Method of loading an evaporation source with material for evaporation, evaporation crucible, evaporation source and deposition system

Abstract

A method (100) of loading an evaporation source (300) with material for evaporation is described. The method includes: filling (110) an evaporation crucible (200) in an inert gas atmosphere with the material for evaporation; closing (120) the evaporation crucible (200) in the inert gas atmosphere via a sliding closing mechanism (220); mounting (130) the evaporation crucible (200) to the evaporation source (300) in a mounting direction (131); and opening (140) a slidable closure (221) of the sliding closing mechanism (220) by moving the slidable closure (221) in a direction (132) opposite to the mounting direction (131). Further, an evaporation crucible to evaporate material, an evaporation source and a deposition system are described.

Description

METHOD OF LOADING AN EVAPORATION SOURCE WITH MATERIAL FOR EVAPORATION, EVAPORATION CRUCIBLE, EVAPORATION SOURCE AND DEPOSITION SYSTEMTECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to methods of loading an evaporation source with material for evaporation. Further embodiments of the present disclosure relate to evaporation crucibles to evaporate material, evaporation sources and deposition systems to deposit evaporated material on a substrate.BACKGROUND

[0002] Material deposition may be provided for various applications, for example for OLED manufacturing and / or for depositing materials on large area substrates.

[0003] An organic light-emitting diode (OLED) is a light-emitting diode in which an electroluminescent layer is a film of organic compounds that emits light in response to an electric current. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information. OLEDs can also be used for general space illumination. An OLED display, for example, may include layers of organic material situated between two electrodes that are deposited on a substrate in a manner so as to form a matrix display panel having individually energizable pixels.

[0004] For OLED manufacturing, organic materials and metallic materials are deposited on a substrate in vacuum processing chambers. Metallic and non-metallic materials are employed as, for example, electrode materials orelectron injection layer (EIL) materials.

[0005] Current methods for handling sensitive materials for evaporation in OLED processes face several challenges. One of the main issues is the high cost of dry room requirements. To prevent sensitive materials from degrading or reacting with moisture or oxygen, existing systems often rely on expensive dry rooms or specialized controlled environments, significantly increasing operational costs. Another challenge is the difficulty in maintaining protective layers around sensitive materials. In many systems, such protective layers are broken when starting the evaporation process, which can result in contamination and loss of material quality. This complicates the process and makes it harder to control the evaporation, especially when precise material properties are essential. Additionally, current handling methods require specialized equipment and additional features to safely manage the delicate balance between preventing contamination and ensuring effective evaporation. Such added components not only raise costs but also increase the complexity of the system. Further, existing systems lack flexibility and require modifications to standard evaporation setups to accommodate the handling of sensitive materials. This reduces compatibility with standard preventive maintenance processes and makes it more difficult to integrate sensitive material handling into existing production lines, adding more complexity to an already intricate process. Overall, such challenges make the safe and efficient handling of sensitive materials in OLED evaporation tools expensive, complex, and difficult to implement within standard production systems.

[0006] Accordingly, there is a demand for improved approaches which at least partially overcome one or more of the disadvantages of the state of the art.SUMMARY

[0007] In light of the above, a method of loading an evaporation source with material for evaporation, an evaporation crucible to evaporate material, an evaporation source and a deposition system according to the independent claims are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0008] According to an aspect of the present disclosure, a method of loading an evaporation source with material for evaporation is provided. The method includes filling an evaporation crucible in an inert gas atmosphere with the material for evaporation. Additionally, the method includes closing the evaporation crucible in the inert gas atmosphere via a sliding closing mechanism. Further, the method includes mounting the evaporation crucible to the evaporation source in a mounting direction. Moreover, the method includes opening a slidable closure of the sliding closing mechanism by moving the slidable closure in a direction opposite to the mounting direction.

[0009] According to another aspect of the present disclosure, an evaporation crucible to evaporate material is provided. The evaporation crucible includes a discharge port for evaporated material. The discharge port includes a sliding closing mechanism. The sliding closing mechanism includes a slidable closure configured to close and open a discharge opening of the discharge port.

[0010] According to a further aspect of the present disclosure, an evaporation source to deposit evaporated material is provided. The evaporation source includes a connection port to connect an evaporation crucible. The connection port has an opening element configured to open a sliding closing mechanism of the evaporation crucible when the evaporation crucible is connected to the connection port.

[0011] According to yet another aspect of the present disclosure, a deposition system is provided. The deposition system includes a vacuum deposition chamber and an evaporation source according to any embodiments described in the present disclosure in the vacuum deposition chamber.

[0012] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0014] FIG. 1 shows a block diagram with pictograms for illustrating a method of loading an evaporation source with material for evaporation according to embodiments of the present disclosure;

[0015] FIG. 2 shows a block diagram with pictograms for illustrating a method of loading an evaporation source with material for evaporation according to further embodiments of the present disclosure;

[0016] FIGS. 3 and 4 show further details of the method of loading an evaporation source with material for evaporation according to embodiments of the present disclosure;

[0017] FIGS. 5 and 6 show embodiments of an evaporation crucible according to the present disclosure;

[0018] FIG. 7 shows a detailed view of a sliding closing mechanism of an evaporation crucible according to embodiments of the present disclosure;

[0019] FIGS. 8 and 9 show embodiments of an evaporation source to deposit evaporated material according to the present disclosure; and

[0020] FIG. 10 shows a deposition system evaporation source to deposit evaporated material according to embodiments of the present disclosure.DETAILED DESCRIPTION OF EMBODIMENTS

[0021] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations.

[0022] Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.

[0023] With exemplary reference to FIG. 1, a method 100 of loading an evaporation source 300 with material for evaporation according to embodiments of the present disclosure is described. According to embodiments, which can be combined with other embodiments described herein, the method 100 includes filling an evaporation crucible 200 in an inert gas atmosphere 111 with the material 11 for evaporation (represented by block 110 in FIG. 1 and schematically illustrated in the pictogram of FIG. 1a). Additionally, the method 100 includes closing the evaporation crucible 200 in the inert gas atmosphere via a sliding closing mechanism 220 (represented by block 120 in FIG. 1 and schematically illustrated in the pictogram of FIG. 1b). Further, the method 100 includes mounting the evaporation crucible 200 to the evaporation source 300 in a mounting direction 131 (represented by block 130 in FIG. 1 and schematically illustrated in the pictogram of FIG. 1 c). Yet further, the method 100 includes opening a slidable closure 221 of the sliding closing mechanism 220 by moving the slidable closure 221 in a direction 132 opposite to the mounting direction 131 (represented by block 140 in FIG.1 and schematically illustrated in the pictogram of FIG. 1d).

[0024] Accordingly, the method of loading an evaporation source with material for evaporation according to the present invention offers significant advantages over current methods for handling sensitive materials in evaporation processes, particularly for OLED manufacturing. One of the key benefits is that only the filling of the evaporation crucible with sensitive materials needs to be carried out in a controlled non-reactive atmosphere, which can be provided in a glove box in which the evaporation crucible is filled. Hence, the method according to the invention eliminates the need for expensive dry rooms during material loading, which leads to significant savings in operational and infrastructure costs. In other words, the invention simplifies the overall handling process of sensitive material during loading. The need for complex and costly equipment typically required for managing sensitive materials is eliminated, making the overall process morestraightforward. Such a simplification allows for easier integration into existing evaporation systems, reducing the need for additional devices or features that would otherwise increase both complexity and cost. Accordingly, the method according to the present invention is highly compatible with standard evaporation processes and systems, such that the invention can be incorporated into existing setups with minimal modifications. Such a compatibility reduces downtime and eliminates the need for extensive changes to standard maintenance procedures, making it a flexible and efficient solution for manufacturers. Hence, the invention provides a cost-effective solution for handling sensitive materials in evaporation tools. By reducing the reliance on expensive dry rooms, specialized equipment, and complex procedures, the invention offers a more accessible option that can be scaled up for a wider range of applications, ultimately improving both efficiency and cost-effectiveness in production. In summary, the invention presents a simpler, cheaper, and more efficient approach to handling sensitive materials in evaporation processes, offering significant operational, economic, and material quality benefits.

[0025] In the present disclosure, an "evaporation source" can be understood as a device configured to vaporize material for material deposition on a substrate. The vaporized material condenses on the substrate to form a thin film. Typically, the evaporation source is configured to provide the thermal energy to transform solid or liquid material into a vapor phase in a controlled environment, typically under vacuum.

[0026] In the present disclosure, the term "material for evaporation" refers to the substance specifically chosen and prepared for deposition in thermal evaporation processes. Typically, the material for evaporation is vaporized under controlled conditions, particularly in an evaporation crucible as described herein. The material for evaporation may also be referred to as source material herein. According to embodiments, which can be combined with other embodiments described herein, the material for evaporation canbe an organic or inorganic material. For example, the material for evaporation can be a metal. In particular, the material for evaporation may be a reactive organic material or a reactive inorganic material, particularly a reactive metallic material. For instance, the material for evaporation may be an alkali metal containing material or an alkali metal, such as lithium (Li), sodium (Na), potassium (K), rubidium (Rb). For instance, the alkali metal containing material can be lithium fluoride. According to another example, the material for evaporation may be an alkaline earth metal containing material or an alkaline earth metal, such as Beryllium (Be), Magnesium (Mg), Calcium (Ca), etc. According to a further example, the material for evaporation may be a lanthanide containing material or a lanthanide (rare earth metal), such as Neodymium (Nd), Ytterbium (Yb), etc. It is to be understood that the material for evaporation may include any combination of materials listed herein. Before evaporation, the material is typically in a solid state, such as a powder or one or more ingots.

[0027] In the present disclosure, an "evaporation crucible" can be understood as a device having a reservoir for the material to be evaporated by heating the evaporation crucible. Accordingly, an evaporation crucible can be understood as a source material reservoir which can be heated to vaporize the source material into a gas by at least one of evaporation and sublimation of the source material. Typically, the evaporation crucible includes a heater to vaporize the source material in the crucible into a gaseous source material. The reservoir can have an inner volume for receiving the source material to be evaporated, e.g. a metal material. For example, the volume of the crucible can be between 100 cm3and 4000 cm3, particularly between 1000 cm3and 3000 cm3, more particularly 2800 cm3. In particular, the crucible may include a heating unit configured for heating the source material provided in the inner volume of the crucible up to a temperature at which the source material evaporates. It is to be understood that the evaporation crucible may be configured to evaporate a source material as described herein.

[0028] In the present disclosure, an "inert gas atmosphere" can be understood as an environment in which reactive gases are replaced or minimized by gases that are chemically stable and non-reactive. Inert gases do not engage in chemical reactions under standard conditions. For instance, an inert gas atmosphere according to embodiments described herein, may include or consist of one or more gases selected from the group consisting of Argon (Ar), Nitrogen (N2), Neon (Ne), Krypton (Kr), Xenon (Xe):

[0029] In the present disclosure, a "sliding closing mechanism" can be understood as a system or assembly in which a closure part or component, for instance a panel or cover, is employed to close an opening by a sliding action. In other words, the sliding closing mechanism typically includes a movable closure part or component, which may also be referred to as slider, that can be shifted along a path, typically a linear path, to close or seal off an opening. The movable closure part or component of the sliding closing mechanism may be referred to as slidable closure herein.

[0030] In the present disclosure, the term "mounting direction" refers to the specific direction in which an evaporation crucible as described herein is oriented and moved during assembly or attachment of the evaporation crucible to a connection port of an evaporation source according to embodiments described herein. In other words, the “mounting direction” can be understood as the specific direction which defines how the evaporation crucible should be aligned and moved relative to the connection port of the evaporation source, ensuring proper functionality and alignment in the assembled state.

[0031] According to embodiments, which can be combined with other embodiments described herein, opening (represented by block 140 in FIG.1 ) of the slidable closure 221 is conducted during the mounting (represented by block 130 in FIG. 1) of the evaporation crucible 200 to the evaporation source 300 in the mounting direction 131. In other words, the opening actionof the slidable closure 221 occurs while the evaporation crucible 200 is being mounted to the evaporation source 300.

[0032] According to embodiments, which can be combined with other embodiments described herein, opening (represented by block 140 in FIG. 1) of the slidable closure 221 includes using an opening element 311 provided at a connection port 310 of the evaporation source 300, as exemplarily shown in FIGS. 2c and 2d. In particular, the opening element 311 is static with respect to the connection port 310. In other words, the opening element 311 is fixed to the connection port 310.

[0033] In the present disclosure, a “connection port” of the evaporation source can be understood as an interface configured to connect the evaporation crucible to the evaporation source. In other words, the connection port provides the attachment interface that allows the evaporation crucible to be securely mounted to the evaporation source.

[0034] In the present disclosure, an “opening element” can be understood as a specific element or component that facilitates the opening of the slidable closure 221 when the evaporation crucible is connected to the connection port 310 of the evaporation source 300. In other words, typically the opening element is configured to trigger the slidable closure 221 to move in such a way that a discharge opening 225 of the evaporation crucible 200, particularly the discharge opening 225 of the sliding closing mechanism 220, will open, as exemplarily shown in the pictograms of FIGS. 2c and 2d. Typically, the opening element 311 is a protruding element. For instance, the opening element 311 can be a rod or a pin.

[0035] According to embodiments, which can be combined with other embodiments described herein, using the opening element 311 includes inserting the opening element 311 into an opening 223 of the sliding closing mechanism 220 while moving the evaporation crucible 200 in the mounting direction 131, as exemplarily visualized in FIG. 2c. In particular, theopening 223 of the sliding closing mechanism 220 is a reception hole 228 (indicated in FIG. 2c) of a tubular insert 222 of the sliding closing mechanism 220. Typically, the tubular insert 222 is arranged within the opening 201 of the evaporation crucible 200, as exemplarily indicated in FIG. 2b.

[0036] According to embodiments, which can be combined with other embodiments described herein, closing (represented by block 120 in FIGS. 1 , 2 and 3) the evaporation crucible 200 in the inert gas atmosphere via the sliding closing mechanism 220 includes linearly moving (indicated by arrow 121 in FIG. 3) the slidable closure 221 towards a discharge opening 225 of the evaporation crucible 200. The expression “linearly moving the slidable closure” refers to the action of sliding or shifting the closure along a defined straight path or trajectory.

[0037] With exemplary reference to FIG. 4, according to embodiments which can be combined with other embodiments described herein, closing (represented by block 120 in FIGS. 1 , 2, 3 and 4) the evaporation crucible 200 in the inert gas atmosphere via the sliding closing mechanism 220 comprises fixing the closed position of the sliding closing mechanism 220 by a fixation element 224, particularly a screw. In the present disclosure, the expression “fixing the closed position” can be understood as the process of securing or locking the sliding closing mechanism 220 in a closed state to prevent an accidental opening.

[0038] According to embodiments, which can be combined with other embodiments described herein, prior to the mounting of the evaporation crucible 200 to the evaporation source 300, the fixation element 224 is removed. Accordingly, prior to the mounting of the evaporation crucible 200 to the evaporation source 300, the method typically includes releasing a fixation of the closed position of the sliding closing mechanism 220, particularly by removing the fixation element 224.

[0039] With exemplary reference to FIG. 5, an evaporation crucible 200 to evaporate material according to embodiments of the present disclosure is described. According to embodiments, which can be combined with other embodiments described herein, the crucible includes a discharge port 210 for evaporated material. The discharge port 210 includes a sliding closing mechanism 220 having a slidable closure 221 configured to close and open (indicated by double sided arrow 22) a discharge opening 225 of the discharge port 210.

[0040] According to embodiments, which can be combined with other embodiments described herein, the sliding closing mechanism 220 includes a tubular insert 222 arranged within an opening 201 of the evaporation crucible 200, as exemplarily shown in FIG. 6. Typically, the slidable closure 221 is guided within the tubular insert 222. The tubular insert 222 can include a reception hole 228 for receiving an opening element 311 configured to move the slidable closure 221 to open the discharge opening 225 when the evaporation crucible is moved towards the opening element 311, as exemplarily described with reference to FIGS. 2c and 2d. The slidable closure 221 may include an abutment 227 for the opening element 311 to open the discharge opening 225.

[0041] With exemplary reference to FIG. 7, according to embodiments which can be combined with other embodiments described herein, the slidable closure 221 includes a reception 226 for a fixation element 224 to fix a closed position of the sliding closing mechanism 220. In particular, the reception 226 for the fixation element 224 may include an internal thread. Typically, the fixation element 224 is a screw.

[0042] With exemplary reference to FIG. 8, an evaporation source 300 to deposit evaporated material according to embodiments of the present disclosure is described. According to embodiments, which can be combined with other embodiments described herein, the evaporation source 300 includes a connection port 310 to connect an evaporation crucible 200.Typically, the connection port 310 has an opening element 311 configured to open a sliding closing mechanism 220 of the evaporation crucible 200 when the evaporation crucible is connected to the connection port 310.

[0043] With exemplary reference to FIG. 9, according to embodiments which can be combined with other embodiments described herein, the evaporation source 300 includes an evaporation crucible 200 according to any embodiment described herein connected to the connection port 310 of the evaporation source.

[0044] According to embodiments, which can be combined with other embodiments described herein, the evaporation source 300 includes a vapor distribution pipe 320 with a plurality of nozzles 321 for directing the evaporated material onto a substrate 10, as exemplarily shown in FIG. 9. The vapor distribution pipe 320 may be configured to provide a line source extending essentially vertically for a vertical deposition process. However, according to some embodiments, which can be combined with other embodiments described herein, also horizontal deposition processes can be utilized, wherein the line source would extend essentially horizontally. In the present disclosure, the term “essentially vertically” is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction of 10° or below. Such a deviation can be provided because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position or may result in less particles on the substrate during substrate processing. Yet, the substrate orientation during deposition of the metal material is considered essentially vertical, which is considered different from the horizontal substrate orientation. Accordingly, the surface of the substrate can be coated by a line source extending in one direction corresponding to one substrate dimension and a translational movement, e.g. of the substrate, along the other direction corresponding to the other substrate dimension.

[0045] It is to be understood that typically the evaporation source is configured to deposit one or more layers of a material as described herein on the substrate, for instance for OLED manufacturing. For example, the evaporation source may be configured to deposit a cathode layer of an OLED layer stack on the substrate.

[0046] Embodiments described herein particularly relate to deposition of materials, e.g. for display manufacturing on large area substrates. According to some embodiments, large area substrates or substrate carriers supporting one or more substrates may have a size of 0.5 m2or larger, particularly of 1 m2or larger. For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 4.5, which corresponds to about 0.67 m2of substrate (0.73 m x 0.92 m), GEN 5, which corresponds to approximately 1.4 m2(1.1 m x 1.3 m), GEN 6, which corresponds to approximately 2.7 m2(1.5 m x about 1.8 m), GEN 7.5, which corresponds to approximately 4.29 m2(1.95 m x 2.2 m), GEN 8.5, which corresponds to approximately 5.7 m2(2.2 m x 2.5 m), or even GEN 10, which corresponds to approximately 8.7 m2(2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be implemented. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure

[0047] With exemplary reference to FIG. 10, a deposition system 400 according to embodiments of the present disclosure is described. According to embodiments, which can be combined with other embodiments described herein, the deposition system 400 includes a vacuum deposition chamber 410 and an evaporation source 300 according to any embodiments described herein. The evaporation source 300 is arranged within the vacuum deposition chamber 410.

[0048] In the present disclosure, a "vacuum deposition chamber" can be understood as a chamber configured for vacuum deposition. The term "vacuum", as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10’5mbar and approximately 10’8mbar, particularly between 10’5mbar and 10’7mbar.

[0049] According to embodiments, which can be combined with other embodiments described herein, the deposition system 400 may include a substrate transportation system 420 configured for moving the substrate relative to evaporation source 300 for coating the substrate 10 with the evaporated material. In particular, the substrate transportation system 420 is configured to move the substrate past the evaporation source 300 at a distance, particularly at a constant distance, with respect to the plurality of nozzles 321 of the vapor distribution pipe 320. Accordingly, in the schematic illustration of FIG. 10, the substrate 10 may be moved perpendicular to the paper plane.

[0050] With exemplary reference to FIGS. 9 and 10, it is to be understood that the evaporation sources may be configured to coat vertically or essentially vertically oriented substrates, particularly substrates that are transported past the evaporation source along a substrate transportation track. However, the present disclosure is not limited to vertically oriented substrates.

[0051] For example, the substrate transportation system may include one or more rollers, one or more linear motors and / or a magnetic levitation system suitable for moving the substrates relative to, and past, the evaporation source. The substrate may be carried by a substrate carrier during the transport and / or deposition in the deposition system.

[0052] A “substrate carrier” can be understood as a carrying device configured to carry one or more substrates through the deposition system. For example, a substrate carrier may comprise a holding section for holding the substrate, e.g., in an essentially vertical orientation, particularly a chucking device, such as an electrostatic chuck. The substrate carrier may further be configured to interact with the substrate transportation track for moving the substrate past the evaporation source. For example, the substrate carrier may include one or more magnetic sections configured to interact with a magnetic levitation system and / or a linear motor of the substrate transportation track.

[0053] According to embodiments, which can be combined with other embodiments described herein, the deposition system 400 may be an in-line system that allows the deposition of a plurality of layers on a substrate in succession, while the substrate is moved past two or more evaporation sources according to embodiments described herein.

[0054] In view of the embodiments described herein, it is to be understood that, compared to the state of the art, embodiments of the present disclosure provide a simpler, cost-effective, and efficient approach for loading sensitive materials into evaporation sources, particularly in OLED manufacturing. By restricting the handling of sensitive materials to a controlled, non-reactive atmosphere, such as within a glove box, such embodiments eliminate the need for expensive dry rooms. Such an approach reduces infrastructure and equipment costs, streamlines the process, and allows seamless integration into existing evaporation systems with minimal modifications. Additionally, the disclosed embodiments minimize downtime and simplify maintenance, offering a flexible and scalable solution that improves production efficiency while preserving material quality.

[0055] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determinedby the claims that follow.

[0056] In particular, this written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

WHAT IS CLAIMED:

1. A method (100) of loading an evaporation source (300) with material (11 ) for evaporation, the method comprising:- filling (110) an evaporation crucible (200) in an inert gas atmosphere (111) with the material for evaporation;- closing (120) the evaporation crucible (200) in the inert gas atmosphere via a sliding closing mechanism (220);- mounting (130) the evaporation crucible (200) to the evaporation source (300) in a mounting direction (131); and- opening (140) a slidable closure (221) of the sliding closing mechanism (220) by moving the slidable closure (221 ) in a direction (132) opposite to the mounting direction (131).

2. The method (100) of claim 1, wherein opening (140) of the slidable closure (221) is conducted during the mounting (130) of the evaporation crucible (200) to the evaporation source (300) in the mounting direction (131).

3. The method (100) of claim 1 or 2, wherein opening (140) of the slidable closure (221) comprises using an opening element (311) provided at a connection port (310) of the evaporation source (300), particularly the opening element (311) being static with respect to the connection port (310).

4. The method (100) of claim 3, wherein using the opening element (311) comprises inserting the opening element (311) into an opening (223) of the sliding closing mechanism (220) while moving the evaporation crucible (200) in the mounting direction (131).

5. The method (100) of any of claims 1 to 4, wherein closing (120) the evaporation crucible (200) in the inert gas atmosphere via the sliding closing mechanism (220) comprises linearly moving the slidable closure (221) towards a discharge opening (225) of the evaporation crucible (200).

6. The method (100) of any of claims 1 to 5, wherein closing (120) the evaporation crucible (200) in the inert gas atmosphere via the sliding closing mechanism (220) comprises fixing the closed position of the sliding closing mechanism (220) by a fixation element (224), particularly a screw.

7. The method (100) of any of claims 1 to 6, wherein the material for evaporation is selected from the group consisting of an organic material, an inorganic material, a metal, a reactive material, a reactive metallic material, an alkali metal, lithium (Li), sodium (Na), potassium (K), rubidium (Rb), an alkali metal containing material, particularly lithium fluoride, an alkaline earth metal, Beryllium (Be), Magnesium (Mg), Calcium (Ca), an alkaline earth metal containing material, a lanthanide, particularly ytterbium (Yb), and combinations thereof.

8. An evaporation crucible (200) to evaporate material, comprising a discharge port (210) for evaporated material, wherein the discharge port (210) comprises a sliding closing mechanism (220) having a slidable closure (221) configured to close and open a discharge opening (225) of the discharge port (210).

9. The evaporation crucible (200) of claim 8, wherein the sliding closing mechanism (220) comprises a tubular insert (222) arranged within an opening (201) of the evaporation crucible (200), and wherein the slidable closure (221) is guided within the tubular insert (222).

10. The evaporation crucible (200) claim 8 or 9, wherein the slidable closure (221) comprises a reception (226), particularly the reception comprising an internal thread, for a fixation element (224), particularly a screw, to fix a closed position of the sliding closing mechanism (220).

11. The evaporation crucible (200) of any of claims 8 to 10, wherein the slidable closure (221) comprises an abutment (227) for an opening element (311 ) to open the discharge opening (225).

12. The evaporation crucible (200) of any of claims 8 to 11 in combination with claim 9, wherein the tubular insert (222) comprises a reception hole (228) for receiving an opening element (311) configured to move the slidable closure (221) to open the discharge opening (225), when the evaporation crucible is moved towards the opening element (311).

13. An evaporation source (300) to deposit evaporated material, comprising a connection port (310) to connect an evaporation crucible (200), the connection port (310) having an opening element (311) configured to open a sliding closing mechanism (220) of the evaporation crucible when the evaporation crucible is connected to the connection port (310).

14. The evaporation source (300) of claim 13, further comprising an evaporation crucible (200) according to any of claims 8 to 12 connected to the connection port (310).

15. A deposition system (400), comprising a vacuum deposition chamber (410) and an evaporation source (300) according to claim 13 or 14 in the vacuum deposition chamber (410).

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