Method for manufacturing strain gauge sensor by means of hot melting, and strain gauge sensor

Abstract

The present application applies to the technical field of sensor manufacturing. Provided are a method for manufacturing a strain gauge sensor by means of hot melting, and a strain gauge sensor. The method comprises: on the basis of the number of attachment wall surfaces on a bearing member where strain gauges need to be affixed, selecting strain gauges, the number of strain gauges being not less than the number of attachment wall surfaces; on the basis of the number of strain gauges, selecting fixing adhesives, the number of fixing adhesive types being not less than the number of strain gauges, and the melting points of the fixing adhesives being different; and heating to melt the fixing adhesives, such that the strain gauges are adhered to the bearing member after the melted fixing adhesives cool down. In the embodiments of the present application, heating temperatures are set in descending order according to the melting points of the fixing adhesives, such that the strain gauges are fixed by first melting a fixing adhesive having a higher melting point, and then melting a fixing adhesive having a lower melting point; in this way, heating of the fixing adhesive having a lower melting point does not cause the melting of the fixing adhesive having a higher melting point, thereby effectively preventing any impact on the positions of the strain gauges that have been already affixed; the strain gauges remain accurately positioned and do not shift, thereby improving product quality.

Description

Methods for manufacturing strain gauge sensors by hot melting and strain gauge sensors

[0001] Cross-reference of related applications

[0002] This application is based on and claims priority to Chinese Patent Application No. 202411921483.9, filed on December 25, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of sensor manufacturing technology, and in particular relates to a method for hot-melting to manufacture a strain gauge sensor and the strain gauge sensor. Background Technology

[0004] Strain gauge sensors utilize strain gauges to detect changes in environmental factors such as force, light, and temperature, which cause changes in the strain gauge's own resistance and capacitance, thereby generating corresponding electrical signals and enabling the measurement of the value of the changing factor.

[0005] In practice, strain gauges are typically installed by attaching them to a detection beam. The strain gauges convert the strain on the beam into an electrical signal output. By measuring the change in resistance, the actual strain value of the beam can be calculated. The detection beam has a rectangular cross-section, including four walls: top, bottom, left, and right. The top and bottom walls are opposite each other, as are the left and right walls. To achieve multi-directional detection, strain gauges are attached to all four walls, allowing for detection from different directions and improving sensitivity and accuracy. To attach the strain gauges to the beam walls, the adhesive used to fix them is melted, and the strain gauges are then immersed in the melted adhesive. The strain gauges sink due to their own weight, and once the adhesive solidifies, they are securely fixed.

[0006] In related technologies, when attaching strain gauges to various wall surfaces, the adhesive on each wall surface is melted simultaneously, and then the strain gauges are placed in each surface. However, due to the different positions of the four wall surfaces (top, bottom, left, and right), the strain gauges on the bottom, left, and right walls are affected by gravity, causing their fixed positions to shift and affecting the quality of the product. Summary of the Invention

[0007] In some embodiments, this application provides a method for hot-melt manufacturing of strain gauge sensors, used to attach strain gauges to a carrier, the method comprising the following steps:

[0008] 1) Based on the number of strain gauge mounting surfaces on the support member, select a number of strain gauges that is not less than the number of mounting surfaces, where the number of mounting surfaces is not less than two.

[0009] 2) Select the number of types of fixing adhesives according to the number of strain gauges. The number of types of fixing adhesives shall not be less than the number of strain gauges, and each fixing adhesive shall have a different melting point.

[0010] 3) Heat to melt the fixative, so that the strain gauge is bonded to the carrier after cooling through the molten fixative;

[0011] The heating temperature is set according to the melting point of each fixing adhesive from high to low.

[0012] In some embodiments, the fixing adhesive is selected according to the number of patch walls and in descending order of melting point. The adhesive is heated to melt the currently used fixing adhesive so as to fix the strain gauges one by one.

[0013] In some embodiments, at least after the strain gauge is placed into the molten adhesive, the currently bonded wall is placed horizontally upwards.

[0014] In some embodiments, before the strain gauge is attached to the carrier, the carrier is heated to a temperature at which the currently selected adhesive can melt, and the adhesive is placed on the wall surface to which the strain gauge is to be attached and melted.

[0015] In some embodiments, strain gauges are placed into the currently melted fixative, allowing them to sink in. Once the fixative cools, the strain gauges are fixed, completing the adhesion of the strain gauges to the current wall surface.

[0016] In some embodiments, the currently molten fixative is cooled and adhered to the current wall surface, thus completing the pre-setting of fixative on the current wall surface; wherein, according to the number of patch wall surfaces, fixatives are selected in descending order of melting point, and the pre-setting of fixative on each wall surface is completed one by one, and the types of fixatives on each wall surface are different.

[0017] In some embodiments, according to the number of patch walls, each wall is pre-set with fixing adhesive; the fixing adhesive is heated and melted in order of melting point from high to low, and strain gauges are placed into the currently melted fixing adhesive. After the fixing adhesive cools, the strain gauges are fixed.

[0018] In some embodiments, before the strain gauges are pasted onto the carrier, a corresponding number of strain gauges are pre-fixed in different types of adhesive according to the number of surface areas to be pasted. The carrier is then heated to the temperature at which the selected adhesive can melt. The adhesive with the strain gauges pre-fixed is placed on the surface to be pasted and melted. After the adhesive cools, the pasting of the strain gauges on the current surface is completed.

[0019] In some embodiments, before patching, at least the surface roughness of the wall surface to be patched is increased.

[0020] This application also provides a strain gauge sensor, which is prepared by the hot-melt manufacturing method of strain gauge sensors described in any of the above embodiments. The strain gauge sensor includes a carrier, the carrier having not less than two walls, and at least one strain gauge is attached to each wall by a fixing adhesive.

[0021] This application provides a method for hot-melt manufacturing of a strain gauge sensor and the strain gauge sensor itself. The method includes selecting a number of strain gauges, not less than the number of mounting surfaces on a carrier, and the number of mounting surfaces is not less than two. Then, based on the number of strain gauges, a number of types of fixatives are selected, not less than the number of strain gauges, and each fixative has a different melting point. The fixatives are then heated to melt, allowing the strain gauges to be bonded to the carrier after cooling. In this application embodiment, the heating temperature is set in descending order of the melting points of the fixatives. This setting first melts the fixatives with higher melting points to fix the strain gauges, then melts the fixatives with lower melting points, and heating the fixatives with lower melting points does not cause the fixatives with higher melting points to melt. This heating sequence effectively avoids affecting the position of the already bonded strain gauges, ensuring accurate positioning of each surface after strain gauge bonding, thus improving the product quality and detection accuracy of the strain gauge sensor. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementations of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 is a schematic flowchart of a method for manufacturing strain gauge sensors by hot melting according to an embodiment of this application;

[0024] Figure 2 is a schematic diagram of the strain gauge sensor structure provided in an embodiment of this application. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] The specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction. For example, different combinations of specific technical features can form different embodiments and technical solutions. To avoid unnecessary repetition, the various possible combinations of the specific technical features in this application will not be described separately.

[0027] In the following description, the terms "first," "second," etc., are used merely to distinguish different objects and do not indicate that the objects have the sameness or relationship. It should be understood that the directional descriptions "above," "below," "outside," and "inside" refer to the orientation under normal use conditions, while "left" and "right" refer to the left and right directions shown in the corresponding diagrams, which may or may not be the left and right directions under normal use conditions.

[0028] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. "A plurality of" means two or more.

[0029] This application provides a method for hot-melt manufacturing of strain gauge sensors, used to attach strain gauges to a carrier. The carrier primarily supports the strain gauge, ensuring a stable detection position for reliable and accurate detection of changes in relevant factors (such as pressure, temperature, or humidity). Specifically, when the strain gauge is used to detect pressure on the carrier, the carrier deforms under external force, and the strain gauge attached to it also deforms accordingly. During deformation, the resistance of the strain gauge changes with increasing strain. By measuring the change in resistance, the actual strain value can be calculated. The carrier can also be called a detection beam or elastic beam, etc., and its specific setup and structural principle are basically the same as existing methods, and will not be elaborated here. In this application embodiment, the carrier is used as an example and is not intended to limit the objects to which the strain gauge can be attached.

[0030] As shown in Figure 1, in this embodiment of the application, the method includes the following steps: first, selecting the required number of strain gauges based on the number of strain gauge mounting surfaces on the carrier, and ensuring that the selected number of strain gauges is not less than the number of mounting surfaces, so as to guarantee that there are still enough strain gauges to replace them in case of loss or damage, to meet the current mounting needs. When selecting the carrier, it is necessary to ensure that the carrier has at least two mounting surfaces.

[0031] Next, select the number of types of fixative based on the number of strain gauges chosen, ensuring that the number of fixative types is no less than the number of strain gauges. That is, at least one type of fixative should be used for each strain gauge to guarantee that different types of fixative are used when attaching strain gauges to different wall surfaces. Furthermore, the different types of fixative must have different melting points.

[0032] After selecting the required number of adhesive types based on the number of wall surfaces and strain gauges, and ensuring that the adhesive used for each strain gauge to be applied to different wall surfaces has a different melting point, the selected adhesive is heated to melt. This allows the strain gauge to adhere to the support after cooling, thus completing the application of the current strain gauge. The remaining strain gauges are applied in the same manner. Specifically, in this embodiment, the heating to melt the adhesives is done by setting the heating temperature in descending order of melting point. That is, when applying the first strain gauge, the adhesive with the highest melting point is used, and the heating temperature is not lower than the melting point of that adhesive to ensure it melts and adheres. When applying the second strain gauge, the adhesive used has a melting point lower than that of the first strain gauge but higher than that of the third strain gauge. This selection method is used to apply strain gauges to different wall surfaces one by one until at least one strain gauge is applied to each wall surface requiring application.

[0033] Specifically, when attaching strain gauges to different wall surfaces, fixatives with different melting points are used and heated sequentially in descending order of melting point. Simultaneously, the heating temperature is set according to the melting point of the fixative that needs to be melted. This ensures that even when already attached strain gauges are heated simultaneously while the fixative is melting, the current heating temperature is insufficient to melt the already attached fixative. Therefore, when heating and attaching the next strain gauge, the position of the already attached strain gauges remains stable and accurate throughout the process, preventing mutual interference and displacement, thus improving product quality.

[0034] This application provides a method for hot-melt manufacturing of strain gauge sensors. The method includes selecting a number of strain gauges, not less than the number of surface areas on a carrier where strain gauges need to be attached, wherein the carrier has at least two surface areas. Then, based on the number of strain gauges, a number of types of fixatives are selected, not less than the number of strain gauges, and the selected fixatives are set to have different melting points. The fixatives are then heated to melt, allowing the strain gauges to be bonded to the carrier after cooling through the melted fixatives. In this application embodiment, the heating temperature is set in descending order of the melting points of the fixatives. The fixative with the highest melting point is melted first, and then the heating temperature is lowered to melt fixatives with lower melting points. This setup first melts the strain gauges using the fixatives with higher melting points, then melts the fixatives with lower melting points, thus preventing the fixatives with higher melting points from melting when the lower melting points are heated. This heating sequence effectively avoids the situation where all the fixing adhesives melt due to temperature issues, which could cause the strain gauges to shift in position. Under this preparation method, when strain gauges are pasted onto each wall surface, they will not interfere with each other during the pasting process, thus preventing positional shifts. The position of the pasted strain gauges can be kept accurate, enabling reliable and precise detection of pressure changes on the load-bearing components and improving product quality.

[0035] In some embodiments, when selecting the support for which strain gauges need to be attached, it is necessary to ensure that the support has at least two or more wall surfaces. Furthermore, the total number of wall surfaces of the support should be greater than or equal to the number of wall surfaces on which the strain gauges need to be attached. This ensures that the selected strain gauges can be attached to different wall surfaces.

[0036] In some embodiments, the selected strain gauges are adhered to different wall surfaces, meaning the number of strain gauges corresponds one-to-one with the number of wall surfaces to which they are to be adhered, with one strain gauge adhered to each different wall surface. In other embodiments, provided the detection requirements are met, at least one strain gauge can be adhered to a single wall surface, such as two or three strain gauges on the same wall surface. In this case, when adhering strain gauges to the same wall surface, fixatives with the same melting point can be used to adhere the strain gauges individually or simultaneously. Alternatively, the strain gauges can be adhered using fixatives with different melting points. In this method, the fixatives are also heat-melted in descending order of melting point before being individually adhered.

[0037] Specifically, before applying the adhesive, it is necessary to ensure that the number of mounting surfaces is greater than the number of strain gauges, and the number of types of adhesive is greater than the number of strain gauges. This ensures that each strain gauge has at least one type of adhesive available for use, and that at least one distinct mounting surface is maintained for the strain gauge to be applied.

[0038] In some embodiments, the fixatives are selected according to the number of patch faces, in descending order of melting point. Each fixative is heated and melted to adhere the strain gauge to each face individually. That is, the number of fixative types needed is determined by the number of patch faces where strain gauges need to be adhered. The fixative with the highest melting point is used to adhere the first strain gauge, and the fixative with the lowest melting point is used to adhere the last strain gauge. Each patch face is adhered to separately. In this way, each heating cycle is used to adhere only one strain gauge. Furthermore, due to the melting point difference, when a lower-melting-point fixative melts, even if the previously adhered fixative is also being heated, it will not melt because the heating temperature is insufficient. Therefore, in this preparation method, by using fixatives with different melting points and heating them sequentially from high to low melting points, the adhesion of each strain gauge through the hot-melted fixative does not affect the previous one, thus ensuring accurate placement of each strain gauge.

[0039] In some embodiments, at least after the strain gauge is placed into the melted adhesive, the wall surface to which it is currently attached is placed horizontally upwards. Specifically, after the adhesive is melted, it is in a flowable adhesive state. When the strain gauge is placed into the adhesive, it sinks to the designated position under the influence of gravity. Therefore, at least after the strain gauge is placed into the adhesive, the wall surface to which it is currently attached needs to be kept horizontally upwards to ensure that the strain gauge can sink effectively under gravity and that the fixed position meets the design requirements, thus ensuring the reliability of the detection performance. This avoids the problem of the strain gauge's fixed position shifting due to the current wall surface being non-horizontal, which could affect product performance. If the current wall surface is downwards, the strain gauge will float under gravity, resulting in a greater distance from the wall surface and affecting the detection performance.

[0040] In some embodiments, the bonding of the strain gauge to the carrier can be accomplished by heating the carrier to a temperature at which the selected adhesive can melt before bonding the strain gauge. The adhesive is then placed on the wall surface where the strain gauge will be bonded and melted. Specifically, the wall surface where the strain gauge will be bonded is first heated to a temperature approximately the same as (or slightly higher than) the melting point of the selected adhesive. The selected adhesive is then placed on the corresponding wall surface, where it melts and adheres. This completes the preparation of the adhesive for bonding the strain gauge to the wall surface.

[0041] In some embodiments, after the adhesive preparation is completed, the fixing adhesive is in a molten state. Strain gauges are then placed into the molten fixing adhesive, and the wall surface to which the strain gauges are to be applied is kept horizontal and facing upwards. The strain gauges sink into the adhesive due to gravity. Once the fixing adhesive cools, the strain gauges are fixed within it. This completes the adhesion of the strain gauges to the wall surface.

[0042] Depending on the number of patch walls required, the patching operation can be carried out separately on each wall according to the above preparation method to complete the patching operation on all patch walls.

[0043] In another possible embodiment, after the fixative is hot-melted and adhered to the currently selected wall surface, the molten fixative is first cooled to solidify and adhere to the current wall surface, thus completing the pre-setting of the fixative on the current wall surface. Furthermore, based on the number of wall surfaces to be fitted with the strain gauge, the fixative is selected in descending order of melting point, and the pre-setting of the fixative on each wall surface is completed one by one, ensuring that the type of fixative adhered to each wall surface is different. That is, the fixative is pre-set on each wall surface before placing the strain gauge on the fixative. Moreover, at least the type of fixative on different wall surfaces is different, thereby ensuring that the melting points are also different.

[0044] In some embodiments, when selecting a method of pre-setting the fixative on each wall surface, the fixative is pre-set on each wall surface according to the number of wall surfaces to be patched. Then, the fixative is heated and melted in descending order of melting point, and strain gauges are placed into the currently melted fixative. After the fixative cools, the strain gauges are fixed. That is, fixative is pre-set on each wall surface. During patching, the fixative is first heated to the temperature of the highest melting point among the fixatives, and then the strain gauge is placed into the fixative with the highest melting point. After the fixative cools, the placed strain gauge is fixed. This process is repeated in descending order of melting point to complete the patching of the remaining strain gauges. Understandably, in this operation, heating the high-melting-point fixative will cause the low-melting-point fixative to melt. However, since the strain gauges are placed into the high-melting-point fixative first, even if the low-melting-point fixative melts, there will be no problem of strain gauge displacement because no strain gauges are placed in the low-melting-point fixative. In this preparation method, a fixing adhesive is pre-adhered to each wall surface, allowing for the pre-determination of the adhesive's adhesion reliability and the accuracy of its placement. This enables the corresponding placement of strain gauges, ensuring accurate positioning and improving product quality. Furthermore, the repeated melting of the low-melting-point adhesive facilitates the dissipation of internal air bubbles, enhancing the accuracy of the strain gauge's sinking to the designated depth after placement.

[0045] In another possible embodiment, before the strain gauges are bonded to the carrier, a corresponding number of strain gauges are pre-fixed in different types of fixatives according to the number of surface areas to be bonded. The carrier is then heated to the melting temperature of the selected fixative. The fixative with the pre-fixed strain gauges is placed on the surface to be bonded and melted. After the fixative cools, the strain gauges are bonded to the surface. That is, the fixative is melted first, the strain gauges are pre-fixed in the fixative, and then the fixative with the strain gauges inside is melted and adhered to the surface to be bonded. After the fixative cools again, the strain gauges are bonded. This preparation method allows for pre-fixing the strain gauges in different types of fixatives, and then selecting the appropriate fixative based on its melting point for hot-melt bonding, resulting in good preparation convenience. Moreover, the carrier only needs to be heated to the temperature required to melt the fixative with the highest melting point. During the subsequent cooling process, the appropriate fixative can be placed according to the temperature change, which helps improve the overall preparation efficiency.

[0046] In some embodiments, before applying the strain gauge, the surface roughness of the wall surface to be fitted is increased. This increases the surface roughness of the wall surface, thereby improving the adhesion between the adhesive and the strain gauge, thus enhancing the stability of the strain gauge installation. Increasing surface roughness can be achieved by creating recesses into which a portion of the adhesive is embedded. Alternatively, a large number of fine bumps or pits can be created on the wall surface, which also increases the adhesion to the adhesive.

[0047] To better understand the implementation of this application, as shown in Figure 2, the preparation method steps are illustrated with an example of a rectangular cross-section of the carrier having opposite upper and lower walls and opposite left and right walls. This does not mean that the preparation method can only be used on carriers with rectangular cross-sections, but can also be applied to carriers of other shapes.

[0048] Specifically, strain gauges are attached to the four walls of the support component, using four different fixing adhesives with varying melting points, ordered from highest to lowest: first fixing adhesive, second fixing adhesive, third fixing adhesive, and fourth fixing adhesive. The melting point of the first fixing adhesive can be 500℃~600℃, the second fixing adhesive 400℃~500℃, the third fixing adhesive 300℃~400℃, and the fourth fixing adhesive 200℃~300℃. The preparation method is as follows:

[0049] 1) Use the first fixative with the highest melting point and place the wall surface to be patched horizontally. Heat the first fixative until it melts. The strain gauge on the first fixative will sink due to its own weight and sink into the melted first fixative to the set depth, causing the temperature to drop. After the first fixative cools and solidifies, the patching of the strain gauge on this wall surface is completed.

[0050] 2) Use the second fixing adhesive with the second highest melting point, and place the wall surface to be patched horizontally. Heat the adhesive until it melts. The strain gauge on the second fixing adhesive will sink due to its own weight and sink into the melted adhesive to the set depth. At this time, because the melting point of the second fixing adhesive is lower than that of the first fixing adhesive, it will not affect the strain gauge on the first fixing adhesive.

[0051] 3) Use the third fixing adhesive with the third highest melting point, and place it horizontally on the wall surface where the patch needs to be applied. Heat it until the third fixing adhesive melts. The strain gauge on the third fixing adhesive will sink due to its own weight and sink into the melted third fixing adhesive to the set depth. At this time, because the melting point of the third fixing adhesive is lower than that of the first and second fixing adhesives, it will not affect the strain gauges on the first and second fixing adhesives.

[0052] 4) Use the fourth fixing adhesive with the lowest melting point, and place it horizontally on the wall surface where the patch needs to be applied. Heat it until the fourth fixing adhesive melts. The strain gauge on the fourth fixing adhesive will sink due to its own weight and sink into the melted fourth fixing adhesive to the set depth. At this time, because the melting point of the fourth fixing adhesive is lower than that of the first, second and third fixing adhesives, it will not affect the strain gauges on the first, second and third fixing adhesives.

[0053] Thus, by following the above steps, strain gauges can be attached to a load-bearing component with four walls. Understandably, when attaching strain gauges to load-bearing components with more walls, this can be achieved by adding adhesives with different melting points and different steps; these will not be elaborated upon here.

[0054] In this embodiment, by using fixatives with different melting points and then individually heat-melting the corresponding fixatives in order of melting point from high to low, the influence of the previous fixative during the heat-melting process can be avoided, ensuring that the position of each strain gauge after bonding does not shift, thus improving the quality of the product.

[0055] As shown in Figure 2, this embodiment of the application also provides a strain gauge sensor 1, which is prepared by the hot-melt manufacturing method of strain gauge sensors described in any of the above embodiments. Specifically, the strain gauge sensor 1 includes a carrier 11, which has at least two walls. If there are two walls, the two walls can be opposite each other or adjacent. At least one strain gauge 12 is attached to each wall by adhesive 13, that is, one strain gauge 12 or multiple strain gauges 12 can be attached to the same wall, and multiple strain gauges 12 can be used for detection or combined for detection according to the design. In this way, strain gauges 12 are attached to different walls respectively, so that detection can be performed in multiple directions. By adopting the above method, the strain gauge sensor 1 can keep the attached strain gauges 12 in an accurate position, and combined with the joint detection in multiple directions, the detection performance is highly sensitive, so that the strain gauge sensor 1 has good detection performance and accuracy of detection results, and the product quality is high.

[0056] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for hot-melt manufacturing of strain gauge sensors, used to attach strain gauges to a carrier, wherein, The method includes the following steps: 1) Based on the number of strain gauge mounting surfaces on the support member, select a number of strain gauges that is not less than the number of mounting surfaces, where the number of mounting surfaces is not less than two. 2) Select the number of types of fixing adhesives according to the number of strain gauges. The number of types of fixing adhesives shall not be less than the number of strain gauges, and each fixing adhesive shall have a different melting point. 3) Heat to melt the fixative, so that the strain gauge is bonded to the carrier after cooling through the molten fixative; Specifically, the heating temperature is set in descending order of the melting point of each fixing adhesive, and the fixing adhesive with the highest melting point among the fixing adhesives corresponding to the strain gauges to be pasted is used first; when pasting strain gauges on different patch walls of the carrier, the melting points of the fixing adhesives used are different; when pasting strain gauges on the same wall, the melting points of the fixing adhesives used are the same; when the fixing adhesive melts and pastes the corresponding strain gauge onto the carrier, the corresponding fixing adhesive is heat-melted separately.

2. The method for manufacturing strain gauge sensors by hot melting as described in claim 1, wherein, Based on the number of patch walls, select the fixing adhesive in descending order of melting point, heat each adhesive separately to melt the currently used fixing adhesive, and then attach and fix the strain gauges one by one.

3. The method for manufacturing strain gauge sensors by hot melting as described in claim 1, wherein, At least after the strain gauge is placed into the molten adhesive, place the currently bonded wall surface horizontally upwards.

4. The method for manufacturing strain gauge sensors by hot melting as described in claim 1, wherein, Before the strain gauge is attached to the carrier, the carrier is heated to a temperature at which the currently selected adhesive can melt, and the adhesive is placed on the wall surface to which the strain gauge will be attached and melted.

5. The method for manufacturing strain gauge sensors by hot melting as described in claim 4, wherein, Place the strain gauge into the molten adhesive and let it sink in. Once the adhesive has cooled, the strain gauge will be fixed in place, completing the adhesion of the strain gauge to the current wall surface.

6. The method for manufacturing a strain gauge sensor by hot melting as described in claim 4, wherein, The molten fixative is cooled and adhered to the current wall surface, thus completing the pre-setting of the fixative on the current wall surface; wherein, according to the number of wall surfaces to be patched, the fixative is selected in order of melting point from high to low, and the pre-setting of the fixative on each wall surface is completed one by one, and the type of fixative on each wall surface is different.

7. The method for manufacturing a strain gauge sensor by hot melting as described in claim 6, wherein, Based on the number of patch walls, each wall is pre-set with fixing adhesive; the fixing adhesive is heated and melted in order of melting point from high to low, and strain gauges are placed into the currently melted fixing adhesive. After the fixing adhesive cools, the strain gauges are fixed.

8. The method for manufacturing a strain gauge sensor by hot melting as described in claim 1, wherein, Before the strain gauges are pasted onto the support, according to the number of wall surfaces to be pasted, a corresponding number of strain gauges are pre-fixed in different types of adhesive. The support is then heated to the temperature at which the selected adhesive can melt. The adhesive with the strain gauges pre-fixed is placed on the wall surface to be pasted and melted. After the adhesive cools, the pasting of the strain gauges on the current wall surface is completed.

9. The method for manufacturing a strain gauge sensor by hot melting as described in claim 1, wherein, Before applying the patch, at least the surface roughness of the wall surface to be patched should be increased.

10. A strain gauge sensor, prepared by the method of hot-melt manufacturing of a strain gauge sensor according to any one of claims 1 to 9, wherein, The strain gauge sensor includes a carrier having at least two walls, each wall having at least one strain gauge attached to it by adhesive.

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