Test socket and manufacturing method thereof
The test socket addresses uneven load distribution by partitioning the conductive part array into regions with varying gaps and insulating support, preventing damage and improving test performance and accuracy.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ISC CO LTD
- Filing Date
- 2025-12-17
- Publication Date
- 2026-07-09
AI Technical Summary
Existing test sockets for semiconductor devices face damage due to uneven load distribution, particularly in the outer areas, leading to deformation and reduced lifespan, as the conductive parts in these areas experience concentrated loads during testing.
The test socket design includes a conductive part array with varying gaps between conductive parts and insulating support members, optimizing the dielectric constant and repulsive force characteristics by partitioning the socket into regions with different gap configurations to evenly distribute load and prevent damage.
This design effectively prevents damage to conductive parts by evenly distributing loads, enhancing test performance and accuracy by ensuring even contact of conductive parts with terminals, thus extending the socket's lifespan.
Smart Images

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