Elastic wave devices

Abstract

To provide an elastic wave device with improved heat dissipation. [Solution] The elastic wave device comprises a package substrate having a mounting surface, a first inner layer, a second inner layer, and an external connection surface in this order, a device chip, and a plurality of resonators, and includes a heat dissipation bump arranged to be surrounded by the plurality of resonators and located in the central region on the device chip, the mounting surface has a plurality of metal patterns MP including a heat dissipation pad HDP, the first inner layer has a plurality of metal patterns including a first metal pattern MP1 electrically connected to the heat dissipation pad via via V, the second inner layer has a plurality of metal patterns including a second metal pattern MP2 electrically connected to the first metal pattern via via, the first metal pattern having the largest area in the first inner layer, and the second metal pattern having the largest area in the second inner layer.

Images