Silicon photonics wafer test apparatus and test method therefor, and silicon photonics wafer test system

Abstract

Provided in the present disclosure are a silicon photonics wafer test apparatus and a test method therefor, and a silicon photonics wafer test system. The silicon photonics wafer test apparatus comprises a camera assembly and a deflection optical path assembly; a prober for carrying a silicon photonics wafer; a fiber coupling module; and a driving assembly. When the driving assembly moves the silicon photonics wafer into the imaging field of view of the camera assembly, the camera assembly is adjusted such that the coordinate system is parallel to scribe lines of the silicon photonics wafer; when the driving assembly moves the deflection optical path assembly into the imaging field of view of the camera assembly, the camera assembly captures lateral images of a fiber end from at least two different directions via the deflection optical path assembly. The fiber coupling module is used for adjusting the pose of the fiber end on the basis of the lateral images and the direction of the coordinate system of the camera assembly, enabling initial alignment between the fiber end and the silicon photonics wafer. The present disclosure reduces the operational difficulty of alignment coupling between the fiber end and a silicon photonics waveguide, thereby simplifying the apparatus structure and reducing apparatus costs.

Description

A silicon photonics wafer testing device and its testing method, and a silicon photonics wafer testing system.

[0001] This disclosure claims priority to Chinese patent applications filed on December 21, 2024, with application numbers 202412000402.8 ("Silicon Photonics Wafer Testing Equipment and its Fiber Optic Pose Adjustment Mechanism, Method and System") and 202423324200.0 ("A Silicon Photonics Wafer Testing Equipment and its Alignment Coupling Mechanism and Testing System"), the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of silicon photonics wafer testing technology, and in particular to a silicon photonics wafer testing device and testing method, and a silicon photonics wafer testing system. Background Technology

[0003] Silicon photonics wafer testing equipment is mainly used to test whether the silicon photonics chips formed on silicon photonics wafers can work properly. In the actual testing process, it is necessary to use optical fibers or optical fiber arrays to transmit optical signals to the silicon photonics chips arranged in an array on the wafer, and to perform optical performance tests based on the optical signals output by the silicon photonics chips.

[0004] In the performance testing of silicon optical waveguides, ensuring effective alignment and coupling between the fiber optic port and the silicon optical waveguide on the wafer is a crucial factor in improving test accuracy. Therefore, achieving proper alignment and coupling between the fiber optic array port and the optical interface of the silicon optical waveguide on the wafer during silicon optical wafer testing, while minimizing the difficulty of achieving this alignment and coupling between the fiber optic array or fiber and the silicon optical waveguide on the wafer, is a key focus in the industry. Summary of the Invention

[0005] This disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a silicon photonics wafer testing device and testing method, and a silicon photonics wafer testing system.

[0006] One aspect of this disclosure provides a silicon photonics wafer testing device, including a micro-imaging assembly, a probe station, an optical fiber coupling module, and a driving assembly; the micro-imaging assembly includes a camera assembly and a deflecting optical path assembly; the probe station is used to support the silicon photonics wafer; the driving assembly is used to drive the probe station and the deflecting optical path assembly to switch between moving into the imaging field of view of the camera assembly;

[0007] When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component adjusts its coordinate system to be parallel to the dicing path of the silicon photonic wafer.

[0008] When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire lateral images corresponding to at least two different lateral views of the end of the optical fiber that is deflected by the deflection optical path component; the optical fiber coupling module is used to adjust the pose of the end of the optical fiber according to the lateral images and the orientation of the coordinate system of the camera component, so that the end of the optical fiber is initially aligned with the silicon photonic wafer.

[0009] Another aspect of this disclosure provides a silicon photonics wafer testing method, which is applied to the silicon photonics wafer testing equipment described above, the testing method comprising:

[0010] The control drive component drives the silicon photonic wafer to translate into the imaging field of view of the camera component. The camera component is adjusted based on the wafer image acquired by the camera component so that the coordinate system of the camera component and the dicing track on the silicon photonic wafer are parallel to each other.

[0011] The silicon photonic wafer is controlled to move out of the imaging field of view of the camera assembly, and the deflection optical path assembly is moved into the imaging field of view of the camera assembly. The camera assembly acquires lateral images corresponding to at least two different lateral views of the end of the optical fiber that is deflected and transmitted by the deflection optical path assembly.

[0012] Based on the lateral image and the orientation of the camera component coordinate system, the fiber coupling module adjusts the pose of the fiber end and controls the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the fiber end and the silicon photonic wafer are initially aligned.

[0013] Another aspect of this disclosure provides a silicon photonics wafer testing device, including an optical fiber coupling module; a piezoelectric displacement stage connected to the optical fiber coupling module; and an end connection structure fixedly connected to the piezoelectric displacement stage for connecting the end of an optical fiber array or the end of a single optical fiber.

[0014] The fiber optic coupling module includes three translational components and three rotational components connected in series. The three translational components are used to drive the end connection structure to translate along a first direction, a second direction, and a third direction, respectively. The three rotational components are used to drive the end connection structure to rotate around a first rotation axis, a second rotation axis, and a third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

[0015] Another aspect of this disclosure provides a silicon photonics wafer testing system, including the silicon photonics wafer testing equipment as described above; or, performing the silicon photonics wafer testing method as described above; or, including the silicon photonics wafer testing equipment as described above. Attached Figure Description

[0016] Figure 1 is a schematic diagram of the overall structure of the silicon photonics wafer testing equipment in the first specific embodiment provided in this disclosure;

[0017] Figure 2 is a partial structural schematic diagram of the silicon photonics wafer testing equipment in the first specific embodiment provided by this disclosure;

[0018] Figure 3 is a schematic diagram of the structure of a silicon photonics wafer;

[0019] Figure 4 is a schematic diagram of the fiber end structure of the fiber array;

[0020] Figure 5 is a schematic diagram of the deflection optical path component in the silicon photonics wafer testing equipment provided in this embodiment of the present disclosure;

[0021] Figure 6 is a partial optical path structure diagram of the deflection optical path component provided in the embodiment of this disclosure;

[0022] Figure 7 is a schematic diagram of the structure of the optical fiber coupling module provided in the embodiment of this disclosure;

[0023] Figure 8 is a flowchart illustrating the testing method of the silicon photonics wafer testing equipment in the second specific embodiment provided in this disclosure.

[0024] Figure 9 is a schematic diagram of the relative positions between the optical waveguide and the optical fiber port within the imaging field of view of the camera provided in this embodiment of the present disclosure;

[0025] Figure 10 is a schematic diagram of the structure of the silicon photonics wafer testing equipment in the third specific embodiment provided in this disclosure;

[0026] Figure 11 is an exploded structural diagram of the silicon photonics wafer testing equipment in the third specific embodiment provided in this disclosure;

[0027] Figure 12 is an exploded view of the end connection structure and the first clamping assembly provided in the embodiments of this disclosure;

[0028] Figure 13 is an exploded view of the end connection structure and the second clamping assembly provided in the embodiments of this disclosure. Detailed Implementation

[0029] The core of this disclosure is to provide a silicon photonics wafer testing device and its testing method, as well as a silicon photonics wafer testing system, which simplifies the alignment process between the fiber end and the silicon photonics waveguide, simplifies the entire device structure, and reduces the device cost.

[0030] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] To facilitate understanding of the technical solution disclosed herein, a brief introduction to the alignment coupling between silicon photonic wafers and fiber arrays will first be given in conjunction with Figures 3 and 4.

[0032] As shown in Figure 3, a silicon photonics wafer 30 is provided, which is cut to form dicing channels 32 to form multiple individual silicon photonics chips. Each silicon photonics chip is provided with a corresponding optical waveguide 31.

[0033] As shown in Figure 4, the fiber end 20 of the fiber array includes several fiber ports 21 that are fixed together on the fixing member 22 in a row. As far as the fiber end 20 is concerned, the end face formed by each fiber port 21 and the lower surface of the fixing member as a whole is roughly a rectangular plane.

[0034] During the actual coupling between the fiber array and the optical waveguide 31, when one fiber port 21 of the fiber array is located directly above and exactly opposite an optical waveguide 31, the fiber array achieves initial alignment with the optical waveguide 31. Furthermore, when the fiber ports 21 of the fiber array and the optical waveguide 31 are aligned and coupled, the vertical plane in which the fiber ports 21 are arranged should be parallel to the cleavage 32 in one direction on the silicon photonics wafer 30 and perpendicular to the cleavage 32 in another direction.

[0035] Based on the above discussion, and referring to Figures 1 and 2, in the first specific embodiment of this disclosure, the silicon photonics wafer testing equipment 10 may include:

[0036] The micro-imaging assembly includes a probe stage 11, an optical fiber coupling module 14, and a driving assembly. The micro-imaging assembly includes a camera assembly 15 and a deflecting optical path assembly 12. The probe stage 11 is used to support the silicon photonic wafer 30. The driving assembly is used to drive the probe stage 11 and the deflecting optical path assembly 12 to switch between moving into the imaging field of view of the camera assembly 15.

[0037] When the drive assembly 13 drives the probe station 11 carrying the silicon photonic wafer 30 to move into the imaging field of view of the camera assembly 15, the camera assembly 15 adjusts its coordinate system to be parallel to the dicing track 32 of the silicon photonic wafer 30.

[0038] When the driving component 13 drives the deflection optical path component 12 to move into the imaging field of view of the camera component 15, the camera component 15 is used to acquire lateral images corresponding to at least two different lateral views of the optical fiber end 20 of the deflection optical path component 12 deflecting the transmission input. The optical fiber coupling module 14 is used to adjust the pose of the optical fiber end 20 according to the lateral images and the orientation of the camera component coordinate system so that the optical fiber end 20 is initially aligned with the silicon photonic wafer 30.

[0039] It is understood that in the actual testing process of the test equipment 10 in this embodiment, the silicon photonic wafer 30 is placed on the probe station 11, and the fiber port 21 of the fiber end 20 of the fiber array is vertically downward and directly facing the optical interface of the optical waveguide.

[0040] Furthermore, the camera component coordinate system refers to the coordinate system in which the camera of the camera component 15 captures and images, generally a two-dimensional rectangular coordinate system on the imaging plane of the camera component 15. In this embodiment, the parallelism between the camera component coordinate system and the dicing 32 of the silicon photonic wafer 30 means that the two mutually perpendicular coordinate axes of the two-dimensional rectangular coordinate system are respectively parallel to the two mutually perpendicular directions of the dicing 32 of the silicon photonic wafer 30. Based on this, the camera component 15 in this disclosure captures images with the optical axis of the camera vertically downward. Therefore, when the driving component 13 drives the probe station 11 to position the silicon photonic wafer 30 in the imaging field of view of the camera component 15 (generally located directly below the camera), it is only necessary to control the camera component 15 to rotate and adjust around the optical axis of the camera to make the camera component coordinate system and the dicing 32 of the silicon photonic wafer 30 parallel to each other.

[0041] Optionally, a crosshair is provided within the camera lens of the camera assembly 15. This crosshair is formed by the intersection of two mutually perpendicular straight lines located in the middle region of the lens of the camera assembly 15. The two straight lines forming the crosshair are parallel to the two coordinate axes of the two-dimensional Cartesian coordinate system of the camera assembly 15. Thus, when the drive assembly 13 drives the probe station 11 carrying the silicon photonic wafer 30 to move into the imaging field of view of the camera assembly 15, the camera assembly 15 acquires a wafer image of the silicon photonic wafer 30 and uses this wafer image to adjust the crosshair of the camera lens in the camera assembly 15 to be parallel to the dicing marks on the silicon photonic wafer 30. Furthermore, in this embodiment, the camera lens of the camera assembly 15 can employ a multi-magnification fixed-magnification lens, enabling image acquisition of different sizes of imaging fields.

[0042] Based on this, in an optional implementation of this embodiment, the deflecting optical path assembly 12 can be an optical path structure including at least two reflective elements.

[0043] When the driving component 13 drives the deflection optical path component 12 to move into the imaging field of view of the camera component 15, the camera component 15 is used to acquire a first lateral image of the fiber end 20 in the first horizontal direction and a second lateral image in the second horizontal direction through the deflection optical path component 12; and uses the fiber coupling module 14 to adjust the end face of the fiber end 20 to the horizontal plane according to the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0044] The camera assembly 15 is also used to acquire a vertical image of the fiber end 20 from the vertical direction, and the fiber coupling module 14 is used to adjust the outline of the fiber end 20 to be parallel to the crosshair of the camera according to the vertical image.

[0045] In this embodiment, the first lateral image is equivalent to an image formed by capturing the first lateral view of the fiber optic end 20 from the first horizontal direction. Similarly, the second lateral image is an image formed by capturing the second lateral view of the fiber optic end 20 from the second horizontal direction. However, if the shooting direction of the camera assembly 15 is modulated to the horizontal direction and needs to be roughly on the same horizontal plane as the position of the fiber optic end 20, it will obviously make the adjustment of the camera assembly 15 too complicated. If multiple cameras with different shooting angles are added, the equipment cost will increase. Therefore, in this embodiment, the deflection optical path assembly 12 uses the reflection effect of at least two reflective elements to reflect the lateral images of the two fiber optic ends 20 in two different horizontal directions to the camera assembly 15. That is, only one camera assembly 15 is used, and there is no need to make overly complicated position adjustments to the camera assembly 15 to acquire images of the two different lateral directions of the fiber optic end 20.

[0046] Based on this, in this embodiment, by acquiring the side images corresponding to the side views of the fiber end 20 in two mutually perpendicular directions, the tilt angle between the end face of the fiber end 20 and the horizontal plane can be obtained, and the end face of the fiber end 20 can be adjusted to be horizontal based on the tilt angle.

[0047] Referring to Figure 2, in the embodiment shown in Figure 2, the deflection optical path component 12 can be disposed on the side of the probe station 11 and fixedly connected to the probe station 11, while the probe station 11 is disposed on the drive component 13. In addition, the drive component 13 includes two mutually perpendicular slide rails, so that the drive component 13 can drive the probe station 11 and the deflection optical path component 12 to translate along two mutually perpendicular directions, that is, it can drive and adjust the position of the probe station 11 and the deflection optical path component 12 in the horizontal plane, thereby realizing that one of the probe station 11 and the deflection optical path component 12 is located directly below the camera in the camera component 15, that is, within the imaging field of view of the camera.

[0048] Once the camera assembly 15 is adjusted so that the crosshair and the dicing path 32 of the silicon photonics wafer 30 are parallel to each other, the drive assembly 13 can further drive the probe station 11 and the deflection optical path assembly 12 to move synchronously, thereby driving the deflection optical path assembly 12 to move below the camera, that is, within the imaging field of view of the camera. The deflecting optical path assembly 12 includes at least a first reflective element 121 and a second reflective element 122, and the reflective surfaces of the first reflective element 121 and the second reflective element 122 can be perpendicular to each other and both form a 45-degree angle with the horizontal plane; when the driving assembly 13 moves the deflecting optical path assembly 12 to a set position below the camera, the first reflective element 121, the second reflective element 122 and the optical fiber end 20 should be distributed in a right-angled triangle; and the end face height of the optical fiber end 20 should be approximately the same as the height of the middle area of ​​the first reflective element 121 and the second reflective element 122; ensuring that the side view of the optical fiber end 20 can be deflected by 90° by the first reflective element 121 and the second reflective element 122 respectively and then incident vertically into the camera.

[0049] Based on this, the camera in the camera assembly 15 can be moved horizontally above the first reflective element 121, the second reflective element 122, and the optical fiber end 20. When the camera is directly above the first reflective element 121, the first side view of the optical fiber end 20 can be reflected to the camera through the first reflective element 121, allowing the camera to capture the first side image of the optical fiber end 20. This first side image is equivalent to the image formed by the optical fiber end 20 when the camera is positioned at the first reflective element 121 along a first horizontal direction pointing towards the optical fiber end 20. Similarly, when the camera moves directly above the second reflective element 122, it can also capture the second side image of the optical fiber end 20. This second side image is equivalent to the image formed by the optical fiber end 20 when the camera is positioned at the second reflective element 122 along a second horizontal direction pointing towards the optical fiber end 20. Furthermore, the first and second horizontal directions are perpendicular to each other. Based on the principles of geometric optics, when the end face of the fiber optic end 20 is not parallel to the horizontal plane, the angle between the end face of the fiber optic end 20 and the second horizontal direction can be determined through the first lateral image, while the angle between the end face of the fiber optic end 20 and the first horizontal direction can be determined through the second lateral image. Therefore, the fiber optic coupling module 14 can modulate the end face of the fiber optic end 20 to the horizontal plane based on these two angles.

[0050] Understandably, when the ambient light is sufficiently bright, a clear image of the end face contour of the fiber optic end 20 can be captured simply by reflecting the lateral image of the fiber optic end 20 to the camera using only the first reflective element 121 and the second reflective element 122. However, considering that the structural components in the test equipment 10 are relatively numerous and complex, resulting in relatively dim ambient light at the location of the fiber optic end 20, a light source assembly 16 may be further included in an optional embodiment of this disclosure to ensure a clearer image of the end face contour of the fiber optic end 20 in both the first and second lateral images. The light source assembly 16 is disposed on the support stage 120 of the deflecting optical path assembly 12. In this embodiment, the light source assembly 16 illuminates the fiber optic end 20, thereby ensuring the clarity of the image of the end face contour of the fiber optic end 20.

[0051] Further optionally, in this embodiment, the deflecting optical path assembly 12 may include a support stage 120 connected to the probe stage, and a first reflective element 121 and a second reflective element 122 disposed on the support stage 120 with their reflective surfaces forming a 45-degree angle with the horizontal plane.

[0052] The light source assembly 16 includes a first light source assembly 161 and a second light source assembly 162 disposed on the support stage 120;

[0053] The first light source assembly 161 is used to output a light beam to the first reflective element 121 along the first horizontal direction, and the first reflective element 121 is used to reflect the incident light beam in a vertically upward direction; the second light source assembly 162 is used to output a light beam to the second reflective element 122 along the second horizontal direction, and the second reflective element 122 is used to reflect the incident light beam in a vertically upward direction; and the optical path between the first light source assembly 161 and the first reflective element 121 intersects with the optical path between the second light source assembly 162 and the second reflective element 122 in a defined intersection area.

[0054] When the deflection optical path assembly 12 moves to below the camera assembly 15 via the second drive assembly 13, the fiber end 20 is located in the set intersection area.

[0055] The camera assembly 15 is used to capture a first lateral image when the camera is panned directly above the first reflective element 121, and to capture a second lateral image when the camera is panned directly above the second reflective element 122.

[0056] In the embodiments shown in Figures 5 and 6, the first light source assembly 161 is used to output a light beam to the first reflective element 121 along a first horizontal direction, and the first reflective element 121 is used to reflect the incident light beam in a vertically upward direction; the second light source assembly 162 is used to output a light beam to the second reflective element 122 along a second horizontal direction, and the second reflective element 122 is used to reflect the incident light beam in a vertically upward direction; and the optical path between the first light source assembly 161 and the first reflective element 121 intersects with the optical path between the second light source assembly 162 and the second reflective element 122 in a set intersection area; the first reflective element 121 and the second reflective element 122 are both at a 45° angle to the horizontal plane; when the deflection optical path assembly 12 moves to below the camera assembly 15 through the second drive assembly 13, the fiber end 20 is located in the set intersection area.

[0057] The camera assembly 15 is used to capture a first lateral image when the camera is moved directly above the first reflective element 121, and to capture a second lateral image when the camera is moved directly above the second reflective element.

[0058] Specifically, when the camera moves to directly above the first reflective element 121, the first light source assembly 161 can output a light beam to the first reflective element 121 along the first horizontal direction. The light beam incident on the first reflective element 121 is deflected by 90° and then vertically upwards to the camera. At this time, the image captured by the camera is the first side image.

[0059] Because the fiber end 20 of the fiber array is located between the first light source component 161 and the first reflective element 121, it will inevitably partially block the light output by the first light source component 161, thereby making the outline of the fiber end 20 appear in the first lateral image captured by the camera; and the outline of the fiber end 20 shown in the first lateral image is equivalent to the outline shown when viewing the fiber end 20 along the first horizontal direction. Obviously, based on the image shown in the first lateral image, the angle between the end face of the fiber end 20 and the second horizontal direction can be determined, and this angle is set as the first angle; based on this, the fiber end 20 is controlled to rotate around a rotation axis parallel to the first horizontal direction by the fiber coupling module 14, and the rotation angle is equal to the first angle. Obviously, after rotation, the end face of the fiber end 20 is parallel to the second horizontal direction.

[0060] Furthermore, to reduce the difficulty of determining the first angle between the end face of the fiber optic end 20 and the second horizontal direction, a first marking line can be further provided on the first reflective element 121, which is parallel to the second horizontal direction. Thus, in the first lateral image captured by the camera, the direction in which the first marking line is imaged also represents the first horizontal direction, and the first angle can be determined directly based on the angle between the end face contour line of the fiber optic end 20 and the first marking line.

[0061] Similarly, when the camera moves directly above the second reflective element 124, the second light source assembly 162 can output a light beam to the second reflective element 122 along the second horizontal direction. The light beam incident on the second reflective element 122 also undergoes a 90° deflection and is incident on the camera, so that the camera can acquire a second side image. Similar to the first side image mentioned above, the outline of the fiber end 20 shown in the second side image in this embodiment is equivalent to the outline shown when viewing the fiber end 20 along the second horizontal direction. That is, based on the second side image, the second included angle between the end face of the fiber end 20 and the first horizontal direction can be determined. By controlling the fiber end 20 to rotate at the second included angle with a rotation axis parallel to the second horizontal direction through the fiber coupling module 14, the end face of the fiber end 20 and the first horizontal direction can be made parallel to each other.

[0062] Similar to the first marking line provided on the first reflective element 121, a second marking line 1221 parallel to the first horizontal direction can also be provided on the second reflective element 122, thereby facilitating the determination of the second included angle based on the imaging of the second marking line 1221 and the end face contour line of the fiber end 20 in the second lateral image.

[0063] Furthermore, in this embodiment, the first light source component 161 and the second light source component 162 can be surface light sources, and the light beams output by the first light source component 161 and the second light source component 162 are both parallel light beams, thereby ensuring that the light beams output by the first light source component 161 and the second light source component 162 can more clearly illuminate the outline of the fiber end 20.

[0064] In addition, in order to ensure that the fiber end 20 is located in the above-mentioned set area so that the end face of the fiber end 20 is adjusted to be horizontal, a height probe structure 147 is also provided on the end connection structure 3 of the fiber coupling module 14 for connecting the fiber end 20.

[0065] Correspondingly, a calibration base plate 123 is also provided on the support platform 120.

[0066] When the driving component 13 drives the deflection optical path component to move until the lower surface of the height detection structure 147 and the upper surface of the calibration substrate 123 are within a set height range, the fiber end 20 is located in the set intersection area.

[0067] In this embodiment, the height probe structure 147 and the calibration substrate 123 are used as mutual identifiers. By measuring the relative height between the two, it is ensured that the fiber end 20 is exactly located in the above-mentioned set intersection area, that is, in the optical path of the deflection optical path component, thereby reducing the difficulty of adjusting the drive deflection component 12 to adjust the fiber end 20 to be located in the set intersection area.

[0068] In another optional implementation of this embodiment, the height detection structure can be a nanocapacitive displacement sensor, which can further detect the vertical distance between the end connection structure 3 that clamps and connects the end of the optical fiber 20 and other structural components below it during the subsequent position adjustment of the optical fiber end 20, thereby avoiding collisions between the optical fiber end 20 and other structural components.

[0069] Referring to FIG6, in another optional embodiment of this embodiment, the deflecting optical path component 12 may further include:

[0070] The first light source assembly 161 includes a first surface light source 1611 and a third reflective element 1612; the second light source assembly 162 includes a second surface light source and a fourth reflective element; and the first reflective element 121, the second reflective element 122, the third reflective element 1612 and the fourth reflective element are all right-angled triangular prisms, and a reflective film layer is provided on the inclined reflective surface of the right-angled triangular prism.

[0071] The oblique reflective surface of the third reflective element 1612 is located on the output light path of the first surface light source 1611. It is used to reflect the light beam output by the first surface light source 1611 along the first horizontal direction through the set intersection area and incident on the first reflective element 121, so that the first reflective element 121 reflects the light carrying the lateral contour information of the fiber end 20.

[0072] The oblique reflective surface of the fourth reflective element is located in the output light path of the second light source. It is used to reflect the light beam output by the second light source along the second horizontal direction through the set intersection area and into the second reflective element 122, so that the second reflective element 122 reflects the light carrying the lateral contour information of the fiber end 20.

[0073] Figure 6 shows the optical path structure between the first surface light source 1611 and the first reflective element 121. In addition to the first surface light source 1611, the first surface light source 1611 structure further includes a third reflective element 1612 in the output optical path of the first surface light source 1611. Therefore, in this embodiment, in order to ensure that the beam of light output vertically upward from the first surface light source 1611 is first incident vertically onto the right-angled side vertical plane of the third reflective element 1612, and is deflected by 90° by the inclined reflective surface in the third reflective element 1612, and then incident on the first reflective element 121 along the first horizontal direction, the optical path structure composed of the first surface light source 1611 and the third reflective element 1612 can finally output a beam of light to the first reflective element 121 along the first horizontal direction.

[0074] In practical applications, the first surface light source 1611 can be a surface light source or a light source that outputs a diverging beam. In this case, optical elements such as convex lenses can be further added to the first light source assembly 161 to modulate the diverging beam, so that the first light source assembly 161 outputs a parallel beam.

[0075] Based on the above discussion, when the end face of the fiber array is parallel to both the first horizontal direction and the second horizontal direction, it is clear that the end face of the fiber array is also in the horizontal plane.

[0076] After adjusting the end face of the fiber optic end 20 to be horizontal, a vertical image can be further captured vertically downwards from above the fiber optic end 20 using a camera. Obviously, the third angle between the vertical plane where the side wall of the fiber optic end 20 is located and the crosshair in the camera can be displayed in the vertical image. By controlling the fiber optic coupling module 14 to rotate the fiber optic end 20 around the vertical rotation axis at the third angle, the fiber optic end 20 can be adjusted to a state where the outline and the crosshair of the camera are aligned with each other.

[0077] As mentioned earlier, the dicing 32 of the silicon photonic wafer 30 has been adjusted to be parallel to the crosshair in the camera. Thus, when the driving component 13 drives the probe station 11 back to below the camera, the fiber end 20 located below the camera and the silicon photonic wafer 30 are simultaneously positioned so that the outline of the fiber end 20 and the silicon photonic wafer 30 are parallel to each other, thus achieving the initial positioning between the fiber end 20 and the silicon photonic wafer 30.

[0078] Furthermore, the camera in the camera system of this disclosure can be a multi-magnification fixed-magnification lens.

[0079] Based on any of the above embodiments, referring to FIG7, the fiber coupling module 14 that realizes the position adjustment of the fiber end 20 in space in this disclosure may include three translation components and three rotation components connected in sequence, as well as the end connection structure 3.

[0080] Among them, three translation components are used to drive the end connection structure 3 to translate along the first direction, the second direction and the third direction respectively; three rotation components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis and the third rotation axis respectively; the first direction, the second direction and the third direction are perpendicular to each other; the first rotation axis, the second rotation axis and the third rotation axis are perpendicular to each other.

[0081] The fiber optic coupling module 14 in this embodiment can realize movement of the fiber end 20 in six different degrees of freedom directions, that is, it can translate along the first direction, the second direction, and the third direction, and rotate around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. The fiber optic coupling module 14 in this embodiment simply connects the structural components that realize one degree of freedom of movement in series, and finally realizes the movement of the fiber end 20 in six different degrees of freedom. The structure is simple, easy to implement, and helps to reduce the practical cost of the equipment.

[0082] Based on this, the fiber optic coupling module 14 in this embodiment may specifically include:

[0083] The first translation component 141, the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145, and the third rotation component 146 are connected in sequence; the end connection structure 3 of the fiber optic coupling module 14 is connected to the third rotation component 146.

[0084] The first translation component 141 is used to drive the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3 to translate synchronously along the first direction.

[0085] The second translation component 142 is used to drive the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3 to translate synchronously along the second direction.

[0086] The third translation component 143 is used to drive the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3 to translate synchronously along the third direction.

[0087] The first rotating component 144 is used to drive the second rotating component 145, the third rotating component, and the end connection structure 3 to rotate synchronously around the first rotating axis as the rotation center.

[0088] The second rotating component 145 is used to drive the third rotating component 146 and the end connecting structure 3 to rotate synchronously around the second rotating axis as the rotation center.

[0089] The third rotating component 146 is used to drive the end connection structure 3 to rotate around the third rotating axis as the rotation center;

[0090] Among them, the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are parallel to each other; and the first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

[0091] As shown above, using the fiber coupling module 14 to drive the fiber end 20 to move can only achieve preliminary alignment between the fiber end 20 and the optical waveguide 31 on the silicon photonic wafer 30. Therefore, the fiber coupling module 14 in this disclosure is also connected to a piezoelectric displacement stage 4 via the end connection structure 3 that connects to the fiber end 20. When different control voltages are applied, the end connection structure 3 drives the fiber end 20 to move, so as to control the alignment and coupling between the fiber end 20 and the silicon photonic wafer 30.

[0092] In actual testing, each fiber in the fiber array is typically connected to a photodetector for coupling at one end of the fiber end 20 that is opposite to the fiber coupling module 14. Based on this, the piezoelectric displacement stage 4 in this embodiment is specifically a driving device containing piezoelectric ceramics. As the voltage of the piezoelectric displacement stage 4 changes, the piezoelectric ceramics in the stage 4 can drive the fine-tuning of the position of the fiber end 20. During this process, light waves can be input into the fiber array. These light waves propagate from the port of the fiber end 20 to the optical interface of the optical waveguide 31. After propagation within the optical waveguide 31, the light waves can be re-transmitted to the fiber port 21 and received by the photodetector for coupling after fiber propagation. When the optical fiber port 21 of the fiber array and the optical interface of the optical waveguide 31 reach the optimal alignment coupling state, the optical wave power transmitted back through the optical waveguide 31 is also the maximum. As a result, as the piezoelectric displacement stage 4 moves with the fine adjustment of the fiber end 20, the magnitude of the optical wave power measured by the coupling photodetector also changes. When the power measured by the coupling photodetector is the maximum, that is, when the alignment coupling between the optical fiber port 21 of the fiber array and the optical interface of the optical waveguide 31 is the best, fine alignment coupling between the fiber array and the optical waveguide 31 can be achieved.

[0093] In addition, to avoid the distance between the fiber end 20 and the silicon photonic wafer 30 being too close, a nanocapacitive displacement sensor is used to detect the relative position between the fiber end 20 and the silicon photonic wafer 30 below it, so as to avoid the fiber end 20 being too low and causing damage to the silicon photonic wafer 30.

[0094] In summary, the silicon photonics wafer testing equipment of this disclosure is configured with a deflection optical path component and an optical fiber coupling module, and the deflection optical path component and the probe station are jointly connected to the driving component 13. This allows the driving component 13 to switch between the deflection optical path component and the probe station carrying the wafer within the imaging field of view of the camera component. Thus, when the probe station carrying the wafer is moved into the imaging field of view of the camera component, the camera component is adjusted so that the coordinate system of the camera component is parallel to the dicing track on the wafer. When the deflection optical path component is moved and switched into the imaging field of view of the camera component, the deflection optical path component deflects and transmits at least two different lateral images of the fiber end to the camera component, thereby acquiring the lateral image of the fiber end. Based on the lateral image and the direction of the coordinate system of the camera component, the fiber coupling module can be used to adjust the pose of the fiber end, thereby achieving the initial alignment of the fiber end with the silicon photonics wafer. The silicon photonic wafer testing equipment disclosed herein only requires one set of camera components, and the alignment process corresponding to the testing equipment is simple and easy to operate, realizing the initial alignment between the fiber end and the silicon photonic waveguide, providing a favorable control basis for subsequent precise alignment and coupling, simplifying the structure of the adjustment mechanism in the entire testing equipment, and reducing equipment costs.

[0095] The second specific embodiment provided in this disclosure also discloses a silicon photonics wafer testing method, wherein the silicon photonics wafer testing method includes an optical fiber pose adjustment method and an alignment coupling method. As shown in Figure 8, the silicon photonics wafer testing method is applied to the silicon photonics wafer testing equipment in the first specific embodiment as described in any of the preceding claims.

[0096] In a second specific embodiment of this disclosure, the silicon photonics wafer testing method includes:

[0097] S1: Control drive component 13 drives the silicon photonic wafer to be translated into the imaging field of view of the camera component. The camera component is adjusted by the wafer image acquired by the camera component so that the coordinate system of the camera component and the dicing track on the silicon photonic wafer are parallel to each other.

[0098] S2: Control the silicon photonic wafer to move out of the imaging field of view of the camera assembly, and move the deflection optical path assembly into the imaging field of view of the camera assembly, and acquire lateral images corresponding to at least two different lateral images of the end of the optical fiber that is deflected by the deflection optical path assembly through the camera assembly.

[0099] S3: Based on the orientation of the lateral image and the coordinate system of the camera assembly, the fiber coupling module adjusts the pose of the fiber end and controls the drive component 13 to drive the silicon photonic wafer to translate into the imaging field of view of the camera assembly, so that the fiber array and the silicon photonic wafer are initially aligned.

[0100] Optionally, the process of adjusting the camera assembly to make the camera assembly coordinate system and the dicing track on the silicon photonics wafer parallel to each other may specifically include:

[0101] S11: Control drive component 13 drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component;

[0102] S12: Used to acquire wafer images of silicon photonic wafers via camera components;

[0103] S13: Adjust the camera assembly using the wafer image so that the crosshair of the camera in the camera assembly is aligned with the dicing track on the silicon photonics wafer.

[0104] Optionally, the fiber coupling module is controlled to adjust the pose of the fiber end according to the orientation of the lateral image and the camera assembly coordinate system, and the driving component 13 is controlled to drive the silicon photonic wafer to translate into the imaging field of view of the camera assembly, so as to initially align the fiber array with the silicon photonic wafer, including:

[0105] S31: The camera assembly acquires lateral images in the first and second horizontal directions through the reflection of the optical fiber end by the deflection optical path assembly, thereby obtaining a first lateral image and a second lateral image; wherein the first and second horizontal directions are perpendicular to each other.

[0106] S32: Control the fiber coupling module to adjust the end face of the fiber end to the horizontal plane according to the first lateral image and the second lateral image;

[0107] S33: Acquire vertical images of the fiber optic end from the vertical direction using a camera assembly;

[0108] S34: According to the vertical image control fiber coupling module, adjust the outline of the fiber end to be parallel to the crosshair of the camera.

[0109] In this embodiment, by acquiring the side images corresponding to the side views of the fiber end 20 in two mutually perpendicular directions, the tilt angle between the end face of the fiber end 20 and the horizontal plane can be obtained. Based on the tilt angle, the end face of the fiber end 20 can be adjusted to be horizontal.

[0110] Further, step S32 may also include:

[0111] S321: Determine the first included angle between the end face of the fiber optic end and the second horizontal direction based on the end face contour line imaged in the first lateral image.

[0112] S322: Control the fiber optic coupling module to drive the fiber end to rotate around the second rotation axis by a first included angle; wherein, the second horizontal direction and the second rotation axis are parallel to each other;

[0113] S323: Determine the second included angle between the end face of the fiber optic end and the first horizontal direction based on the end face contour line imaged in the second lateral image.

[0114] S324: Control the fiber coupling module to drive the fiber end to rotate around the first rotation axis by a second included angle; wherein, the first horizontal direction and the first rotation axis are parallel to each other.

[0115] Based on the deflection optical path component in the above-mentioned test equipment embodiment, it can be seen that the first lateral image in this embodiment is equivalent to taking an image of the fiber end along the first horizontal direction. Based on the imaging position of the end face contour line of the fiber end in the first lateral image, the first included angle between the end face of the fiber end and the second horizontal direction can obviously be determined.

[0116] Furthermore, when a first marking line parallel to the second horizontal direction is provided on the first reflective element in the deflection optical path assembly, the first angle can be directly determined based on the angle between the first marking line and the end face contour line of the optical fiber end in the first lateral image.

[0117] Similarly, when the second reflective element in the deflecting optical path assembly is provided with a second marking line that is parallel to the first horizontal direction, the second included angle can also be determined directly based on the second marking line. This will not be elaborated further in this embodiment.

[0118] Furthermore, referring to Figure 7, based on the embodiment of the above-described test equipment, the fiber optic coupling module in this disclosure may include a first translation component 141, a second translation component 142, a third translation component 143, a first rotation component 144, a second rotation component 145, and a third rotation component 146 connected in series. The first translation component 141, the second translation component 142, and the third translation component 143 are used to achieve translation in the first direction, the second direction, and the third direction, respectively; while the first rotation component 144, the second rotation component 145, and the third rotation component 146 are used to achieve rotation around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. As shown in Figure 7, an XYZ three-dimensional Cartesian coordinate system is established, where the X-axis, Y-axis, and Z-axis are parallel to the first direction, the second direction, and the third direction, respectively, and the first rotation axis, the second rotation axis, and the third rotation axis are also parallel to the X-axis, the Y-axis, and the Z-axis, respectively.

[0119] Furthermore, in this embodiment, the first direction should be parallel to the first horizontal direction of acquiring the first lateral image, while the second direction should be parallel to the second horizontal direction of acquiring the second lateral image.

[0120] Therefore, when the fiber end is rotated at the first included angle in a direction parallel to the second direction by a six-axis series displacement platform, that is, the fiber end is driven to rotate at the second included angle around the second rotation axis by the second rotation component.

[0121] However, this rotation will inevitably cause a change in the position of the fiber optic end in space, and may even move it out of the camera's field of view. Therefore, after driving the fiber optic end to rotate around the second rotation axis by the second rotation component at the second included angle, it can further include:

[0122] The fiber optic coupling module is used to drive the fiber end to translate a distance L2(1-cosθ1) along the first direction and a distance L2sinθ1 upward along the third direction; where L2 is the distance between the fiber end and the second rotation axis; and θ1 is the first included angle.

[0123] Understandably, in practical applications, the fiber end can be driven to translate a distance L2(1-cosθ1) along the first direction by the first translation component in the fiber coupling module, and then the fiber end can be driven to translate a distance L2sinθ1 along the third direction by the third translation component. In this way, the fiber end can return to its original position while achieving rotational adjustment.

[0124] Similarly, after driving the fiber end to rotate around the second rotation axis at a second included angle using the second rotating component, the process may further include:

[0125] The fiber optic coupling module drives the fiber end to translate a distance L1(1-cosθ2) along the second direction and a distance L1sinθ2 upward along the third direction; where L1 is the distance between the fiber end and the first rotation axis; and θ2 is the second included angle.

[0126] Specifically, the second translation component can be used to drive the fiber end to translate a distance of L1(1-cosθ2) along the second direction, and then the third translation component can be used to drive the fiber end to translate a distance of L1sinθ2 along the third direction. In this way, after the end face of the fiber end is brought to the horizontal plane, the position of the fiber end remains unchanged.

[0127] It is understandable that the fiber optic end is roughly rectangular in shape. The vertical image taken from directly above the fiber optic end is also a top view of the fiber optic end. Each fiber optic port is arranged on one side of the cuboid. Adjusting the outline of the fiber optic end to be parallel to the crosshair of the camera means that the vertical plane where each fiber optic port is located is parallel to one of the lines of the crosshair. As mentioned earlier, the two lines of the crosshair are parallel to the two dicing marks on the silicon photonics wafer, respectively. Thus, the plane where each fiber optic port is located is parallel to one of the dicing marks on the silicon photonics wafer.

[0128] In an optional implementation of this embodiment, the process of rotating and adjusting the fiber end based on the vertical image may include:

[0129] Based on the end face contour line of the fiber end imaged in the vertical image, determine the third included angle between the end face contour line of the fiber end and the crosshair cursor.

[0130] The fiber optic coupling module is used to drive the fiber end to rotate around a third included angle about a third rotation axis; wherein the third rotation axis is a vertical rotation axis.

[0131] In this embodiment, the third rotating component in the optical fiber coupling module can be used to drive the end of the optical fiber to rotate around the third rotating axis at a third included angle.

[0132] Based on the above discussion, in this embodiment, the crosshair in the camera lens is first adjusted to be parallel to the dicing marks on the silicon photonics wafer. Then, by utilizing the interaction between the deflection optical path assembly and the camera, two mutually perpendicular horizontal lateral images and a second lateral image are acquired at the end of the optical fiber. Based on these images, the angle between the end face of the optical fiber in the fiber array and the horizontal plane can be determined. Then, a six-axis serial displacement platform is used to control the optical fiber end to rotate and adjust in the first and second horizontal directions respectively, so that the end face of the optical fiber is adjusted to the horizontal plane. Furthermore, the camera is used to... A vertical image of the fiber optic end is measured in a downward direction. Based on this vertical image, the angle between the side of the fiber optic end and the crosshair of the camera can be determined. Then, a six-axis serial displacement platform is used to control the fiber optic end to rotate around the vertical axis, so that the side of the fiber optic end and the crosshair of the camera are aligned parallel to each other. On this basis, since the crosshair of the camera and the dicing marks on the silicon photonics wafer are parallel to each other, the silicon photonics wafer is then moved back to be directly below the camera. The sidewall of the fiber optic end will then be parallel to the dicing marks on the silicon photonics wafer, thus achieving the initial alignment and coupling between the fiber optic end and the optical waveguide on the silicon photonics wafer.

[0133] In one optional embodiment of this disclosure, after achieving initial alignment coupling between the fiber end and the silicon photonic wafer, the process may further include:

[0134] The camera assembly is controlled to acquire aligned images of the fiber optic end and the silicon photonic wafer within the same frame.

[0135] Based on the imaging positions of the fiber port at the end of the optical fiber and the optical interface in the silicon photonics wafer in the alignment image, the fiber coupling module is controlled to drive the end of the optical fiber to translate along the first and second directions, so as to achieve initial alignment and coupling between the fiber port and the optical interface at the end of the optical fiber.

[0136] Referring to Figures 4 and 9, each fiber optic port 21 is arranged side-by-side on the side of the fiber optic end 20. Therefore, the position of each fiber optic port 21 in the alignment image can be determined based on the imaging position of the side of the fiber optic end 20. Furthermore, the optical interfaces of each optical waveguide 31 are also imaged in the alignment image. Based on this alignment image, the relative position between a fiber optic port 21 and an optical interface can be determined. Thus, the fiber optic coupling module can drive the fiber optic end 20 to translate horizontally, positioning a fiber optic port 21 directly above an optical interface, thereby achieving initial alignment between the fiber optic port 21 and the optical interface.

[0137] Building upon this, to achieve even more precise alignment between fiber optic ports and optical interfaces, after moving a fiber optic port directly above an optical interface, the following further steps can be taken:

[0138] Control the output light wave of the corresponding optical fiber at each optical fiber end;

[0139] The piezoelectric displacement stage connected to the end connection structure of the fiber optic coupling module drives the fiber end to translate in the horizontal plane.

[0140] The optical power that changes with the translational movement of the fiber end is detected by a photodetector connected to the end of the optical fiber away from the fiber end.

[0141] The optimal coupling position between the fiber end and each waveguide in the silicon photonic wafer is determined by the location of the fiber end corresponding to the maximum optical power.

[0142] In this embodiment, light waves can be input into the fiber optic array. These light waves are transmitted from the fiber optic port to the optical interface of the optical waveguide, and after propagation within the optical waveguide, they are transmitted to the optical interface and then back to the fiber optic port, where they are received by the photodetector used for coupling. Therefore, the better the alignment coupling effect between the fiber optic port of the fiber optic array and the optical interface of the optical waveguide, the greater the power of the light wave that is re-propagated back through the optical waveguide. As the piezoelectric displacement stage moves with the fine adjustment of the fiber end, the power of the light wave measured by the photodetector used for coupling also changes. When the power measured by the photodetector used for coupling is the maximum, that is, when the alignment coupling between the fiber optic port of the fiber optic array and the optical interface of the optical waveguide is the best, fine alignment coupling between the fiber optic array and the optical waveguide can be achieved.

[0143] This disclosure also provides an embodiment of a silicon photonics wafer testing system, which may include an optical performance tester, a controller, and the silicon photonics wafer testing equipment as described in the first specific embodiment above.

[0144] The controller is used to perform the steps of the silicon photonics wafer testing method as described in any of the preceding claims using the silicon photonics wafer testing equipment.

[0145] It is understood that the controller in this embodiment can be built into the test equipment or it can be a host computer connected to the test equipment; in short, it can control and realize automated testing of silicon photonic wafers.

[0146] In addition, the optical performance tester has a built-in motion controller that communicates with the aforementioned fiber coupling module and piezoelectric displacement stage, a tunable light source for outputting light waves to the fiber array, a tunable light source and a polarization scrambler connected to the end of the fiber array away from the aforementioned fiber end, and an optical power meter and a coupling photodetector connected to the output end of the polarization scrambler.

[0147] In practical applications, the motion controller first controls the fiber coupling module to drive the attitude adjustment of the fiber end, achieving initial alignment between the fiber end and the optical waveguide on the silicon photonic wafer. Then, a tunable light source outputs light waves to the fiber in the fiber array. These light waves are transmitted through the fiber end to the optical waveguide on the silicon photonic wafer, and the light waves transmitted back from the silicon photonic wafer are received. These light waves are then transmitted along the fiber in the fiber array to the polarization scrambler, and split into two light waves by the polarization scrambler, which are transmitted to the photodetector for coupling and the optical power meter, respectively. The photodetector for coupling converts the received optical signal into a voltage signal, which is then used by the motion controller to control the piezoelectric displacement stage to finely adjust the position of the fiber end. The position point corresponding to the fiber end when the voltage signal is at its maximum is taken as the optimal alignment and coupling position point between the fiber end and the optical waveguide on the silicon photonic wafer.

[0148] The third specific embodiment provided in this disclosure also discloses a silicon photonics wafer testing device, which can achieve precise motion adjustment of optical fiber or optical fiber array in six degrees of freedom, thereby accelerating the rapid alignment and coupling between optical fiber or optical fiber array and silicon photonic waveguide, reducing the difficulty of alignment and coupling, and the overall structure of the silicon photonics wafer testing device is simple and easy to implement, which helps to reduce equipment cost.

[0149] It is understood that the silicon photonics wafer testing equipment in this disclosure is mainly used to control the positional adjustment of the fiber end of an optical fiber or fiber array.

[0150] In a third specific embodiment of this disclosure, the silicon photonics wafer testing equipment may include:

[0151] Fiber optic coupling module 14; piezoelectric displacement stage 4 connected to fiber optic coupling module 14; and end connection structure 3 fixedly connected to piezoelectric displacement stage 4 for connecting fiber array end 6 or single fiber end 5.

[0152] The fiber optic coupling module 14 includes three translational components and three rotational components connected in series. The three translational components are used to drive the end connection structure to translate along the first direction, the second direction, and the third direction, respectively. The three rotational components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

[0153] Referring to Figures 10 and 11, the silicon photonics wafer testing equipment of this embodiment is used to drive and adjust the fiber end of the fiber array or a single fiber to move in space. When the port of the fiber end and the optical interface of the optical waveguide on the silicon photonics wafer reach the optimal coupling position, so that the optical power loss of the optical wave transmission between the port of the fiber end and the optical interface of the optical waveguide is minimized, the alignment coupling between the port of the fiber end and the optical interface of the optical waveguide on the silicon photonics wafer is realized.

[0154] During the alignment and coupling adjustment process, in addition to adjusting the position of the fiber tip in three-dimensional space, it is also necessary to adjust the attitude of the fiber tip, such as its pitch and tilt angles. This requires the alignment and coupling mechanism of the silicon photonics wafer testing equipment to not only realize the translational movement of the fiber tip in three-dimensional space, but also to realize the rotational adjustment of the fiber tip in three-dimensional space to adjust the pitch and tilt angles. To this end, the silicon photonics wafer testing equipment in this disclosure can drive the fiber tip to achieve six different degrees of freedom of movement.

[0155] Furthermore, in an optional implementation of this embodiment, the three translation components may include a first translation component 141, a second translation component 142, and a third translation component 143 connected in series; the three rotation components include a first rotation component 144, a second rotation component 145, and a third rotation component 146 connected in series; the third translation component 143 is connected to the first rotation component 144; and the third rotation component 146 is connected to the end connection structure 3.

[0156] The first translation component 141 is used to drive the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3 to translate synchronously along the first direction.

[0157] The second translation component 142 is used to drive the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3 to translate synchronously along the second direction.

[0158] The third translation component 143 is used to drive the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3 to translate synchronously along the third direction.

[0159] The first rotating component 144 is used to drive the second rotating component 145 and the third rotating component 146 and the end connection structure 3 to rotate synchronously around the first rotating axis as the rotation center.

[0160] The second rotating component 145 is used to drive the third rotating component 146 and the end connection structure 3 to rotate synchronously around the second rotating axis as the rotation center.

[0161] The third rotating component 146 is used to drive the end connection structure 3 to rotate around the third rotating axis as the rotation center.

[0162] Among them, the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are all parallel to each other.

[0163] Referring to Figure 10, the silicon photonics wafer testing equipment of this disclosure can realize translational movements in two mutually perpendicular directions: a first direction, a second direction, and a third direction. It can also realize rotational movements centered on two mutually perpendicular rotation axes: a first rotation axis, a second rotation axis, and a third rotation axis. Referring to the three-dimensional Cartesian coordinate system shown in Figure 10, the X-axis, Y-axis, and Z-axis in the three-dimensional Cartesian coordinate system are parallel to the first direction, the second direction, and the third direction, respectively. Simultaneously, the X-axis, Y-axis, and Z-axis are also parallel to the first rotation axis, the second rotation axis, and the third rotation axis, respectively.

[0164] To achieve six degrees of freedom of motion, including translation in three directions and rotation along three rotation axes, the silicon photonics wafer testing equipment of this disclosure employs a corresponding component structure for each degree of freedom. Specifically, the first translation component 141 achieves translation in the first direction, the second translation component 142 achieves translation in the second direction, and the third translation component 143 achieves translation in the third direction. The first rotation component 144 achieves rotation around the first rotation axis, the second rotation component 145 achieves rotation around the second rotation axis, and the third rotation component 146 achieves rotation around the third rotation axis. Thus, each component structure in the silicon photonics wafer testing equipment of this disclosure achieves driving motion in only one degree of freedom, and these component structures are connected in series.

[0165] In the silicon photonics wafer testing equipment, the first translation component 141 is directly and fixedly connected to the main platform of the silicon photonics wafer testing equipment, while the two relatively translatable parts of the second translation component 142 are respectively connected to the first translation component 141 and the third translation component 143; the first rotation component 144 and the second translation component 142 are respectively connected to the two relatively translatable parts of the third translation component 143; similarly, the two relatively rotatable parts of the second rotation component 145 are respectively connected to the first rotation component 144 and the third rotation component 146, and the two relatively rotatable parts of the third rotation component 146 are respectively connected to the second rotation component 145 and the end connection structure 3; the end connection structure 3 is also the structure that connects to the end of a single optical fiber or an optical fiber array.

[0166] Based on this, when the first translation component 141 in this disclosure translates along the first direction at the end of the optical fiber connected to the drive and end connection structure 3, the first translation component 141 can drive the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145 and the third rotation component 146 and the end connection structure 3, etc., to translate synchronously along the first direction, thereby indirectly driving the end of the optical fiber to translate along the first direction.

[0167] Similarly, the second translation component 142 also drives the fiber end to translate in the second direction by driving the entire structure, including the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure 3, to translate synchronously in the second direction.

[0168] The first rotating component 144 drives the second rotating component 145 and the third rotating component 146, as well as the end connection structure 3, to rotate synchronously around the first rotating axis, thereby indirectly driving the fiber end to rotate around the first rotating axis. Similarly, the second rotating component 145 drives the third rotating component 146 and the end connection structure 3 to rotate synchronously around the second rotating axis, thereby indirectly driving the fiber end to rotate around the first rotating axis. The third rotating component 146 directly drives the end connection structure 3 to rotate the fiber end around the third rotating axis. Thus, the movement of the six different free ends of the fiber end is finally realized.

[0169] Based on the above discussion, each component structure in the silicon photonics wafer testing equipment disclosed herein only needs to achieve a single degree of freedom of driven movement, which simplifies the complexity of the motion trajectory required by each component structure, thereby ensuring the accuracy of the driven movement of the silicon photonics wafer testing equipment in each degree of freedom; furthermore, the various component structures in this embodiment only need to be simply spliced ​​together in sequence, making the overall structure of the silicon photonics wafer testing equipment simpler and easier to implement, completely eliminating the need for complex mechanical structures, which helps to reduce the equipment cost of the silicon photonics wafer testing equipment.

[0170] As described above, the silicon photonics wafer testing equipment of this disclosure may require adjustment of the fiber end movement of a single optical fiber or adjustment of the fiber end movement of an optical fiber array in practical applications. Therefore, in an optional embodiment of this disclosure, the silicon photonics wafer testing equipment may further include:

[0171] The end connection structure 3 is detachably connected to one of the first clamping assembly and the second clamping assembly; the first clamping assembly is used to clamp the end 5 of a single optical fiber; the second clamping assembly is used to clamp the end structure of the optical fiber array.

[0172] In this embodiment, the end connection structure 3 can be detachably connected to both the first clamping component and the second clamping component. Therefore, in practical applications, the clamping component connected to the end connection structure 3 can be switched between the first clamping component and the second clamping component at any time based on testing needs, providing convenience for users' actual application needs.

[0173] In addition, in order to facilitate quick disassembly and switching between the first clamping assembly and the second clamping assembly and the end connection structure 3 respectively, a groove structure can be further provided on the end connection structure 3; a first magnetic attractor is provided in the groove structure.

[0174] Both the first clamping assembly and the second clamping assembly are provided with a second magnetic attractor; the first magnetic attractor and the second magnetic attractor can magnetically attract each other.

[0175] It is understandable that a groove structure is provided on the end connecting structure 3 so that the first magnetic attractor and the second magnetic attractor are attracted to each other within the groove structure. In practical applications, the first and second clamping structures should be equipped with protrusions that match the shape of the groove structure, and the second magnetic attractor also has a surface with a concave-convex structure. Thus, the mutual cooperation between the groove structure and the protrusion structure can, to a certain extent, limit the relative positional relationship between the end connecting structure 3 and the first clamping assembly, as well as between the end connecting structure 3 and the first clamping assembly. Of course, in practical applications, the second magnetic attractor can also be directly set to protrude outward from the surface of the first and second clamping assemblies, and have a shape that matches the shape of the groove structure. This allows the first and second magnetic attractors to attract each other, while the groove structure limits the second magnetic attractor, thus also limiting the relative positional relationship between the end connecting structure 3 and the first clamping assembly, as well as between the end connecting structure 3 and the first clamping assembly.

[0176] As shown in Figure 12, in an optional embodiment of this example, the first clamping component may include:

[0177] The optical fiber clamp 311 is detachably connected to the end connection structure 3, a height detection structure 147 is disposed below the optical fiber clamp 311, and a probe 313 is connected to the height detection structure 147. The height detection structure 147 can be a height detector, for example, a nanocapacitive displacement sensor.

[0178] The fiber optic clamp 311 is provided with a first slot 3110 that extends vertically and matches the contour shape of the end of a single fiber optic cable.

[0179] The tip of probe 313 extends directly below the first slot 3110.

[0180] A detachable connection exists between the height probe structure 147 and the fiber optic clamp 311.

[0181] Referring to Figure 12, the fiber optic clamp 311 in this embodiment is generally in the form of a plate-shaped block structure, and one end is provided with a first slot 3110 that extends in a generally vertical direction. The shape of the first slot 3110 matches the shape and contour of the end 5 of a single fiber, and is generally cylindrical.

[0182] Based on this, a height detection structure 147 and a probe 313 are connected below the first slot 3110. When the end of a single optical fiber 5 is inserted into the first slot 3110 and its port extends out from below the first slot 3110, the port of the end of the single optical fiber 5 should be exactly abutting against the probe 313. Thus, the probe 313 can limit the port of the end of the single optical fiber 5 from extending further downward, that is, it limits the height of the port of the end of the single optical fiber 5 in the pointing direction. In addition, because the probe 313 is also connected to the height detection structure 147, the height detection structure 147 can detect the relative height of other structural components (such as silicon photonic wafers) below, avoiding collisions between the end of the single optical fiber 5 and the structural components below it, thus preventing damage.

[0183] In the embodiment shown in Figure 12, a pad 314 of a certain thickness is provided between the fiber optic clamp 311 and the probe height structure 147, so that the probe 313 and the first slot 3110 are separated by a sufficiently large distance, ensuring that the length of the single fiber end 5 extending downward from below the first slot 3110 is long enough.

[0184] Furthermore, when actually adjusting the alignment and coupling between the port of the single fiber end 5 and the optical interface of the optical waveguide, it is necessary to remove the height sensor and probe 313 from the fiber clamp 311 to ensure that the port of the single fiber end 5 is fully exposed. This facilitates the subsequent adjustment of the position of the single fiber end 5, allowing the camera and other vision systems to capture images of the port of the single fiber end 5. In practical applications, the pad 314, the height probe structure 147, and the probe 313 can be fixedly connected together, while the pad 314 is detachably connected to the fiber clamp 311. Thus, after the fiber end of the tube is inserted into the fiber clamp 311 and its vertical height is adjusted, the pad 314, the height probe structure 147, and the probe 313 can be detached together. In addition, to simplify the operation of the detachable connection between the fiber optic clamp 311 and the pad 314, a sliding strip and a sliding groove 1021 that can be interlocked can be provided between the lower surface of the fiber optic clamp 311 and the upper surface of the pad 314, thereby realizing the detachable connection between the fiber optic clamp 311 and the pad 314, that is, realizing the detachable connection between the probe structure 147 and the probe 313 and the fiber optic clamp 311.

[0185] Furthermore, as described above, the first clamping assembly and the end connection structure 3 can be detachably connected to each other via a first magnetic chuck and a second magnetic chuck, wherein the second magnetic chuck can be disposed on the surface where the fiber optic clamp 311 and the end connection structure 3 are in contact with each other.

[0186] Based on the above discussion, as shown in Figure 13, in another optional implementation of this embodiment, the second clamping component for clamping the fiber array end 6 may include:

[0187] A fiber array clamp 321 that can be detachably connected to the end connection structure 3, and a limiting structure 323 that can be connected to the fiber array clamp.

[0188] The fiber array clamp 321 is provided with a second slot 322 that matches the contour shape of the fiber array end 6.

[0189] The limiting structure 323 and the fiber array clamp 321 are detachably connected, and the limiting recess 3231 extends to the bottom of the second slot 322 to limit the height of the fiber array end 6 in the vertical direction.

[0190] The fiber array clamp 321 in this embodiment is similar to the fiber array clamp 311 in the first clamping assembly, and also has a second slot 322 extending approximately vertically. The shape and structure of the second slot 322 are approximately similar to the shape and structure of the fiber array end 6. It is located at one end of the fiber array clamp and is cuboid in shape, penetrating the fiber array clamp 321 along its thickness direction. In order to limit the position of the fiber array end 6 extending from the lower end of the second slot 322, a limiting structure 323 is further provided below the fiber array clamp. When the port of the fiber array end 6 extends downward from the lower end of the second slot 322, it can extend to abut against the platform of the limiting recess 3231 in the limiting structure 323. The platform of the limiting recess 3231 and the length direction of the second slot 322 are perpendicular to each other.

[0191] It is understood that the limiting structure 323 in this embodiment can be a block structure with a certain thickness, and the area below the second slot 322 is provided with a recessed structure, that is, forming a limiting recess 3231. There should be a sufficient height difference between the platform of the limiting recess 3231 and the upper surface of the limiting structure 323, so as to ensure that the length of the light array end extending downward from below the second slot 322 is large enough.

[0192] Furthermore, in this embodiment, the limiting structure 323 also needs to be detached from the fiber array clamp 321 when aligning and coupling between the fiber array end 6 and the optical interface of the optical waveguide. In this embodiment, the limiting structure 323 and the fiber array clamp can also be detachably connected using snap-fit ​​or magnetic attraction, etc., and this disclosure does not specifically limit this connection.

[0193] Based on any of the above embodiments, the driving movement accuracy achieved by the first translation component 141, the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145, and the third rotation component 146 in the silicon photonics wafer testing equipment disclosed herein is relatively limited and difficult to reach the millimeter level. It can only achieve coarse adjustment of the attitude and position of the end 5 of a single optical fiber and the end 6 of the optical fiber array.

[0194] Therefore, in another optional embodiment of this disclosure, a piezoelectric displacement stage 4 can also be connected to the end connection structure 3. Specifically, the piezoelectric displacement stage 4 can be disposed between the third rotating component 146 and the end connection structure 3; the piezoelectric displacement stage 4 can achieve minute expansion and contraction movements by applying different voltages, thereby driving the end connection structure 3 and the optical fiber end to perform fine-tuning with higher precision; and as the piezoelectric displacement stage 4 expands and contracts, it causes minute movements in the single optical fiber end 5 and the optical fiber array end 6, thereby changing the coupling state between the optical fiber port and the optical interface of the optical waveguide. When the two reach the best coupling state, the optical power of the light wave transmitted from the optical waveguide to the optical fiber port is the maximum. Thus, the photodetector used for coupling connected to the other end of the single optical fiber or optical fiber array can also collect the maximum optical power, thereby determining that the alignment coupling accuracy between the optical fiber port and the optical interface of the optical waveguide is the best at this time.

[0195] In this embodiment, the first translation component 141, the second translation component 142, and the third translation component 143 are all translation components with identical structures. The first rotation component 144, the second rotation component 145, and the third rotation component 146 are rotation components with identical structures.

[0196] In summary, the silicon photonics wafer testing equipment disclosed herein includes an fiber optic coupling module that enables driving and adjusting six different degrees of freedom at the fiber array end or single fiber end connected to the end-connection structure; thereby achieving preliminary pose adjustment of the fiber array end or single fiber end; and the fiber optic coupling module is composed of three translation components and three rotation components connected in series. For each component, only one degree of freedom motion adjustment is required, resulting in a single function that helps ensure precise control of motion adjustment in each degree of freedom. This ensures faster preliminary alignment and coupling between the fiber or fiber array and the silicon photonics waveguide, reducing the impact on… The coupling difficulty is reduced; and the components only need to be connected in series sequentially, which is simple and easy to implement, and helps to reduce equipment costs. On this basis, a piezoelectric displacement stage is further set between the fiber coupling module and the end connection structure. After the piezoelectric displacement stage is connected to different excitation voltages, it can drive the end connection structure to perform fine-tuning with higher precision. Thus, in this disclosure, through the cooperation between the fiber coupling module and the piezoelectric displacement stage, the position and attitude of the fiber or fiber array can be finely adjusted sequentially, thereby enabling the rapid alignment and coupling of the end of the fiber or fiber array with the waveguide on the silicon photonic wafer.

[0197] This disclosure also provides an embodiment of a silicon photonics wafer testing system, including the silicon photonics wafer testing equipment as described in the third specific embodiment above; and an optical performance testing machine connected to the silicon photonics wafer testing equipment.

[0198] The optical performance testing machine includes a motion controller that is communicatively connected to the optical fiber coupling module and the piezoelectric displacement stage, a tunable light source and a polarization scrambler connected to the end of the optical fiber array away from the end of the optical fiber, and an optical power meter and a coupling photodetector connected to the output end of the polarization scrambler.

[0199] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A silicon photonic wafer testing apparatus, characterized by, The device includes a micro-imaging assembly, a probe stage, an optical fiber coupling module, and a driving assembly. The micro-imaging assembly includes a camera assembly and a deflecting optical path assembly. The probe stage is used to support a silicon photonic wafer. The driving assembly is used to drive the probe stage and the deflecting optical path assembly to switch between moving into the imaging field of view of the camera assembly. When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component adjusts its coordinate system to be parallel to the dicing path of the silicon photonic wafer. When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire lateral images corresponding to at least two different lateral views of the end of the optical fiber that is deflected by the deflection optical path component; the optical fiber coupling module is used to adjust the pose of the end of the optical fiber according to the lateral images and the orientation of the coordinate system of the camera component, so that the end of the optical fiber is initially aligned with the silicon photonic wafer.

2. The silicon photonic wafer testing apparatus of claim 1, wherein, The camera assembly has a crosshair cursor inside its lens. When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component is used to acquire a wafer image of the silicon photonic wafer, and adjust the crosshair of the camera in the camera component to be parallel to the dicing track on the silicon photonic wafer using the wafer image.

3. The silicon photonic wafer testing apparatus of claim 2, wherein, The deflecting optical path assembly includes at least two reflective elements; When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire a first lateral image of the fiber end of the fiber array in a first horizontal direction and a second lateral image in a second horizontal direction through the deflection optical path component. The fiber coupling module is used to adjust the end face of the fiber to a horizontal plane based on the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other; The camera assembly is also used to acquire a vertical image of the end of the optical fiber from a vertical direction; the optical fiber coupling module is used to adjust the outline of the end of the optical fiber to be parallel to the crosshair of the camera according to the vertical image.

4. The silicon photonic wafer testing apparatus of claim 3, wherein, The deflecting optical path assembly includes a support platform connected to the probe station, and a first reflective element and a second reflective element disposed on the support platform; It also includes a first light source assembly and a second light source assembly disposed on the support platform; Wherein, the first light source component is used to output a light beam to the first reflective element along the first horizontal direction, and the first reflective element is used to reflect the incident light beam in a vertically upward direction; the second light source component is used to output a light beam to the second reflective element along the second horizontal direction, and the second reflective element is used to reflect the incident light beam in a vertically upward direction; and the optical path between the first light source component and the first reflective element intersects with the optical path between the second light source component and the second reflective element at a predetermined intersection area; When the deflection optical path assembly moves to below the camera assembly via the drive assembly, the end of the optical fiber is located in the designated intersection area; The camera assembly is used to capture the first lateral image when the camera is moved directly above the first reflective element, and to capture the second lateral image when the camera is moved directly above the second reflective element.

5. The silicon photonic wafer testing apparatus of claim 4, wherein, The first reflective element is provided with a first marking line that is parallel to the second horizontal direction; the second reflective element is provided with a second marking line that is parallel to the first horizontal direction.

6. The silicon photonic wafer testing apparatus of claim 5, wherein, The heights of the first marking line and the second marking line on the first reflective element and the second reflective element, respectively, are lower than the end face height of the optical fiber end.

7. The silicon photonic wafer testing apparatus of claim 4, wherein, The fiber optic coupling module is equipped with a height probe structure on the end connection structure for connecting the ends of the fiber optic cable. Accordingly, a calibration substrate is also provided on the support platform corresponding to the designated intersection area; When the driving component drives the deflection optical path component to move to a distance within a set height range between the lower surface of the height probe structure and the upper surface of the calibration substrate, the end of the optical fiber is located in the set intersection area.

8. The silicon photonic wafer testing apparatus of claim 7, wherein, The height detection structure is a nanocapacitive displacement sensor.

9. The silicon photonic wafer testing apparatus of claim 4, wherein, The first light source assembly includes a first surface light source and a third reflective element; the second light source assembly includes a second surface light source and a fourth reflective element; Furthermore, the first reflective element, the second reflective element, the third reflective element, and the fourth reflective element are all right-angled triangular prisms, and a reflective film layer is provided on the inclined reflective surface of the right-angled triangular prism; The oblique reflective surface of the third reflective element is located in the output light path of the first surface light source, and is used to reflect the light beam output by the first surface light source along the first horizontal direction through the set intersection area and incident on the first reflective element, so that the first reflective element reflects the light carrying the lateral contour information of the end of the optical fiber. The oblique reflective surface of the fourth reflective element is located in the output light path of the second surface light source, and is used to reflect the light beam output by the second surface light source along the second horizontal direction through the set intersection area and incident on the second reflective element, so that the second reflective element reflects the light carrying the lateral contour information of the end of the optical fiber.

10. The silicon photonic wafer testing apparatus of any one of claims 1 to 9, wherein, The fiber optic coupling module includes three translation components and three rotation components connected in sequence, as well as an end connection structure; The end connection structure is used to clamp the fiber coupling module at the end of the fiber; The three translation components are used to drive the end connection structure to translate along the first direction, the second direction, and the third direction, respectively. The three rotation components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

11. The silicon photonic wafer testing apparatus of claim 10, wherein, The fiber optic coupling module includes a first translation component, a second translation component, a third translation component, a first rotation component, a second rotation component, and a third rotation component connected in sequence; the end connection structure of the fiber optic coupling module is connected to the third rotation component; Wherein, the first translation component is used to drive the second translation component, the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the first direction; The second translation component is used to drive the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the second direction; The third translation component is used to drive the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the third direction. The first rotating component is used to drive the second rotating component, the third rotating component, and the end connection structure to rotate synchronously around the first rotating axis as the rotation center; The second rotating component is used to drive the third rotating component and the end connection structure to rotate synchronously around the second rotating axis as the rotation center; The third rotating component is used to drive the end connection structure to rotate around the third rotating axis as the rotation center.

12. The silicon photonic wafer testing apparatus of claim 10, wherein, The end connection structure is also connected to a piezoelectric displacement stage, which is used to drive the fiber end to move when different control voltages are applied, so as to control the alignment and coupling between the fiber end and the silicon photonic wafer.

13. A silicon photonics wafer testing method, characterized in that, The testing method, applied to the silicon photonics wafer testing equipment as described in any one of claims 1 to 12, comprises: The control drive component drives the silicon photonic wafer to translate into the imaging field of view of the camera component. The camera component is adjusted based on the wafer image acquired by the camera component so that the coordinate system of the camera component and the dicing track on the silicon photonic wafer are parallel to each other. The silicon photonic wafer is controlled to move out of the imaging field of view of the camera assembly, and the deflection optical path assembly is moved into the imaging field of view of the camera assembly. The camera assembly acquires lateral images corresponding to at least two different lateral views of the end of the optical fiber that is deflected and transmitted by the deflection optical path assembly. Based on the lateral image and the orientation of the camera component coordinate system, the fiber coupling module adjusts the pose of the fiber end and controls the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the fiber end and the silicon photonic wafer are initially aligned.

14. The method of claim 13, wherein the silicon photonic wafer test method further comprises: Adjusting the camera assembly based on the wafer image acquired by the camera assembly to make the camera assembly coordinate system parallel to the dicing traces on the silicon photonic wafer includes: The drive assembly is controlled to move the probe station carrying the silicon photonic wafer into the imaging field of view of the camera assembly; The camera assembly is used to acquire wafer images of the silicon photonics wafer; The camera assembly is adjusted using the wafer image so that the crosshair of the camera in the camera assembly is aligned parallel to the dicing marks on the silicon photonics wafer.

15. The method of claim 14, wherein the silicon photonic wafer test method further comprises: Based on the lateral image and the orientation control of the camera assembly coordinate system, the fiber coupling module adjusts the pose of the fiber end to initially align the fiber end with the silicon photonic wafer, including: The camera assembly acquires lateral images in the first and second horizontal directions reflected by the optical fiber end through the deflection optical path assembly, thereby obtaining a first lateral image and a second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other; Based on the first lateral image and the second lateral image, the fiber coupling module is controlled to adjust the end face of the fiber end to a horizontal plane; The camera assembly acquires a vertical image of the end of the optical fiber from a vertical direction. Based on the vertical image, the fiber optic coupling module is controlled to adjust the outline of the fiber end to be parallel to the crosshair of the camera.

16. The method of claim 15, wherein the silicon photonic wafer test method further comprises: Controlling the fiber coupling module to adjust the end face of the fiber optic cable to a horizontal plane based on the first lateral image and the second lateral image includes: Based on the end face contour line of the fiber end imaged in the first lateral image, a first included angle between the end face of the fiber end and the second horizontal direction is determined; The fiber coupling module is controlled to drive the fiber end to rotate around the second rotation axis by a first included angle; wherein the second horizontal direction and the second rotation axis are parallel to each other. Based on the end face contour line of the fiber end imaged in the second lateral image, a second included angle between the end face of the fiber end and the first horizontal direction is determined; The fiber coupling module is controlled to drive the fiber end to rotate around a first rotation axis at a second included angle; wherein the first horizontal direction and the first rotation axis are parallel to each other.

17. The method of testing a silicon photonic wafer of claim 16, wherein, After controlling the fiber coupling module to drive the fiber end to rotate around the second rotation axis by a first included angle, the method further includes: The fiber coupling module is used to drive the fiber end to translate a distance L2(1-cosθ1) along a first direction and a distance L2sinθ1 upward along a third direction; where L2 is the distance between the fiber end and the second rotation axis; and θ1 is the first included angle. Accordingly, after controlling the fiber coupling module to drive the fiber end to rotate around the first rotation axis by a second included angle, the method further includes: The fiber coupling module is used to drive the fiber end to translate a distance L1(1-cosθ2) along the second direction and a distance L1sinθ2 upward along the third direction; where L1 is the distance between the fiber end and the first rotation axis; and θ2 is the second included angle. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other; the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction are vertical directions; Furthermore, the first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

18. The method of claim 15, wherein the silicon photonic wafer test method further comprises: Based on the vertical image, the fiber optic coupling module is controlled to adjust the outline of the fiber optic end to be parallel to the crosshair of the camera, including: Based on the end face contour line of the fiber end imaged in the vertical image, determine the third included angle between the end face contour line of the fiber end and the crosshair cursor. The fiber coupling module is controlled to drive the fiber end to rotate around the third included angle about the third rotation axis; wherein the third rotation axis is a vertical rotation axis.

19. The method of testing a silicon photonic wafer of claim 13, wherein, After controlling the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the fiber end is initially aligned with the silicon photonic wafer, the method further includes: The camera assembly is controlled to acquire aligned images of the fiber optic end and the silicon photonic wafer within the same frame; Based on the imaging positions of the fiber port at the end of the optical fiber and the optical interface in the silicon photonics wafer in the alignment image, the optical fiber coupling module is controlled to drive the end of the optical fiber to translate along the first direction and the second direction, so as to achieve initial alignment and coupling between the fiber port and the optical interface at the end of the optical fiber.

20. The method of claim 19, wherein the silicon photonic wafer test method is performed on a silicon photonic wafer comprising a plurality of silicon photonic dies. After initial alignment and coupling between the fiber optic port and the optical interface at the end of the fiber, the process further includes: Control the output light wave of one optical fiber at each of the optical fiber ends; The piezoelectric displacement stage connected to the end connection structure of the optical fiber coupling module drives the end of the optical fiber to translate within the horizontal plane. The optical power that changes with the translational movement of the end of the optical fiber is detected by a photodetector connected to the end of the optical fiber away from the end of the optical fiber. The optimal coupling position between the fiber end and each waveguide in the silicon photonic wafer is the location corresponding to the maximum optical power.

21. A silicon photonic wafer testing apparatus, comprising: It includes an optical fiber coupling module; a piezoelectric displacement stage connected to the optical fiber coupling module; and an end connection structure fixedly connected to the piezoelectric displacement stage for connecting the end of an optical fiber array or the end of a single optical fiber. The fiber optic coupling module includes three translational components and three rotational components connected in series. The three translational components are used to drive the end connection structure to translate along a first direction, a second direction, and a third direction, respectively. The three rotational components are used to drive the end connection structure to rotate around a first rotation axis, a second rotation axis, and a third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

22. The silicon photonic wafer testing apparatus of claim 21, wherein, The three translation components include a first translation component, a second translation component, and a third translation component connected in series; the three rotation components include a first rotation component, a second rotation component, and a third rotation component connected in series; the third translation component is connected to the first rotation component; the third rotation component is connected to the end connection structure; Wherein, the first translation component is used to drive the second translation component, the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end structure to translate synchronously along the first direction; The second translation component is used to drive the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end structure to translate synchronously along the second direction; The third translation component is used to drive the first rotation component, the second rotation component, the third rotation component, and the end structure to translate synchronously along a third direction. The first rotating component is used to drive the second rotating component, the third rotating component, and the end structure to rotate synchronously around the first rotating axis as the rotation center; The second rotating component is used to drive the third rotating component and the end structure to rotate synchronously around the second rotating axis as the rotation center; The third rotating component is used to drive the end structure to rotate about the third rotating axis as the rotation center; The first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are all parallel to each other.

23. The silicon photonic wafer testing apparatus of claim 21, wherein, The end connection structure is detachably connected to one of the first clamping assembly and the second clamping assembly; the first clamping assembly is used to clamp the end of a single optical fiber; the second clamping assembly is used to clamp the end structure of an optical fiber array.

24. The silicon photonic wafer testing apparatus of claim 23, wherein, The first clamping assembly includes an optical fiber clamp that can be detachably connected to the end connection structure, a height probe structure disposed below the optical fiber clamp, and a probe connected to the height probe structure; The fiber clamp is provided with a first slot that extends vertically and matches the contour shape of the end of the single fiber. The tip of the probe extends directly below the first slot; The height-sensing structure and the fiber optic clamp are detachably connected.

25. The silicon photonic wafer testing apparatus of claim 23, wherein, The second clamping assembly includes a fiber array clamp that can be detachably connected to the end connection structure, and a limiting structure that can be connected to the fiber array clamp; The fiber array clamp is provided with a second slot that matches the contour shape of the end of the fiber array. The limiting structure and the fiber array clamp are detachably connected, and the limiting recess extends to the bottom of the second slot to limit the height of the fiber array end in the vertical direction.

26. The silicon photonic wafer testing apparatus of claim 23, wherein, The end connection structure is provided with a groove structure; a first magnetic attractor is provided in the groove structure; Both the first clamping component and the second clamping component are provided with a second magnetic attractor; the first magnetic attractor and the second magnetic attractor can magnetically attract each other.

27. A silicon photonic wafer testing system, comprising: It includes the silicon photonics wafer testing equipment as described in any one of claims 1 to 12; or, it performs the silicon photonics wafer testing method as described in any one of claims 13 to 20; or, it includes the silicon photonics wafer testing equipment as described in any one of claims 21 to 26.

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