Circuit board configuration for thermally insulating an embedded temperature sensor

Abstract

The disclosed system includes a thermally optimized circuit board configured for use in thermostats to enhance temperature measurement accuracy. The circuit board integrates embedded thermistors strategically positioned in distinct thermal zones. A hot thermistor is influenced by heat-generating components in a hot zone, and a cool thermistor is thermally isolated in a more stable, cool zone. The system leverages the temperature differential between these zones to compensate for heat offsets caused by component board heating, enabling more accurate ambient temperature readings. Thermal isolation is achieved through features such as thermal gaps, serpentine routes, and thermal peninsulas, which reduce heat conduction into the cool zone. The circuit board's configuration supports precise temperature sensing, reliable RF operation, and scalability for compact devices. The system improves thermostat functionality by combining thermal management, electrical connectivity, and accurate environmental monitoring for modern smart thermostats.

Description

Attorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025CIRCUIT BOARD CONFIGURATION FOR THERMALLY INSULATING AN EMBEDDED TEMPERATURE SENSORCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of, and priority to, U.S. Provisional Patent Application No. 63 / 734,287 filed December 16, 2024, the entire contents of which are incorporated herein by reference.FIELD OF THE DISCLOSURE

[0002] The disclosed system relates generally to thermostat systems and, more specifically, to circuit board configurations for thermostats.SUMMARY OF THE DISCLOSURE

[0003] In some embodiments, the disclosure is directed to a thermostat which includes a circuit board with a novel thermal and electrical management system to enhance accuracy in temperature measurement and maintain reliable operation. The circuit board includes two or more thermistors and utilizes a combination of routing, structural isolation, and component placement to address challenges posed by heat generation and radio frequency (RF) performance.

[0004] In some embodiments, the circuit board includes at least two thermistors, one positioned in a higher-temperature region and / or heat generating portion, referred to as the hot zone, and another in a lower-temperature region, referred to as the cool zone, where the hot zone experiences a higher average temperature and / or greater thermal fluctuation than the cool zone. The thermistors described herein may be embedded or discrete, or some combination thereof. The thermistors are configured to measure temperature differentials across the board, compensating for internal heat rise and ensuring accurate ambient temperature readings. The cool zone includes a cool spot, which includes a thermally stable area maintained through isolation structures such as one or more thermal gaps, serpentine routes, and thermal peninsulas.

[0005] In some embodiments, copper is utilized strategically on the circuit board to enhance RF performance by providing shielding and signal stability for wireless communication modules. However, due to copper’s high thermal conductivity7, and limited space on the circuit board, there is a need for a circuit configuration that minimizes heat transfer from copper- covered regions into the cool zone. Traces, which may be may of copper and / or other thermallyAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 conductive materials, are routed around thermal gaps to prevent thermal bridging, while the absence of conductive plating / shielding in specific areas within the cool zone ensures the stability of temperature measurements.

[0006] The routing of the thermistor traces, including the cool thermistor trace, is configured to balance thermal isolation with electrical connectivity'. These traces leverage the insulating properties of the thermal gaps and apertures to dissipate heat and minimize thermal gradients, ensuring the embedded thermistors provide reliable and accurate data. In some embodiments, surface-mounted thermistors are used, and, in some embodiments, embedded thermistors ; however, either ty pe of thermistor can be used with the thermal isolation system and methods described herein.

[0007] The system’s configuration effectively combines thermal management with RF performance, enabling the thermostat to function efficiently in wireless communication environments. The printed circuit board configuration described herein reduces thermal interference, improves temperature accuracy by up to 25%, and provides scalable solutions for circuit board layouts in compact devices. Through a novel arrangement of thermistors, copper structures, and thermal isolation techniques, the system addresses the dual challenges of internal heat dissipation and external RF requirements.DESCRIPTIONS OF THE DRAWING

[0008] The features and advantages of the disclosure will be apparent from the following description of embodiments as illustrated in the accompanying drawing, in which reference characters refer to the same parts throughout the various views. The drawing is not necessarily to scale, emphasis instead being placed upon illustrating principles of the disclosure:

[0009] FIG. 1 illustrate a circuit board according to some embodiments of the present disclosure; and

[0010] FIG. 2 illustrate a circuit board according to some embodiments of the present disclosure.DETAILED DESCRIPTION

[0011] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawing, which form a part hereof, and which show, by way of non-limiting illustration, certain example embodiments. Subject matter may, however, be embodied in a variety of different forms and. therefore, covered or claimed subject matter is intended to beAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 construed as not being limited to any example embodiments set forth herein; example embodiments are provided merely to be illustrative. Likewise, a reasonably broad scope for claimed or covered subject matter is intended. Among other things, for example, subject matter may be embodied as methods, devices, components, or systems. Accordingly, embodiments may, for example, take the form of hardware, software, firmware or any combination thereof (other than software per se). The following detailed description is. therefore, not intended to be taken in a limiting sense.

[0012] Throughout the specification and claims, terms may have nuanced meanings suggested or implied in context beyond an explicitly stated meaning. Likewise, the phrase “in one embodiment” as used herein does not necessarily refer to the same embodiment and the phrase “in another embodiment” as used herein does not necessarily refer to a different embodiment. It is intended, for example, that claimed subject matter include combinations of example embodiments in whole or in part.

[0013] In general, terminology' may be understood at least in part from usage in context. For example, terms, such as “and”, “or”, or “and / or,” as used herein may include a variety of meanings that may depend at least in part upon the context in which such terms are used. Typically, “or” if used to associate a list, such as A, B or C, is intended to mean A, B, and C, here used in the inclusive sense, as well as A, B or C, here used in the exclusive sense. In addition, the term “one or more” as used herein, depending at least in part upon context, may be used to describe any feature, structure, or charactenstic in a singular sense or may be used to describe combinations of features, structures or characteristics in a plural sense. Similarly, terms, such as “a,” “an,” or “the,” again, may be understood to convey a singular usage or to convey a plural usage, depending at least in part upon context. In addition, the term “based on” may be understood as not necessarily intended to convey an exclusive set of factors and may, instead, allow for existence of additional factors not necessarily expressly described, again, depending at least in part on context.

[0014] Referring now to FIG. 1, a first circuit board (FCB) 100, configured for use in a thermostat is depicted in accordance with some embodiments of the disclosure. Various components mounted on the FCB 100 generate heat during operation, which spreads throughout the board due to the high thermal conductivity of materials like copper in FCB plating 101. While the copper in FCB plating 101 covering the FCB 100 improves radio frequency (RF) performance, the heat dissipation creates challenges in accurately measuring temperature, as the heat generated by components such as relays, microcontrollers, andAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 communication modules can accumulate, causing temperature gradients across the board. FCB plating 101 may be any suitable material configured to improve RF performance and / or reduce noise from electromagnetic radiation; however, for the non-limiting examples described herein the FCB plating 101 includes copper.

[0015] In some embodiments, the FCB 100 includes one or more embedded thermistors integrated directly into the FCB 100 for temperature measurement. While in some embodiments, the FCB 100 may include discrete (surface-mounted) thermistors, which are separate components mounted onto the board, as shown in FIG. 2, the FCB 100 will be described with respect to embedded thermistors which are integral to a printed circuit board (PCB) configuration. In this non-limiting example, two or more thermistors are integrated into the PCB, where one thermistor is a hot thermistor in proximity to components and / or surrounded by FCB plating 101, and another thermistor is a FCB cool thermistor 110 at an edge of the FCB 100 and / or not surrounded by FCB plating 101. A cool thermistor may be referred to as a first thermistor, and a hot thermistor may be referred to as a second thermistor, when defining the meets and bounds of the system.

[0016] In some embodiments, the embedded thermistors utilize exposed FCB cool thermistor trace 117, which include copper in this example, as part of the thermal sensing mechanism. As described supra, any suitable thermally and electrically conductive material may be used in conjunction with or in place of copper, such as aluminum or gold. In some embodiments, the FCB cool thermistor trace 117 are configured to sense temperature changes by detecting variations in resistance caused by thermal energy. However, as copper is an excellent conductor of heat, the traces can also transfer heat from surrounding components, potentially impacting the accuracy of temperature readings.

[0017] To address this, the FCB 100 is configured such that the FCB hot thermistor is positioned in a FCB hot zone 102, where components generate the most heat, and the FCB cool thermistor 110 is positioned in the FCB cool zone 111, where the FCB 100 includes thermal isolation structures to reduce heat transfer. This dual-thermistor configuration allows the system to measure the temperature differential across the board and compensate for inaccuracies caused by heat conduction along the traces, resulting in a more accurate assessment of ambient temperature.

[0018] As used herein, the terms “hot zone'’ and “cool zone’' refer to temperature differences relative to each other, where a hot zone is at a higher temperature relative to a cool zone by at least 1 degree at when the hot zone is at its maximum temperature, although the configurationAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 shown in FIG. 1 and / or FIG. 2 can reduce the temperature difference greater than or equal to 2°C. Likewise, a '“hot thermistor” refers to a thermistor configured to measure temperature in a hot zone, where a “cool thermistor” is configured to measure temperature in a cool zone, and therefore are each proper names denoting function as opposed to a reference to the temperature of the respective thermistor. A hot zone and a cool zone may be referred to as a first zone and second zone, respectively, when defining the metes and bounds of the system.

[0019] In some embodiments, the FCB 100 includes additional features that manage heat flow and improve temperature measurement accuracy. These features include FCB serpentine routes112, which increase thermal resistance and decrease heat conduction, and FCB peninsulas 104,113, which isolate the FCB cool zone 111 from the FCB hot zone 102. Together, these structures contribute to creating a FCB cool spot 114 in the FCB cool zone 111, where accurate temperature measurements can be taken. Additional components, such as relays, microcontrollers, and communication modules, are strategically arranged on the circuit board to balance functionality with thermal management.

[0020] In some embodiments, the circuit board includes copper-covered portions that contribute to electrical functionality and / or heat transfer management. As mentioned previously, in some embodiments FCB plating 101 is distributed over the surface of the FCB 100 to improve radio frequency (RF) shielding, and / or may also play a role in component thermal management by distributing component heat across the FCB 100 for dissipation.

[0021] In some embodiments, the FCB 100 is arranged such that the FCB plating 101 on the board is positioned away from thermal isolation features, such as FCB thermal cove 115 and FCB plating edge aperture 116, such that FCB plating 101 does not touch an edge of a gap. In the non-limiting example shown in FIG. 1, an area of the FCB thermal cove 115 is at least twice an area of the FCB plating edge aperture 116. Analogous terms such as “cove,” “channel,” and “basin” are used to describe features formed by gaps in a PCB, but may be referred to as a first thermal gap, second thermal gap, third thermal gap, etc., when defining the meets and bounds of the system. The term “gap” refers to the area and / or volume of missing PCB separating a portion of a cool thermistor from a plating edge and / or an edge of the PCB, where “thermal gap” means that the gap is configured to reduce a temperature fluctuation of the portion of a PCB that includes a portion of a thermistor and / or trace. The FCB peninsula gap 121 denotes a structural feature where an edge of the FCB thermistor peninsula 113 is separated from an opposing edge of the FCB 100. The non-limiting example in FIG. 1 showsAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 a FCB thermistor peninsula 113 and a FCB board peninsula 104 forming a FCB channel 105, which further interrupts the transfer of heat through the FCB cool zone 111.

[0022] In some embodiments, these gaps formed by the various analogous named features are configured to disrupt heat transfer and isolate the FCB cool zone 111 from the surrounding high-temperature regions. As shown in FIG. 1, an FCB edge 103 of FCB plating 101 can be seen following a path along the edge of the FCB thermal cove 115 and FCB plating edge aperture 116. This separation of FCB plating 101 allows the FCB cool zone 111 to retain a relatively lower temperature environment, which improves the accurate of readings by the embedded thermistors. Additionally, the absence of FCB plating 101 on the surface of the cool zone and / or around the FCB cool thermistor 110 minimizes thermal bridging and further enhances isolation in accordance with some embodiments.

[0023] As discussed supra, the FCB 100 includes at least two (embedded) thermistors integrated into the circuit board to ensure accurate temperature measurement. The thermistors operate by detecting temperature variations through changes in electrical resistance within the FCB cool thermistor trace 117, which includes copper in this non-limiting example. The exposed FCB (copper) cool thermistor trace 117 on FCB 100 facilitates the thermal interaction necessary' for temperature detection; however, the high thermal conductivity7of copper traces can introduce inaccuracies by conducting heat from nearby components to the thermistors.

[0024] To mitigate these effects, the use of multiple thermistors allows the system to measure the temperature differential across the board and take these measurements into account when calculating ambient temperature. By comparing the temperature readings from the thermistor in the FCB hot zone 102 to those in the FCB cool zone 111, the system can account for thermal offsets, preventing overcompensation by a thermostat during heating or cooling cycles.

[0025] Turning back to FIG. 1, the circuit board includes a FCB cool spot 114 located within the FCB cool zone 111, which is configured to maintain a stable, lower-temperature environment relative to the FCB hot zone 102. In some embodiments, the FCB cool spot 114 signifies the lowest temperature area and / or lowest temperature fluctuation area of the board during normal operation. The FCB cool spot 114 supports accurate temperature measurement by the embedded thermistor by maintaining a more stable temperature variation than the FCB hot zone 102. The FCB cool spot 114 is a result of the configuration and / or placement of FCB thermal cove 115, FCB plating edge aperture 116, and FCB channel 105, which serve as physical interruptions in the thermal conduction pathways, preventing heat from easily traveling into the FCB cool zone 111 and / or to the FCB cool spot 114.Attorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025

[0026] In some embodiments, the FCB 100 includes a FCB thermistor peninsula 113, which is configured to enhance the thermal isolation of the FCB cool spot 114. In some embodiments, the FCB thermistor peninsula 113 extends into the FCB cool zone 111 and is configured to act as a barrier that disrupts the transfer of heat. The placement and shape of the FCB thermistor peninsula 113 between the FCB thermal cove 115 and an FCB edge 118 of the PCB is configured to create a thermal buffer zone around the FCB cool spot 114, ensuring that the heat from the FCB hot zone 102 is redirected or dissipated before the heat can impact the portion of FCB cool thermistor 110 located on FCB thermistor peninsula 113. In some embodiments, the FCB thermistor peninsula 113 includes one or more FCB serpentine apertures 119, positioned between the windings of FCB serpentine route 112, and configured to dissipate heat and maintain a lower temperature variance than other portions of the PCB.

[0027] In some embodiments, the shape of the FCB cool thermistor trace 117 plays role in maintaining the integrity' of the cool spot and ensuring accurate temperature measurement. In some embodiments, FCB cool thermistor trace 117 includes a plating aperture route 122 that extends around at least a portion of a perimeter of the FCB plating edge aperture 116 to a FCB connection point 120, which is positioned near the FCB edge 103. The length and routing of the FCB cool thermistor trace 117 are configured to minimize thermal influence from adjacent heat-generating regions. By extending the trace adjacent to the gaps formed by the FCB thermal cove 115 and FCB plating edge aperture 116. the insulating properties of each gap limit heat conduction towards a respective portion of the FCB cool thermistor 110. This configuration helps preserve the low-temperature environment of the FCB cool spot 114 and reduces the impact of FCB temperature gradients 106.

[0028] FCB temperature gradients 106 at the connection points (e.g., connection point 120) of the FCB cool thermistor trace 117 influence the accuracy of the thermistor's readings. The trace is configured to mitigate these gradients by maintaining sufficient length, as well as maintaining proximity to FCB serpentine apertures 119, FCB thermal cove 115, FCB plating edge aperture 116, and / or FCB peninsula gap 121, which helps dissipate heat. In some embodiments, extending the trace path allows the FCB cool thermistor trace 117 to better dissipate heat (as compared to a shorter path), thereby reducing the thermal offset in the measurement.

[0029] In some embodiments, the FCB cool thermistor trace 117 includes a FCB serpentine route 112 configured to increase the path length for heat dissipation and / or exposure to ambient air. By including a serpentine, zigzag, winding, and / or other alternating pattern (route) in aAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 thermistor trace, the effect of thermal gradients along the trace are further reduced. In some embodiments, the FCB serpentine route 112 (or any trace route) is configured to wind around and / or follow a contour of a perimeter of two or more (e g., 5) FCB serpentine apertures 119 within the FCB thermistor peninsula 113, which provides the advantage of both increasing trace length while maintaining stable temperature variations through heat dissipation along the extended length, leading to a better reading of ambient temperatures.

[0030] In some embodiments, the FCB cool thermistor trace 117 is configured as a surfacemounted conductive pathway extending through the FCB cool zone 111 to connect the embedded thermistor within the FCB cool spot 114 to other functional elements (e.g., vias) of the FCB 100. The surface positioning of the FCB cool thermistor trace 117 at the FCB edge 118 allows the trace to interact directly with ambient air, enabling more accurate detection of external temperature conditions. In some embodiments, the PCB includes one or more thermistor traces embedded in internal PCB layers; however, FCB cool thermistor 110 is purposefully exposed to optimize its role in thermal sensing.

[0031] In some embodiments, FCB cool thermistor 110 extends around a perimeter of the FCB plating edge aperture 116, maintaining alignment with the gap to leverage the gap’s insulating properties. The routing ensures that the trace remains thermally isolated from nearby high- temperature regions of the board, as the FCB cool thermistor trace 117 moves tow ard FCB connection point 120 near FCB edge 103. In some embodiments, an end of the FCB plating edge aperture 116 is positioned adjacent the entrance to the FCB thermistor peninsula 113.

[0032] At the FCB connection point 120 near the FCB plating 101 FCB edge 103, the FCB cool thermistor trace 117 is configured to balance thermal and electrical considerations. This location minimizes the trace's exposure to excessive thermal conduction while maintaining reliable connectivity with other circuit board elements. In some embodiments. FCB edge 103 serves as athermal boundary, with the edge’s proximity to FCB connection point 120 managed to ensure that the trace remains within a stable thermal profile.

[0033] FIG. 2 depicts a second circuit board (SCB) 200 configured for use in a thermostat in accordance with some embodiments of the disclosure. The thermal isolation features applied to the configuration in FIG. 1 also apply to the configuration shown in FIG. 2, so the theory of how the features create thermal isolation will not be repeated in the interest of being concise. SCB 200 has similar components and thermal isolation arrangements as FIG. 1 : likewise, components mounted on the SCB 200 generate heat during operation, which spreadsAttorney Docket No. 203863-019001ZPCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 throughout the board due to the high thermal conductivity of materials like SCB plating 201, which may include any suitable material such as copper in this non-limiting example.

[0034] Similar to the FCB 100, the SCB 200 is configured such that the hot thermistor is positioned in an SCB hot zone 202, where components generate the most heat, and the SCB cool thermistor 210 is positioned in the SCB cool zone 211, where the SCB 200 includes thermal isolation structures to reduce heat transfer. As discussed supra, this dual-thermistor configuration allows the system to measure the temperature differential across the board and compensate for inaccuracies caused by heat conduction along the traces, resulting in a more accurate assessment of ambient temperature.

[0035] In some embodiments, SCB cool thermistor 210 includes a discrete (surface-mounted) thermistor connected to an SCB connection point 220 by an SCB cool thermistor trace 217. As mentioned previously, any embedded thermistor may be replaced with a discrete thermistor, and vice versa, so any reference to a “thermistor” w hen defining the metes and bounds of the system is a reference to either type of thermistor. While the SCB cool thermistor trace 217 acts primarily as a signal transfer mechanism in this arrangement, as opposed to being used for temperature measurement. However, the thermal conductivity of the SCB cool thermistor trace 217, which may include copper, for example, provides a path for heat transfer from the SCB hot zone 202 to the SCB cool thermistor 210, and may cause inaccuracies in measurements without the thermal isolation features described herein.

[0036] In some embodiments, the SCB cool thermistor trace 217 is connected to an SCB connection point 220 in an area proximate to the SCB plating 201. In some embodiments, the SCB 200 includes an SCB plating edge aperture 216 separating the SCB plating 201 from an SCB edge 218 and / or an SCB plating edge 203, creating a gap betw een the SCB hot zone 202 and an SCB plate aperture route 222 of SCB cool thermistor trace 217. The SCB plating edge aperture 216 interferes with the flow' of each transfer across the PCB, as illustrated by the SCB temperature gradient 206.

[0037] In some embodiments, the SCB 200 includes one or more board thermal peninsulas configured to provide thermal isolation for board components other than the cool thermistor 210. In some embodiments, an SCB first board thermal peninsula 204 is formed by an SCB peninsula gap 221 that extends into the PCB, where the SCB peninsula gap 221 is positioned between the SCB first board thermal peninsula 204 and the SCB thermistor peninsula 213. In some embodiments, the SCB peninsula gap 221 forms at least a portion of a perimeter of both the SCB first board thermal peninsula 204 and the SCB thermistor peninsula 213. In someAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 embodiments, an SCB second board thermal peninsula 225 projects from an opposite side of the PCB, where the SCB second board thermal peninsula 225 includes at least a portion of SCB plating 201. In some embodiments, at least a portion of the SCB second board thermal peninsula 225 is formed by SCB channel 205, where SCB channel 205 creates a thermal gap that separates the SCB second board thermal peninsula 225 from the SCB thermistor peninsula 213.

[0038] In some embodiments, the SCB thermistor peninsula 213 includes an SCB first peninsula projection 223 extending away from the SCB edge 218. In some embodiments, the SCB thermistor peninsula 213 includes an SCB second peninsula projection 224 extending in a different direction than the SCB first peninsula projection 223. In some embodiments, the at least a portion of the SCB second peninsula projection 224 is spaced from the SCB edge 218, forming an SCB thermal basin 215. In some embodiments, the SCB thermal basin 215 creates a thermal gap between the second peninsula projection 224, the SCB edge 218, and / or the SCB plating 201, in accordance with some embodiments. In some embodiments, the SCB second peninsula projection 224 includes an SCB serpentine route 212 configuration for the SCB cool thermistor trace 217. While not shown with serpentine apertures, serpentine apertures may be included within the SCB serpentine route 212 similar to the FBC serpentine apertures 119 shown in Fig. 1, in accordance with some embodiments.

[0039] In some embodiments, the SCB (discrete) cool thermistor 210 is position at a terminal end of the SCB serpentine route 212, where the SCB cool thermistor 210 is coupled to the SCB cool thermal trace 217. In some embodiments, the SCB cool thermistor 210 is positioned at the distal end of the SCB second peninsula projection 224. In some embodiments, the SCB cool thermistor 210 is positioned an SCB cool spot 214 formed in the SCB cool zone 211, where the SCB cool zone 211 is formed by a combination of the SCB plating edge aperture 216. the SCB channel 205, the SCB peninsula gap 221, and / or the SCB thermal basin 215, providing a relatively stable temperature environment to improve the performance of the cool thermistor 210 and the measurement of ambient temperatures.

[0040] It is understood that the system is not limited in its application to the details of construction and the arrangement of components set forth in the previous description or illustrated in the drawing. The thermal management system and methods disclosed herein fall within the scope of numerous embodiments. The previous discussion is presented to enable a person skilled in the art to make and use the system according to some embodiments. Any portion of the structures and / or principles included in some embodiments can be applied to anyAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 and / or all embodiments: it is understood that features from some embodiments presented herein are combinable with other features according to some other embodiments. Thus, some embodiments of the system are not intended to be limited to what is illustrated but are to be accorded the widest scope consistent with all principles and features disclosed herein.

[0041] Some embodiments of the system are presented with specific values and / or setpoints. These values and setpoints are not intended to be limiting and are merely examples of a higher configuration versus a lower configuration and are intended as an aid for those of ordinary' skill to make and use the system.

[0042] It is understood that defining the metes and bounds of the system using a description of images in the drawing does not need a corresponding text description in the written specification to fall with the scope of the disclosure.

[0043] Furthermore, acting as Applicant’s own lexicographer, Applicant imparts the explicit meaning and / or disavow of claim scope to the following terms:

[0044] “Substantially’' and “approximately’’ when used in conjunction with a value encompass a difference of 5% or less of the same unit and / or scale of that being measured (e.g., degrees, volume, mass, distance).

[0045] As used herein, “can” or “may” or derivations thereof are used for descriptive purposes only and is understood to be synonymous and / or interchangeable with “configured to” when defining the metes and bounds of the system.

[0046] In addition, the term “configured to” means that the limitations recited in the specification and / or the claims must be arranged in such a way to perform the recited function: “configured to” excludes structures in the art that are “capable of’ being modified to perform the recited function but the disclosures associated with the art have no explicit teachings to do so. For example, a recitation of a “container configured to receive a fluid from structure X at an upper portion and deliver fluid from a lower portion to structure Y” is limited to systems where structure X, structure Y, and the container are all disclosed as arranged to perform the recited function. The recitation “configured to” excludes elements that may be “capable of’ performing the recited function simply by virtue of their construction but associated disclosures (or lack thereof) provide no teachings to make such a modification to meet the functional limitations between all structures recited.

[0047] It is understood that the phraseology and terminology used herein is for description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalentsAttorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 thereof as well as additional items. Unless specified or limited otherwise, the terms ‘‘mounted,’' “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Further, “connected” and “coupled” are not restricted to physical or mechanical connections or couplings.

[0048] The previous detailed description is to be read with reference to the figures, in which like elements in different figures have like reference numerals. The figures, which are not necessarily to scale, depict some embodiments and are not intended to limit the scope of embodiments of the system.

[0049] It will be appreciated by those skilled in the art that while the system has been described above in connection with some embodiments and examples, the system is not necessarily so limited, and that numerous other embodiments, examples, uses, modifications and departures from the embodiments, examples and uses are intended to be encompassed by the claims attached hereto. Various features and advantages of the system are set forth in the following claims.

Claims

Attorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025CLAIMSWhat is claimed is:

1. A circuit board comprising: a first thermistor, a first thermal gap, a first gap channel, and a thermistor peninsula; wherein the thermistor peninsula is formed at least in part by the first thermal gap and the first gap channel; wherein the first thermal gap thermally separates the first thermistor from a heat generating portion of the circuit board; and wherein at least a portion of the first thermistor is located within the thermistor peninsula.

2. The circuit board of claim 1, wherein the first thermistor is configured to detect an ambient air temperature.

3. The circuit board of claim 1, wherein the thermistor peninsula is configured to maintain a more stable temperature than the heat generating portion of the circuit board.

4. The circuit board of claim 3, wherein the thermistor peninsula is configured to maintain at least a 2°C lower temperature than the heat generating portion when the heat generating portion is at a maximum temperature.

5. The circuit board of claim 1, wherein the thermistor peninsula includes a plurality' of apertures.

6. The circuit board of claim 5, wherein at least a portion of the first thermistor winds around the plurality’ of apertures.Attorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 20257. The circuit board of claim 1, wherein the circuit board includes a conductive shielding extending over at least a portion of the heat generating portion of the circuit board.

8. The circuit board of claim 7, wherein the thermistor peninsula is configured to thermally insulate a portion of the first thermistor from an edge of the conductive shielding.

9. The circuit board of claim 8, wherein the conductive shielding is configured to shield from radio frequencies.

10. The circuit board of claim 1, further comprising a second thermal gap; wherein at least a portion of the first thermistor is positioned around at least a portion of a perimeter of the second thermal gap.

11. The circuit board of claim 10, wherein an end of the second thermal gap is positioned adjacent to an entrance of the thermistor peninsula.

12. The circuit board of claim 11, wherein the second thermal gap extends adjacent to an edge of the circuit board.

13. The circuit board of claim 12, wherein the circuit board includes a conductive shielding extending over the heat generating portion of the circuit board.

14. The circuit board of claim 13, wherein the thermistor peninsula is configured to thermally insulate a portion of the first thermistor from the edge of the conductive shielding.

15. The circuit board of claim 14,Attorney Docket No. 203863-019001 / PCTResideo Ref. No. R214239-WOElectronically Filed: December 15, 2025 wherein the second thermal gap is configured to thermally insulate a portion of the first thermistor from the edge of the conductive shielding.

16. The circuit board of claim 15, wherein the thermistor peninsula includes a plurality of apertures.

17. The circuit board of claim 16, wherein at least a portion of the first thermistor winds around the plurality of apertures.

18. The circuit board of claim 1, further including a second thermistor; wherein the second thermistor is embedded in the heat generating portion of the circuit board.

19. The circuit board of claim 18, wherein the first thermistor and the second thermistor are configured to enable an offset calculation configured to account for the heat generating portion of the circuit board when measuring an ambient temperature.

20. The circuit board of claim 18, further comprising a second thermal gap; wherein at least a portion of the first thermistor is positioned around at least a portion of a perimeter of the second thermal gap; wherein an end of the second thermal gap is positioned adjacent to an entrance of the thermistor peninsula; wherein the thermistor peninsula includes a plurality of apertures; and wherein at least a portion of the first thermistor winds around the plurality of apertures.

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