Method for adjusting performance of electronic device, corresponding apparatus, chip, and electronic device

Abstract

A method for adjusting the performance of an electronic device, a corresponding apparatus, a chip, and an electronic device. The method for adjusting the performance of the electronic device comprises: receiving a first temperature signal from a first sensor, wherein the first temperature signal represents an ambient temperature of an environment where the electronic device is located (202); receiving a second temperature signal from a second sensor, wherein the second temperature signal represents a shell temperature of the electronic device (204); and adjusting the performance of the electronic device on the basis of the first temperature signal and the second temperature signal (206). The method can comprehensively consider the sensed external factor and internal factor of the electronic device to dynamically adjust the performance of the electronic device, thereby ensuring performance while optimizing heat dissipation efficiency, and thus greatly improving the user experience.

Description

Methods for adjusting the performance of electronic devices and corresponding devices, chips and electronic equipment Technical Field

[0001] This application generally relates to the field of electronic devices, and more specifically, to methods for regulating the performance of electronic devices that can provide good performance and user experience, as well as corresponding devices, chips, and electronic devices. Background Technology

[0002] As the performance of terminal electronic devices such as smartphones, tablets, and smart wearables becomes increasingly powerful, the heat generated during use is also increasing. Temperature control of electronic devices has become a critical element in system-on-chip (SoC) and terminal design, as it is closely related to user experience. With the development of various programs on these devices and the increasing demands on hardware performance, various overheating issues are emerging. If the temperature of a terminal device is not effectively controlled, it can not only lead to problems such as device lag and a deterioration in user experience, but also potentially cause serious safety hazards due to excessive heat.

[0003] Existing terminal temperature control solutions are mainly passive management methods, which have drawbacks such as fixed strategies and incompatibility with hardware module performance. Therefore, there is an urgent need for an improved solution to regulate the performance of electronic devices, which can comprehensively consider the environment in which the electronic devices operate and the load on the devices, thereby dynamically adjusting the performance of the electronic devices to effectively control the rate of temperature change. Summary of the Invention

[0004] Embodiments of this application provide a method for adjusting the performance of an electronic device and corresponding apparatus, chip, electronic device and computer-readable storage medium, which are intended to at least partially overcome the above and / or other potential problems existing in the prior art.

[0005] In a first aspect of this application, a method for adjusting the performance of an electronic device is provided. The method includes: receiving a first temperature signal from a first sensor, the first temperature signal representing the ambient temperature of the environment in which the electronic device is located; receiving a second temperature signal from a second sensor, the second temperature signal representing the casing temperature of the electronic device; and adjusting the performance of the electronic device based on the first temperature signal and the second temperature signal.

[0006] According to embodiments of this application, it is possible to comprehensively consider both external factors and internal factors of the electronic device, and dynamically adjust the performance of the electronic device based on these factors, thereby ensuring performance while optimizing heat dissipation efficiency, thus greatly improving the user experience.

[0007] In one implementation, the case temperature of the electronic device is determined by: determining the heat transfer coefficient based on the ambient temperature using Newton's law of cooling; and determining the case temperature of the electronic device based on the heat transfer coefficient.

[0008] In one implementation, the heat transfer coefficient is a modified heat transfer coefficient, and determining the heat transfer coefficient includes: acquiring the load characteristics of the electronic device; and determining the modified heat transfer coefficient based on the load characteristics of the electronic device and the heat transfer coefficient.

[0009] In one implementation, the first sensor is located inside or outside the electronic device or on another electronic device independent of the electronic device.

[0010] In one implementation, the ambient temperature is a corrected ambient temperature, and the ambient temperature is determined by: acquiring an initial ambient temperature from the first sensor; determining fitting parameters based on the environment in which the electronic device is located; and acquiring the corrected ambient temperature based on the fitting parameters and the initial ambient temperature.

[0011] In one implementation, adjusting the performance of the electronic device includes: determining a characteristic parameter of the housing temperature of the electronic device based on the first temperature signal and the second temperature signal; adjusting the performance of the electronic device to a first performance level in response to the characteristic parameter of the housing temperature of the electronic device rising to a level greater than a first threshold; and adjusting the performance of the electronic device to a second performance level different from the first performance level in response to the characteristic parameter of the housing temperature of the electronic device continuing to rise to a second threshold higher than the first threshold.

[0012] In one implementation, adjusting the performance of the electronic device to a first performance includes at least one of the following: reducing the frequency of the chip of the electronic device to a first frequency; reducing the voltage of the chip of the electronic device to a first voltage; reducing the brightness of the screen of the electronic device to a first brightness; reducing the number of applications of the electronic device to a first number; and reducing the charging power consumption of the electronic device to a first power consumption.

[0013] In one implementation, adjusting the performance of the electronic device to a second performance includes at least one of the following: reducing the frequency of the chip of the electronic device to a second frequency lower than the first frequency; reducing the voltage of the chip of the electronic device to a second voltage lower than the first voltage; reducing the brightness of the screen of the electronic device to a second brightness lower than the first brightness; reducing the number of applications of the electronic device to a second number lower than the first number; and reducing the charging power consumption of the electronic device to a second power consumption lower than the first power consumption.

[0014] In one implementation, the characteristic parameter of the shell temperature includes at least one of the numerical value of the shell temperature and the rate of change of the shell temperature.

[0015] In a second aspect of this application, an apparatus for regulating the performance of an electronic device is provided. The apparatus includes components for performing the method according to the first aspect of this application.

[0016] In a third aspect of this application, a chip is provided. The chip includes at least one processor for performing the method according to the first aspect of this application.

[0017] In a fourth aspect of this application, an electronic device is provided. The electronic device includes at least one processor; and a memory coupled to the at least one processor and having instructions stored thereon, which, when executed by the at least one processor, cause the device to perform the method according to the first aspect of this application.

[0018] In a fifth aspect of this application, a computer-readable storage medium is provided. The computer-readable storage medium stores computer-executable instructions, which are executed by a processor to implement the method according to the first aspect of this application.

[0019] The above and other aspects of this application will become more apparent from the following description of several embodiments. Attached Figure Description

[0020] The above and other features, advantages and aspects of the embodiments of this application will become more apparent when taken in conjunction with the accompanying drawings and the following detailed description.

[0021] In the accompanying drawings, identical or similar labeling indicates identical or similar elements. The drawings are not necessarily drawn to scale, and:

[0022] Figure 1 illustrates a schematic usage environment according to an embodiment of this application;

[0023] Figure 2 illustrates a method for adjusting the performance of an electronic device according to an embodiment of this application; and

[0024] Figure 3 shows a block diagram of an apparatus capable of implementing several exemplary embodiments of the contents of this application. Detailed Implementation

[0025] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.

[0026] In the description of embodiments of this application, the term "comprising" and similar terms should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects. Other explicit and implicit definitions may also be included below.

[0027] As mentioned earlier, existing solutions for temperature control of terminal electronic devices have many shortcomings. For example, most existing solutions rely on passive management strategies, which are often fixed and difficult to adapt to changing usage scenarios and user needs. This lack of flexibility and simplistic approach limits system performance optimization and may lead to performance degradation or even device damage. Furthermore, existing solutions often do not match the hardware architecture with temperature control requirements. Developers need a deep understanding of the hardware architecture and can improve performance through code optimization and algorithm selection to ensure efficient software operation on specific hardware. This places high demands on developer experience. In short, existing solutions often fail to promptly control the temperature of electronic devices under high load conditions, potentially leading to overheating and shutdown. They also lack awareness of user experience and current load, resulting in a poor user experience.

[0028] To address the aforementioned issues, embodiments of this application provide an intelligent temperature control scheme that comprehensively considers ambient temperature and load. This scheme obtains accurate measurements of the ambient temperature based on an infrared measurement correction algorithm, further integrates multiple factors to establish a dynamic temperature prediction model, and finally adaptively adjusts a pre-set initial temperature control threshold based on the model. According to embodiments of this application, the overall load can be dynamically adjusted, effectively controlling the heating rate of electronic devices, thereby optimizing heat dissipation efficiency and energy efficiency ratio, achieving stable performance, comfortable user experience, and extended battery life. Furthermore, the solution according to embodiments of this application also has excellent temperature control performance and cost advantages.

[0029] The embodiments according to this application will now be described with reference to Figures 1 to 3. Referring first to Figure 1, an electronic device 10 according to an embodiment of this application is shown. In the embodiment shown in the figure, such an electronic device 10 can be a smartphone. Further details of the embodiments of this application will be described below using a smartphone as an example. It should be understood that this is merely illustrative. In other embodiments, the electronic device 10 can be other forms of terminal devices, such as smartwatches, tablets, etc. Those skilled in the art will envision that the embodiments according to this application can be applied to various forms of terminal devices. The electronic device 10 shown in the figure generates heat during normal operation. If this heat is not dissipated effectively and in a timely manner, it will affect the operating speed of the electronic device 10, thereby reducing the user experience. According to the embodiments of this application, dynamic temperature prediction can be achieved by comprehensively considering factors such as the case temperature, ambient temperature, operating current, and load of the electronic device 10, so as to provide a good performance control scheme for the electronic device 10.

[0030] Referring now to FIG2, a method 200 for adjusting the performance of an electronic device 10 according to an embodiment of the present application is illustrated. At block 202, method 200 includes: receiving a first temperature signal from a first sensor, wherein the first temperature signal characterizes the ambient temperature of the environment in which the electronic device 10 is located. In one feasible embodiment, the first sensor may be an infrared sensor built into the electronic device 10. An infrared sensor is a sensor that uses infrared light for data processing and can be used for non-contact temperature measurement.

[0031] According to embodiments of this application, in the operation mechanism of the infrared sensor of the electronic device 10, to optimize energy consumption and improve response efficiency, the infrared sensor thread automatically enters a low-power sleep state when there is no explicit temperature trigger request or monitoring requirement. This design not only helps extend the service life of the electronic device 10, but also allows for rapid wake-up when necessary, ensuring timely response to temperature changes. When a temperature measurement request is received, the control system of the electronic device 10 first performs an initialization process, which includes a comprehensive check and setup of the infrared sensor to ensure it is in optimal working condition. After initialization, the infrared sensor is woken up. Once successfully woken up, the infrared sensor immediately begins to directly measure the temperature of the surrounding environment. This direct measurement method is typically based on the relationship between the intensity of infrared radiation and the temperature of an object, namely the Stefan-Boltzmann law and Wien's displacement law. By analyzing the frequency and intensity of the received infrared radiation, the infrared sensor can accurately calculate the temperature of the environment in which the electronic device 10 is located, thereby providing the electronic device 10 with accurate ambient temperature data.

[0032] In a further embodiment, the ambient temperature can be corrected. For example, an initial ambient temperature can be obtained first from a first sensor. Then, based on the initial ambient temperature, a fitting parameter k is determined using the thermal balance algorithm Q = kmcΔT, where Q represents the heat transferred between the electronic device 10 and the external environment; m is the mass; c is the specific heat capacity; ΔT is the temperature change before and after heat transfer; and k is the parameter to be fitted. Subsequently, based on the fitted parameter k and the initial ambient temperature, a corrected ambient temperature is obtained. In this way, the measurement results are compensated and corrected by fitting and adjusting the parameter k value using actual temperature rise data, thereby enabling the handling of complex and changing actual external environmental conditions such as air flow and humidity changes. Therefore, the obtained ambient temperature can be closer to the actual temperature, ensuring the ultimate accuracy of the temperature data.

[0033] In other feasible embodiments, besides the built-in infrared sensor, the first sensor can also be a sensor located external to the electronic device 10. In a further embodiment, the first sensor can also be a temperature sensor located in the ecosystem to which the electronic device 10 is connected. For example, the first sensor can be a sensor connected to the electronic device 10 via Bluetooth or WiFi for sensing ambient temperature. Alternatively, the first sensor can also be a temperature sensor located on another electronic device independent of the electronic device 10. It is understood that this application does not place special requirements on the location and form of the first sensor, as long as it can sense the ambient temperature of the environment in which the electronic device 10 is located, and the sensed temperature can be received by the electronic device 10.

[0034] Referring back to Figure 2, as shown, in block 204, method 200 includes receiving a second temperature signal from a second sensor, the second temperature signal characterizing the case temperature of the electronic device 10. In one implementation, the case temperature of the electronic device is determined by: based on the ambient temperature, using Newton's law of cooling Q / Δt = hAΔT, determining the heat transfer coefficient, where Q represents the heat transferred between the electronic device 10 and the external environment; Δt represents the time elapsed; h represents the heat transfer coefficient; A represents the heat transfer area; and ΔT represents the temperature difference. In determining the heat transfer coefficient, the ambient temperature obtained by the first sensor is considered an external factor, while the case temperature obtained by the second sensor is considered an internal factor. By considering both the internal and external factors and combining Newton's law of cooling, the heat transfer coefficient h of the electronic device 10 and its surrounding environment can be obtained. In one implementation, the heat transfer coefficient is a modified heat transfer coefficient, and determining the heat transfer coefficient includes acquiring the load characteristics of the electronic device 10. For example, the load characteristics of the electronic device 10 may be the operating current or the state of charge of the electronic device 10. Subsequently, based on the load characteristics of the electronic device 10 and the heat transfer coefficient, the corrected heat transfer coefficient is determined. In this way, the electronic device 10 receives the measured value of the ambient temperature and multiple information from inside and outside the system, establishes a dynamic shell temperature prediction model, and accurately predicts the shell temperature change pattern under the interaction of multiple factors in real time.

[0035] Referring back to Figure 2, as shown, in block 206, method 200 includes adjusting the performance of the electronic device based on the first temperature signal and the second temperature signal.

[0036] In one implementation, adjusting the performance of the electronic device 10 includes: determining a characteristic parameter of the casing temperature of the electronic device 10 based on the first temperature signal and the second temperature signal. Adjusting the performance of the electronic device 10 includes: if the characteristic parameter of the casing temperature of the electronic device 10 rises above a first threshold, then adjusting the performance of the electronic device 10 to a first performance level; and if the characteristic parameter of the casing temperature of the electronic device 10 continues to rise above a second threshold, then adjusting the performance of the electronic device 10 to a second performance level different from the first performance level. In other words, embodiments of this application employ the concept of multiple thresholds, and different strategies are applied to the performance of the electronic device 10 based on different thresholds, causing the electronic device 10 to enter different performance levels. In existing methods using a single threshold, the electronic device 10 directly enters an extreme mode due to excessive casing temperature. While this can quickly reduce power consumption, the performance of the electronic device 10 is significantly reduced in extreme mode, resulting in a poor user experience. Compared to existing methods, embodiments of this application set another threshold (such as a first threshold) before the final extreme mode, and adopt a relatively mild performance mode when the characteristic parameter of the case temperature reaches the first threshold but has not yet reached the second threshold. This measure can prevent the electronic device 10 from directly entering a more aggressive performance mode, thereby optimizing heat dissipation efficiency while ensuring performance, thus improving the user experience.

[0037] In some embodiments, the characteristic parameters of the housing temperature of the electronic device 10 include at least one of the housing temperature value and the rate of change of the housing temperature. That is, as long as the predicted housing temperature value of the electronic device 10 or the rate of change of the housing temperature exceeds a certain threshold, the performance adjustment of the electronic device 10 will be initiated.

[0038] In one implementation, adjusting the performance of the electronic device 10 to a first performance may include reducing the frequency of the chip of the electronic device 10 to a first frequency, and adjusting the performance of the electronic device 10 to a second performance may include reducing the frequency of the chip of the electronic device 10 to a second frequency lower than the first frequency.

[0039] In another implementation, adjusting the performance of the electronic device 10 to a first performance may include reducing the voltage of the chip of the electronic device 10 to a first voltage, and adjusting the performance of the electronic device 10 to a second performance may include reducing the voltage of the chip of the electronic device 10 to a second voltage lower than the first voltage.

[0040] In another implementation, adjusting the performance of the electronic device 10 to a first performance may include reducing the brightness of the screen of the electronic device 10 to a first brightness, and adjusting the performance of the electronic device 10 to a second performance may include reducing the brightness of the screen of the electronic device 10 to a second brightness lower than the first brightness.

[0041] In another implementation, adjusting the performance of the electronic device 10 to a first performance level may include reducing the number of applications on the electronic device 10 to a first number, and adjusting the performance of the electronic device 10 to a second performance level may include reducing the number of applications on the electronic device 10 to a second number lower than the first number.

[0042] In another implementation, adjusting the performance of the electronic device 10 to a first performance may include reducing the charging power consumption of the electronic device 10 to a first power consumption, and adjusting the performance of the electronic device 10 to a second performance may include reducing the charging power consumption of the electronic device 10 to a second power consumption lower than the first power consumption.

[0043] Using the methods listed above, when the detected case temperature value or rate of change exceeds a first threshold, the electronic device 10 can adjust parameters such as chip frequency, chip voltage, screen brightness, number of applications, or charging power consumption to reduce the operating power consumption of the electronic device 10. However, this reduction is relatively gradual and has little impact on the performance of the electronic device 10, thus balancing user experience. If the electronic device 10 further detects that the case temperature value or rate of change exceeds a second threshold, then due to safety regulations, it is necessary to make more drastic adjustments to parameters such as chip frequency, chip voltage, screen brightness, number of applications, or charging power consumption to avoid user risks.

[0044] The examples listed above are merely a few instances of how electronic device 10 can be adjusted in a step-by-step manner. It should be noted that, within the scope of the embodiments described in this application, those skilled in the art can envision many more examples to enable electronic device 10 to be adjusted in a step-by-step manner for different thresholds, such as system load, image quality, frame rate, etc. Furthermore, although the document describes adjusting the performance of electronic device 10 for two different thresholds, in other embodiments, more thresholds can be set, such as three, four, or more, while meeting cost and other requirements, to allow for more fine-tuning and controllable adjustments to the performance of electronic device 10, thereby further improving the user experience.

[0045] According to an embodiment of this application, the electronic device 10 receives the predicted shell temperature curve from the dynamic shell temperature prediction model in the shell temperature prediction module, formulates a real-time intelligent temperature control strategy, and adaptively adjusts the temperature control threshold. When the temperature exceeds the adaptive threshold, the electronic device 10 dynamically adjusts the system load, automatically reduces power consumption, and slows down the heating rate, thereby optimizing heat dissipation efficiency while ensuring performance.

[0046] In one aspect of this application, an apparatus for regulating the performance of an electronic device is provided. The apparatus includes components for performing the method described above.

[0047] In one aspect of this application, a chip is provided. The chip includes at least one processor for performing the methods described above.

[0048] In one aspect of this application, an electronic device is provided. The electronic device includes at least one processor; and a memory coupled to the at least one processor and having instructions stored thereon, which, when executed by the at least one processor, cause the device to perform the methods described above.

[0049] Referring back to FIG1, an electronic device 10 according to an embodiment of this application will now be described with reference to FIG1. ​​As shown in FIG1, the electronic device 10 includes various sensors at the hardware level, such as an infrared sensor, a junction temperature sensor, and a case temperature sensor. The electronic device 10 can sense the ambient temperature of the environment in which it is located via the infrared sensor. The electronic device 10 can determine the junction temperature of the chip via the junction temperature sensor. The electronic device 10 can determine the case temperature of the electronic device 10 via the case temperature sensor. The electronic device 10 also includes a measurement module and a prediction optimization module, wherein the measurement module includes an ambient temperature measurement module that communicates with the infrared sensor to obtain an initial measurement value of the ambient temperature measured by the infrared sensor. The initial measurement value of the ambient temperature is transmitted to the ambient temperature correction module in the measurement module, which uses a thermal balance algorithm to correct the initial measurement value of the ambient temperature, thereby improving the reliability and accuracy of the measurement results.

[0050] The corrected ambient temperature is transmitted to the case temperature prediction module in the prediction and optimization module. Furthermore, the application layer of electronic device 10 can also transmit key data such as case temperature, load characteristics, and operating current to the case temperature prediction module. In the case temperature prediction module, a dynamic case temperature prediction model is used to comprehensively consider the corrected ambient temperature and key data to obtain a case temperature prediction curve, thus preparing for the subsequent implementation of the temperature control scheme. Based on the case temperature prediction curve, the case temperature value or its rate of change is obtained, and the temperature control decision module can formulate an intelligent real-time temperature control strategy for electronic device 10. For example, a multi-threshold temperature control strategy can be adopted, where different thresholds are reached for the case temperature value or its rate of change, causing electronic device 10 to enter operating modes with varying degrees of aggression, thereby adjusting the system chip of electronic device 10.

[0051] Compared to existing methods, electronic device 10 can take into account both external factors such as ambient temperature and internal factors such as device performance, and formulate a case temperature prediction model based on these factors to optimize heat dissipation efficiency and energy efficiency ratio, thereby extending battery life and ensuring stable performance, significantly improving the user experience. Furthermore, the embodiments of this application are stable and reliable, and can meet various usage scenarios, such as various electronic devices, such as mobile phones, tablets, smartwatches, etc.

[0052] In one aspect of this application, a computer-readable storage medium is provided. The computer-readable storage medium stores computer-executable instructions, which are executed by a processor to implement the method according to the first aspect of this application.

[0053] Figure 3 shows a schematic block diagram of a device capable of implementing several embodiments of the present application. As shown, device 300 includes a central processing unit (CPU) 301, which can perform various appropriate actions and processes according to computer program instructions stored in read-only memory (ROM) 302 or loaded from storage unit 308 into random access memory (RAM) 303. Various programs and data required for the operation of device 300 may also be stored in RAM 303. CPU 301, ROM 302, and RAM 303 are interconnected via bus 304. Input / output (I / O) interface 305 is also connected to bus 304.

[0054] Multiple components in device 300 are connected to I / O interface 305, including: input unit 306, such as a touch screen, microphone, etc.; output unit 307, such as various types of displays, speakers, etc.; storage unit 308, such as a disk, optical disk, etc.; and communication unit 309, such as a network card, modem, wireless transceiver, etc. Communication unit 309 allows device 300 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0055] The various processes and handling described above, such as method 200, can be executed by processing unit 301. For example, in some embodiments, method 200 can be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 308. In some embodiments, part or all of the computer program can be loaded and / or installed on device 300 via ROM 302 and / or communication unit 309. When the computer program is loaded into RAM 303 and executed by CPU 301, one or more actions of method 200 described above can be performed.

[0056] This application may be a method, apparatus, system, and / or computer program product. A computer program product may include a computer-readable storage medium having computer-readable program instructions loaded thereon for performing various aspects of this application.

[0057] Computer-readable storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Computer-readable storage media can be, for example—but not limited to—electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination of the foregoing. The computer-readable storage media used herein are not to be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses through fiber optic cables), or electrical signals transmitted through wires.

[0058] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.

[0059] The computer program instructions used to perform the operations of this application may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuits, such as programmable logic circuits, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), are personalized by utilizing state information from the computer-readable program instructions. These electronic circuits can execute the computer-readable program instructions to implement various aspects of this application.

[0060] Various aspects of this application are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0061] These computer-readable program instructions can be provided to a processing unit of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processing unit of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner. Thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0062] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0063] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of an instruction containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0064] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0065] Although the subject matter has been described using language specific to structural features and / or methodological logic, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are merely illustrative examples of implementing the claims.

Claims

1. A method for adjusting the performance of an electronic device, comprising: Receive a first temperature signal from a first sensor, the first temperature signal representing the ambient temperature of the environment in which the electronic device is located; Receive a second temperature signal from a second sensor, the second temperature signal representing the case temperature of the electronic device; as well as The performance of the electronic device is adjusted based on the first temperature signal and the second temperature signal.

2. The method according to claim 1, wherein the housing temperature of the electronic device is determined by: Based on the ambient temperature, the heat transfer coefficient is determined using Newton's law of cooling; and The casing temperature of the electronic device is determined based on the heat transfer coefficient.

3. The method of claim 2, wherein the heat transfer coefficient is a modified heat transfer coefficient, and wherein determining the heat transfer coefficient comprises: Obtain the load characteristics of the electronic device; as well as The corrected heat transfer coefficient is determined based on the load characteristics and the heat transfer coefficient of the electronic device.

4. The method according to any one of claims 1 to 3, wherein the first sensor is disposed inside or outside the electronic device or on another electronic device independent of the electronic device.

5. The method according to any one of claims 1 to 4, wherein the ambient temperature is a modified ambient temperature, and wherein the ambient temperature is determined by: The initial ambient temperature is obtained from the first sensor; Based on the environment in which the electronic device is located, determine the fitting parameters; and The corrected ambient temperature is obtained based on the fitted parameters and the initial ambient temperature.

6. The method according to any one of claims 1 to 5, wherein adjusting the performance of the electronic device comprises: Based on the first temperature signal and the second temperature signal, the characteristic parameters of the casing temperature of the electronic device are determined; In response to the characteristic parameter of the case temperature of the electronic device rising to a value greater than a first threshold, the performance of the electronic device is adjusted to a first performance. as well as In response to the characteristic parameter of the case temperature of the electronic device continuing to rise to a second threshold higher than the first threshold, the performance of the electronic device is adjusted to a second performance different from the first performance.

7. The method of claim 6, wherein adjusting the performance of the electronic device to a first performance includes at least one of the following: The frequency of the chip in the electronic device is reduced to a first frequency; Reduce the voltage of the chip in the electronic device to a first voltage; Reduce the brightness of the screen of the electronic device to a first brightness level; The number of applications on the electronic device is reduced to a first number; as well as The charging power consumption of the electronic device is reduced to the first power consumption.

8. The method of claim 7, wherein adjusting the performance of the electronic device to a second performance comprises at least one of the following: The frequency of the chip in the electronic device is reduced to a second frequency lower than the first frequency; The voltage of the chip in the electronic device is reduced to a second voltage, which is lower than the first voltage; The brightness of the screen of the electronic device is reduced to a second brightness, which is lower than the first brightness. The number of applications on the electronic device is reduced to a second number, which is lower than the first number; as well as The charging power consumption of the electronic device is reduced to a second power consumption that is lower than the first power consumption.

9. The method according to any one of claims 6 to 8, wherein the characteristic parameter of the shell temperature includes at least one of the numerical value of the shell temperature and the rate of change of the shell temperature.

10. An apparatus for regulating the performance of an electronic device, comprising: Components for performing the method according to any one of claims 1 to 9.

11. A chip, comprising: At least one processor, said processor being configured to perform the method according to any one of claims 1 to 9.

12. An electronic device, comprising: At least one processor; as well as A memory coupled to the at least one processor and having instructions stored thereon, which, when executed by the at least one processor, cause the device to perform the method according to any one of claims 1 to 9.

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