Radiation-resistant packaging structure and method for manufacturing same

Abstract

The present invention relates to a radiation-resistant packaging structure and a method for manufacturing same. The structure comprises: a first redistribution layer; a protective layer disposed below the first redistribution layer; metal pillars disposed above the first redistribution layer; a processor chip module disposed above the first redistribution layer; a protective cover covering the processor chip module; a molding layer that molds and encapsulates the metal pillars, the processor chip module and the protective cover; a second redistribution layer disposed above the molding layer; a detector chip module disposed above the second redistribution layer; and solder balls. In the radiation-resistant packaging structure provided by the present invention, the protective cover is disposed above the processor chip module, and the protective layer is disposed below the processor chip module, thereby providing three-dimensional protection for the processor chip module, such that external radiation to the processor chip module can be effectively reduced and the service life of the packaging structure is prolonged.

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