Circuit module and electronic device

Abstract

The present application provides a circuit module and an electronic device. The circuit module comprises a main circuit board, a heating part, a heat conducting part, and a stacked module. The heating part is arranged on the surface of the main circuit board, and the stacked module is arranged on the surface of the main circuit board. The stacked module and the main circuit board define an accommodating space, the heat conducting part is arranged in the accommodating space, and orthographic projections of the heating part and the heat conducting part on the main circuit board at least partially overlap each other. One end of the heat conducting part is fixed to the main circuit board, and the end of the heat conducting part away from the main circuit board is in contact with the stacked module by means of a heat conducting material, or one end of the heat conducting part is in contact with the main circuit board by means of a heat conducting material, and the end of the heat conducting part away from the main circuit board is fixed to the stacked module, wherein the heat conducting material is flexible. A transfer path of heat dissipated by the heating part during operation is as follows: the heating part - the main circuit board - the heat conducting part - the stacked module. Therefore, heat can be transferred out by means of the heat conducting part, thereby improving the heat dissipation efficiency.

Description

Circuit modules and electronic equipment

[0001] This application claims priority to Chinese Patent Application No. 202510068646.1, filed on January 16, 2025, entitled "Circuit Module and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and in particular to a circuit module and electronic device. Background Technology

[0003] In modern life, electronic products are playing an increasingly important role in various communication and work situations. Smartwatches, mobile phones, laptops, and other electronic devices are gradually becoming necessities for modern people. Taking mobile phones as an example, a mobile phone includes a circuit module, which includes, but is not limited to, circuit boards and electronic components. These electronic components include, but are not limited to, processors, radio frequency chips, power amplifiers, and charging chips. As mobile phones need to perform more and more functions, the number of electronic components placed inside them is also increasing. Correspondingly, the space occupied by the circuit module inside the phone is also increasing, which contradicts the trend of making electronic devices thinner and lighter. Therefore, it is necessary to optimize the structure of the circuit module to reduce the space occupied by its components.

[0004] Current circuit modules often use a stacked approach, with several circuit boards stacked together to house more electronic components and make full use of the internal space of electronic devices. While this method saves space, it places higher demands on heat dissipation. Currently, this stacked circuit module design has relatively poor heat dissipation capabilities. Summary of the Invention

[0005] This application provides a circuit module and electronic equipment, and the circuit module has high heat dissipation efficiency.

[0006] This application provides a circuit module, including: a main circuit board, a heat-generating component, a heat-conducting component, and a stacked module. The heat-generating component is disposed on the surface of the main circuit board, and the stacked module is disposed on the surface of the main circuit board opposite to the heat-generating component. The stacked module and the main circuit board enclose a receiving space, and the heat-conducting component is disposed within the receiving space. Along the thickness direction of the circuit module, the orthographic projections of the heat-generating component and the heat-conducting component on the main circuit board at least partially overlap. One end of the heat-conducting component is fixed to the main circuit board, and the end of the heat-conducting component away from the main circuit board contacts the stacked module through a heat-conducting material; alternatively, one end of the heat-conducting component contacts the main circuit board through a heat-conducting material, and the end of the heat-conducting component away from the main circuit board is fixed to the stacked module. The heat-conducting material is flexible.

[0007] The heat dissipation path of the heat-generating component during operation is as follows: heat-generating component - main circuit board - thermally conductive component - stacked module. Therefore, the heat can be conducted away through the thermally conductive component, improving heat dissipation efficiency. Furthermore, one end of the thermally conductive component is fixed to a component, while the other end contacts other components through a flexible thermally conductive material. This allows heat to be transferred through the thermally conductive material, prevents the thermally conductive component from shaking, and avoids it pressing against the application processor board or stacked module, thus preventing deformation of the application processor board and stacked module.

[0008] In some embodiments, the accommodating space contains multiple electronic devices, which are fixed to a main circuit board or stacked module, and heat-conducting components are located in the gaps between the multiple electronic devices.

[0009] This allows for the rational use of space, avoids interfering with the normal arrangement of electronic components, and improves heat dissipation efficiency.

[0010] In some embodiments, the heat-generating component includes at least one of a system-on-a-chip, a charging chip, a radio frequency chip, and a Bluetooth chip, and the main circuit board includes an application processor board.

[0011] In some embodiments, the material of the thermally conductive component includes at least one of copper, aluminum, gold, zinc, silver, silicon carbide, ceramic, and graphite.

[0012] The materials selected for the heat-conducting components are all materials with high thermal conductivity and easy to obtain, which can ensure heat dissipation effect and increase the convenience of material acquisition.

[0013] In some embodiments, the thermal conductivity of the heat-conducting component is greater than 100 W / (m·K).

[0014] This satisfies the heat dissipation requirements of the heat-generating components and allows for a wider range of material choices for the heat-conducting components.

[0015] In some embodiments, the thermally conductive material includes at least one of phase change materials, liquid metals, thermally conductive gels, and thermal interface materials.

[0016] This allows the heat-conducting components to make smooth and flexible contact with other components, ensures efficient heat conduction, improves heat dissipation, and allows for a wide range of material choices.

[0017] In some embodiments, the stacked module includes a first shield, one end of a heat-conducting component is fixed to the main circuit board, and the other end of the heat-conducting component is in contact with the first shield through a heat-conducting material. The end of the heat-conducting component facing the first shield has multiple spaced-apart first protrusions, and a first recess is formed between any two adjacent first protrusions. The heat-conducting material wraps around the first protrusions and fills the first recess. And / or, the side of the first shield facing the heat-conducting component has multiple spaced-apart second protrusions, and a second recess is formed between any two adjacent second protrusions. The heat-conducting material wraps around the second protrusions and fills the second recess.

[0018] By setting a second protrusion and / or a first protrusion, the contact area between the heat-conducting component and the heat-conducting material can be increased, thereby increasing the heat transfer efficiency.

[0019] In some embodiments, the heat-conducting component has a first protrusion and a first recess, and the first shielding cover has a second protrusion and a second recess. The first protrusion extends into the second recess, and a gap exists between the inner wall surfaces of the first protrusion and the second recess. The second protrusion extends into the first recess, and a gap exists between the inner wall surfaces of the second protrusion and the first recess. A heat-conducting material wraps around the first and second protrusions, and fills the gap between the first and second protrusions, as well as the gap between the second protrusion and the first recess.

[0020] This can increase the structural compactness of the circuit module and bring the first and second heat-conducting components as close as possible to increase heat conduction efficiency.

[0021] In some embodiments, the stacked module includes a first shielding cover fixed to the surface of the main circuit board away from the heat-generating component. The accommodating space includes the space enclosed by the first shielding cover and the main circuit board.

[0022] In some embodiments, the stacked module includes a sub-circuit board, a frame board, and a first shield. The frame board is fixed to the surface of the main circuit board away from the heat-generating component, the sub-circuit board is fixed to the side of the frame board away from the main circuit board, and the first shield is fixed to the side of the sub-circuit board away from the frame board. The main circuit board, sub-circuit board, and frame board form a first receiving cavity, and the first shield and sub-circuit board form a second receiving cavity. The receiving space includes the first receiving cavity and the second receiving cavity. The heat-conducting component is located in the first receiving cavity, or, alternatively, a portion of the heat-conducting component is located in the first receiving cavity, and another portion of the heat-conducting component is located in the second receiving cavity.

[0023] In this way, designers can choose the setting method of heat-conducting components according to actual needs, increasing the flexibility of the design.

[0024] In some embodiments, the heat-conducting component includes a first heat-conducting element and a second heat-conducting element. The first heat-conducting element is disposed within a first receiving cavity, one end of the first heat-conducting element is fixed to the main circuit board, and the end of the first heat-conducting element away from the main circuit board is in contact with the sub-circuit board through a heat-conducting material. Alternatively, one end of the first heat-conducting element is in contact with the main circuit board through a heat-conducting material, and the end of the first heat-conducting element away from the main circuit board is fixed to the sub-circuit board.

[0025] The second heat-conducting element is disposed within the second receiving cavity. One end of the second heat-conducting element is fixed to the sub-circuit board, and the end of the second heat-conducting element away from the sub-circuit board contacts the first shielding cover through a heat-conducting material. Alternatively, one end of the second heat-conducting element contacts the sub-circuit board through a heat-conducting material, and the end of the second heat-conducting element away from the sub-circuit board is fixed to the first shielding cover.

[0026] Along the thickness direction of the circuit module, the orthographic projections of the first and second heat-conducting components on the sub-circuit board at least partially overlap.

[0027] The shapes and sizes of the gaps between multiple electronic components within the first and second receiving cavities may differ. A first heat-conducting component and a second heat-conducting component are respectively provided in the first and second receiving cavities. The shape and size of the first heat-conducting component can be set according to the shape and gaps between the electronic components in the first receiving cavity, and the shape and size of the second heat-conducting component can be set according to the shape and size of the gaps between the electronic components in the second receiving cavity. This allows for the placement of larger heat-conducting components within a limited space, thereby improving heat dissipation efficiency.

[0028] In some embodiments, the sub-circuit board has mounting holes that connect to a first receiving cavity and a second receiving cavity. At least one of the first and second thermally conductive elements has a plurality of first protrusions, with a first recess formed between any two adjacent first protrusions. The first protrusions extend into the mounting holes. Thermally conductive material fills the mounting holes, wraps around the first protrusions, and fills the first recesses. By providing the first protrusions, the contact area between the first and second thermally conductive elements and the thermally conductive material is increased, thereby improving heat dissipation efficiency.

[0029] In some embodiments, the first heat-conducting element includes a first sub-heat-conducting element and a second sub-heat-conducting element. The first and second sub-heat-conducting elements are arranged along a predetermined direction, perpendicular to the thickness direction of the circuit module. One end of the first sub-heat-conducting element is fixed to the main circuit board, and the end of the first sub-heat-conducting element away from the main circuit board contacts the sub-circuit board through a thermally conductive material. Alternatively, one end of the first sub-heat-conducting element contacts the main circuit board through a thermally conductive material, and the end of the first sub-heat-conducting element away from the main circuit board is fixed to the sub-circuit board. A portion of the second sub-heat-conducting element is located between the main circuit board and the sub-circuit board, and another portion of the second sub-heat-conducting element is located between electronic devices on the main circuit board and the sub-circuit board. One end of the second sub-heat-conducting element is fixed to the main circuit board, and the end of the second sub-heat-conducting element away from the main circuit board contacts the sub-circuit board through a thermally conductive material. Alternatively, one end of the second sub-heat-conducting element contacts the main circuit board through a thermally conductive material, and the end of the second sub-heat-conducting element away from the main circuit board is fixed to the sub-circuit board.

[0030] The first heat-conducting component is divided into a first sub-heat-conducting component and a second sub-heat-conducting component. The shape and size of the first and second sub-heat-conducting components can be set according to the gaps between the electronic components they are located in, so as to make better use of the gaps between the electronic components in the first accommodating cavity, increase the volume of the first heat-conducting component, and improve the heat dissipation efficiency.

[0031] In some embodiments, the first heat-conducting element includes a first sub-heat-conducting element and a second sub-heat-conducting element. The first and second sub-heat-conducting elements are arranged along the thickness direction of the circuit module. One end of the first sub-heat-conducting element is fixed to the main circuit board, and one end of the second sub-heat-conducting element is fixed to the sub-circuit board. The end of the first sub-heat-conducting element away from the main circuit board is in contact with the end of the second sub-heat-conducting element away from the sub-circuit board via a thermally conductive material. The first heat-conducting element is divided into a first sub-heat-conducting element and a second sub-heat-conducting element, and the first and second sub-heat-conducting elements are arranged along the thickness direction of the circuit module. Therefore, the shape and outer diameter of the first sub-heat-conducting element can be set according to the shape and size of the gaps between electronic components on the main circuit board, while the shape and outer diameter of the second sub-heat-conducting element can be designed according to the shape and size of the gaps between electronic components on the sub-circuit board. This maximizes the volume of the first and second sub-heat-conducting elements within a limited space, thereby increasing heat dissipation efficiency.

[0032] In some embodiments, the sub-circuit board has mounting holes that connect a first receiving cavity and a second receiving cavity. A portion of the heat-conducting component is located within the first receiving cavity, while another portion of the heat-conducting component passes through the mounting holes and extends into the second receiving cavity. The portions of the heat-conducting component located in the first receiving cavity and the portions located in the second receiving cavity are integrally formed as a single component, which can reduce the number of parts.

[0033] In some embodiments, an elastic element is provided between the outer peripheral surface of the heat-conducting component and the inner wall surface of the mounting hole, with the elastic element abutting against the outer peripheral surface of the heat-conducting component and the inner wall surface of the mounting hole. This increases the stability of the heat-conducting component and prevents it from shaking.

[0034] In some embodiments, the inner wall of the mounting hole is provided with a thermally conductive layer, and the elastic element abuts against the outer peripheral surface of the thermally conductive component and the thermally conductive layer. This allows heat to be transferred through the elastic element to the thermally conductive layer, and then from the thermally conductive layer to the circuit layer of the first radio frequency board and the conductive pillars in the via, ensuring that heat can be dissipated smoothly.

[0035] In some embodiments, the outer peripheral surface of the heat-conducting component is provided with a first extension, which is located within a first or second receiving cavity and is fixed to the sub-circuit board. This increases the reliability of the heat-conducting component's fixation, and the first extension can also be used to transfer heat, thereby increasing heat dissipation efficiency.

[0036] In some embodiments, the outer peripheral surface of the heat-conducting component is further provided with a second extension, which is located within the first or second receiving cavity, and the first and second extensions are spaced apart along the thickness direction of the circuit module. This increases the volume of the heat-conducting component, thereby improving heat dissipation efficiency.

[0037] In some embodiments, the outer peripheral surface of the heat-conducting component has a first extension, and the inner wall surface of the mounting hole has a heat-conducting layer. The first extension is located inside the mounting hole and in contact with the heat-conducting layer. By providing the first extension, the volume of the heat-conducting component is increased, which can improve the heat dissipation effect. In addition, the contact between the first extension and the heat-conducting layer of the sub-circuit board allows heat to be transferred to the sub-circuit board through the first extension. Combined with the heat transfer to the first shielding cover through the heat-conducting component, the heat dissipation efficiency is significantly increased.

[0038] In some embodiments, the heat-conducting components include a first heat-conducting element, a second heat-conducting element, and a third heat-conducting element. Along the thickness direction of the circuit module, the second, first, and third heat-conducting elements are fixed sequentially. The second heat-conducting element is located within a first receiving cavity, the third heat-conducting element is located within a second receiving cavity, a portion of the first heat-conducting element is located within the first receiving cavity, and another portion of the first heat-conducting element passes through a mounting hole and extends into the second receiving cavity. Thus, the shape and outer diameter of the first heat-conducting element can be set according to the shape and size of the gaps between electronic devices on the surface of the sub-circuit board facing the main circuit board, while the shape and outer diameter of the second heat-conducting element can be designed according to the shape and size of the gaps between electronic devices on the main circuit board, and the shape and outer diameter of the third heat-conducting element can be designed according to the shape and size of the gaps between electronic devices on the surface of the sub-circuit board facing away from the main circuit board. This maximizes the volume of the first, second, and third heat-conducting elements within a limited space, thereby increasing heat dissipation efficiency.

[0039] In some embodiments, the heating element is soldered to the main circuit board via pads. A solder mask layer is provided on the main circuit board, located around the pads, and its height is greater than the height of the pads. The solder mask layer prevents bridging during soldering; that is, during the soldering process, the solder mask layer prevents unnecessary solder joints, ensuring that short circuits do not occur between components and lines. The solder mask layer also has an insulating function, preventing external mechanical damage and electrical short circuits, ensuring stable operation of the circuit board. The greater height of the solder mask layer than the pads improves the solder mask effect.

[0040] In some embodiments, the heat-generating component is a system-on-a-chip (SoC), and the circuit module also includes a low-power double-data-rate (DDR) memory. The DDR memory is fixed to the side of the SoC facing away from the main circuit board. The DDR memory partially obscures the SoC, and the portion of the SoC not obscured by the DDR memory is covered with thermally conductive adhesive. Heat dissipated by the SoC during operation can be transferred to the thermally conductive adhesive, thereby increasing the SoC's heat dissipation efficiency and preventing overheating.

[0041] A second aspect of this application provides an electronic device, comprising: a housing and a circuit module according to any one of the first aspects of this application. The housing has a mounting space, and the circuit module is disposed within the mounting space. Since the electronic device includes the circuit module of the first aspect, the technical effects of the circuit module are also applicable to the electronic device. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0043] Figure 1 is a schematic diagram of the structure of a candybar mobile phone provided in an embodiment of this application.

[0044] Figure 2 is a schematic diagram of the split structure of a candybar mobile phone provided in an embodiment of this application.

[0045] Figure 3 is a partial structural schematic diagram of a candybar mobile phone provided in an embodiment of this application.

[0046] Figure 4 is a partial structural schematic diagram of the double-folding machine provided in an embodiment of this application.

[0047] Figure 5 is a partial structural schematic diagram of the three-fold machine provided in an embodiment of this application.

[0048] Figure 6 is a partial structural schematic diagram of another three-fold machine provided in an embodiment of this application.

[0049] Figure 7 is a partial structural schematic diagram of the four-fold machine provided in an embodiment of this application.

[0050] Figure 8 is a schematic diagram of the structure of a circuit module provided in some embodiments of this application.

[0051] Figure 9 is a schematic diagram of the structure of a circuit module provided in some other embodiments of this application.

[0052] Figure 10 is a schematic diagram of the structure of a circuit module provided in some embodiments of this application.

[0053] Figure 11 is a first embodiment of the circuit module of a candybar mobile phone provided in the first embodiment of this application.

[0054] Figure 12 shows a second embodiment of the circuit module of the candybar mobile phone provided in the first embodiment of this application.

[0055] Figure 13 is a bottom view of the application processor board shown in Figure 12.

[0056] Figure 14 is a top view of the application processor board shown in Figure 12.

[0057] Figure 15 is a partial structural schematic diagram of the circuit module provided in the first embodiment of this application.

[0058] Figure 16 is another partial structural schematic diagram of the circuit module provided in the first embodiment of this application.

[0059] Figure 17 is a partial structural diagram of the circuit module provided in the first embodiment of this application, in which the heat-conducting material is liquid metal.

[0060] Figure 18 is a schematic diagram of another partial structure in the circuit module provided in the first embodiment of this application, where the heat-conducting material is liquid metal.

[0061] Figure 19 is a schematic diagram of the structure of the circuit module provided in the first embodiment of this application, in which a steel mesh is set on the solder pad.

[0062] Figure 20 is a schematic diagram of the heat dissipation path of the heat-generating component in the circuit module provided in the first embodiment of this application.

[0063] Figure 21 is a schematic diagram of the solder resist layer arrangement in the circuit module provided in the first embodiment of this application.

[0064] Figure 22 is a schematic diagram of the structure of the heat-conducting component of the circuit module provided in the first embodiment of this application disposed in the first receiving cavity.

[0065] Figure 23 shows a first specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is a separate type.

[0066] Figure 24 is a schematic diagram of the structure of the circuit module provided in the first embodiment of this application, in which both the heat-conducting component and the first shielding cover are provided with protrusions.

[0067] Figure 25 is a schematic diagram of the structure of the heat-conducting component of the circuit module provided in the first embodiment of this application, with protrusions.

[0068] Figure 26 is a schematic diagram of the structure of the first shielding cover of the circuit module provided in the first embodiment of this application, which has a protrusion.

[0069] Figure 27 shows a second specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is a separate type.

[0070] Figure 28 shows a third specific implementation of the circuit module provided in the first embodiment of this application, where the heat-conducting component is a separate unit.

[0071] Figure 29 shows a fourth specific implementation of the circuit module provided in the first embodiment of this application, where the heat-conducting component is a separate unit.

[0072] Figure 30 shows a first specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0073] Figure 31 shows a second specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0074] Figure 32 is a schematic diagram of the state changes of the elastic element shown in Figure 31.

[0075] Figure 33 shows another structural form of the elastic element of the circuit module provided in the first embodiment of this application.

[0076] Figure 34 is a schematic diagram of the assembly state of the elastic component shown in Figure 33.

[0077] Figure 35 shows a third specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0078] Figure 36 is a schematic diagram of the structure in which the first extension of the heat-conducting component shown in Figure 35 is fixed to the side of the sub-circuit board facing the main circuit board.

[0079] Figure 37 shows a fourth specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0080] Figure 38 shows a fifth specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0081] Figure 39 is a structural schematic diagram of the heat-conducting component shown in Figure 38 from another perspective.

[0082] Figure 40 is a schematic diagram of another structure of the fifth specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0083] Figure 41 shows a sixth specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated.

[0084] Figure 42 is a partial structural schematic diagram of Figure 41.

[0085] Figure 43 is a partial structural schematic diagram of the circuit module of a candybar mobile phone provided in the second embodiment of this application.

[0086] Figure 44 is a schematic diagram of the structure of the circuit module provided in the second embodiment of this application, in which both the heat-conducting component and the first shielding cover are provided with protrusions.

[0087] Figure 45 is a schematic diagram of the heat-conducting component provided in the second embodiment of this application, where the protrusion is annular.

[0088] Figure 46 is a schematic diagram of the heat-conducting component provided in the second embodiment of this application, where the protrusion is a cube.

[0089] Figure 47 is a schematic diagram of the heat-conducting component provided in the second embodiment of this application, in which the protrusions are rectangular strips.

[0090] Figure 48 is a schematic diagram of the heat-conducting component provided in the second embodiment of this application, where the protrusion is a square ring shape.

[0091] Figure 49 is a schematic diagram of the structure of the heat-conducting component of the circuit module provided in the second embodiment of this application, with protrusions.

[0092] Figure 50 is a schematic diagram of the structure of the first shielding cover of the circuit module provided in the second embodiment of this application, which has a protrusion.

[0093] Explanation of reference numerals in the attached drawings: 1000 - Electronic device; 100 - Circuit module; 100a - Mainboard module; 100b - Small board module; 100c - Sub-board module; 100d - First sub-board module; 100e - Second sub-board module; 100f - Third sub-board module; 101 - Circuit board; 102 - Frame board; 103 - Bearing part; 104 - Support part; 105 - Main circuit board; 106 - Sub-circuit board; 107 - Solder pad; 108 - Solder; 109 - Stencil; 1 0 - Application processor board; 11 - Conductive pillar; 12 - Circuit layer; 13 - Solder mask layer; 20 - First RF board; 21 - Second RF board; 22 - Third RF board; 24 - Mounting hole; 25 - Thermal conductive layer; 30 - Shielding cover; 31 - First shielding cover; 32 - Second shielding cover; 33 - Second protrusion; 40 - Thermal conductive component; 41 - First thermal conductive component; 42 - Second thermal conductive component; 43 - First protrusion; 44 - First sub-thermal conductive component; 45 - Second sub-thermal conductive component; 46 - Elastic component. 461-Connecting part, 462-Deformable part, 47-First extension part, 48-Second extension part, 49-Third thermal conductive part, 50-Electronic device, 51-System-on-a-chip, 52-Low power double data rate memory, 53-Type-C interface, 54-SIM card, 55-Universal flash memory, 56-Thermal conductive adhesive, 60-Stacked module, 70-Accommodation space, 71-First accommodating cavity, 72-Second accommodating cavity, 80-Thermal conductive material, 90-Accommodating frame, 200- Housing, 201-Middle frame, 202-Back cover, 203-Border, 204-Middle plate, 205-Mounting space, 206-First mounting cavity, 207-Second mounting cavity, 208-Heat spreader, 209-Through hole, 210-First housing, 220-Second housing, 230-Third housing, 240-Fourth housing, 300-Display screen, 400-Battery, 500-Flexible circuit board, 600-Board to board connector, 700-Camera, 800-Rotation mechanism. Detailed Implementation

[0094] The embodiments of this application are described below with reference to the accompanying drawings.

[0095] This application provides an electronic device 1000, which includes, but is not limited to, drones, cellphones, notebook computers, tablet computers, personal digital assistants, wearable devices, mobile devices, action cameras, or handheld gimbal cameras.

[0096] The electronic device 1000 can be a candybar phone. Referring to Figures 1 and 2, Figure 1 is a structural schematic diagram of a candybar phone provided in an embodiment of this application. Figure 2 is a schematic diagram of the split structure of a candybar phone provided in an embodiment of this application. The candybar phone includes a housing 200, a display screen 300, a circuit module 100, and a battery 400.

[0097] The housing 200 includes a middle frame 201 and a rear cover 202. The middle frame 201 includes a side frame 203 and a middle plate 204. The side frame 203 surrounds the outer periphery of the middle plate 204 and is fixedly connected to it. The middle plate 204 and the side frame 203 enclose a mounting space 205. The mounting space 205 includes a first mounting cavity 206 and two second mounting cavities 207. Along the Y-axis, the two second mounting cavities 207 are located on both sides of the first mounting cavity 206. The first mounting cavity 206 is used to mount a battery 400, and the second mounting cavities 207 are used to mount a circuit module 100. The middle plate 204 includes a first surface and a second surface opposite to each other along its thickness direction. The first surface is the bottom surface of the first mounting cavity 206, and the second surface supports the display screen 300. The rear cover 202 is connected to one side of the side frame 203 to enclose the mounting space 205. The display screen 300 is connected to the side of the bezel 203 away from the back cover 202 and is used to display pictures, text and videos.

[0098] Referring to Figure 3, which is a partial structural schematic diagram of a candybar mobile phone provided in an embodiment of this application, the battery module 400 and the circuit module 100 are respectively installed in the first mounting cavity 206 and the second mounting cavity 207. The number of circuit modules 100 can be one or two. In this embodiment, there are two circuit modules 100, each installed in one of the two second mounting cavities 207. The two circuit modules 100 are a motherboard module 100a and a small board module 100b. The motherboard module 100a includes electronic components 50 such as a system-on-chip (SOC) and universal flash storage (UFS). The small board module 100b includes electronic components 50 such as a Type-C interface 53 and a SIM card 54. Mainboard module 100a and small board module 100b are electrically connected via flexible circuit board 500, allowing the electronic components 50 of the mainboard module 100a and small board module 100b to be electrically connected. Mainboard module 100a and battery 400 are also electrically connected via flexible circuit board 500 (FPC), allowing battery 400 to power mainboard module 100a, etc. Mainboard module 100a and flexible circuit board 500, and small board module 100b and flexible circuit board 500, are electrically connected via board-to-board connectors 600. Electronic device 1000 also includes camera 700 (CAM), which is generally electrically connected to mainboard module 100a.

[0099] Electronic device 1000 can also be a foldable phone, which can be a bi-fold, tri-fold, quad-fold, or penta-fold phone, etc.

[0100] Referring to Figure 4, which is a partial structural schematic diagram of the double-folding device provided in this embodiment of the application, the double-folding device differs from the candybar device in that it includes two housings 200, three circuit modules 100, two batteries 400, and a rotating mechanism 800. The two housings 200 are rotatably connected by the rotating mechanism 800. Each housing 200 includes a middle frame 201 and a back cover 202. The structures of the middle frame 201 and the back cover 202 are similar to those of the candybar device described above and will not be repeated. The two batteries 400 are respectively installed in the mounting spaces 205 of the two housings 200. The three circuit modules 100 are a main board module 100a, a small board module 100b, and a secondary board module 100c. The main board module 100a and the small board module 100b are installed in the mounting space 205 of one of the housings 200, and along the Y-axis direction, the main board module 100a and the small board module 100b are located on both sides of the battery 400. Sub-board module 100c is installed in the mounting space 205 of another housing 200. Main board module 100a and sub-board module 100b are electrically connected via a flexible circuit board 500, and main board module 100a and sub-board module 100c are electrically connected via another flexible circuit board 500.

[0101] Referring to Figures 5 and 6, Figure 5 is a partial structural schematic diagram of a three-fold folding machine provided in an embodiment of this application, and Figure 6 is a partial structural schematic diagram of another three-fold folding machine provided in an embodiment of this application. The difference from the two-folding machine is that the three-folding machine includes four circuit modules 100, three housings 200, three batteries 400, and two rotating mechanisms 800. Each of the three housings 200 has an installation space 205. The three housings 200 are respectively a first housing 210, a second housing 220, and a third housing 230, arranged sequentially along the X-axis. The first housing 210 and the second housing 220 are rotatably connected by one rotating mechanism 800, and the second housing 220 and the third housing 230 are rotatably connected by another rotating mechanism 800. The three batteries 400 are respectively installed in the installation spaces 205 of the three housings 200. The four circuit modules 100 are the main board module 100a, the small board module 100b, the first sub-board module 100d, and the second sub-board module 100e.

[0102] Referring to Figure 5, in one embodiment, the first sub-board module 100d and the small board module 100b are installed in the mounting space 205 of the first housing 210, the main board module 100a is installed in the mounting space 205 of the second housing 220, and the second sub-board module 100e is installed in the mounting space 205 of the third housing 230. The first sub-board module 100d and the small board module 100b are electrically connected via a flexible circuit board 500, the first sub-board module 100d and the main board module 100a are electrically connected via a flexible circuit board 500, and the second sub-board module 100e and the main board module 100a are electrically connected via a flexible circuit board 500.

[0103] Referring to Figure 6, in another embodiment, the motherboard module 100a and the small board module 100b are installed in the mounting space 205 of the first housing 210, the first sub-board module 100d is installed in the mounting space 205 of the second housing 220, and the second sub-board module 100e is installed in the mounting space 205 of the third housing 230. The motherboard module 100a and the small board module 100b are electrically connected through a flexible circuit board 500, the first sub-board module 100d and the motherboard module 100a are electrically connected through a flexible circuit board 500, and the second sub-board module 100e and the first sub-board module 100d are electrically connected through a flexible circuit board 500.

[0104] Referring to Figure 7, which is a partial structural schematic diagram of the four-fold folding machine provided in an embodiment of this application, the four-fold folding machine differs from the double-folding machine in that it includes five circuit modules 100, four housings 200, four batteries 400, and three rotating mechanisms 800. Each of the four housings 200 has an installation space 205. The four housings 200 are respectively a first housing 210, a second housing 220, a third housing 230, and a fourth housing 240, arranged sequentially along the X-axis. The first housing 210 and the second housing 220 are rotatably connected by the rotating mechanisms 800, the second housing 220 and the third housing 230 are rotatably connected by the rotating mechanisms 800, and the third housing 230 and the fourth housing 240 are rotatably connected by the rotating mechanisms 800. The four batteries 400 are respectively installed within the installation spaces 205 of the four housings 200. The five circuit modules 100 are a motherboard module 100a, a small board module 100b, a first sub-board module 100d, a second sub-board module 100e, and a third sub-board module 100f. The motherboard module 100a and the small board module 100b are installed in the mounting space 205 of the first housing 210, the first sub-board module 100d is installed in the mounting space 205 of the second housing 220, the second sub-board module 100e is installed in the mounting space 205 of the third housing 230, and the third sub-board module 100f is installed in the mounting space 205 of the fourth housing 240. The main board module 100a and the small board module 100b are electrically connected via a flexible circuit board 500. The first sub-board module 100d and the main board module 100a are electrically connected via a flexible circuit board 500. The second sub-board module 100e and the first sub-board module 100d are electrically connected via a flexible circuit board 500. The third sub-board module 100f and the second sub-board module 100e are electrically connected via a flexible circuit board 500.

[0105] With the trend towards thinner and lighter mobile phones, both candybar and foldable phones tend to incorporate circuit modules 100 that include multiple stacked circuit boards 101 to save space. This will be detailed below.

[0106] Referring to FIG. 8, FIG. 8 is a schematic structural diagram of a circuit module 100 provided in some embodiments of the present application. In some embodiments, the circuit module 100 includes a plurality of circuit boards 101 and a frame board 102. Each of the plurality of circuit boards 101 has an upper surface and a lower surface, and the direction from the upper surface to the lower surface of the circuit board 101 is the thickness direction of the circuit board 101. The plurality of circuit boards 101 are stacked, and the stacking direction of the plurality of circuit boards 101 is the thickness direction of the circuit board 101. Electronic devices 50 may be provided on the upper surface and / or the lower surface of the circuit board 101.

[0107] To avoid interference between the electronic devices 50 on the stacked plurality of circuit boards 101 and to prevent the electronic devices 50 from being squeezed, a frame board 102 is provided between any two adjacent circuit boards 101 along the thickness direction of the circuit board 101. The frame board 102 is in a frame shape. When the frame board 102 is stacked between two adjacent circuit boards 101, the cavity of the frame board 102 can accommodate the electronic devices 50 of the circuit board 101, preventing interference between the electronic devices 50 on the adjacent circuit boards 101. The frame board 102 includes a plurality of support portions 104. The plurality of support portions 104 can be connected in shapes such as L-shaped, "I"-shaped, "日"-shaped, "田"-shaped, etc., and the cavity for accommodating electrical devices is enclosed by the plurality of support portions 104. The frame board 102 and the circuit board 101 can be fixed by welding. Specifically, solder pads 107 are provided on both the frame board 102 and the circuit board 101, and then solder 108 such as solder paste is used to weld the solder pads 107 of the two to achieve mechanical connection between the frame board 102 and the circuit board 101.

[0108] The circuit board 101 can be a printed circuit board 101 or a flexible circuit board 500. The shape of the circuit board 101 can be a regular shape such as circular, square, oval, etc., or an irregular shape. The present application is not limited. Electronic devices 50 can be provided on both the upper surface and the lower surface of the circuit board 101. According to the number of electronic devices 50 to be provided on the circuit board 101, the circuit board 101 can be a single-sided board or a double-sided board. A single-sided board refers to a circuit board 101 with electronic devices 50 provided only on the upper surface or only on the lower surface, and a double-sided board refers to a circuit board 101 with electronic devices 50 provided on both the upper surface and the lower surface.

[0109] Referring to Figure 9, which is a schematic diagram of the structure of a circuit module 100 provided in some embodiments of this application. In some embodiments, the circuit module 100 includes multiple circuit boards 101 and a frame board 102. The frame board 102 includes a carrier portion 103 and a support portion 104. The carrier portion 103 and the support portion 104 can be integrally formed or welded together. The carrier portion 103 and the multiple circuit boards 101 are stacked along the thickness direction of the circuit boards 101. Electronic devices 50 can also be disposed on the carrier portion 103. A support portion 104 is provided between two adjacent circuit boards 101 to prevent the electronic devices 50 of the two adjacent circuit boards 101 from being squeezed or interfering with each other. A support portion 104 is provided between adjacent circuit boards 101 and the carrier portion 103 to prevent the electronic devices 50 of the circuit boards 101 and the electronic devices 50 of the carrier portion 103 from being squeezed or interfering with each other.

[0110] Referring to Figure 10, which is a schematic diagram of the structure of a circuit module 100 provided in some embodiments of this application, the circuit module 100 may include multiple circuit boards 101 and frame boards 102. Frame boards 102 are disposed between adjacent circuit boards 101, and the structure and function of the frame boards 102 are as described in the above embodiments. The multiple circuit boards 101 include a main circuit board 105 and multiple sub-circuit boards 106, with the area of ​​the main circuit board 105 being larger than the area of ​​the sub-circuit boards 106. The multiple sub-circuit boards 106 may be sequentially stacked on the upper or lower surface of the main circuit board 105. Alternatively, a first portion of the multiple sub-circuit boards 106 may be stacked on a region of the upper surface of the main circuit board 105, and a second portion of the multiple sub-circuit boards 106 may be stacked on another region of the upper surface of the main circuit board 105. Alternatively, a first portion of the multiple sub-circuit boards 106 may be stacked on the upper surface of the main circuit board 105, and a second portion of the multiple sub-circuit boards 106 may be stacked on the lower surface of the main circuit board 105. The number of sub-circuit boards 106 in the first part and the second part can be the same or different.

[0111] The following explanation uses the circuit module 100 in a candybar phone as an example.

[0112] Referring to Figure 11, Figure 11 illustrates a first embodiment of the circuit module 100 for a candybar mobile phone according to the first embodiment of this application. In the first embodiment, the circuit module 100 is disposed in the mounting space 205 of the mid-frame 201, and the back cover 202 is fixed to the mid-frame 201 to enclose the mounting space 205. A heat dissipation plate 208 is stacked on the surface of the mid plate 204 of the mid-frame 201 facing away from the mounting space 205. The heat dissipated by the circuit module 100 and the battery 400 during operation can be transferred to the heat dissipation plate 208 through the mid-frame 201, etc. The heat dissipation plate 208 is used to dissipate heat from the circuit module 100 and the battery 400. The display screen 300 is disposed on the side of the heat dissipation plate 208 facing away from the mid plate 204. The circuit module 100 includes a main circuit board 105, three sub-circuit boards 106, and a frame plate 102. The frame plate 102 includes a carrier portion 103 and multiple support portions 104. The main circuit board 105 can be an application processor (AP) board, and the three sub-circuit boards 106 can all be radio frequency (RF) boards. The three sub-circuit boards 106 are a first RF board 20, a second RF board 21, and a third RF board 22, respectively. The first RF board 20 is stacked on the upper surface of the application processor board 10. A carrier board is stacked on the upper surface of the application processor board, the second RF board 21 is stacked on the upper surface of the carrier board, and the third RF board 22 is stacked on the upper surface of the application processor board 10. The first RF board 20 and the application processor board 10, the carrier board 103 and the application processor board 10, the second RF board 21 and the carrier board 103, and the third RF board 22 and the application processor board 10 are all separated by a support portion 104.

[0113] The electronic device 1000 also includes a camera 700, which is installed in the mounting space 205. To save space, the application processor board 10 has a clearance hole through which the camera 700 passes, making the electronic device 1000 thinner. The first radio frequency board 20 and the second radio frequency board 21 are located on one side of the camera 700, and the third radio frequency board 22 is located on the other side of the camera 700.

[0114] It is understood that the circuit module 100 also includes board-to-board connectors 600 (BTB) to enable the circuit module 100 to be electrically connected to other electrical components in the electronic device 1000, such as the flexible circuit board 500.

[0115] Referring to Figure 12, Figure 12 illustrates a second embodiment of the circuit module 100 for a candybar mobile phone provided in the first embodiment of this application. In the second embodiment of the first embodiment, the circuit module 100 includes a main circuit board 105, three sub-circuit boards 106, and a frame board 102. The difference from the above embodiment is that the frame board 102 only includes a support portion 104. The main circuit board 105 can be an application processor board 10, and the three sub-circuit boards 106 can all be radio frequency (RF) boards. The three sub-circuit boards 106 are respectively a first RF board 20, a second RF board 21, and a third RF board 22. The first RF board 20 is stacked on the upper surface of the application processor board 10, the second RF board 21 is stacked on the upper surface of the first RF board 20, and the third RF board 22 is stacked on the upper surface of the application processor board 10. The first RF board 20 and the application processor board 10, the first RF board 20 and the second RF board 21, and the third RF board 22 and the application processor board 10 are all separated by the support portion 104. Other components and connections of the circuit module 100 in this embodiment are the same as those in the above embodiment and will not be repeated here.

[0116] In the first embodiment, the electronic devices 50 on the application processor board 10 include a system-on-chip (SOC), low-power double-data-rate (LPDDR) memory, a wireless fidelity (WIFI) chip, universal flash storage (UFS), an inductor, a power management unit (PMU), a charging chip, an RF chip, an RF transceiver module, and the charging chip, etc. The electronic devices 50 on the RF board include an RF chip, a power amplifier, an antenna switch, a resistor, a Bluetooth chip, a compass, a capacitor, and an RF transceiver module, etc.

[0117] It is understood that all electronic components 50 on circuit board 101 need to be shielded to protect them from interference by external electromagnetic signals and to prevent damage from external mechanical forces. Electronic components 50 located between two adjacent circuit boards 101 can be protected by the circuit board 101 and the frame board 102, while the outermost electronic component 50 of the circuit module 100 needs to be shielded with a shielding cover 30. The gaps between two adjacent circuit boards 101 and the gaps within the shielding cover 30 can be filled with thermal interface materials (TIM). The blank areas in Figure 12 represent gaps that can be filled with TIM. This conducts the heat dissipated by the electronic components 50 during operation, cooling the circuit module 100 and preventing overheating. The shielding cover 30 can be soldered to the surface of circuit board 101 via pads 107, or it can be adhered to the surface of circuit board 101 with adhesive. The number of electronic devices 50 protected within each shield 30 can be designed according to actual needs, and the height and shape of each shield 30 can also be designed according to actual needs. This application does not impose any limitations on this.

[0118] In the first embodiment, the heat-generating components of the circuit module 100 are the main cause of the high temperature of the circuit module 100. The heat-generating components may include a system-on-a-chip 51, an RF chip, a Bluetooth chip, or a charging chip, etc. Since the heat-generating components such as the system-on-a-chip 51 of the circuit module 100 are the main cause of the high temperature of the circuit module 100, making the heat of the heat-generating components dissipate quickly can prevent the entire circuit module 100 from losing temperature.

[0119] Figure 13 is a bottom view of the application processor board 10 shown in Figure 12, and Figure 14 is a top view of the application processor board 10 shown in Figure 12. The small dots in Figure 13 are solder pads, which are used to solder electronic components such as the system-on-a-chip 51 onto the application processor board 10. The square areas in Figure 13 represent components such as capacitors. The smaller square areas in Figure 14 represent some electronic components. The three larger square areas in Figure 14 represent gaps between electronic components; these gaps can be used to house heat-conducting components.

[0120] Referring to Figures 15 and 16, Figure 15 is a partial structural schematic diagram of the circuit module 100 provided in the first embodiment of this application, and Figure 16 is another partial structural schematic diagram of the circuit module 100 provided in the first embodiment of this application. In this embodiment, taking the system-on-a-chip 51 as an example, in order to quickly cool down the system-on-a-chip 51, in this embodiment, the system-on-a-chip 51 is soldered and fixed to the lower surface of the application processor board 10 via pads 107, and the low-power double data rate memory 52 is soldered and fixed to the lower surface of the system-on-a-chip 51 via pads 107. That is, the system-on-a-chip 51 and the low-power double data rate memory 52 are stacked sequentially on the surface of the application processor board 10, and the area of ​​the system-on-a-chip 51 is larger than that of the low-power double data rate memory 52. ​​Therefore, the low-power double data rate memory 52 can only block the middle part of the system-on-a-chip 51, and the surface of the part of the system-on-a-chip 51 not blocked by the low-power double data rate memory 52 can be provided with thermal conductive adhesive 56 to increase heat dissipation efficiency. Both the system-on-a-chip 51 and the low-power double data rate memory 52 are located on the outermost side of the circuit module 100, therefore, they require protection using a shield 30. This shield 30 is soldered and fixed to the lower surface of the application processor board 10. A through-hole 209 is provided on the middle plate 204 at a location corresponding to the shield 30 along the Z-axis, into which the shield 30 extends to reduce the thickness of the electronic device 1000. Thermally conductive adhesive 56 is also provided between the surface of the low-power double data rate memory 52 facing away from the system-on-a-chip 51 and the shield 30. The outer surface of the shield 30 is bonded to the heat spreader 208 using the thermally conductive adhesive 56, allowing the heat generated by the system-on-a-chip 51 and the low-power double data rate memory 52 during operation to be transferred to the heat spreader 208, thus reducing the temperature of the system-on-a-chip 51 and the low-power double data rate memory 52.

[0121] It is understood that the shielding cover 30 can be made of metals such as copper, aluminum, or titanium alloy. The area where the shielding cover 30 and the heat spreader 208 are bonded has a high thermal conductivity section. This high thermal conductivity section can be made of a material with a high thermal conductivity coefficient, or it can be layered with another layer of a material with a high thermal conductivity coefficient. For example, the shielding cover 30 can be made of aluminum to reduce its weight. The high thermal conductivity section of the shielding cover 30 can be made of copper, or a layer of copper foil can be placed in the high thermal conductivity section to improve heat transfer efficiency.

[0122] Referring to Figure 15, in this embodiment, in order to further increase heat dissipation efficiency, a heat-conducting component 40 can be provided on the surface of the application processor board 10 away from the system-on-a-chip 51. Along the Z-axis direction, the orthographic projection of the heat-conducting component 40 on the application processor board 10 and the orthographic projection of the heat-generating components such as the system-on-a-chip 51 on the application processor board 10 overlap at least partially, so that the heat generated by the system-on-a-chip 51 when it is working can be quickly dissipated through the heat-conducting component 40. The thermal conductivity of the heat-conducting component 40 is greater than 100 W / (m·K). For example, the thermal conductivity can be 100 W / (m·K), 129 W / (m·K), 150 W / (m·K), 237 W / (m·K), 250 W / (m·K), 270 W / (m·K), 300 W / (m·K), 401 W / (m·K), 414 W / (m·K), 500 W / (m·K), 600 W / (m·K), 700 W / (m·K), 900 W / (m·K), or 1000 W / (m·K), etc. This satisfies the heat dissipation requirements of the heat-generating component and allows for a wide range of material choices for the heat-conducting component 40. The material of the heat-conducting component 40 may include at least one metal with a high thermal conductivity, such as copper, aluminum, gold, zinc, and silver; or, the material of the heat-conducting component 40 may include non-metals with high thermal conductivity, such as silicon carbide, ceramics, or graphite. The above-mentioned material selection range for the heat-conducting component 40 all belong to materials with high thermal conductivity and are readily available, which can ensure heat dissipation effect and increase the convenience of material acquisition.

[0123] As shown in Figure 14, the application processor board 10 has electronic devices 50 on its surface opposite to the system-on-a-chip 51. The heat-conducting components 40 can be located within the gaps between these electronic devices 50, improving space utilization without affecting the functionality of the application processor board 10. It is understood that heat-conducting components 40 can be placed in the three larger square areas in Figure 14. All three heat-conducting components 40 can be made of copper. The three heat-conducting components 40 are heat-conducting component 40A, heat-conducting component 40B, and heat-conducting component 40C. The minimum length and width of heat-conducting component 40A are 1mm*1mm, and the maximum length and width are 3mm*3mm. The minimum length and width of heat-conducting component 40B are 2mm*2mm, and the maximum length and width are 5mm*4mm. The minimum length and width of heat-conducting component 40C are 3mm*2mm, and the maximum length and width are 6mm*5mm. The thermal conductive components corresponding to the system-on-a-chip 51 can be thermal conductive component 40A, thermal conductive component 40B, and thermal conductive component 40C.

[0124] In the first embodiment, referring to FIG15, the application processor board 10 has a stacked module 60 on the surface opposite to the system-on-a-chip 51. The stacked module 60 includes the aforementioned frame board 102, radio frequency board, and shielding cover 30. A receiving space 70 is formed between the application processor board 10 and the stacked module 60, and the heat-conducting component 40 is located in the receiving space 70. Along the thickness direction of the circuit module 100, the heat-generating component and the heat-conducting component 40 at least partially overlap in their orthogonal projections on the main circuit board 105. The heat-conducting component 40 is made of a rigid material, and rigidity refers to the property of a material that does not deform under external force. Furthermore, one end of the heat-conducting component 40 is soldered to the application processor board 10, and the other end of the heat-conducting component 40 is in contact with the stacked module 60 through a heat-conducting material 80. Alternatively, one end of the heat-conducting component 40 is in contact with the application processor board 10 through the heat-conducting material 80, and the other end of the heat-conducting component 40 is soldered to the stacked module 60. The heat-conducting component 40 dissipates heat from the system-on-a-chip 51, reducing its junction temperature by at least 4 degrees Celsius, for example, by 4, 5, or 6 degrees Celsius. The housing 70 also contains electronic devices that generate heat; the heat emitted by these devices is retained within the housing 70. The heat-conducting component 40 further enhances the heat dissipation capacity of the housing 70 and its electronic devices, thereby extending the lifespan of the electronic devices and improving their heat dissipation capabilities.

[0125] Furthermore, by using the heat-conducting component 40 for heat dissipation, compared to the traditional solution of completely filling the space with thermally conductive adhesive, the soldering process is less prone to reflow and adhesive failure because there is no thermally conductive adhesive or only a small amount of thermally conductive adhesive at the location corresponding to the system-on-a-chip 51, thus improving the manufacturability of the circuit module. Additionally, when the electronic device needs repair, the amount of thermally conductive adhesive used is reduced due to the heat-conducting component 40, increasing the ease of cleaning residual adhesive and allowing it to be peeled off completely, thus improving maintenance convenience. Here, residual adhesive refers to the TIM filling the empty spaces in the receiving space 70.

[0126] The thermally conductive material 80 can be any of the following: phase change material (PCM), liquid metal, thermally conductive gel, or thermal interface material. This allows the thermally conductive component 40 to smoothly and flexibly contact other components while ensuring efficient heat conduction and improving heat dissipation, and also provides a wide range of material choices. A phase change material is a substance that changes its state of matter with temperature and can provide latent heat. The thermally conductive material 80 is flexible, meaning it deforms under external force. This flexibility prevents rigid contact when the thermally conductive component 40 contacts other components. That is, one end of the thermally conductive component 40 is fixed to one component, while the other end contacts other components through the flexible thermally conductive material 80. This prevents the thermally conductive component 40 from shaking and avoids it pressing against the application processor board 10 or the stacked module 60, thus preventing deformation of the application processor board 10 and the stacked module 60.

[0127] Referring to Figures 17 and 18, Figure 17 is a partial structural schematic diagram of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting material 80 is liquid metal, and Figure 18 is another partial structural schematic diagram of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting material 80 is liquid metal. When the heat-conducting material 80 is liquid metal, a receiving frame 90 can be used to contain the liquid metal, and the shape of the receiving frame 90 can be "U". During assembly, the receiving frame 90 can be placed on the inner surface of the first shielding cover 31 first, and then the liquid metal can be placed inside the receiving frame 90. Next, the heat-conducting component 40 can be placed inside the first shielding cover 31. The heat-conducting component 40 closes the opening of the receiving frame 90 and contacts the liquid metal inside the receiving frame 90 to prevent liquid metal leakage. The receiving frame 90 can be made of rubber.

[0128] It is understandable that electronic components 50 can be mounted on both the application processor board 10 and the stacked module 60. Therefore, to avoid interference from the heat-conducting component 40 with the electronic components 50, the heat-conducting component 40 can be placed in the gaps between multiple electronic components 50. This makes reasonable use of space, does not interfere with the normal arrangement of the electronic components 50, and can improve heat dissipation efficiency.

[0129] When the system-on-a-chip (SoC) 51 generates heat, the heat conduction path is as follows: SoC 51 - application processor board 10 - thermally conductive component 40 - stacked module 60. Generally, the SoC 51 and other electronic components 50 are soldered and fixed to the application processor board 10 via pads 107. The pads 107 on the application processor board 10 are electrically connected to the internal circuit layer 12 vias. The cross-section of the vias on the application processor board 10 can be trapezoidal, and the minimum via diameter is not less than 5 mils. Conductive posts 11 are provided within the vias, and the conductive posts 11 are mechanically connected to the circuit layer 12 within the application processor board 10, allowing the pads 107 to be electrically connected to the circuit layer 12 via the conductive posts 11.

[0130] Referring to Figure 19, which is a schematic diagram of the structure of the circuit module 100 provided in the first embodiment of this application, in which a stencil 109 is provided on the pad 107. When the system-on-a-chip 51 is soldered to the pad 107 of the application processor board 10, solder 108 and stencil 109 are required. The stencil 109 covers the pad 107, and the solder 108 is located in the holes of the stencil 109. During soldering, the solder 108 melts and fixes the pins of the system-on-a-chip and the pad 107 together. Similarly, if the heat-conducting component 40 is soldered to the pad 107 of the application processor board 10, solder 108 and stencil 109 are also required. Therefore, referring to Figure 20, which is a schematic diagram of the heat dissipation path of the heat-generating component in the circuit module 100 provided in the first embodiment of this application. The detailed heat transfer process is as follows: System-on-a-chip 51 - Pads 107, solder 108 and stencil 109 corresponding to system-on-a-chip 51 - Conductive pillars 11 and circuit layer 12 of application processor board 10 - Pads 107, solder 108 and stencil 109 corresponding to heat-conducting component 40 - Heat-conducting component 40 - Stacked module 60.

[0131] The system-on-a-chip 51 is soldered to the pads 107 of the application processor. The thermally conductive component 40 contacts the application processor board 10 via the thermally conductive material 80. At this time, the pads 107 are still present on the surface of the application processor board 10 and at the corresponding locations of the thermally conductive component 40. The thermally conductive material 80 can be disposed between the thermally conductive component 40 and the pads 107. The detailed heat transfer process is as follows: System-on-a-chip 51 - Pads 107, solder 108, and stencil 109 corresponding to the system-on-a-chip 51 - Conductive pillars 11 and circuit layers 12 of the application processor board 10 - Pads 107 corresponding to the thermally conductive component 40 - Thermally conductive material 80 - Thermally conductive component 40 - Stacked module 60.

[0132] In this embodiment, heat-generating components such as the system-on-a-chip 51 can use thermal pads. Thermal pads refer to pads 107 of certain key components that have undergone special treatment to give them a larger area and better heat dissipation performance, thereby improving the reliability and strength of the soldering. During the soldering process of electronic devices 50, the design of thermal pads can effectively solve the problem of excessive heat dissipation during soldering and prevent the formation of cold solder joints. In this embodiment, thermal pads can be formed by exposing the copper layer of the circuit board 101, which can improve soldering strength and enhance heat dissipation. Other electronic devices 50 with lower heat generation can use ordinary pads 107, which can be non-solder mask defined (NSMD) pads.

[0133] In this embodiment of the application, referring to FIG21, FIG21 is a schematic diagram of the arrangement structure of the solder mask layer 13 in the circuit module 100 provided in the first embodiment of the application. The application processor board 10 is also provided with a solder mask layer 13, which surrounds the pads 107 corresponding to the electronic devices 50. The height of the solder mask layer 13 is higher than the height of the pads 107. The thermal conductivity of the solder mask layer 13 is greater than 2 W / (m·K). The solder mask layer 13 can prevent bridging during soldering, that is, during the soldering process, the solder mask layer 13 can prevent unnecessary solder joints, ensuring that short circuits do not occur between various components and lines. The solder mask layer 13 also has an insulating function, preventing external mechanical damage and electrical short circuits, ensuring the stable operation of the circuit board 101. In conventional technology, the height of the solder mask layer 13 is the same as the height of the pads 107, and the thermal conductivity of the solder mask layer 13 is about 0.2 W / (m·K), resulting in poor solder mask and heat dissipation effects. Furthermore, in conventional technologies, heat-generating components such as the system-on-a-chip 51 and other components all use solder mask defined (SMD) pads 107, resulting in low solder strength and poor heat dissipation for the heat-generating components. In this embodiment, the height of the solder mask layer 13 is greater than the height of the pad 107, which improves the solder mask effect. In addition, the solder mask layer 13 has a high thermal conductivity, which can also increase the heat conduction efficiency and improve the heat dissipation effect.

[0134] In the first embodiment, referring to FIG22, FIG22 is a schematic diagram of the structure of the heat-conducting component 40 of the circuit module 100 provided in the first embodiment of the present application disposed in the first receiving cavity 71. The stacked module 60 includes a sub-circuit board 106, a shielding cover 30 and a frame plate 102. Specifically, the sub-circuit board 106 refers to the first radio frequency board 20, and the shielding cover 30 refers to the first shielding cover 31. The first shielding cover 31 is a shielding cover 30 that protects the electronic device 50 of the first radio frequency board 20 from the surface of the application processor board 10. The shielding cover 30 that protects the system-on-a-chip 51 is called the second shielding cover 32. The receiving space 70 enclosed by the stacked module 60 and the application processor board 10 includes the first receiving cavity 71 and the second receiving cavity 72. The space enclosed by the application processor board 10, the first radio frequency board 20 and the frame plate 102 is the first receiving cavity 71, and the space enclosed by the first radio frequency board 20 and the first shielding cover 31 is called the second receiving cavity 72. The heat-conducting component 40 is located in the first receiving cavity 71, or a portion of the heat-conducting component 40 is located in the first receiving cavity 71, and another portion of the heat-conducting component 40 is located in the second receiving cavity 72. The portion of the heat-conducting component 40 located in the first receiving cavity 71 and the portion located in the second receiving cavity 72 can be two independent components, or they can be integrally formed into one component. The remaining blank areas in the first receiving cavity 71 and the second receiving cavity 72 can be filled with surface filler material.

[0135] The following details the specific implementation methods of several heat-conducting components 40.

[0136] First embodiment: Referring to FIG22, a heat-conducting component 40 is provided only within the first receiving cavity 71 formed by the first radio frequency board 20 and the application processor board 10.

[0137] One end of the heat-conducting component 40 is soldered and fixed to the application processor board 10 via pad 107. The other end of the heat-conducting component 40 is in contact with the first RF board 20 via thermally conductive material 80. When the system-on-chip 51 heats up, the heat conduction path is as follows: system-on-chip 51 - application processor board 10 - heat-conducting component 40 - first RF board 20. The detailed heat transfer process is as follows: system-on-chip 51 - pad 107, solder 108 and stencil 109 corresponding to system-on-chip 51 - conductive pillar 11 and circuit layer 12 of application processor board 10 - pad 107 corresponding to heat-conducting component 40 - thermally conductive material 80 - heat-conducting component 40 - first RF board 20. At this time, the thermally conductive material 80 can be placed in the second receiving cavity 72, and the thermally conductive material 80 contacts the ground RF board and the first shield 31 on opposite sides along the Z-axis. The thermally conductive material 80 can transfer the heat transferred by the heat-conducting component 40 to the first shield 31.

[0138] One end of the heat-conducting component 40 is located within the gap between multiple electronic devices 50 on the application processor board 10, and the other end of the heat-conducting component 40 is located within the gap between multiple electronic devices 50 on the first radio frequency board 20, without affecting the normal function of the first radio frequency board 20 and the application processor board 10. There can be one or more heat-conducting components 40; "multiple" here refers to two or more. When there is only one heat-conducting component 40, it can be placed at the location with the largest gap between the multiple electronic devices 50 to improve heat dissipation efficiency while minimizing the number of components and reducing the complexity of the circuit module 100. When there are multiple heat-conducting components 40, one heat-conducting component 40 can be placed between any two adjacent electronic devices 50 to increase heat dissipation efficiency.

[0139] Second embodiment: A portion of the heat-conducting component 40 is located in the first receiving cavity 71, and another portion of the heat-conducting component 40 is located in the second receiving cavity 72. The portion of the heat-conducting component 40 located in the first receiving cavity 71 and the portion located in the second receiving cavity 72 are two independent components. Several specific embodiments are described in detail below.

[0140] First specific implementation method

[0141] Referring to Figure 23, which illustrates a first specific embodiment of the circuit module 100 provided in this application, the heat-conducting component 40 is a split type. The heat-conducting component 40 includes a first heat-conducting element 41 and a second heat-conducting element 42, which are separately formed. The first heat-conducting element 41 is disposed within the first receiving cavity 71. One end of the first heat-conducting element 41 is soldered to the pad 107 of the application processor board 10, and the other end of the first heat-conducting element 41 contacts the first radio frequency board 20 through the heat-conducting material 80. Alternatively, one end of the first heat-conducting element 41 contacts the application processor board 10 through the heat-conducting material 80, and the other end of the first heat-conducting element 41 is soldered to the first radio frequency board 20. Along the thickness direction of the circuit module 100, the orthographic projections of the first heat-conducting element 41 and the second heat-conducting element 42 at least partially overlap on the first radio frequency board 20.

[0142] The second heat-conducting element 42 is disposed on the side of the first RF board 20 opposite to the application processor board 10, and is located inside the first shielding cover 31. The second heat-conducting element 42 is located within the gaps of the electronic components 50 on the first RF board 20. One end of the second heat-conducting element 42 is soldered to the first RF board 20, and the other end of the second heat-conducting element 42 is in contact with the first shielding cover 31 through the thermally conductive material 80. Alternatively, one end of the second heat-conducting element 42 is in contact with the first RF board 20 through the thermally conductive material 80, and the other end of the second heat-conducting element 42 is soldered to the first shielding cover 31.

[0143] When the system-on-a-chip 51 generates heat, the heat conduction path is as follows: system-on-a-chip 51 - application processor board 10 - first heat-conducting component 41 - first radio frequency board 20 - second heat-conducting component 42 - first shielding cover 31.

[0144] The first heat-conducting element 41 and the second heat-conducting element 42 may have the same or different shapes and outer diameters. Those skilled in the art can select the shape and outer diameter of the first heat-conducting element 41 and the second heat-conducting element 42 based on the gaps between adjacent electronic devices 50. The orthographic projection of the first heat-conducting element 41 onto the first RF plate 20 and the orthographic projection of the second heat-conducting element 42 onto the first RF plate 20 at least partially overlap to improve heat transfer efficiency. The shape and size of the gaps between the multiple electronic devices 50 within the first receiving cavity 71 and the second receiving cavity 72 may be different. The first receiving cavity 71 and the second receiving cavity 72 are respectively provided with the first heat-conducting element 41 and the second heat-conducting element 42. The shape and size of the first heat-conducting element 41 can be set according to the gaps and shapes between the electronic devices 50 within the first receiving cavity 71, and the shape and size of the second heat-conducting element 42 can be set according to the shape and size of the gaps between the electronic devices 50 within the second receiving cavity 72. This allows for the provision of a larger heat-conducting component 40 within a limited space, thereby improving heat dissipation efficiency.

[0145] Referring to Figure 24, which is a schematic diagram of the circuit module 100 provided in the first embodiment of this application, both the heat-conducting component 40 and the first shielding cover 31 are provided with protrusions. One end of the second heat-conducting component 42 is soldered to the first radio frequency board 20. When the other end of the second heat-conducting component 42 contacts the first shielding cover 31 through the heat-conducting material 80, multiple spaced first protrusions 43 can be provided on the end of the second heat-conducting component 42 facing the first shielding cover 31, and the gap between any two adjacent first protrusions 43 forms a first recess. The first shielding cover 31 can be provided with multiple spaced second protrusions 33, and the gap between any two adjacent second protrusions 33 forms a second recess. Specifically, the second protrusions 33 are formed by the outer surface of the first shielding cover 31 being recessed in the direction of the inner surface. This can reduce the weight of the first shielding cover 31, thereby helping to reduce the weight of the entire electronic device 1000. Of course, the outer surface of the first shielding cover 31 may not be recessed, and the second protrusions 33 may be directly protruded from the inner surface of the first shielding cover 31 to make the structural strength of the first shielding cover 31 stronger.

[0146] When the second heat-conducting component 42 contacts the first shielding cover 31 through the heat-conducting material 80, the first protrusion 43 extends into the second recess, and the second protrusion 33 extends into the first recess. There is a gap between the inner wall surfaces of the first protrusion 43 and the second recess, and a gap between the second protrusion 33 and the inner wall surface of the first recess. Both the first protrusion 43 and the second protrusion 33 are wrapped by the heat-conducting material 80. The gap between the second recess and the first protrusion 43 is filled with the heat-conducting material 80, and the gap between the second protrusion 33 and the first recess is also filled with the heat-conducting material 80. Alternatively, referring to Figure 25, which is a schematic diagram of the structure of the heat-conducting component 40 of the circuit module 100 provided in the first embodiment of this application with protrusions, only the second heat-conducting component 42 has the first protrusion 43 and the first recess; or, referring to Figure 26, which is a schematic diagram of the structure of the first shielding cover 31 of the circuit module 100 provided in the first embodiment of this application with protrusions, only the first shielding cover 31 has the second protrusion 33 and the second recess. By providing the second protrusion 33 and / or the first protrusion 43, the contact area between the heat-conducting component 40 and the heat-conducting material 80 can be increased, thereby increasing the heat conduction efficiency. The first protrusion 43 extends into the second recess, and the second protrusion 33 extends into the first recess, which can increase the structural compactness of the circuit module 100 and make the first heat-conducting component 41 and the second heat-conducting component 42 as close as possible to increase the heat conduction efficiency.

[0147] Second specific implementation method

[0148] Referring to Figure 27, Figure 27 shows a second specific embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is a separate type. The difference from the first specific embodiment is that the first radio frequency board 20 is provided with a mounting hole 24, which penetrates two surfaces of the first radio frequency board 20 opposite in thickness, connecting the first receiving cavity 71 and the second receiving cavity 72. One end of the first heat-conducting component 41 is soldered to the pad 107 of the application processor board 10, and one end of the second heat-conducting component 42 is soldered to the first shielding cover 31. The other ends of the first heat-conducting component 41 and the second heat-conducting component 42 are respectively provided with multiple first protrusions 43, and a first recess is formed between any two adjacent first protrusions 43. The first protrusions 43 of the first heat-conducting component 41 and the first protrusions 43 of the second heat-conducting component 42 both extend into the mounting hole 24, which is filled with a thermally conductive material 80. The thermally conductive material 80 wraps around the first protrusions 43 and fills the first recess.

[0149] When the system-on-a-chip 51 generates heat, the heat conduction path is as follows: system-on-a-chip 51 - application processor board 10 - first heat-conducting component 41 - first radio frequency board 20, second heat-conducting component 42 - first shielding cover 31.

[0150] By setting the first protrusion 43, the contact area between the first heat-conducting element 41 and the second heat-conducting element 42 and the heat-conducting material 80 is increased, thereby improving the heat dissipation efficiency.

[0151] Third specific implementation method

[0152] Referring to Figure 28, Figure 28 illustrates a third specific embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is a separate component. The difference from the first specific embodiment is that the first heat-conducting component 41 includes a first sub-heat-conducting component 44 and a second sub-heat-conducting component 45. Both the first sub-heat-conducting component 44 and the second sub-heat-conducting component 45 are disposed within the first receiving cavity 71. The first sub-heat-conducting component 44 and the second sub-heat-conducting component 45 are arranged along a preset direction, which is perpendicular to the thickness direction of the circuit module 100.

[0153] A portion of one end of the first sub-heat conductor 44 is spaced apart from the electronic components 50 on the application processor board 10 along the Z-axis, and the other portion of one end of the first sub-heat conductor 44 is in contact with the application processor board 10 through the thermally conductive material 80. The other end of the first sub-heat conductor 44 is soldered to the first radio frequency board 20, and the other end of the first sub-heat conductor 44 is located in the gap between the electronic components 50 on the first radio frequency board 20. Alternatively, one end of the first sub-heat conductor 44 is in contact with the main circuit board 105 through the thermally conductive material 80, and the end of the first sub-heat conductor 44 away from the main circuit board 105 is fixed to the sub-circuit board 106.

[0154] One end of the second sub-heat conductor 45 is located within the gap between multiple electronic components 50 on the application processor board 10, and one end of the second sub-heat conductor 45 is soldered to the application processor board 10. The other end of the second sub-heat conductor 45 is located within the gap between electronic components 50 on the first radio frequency board 20, and the other end of the second sub-heat conductor 45 is in contact with the first radio frequency board 20 through the thermally conductive material 80. Alternatively, one end of the second sub-heat conductor 45 is in contact with the application processor board 10 through the thermally conductive material 80, and the other end of the second sub-heat conductor 45 is soldered and fixed to the first radio frequency board 20.

[0155] The position and connection relationship of the second heat-conducting element 42 are the same as those in the first specific embodiment, and will not be repeated here. The orthographic projection of the second heat-conducting element 42 on the first radio frequency board 20 covers part or all of the orthographic projection of the first sub-heat-conducting element 44 on the first radio frequency board 20, and the orthographic projection of the second heat-conducting element 42 on the first radio frequency board 20 covers part or all of the orthographic projection of the second sub-heat-conducting element 45 on the first radio frequency board 20.

[0156] The first sub-heat conductor 44 and the second sub-heat conductor 45 may have the same shape, outer diameter, and height, or they may be different. The sum of the outer diameters of the first sub-heat conductor 44 and the second sub-heat conductor 45 is approximately equal to the outer diameter of the second heat conductor 42, so that both the first sub-heat conductor 44 and the second sub-heat conductor 45 can be opposite the second heat conductor 42 along the Z-axis.

[0157] When the system-on-a-chip 51 generates heat, the heat conduction path is as follows: system-on-a-chip 51 - application processor board 10 - first sub-heat conductor 44, second sub-heat conductor 45 - first radio frequency board 20 - second heat conductor 42 - first shielding cover 31.

[0158] In this embodiment, by making reasonable use of the gaps between multiple electronic devices 50 and setting multiple heat-conducting components, the heat dissipation efficiency can be improved. The first heat-conducting component 41 is divided into a first sub-heat-conducting component 44 and a second sub-heat-conducting component 45. The first sub-heat-conducting component 44 and the second sub-heat-conducting component 45 can be shaped and sized according to the gaps between the electronic devices 50 they are located in, so as to make better use of the gaps between the electronic devices 50 in the first receiving cavity 71, increase the volume of the first heat-conducting component 41, and improve the heat dissipation efficiency.

[0159] The first sub-heat conductor 44, the second sub-heat conductor 45, and the second heat conductor 42 can all be cubic in shape. The side length of the first sub-heat conductor 44 is between 2mm and 30mm, for example, the side length of the first sub-heat conductor 44 can be 2mm, 5mm, 8mm, 15mm, 18mm, 22mm, 25mm, 27mm, or 30mm, etc. The side length of the second sub-heat conductor 45 is between 2mm and 15mm, for example, the side length of the second sub-heat conductor 45 can be 2mm, 5mm, 7mm, 9mm, 10mm, 11mm, 12mm, 13mm, or 15mm. The side length of the second heat conductor 42 can be between 5mm and 40mm, for example, the side length of the second heat conductor 42 can be 2mm, 6mm, 10mm, 14mm, 18mm, 23mm, 28mm, 32mm, 35mm, 37mm, or 40mm, etc. Since solder pads 107 and solder 108 are required when welding the heat-conducting component 40, the height of the first sub-heat-conducting component 44, the second sub-heat-conducting component 45, and the second heat-conducting component 42 should be selected with reference to the height of the welding position. The height of the welding position is generally between 0.02mm and 0.2mm.

[0160] Fourth specific implementation method

[0161] Referring to Figure 29, Figure 29 illustrates a fourth specific embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is a separate component. The difference from the third specific embodiment described above is that, along the direction from the application processor board 10 to the first radio frequency board 20, the first sub-heat-conducting component 44 and the second sub-heat-conducting component 45 are stacked, with one end of the first sub-heat-conducting component 44 contacting the second sub-heat-conducting component 45 via the heat-conducting material 80. The other end of the first sub-heat-conducting component 44 is soldered to the pad 107 of the application processor board 10, and the other end of the second sub-heat-conducting component 45 is soldered to the pad 107 of the first radio frequency board 20. The position and connection method of the second heat-conducting component 42 are the same as in the second embodiment and will not be described again.

[0162] When the system-on-a-chip 51 generates heat, the heat conduction path is as follows: system-on-a-chip 51 - application processor board 10 - first sub-heat conductor 44 - second sub-heat conductor 45 - first radio frequency board 20 - second heat conductor 42.

[0163] The shape and outer diameter of the first sub-heat conductor 44 can be set according to the shape and size of the gap between the electronic components 50 on the main circuit board 105, while the shape and outer diameter of the second sub-heat conductor 45 can be designed according to the shape and size of the gap between the electronic components 50 on the sub-circuit board 106. This allows the volume of the first sub-heat conductor 44 and the second sub-heat conductor 45 to be as large as possible within a limited space, thereby increasing heat dissipation efficiency.

[0164] Third embodiment: A portion of the heat-conducting component 40 is located in the first receiving cavity 71, and another portion of the heat-conducting component 40 is located in the second receiving cavity 72. The portion of the heat-conducting component 40 located in the first receiving cavity 71 and the portion located in the second receiving cavity 72 are integrally formed into a single component to reduce the number of parts. Several specific embodiments are described in detail below.

[0165] First specific implementation method

[0166] Referring to Figure 30, Figure 30 illustrates a first embodiment of the circuit module 100 provided in this application, where the heat-conducting component 40 is an integral unit. The first radio frequency board 20 has mounting holes 24 that penetrate both opposite surfaces along its thickness direction. A heat-conducting layer 25 is provided on the wall of the mounting holes 24. The heat-conducting layer 25 can be made of at least one metal with high thermal conductivity, such as copper, aluminum, steel, or silver; alternatively, it can be made of a non-metal with high thermal conductivity, such as ceramic or graphite. A portion of the heat-conducting component 40 is located between the application processor board 10 and the first radio frequency board 20, while another portion passes through the mounting holes 24 and extends into the first shielding cover 31. The portion of the heat-conducting component 40 passing through the mounting holes 24 can contact the heat-conducting layer 25, allowing heat to be transferred to the first radio frequency board 20 via the heat-conducting layer 25. One end of the heat-conducting component 40 is soldered to the application processor board 10, and the other end contacts the inner surface of the first shielding cover 31 through a heat-conducting material 80. Alternatively, one end of the heat-conducting component 40 contacts the application processor board 10 through the heat-conducting material 80, and the other end of the heat-conducting component 40 is welded to the first shield 31.

[0167] Second specific implementation method

[0168] Referring to Figure 31, Figure 31 illustrates a second embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is an integral unit. The difference from the first embodiment is that an elastic element 46 is fitted onto the outer peripheral surface of the heat-conducting component 40. The elastic element 46 is located within the mounting hole 24; that is, the elastic element 46 is positioned between the outer peripheral surface of the heat-conducting component 40 and the inner wall surface of the mounting hole 24. Under the pressure of the heat-conducting layer 25 and the heat-conducting component 40 within the mounting hole 24, the elastic element 46 deforms, and it abuts against the heat-conducting layer 25. This increases the stability of the heat-conducting component 40 and allows heat to be transferred through the elastic element 46 to the heat-conducting layer 25, and then from the heat-conducting layer 25 to the circuit layer 12 of the first radio frequency board 20 and the conductive pillars 11 within the vias.

[0169] For example, referring to FIG32, FIG32 is a schematic diagram of the state changes of the elastic element 46 shown in FIG31. The elastic element 46 and the heat-conducting component 40 are integrally formed. When the elastic element 46 and the heat-conducting component 40 are integrally formed, the elastic element 46 can be an annular spring sheet, with its two sides fixedly connected to the heat-conducting component 40 respectively, and the middle part of the spring sheet bent away from the outer peripheral surface of the heat-conducting component 40, with a gap between the middle part of the spring sheet and the heat-conducting component 40. When the heat-conducting component 40 passes through the mounting hole 24, the elastic element 46 extends into the mounting hole 24 along with the heat-conducting component 40. In its natural state, the distance from the outer periphery of the elastic element 46 to the central axis of the heat-conducting component 40 along the Z-axis is A1, and the gap between the middle part of the elastic element 46 and the heat-conducting component 40 is relatively large. When the elastic element 46 deforms and comes into contact with the heat-conducting layer 25, the distance from the outer periphery of the elastic element 46 to the central axis of the heat-conducting component 40 along the Z-axis is B1, and the gap between the middle part of the elastic element 46 and the heat-conducting component 40 decreases. Where A1 is greater than B1, A1 is 30%-80% of the radius of the mounting hole 24, and B1 is 10%-50% of the radius of the mounting hole 24.

[0170] Referring, as exemplarily to Figures 33 and 34, Figure 33 shows another structural form of the elastic element 46 of the circuit module 100 provided in the first embodiment of this application, and Figure 34 is a schematic diagram of the assembled state of the elastic element 46 shown in Figure 33. The elastic element 46 and the heat-conducting component 40 are formed separately. When the elastic element 46 and the heat-conducting component 40 are formed separately, the elastic element 46 can be a crown spring. The elastic element 46 includes two connecting portions 461 and a plurality of deformable portions 462. The connecting portions 461 are all annular, and the deformable portions 462 are arc-shaped. The plurality of deformable portions 462 are disposed between the two connecting portions 461. The plurality of deformable portions 462 are evenly and spaced apart radially around the connecting portions 461, and the two ends of the deformable portions 462 are respectively fixed to the two connecting portions 461. The deformable portions 462 are bent towards the axial centerline of the connecting portions 461.

[0171] When installing the heat-conducting component 40, the elastic element 46 can be placed inside the mounting hole 24 first, and then the heat-conducting component 40 can be passed through the mounting hole 24. When the heat-conducting component 40 passes through the mounting hole 24, it will extend into the elastic element 46, causing the deformation portion 462 of the elastic element 46 to deform. The deformation portion 462 of the elastic element 46 abuts against the outer peripheral surface of the heat-conducting component 40 and the heat-conducting layer 25. Table 1 below shows the parameters of the elastic element 46 when the elastic element 46 and the heat-conducting component 40 are separately molded. Those skilled in the art can select a suitable elastic element 46 according to actual needs. As can be seen from Table 1, when the outer diameter of the heat-conducting component 40 is 0.8mm, the outer diameter of the elastic element 46 can be 1.3mm or 1.35mm, the inner diameter of the elastic element 46 can be 0.8mm or 0.5mm, the height of the elastic element 46 can be 3mm, and the wall thickness of the elastic element 46 can be 0.1mm.

[0172] Table 1

[0173] When the system-on-a-chip 51 generates heat, the heat transfer path is as follows: system-on-a-chip 51 - application processor board 10 - heat-conducting component 40 - elastic component 46, first shielding cover 31 - first radio frequency board 20.

[0174] In this embodiment, the heat-conducting component 40 is snapped onto the first radio frequency board 20 by the elastic element 46, which increases the stability of the heat-conducting component 40. In addition, the heat from the system-on-a-chip 51 can also be conducted to the first radio frequency board 20 through the elastic element 46, increasing the heat dissipation efficiency.

[0175] Third specific implementation method

[0176] Referring to Figure 35, Figure 35 illustrates a third specific embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is an integral unit. The outer peripheral surface of the heat-conducting component 40 has a first extension 47, which protrudes from the outer peripheral surface of the heat-conducting component 40. The first extension 47 can surround the outer peripheral surface of the heat-conducting component 40, or it can be formed by multiple protrusions spaced apart circumferentially along the heat-conducting component 40. The first radio frequency board 20 has mounting holes 24 that penetrate the two opposing surfaces of the first radio frequency board 20 along its thickness direction. A portion of the heat-conducting component 40 is located between the application processor board 10 and the first radio frequency board 20, while another portion of the heat-conducting component 40 passes through the mounting holes 24 and extends into the first shielding cover 31. One end of the heat-conducting component 40 contacts the application processor board 10 through a thermally conductive material 80, and the other end of the heat-conducting component 40 contacts the first shielding cover 31 through the thermally conductive material 80. Along the Z-axis, the first extension 47 and the first radio frequency board 20 are stacked, and the first extension 47 is soldered to the pad 107 of the first radio frequency board 20.

[0177] Referring to Figure 35, the first extension 47 is located within the second receiving cavity 72, and the first extension 47 is soldered to the pad 107 on the surface of the first RF board 20 facing the application processor board 10. Referring to Figure 36, Figure 36 is a schematic diagram of the structure in which the first extension 47 of the heat-conducting component 40 shown in Figure 35 is fixed to the side of the sub-circuit board 106 facing the main circuit board 105. The first extension 47 may also be located within the first receiving cavity 71, and the first extension 47 is soldered to the pad 107 on the surface of the first RF board 20 facing away from the application processor board 10.

[0178] When the system-on-a-chip 51 generates heat, the heat transfer path is as follows: system-on-a-chip 51 - application processor board 10 - heat-conducting component 40 - first extension 47, first shielding cover 31 - first radio frequency board 20.

[0179] In this embodiment, the portion of the heat-conducting component 40 located in the first receiving cavity 71 and the second receiving cavity 72 is integrally formed, resulting in a longer dimension of the heat-conducting component 40 along the Z-axis direction. By providing the first extension 47 and welding the middle portion of the heat-conducting component 40 to the first radio frequency board 20 through the first extension 47, the reliability of fixing the heat-conducting component 40 is increased, and the first extension 47 can also be used to transfer heat, thereby increasing the heat dissipation efficiency.

[0180] Fourth specific implementation method

[0181] Referring to Figure 37, Figure 37 illustrates a fourth embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is an integral unit. The difference between this fourth embodiment and the second embodiment described above is that the outer peripheral surface of the heat-conducting component 40 is provided with a first extension 47 and a second extension 48. The structure, position, and connection method of the first extension 47 are the same as in the second embodiment. The second extension 48 may surround the circumference of the heat-conducting component 40, or the second extension 48 may include a plurality of protrusions spaced apart along the circumference of the heat-conducting component 40.

[0182] When the system-on-a-chip 51 generates heat, the heat transfer path is as follows: System-on-a-chip 51 - Application processor board 10 - Thermal conductive component 40 - First extension 47, second extension 48, first shielding cover 31 - First radio frequency board 20.

[0183] The second extension 48 is located between the electronic components 50 of the application processor board 10 and the electronic components 50 of the first radio frequency board 20. This increases the volume of the heat-conducting component 40, thereby improving heat dissipation efficiency.

[0184] Fifth specific implementation method

[0185] Referring to Figures 38 and 39, Figure 38 shows a fifth specific embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is an integral part, and Figure 39 is a structural schematic diagram of the heat-conducting component 40 shown in Figure 38 from another perspective. A first extension 47 is fixedly provided on the outer peripheral surface of the heat-conducting component 40. The first extension 47 can surround the circumference of the heat-conducting component 40 and can be rectangular, circular, elliptical, etc. The first extension 47 protrudes relative to the outer peripheral surface of the heat-conducting component 40, and its outer surface can be convex arc-shaped. The first radio frequency board 20 is provided with a mounting hole 24, which penetrates the two opposing surfaces of the first radio frequency board 20 along its thickness direction. A heat-conducting layer 25 is provided on the wall surface of the mounting hole 24, and the shape of the mounting hole 24 is the same as the shape of the first extension 47. A portion of the heat-conducting component 40 is located between the application processor board 10 and the first radio frequency board 20, and another portion of the heat-conducting component 40 passes through the mounting hole 24 and extends into the first shielding cover 31. One end of the heat-conducting component 40 is soldered and fixed to the pad 107 of the application processor board 10, and the other end of the heat-conducting component 40 contacts the first shielding cover 31 through the heat-conducting material 80. Alternatively, referring to FIG40, FIG40 is a schematic diagram of another structure of a fifth specific embodiment of the circuit module provided in the first embodiment of this application, in which the heat-conducting component is integrated. One end of the heat-conducting component 40 contacts the application processor board 10 through the heat-conducting material 80, and the other end of the heat-conducting component 40 is soldered and fixed to the first shielding cover 31. The first extension 47 extends into the mounting hole 24, and the first extension 47 contacts the heat-conducting layer 25.

[0186] When the system-on-a-chip 51 generates heat, the heat transfer path is as follows: system-on-a-chip 51 - application processor board 10 - heat-conducting component 40 - first extension 47, first shielding cover 31 - first radio frequency board 20.

[0187] By providing the first extension 47, the heat dissipated by the system-on-a-chip 51 can be transferred to the first radio frequency board 20, thereby increasing the heat dissipation efficiency.

[0188] Sixth specific implementation method

[0189] Referring to Figures 41 and 42, Figure 41 illustrates a sixth specific embodiment of the circuit module 100 provided in the first embodiment of this application, where the heat-conducting component 40 is an integral unit. Figure 42 is a partial structural schematic diagram of Figure 41. The heat-conducting component 40 includes a first heat-conducting element 41, a second heat-conducting element 42, and a third heat-conducting element 49. Along the Z-axis direction, the second heat-conducting element 42, the first heat-conducting element 41, and the third heat-conducting element 49 are stacked and fixed sequentially. Each of the first heat-conducting element 41, the second heat-conducting element 42, and the third heat-conducting element 49 can be cylindrical, with their outer diameters increasing sequentially. A portion of the first heat-conducting element 41 is located within the first receiving cavity 71, and another portion of the first heat-conducting element 41 extends through the mounting hole 24 into the second receiving cavity 72. The second heat-conducting element 42 is located within the first receiving cavity 71, and the third heat-conducting element 49 is located within the second receiving cavity 72. The end of the second heat-conducting element 42 away from the first heat-conducting element 41 is in contact with the application processor board 10 through the thermally conductive material 80, and the end of the third heat-conducting element 49 away from the first heat-conducting element 41 is soldered to the first radio frequency board 20. Alternatively, the end of the second heat-conducting element 42 away from the first heat-conducting element 41 is soldered to the pad 107 of the application processor board 10, and the end of the third heat-conducting element 49 away from the first heat-conducting element 41 is in contact with the first radio frequency board 20 through the thermally conductive material 80. The inner diameter of the mounting hole 24 is A, the outer diameter of the second heat-conducting element 42 is B, and the outer diameter of the third heat-conducting element 49 is C. The following relationship exists between A, B, and C: C-0.1mm > B > A+0.1mm.

[0190] Therefore, the shape and outer diameter of the first heat-conducting element 41 can be set according to the shape and size of the gap between the electronic devices 50 on the surface of the sub-circuit board 106 facing the main circuit board 105, while the shape and outer diameter of the second heat-conducting element 42 can be designed according to the shape and size of the gap between the electronic devices 50 on the main circuit board 105, and the shape and outer diameter of the third heat-conducting element 49 can be designed according to the shape and size of the gap between the electronic devices 50 on the surface of the sub-circuit board 106 away from the main circuit board 105. This allows the volume of the first heat-conducting element 41, the second heat-conducting element 42, and the third heat-conducting element 49 to be as large as possible within a limited space, thereby increasing heat dissipation efficiency.

[0191] In the second embodiment, referring to FIG43, FIG43 is a partial structural schematic diagram of the circuit module 100 of the candybar mobile phone provided in the second embodiment of the present application. The surface of the application processor board 10 facing away from the system-on-a-chip (SoC) may not have other circuit boards 101 stacked on it, but instead has electronic components 50 and a shielding cover 30 protecting the electronic components 50. For ease of description, the shielding cover 30 on the side of the application processor facing away from the SoC is called the first shielding cover 31, and the shielding cover 30 protecting the SoC 51 and other electronic components 50 such as the low-power double data rate memory 52 is called the second shielding cover 32. The first shielding cover 31 is the stacked module 60 stacked on the application processor board 10 facing away from the SoC 51. The application processor board 10 and the stacked module 60 enclose a receiving space 70, that is, the application processor board and the first shielding cover 31 enclose a receiving space 70.

[0192] In this embodiment, the heat-conducting component 40 is disposed within the receiving space 70. One end of the heat-conducting component 40 is soldered to the pad 107 of the application processor board 10, and the other end of the heat-conducting component 40 contacts the inner surface of the first shield 31 through the heat-conducting material 80. Alternatively, one end of the heat-conducting component 40 is soldered to the inner surface of the first shield 31, and the other end of the heat-conducting component 40 contacts the application processor board 10 through the heat-conducting material 80. That is, one end of the heat-conducting component 40 is fixed, and the other end of the heat-conducting component 40 is in a free state. This prevents the heat-conducting component 40 from shaking and avoids the heat-conducting component 40 pressing against the circuit board 101, causing the circuit board 101 to deform.

[0193] Of course, in this embodiment, the application processor board 10 is also provided with a circuit layer 12, vias, conductive pillars 11, pads 107, and solder mask layer 13, etc. The structure and function of the circuit layer 12, vias, conductive pillars 11, pads 107, and solder mask layer 13 are similar to those in the above embodiments, and will not be described again. The following example illustrates several implementations where the heat-conducting component 40 is disposed within the first receiving cavity 71, with one end soldered to the application processor board 10 and the other end in contact with the first shielding cover 31 via the heat-conducting material 80.

[0194] First Implementation Method

[0195] Referring to Figure 44, which is a schematic diagram of the circuit module 100 provided in the second embodiment of this application, both the heat-conducting component 40 and the first shielding cover 31 are provided with protrusions. One end of the heat-conducting component 40 is provided with a plurality of first protrusions 43, and the shape of the first protrusions 43 and the shape of the second protrusions 33 may be the same. A first recess is provided between any two adjacent first protrusions 43.

[0196] The application processor board 10 has pads 107 on its surface away from the system-on-a-chip 51. The first shielding cover 31 has multiple second protrusions 33, and a second recess is provided between any two adjacent second protrusions 33. Referring to Figures 45, 46, 47, and 48, Figure 45 is a schematic diagram of the protrusion of the heat-conducting component 40 provided in the second embodiment of this application being annular; Figure 46 is a schematic diagram of the protrusion of the heat-conducting component 40 provided in the second embodiment of this application being cubic; Figure 47 is a schematic diagram of the protrusion of the heat-conducting component 40 provided in the second embodiment of this application being cuboid; and Figure 48 is a schematic diagram of the protrusion of the heat-conducting component 40 provided in the second embodiment of this application being square annular. The second protrusions 33 can be annular, cubic, cuboid, cuboid strip, or square annular. The cross-section of the second protrusion 33 can be trapezoidal. Specifically, the second protrusions 33 are formed by the outer surface of the first shielding cover 31 being recessed towards the inner surface. This reduces the weight of the first shielding cover 31, thereby helping to reduce the weight of the entire electronic device 1000. Of course, the outer surface of the first shielding cover 31 does not have to be recessed, and the second protrusion 33 can be directly protruded from the inner surface of the first shielding cover 31 to make the structural strength of the first shielding cover 31 stronger.

[0197] When the heat-conducting component 40 is disposed on the surface of the application processor board 10 away from the system-on-a-chip 51 and located within the first receiving cavity 71, the first protrusion 43 of the heat-conducting component 40 extends into the second recess of the first shield 31, and the second protrusion 33 of the first shield 31 extends into the first recess of the heat-conducting component 40. Furthermore, the gap between the second recess and the first protrusion 43 is filled with thermally conductive material 80, and the gap between the second protrusion 33 and the first recess is also filled with thermally conductive material 80. The end of the heat-conducting component 40 away from the first protrusion 43 is soldered and fixed to the pad 107 of the application processor board 10 by solder 108.

[0198] By providing a second protrusion 33 and a second recess on the first shielding cover 31, and a first protrusion 43 and a first recess on the heat-conducting component 40, the contact area between the first shielding cover 31 and the heat-conducting component 40 is increased, thereby improving the heat conduction efficiency and heat dissipation effect.

[0199] Second Implementation Method

[0200] Referring to Figure 49, which is a schematic diagram of the structure of the heat-conducting component 40 of the circuit module 100 provided in the second embodiment of this application, the difference from the first embodiment is that the heat-conducting component 40 does not have a first protrusion 43. The first shielding cover 31 has a plurality of second protrusions 33, and a second recess is provided between any two adjacent second protrusions 33. One end of the heat-conducting component 40 is soldered to the pad 107 of the application processor board 10 by solder 108, and the other end of the heat-conducting component 40 is opposite to the second protrusion 33 and the second recess of the first shielding cover 31. The heat-conducting material 80 is filled between the heat-conducting component 40 and the inner surface of the first shielding cover 31, and the heat-conducting material 80 covers the second protrusion 33 and fills the second recess.

[0201] Figure 49 illustrates the structures of the thermally conductive material 80 as a phase change material, liquid metal, and thermally conductive gel. When the thermally conductive material 80 is liquid metal, a receiving frame 90 is required to contain the liquid metal, and the structure of the receiving frame 90 is as described in the above embodiment.

[0202] Third Implementation Method

[0203] Referring to Figure 50, which is a schematic diagram of the first shielding cover 31 of the circuit module 100 provided in the second embodiment of this application, the first shielding cover 31 is provided with a protrusion. The difference from the first embodiment described above is that the first shielding cover 31 does not have a second protrusion 33. One end of the heat-conducting component 40 is provided with a plurality of first protrusions 43, and a first recess is provided between any two adjacent first protrusions 43. One end of the heat-conducting component 40 is soldered to the application processor board 10. The first protrusions 43 and the first recesses of the heat-conducting component 40 are opposite to the inner surface of the first shielding cover 31. Thermally conductive material 80 fills the space between the heat-conducting component 40 and the inner surface of the first shielding cover 31, covering the first protrusions 43 and filling the first recesses.

[0204] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit module, characterized in that, include: Main circuit board, heat-generating components, heat-conducting components, and stacked modules; The heating element is disposed on the surface of the main circuit board, and the stacking module is disposed on the surface of the main circuit board opposite to the heating element; The stacked module and the main circuit board form a receiving space, and the heat-conducting component is disposed in the receiving space. Along the thickness direction of the circuit module, the heat-generating component and the heat-conducting component at least partially overlap on the orthographic projection of the main circuit board. One end of the heat-conducting component is fixed to the main circuit board, and the other end of the heat-conducting component away from the main circuit board contacts the stacked module through a heat-conducting material; or, one end of the heat-conducting component contacts the main circuit board through a heat-conducting material, and the other end of the heat-conducting component away from the main circuit board is fixed to the stacked module. The thermally conductive material is flexible.

2. The circuit module according to claim 1, characterized in that, The accommodating space contains multiple electronic devices, which are fixed to the main circuit board or the stacked module, and the heat-conducting component is located in the gap between the multiple electronic devices.

3. The circuit module according to claim 1, characterized in that, The heat-generating component includes at least one of a system-on-a-chip, a charging chip, an RF chip, and a Bluetooth chip, and the main circuit board includes an application processor board.

4. The circuit module according to claim 1, characterized in that, The material of the heat-conducting component includes at least one of copper, aluminum, gold, zinc, silver, silicon carbide, ceramic, and graphite.

5. The circuit module according to claim 1, characterized in that, The thermal conductivity of the heat-conducting component is greater than 100 W / (m·K).

6. The circuit module according to claim 1, characterized in that, The thermally conductive material includes at least one of phase change materials, liquid metals, thermally conductive gels, and thermal interface materials.

7. The circuit module according to any one of claims 1 to 6, characterized in that, The stacked module includes a first shield, one end of the heat-conducting component is fixed to the main circuit board, and the other end of the heat-conducting component is in contact with the first shield through the heat-conducting material; The heat-conducting component has a plurality of spaced first protrusions at one end facing the first shield, and a first recess is formed between any two adjacent first protrusions. The heat-conducting material wraps around the first protrusions and fills the first recess. And / or, the first shield has a plurality of spaced second protrusions on one side facing the heat-conducting component, and a second recess is formed between any two adjacent second protrusions. The heat-conducting material wraps around the second protrusions and fills the second recess.

8. The circuit module according to claim 7, characterized in that, When the heat-conducting component is provided with the first protrusion and the first recess, and the first shielding cover is provided with the second protrusion and the second recess; the first protrusion extends into the second recess, and there is a gap between the inner wall surfaces of the first protrusion and the second recess; the second protrusion extends into the first recess, and there is a gap between the inner wall surfaces of the second protrusion and the first recess. The thermally conductive material wraps around the first protrusion and the second protrusion, and fills the gap between the first protrusion and the second recess, as well as the gap between the second protrusion and the first recess.

9. The circuit module according to any one of claims 1 to 6, characterized in that, The stacked module includes a first shielding cover, which is fixed to the surface of the main circuit board away from the heat-generating component; the accommodating space includes the space enclosed by the first shielding cover and the main circuit board.

10. The circuit module according to any one of claims 1 to 6, characterized in that, The stacked module includes a sub-circuit board, a frame board, and a first shielding cover. The frame board is fixed to the surface of the main circuit board away from the heat-generating component. The sub-circuit board is fixed to the side of the frame board away from the main circuit board. The first shielding cover is fixed to the side of the sub-circuit board away from the frame board. The main circuit board, the sub-circuit board, and the frame board form a first receiving cavity. The first shielding cover and the sub-circuit board form a second receiving cavity. The receiving space includes the first receiving cavity and the second receiving cavity. The heat-conducting component is located in the first receiving cavity, or a portion of the heat-conducting component is located in the first receiving cavity and another portion of the heat-conducting component is located in the second receiving cavity.

11. The circuit module according to claim 10, characterized in that, The heat-conducting component includes a first heat-conducting element and a second heat-conducting element; the first heat-conducting element is disposed in the first receiving cavity, one end of the first heat-conducting element is fixed to the main circuit board, and the end of the first heat-conducting element away from the main circuit board is in contact with the sub-circuit board through a heat-conducting material; or, one end of the first heat-conducting element is in contact with the main circuit board through a heat-conducting material, and the end of the first heat-conducting element away from the main circuit board is fixed to the sub-circuit board. The second heat-conducting element is disposed in the second receiving cavity. One end of the second heat-conducting element is fixed to the sub-circuit board, and the end of the second heat-conducting element away from the sub-circuit board is in contact with the first shielding cover through a heat-conducting material; or, one end of the second heat-conducting element is in contact with the sub-circuit board through a heat-conducting material, and the end of the second heat-conducting element away from the sub-circuit board is fixed to the first shielding cover. Along the thickness direction of the circuit module, the first thermal conductive element and the second thermal conductive element at least partially overlap in their orthographic projections on the sub-circuit board.

12. The circuit module according to claim 11, characterized in that, The sub-circuit board is provided with mounting holes, which connect the first receiving cavity and the second receiving cavity; At least one of the first heat-conducting component and the second heat-conducting component is provided with a plurality of first protrusions, and a first recess is formed between any two adjacent first protrusions; The first protrusion extends into the mounting hole; the thermally conductive material fills the mounting hole, wraps around the first protrusion, and fills the first recess.

13. The circuit module according to claim 11, characterized in that, The first heat-conducting component includes a first sub-heat-conducting component and a second sub-heat-conducting component; the first sub-heat-conducting component and the second sub-heat-conducting component are arranged along a preset direction, the preset direction being perpendicular to the thickness direction of the circuit module; One end of the first sub-heat conductor is fixed to the main circuit board, and the end of the first sub-heat conductor away from the main circuit board is in contact with the sub-circuit board through a thermally conductive material; or, one end of the first sub-heat conductor is in contact with the main circuit board through a thermally conductive material, and the end of the first sub-heat conductor away from the main circuit board is fixed to the sub-circuit board. A portion of the second sub-heat conductor is located between the main circuit board and the sub-circuit board, and another portion of the second sub-heat conductor is located between the electronic device on the main circuit board and the sub-circuit board; one end of the second sub-heat conductor is fixed to the main circuit board, and the end of the second sub-heat conductor away from the main circuit board is in contact with the sub-circuit board through a thermally conductive material; or, one end of the second sub-heat conductor is in contact with the main circuit board through a thermally conductive material, and the end of the second sub-heat conductor away from the main circuit board is fixed to the sub-circuit board.

14. The circuit module according to claim 11, characterized in that, The first thermal conductive component includes a first sub-thermal conductive component and a second sub-thermal conductive component; the first sub-thermal conductive component and the second sub-thermal conductive component are arranged along the thickness direction of the circuit module; one end of the first sub-thermal conductive component is fixed to the main circuit board, and one end of the second sub-thermal conductive component is fixed to the sub-circuit board; the end of the first sub-thermal conductive component away from the main circuit board is in contact with the end of the second sub-thermal conductive component away from the sub-circuit board through a thermally conductive material.

15. The circuit module according to claim 10, characterized in that, The sub-circuit board is provided with mounting holes, which connect the first receiving cavity and the second receiving cavity; a portion of the heat-conducting component is located in the first receiving cavity, and another portion of the heat-conducting component passes through the mounting holes and extends into the second receiving cavity.

16. The circuit module according to claim 15, characterized in that, An elastic element is provided between the outer peripheral surface of the heat-conducting component and the inner wall surface of the mounting hole, and the elastic element abuts against the outer peripheral surface of the heat-conducting component and the inner wall surface of the mounting hole.

17. The circuit module according to claim 16, characterized in that, The inner wall of the mounting hole is provided with a heat-conducting layer, and the elastic element abuts against the outer peripheral surface of the heat-conducting component and the heat-conducting layer.

18. The circuit module according to claim 15, characterized in that, The outer peripheral surface of the heat-conducting component is provided with a first extension, which is located in the first receiving cavity or the second receiving cavity, and the first extension is fixed to the sub-circuit board.

19. The circuit module according to claim 18, characterized in that, The outer peripheral surface of the heat-conducting component is also provided with a second extension, which is located in the first or second accommodating cavity, and the first and second extensions are spaced apart along the thickness direction of the circuit module.

20. The circuit module according to claim 15, characterized in that, The outer peripheral surface of the heat-conducting component is provided with a first extension, and the inner wall surface of the mounting hole is provided with a heat-conducting layer. The first extension is located inside the mounting hole and is in contact with the heat-conducting layer.

21. The circuit module according to claim 15, characterized in that, The heat-conducting component includes a first heat-conducting element, a second heat-conducting element, and a third heat-conducting element; along the thickness direction of the circuit module, the second heat-conducting element, the first heat-conducting element, and the third heat-conducting element are fixed in sequence; The second heat-conducting element is located in the first receiving cavity, the third heat-conducting element is located in the second receiving cavity, a portion of the first heat-conducting element is located in the first receiving cavity, and another portion of the first heat-conducting element passes through the mounting hole and extends into the second receiving cavity.

22. The circuit module according to any one of claims 1 to 6, characterized in that, The heating element is fixed to the main circuit board by soldering through pads; the main circuit board is provided with a solder resist layer, which is located around the pads and the height of the solder resist layer is greater than the height of the pads.

23. The circuit module according to any one of claims 1 to 6, characterized in that, The heat-generating component is a system-on-a-chip (SoC), and the circuit module also includes a low-power double data rate (DVR) memory. The DVR is fixed to the side of the SoC facing away from the main circuit board. The DVR partially obscures the SoC, and the portion of the SoC not obscured by the DVR is provided with thermally conductive adhesive.

24. An electronic device, characterized in that, include: The housing and the circuit module according to any one of claims 1 to 22, wherein the housing has an installation space and the circuit module is disposed within the installation space.

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