polishing surface 131 as shown in Figure 1A. AsPATENTAttorney Docket No.: 44025281 WO01 will be discussed in more detail below, the nozzles 340 have a bottom surface that is flush with the bottom surface of the dispensing arm 136. A proximal end of the arm 136 is coupled to a base 138 which extends upward from the base 102 of the housing 101 . The base 138 is rotatable to pivot the arm 136 between a first position disposed over the platen 120 (shown in Figure 1 A) and a second position disposed adjacent the platen 120. During polishing, the fluid delivery apparatus 134 is located in the first position and slurry 135 is applied onto the polishing surface 131 as the platen 120 rotates.

[0040] The fluid delivery apparatus 134 is fluidly coupled to one or more fluid sources outside the processing region 105, such as slurry source 140 and deionized water source 142. Although only slurry and deionized water sources are illustrated, the fluid delivery apparatus 134 may utilize numerous additional fluid chemistries as known in the art. For example, other suitable fluid chemistries may include alcohols, amphiphilic compounds (e.g., detergents, soaps, lipoproteins, surfactants, synthetic amphiphiles, naturally-occurring amphiphiles), acids (e.g., citric acid, hydrogen peroxide), bases, oxidizing agents, reducing agents, hydrophilic compounds, hydrophobic compounds (e.g., oils, fats, waxes), or mixtures thereof.

[0041] Figure 1 B is a schematic, partial cross-sectional side view of Figure 1 illustrating an exemplary pad conditioning apparatus 112 in combination with polishing station 124. The cross-sectional view of Figure 1 B is taken at a different angle from that of Figure 1A, for example about 90 degrees apart. Each pad conditioning apparatus 112 includes an arm 113 which supports a conditioner head 115 over a respective platen 120. The arm 113 is rotatably secured to the base 102. A distal end of the arm 113 is coupled to a housing 116 of the conditioner head 115. A motor 117 is coupled to the distal end of the arm 113 for rotating the conditioner head 115 during pad conditioning. A proximal end of the arm 113 is coupled to a base 118 which extends upward from the base 102 of the housing 101 . The base 118 is rotatable to pivot the arm 113 and laterally translate the conditioner head 115 across the polishing surface 131 .PATENTAttorney Docket No.: 44025281 WO01

[0042] Each polishing station 124 of the polishing apparatus 100 includes a station cup 146 radially surrounding the platen 120. The station cup 146 has an inner sidewall surface 147 facing the platen 120. The inner sidewall surface 147 extends above the polishing surface 131. Slurry 135 from the polishing pad 130 contacts the inner sidewall surface 147 and collects inside the station cup 146. A drain 148 in the bottom of the station cup 146 and / or through the base 102 is used for draining slurry 135 collected inside the station cup 146.

[0043] Figures 2A and 2B illustrate an exemplary embodiment of a dispensing arm 330 suitable for use as the dispensing arm 136 of the fluid delivery apparatus 134 shown in Figure 1A. Figure 2A is a top view of the dispensing arm 330, and Figure 2B is a bottom view of the dispensing arm 330. The dispensing arm 330 includes a housing 310 having a proximal end 311 for coupling with the base 138 (shown in Figure 1A). The proximal end 311 has a hole 312 for engagement with the base 138. For example, the base 138 can be inserted through the hole 312 and connected to the housing 310 using bolts or screws. The base 138 can move, such as rotate, the dispensing arm 330 relative to the platen 120. Figure 2A shows a manifold 320 attached to the upper portion of the housing 310. The manifold 320 may be attached to the housing 310 using a plurality of screws 317. Figure 2B shows a plurality of nozzles 340 attached to the lower portion of the housing 310. The bottom surface of the nozzles 340 is flush with the bottom surface of the housing 310.

[0044] Figure 3 illustrates a cross-sectional view of the dispensing arm 330 through the manifold 320 and the nozzles 340. Figure 4 is an enlarged, partial view of the dispensing arm 330 of Figure 3. As shown, the manifold 320 is disposed on the top surface 315 of the housing 310. In this example, the bottom surface 415 of the manifold 320 rests on the top surface 315. In some embodiments, the manifold 320 is at least partially disposed in a recess formed in the top surface 315 of the housing 310. The manifold 320 has a manifold body 323 and an axial bore 325 extending along the length of the body 323. A proximal end 321 of the axial bore 325 fluidly communicates with a fluid bore 313 in the housing 310. In turn, the fluid bore 313 fluidly communicates with one or more fluid sources, such as the slurryPATENTAttorney Docket No.: 44025281 WO01 source 140 and deionized water source 142. The manifold 320 also includes a plurality of outlet bores 324 in fluid communication with the axial bore 325. As shown, the outlet bores 324 extend downward from the axial bore 325. The axial bore 325 distributes fluid to the nozzles 340 via the outlet bores 324. In this example, each axial bore 325 communicates with a single nozzle 340.

[0045] Figure 5 illustrates an exemplary nozzle 340, according to some embodiments. The nozzle 340 includes a nozzle body 333 and a nozzle bore 334. The nozzle bore 334 fluidly communicates with the outlet bore 324 of the manifold 320. The nozzle bore 334 supplies fluid from the outlet bore 324 to an outlet port 339 at the lower end of the nozzle 340, as shown in Figure 4. In some examples, the outlet port 339 is configured to spray the fluid in a fan shape toward the polishing pad 130. For example, the outlet port 339 can be in the form of a slit to spray the fluid in a flat fan shape with a 120 degree angular dispersion. It is contemplated the outlet port 339 can be configured to deliver the fluid in any suitable spray shape, such as circular spray shape or oval spray shape. In some embodiments, the top of the nozzle 340 includes a groove 337 encircling the nozzle bore 334 for receiving a sealing member such as an o-ring 342. When disposed in the groove 337, the top of the o-ring 342 can engage the bottom surface 415 of the manifold 320 to prevent leaks between the manifold 320 and the top of the nozzle 340. In some embodiments, the top of the nozzle 340 is at or slightly below the bottom surface 415 of the manifold 320.

[0046] The nozzle body 333 includes a first portion 331 and a second portion 332. In some examples, the first portion 331 is located on the upper portion of the nozzle body 333, and the second portion 332 is located at the lower portion of the nozzle body 333. The first portion 331 and the second portion 332 have a cylindrical shape, and the first portion 331 has a larger diameter than the second portion 332. In this respect, a flange 346 is formed between the first and second portions 331 , 332. The length of the first portion 331 is shown to be longer than the second portion 332, but can have the same or shorter length than the second portion 332. In some examples, the length of the second portion 332 is from 10% to 90%, from 20% to 60%, or from 25% to 45% of the total length of the nozzle 340.PATENTAttorney Docket No.: 44025281 WO01

[0047] The first portion 331 includes an optional alignment feature for aligning the nozzle 340 relative to the housing 310. In this example, the alignment feature is a flat surface 335 formed on the round exterior surface of the first portion 331 . In this respect, the first portion 331 has a cross-section defined by a circular arc 381 connected by a chord 382 representing the flat surface 335. In some embodiments, the length of the circular arc 381 is at least half of the circumference of a circle formed by the radius of the circular arc 381 . In some examples, the length of the circular arc 381 is from 0.7X to 0.95X the circumference of a circle having the same radius as the circular arc. The flat surface 335 extends the entire longitudinal length of the first portion 331. In some examples, the alignment feature includes two or more flat surfaces. In some examples, the alignment feature includes a spline formed on the outer surface of the nozzle 340 and a complementary groove formed in the housing 310, or vice versa. In some examples, the alignment feature is a key that is at least partially disposed in the first portion 331 of the nozzle body 333 and at least partially disposed in the housing 310. In some examples, the nozzles 340 are aligned in the same orientation. For example, the nozzles 340 can be aligned to provide a flat fan spray having an orientation of from twelve o’clock to six o’clock, from one o’clock to seven o’clock, from two o’clock to eight o’clock, or any suitable orientation. In some examples, one or more of the nozzles 340 can be aligned in the same or different orientations.

[0048] Each of the nozzles 340 are disposed in a nozzle pocket 314 formed in the housing 310, as shown in Figures 3 and 4. The nozzle pocket 314 has a shape complementary to the shape of the nozzle 340. A first portion 351 of the nozzle pocket 314 has a shape that is complementary to the shape of the first portion 331 of the nozzle 340, including the alignment feature if present. In some embodiments, a clearance is formed between the first portion 351 of the nozzle pocket 314 and the first portion 331 of the nozzle 340. The second portion 352 of the nozzle pocket 314 has a circular shape that is complementary to the circular shape of the second portion 332 of the nozzle 340. The pocket 314 also includes a complementary pocket flange 356 for engaging the nozzle flange 346 on the nozzle 340. The pocket flange 356 can include an optional transitional edge, such as a chamfer, to facilitate insertion of the nozzle 340. The flanges 346, 356 beneficially limit thePATENTAttorney Docket No.: 44025281 WO01 downward movement of the nozzle 340. It is noted that the o-ring 342, when engaged with the manifold 320, can apply a downward force on the nozzle 340, thereby urging the nozzle 340 against the pocket flange 356. As shown, the dispensing arm 330 includes nine nozzle pockets 314. However, the dispensing arm 330 may include any number of nozzle pockets 314 to accommodate any suitable number of nozzles 340, such as five, six, seven, eight, ten, or more nozzles 340.

[0049] In some embodiments, the second portion 332 of the nozzle 340 is configured to form a press fit with the second portion 352 of the nozzle pocket 314. In some examples, the press fit is a light press fit, such as an FN 1 (force fits) in accordance with ANSI B4.1. It is contemplated the press fit can be a medium pressure fit (FN 2) or a heavy press fit (FN 3). The press fit advantageously prevents material from depositing between the nozzle 340 and the housing 310.

[0050] When the nozzle 340 is disposed in the nozzle pocket 314, the bottom surface of the nozzle 340 is flush with the bottom surface of the housing 310. In some embodiments, the flush arrangement includes tolerances that allow the nozzle 340 to protrude or recess slightly from the bottom surface of the housing 310. For example, the nozzle 340 can protrude or recess up to 0.01 inch from the bottom surface of the housing 310. In some examples, the tolerances allow the nozzle 340 to protrude or recess up to 0.008, 0.006, 0.005, 0.004, 0.003, 0.002, or 0.001 inches from the bottom surface of the housing 310 and still be flush with the housing 310. The flush arrangement advantageously decreases the surface area of the dispensing arm 330 available for undesirable material deposition. The flush arrangement also makes the dispensing arm 330 easier to clean.

[0051] In some embodiments, the nozzle 340, the manifold 320, and the housing 310 can be made from one or more of polyvinylidene fluoride (PVDF), polyethylene terephthalate (PET), polyether ether ketone (PEEK), or other suitable polymers. In one example, the nozzle 340 and the manifold 320 are made from PVDF, and the housing 310 is made from PET. In some embodiments, the nozzle 340 is made by machining or by printing, such as 3D printing. In another embodiment, the nozzle 340 is made using a mold.PATENTAttorney Docket No.: 44025281 WO01

[0052] In some embodiments, the dispensing arm 330 includes one or more manifold nozzles 360 attached to the manifold 320, as shown in Figures 3 and 4. In this embodiment, the manifold 320 includes a lip portion 371 that extends beyond the distal end of the housing 310. An outlet bore 374 is formed in the lip portion 371 and fluidly communicates with the axial bore 325 of the manifold 320.

[0053] The manifold nozzle 360 includes a nozzle body 363 and a nozzle bore 364. The nozzle body 363 includes an attachment portion 361 configured for attaching the nozzle 360 to the outlet bore 374. In one example, the attachment portion 361 includes threads for mating with complementary threads formed in the outlet bore 374. In another example, the attachment portion 361 is configured to form a press fit with the outlet bore 374. In some examples, a section of the attachment portion 361 may extend below the lip portion 371 of the manifold 320.

[0054] The nozzle bore 364 fluidly communicates with the outlet bore 374 of the manifold 320. The nozzle bore 364 supplies fluid from the outlet bore 374 to an outlet port 369 at the lower end of the nozzle body 363, as shown in Figure 4. In some examples, the outlet port 369 is configured to spray the fluid in a fan shape toward the polishing pad 130. For example, the outlet port 369 can be in the form of a slit to spray the fluid in a flat fan shape with a 120 degree angular dispersion. It is contemplated the outlet port 369 can be configured to deliver the fluid in any suitable spray shape, such as circular spray shape or oval spray shape. In some embodiments, the nozzle 360 is oriented to spray fluid towards the center of the platen 120. However, it is contemplated the nozzle 360 may be oriented to spray fluid toward any section of the platen 120. While one manifold nozzle 360 is shown, any suitable number of manifold nozzles 360 can be attached to the manifold 320, such as two, three, or more manifold nozzles 360.

[0055] Embodiments of the present disclosures provides a fluid delivery apparatus with a flush bottom surface. The flush bottom surface reduces the surface area available to accumulate slurry or removed material, when compared to nozzles that protrude from the bottom surface. The flush bottom surface is advantageously easier to clean. For example, the flush bottom surface can be cleaned by wiping the accumulated material from the bottom surface.PATENTAttorney Docket No.: 44025281 WO01

[0056] Although the disclosure herein relates to a polishing apparatus, it is contemplating the cleaning stations may be use with other chambers or components of a substrate processing system, including, cleaning chambers, robots, etc.

[0057] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

PATENTAttorney Docket No.: 44025281 WO01What is claimed is:

1. A fluid delivery apparatus for use in chemical mechanical polishing comprising: a housing having a plurality of nozzle pockets; a manifold disposed above the plurality of nozzle pockets; and a plurality of nozzles disposed in a respective nozzle pocket, the plurality of nozzles in fluid communication with the manifold, and the plurality of nozzles having a bottom surface in a flush arrangement with a bottom surface of the housing.

2. The fluid delivery apparatus of claim 1 , wherein the plurality of nozzles form a press fit with the respective nozzle pocket.

3. The fluid delivery apparatus of claim 1 , wherein the manifold includes a plurality of outlet bores in fluid communication with an axial bore and in fluid communication with a respective nozzle.

4. The fluid delivery apparatus of claim 1 , wherein the bottom surface of the plurality of nozzles are recessed up to 0.005 inches from the bottom surface of the housing.

5. The fluid delivery apparatus of claim 1 , wherein each of the plurality of nozzles includes a nozzle body and a nozzle bore, the nozzle body configured to form a press fit with the respective nozzle pocket.

6. The fluid delivery apparatus of claim 5, wherein the nozzle body includes a first portion and a second portion, the second portion having a smaller outer diameter than the first portion.

7. The fluid delivery apparatus of claim 6, wherein the first portion includes an alignment feature for alignment with the nozzle pocket.PATENTAttorney Docket No.: 44025281 WO018. The fluid delivery apparatus of claim 7, wherein the alignment feature comprises a flat surface formed an exterior of the first portion.

9. The fluid delivery apparatus of claim 6, wherein the nozzle pocket has a shape complementary to a shape of the respective nozzle.

10. The fluid delivery apparatus of claim 1 , further comprising a plurality of sealing members disposed between the manifold and the plurality of nozzles.

11. The fluid delivery apparatus of claim 10, wherein each of the plurality of sealing members is disposed in a groove formed in a top surface of a respective nozzle.

12. The fluid delivery apparatus of claim 11 , wherein the plurality of sealing members exert a downward force on a respective nozzle.

13. The fluid delivery apparatus of claim 1 , further comprising a manifold nozzle attached to the manifold.

14. The fluid delivery apparatus of claim 1 , further comprising a base coupled to the housing and configured to move the housing.

15. An apparatus for polishing a substrate, comprising: a polishing platen having a polishing pad disposed thereon; a substrate carrier for urging a substrate against the polishing pad; and a dispensing arm for dispensing fluid onto the polishing pad, the dispensing arm having: a housing having a plurality of nozzle pockets; a manifold in fluid communication with the housing; and a plurality of nozzles disposed in a respective nozzle pocket, the plurality of nozzles in fluid communication with the manifold, and the pluralityPATENTAttorney Docket No.: 44025281 WO01 of nozzles having a bottom surface in a flush arrangement with a bottom surface of the housing.

16. The apparatus of claim 15, wherein each of the plurality of nozzles includes a nozzle body and a nozzle bore, the nozzle body configured to form a press fit with the respective nozzle pocket.

17. The apparatus of claim 16, wherein the nozzle body includes a first portion and a second portion, the second portion having a smaller outer diameter than the first portion.

18. The apparatus of claim 17, wherein the first portion includes an alignment feature for alignment with the nozzle pocket.

19. The apparatus of claim 18, wherein the alignment feature comprises a flat surface formed an exterior of the first portion.

20. The fluid delivery apparatus of claim 15, further comprising a plurality of sealing members disposed between the manifold and the plurality of nozzles.

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