Circuit board module

Abstract

A circuit board module according to an embodiment of the present invention comprises: a circuit board; at least one condenser disposed on the circuit board; a case disposed to face the circuit board; and at least one heat dissipation pad disposed on the case, wherein the condenser has at least two layers stacked in a direction parallel to the circuit board, and the heat dissipation pad is disposed between the case and the condenser and / or between the case and the circuit board.

Description

Circuit board module

[0001] The present invention relates to a circuit board module.

[0002] Various chips, diodes, and capacitors are arranged on the circuit board, and due to the characteristics of the circuit board, electrical insulation performance, electrical transmission efficiency, and heat dissipation efficiency affect the overall performance of the product; therefore, it is important to prevent the occurrence of problems.

[0003] In this context, capacitors are used in electronic products to store electric charge in power conversion devices or to block direct current (DC) signals and allow alternating current (AC) signals to pass through.

[0004] For example, Multilayer Ceramic Capacitors (MLCCs) are widely used due to their advantages, such as the ability to manufacture them in a compact size, good high-frequency characteristics, and high capacitance stability. However, they have disadvantages, such as low capacitance and susceptibility to cracking caused by substrate splitting and temperature changes, which can lead to the problem of having to control the capacitor's temperature within a stable range.

[0005] In addition, in the case of capacitors, as the current flowing through the capacitor increases, the internal rated capacitance changes and the internal temperature rises due to external temperature; if the temperature is not controlled within a stable range, damage to the welded parts of the capacitor may occur due to stress caused by the temperature difference, and there is also a risk that the circuit board may crack depending on the capacitor's temperature.

[0006] Due to the nature of electronic products, even minor issues can prevent proper performance or render the product unusable; therefore, measures are required to resolve such problems.

[0007] The present invention is an invention devised to solve the problems of the aforementioned prior art, and aims to prevent cracking by improving the heat dissipation efficiency of a multilayer ceramic capacitor.

[0008] The problems that the present invention aims to solve are not limited to those mentioned above, and other problems not mentioned herein will be clearly understood by those skilled in the art from the description below.

[0009] A circuit board module according to an embodiment of the present invention for achieving the above-described purpose comprises a circuit board, at least one capacitor disposed on the circuit board, a case disposed facing the circuit board, and at least one heat dissipation pad disposed on the case, wherein the capacitor comprises at least two layers, and the heat dissipation pad may be disposed between the case and the capacitor or between the case and the circuit board.

[0010] According to the present embodiment, the heat dissipation pad and the capacitor can be in contact with each other.

[0011] According to the present embodiment, the heat dissipation pad may include a contact area that overlaps with the capacitor in a direction perpendicular to the circuit board and a non-contact area that does not overlap.

[0012] According to the present embodiment, the thickness of the contact area in a direction perpendicular to the circuit board may be smaller than the thickness of the non-contact area.

[0013] According to the present embodiment, the capacitor may overlap at least a portion with the heat dissipation pad in a direction parallel to the circuit board.

[0014] According to the present embodiment, the case may include a first area where the heat dissipation pad is disposed and a second area where the heat dissipation pad is not disposed.

[0015] According to the present embodiment, the first region overlaps at least a portion of the capacitor in a direction perpendicular to the circuit board, and the second region may not overlap the capacitor in a direction perpendicular to the circuit board.

[0016] According to the present embodiment, the heat dissipation pad may be an elastic body made of an insulating material.

[0017] According to the present embodiment, the heat dissipation pad may be in contact with the circuit board and may not be in contact with the capacitor.

[0018] According to the present embodiment, the case includes a first region that overlaps with the capacitor in a direction perpendicular to the circuit board and a second region that does not overlap with the capacitor, wherein the heat dissipation pad is disposed in the first region and the heat dissipation pad may not be disposed in the second region.

[0019] A circuit board module according to an embodiment of the present invention for solving the above problem may have the effect of preventing cracks by improving the heat dissipation efficiency of a multilayer ceramic capacitor.

[0020] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims.

[0021] In addition, the effects of the present invention may be described in more detail in the detailed description of the present invention and are not necessarily limited to those presented above.

[0022] The summary described above, as well as the detailed description of the preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings.

[0023] Preferred embodiments are illustrated in the drawings for the purpose of illustrating the present invention.

[0024] However, it should be understood that the present application is not limited to the exact arrangement and means depicted.

[0025] FIG. 1 is a drawing illustrated for the overall explanation of a circuit board module according to an embodiment of the present invention;

[0026] FIG. 2 is a drawing illustrating the contact area and non-contact area of ​​a circuit board module according to an embodiment of the present invention;

[0027] FIG. 3 is a drawing illustrating the arrangement of a heat dissipation pad of a circuit board module according to an embodiment of the present invention;

[0028] FIG. 4 is a drawing illustrating the arrangement of heat dissipation pads of a circuit board module according to a modified example of the present invention; and

[0029] FIG. 5 is a drawing illustrated to provide an overall description of a circuit board module according to a modified example of the present invention.

[0030] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention. In describing the present invention, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the present invention.

[0031] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0032] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0033] Furthermore, throughout the specification, when the term "connected" is used, it does not mean only that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are connected not only physically but also electrically, or that they are a single unit although referred to by different names depending on their location or function.

[0034] Furthermore, when described as being formed or placed on the “top or bottom” of each component, “top or bottom” includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as “top or bottom,” it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0035] Furthermore, when describing objects as "identical" or "similar" based on numerically or geometrically comparable properties such as length, inner diameter, diameter, or area, this may imply that there is a margin of error. For example, if it is stated that the lengths of components A and B are identical, it may be advisable to interpret this to mean that the length of B falls within the margin of error of the length of A. This takes into account the margin of error that occurs during the injection molding and manufacturing processes; since this is a matter that can occur physically and is self-evident, it is advisable to understand the description as "identical" or "similar" by considering the margin of error as described above. In this case, the margin of error may be within the range of -5% to +5% of the mentioned numerical value or shape, but this is merely an example of the margin of error and may not necessarily be limited to the stated range.

[0036] A preferred embodiment of the present invention, in which the objective of the present invention can be specifically realized, will be described below with reference to the attached FIGS. 1 to 5.

[0037] First, a circuit board module according to an embodiment of the present invention comprises a circuit board (100), at least one capacitor (200) disposed on the circuit board (100), a case (300) disposed facing the circuit board (100), and at least one heat dissipation pad (400) disposed on the case (300).

[0038] Here, the capacitor (200) may be a multi-layer ceramic capacitor (MLCC) comprising at least two layers stacked in a direction parallel to the circuit board (100) or perpendicular to the circuit board (100), and the heat dissipation pad (400) is placed between the case (300) and the capacitor (200) or between the case (300) and the circuit board (100).

[0039] At this time, the capacitor (200) of the present invention has the advantages of being able to be manufactured in a small size due to the characteristics of a multilayer ceramic capacitor (MLCC), having excellent high-frequency characteristics, and having high capacitance stability. However, contrary to the stability of the capacitance, there is a problem that the capacitance is small and cracks may occur due to heat generated by the flow of current. In addition, since the heat generated from the capacitor (200) is transferred to the circuit board (100), cracks may also occur in the circuit board (100) due to temperature changes.

[0040] In this case, if a crack occurs in the capacitor (200), there is a problem in that a single crack in the capacitor (200) causes a defect or performance degradation due to the characteristics of electronic products having complex circuits, and there is a problem in that it is difficult to identify replacement and assembly issues due to the characteristics of small components, so a method to prevent such problems in advance is required.

[0041] In the circuit board module according to an embodiment of the present invention, as shown in FIG. 1, a heat dissipation pad (400) may be disposed between the case (300) and the capacitor (200) to effectively dissipate heat from the capacitor (200) disposed on the circuit board (100) disposed inside the case (300) forming the exterior.

[0042] To explain in more detail, an internal space (S) is formed on the inner side of the case (300), and a circuit board (100) is placed on the internal space (S). The capacitor (200) may include a multilayer ceramic capacitor (210) comprising a plurality of layers and a soldering member (220) for electrically connecting the circuit board (100) and the capacitor (200) and fixing the capacitor (200) to the circuit board (100). Here, the soldering member (220) may be placed on the side of the multilayer ceramic capacitor (210). For example, the circuit board (100) may be a PCB.

[0043] At this time, in a circuit board module according to the conventional technology, a capacitor (200) is placed between a case (300) forming the exterior and a circuit board (100), and an air gap is formed between the capacitor (200) and the case (300), so the heat of the capacitor (200) is not directly transferred to the case (300), and heat accumulates in the capacitor (200), and the high temperature cannot be dissipated, so there was a problem that cracks were likely to occur in the capacitor (200).

[0044] In the circuit board module according to an embodiment of the present invention, a heat dissipation pad (400) is disposed between the case (300) and the capacitor (200), and due to the heat dissipation pad (400), there is no air gap between the case (300) and the capacitor (200), and heat generated from the capacitor (200) is directly transferred to the heat dissipation pad (400), and the transferred heat is conducted to the case (300) so that the heat can be quickly dissipated to the outside. In this way, the speed at which heat from the capacitor (200) is transferred to the outside is increased, and by preventing high temperatures from accumulating in the capacitor (200), the temperature transferred indirectly to the circuit board (100) can be reduced, and through this, cracks in both the capacitor (200) and the circuit board (100) can be effectively prevented.

[0045] Meanwhile, referring to FIG. 2, as illustrated in FIG. 2, the case (300) may include a plurality of heat dissipation protrusions (310) that protrude toward the outside of the case (300) in a direction perpendicular to the case (300) to effectively dissipate heat received to the outside, and the heat dissipation protrusions (310) can dissipate heat to the outside more quickly by increasing the contact area with the outside.

[0046] Additionally, the heat dissipation pad (400) includes a contact area (410) that overlaps with the capacitor (200) in a direction perpendicular to the circuit board (100) and a non-contact area (420) that does not overlap with the capacitor (200). The contact area (410) is in contact with the capacitor (200) in a direction perpendicular to the circuit board (100), and the non-contact area (420) is not in contact with the capacitor (200) and can be spaced apart from the circuit board (100).

[0047] In other words, the contact area (410) is a part of the heat dissipation pad (400) in which a capacitor (200) is placed between the heat dissipation pad (400) and the circuit board (100), and the non-contact area (420) may be the remaining area of ​​the heat dissipation pad (400) in which no capacitor (200) exists between the heat dissipation pad (400) and the circuit board (100). Here, the heat dissipation pad (400) is provided with an insulating material so that the current of the capacitor (200) is not transmitted to the case (300), and may be provided with an elastic material to prevent the capacitor (200) from being pressurized due to tolerances occurring during the manufacturing process.

[0048] At this time, the thickness (T1) of the contact area (410) in a direction perpendicular to the circuit board (100) may be smaller than the thickness (T2) of the non-contact area (420). This is because the heat dissipation pad (400), which is an elastic body, is deformed as it comes into contact with the capacitor (200), so that some areas are sunken in a direction away from the circuit board (100) or in a direction toward the case (300), and some areas are inserted into the heat dissipation pad (400).

[0049] In order for the contact area (410) to be formed in this manner, it is preferable to design the case (300) and the capacitor (200) by adding a thickness equal to the error range to the distance between them during manufacturing. Designing it in this way may prevent the problem of the contact area (410) failing to properly perform the heat dissipation function due to the error range that occurs during the process of combining the capacitor (200) with the circuit board (100) and the process of manufacturing the capacitor (200).

[0050] In order to ensure that the contact area (410) is in contact with the capacitor (200), the thickness of the heat dissipation pad (400) is such that, based on FIG. 2, the thickness (T2) of the non-contact area (420) before deformation is such that the thickness of the non-contact area (420) can have a thickness equal to the error range added to the distance between the case (300) and the capacitor (200) in the design. For example, assuming that the error range of a non-defective product in a general manufacturing process is set to an absolute value of 5%, it may be desirable to add a thickness equal to the absolute value of 5%, which is the error range of the distance between the case (300) and the capacitor (200). However, rather than an exact value, the thickness of the heat dissipation pad (400) may be preferably such that the thickness (T2) of the non-contact area (420) is 1.05 to 1.1 times the distance between the case (300) and the capacitor (200) for the purpose of reliably preventing air gaps.

[0051] Here, the thickness (T2) of the non-contact area (420) may be smaller than the distance between the case (300) and the circuit board (100). If the thickness (T2) of the non-contact area (420) is equal to or greater than the length of the internal space (S) in the direction perpendicular to the circuit board (100), that is, the distance between the case (300) and the circuit board (100), then the capacitor (200) is closed by the heat dissipation pad (400) on the upper side of the circuit board (100), so the generated heat can be quickly transferred to the heat dissipation pad (400), but there may be a problem where the heat is concentrated inside the capacitor (200) due to the enclosed space.

[0052] Alternatively, the contact area (410) of the heat dissipation pad (400) is positioned relatively close to the case (300) so that heat generated from the capacitor (200) is quickly transferred to the case (300), making it easy to dissipate heat to the outside. However, if the thickness (T2) of the non-contact area (420) is equal to or greater than the distance between the case (300) and the circuit board (100) as described above, the non-contact area (420) must dissipate heat generated from the capacitor (200) into an internal space (S) in a direction parallel to the circuit board (100). Since this raises the temperature of the internal space (S), the heat dissipation effect cannot be properly performed. Furthermore, if the circuit board (100) and the non-contact area (420) come into contact, the heat from the non-contact area (420) is transferred to the circuit board (100), and a crack may occur in the circuit board (100).

[0053] That is, the thickness (T2) of the non-contact area (420) may preferably be 1.05 to 1.1 times the distance between the case (300) and the capacitor (200).

[0054] In addition, the length or area of ​​the capacitor (200) in a direction parallel to the circuit board (100) may be smaller than the length or area of ​​the heat dissipation pad (400) in a direction parallel to the circuit board (100). As such, since the area of ​​the heat dissipation pad (400) is larger than the length or area of ​​the capacitor (200), the heat dissipation pad (400) must necessarily include a contact area (410) and a non-contact area (420), and due to the contact area (410), a portion of the capacitor (200) may overlap in a direction parallel to the heat dissipation pad (400) and the circuit board (100).

[0055] As previously mentioned, multilayer ceramic capacitors can develop cracks due to temperature rise caused by current flow, and given the characteristics of electronic products where performance is significantly degraded even by minor issues, it is essential to solve the problem of heat dissipation of multilayer ceramic capacitors. In the circuit board module according to the embodiment of the present invention, there is no air gap due to the heat dissipation pad (400) placed between the capacitor (200) and the case (300), so the capacitor (200) comes into direct contact with the heat dissipation pad (400). Due to this direct contact, heat generated from the capacitor (200) is rapidly transferred to the heat dissipation pad (400), and the heat dissipation pad (400) can effectively perform heat dissipation by rapidly transferring heat to the contacted area of ​​the case (300).

[0056] Meanwhile, as illustrated in FIG. 3, the case (300) includes a first area (330) where a heat dissipation pad (400) is placed and a second area (320) where a heat dissipation pad (400) is not placed, and a plurality of first areas (330) may be formed.

[0057] At this time, the area of ​​the first region (330), more specifically, the area or length of each of the plurality of first regions (330) in a direction parallel to the circuit board (100) or case (300) may differ from one another. This is determined by the arrangement and density of the capacitor (200) placed on the circuit board (100), and as shown in FIG. 3, the heat dissipation pad (400) overlaps with at least one capacitor (200) in a direction perpendicular to the circuit board (100), and the first region (330) of the case (300) may also overlap with at least one capacitor (200) in a direction perpendicular to the circuit board (100).

[0058] That is, the first region (330) overlaps at least partially with the capacitor (200) in a direction perpendicular to the circuit board (100), and the second region (320) may not overlap with the capacitor (200) in a direction perpendicular to the circuit board (100). Additionally, a plurality of first regions (330) may be spaced apart from each other, and as the first regions (330) are spaced apart, the problem of heat transferred to the case (300) not being properly dissipated by adjacent first regions (330) can be prevented.

[0059] In addition, since the first region (330) is arranged differently depending on the arrangement of the capacitor (200), there may be an advantage in that the assembly direction of the case (300) can be checked during the process of combining the case (300) when multiple capacitors (200) are arranged irregularly.

[0060] Meanwhile, referring to FIG. 4, in a circuit board module according to a modified embodiment of the present invention, a heat dissipation pad (400) is not disposed between the case (300) and the capacitor (200), and a lower heat dissipation pad (400b) may be disposed on the lower part of the circuit board (100). Additionally, the case (300) may be disposed on the upper and lower parts respectively with respect to the circuit board, and a heat dissipation pad (400) is not disposed in the space between the upper case (300a) and the capacitor (200), and a lower heat dissipation pad (400b) may be disposed in the space between the lower case (300b) and the circuit board (100).

[0061] Additionally, as previously described, the lower heat dissipation pad (400b) may be positioned to overlap the capacitor (200) in a direction perpendicular to the circuit board. When positioned in this manner, heat generated from the circuit board (100) can be indirectly dissipated to the outside, and the circuit board (100) may be prevented from cracking due to heat. Furthermore, the lower case (300b) includes a first area (330) and a second area (320) where the lower heat dissipation pad (400b) is positioned, the first area (330) overlaps the capacitor (200) and the circuit board (100) in a direction perpendicular to the circuit board (100), and the second area (320) may not overlap the capacitor (200) in a direction perpendicular to the circuit board (100).

[0062] Referring to FIG. 5 to explain a circuit board module according to a modified embodiment of the present invention by applying the above description, the circuit board module according to a modified embodiment of the present invention may include an upper case (300a) and a lower case (300b), a circuit board (100) disposed between the upper case (300a) and the lower case (300b), a plurality of capacitors (200) disposed on the circuit board (100), an upper heat dissipation pad (400a) disposed between the upper case (300a) and the capacitors (200), and a lower heat dissipation pad (400b) disposed between the circuit board (100) and the lower case (300b).

[0063] When arranged in this manner, heat generated from the capacitor (200), such as in the circuit board module according to the embodiment of the present invention, is conducted to the upper heat dissipation pad (400a), and the heat from the upper heat dissipation pad (400a) is conducted toward the upper case (300a), thereby preventing cracks caused by heat generation of the capacitor (200).

[0064] In addition, the lower part of the capacitor (200) that is not in contact with the upper heat dissipation pad (400a), that is, the area adjacent to the circuit board (100), may have a relatively high temperature because it relies on the upper part of the capacitor (200) for heat dissipation. To solve this, a lower heat dissipation pad (400b) is placed between the circuit board (100) and the lower case (300b) so that the heat generated in the lower part of the capacitor (200) can be indirectly dissipated to the outside.

[0065] At this time, the upper heat dissipation pad (400a) includes the aforementioned contact area (410) and non-contact area (420), but the lower heat dissipation pad (400b) may not be divided into a contact area (410) and a non-contact area (420) because it is in contact with one side of the circuit board (100) in its entirety. This may be due to the arrangement of the upper heat dissipation pad (400a), which receives heat directly, and the lower heat dissipation pad (400b), which receives heat indirectly.

[0066] As previously explained, to summarize the circuit board module according to the embodiment of the present invention, a heat dissipation pad (400) is disposed between the case (300) and the capacitor (200), and the heat dissipation pad (400) is divided into a contact area (410) that contacts the capacitor (200) and a non-contact area (420). Since the heat dissipation pad (400) is provided as an elastic body of insulating material, the thickness (T1) of the contact area (410) may be smaller than the thickness (T2) of the non-contact area (420).

[0067] In addition, the thickness (T2) of the non-contact area (420) is smaller than the shortest distance between the case (300) and the circuit board (100), and there is no air gap between the capacitor (200) and the contact area (410), so heat can be effectively transferred toward the case (300). Also, the case (300) includes a first area (330) where a heat dissipation pad (400) is placed and a second area (320) where a heat dissipation pad (400) is not placed, and the first area (330) may be multiple, and the area of ​​each first area (330) may be different from each other.

[0068] In addition, to effectively solve the problem regarding the efficiency and complexity of the arrangement of the heat dissipation pad (400), the heat dissipation pad (400) may be in contact with a plurality of capacitors (200), and accordingly, the first region (330) may overlap in a direction perpendicular to the plurality of capacitors (200) and the circuit board (100).

[0069] Meanwhile, to summarize the circuit board module according to a modified embodiment of the present invention, a circuit board (100) is disposed between an upper case (300a) and a lower case (300b), a capacitor (200) is disposed on the circuit board (100), an upper heat dissipation pad (400a) is disposed between the upper case (300a) and the capacitor (200), and a lower heat dissipation pad (400b) can be disposed between the lower case (300b) and the circuit board (100).

[0070] Here, the upper heat dissipation pad (400a) is divided into a contact area (410) that is in direct contact with the capacitor (200) and a non-contact area (420) that is not in contact, and the lower case (300b) is not divided into a contact area (410) and a non-contact area (420), and each of the upper case (300a) and the lower case (300b) includes the first area (330) and the second area (320) described above, and at least a portion of the first area (330) of the upper case (300a) and the first area (330) of the lower case (300b) may overlap in a direction perpendicular to the circuit board (100).

[0071] As the upper heat dissipation pad (400a) and the lower heat dissipation pad (400b) are arranged in this manner, heat generated in the condenser (200) can be effectively dissipated through the upper heat dissipation pad (400a), and heat generated in the lower region of the condenser (200) can be indirectly dissipated through the lower heat dissipation pad (400b), thereby effectively dissipating heat generated in the condenser (200) to the outside. Accordingly, there may be an advantage in that the overall heat dissipation efficiency can be significantly improved.

[0072] We have examined preferred embodiments according to the invention, and it is obvious to those skilled in the art that, in addition to the embodiments described above, the invention may be embodied in other specific forms without departing from the spirit or scope thereof.

[0073] Therefore, the embodiments described above should be regarded as exemplary rather than limiting, and accordingly, the present invention is not limited to the description above but may be modified within the scope of the appended claims and their equivalents.

Claims

1. Circuit board; At least one capacitor disposed on the circuit board above; A case positioned facing the above circuit board; and It includes at least one heat dissipation pad disposed on the above case, and The above capacitor includes at least two layers, and The above heat dissipation pad is a circuit board module disposed between the case and the capacitor or between the case and the circuit board.

2. In Paragraph 1, A circuit board module in which the above-mentioned heat dissipation pad and the above-mentioned capacitor are in contact with each other.

3. In Paragraph 2, The above heat dissipation pad is a circuit board module comprising a contact area that overlaps with the capacitor in a direction perpendicular to the circuit board and a non-contact area that does not overlap.

4. In Paragraph 3, A circuit board module in which the thickness of the contact area in a direction perpendicular to the circuit board is smaller than the thickness of the non-contact area.

5. In Paragraph 2, The above capacitor is a circuit board module in which at least a portion of the heat dissipation pad overlaps in a direction parallel to the circuit board.

6. In Paragraph 1, The above case is a circuit board module comprising a first region where the heat dissipation pad is placed and a second region where the heat dissipation pad is not placed.

7. In Paragraph 6, The first region overlaps at least a portion with the capacitor in a direction perpendicular to the circuit board, and The second region above is a circuit board module that does not overlap with the capacitor in a direction perpendicular to the circuit board.

8. In Paragraph 1, The above heat dissipation pad is a circuit board module that is an elastic body of insulating material.

9. In Paragraph 1, The above heat dissipation pad is in contact with the circuit board and is not in contact with the capacitor, forming a circuit board module.

10. In Paragraph 9, The above case includes a first region that overlaps with the capacitor in a direction perpendicular to the circuit board and a second region that does not overlap with the capacitor, and A circuit board module in which the heat dissipation pad is disposed in the first region and the heat dissipation pad is not disposed in the second region.

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