A method for improving a material removal process

Abstract

The present invention provides a method (200) for improving a material removal process. The method (200) is performed on a system (100) having a material removal apparatus (10) with a material removing head (15), a sensing unit (30), a processing unit (40), a storage unit (60), and a control unit (50). The first phase of material removal is performed on the workpiece (34) surface connected to the light source (20) using predefined operational parameters. After the first phase, an image of the surface is captured by the sensing unit (30) and sent to the processing unit (40). The processing unit (40) compares the captured image with a reference image to identify deviations. Based on the identified deviations, the material removing head (15) is controlled to perform the next phases of the material removal to achieve the desired uniform light distribution throughout the entire workpiece (34).

Description

A Method for Improving a Material Removal ProcessField of the invention

[0001] The present invention relates to material removal processes. More specifically, the present invention relates to a method for improving a material removal process.Background of the invention:

[0002] In industries where precise control of light emission is essential, such as in backlit displays, architectural lighting, and automotive illumination systems, ensuring uniform light intensity across a surface presents a considerable challenge. Ensuring consistency of light intensity in series production of such products is also a considerable challenge. Light-emitting surfaces are typically created by etching or engraving materials, which allows light to pass through specific patterns or designs. Achieving the desired uniformity in light distribution is complex due to various external factors and inherent limitations in the engraving or etching process.

[0003] One of the significant issues in existing systems is their inability to adapt to environmental conditions that can affect the engraving or etching process. Factors such as ambient temperature and pressure of the surroundings can cause material distortions, affecting how the material reacts to the laser and, consequently, how the light passes through the engraved or etched surface. Fluctuations in temperature or pressure may lead to inconsistencies in material removal or cause the material to expand or contract slightly, altering the final light emission characteristics.

[0004] Often light emitting products are multilayer. For example, a light emitting surface has an additional spacer or diffuser layer on top of it to evenly distribute the light over the entire surface area or reduce the intensity of the light. The tolerances of the spacer / diffuser material thickness applied to the light-emitting surface can complicate achieving uniform light distribution. The variations in the spacer material thickness can impact how much light passes through the surface after etching or engraving. In some cases, the spacer material acts as a diffuser layer, and even minor deviations from the thickness can result in uneven light intensity. Current methods lack real-time adaptability to adjust for such variations in thickness during the process, leading to bright spots, dim areas, or irregular illumination.

[0005] Moreover, process tolerance in the engraving or etching is another major factor. Even with advanced machinery, deviations in the laser's precision, beam focus, or powercan introduce small errors in the pattern being etched, affecting the light distribution. These tolerances in the process, especially when combined with variations in material properties, can lead to inconsistent removal of material, further leading to non-uniform light emission.

[0006] Current systems are typically designed with fixed operational parameters such as laser power, speed, and focal length, which are predefined and remain constant throughout the process. However, these parameters are not dynamically adjusted to account for real-time changes in environmental conditions or material tolerances. As a result, the final product often exhibits suboptimal light distribution, requiring additional adjustments, reworking, or even rejection of faulty products. This not only increases production costs but also reduces overall efficiency.

[0007] Therefore, there is a requirement for a method for improving the material removal processes to overcome all or a few drawbacks of the present technologies.Objects of the invention

[0008] An object of the present invention is to provide a method for improving the material removal process.

[0009] Another object of the present invention is to provide a method for improving a material removal process, which ensures consistent and even light distribution across the surface of an etched or engraved workpiece, reducing bright spots, dim areas, and inconsistencies in illumination.

[0010] Yet another object of the present invention is to provide a method for improving a material removal process, which automatically adjusts the laser parameters during the material removal process to compensate for variations in material properties, environmental conditions, and process tolerances.

[0011] One more object of the present invention is to provide a method for improving a material removal process, which reduces the need for post-process corrections, reworking, or rejection of products due to non-uniform light distribution.Summary of the invention:

[0012] According to the present invention, a method for improving a material removal process is provided. The method may be performed by a system comprising a sensing unit, a processing unit, a storage unit, a control unit, and a material removal apparatus havinga material removing head. The material removal apparatus may be adapted to mount a workpiece in front of the material removing head for removing material from a surface of the workpiece for uniform light intensity and distribution there through.

[0013] Initially, the first phase of material removal may be performed on a portion of the surface of the workpiece using predefined operational parameters. The predefined operational parameters may include laser power in wattage, beam speed in feed rate, focal length / focus, pulse frequency, material removal depth, or resolution (dots per inch - DPI or Line per inch - LPI). The material removing head may be adapted to move above the surface of the workpiece to remove the material according to a predefined layout.

[0014] Further, the sensing unit may be used to capture an image of the surface of the workpiece for communicating with the processing unit to generate a secondary image simulating the light intensity and the light distribution of a final product.

[0015] Specifically, at the first stage, the light intensity and the light distribution of the captured image may be adjusted using the processing unit. The processing unit may adjust the light intensity of the image based on the properties of a spacer / diffuser material of a spacer / diffuser layer to generate a processed image with the adjusted light intensity. The properties of the diffuser layer are already stored in the storage unit.

[0016] After generating the processed image, it may be superimposed with a virtual surface layer to generate the secondary image. The virtual surface layer may have a predefined perforation pattern / design through which the light is expected to emit from the workpiece.

[0017] After that, the secondary image may be compared with a reference image of the final product stored in the storage unit. Specifically, the processing unit may compare the lighting characteristics of the secondary image against the reference image to identify deviations. Based on identified deviations, the processing unit may modify the predefined operational parameters to adjusted operational parameters. The processing unit is configured to calculate a light intensity reduction factor and a light intensity distribution factor based on the properties of the diffuser layer stored in the storage unit and apply the light intensity reduction factor and / or the light intensity distribution factor to the captured image to simulate the light intensity of the final product.

[0018] Based on the adjusted operational parameters, the control unit may control the material removing head according to adjusted operational parameters. The control unit may be adapted to control the material removing head while performing a second phase of material removal over a corresponding portion of the surface of the workpiece to achieve uniform light intensity and distribution.

[0019] In an aspect, the secondary image and the reference image may be divided in a grid and each cell of the secondary image may be compared with the corresponding cell of the reference image. Specifically, the first phase of material removal is on a first cell of the grid using the predefined operational parameters, the second phase of material removal is on a second cell of the grid using the adjusted operational parameters, and a third phase of material removal is on a third cell of the grid using a secondly-adjusted operational parameters. Further, the method is performed for the subsequent cells of the grid thereafter.

[0020] In another aspect, the processing unit may be adapted to convert the captured image into a greyscale image before generating the processed image. Additionally, the reference image stored in the storage unit is a greyscale image for comparing the reference image with the secondary image maintaining consistency in the comparison process.

[0021] Moreover, a system for material removal for uniform light intensity and distribution is provided to perform the method. The system may include a material removal apparatus having a material removing head, a light source, a sensing unit, a processing unit, and a control unit.

[0022] The material removal apparatus may have the material removing head and may be adapted to mount a workpiece in front of the material removing head. The material removing head may be provided to perform material removal on a portion of the surface using predefined operational parameters.

[0023] The light source may be arranged around the workpiece at a predetermined location based on a placement of the light source in a final product. Further, the sensing unit may be arranged above the workpiece and may be configured to capture an image of the surface of the workpiece after each phase of material removal. The image is captured to measure and detect the light intensity and distribution emitted through a material-removed surface of the workpiece.

[0024] Specifically, the processing unit is connected to the sensing unit to receive the captured image. The processing unit may be configured to compare the captured image with an image stored in a storage unit showing a final product to identify deviations. More particularly, the processing unit is configured to adjust the light intensity and the light distribution of the captured image based on the properties of the diffuser layer stored in the storage unit to generate a processed image. In one aspect, the storage unit may be a cloud server configured to communicate with the processing unit and the control unit through a wireless network

[0025] Further, the processing unit may be adapted to apply a virtual surface layer on the processed image to generate a secondary image simulating the light intensity of the final product. The processing unit may compare the secondary image with the reference image to identify deviations in the light intensity and the light distribution.

[0026] The processing unit may be adapted to modify the predefined operational parameters for generating adjusted operational parameters based on the identified deviations. The processing unit modifies the predefined operational parameters and communicates them with the control unit.

[0027] The control unit is connected to the processing unit and is adapted to receive the adjusted operational parameters from the processing unit. The control unit may control the material removing head based on the adjusted operational parameters to achieve uniform light intensity and distribution through the material-removed surface.

[0028] In one aspect of the invention, the processing unit, the storage unit, and the control unit may be remotely arranged away from the material removal apparatus and adapted to communicate with the sensing unit and the material removing head through a wireless network

[0029] In another aspect, the light source may be an infrared light source and the sensing unit may be an infrared detector adapted to capture images of the infrared light passing through or reflecting from the material-removed surface of the workpiece to compare with the reference image stored in the storage unit. The reference image stored in the storage unit may be an image of the workpiece illuminated by the infrared light source. The reference image illuminated by the infrared light source is used for comparison with the captured image to maintain consistency during the comparison process.

[0030] In one more aspect, the workpiece may be an optical fiber fabric. The optical fiber fabric may be having a plurality of optical fibers and a plurality of yarn meshed / woven with each other to form the fabric of the optical fibers. Further, the processing unit may be adapted to reduce the distance between the adjacent lines of the material removal pattern as the material removing head travels from the first end of the optical fiber fabric connected to the light source towards a second end of the optical fiber fabric to compensate for the reduction and distribution of the light intensity and control the material removing head through the control unit to remove the material from (etching, engraving, or the like.) the fabric for uniform light distribution.

[0031] In one of the aspects, the captured image may be processed using the processing unit to generate the secondary image based on the properties of diffuser layer. The secondary image is representative of the final product.

[0032] In one of the aspects, the captured image may be processed using the processing unit. The processing unit superimposes virtual surface layer over the captured image to generate the secondary image. Tthe secondary image is representative of the final product.Brief description of drawings:

[0033] The advantages and features of the present invention will be understood better with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:

[0034] Figure 1 shows a schematic view of a system for improving a material removal process in accordance with the present invention;

[0035] Figure 2 shows a perspective view of layers of a final product in accordance with the present invention;

[0036] Figure 3a shows a top view of the workpiece with an engraved pattern in accordance with the present invention;

[0037] Figure 3b shows a top view of a diffuser layer arranged on the workpiece shown in figure 3 a;

[0038] Figure 3c shows a top view of a surface layer arranged on the diffuser layer and the workpiece in accordance with the present invention;

[0039] Figure 4a-4cshows a top view of the workpiece illustrating an example of an adjusted line pattern in accordance with the present invention;

[0040] Figure 5 shows a perspective view of the system in accordance with another embodiment of the present invention with an infrared light source and an infrared detector;

[0041] Figure 6 shows a perspective view of a system having a fibre optic fiber as a workpiece in accordance with an alternative embodiment of the present invention;

[0042] Figure 7 shows a top view of the workpiece shown in figure 6 illustrating the light behaviour in optical fibers;

[0043] Figure 8a shows a perspective view of the optical fiber in accordance with the embodiment shown in figures 6 and 7 ;

[0044] Figure 8b shows a sectional view of the optical fiber shown in figure 8a;

[0045] Figure 8c shows a sectional side view of the optical fiber illustrating the light transmission;

[0046] Figure 8d shows a sectional side view of the optical fiber with a material-removed surface illustrating the reduction in the light;

[0047] Figure 9 shows a top view of a predefined layout to be etched or engraved on the optical fiber fabric shown in figure 6;

[0048] Figure 10 shows a top view of an material removal pattern to be etched or engraved on the optical fiber fabric shown in figure 6;

[0049] Figure 11 shows a top view of the optical fiber fabric with a material-removed surface according to predefined operational parameters;

[0050] Figure 12a- 12b shows a top view of a front portion and a second portion illustrating the deviation in the light intensity if the fabric is etched / engraved with the predefined operational parameters;

[0051] Figure 13 shows a top view of an adjusted material removal pattern for uniform light distribution from the fabric;

[0052] Figure 14a shows an enlarged view of an adjusted material removal pattern with predefined operational parameters for uniform light distribution;

[0053] Figure 14b shows an enlarged view of the adjusted material removal pattern after modifying the predefined operational parameters to the adjusted operational parameters for uniform light distribution;

[0054] Figure 15 shows a top view of the optical fiber fabric with material-removed surface according to adjusted operational parameters; and

[0055] Figure 16 shows a flowchart of a method for improving the material removal process.Detailed description of the invention

[0056] An embodiment of this invention, illustrating its features, will now be described in detail. The words "comprising," "having," "containing," and "including," and other forms thereof, are intended to be equivalent in meaning and be open-ended in that an item oritems following any one of these words is not meant to be an exhaustive listing of such item or items, or meant to be limited to only the listed item or items.

[0057] The present invention relates to a method of material removal on a surface for uniform light intensity and distribution. The method is provided to ensure that the material removal process is adapted to detect the deviations in the material-removed surface by comparing it with the final product. Further, the system and the method are adapted to control the material removal apparatus to adjust the operational parameters real - time according to comparison results.

[0058] The terms “first,” “second,” and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another, and the terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. The disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms.

[0059] Referring now to figure 1, a system (100) for improving a material removal process in accordance with the present invention is illustrated. The material removal process includes etching, carving, engraving, milling, embossing, shot blasting or the like. The system (100) includes a material removal apparatus (10) having a material removing head (15), a light source (20), a sensing unit (30), a processing unit (40), and a control unit (50).

[0060] The material removal apparatus (10) is adapted to mount a workpiece (34) preferably, in front of the material removing head (15) for removing the material from the surface of the workpiece (34). In the present embodiment, the material removal apparatus (10) is a laser apparatus having a laser head to remove the material from the workpiece. It may be obvious for a person skilled in the art to use any material removal apparatus (10) other than the laser apparatus to remove the material from the workpiece (34).

[0061] The material removal apparatus (10) has a body (11) adapted to movably arrange the material removing head (15) to move over a surface of the workpiece (34) to perform a first phase of material removal on a portion of the surface of the workpiece (34) to remove the material from the workpiece (34) using operational parameters according to a predefined layout. Especially, the first phase of material removal is performed using predefined operational parameters. The predefined operational parameters include laser power in wattage, beam speed in feed rate, focal length / focus, pulse frequency, material removal depth, or resolution (dots per inch - DPI or lines per inch (LPI) of material removal pattern).

[0062] The predefined layout is a specific design, layout, or arrangement that has been pre-programmed in advance, which is fed to the material removal apparatus (10) for thematerial removal process. The predefined layout is any shape, text, or image that needs to be created on the surface of the workpiece (34). The predefined layout is stored in a storage unit (60) before initiating the material removal process. Further, the storage unit (60) is adapted to store data including a reference image, material removal patterns, spacer material / diffuser type, material properties of a spacer layer or a diffuser layer (35), predefined operational parameters, and adjusted operational parameters.

[0063] The storage unit (60) is electronically connected to the material removing head (15) through the control unit (50). The control unit (50) controls the material removing head (15) for material removal according to the predefined layout on the surface of the workpiece (34). In an alternative embodiment, the storage unit (60) is a cloud server configured to communicate with the processing unit (40) and the control unit (50) through a wireless network.

[0064] Further, the light source (20) is arranged on the material removal apparatus (10), around the workpiece (34). The light source (20) is specifically arranged at a predetermined location, the predetermined location is a place where the light source (20) is being arranged in the final product. The light source (20) is arranged to simulate the real-life light emission through a material-removed surface while performing material removal.

[0065] Furthermore, the sensing unit (30) is arranged above the workpiece (34) to capture the images of the surface of the workpiece (34). Specifically, the sensing unit (30) is configured to capture an image of the surface of the workpiece (34) after each phase of material removal. The sensing unit (30) is a sensor adapted to capture the images of the workpiece (34) and communicate them with the processing unit (40). It may be obvious for a person skilled in the art to use any type of sensor / unit to capture the image of the surface of the workpiece (34).

[0066] The images are captured to measure and detect lighting characteristics including color appearance such as color temperature, or color rendering index (CRI), luminous flux, illuminance, light beam angle, glare, dimming capability, uniformity, specifically, the light intensity and the light distribution emitted through the material-removed surface of the workpiece (34). The processing unit (40) is configured to compare the captured image (with or without additional image processing) with the reference image. The reference image is an image of the workpiece (34) of the final product, stored in the storage unit (60). The lighting characteristics of the captured image (with or without additional image processing) have to match the lighting characteristics of the reference image.

[0067] Specifically, the processing unit (40) is configured to adjust the light intensity and the light distribution of the captured image based on the properties of the diffuserlayer (35) stored in the storage unit (60). The processing unit (40) is configured to calculate a light intensity reduction factor and a light intensity distribution factor based on the properties of the diffuser layer (35) stored in the storage unit (60) and apply the light intensity reduction factor and / or the light intensity distribution factor to the captured image to simulate the light intensity of the final product. The processing unit (40) is adapted to generate a processed image based on the properties of the diffuser layer (35) (as shown in figure 3b). The spacer layer or the diffuser layer (35) is placed above the material-removed surface of the workpiece (34) to evenly distribute or diffuse the light emitted through the material-removed surface of the workpiece (34).

[0068] The diffuser layer (35) has physical properties such as thickness, transparency, refractive index, and light absorption characteristics. The physical properties are responsible for how light passes through the material-removed surface of the workpiece (34). For example, the thickness of the spacer can reduce or diffuse the light intensity emitted through the surface, while transparency or opacity is responsible for how much light can penetrate or reflect.

[0069] The storage unit (60) is being used to store the properties of the diffuser layer (35) before the first phase of material removal begins. The pre-stored properties of the diffuser layer (35) provide information about how light interacts with the diffuser layer (35) in the final product such as light intensity, light direction and light orientation.

[0070] In an alternative embodiment, one or more of the processing unit (40), the storage unit (60), and the control unit (50) are remotely arranged away from the material removal apparatus (10) and adapted to communicate with the sensing unit (30) and the material removing head (15) through a wireless network.

[0071] Once, the sensing unit (30) captures the image of the material-removed surface, the processing unit (40) uses the properties of the diffuser layer (35) to adjust the light intensity and the light distribution of the captured image to generate the processed image simulating a light intensity of the workpiece (34) after application of the diffuser layer (35).

[0072] Further, the processing unit (40) is adapted to apply a virtual surface layer (36) (shown in figure 2) on the processed image to generate a secondary image simulating a real-life lighting characteristic of the final product. The virtual surface layer (36) imitates the characteristics of the actual surface layer of the final product which includes patterns, perforations, or other features. The virtual surface layer (36) is used to predict how light will behave once the actual surface layer is arranged over the diffuser layer which is arranged over the material-removed surface of the workpiece (34). The virtual surface layer (36) may have apredefined layout or pattern carved through the thickness of the layer allowing the light to transmit from a bottom surface to an upper surface.

[0073] Specifically, the virtual surface layer (36) includes a plurality of perforations (not visible in figure 2) (shown in figure 3c) to form the predefined layout. The plurality of perforations is arranged adjacent to each other in a shape of the predefined layout. In the present embodiment, the perforations have a circular shape. In another embodiment, the perforations can be square, triangular or any other shape. The plurality of perforations shown in figure 3c may also have perforations small enough to be unnoticeable and only the predefined layout is visible. The plurality of perforations is transparent on the virtual surface layer (36) so that light emitted from the workpiece (34) after the material removal process and diffuser layer (35) simulates the actual surface layer of the final product.

[0074] Moreover, the processing unit (40) compares the secondary image with the reference image to identify deviations in the lighting characteristics. The reference image is an image of the final product captured after laminating the diffuser layer (35) over the workpiece (34), an actual surface layer over the diffuser layer (35) and arranging the light source (200) arranged at the predefined location, thereby representing the real-life appearance of the product. In another aspect, the final product may consist of a single light emitting layer or two layers or four layers or any other number of layers. The processing (40) unit is adapted to superimpose a plurality of layers including plurality of diffuser layers or plurality of virtual surface layers based on the number of layers required in the final product.

[0075] The processing unit (40) compares the secondary image derived from the current state of the material-removed surface with the reference image indicative of the ideal image to identify any deviations or differences in the lighting characteristics between the secondary image and the reference image.

[0076] In the present aspect of the invention, the reference image and the secondary image are divided into a grid having a plurality of cells. Each cell of the reference image has a corresponding cell of the secondary image. The corresponding cells of the reference image and the secondary image are with respect to the surface of the workpiece (34). The first phase of the material removal is performed on a first cell of the grid using the predefined operational parameters.

[0077] Furthermore, the processing unit (40) is adapted to modify the predefined operational parameters based on the identified deviations to generate the adjusted operational parameters. The processing unit (40) is adapted to define the adjusted operational parameters different from the predefined operational parameters based on the comparison between thesecondary image and the reference image. The generated adjusted operational parameters are communicated with the control unit (50) to control the material removing head (15).

[0078] Moreover, the processing unit (40) is adapted to control and modify the material removal patterns along with the predefined operational parameters. The material removalpatterns are specific configurations that determine how the material removal apparatus (10) interacts with the workpiece (34) during the material removal process specifically, how the material removing head (15) moves over the workpiece (34) to remove material according to the predefined layout (as shown in figure 3a). The material removal patterns define the method / steps used by the material removing head (15) to remove material from the surface, including the path, speed, and density of the lines. For example, the material removalpatterns may include line patterns, cross-hatching, dot matrix configurations, or other structured paths that control how the material removing head (15) moves across the workpiece (34) to create the predefined layout.

[0079] If the material removal pattern is a line pattern, then by controlling the density of laser lines (measured in DPI or LPI) and the sequence of laser passes, the predefined layout is engraved with correct precision, depth, and light-diffusing properties. The material removal patterns are stored in the storage unit (60) and retrieved to perform the first phase of material removal on the workpiece (34).

[0080] By way of a non-limiting example, the identified deviation and the adjusted operational parameters with modified material removal patterns are explained. If the light intensity of the material-removed surface is less than the light intensity of the reference image, one of the causes of this deviation might be the resolution, which is lines per inch. The lines per inch of the material removal pattern / design are responsible for the light intensity of the material-removed surface, if adjacent lines are away from each other, the light intensity emitting from the material-removed surface is less compared to the lines being closer to each other. When the material removing head (15) etches or engraves more lines in the first cell, the surface of the workpiece (34) will have finer details with less material remaining between the adjacent lines. The less distance between two adjacent lines allows more light to pass through, which increases the light intensity emitted through the material-removed surface. However, when fewer lines are etched or engraved, more material is left between the adjacent lines, which blocks the light or scatters the light unevenly. The blocking and / or scattering of the light may reduce the light intensity or cause uneven light distribution in the final product.

[0081] In another example, the processing unit (40) is adapted to modify the material removal patterns according to the shape of the predefined layout and the captured image.Referring to figures 4a-4c, the material removing head (15) is adapted to engrave the workpiece (34) according to the predefined layout shown in FIG. 4a. The predefined pattern includes two circular shapes (Cl, C2) and the material removal pattern is a line pattern as shown in FIG. 4b. The line pattern has a length (L) and height (H) stored in the storage unit (60).

[0082] The material removing head (15) starts the stroke from a starting point (SI) according to the predefined operational parameters such as the length and height (resolution in LPI) of the laser pattern as shown in figure 4b. Simultaneously, the sensing unit (30) captures the image and the processing unit (40) processes the image to detect the deviations. The processing unit (40) detects while material removal from the starting point (S 1) to a finish point (S2), the shape of the predefined layout is gradually increasing and the light intensity detected by the captured image is not sufficient as compared to the intended light intensity in the final product. Accordingly, the processing unit (40) adjusts the predefined operational parameters and generates the adjusted operational parameters with adjusted pattern / design such as reduced height, thereby removing more material to allow more light to pass through the workpiece (34).

[0083] As shown in figure 4c, at a central portion of the circular shape (Cl), the material removal pattern is modified to have reduced height (H’), causing more material removal for higher-intensity light. Further, the reduced height (FF) is modified according to the gradually decreasing shape after the central portion towards the finish point (S2). Specifically, the reduced height (FF) is modified to the original height (H).

[0084] Furthermore, the processing unit (40) is adapted to adjust the height (H) of the line pattern for the subsequent circular shapes of the predefined layout (Figure 4c) based on the captured images.

[0085] It may be obvious for a person skilled in the art to adjust the predefined operational parameters such as resolution in DPI or LPI according to the material removal pattern. If the material removal patterns are circles, then the density of the circles is modified to provide the intended results in the final product.

[0086] If the processing unit (40) detects that the light intensity of the secondary image is higher than that of the reference image, the processing unit (40) adjusts the resolution (lines per inch) by increasing the value of Lines Per Inch (LPI). The processing unit (40) modifies the predefined operational parameter which is resolution (LPI) and generates the adjusted operational parameter to communicate with the control unit (50).

[0087] The control unit (50) is connected to the processing unit (40) to receive the adjusted operational parameters and adjusted pattern / design. After receiving the adjustedoperational parameters and adjusted pattern / design, the control unit (50) controls the material removing head (15) for a second phase of material removal. The second phase of material removal is performed on a second cell of the grid with adjusted operational parameters and adjusted pattern / design to achieve desired lighting characteristics such as uniform light intensity and distribution.

[0088] Additionally, the control unit (50) is adapted to receive the adjusted operational parameters and adjusted pattern / design frequently, specifically after each phase of the material removal and adjust the material removing head (15) according to the newly received adjusted operational parameters and adjusted pattern / design.

[0089] Particularly, the sensing unit (30) is adapted to capture the image of the surface of the workpiece (34) after each phase of the material removal. After the second phase of the material removal, the captured image is shared with the processing unit (40) to compare it with the reference image. After comparison, the processing unit (40) generates secondly-adjusted operational parameters and adjusted pattern / design. The secondly-adjusted parameters and adjusted pattern / design are communicated with the control unit (50) to control the material removing head (15) while performing a third phase of the material removal.

[0090] Furthermore, the processing unit (40) is adapted to perform subsequent phases of material removal on the remaining cells of the grid.

[0091] In another embodiment (not shown), the system (100) for material removal utilizes an alternative light source (20) during the material removal process that is different from the light source intended for use in the final product. The alternative light source (20) is used because colors or wavelengths of light used in the final product may present challenges during the processing. For example, if the final product uses a blue light source with a wavelength of around 450 nm, the wavelength of the blue light source results in reflection or scattering when interacting with materials of the workpiece (34), the diffuser layer (35), or the surface layer, making it difficult to capture the lighting characteristics in the sensing unit (30). This increases the processing time, as more adjustments are required to fine-tune the laser parameters and light distribution.

[0092] This embodiment is explained with a non-limiting example. The alternative light source (20), such as a green light source with a wavelength of around 530 nm, is used during the material removal process, instead of the blue light source. Greenlight has different interaction characteristics with the workpiece (34) material, such as lower reflection and more predictable absorption, making it easier to process and simulate. The green light source is chosen because it produces a light distribution pattern that resembles the behaviour of the bluelight source, even though the actual wavelengths differ. The sensing unit (30) captures the workpiece (34) under the green light source and communicates with the processing unit (40).

[0093] The processing unit (40) compares the captured images with a green light with the reference image stored in the storage unit (60) also with the green light, even if the final product uses a blue light for its end application. The reference image may be prepared by considering the green light source as it has to be matched with the captured image. By comparing the captured image with the reference image, the processing unit (40) detects deviations in the lighting characteristics including light intensity or distribution or color appearance, even though the green light is being used during the process. The processing unit (40) adjusts the predefined operational parameters, such as laser power, resolution (LPI), or pulse frequency, to generate adjusted operational parameters and adjusted pattern / design that ensure desired lighting characteristics including uniform light intensity across the workpiece (34). The green light source allows the processing unit (40) to process the image faster than the blue light source being used in the final product.

[0094] In one more embodiment shown in figure 5, the system (100) includes an infrared (IR) light source (20’) as the light source (20) and an infrared detector (30’) as the sensing unit (30). Specifically, in this embodiment, the infrared light source (20’) is arranged on the side of the workpiece (34). It may be obvious to a person skilled in the art to arrange the infrared light source (20’) at any other position according to the position of the light source (20) of the final product. The infrared light source (20’) and the infrared detector (30’) simulate the light source being used in the final product and provide faster and more efficient processing than using the actual light source of the final product. For example, blue or red color light sources may cause issues during processing as processing the wavelengths of these colors is time-consuming and requires complex adjustments.

[0095] To ease out the process, the infrared light source (20’) is used during the material removal process. The infrared light source (20’) has wavelengths between 800 nm and 1200 nm, and interacts more uniformly with various materials, making it easier to measure how light will be emitted off the material-removed surface and less interference with the surrounding light from the wavelengths such as wavelengths visible to the human eye.

[0096] Further, the sensing unit (30) in this embodiment is the infrared detector (30’) adapted to capture images of the infrared light emitted from the material-removed surface of the workpiece (34). The infrared detector (30’) is adapted to capture images that shows how light is distributed through the surface as the material removing head (15) moves over the workpiece (34) and removes the material according to the predefined operational parameters.The processing unit (40) compares the captured images with a reference image stored in the storage unit (60), which represents the lighting characteristics of the final product. In this embodiment, the reference image stored in the storage unit (60), is an image of the workpiece (34) illuminated by the infrared light source (20’). The reference image illuminated by the infrared light source is used for comparison with the captured image to maintain consistency during the comparison process.

[0097] The processing unit (40) compares the captured image with the reference image and identifies deviations in the lighting characteristics to adjust the predefined operational parameters. The adjusted operational parameters are sent to the control unit (50), to control the material removing head (15) in the next phases of material removal to achieve more uniform light distribution.

[0098] In another embodiment (shown in Figure 6), the workpiece (34) is an optical fiber fabric (341) adapted to being arranged on the material removal apparatus (10) for material removal. Hereinafter, “the optical fiber fabric (341)” is referred to as “the fabric (341)”. The fabric (341) is having a plurality of optical fibers (3411) and a plurality of yarns (3412) meshed / woven with each other to form the fabric (341) of the optical fibers (3411) as shown in figure 7. In the illustrated figure, the plurality of optical fibers (3411) is horizontally arranged with the vertically arranged plurality of yarns (3412). The fabric may be manufactured by weaving process such as the rapier-based weft insertion that uses polymer optical fiber in weft (weft yam) and polyester yarn in the warp.

[0099] The fabric (341) has a first end (341a) and second end (341b) opposite to the first end (341a). The plurality of the optical fibers (3411) is longitudinally arranged from the first end (341a) to the second end (341b) of the fabric (341). In the present embodiment, the plurality of optical fibers (3411) is polymer optical fiber, however, it may be obvious for a person skilled in the art to use any other type of optical fiber. Further, the plurality of the optical fibers (3411) is connected to a light source (20”) to illuminate the optical fibers (3411). The light source (20”) is arranged on the first end (341a) of the fabric (341) and is turned on to illuminate the plurality of optical fibers (3411) of the fabric (341).

[0100] The plurality of optical fibers (3411) is bundled together at the first end (341a) and connected to the light source (20”). In case of side emission optical fibers, the intensity of light decreases from the first end (341a) to the second end (341b). In case of non -side emission optical fibers, the intensity of the light due to almost total internal reflection remains same at the first end (341a) to the second end (341b) assuming minimal transmission losses. In the case of engraving, etching or any other suitable material removal process, theintensity decreases from the first end (341a) to the second end (341b) due to transmission losses (as shown in Figure 8d) and etching, engraving or any other suitable material removal process on the fabric (341) (shown in figure 11).

[0101] Referring now to figures 8a-8c, the optical fiber (3411) has two layers, a core (3411a), and a cladding (3411b), The core (3411a) is a centre of the fiber made up of highly transparent materials such as glass, plastic, PMMA (Polymethyl Methacrylate / acrylic) or the like. The core (3411a) is adapted for carrying the light (Li) and is configured with a high refractive index to ensure minimal transmission losses. The cladding (3411b) is arranged around the core (3411a), which has a lower refractive index than the core (3411a) such as fluorinated polymers allowing the phenomenon of total internal reflection, where light (Li) remains confined within the core (341 la) as it travels along the optical fiber (3411).

[0102] Generally, the system (100) is configured to etch, engrave or remove material using any other suitable process on the fabric (341) according to the predefined layout (shown in Figure 9). Specifically, the material removing head (15) is adapted to etch, engrave, or remove material using any other suitable process on the fabric (341) to remove the cladding material and maybe some part of the core material from the plurality of optical fibers (3411). The material removing head (15) is adapted to remove the cladding (3411b) (as shown in figure 8d) and maybe some part of the core of the optical fiber (3411) based on the material removal pattem / design. The material removal pattern / design is the line pattern shown in figure 10.

[0103] The line pattern has a plurality of adjacent lines configured to form the predefined layout, and the material removing head (15) is configured to perform the material removal including etching or engraving. If the predefined layout shown in figure 9 is etched or engraved on the fabric (341) according to the pre-stored distance of the line pattern as shown in figure 10, the intensity of the light (Li) decreases from the first end (341a) towards the second end (341b) (as shown in figure 11) due to the transmission losses and the light (Li) escaping outward from the etched / engraved area. The intensity of the light (Li) is higher in a first portion (345a) (figure 12a) than a second portion (345b) (figure 12b). The first portion (345a) is nearer to the light source (20”) and the second portion (345b) is away from the light source (20”) compared to the first portion (345a).

[0104] The intensity of light (Li) is reduced as the light (Li) travels towards the second end (341b) of the fabric (341) due to the material -removed surface allowing the light (Li) to escape from the core (3411a) of the optical fiber (3411). Referring to figure 8d, the light (Li) travels within the core (3411a) of the optical fiber and escapes from the material-removed surface to illuminate according to the engraved, etched or material removed pattern. However,the intensity of the light (Li) decreases as it travels towards the second end (341b) and thus overall, less light (Li) is available towards the second end that escapes from the material-removed surface, hence the intensity of the light (Li) at a material-removed surface (ESI) away from the light source (20”) is less compared to the light (Li) at an material-removed surface (ES2) near to the light source (20”).

[0105] In the present embodiment, to maintain the intensity or uniformity of the light (Li) throughout the predefined layout, the material removal pattern is the line pattern shown in figure 13 and is pre-stored in the storage unit (60). The line pattern has a plurality of adjacent lines configured to form the predefined layout, and the material removing head (15) is configured to perform the etching, engraving or material removal according to the line pattern stored in the storage unit (60). Particularly, the distance between the adjacent lines of the line pattern is pre-stored to control the material removing head (15) accordingly.

[0106] In the present embodiment, the predefined layout is separated into three portions, a first portion (3421a) which is near the source light (20”) has less line density, a second portion (3421b) adjacent to the first portion (3421a) and away from the source light (20”) has the line density higher than the first portion (3421a), and a third portion (3421c) adjacent to the second portion (3421b) and farthest from the source light (20”) has most denser lines than the second portion (3421b) to compensate with the light losses occurring during transmission of light from the light source (20”). In the present embodiment, the material removal pattern has vertical lines hence, the number of lines increases (as shown in figure 13) from the first portion (3421a) towards the third portion (3421c). The material removal pattern may have gradually increasing density. The density of the lines goes on gradually increasing from the light source (20”) that is from the first end (341a) to the second end (341b).

[0107] Further, the processing unit (40) adjusts operational parameters in real - time such as the distance between the adjacent lines of the material removal pattern. Specifically, the processing unit (40) is adapted to adjust the distance between the adjacent lines as the material removing head (15) travels towards the second end (341b) of the fabric (341). Referring to Figures 14a and 14b, initially, the two adjacent lines are having a distance (D) and accordingly the material removal head (15) removes the material.

[0108] After the first phase of material removal, if the processing unit (40) detects the variation in the lighting characteristics emitting from the workpiece / fabric (341) relative to the final product, the predefined operational parameters are adjusted to remove the material from the fabric (341) to compensate for the manufacturing tolerances of the material used in fabric (341), process tolerances, atmospheric tolerances, or the like. The processing unit (40)is adapted to adjust the spacing between the material removal pattern including lines or circles to compensate for the lighting characteristics including reduction and distribution in the light intensity and control the material removing head (15) through the control unit (50) to remove the material from the optical fiber fabric (341) for desired lighting characteristics across the optical fiber fabric (341) with respect to the final product. Specifically, in this case, the distance (D) is modified to a distance (D’) (shown in Figure 14b) to remove the material according to detected variations for desired lighting characteristics such as uniform light intensity and distribution. The material removing head (15) is controlled through the control unit (50) to etch or engrave the fabric (341) for uniform light distribution as shown in figure 15.

[0109] Specifically, the system (100) is adapted to capture the images of the fabric (341) during the material removal including the etching or engraving using the sensing unit (30). The sensing unit (30) communicates with the processing unit (40) to compare the captured image (with image processing) with the reference image to detect variations in the lighting characteristics. According to detected deviations, the processing unit (40) adjusts the operational parameters. In this case, the distance between the two adjacent lines of the line pattern is adjusted and the predefined operational parameters are adjusted to achieve uniform light distribution over the predefined layout.

[0110] In an embodiment (not shown), the captured image during the material removal process of the fabric (341) might also be first used as an input to generate a processed image. The processing unit (40) may adjust the lighting characteristics such as light intensity and distribution of the captured image based on the properties of a spacer / diffuser material of a spacer / diffuser layer to generate the processed image. After generating the processed image, it may be superimposed with a virtual surface layer (36) to generate a secondary image. The virtual surface layer (36) may have a predefined perforation pattern / design through which the light emitted from the underlying workpiece is visible. The secondary image is compared with the reference image to determine the adjusted operational parameters for the next phase of the material removal process of the fabric (341).

[0111] Referring now to figure 16, a method (200) for improving the material removal process in accordance with the present invention is illustrated. The method (200) is described in conjunction with the system (100) described above. The method (200) comprises steps of:

[0112] The method (200) starts at step (210).

[0113] At step (220), the material removing head (15) is adapted to perform a first phase of material removal on a portion of the surface of the workpiece (34). Before starting thefirst phase of material removal, the light source (20) is arranged around the workpiece (34) / connected to the workpiece (34) (in case the workpiece is the fabric which itself emits light) at the predefined position and is turned ON to simulate the real-life light emission through the material-removed surface. In the first phase, the control unit (50) controls the material removing head (15) according to predefined operational parameters. Further, the material removing head (15) is adapted to move over the surface of the workpiece (34) to remove the material (etch, engrave or the like) according to the predefined layout or pattern.

[0114] At step (230), the sensing unit (30) is adapted to capture the image of the material-removed surface of the workpiece (34). The captured image is then communicated with the processing unit (40) to generate the secondary image simulating real-life lighting characteristics and appearance of the final product.

[0115] Specifically, in the first stage, the light intensity of the captured image is adjusted by the processing unit (40). The processing unit (40) adjusts the light intensity of the image based on the properties of the diffuser layer (35) stored in the storage unit (60) to generate a processed image with the adjusted light intensity. The properties of the spacer layer (35) are stored in the storage unit (60) before initiating the material removal on the workpiece (34) which can be retrieved by the processing unit (40).

[0116] Further, the processing unit (40) superimposes a virtual surface layer (36) over the processed image to generate the secondary image. The virtual surface layer (36) has a predefined perforation pattern / design (made transparent for image processing) through which the light emitted from the workpiece (34) is expected to be visible.

[0117] At step (240), the secondary image generated in step (230) is compared with the reference image of the final product. The reference image is previously stored in the storage unit (60) and is retrieved by the processing unit (40) to compare it with the secondary image. Specifically, the processing unit (40) compares the lighting characteristics such as light intensity and the light distribution of the secondary image against the reference image to identify deviations in the lighting characteristics including light intensity and the light distribution / light uniformity.

[0118] At step (250), the identified deviations are used to define the adjusted operational parameters. The processing unit (40) is adapted to define the adjusted operational parameters and material removal (such as etching, engraving or the like) design or pattern different from the predefined operational parameters and material removal (etching, engraving or the like) design or pattern based on the comparison between the secondary image and the reference image. The adjusted operational parameters and adjusted material removal patternare communicated with the control unit (50) to control the material removing head (15) to perform a second phase of material removal over a corresponding portion of the surface according to the adjusted operational parameters and adjusted material removal pattern to achieve desired lighting characteristics such as uniform light intensity and distribution.

[0119] At step (260), the processing unit (40) repeats steps (230) to (250) until each phase of the material removal has been performed on the workpiece (34). The processing unit (40) detects whether all the phases have been performed or not and if all the phases have not been done, the processing unit (40) sends a signal to the sensing unit (30) to capture the image of the workpiece (34) for comparing it with the reference image. If the processing unit (40) detects that all the phases of the material removal have been done, the method (200) ends at step (270).

[0120] In an additional embodiment, the method (200) for improving material removal is configured to convert the captured images into a greyscale image before generating the processed image.

[0121] Specifically, after the sensing unit (30) captures an image of the light distribution through the material-removed surface of the workpiece (34), the processing unit (40) converts the captured image into a greyscale image. The processing unit (40) uses the greyscale image to generate a processed image that simulates the light distribution through the material-removed surface.

[0122] After generating the processed image, the processing unit (40) superimposes a virtual surface layer (36) to produce a secondary image, which simulates the real-life light behavior of the final product or intended workpiece (34). The secondary image is also in greyscale and is compared with a reference image stored in the storage unit (60). The reference image is stored as a greyscale image for comparison with the secondary image.

[0123] The comparison between the secondary image (greyscale) and the reference image (greyscale) allows the processing unit (40) to detect deviations in the lighting characteristics including light intensity or distribution. Based on the detected deviations, the processing unit (40) adjusts the predefined operational parameters, such as laser power or resolution (LPI), to create adjusted operational parameters and the adjusted material removal pattern or layout that controls the material removing head (15) during subsequent phases of material removal. The greyscale image only includes lighting characteristics without considering the color information.

[0124] The greyscale image allows the processing unit (40) to detect how light is distributed through the surface of the workpiece (34) without detecting the variations in color.The conversion of the captured image into the greyscale image allows the processing unit (40) to process the comparison quicker as the greyscale images contain only brightness levels, and color information (for e.g. RGB information) is removed. It may be obvious for a person skilled in the art to convert the captured image into any other form of image such as inversion photo negative, sepia (warm colors), solarization (make dark areas light and light areas dark), and the like to reduce the processing time.

[0125] In an alternative embodiment, the captured image is processed using the processing unit (40) to generate the secondary image based on the properties of a diffuser layer(s) (35) instead of generating a processed image. The processing unit (40) is adapted to compare the secondary image, which only has the workpiece (34) and the diffuser layer(s) (35). The secondary image is representative of the final product.

[0126] In an alternative embodiment, the captured image is processed using the processing unit (40). The processing unit (40) superimposes virtual surface layer(s) (36) over the captured image to generate the secondary image without generating a processed image as the final product does not include the diffuser layer (35). The processing unit (40) is adapted to compare the secondary image, which only has the workpiece (34) and the virtual surface layer(s) (36).

[0127] Therefore, the advantage of the present invention is to provide a method (200) for improving a material removal process. The method (200) is adapted to provide uniform light intensity and distribution across the material-removed surface. The method (200) adjusts the operational parameters and the pattern or layout based on real-time data from the sensing unit (30) to improve precision and reduce errors during the process. The method (200) reduces the need for reworking and increases production efficiency. The method (200) along with the system (100) provides consistency, enhanced control, and improved productivity.

[0128] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present invention to the precise forms disclosed, and obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to explain the principles of the present invention best and its practical application, to thereby enable others skilled in the art to best utilise the present invention and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omission and substitutions of equivalents are contemplated as circumstance may suggest or render expedient, but such are intended to coverthe application or implementation without departing from the scope of the claims of the present invention.

Claims

1. We Claim:

1. A method (200) for improving a material removal process, the method (200) comprising the steps of:performing a first phase of material removal on a portion of the surface of a workpiece (34) using predefined operational parameters, a material removing head (15) is adapted to move over the surface of the workpiece (34) to remove material according to a predefined layout;capturing an image of surface of the workpiece (34) after the first phase of material removal using a sensing unit (30) for communicating with a processing unit (40) to generate a secondary image, wherein the secondary image is representative of the final product;comparing the secondary image with a reference image of the final product stored in a storage unit (60), the processing unit (40) compares lighting characteristics of the secondary image against the reference image to identify deviations in the lighting characteristics for modifying the predefined operational parameters into adjusted operational parameters;controlling a material removing head (15) using a control unit (50) according to adjusted operational parameters, the control unit (50) controls the material removing head (15) while performing a second phase of material removal over a corresponding portion of the surface of the workpiece (34) to achieve desired lighting characteristics.

2. The method (200) as claimed in claim 1, wherein the lighting characteristics include light intensity, light distribution, or color appearance including color temperature, or color rendering index (CRI), luminous flux, illuminance, light beam angle, glare, dimming capability, uniformity.

3. The method (200) as claimed in claim 1, wherein the captured image is processed using the processing unit (40), the processing unit (40) adjusts the lighting characteristics including light intensity and the light distribution of the image based on the properties of diffuser layer(s) (35) stored in the storage unit (60) to generate a processed image with the adjusted lighting characteristics.

4. The method (200) as claimed in claim 3, wherein the processed image is superimposed with virtual surface layer(s) (36) to generate a secondary image, the virtual surface layer(s) (36) has a predefined perforation pattem / design through which the light emitted from the workpiece (34) is visible.

5. The method (200) as claimed in claim 1, wherein the captured image is processed using the processing unit (40) to generate the secondary image based on the properties of diffuser layer(s) (35), wherein the secondary image is representative of the final product.

6. The method (200) as claimed in claim 1, wherein the captured image is processed using the processing unit (40), the processing unit (40) superimposes virtual surface layer (s) (36) over the captured image to generate the secondary image, wherein the secondary image is representative of the final product.

7. The method (200) as claimed in claim 1, wherein the predefined operational parameters include laser power in wattage, beam speed in feed rate, focal length / focus, pulse frequency, material removal pattern, material removal depth, or resolution (dots per inch - DPI or lines per inch-LPI or pattern per inch-PPI), wherein the processing unit (40) determines the adjusted operational parameters different than the predefined operational parameters based on the comparison between the secondary image and the reference image.

8. The method (200) as claimed in claim 1, wherein the processing unit (40) is configured to calculate a light intensity reduction factor and a light distribution factor based on the properties of the diffuser layer(s) (35) stored in the storage unit (60) and apply the light intensity reduction factor and or the light intensity distribution factor to the captured image to simulate the lighting characteristics including light intensity, light distribution, or color appearance after arranging the diffuser layer(s) (35) over the workpiece (34).

9. The method (200) as claimed in claim 1 , wherein the secondary image and the reference image are divided in a grid and each cell of the secondary image is compared with the corresponding cell of the reference image.

10. The method (200) as claimed in claim 1, wherein the first phase of material removal is on a first cell of a grid using the predefined operational parameters, the second phase of material removal is on a second cell of the grid using the adjusted operational parameters, wherein a third phase of material removal is on a third cell of the grid using secondly-adjusted operational parameters and the method (200) is performed for the subsequent cells of the grid thereafter for the entire workpiece.

11. The method (200) as claimed in claim 1, wherein the processing unit (40) is adapted to convert the captured image into a greyscale image or process a greyscale image captured by the sensing unit (30), wherein the reference image stored in the storage unit (60) is a greyscale image for comparing the reference image with the secondary image.

12. A system (100) for improving material removal process, comprising:a material removal apparatus (10) having a material removing head (15) and adapted to mount a workpiece (34) under the material removing head (15), the material removing head (15) is provided to perform material removal on a portion of the surface using predefined operational parameters;a light source (20) arranged around the workpiece (34), at a predetermined location based on a placement of the light source (20) in a final product;a sensing unit (30) arranged above the workpiece (34), configured to capture an image of the surface of the workpiece (34) after each phase of material removal, the images are captured to measure and detect lighting characteristics of a material-removed surface of the workpiece (34);a processing unit (40) connected to the sensing unit (30) to receive captured image and configured to compare the captured image with an image stored in a storage unit (60) showing a final product to identify deviations and modify the predefined operational parameters for generating adjusted operational parameters based on the identified deviations; anda control unit (50) connected to the processing unit (40) and adapted to control the material removing head (15) based on the adjusted operational parameters to achieve desired lighting characteristics including uniform light intensity and distribution emitted through the material-removed surface.

13. The system (100) as claimed in claim 12, wherein the processing unit (40) is configured to adjust the lighting characteristics including light intensity, light distribution, color appearance, luminous flux, illuminance, light beam angle, glare, dimming capability, uniformity of the captured image based on properties of a diffuser layer(s) (35) stored in the storage unit (60) to generate a processed image.

14. The system (100) as claimed in claim 13, wherein the processing unit (40) is adapted to apply a virtual surface layer(s) (36) on the processed image for generating a secondary image simulating the lighting characteristics of the final product, wherein the processing unit (40) compares the secondary image with the reference image to identify deviations in the lighting characteristics.

15. The system (100) as claimed in claim 13, wherein the processing unit (40) modifies the predefined operational parameters based on the identified deviations to generate adjusted operational parameters and communicates them with the control unit (50).

16. The system (100) as claimed in claim 12, wherein the light source (20) is an infrared light source (20’) and the sensing unit (30) is an infrared detector (30’) adapted to captureinfrared images of the infrared light emitted from the surface of the workpiece (34) after material removal phase, to compare with the reference image stored in the storage unit (60).

17. The system (100) as claimed in claim 16, wherein the reference image stored in the storage unit (60), is an image of the workpiece (34) illuminated by the infrared light source (20’), the reference image illuminated by the infrared light source (20’) is used for comparison with the captured image to maintain consistency during the comparison process.

18. The system (100) as claimed in claim 12, wherein the workpiece (34) is an optical fiber fabric (341), the optical fiber fabric (341) is having a plurality of optical fibers (3411) and a plurality of yams (3412) meshed / woven with each other to form the optical fiber fabric (341).

19. The system (100) as claimed in claim 12, wherein the processing unit (40) is adapted to modify the material removal pattern density for an optical fiber fabric (341), wherein the material removal pattern is modified to increase the density from a first end (341a) of the optical fiber fabric (341) towards a second end (341b) of the optical fiber fabric (341) to increase material removal density for uniform lighting characteristics across the optical fiber fabric (341).

20. The system (100) as claimed in claim 19, wherein the processing unit (40) is adapted to adjust the spacing between the material removal pattern including lines or circles to compensate for the lighting characteristics including reduction and distribution in the light intensity and control the material removing head (15) through the control unit (50) to remove the material from the optical fiber fabric (341) for desired lighting characteristics across the optical fiber fabric (341) with respect to the final product.

21. The system (100) as claimed in claim 12, wherein one or more of the processing unit (40), the storage unit (60), or the control unit (50) are remotely arranged away from the material removal apparatus (10) and adapted to communicate with the sensing unit (30) and the material removing head (15) through a wireless network.

22. The system (100) as claimed in claim 12, wherein one or more of the storage unit (60), the processing unit (40), or the control unit (50) is a cloud server configured to communicate with the material removal apparatus (10) through a wireless network.

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