Detector module for scalable parallel single photon detection

Abstract

A detector module (100) is provided for parallel single photon detection applications, said detector module comprising a printed circuit board, an electrical connector board and a plurality of individual single-photon detectors, said electrical connector and said plurality of individual single-photon detectors being arranged on the printed circuit board, wherein each single-photon detector is configured to receive a respective input optical signal from a respective optical fiber and to output a respective output electrical signal representative of the detection of individual photons present in the received input optical signal, and wherein the electrical connector is configured to connect the output electrical signals from the single-photon detectors to an external read-out system.

Description

[0001] Detector module for scalable parallel single photon detection

[0002] BACKGROUND

[0003] The present invention relates to detector modules for scalable parallel single photon detection applications, in particular for multi-module systems based thereon.

[0004] Single-photon detectors (SPDs) play a crucial role in several cutting-edge fields, particularly in data communications and quantum computing. Key advantages of SPDs are high sensitivity (enabling the detection of individual photons), low noise (maintaining fidelity of quantum communication and computation), and fast response time (crucial for high-speed data communication, state-of-the art experiments, and rapid quantum computing operations).

[0005] Several types of SPDs are known, among which Superconducting Nanowire SPDs or SNSPDs. SNSPDs typically comprise a thin film of superconducting material shaped into a meandering nanowire. This meandering nanowire covers a large surface area, collecting the whole output of an optical fiber, while constituting a single path for the current. SNSPDs are operated at low temperatures such that the nanowire is superconducting (e.g. at 2.5 Kelvin) and a constant current below the critical current of the superconductor is applied to the device. The nanoscale cross section gives the photon detectors extremely high sensitivity and allows the detection of just a single absorbed photon. Once a single photon is absorbed in the meandering nanowire, superconductivity is locally broken. As a result, the current is directed towards the amplification electronics and creates a voltage pulse. After the photon is absorbed, superconductivity recovers in the nanowire within a short time and the SNSPD is ready to detect the next photon. In other words, single photons are counted with extremely high sensitivity in SNSPDs by detecting the transition from the superconducting to resistive state of a nanowire upon which photons impinge.

[0006] Figure 1 illustrates a typical prior art single-photon detector (SPD) module 100. In such prior art modules, a SPD 20, for instance a SNSPD (yet other sorts of SPDs may be envisaged), is arranged on a board 10 together with an electrical connector 30 and for instance a mating sleeve 40. The mating sleeve 40 may be arranged on the board 10 to receive an optical fiber 200 on the same side of the board 10 as the SPD 20. The mating sleeve 40 is configured to optically and mechanically couple the optical fiber 200 with the SPD 20. A mating sleeve is known in the art as a tubular mechanical component designed to align and connect an optical fiber and a further optical element (here an SPD 20). The single-photon detector 20 is configured to receive an optical signal from the optical fiber 200 and to output an output electrical signal representative of the detection of individual photons present in the received input optical signal. By optical signal is meant a light beam exitingan end of the optical fiber 200. The electrical connector 30 is then configured to connect the output electrical signal from the single-photon detector 20 to an external read-out system (not represented in Figure 1). The electrical connector 30 may be arranged on any side of the board 10. Typically the electrical connector 30 is arranged on the same side of the board 10 as the SPD 20, yet the opposite side may be used as well depending on circumstances. The mating sleeve 40 is arranged on the board 10 such that an optical axis A of the optical fiber 200 when inserted in the mating sleeve 40 extends substantially perpendicular to the detecting surface of the SPD 20.

[0007] Such a prior art SPD module 100 is typically used in a general detection system 500 as illustrated in Figure 2 comprising a cryostat A in which at least one SPD module 1 is arranged. The system 500 typically further comprises an electronic driver B configured to deliver driving signals for the SPDs, a computer C for controlling the driver B and an helium compressor D for providing cooling to the cryostat A. Fischer cables E and SMA cables F typically connect the driver B and the cryostat A while a Lan cable typically connects the computer C and the driver B. Helium flexlines H typically connect the Helium compressor D and the Cryostat A. Further power cables K may be provided to the driver B and the Helium compressor D, while a vacuum line is provided to the Cryostat A. Readout line(s) N may be provided to the outside of the cryostat A.

[0008] Figure 3 illustrates a typical driving / read-out arrangement for an SPD. As known in the prior art, an SPD is typically inputting driving signals (often a DC current) and outputting readout signals on the same Input / output line. A tee element L interconnects then the driver system B , a read-out system M and the SPD 20. The read-out system M receives signals from the SPD via the Tee element L and delivers read-out signals N through amplification and possible pulse conditioning, typically to the outside of the Cryostat A. The Driver B and part of the read-out system M may be operating at room temperature or within the cryostat.,

[0009] A challenge of modern systems for complex applications, such as quantum communication, quantum computing or large-scale imaging systems is yet to increase the number of parallel operations. Yet with the current physical arrangement of SPD modules 100 as illustrated in Figure 1, only a relatively small number of identical parallel-operable SPD modules 100 can be typically housed within the space constraints of a single cryostat A.

[0010] US2015 / 362688 discloses a nanophotonic device comprises at least two segments, wherein each segment comprises a grating coupler for receiving incident light and a superconducting stripe located on a substrate, wherein the grating coupler is optically coupled to a superconducting stripe of a superconducting single -photon detector. The nanophotonic device further comprises at least two further segments which do not comprise a superconducting stripe, wherein the grating couplers in the further segments constitute an optical reference port for aligning an optical fiber array to the nanophotonic device, wherein an optical coupling is provided between at least two of the opticalreference ports. Additionally, a single-photon camera comprises a housing, wherein the housing comprises a single-photon detector chip with at least one nanophotonic device, a method for manufacturing the nanophotonic device, and a method for aligning an optical fiber array to the nanophotonic device.

[0011] CN 118173619A discloses a multichannel superconducting single photon detector, where the positive electrode bonding pad and the radio frequency connector are removed from the self-alignment metal packaging block, the positive electrode bonding pad is arranged on the PCB wiring board, and the radio frequency connector is arranged on the array disc, so that the space of a cold table is effectively utilized, and the integrated layout of 64-channel self-alignment SNSPD is realized; in addition, compared with a self-alignment PCB packaging board in the prior art, the self-alignment metal packaging block has better thermal contact, and the performance of the device is improved.

[0012] There is thus a need to increase the scalability of SPD modules to meet these challenges while keeping costs and fabrication yield under control.

[0013] SUMMARY

[0014] It is an object, among objects, of the invention to provide a scalable detector module for parallel single-photon detection applications.

[0015] In an aspect of the invention, a detector module for parallel single photon detection applications is provided. Said detector module comprises a printed circuit board, an electrical connector and a plurality of individual single-photon detectors, said electrical connector and said plurality of individual single-photon detectors being arranged on the printed circuit board. Each single-photon detector is configured to receive a respective input optical signal from a respective optical fiber and to output a respective output electrical signal representative of the detection of individual photons present in the received input optical signal. The electrical connector is configured to connect the output electrical signals from the single-photon detectors to an external read-out system. The electrical connector acts thus a common electrical connector for the plurality of single photon detectors, connecting the output electrical signal of each single -photon detector to the external readout system.

[0016] In this way, a compact and cost-effective detector module can be obtained, increasing accordingly scalability. By mounting a plurality of SPDs on a single board, compacity may be increased while by associating the plurality of SPDs to a single connector, the number of elements can be reduced, improving further compacity while reducing costs.

[0017] In a preferred embodiment, the electrical connector and the plurality of single photon detectors are arranged on opposite sides of the printed circuit board. In this way, compacity may be further increased and ease of interconnection may be improved. Indeed arranging optical fibers on one sideand electrical cables on the other side improves space usage inside the cryostat. Opposite orientations of the electrical connector and the SPDs further simplifies the mounting of the detector module to the optical fibers and the external read-out system.

[0018] In a preferred embodiment, a distance between adjacent single-photon detectors is in the range of millimeters. In this way, compacity may be improved compared to individual prior art modules. It is here noted that the distance between adjacent single detectors is such that the SPDs do not act as a single active surface. In that sense the detector module of the present invention is not to be confused with an array of SPDs for the detection of a large combined detection area (with multiple pixels, each pixel being an SPD) but the detector module of the present invention should be seen as a colocation of independent individual SPDs on a board, each SPD receiving a different input signal. The pitch or distance between SPDs in the embodiments is hence not related to any spatial resolution of the photon detection.

[0019] In a preferred embodiment, a plurality of fiber holders, preferably mating sleeves, are arranged on the printed circuit board on the same side as the plurality of single-photon detectors, each fiber holder (mating sleeve) being configured to optically and mechanically couple a respective optical fiber with its respective single-photon detector. In this way, coupling of the optical fibers to the board may be arranged in one side of said board, simplifying mounting. Although mating sleeves are described, optical adhesives, or mechanical holders (spring loaded or clamped holders) may be envisaged as alternative fiber holders.

[0020] In a preferred embodiment, a distance between adjacent single -photon detectors is at least larger than the diameter of the mating sleeves of said single -photon detectors. In other words, the SPDs may be arranged as compact with respect to each other as the mating sleeves allow it. The dimension(s) of the mating sleeves (and associated optical fibers) may hence be regarded as the limiting factor for the compacity of the detector module.

[0021] In a preferred embodiment, the electrical connector is further configured to individually address the output electrical signals from the single-photon detectors. The electrical connector may have one or two pins for each SPD. With a traditional read-out system, a single pin may be used as one side of an SPD is connected to ground on the PCB while the other side of that SPD is connected to a pin of the electrical connector. With a differential read-out system, each side of an SPD may be connected to a separate pin of the electrical connector, such that two pins per SPD may be required. Such an arrangement allows greater connection flexibility and signal integrity. In regard to flexibility, in the simplest case, several SPDs can be envisioned to be connected in series, allowing to use the same driving current in N detectors instead of N times the driving current for each detector. Alternatively the SPDs can be connected to the electrical connector by analogy with a pixel array having a matrix structure of rows and columns, the output electrical signal of each SPD may then be read by adifference in signals between intersecting lines of the matrix. Yet an arrangement with two pins per SPD does not necessarily limit to differential read-out since each pin may be later connected as desired on a separate read out-board. The arrangement of an electrical connector with two pins per SPD allows in that sense a greater compatibility with different read-out techniques as well as the possibility to update over time (retrofit) the read-out system connected to the detector module. In regard to signal integrity, differential signals provide a way for better common noise suppression. In a preferred embodiment, the electrical connector is further configured to connect the plurality of single-photon detectors to an external driving system. In this way, a single input / output line for both the driver system and the read-out system is created.

[0022] In a preferred embodiment, the electrical connector is high-speed hermaphroditic strip. Alternatively, other sorts of connectors may be envisaged without inventive step, among which for example female / male connectors.

[0023] In a preferred embodiment, the detector module comprises at least ten single-photon detectors, preferably at least twenty single -photon detectors, regularly spaced on the printed circuit board. By regularly spacing the SPDs, in particular in an interleaved manner, the module can be rendered compact. The number of SPDs per module may be limited among others by the space constraints of cryostats, the dimensions / prices of available commercial connectors and / or the optical fiber dimensions. The number of SPDs per module may further be optimized depending on the fabrication yield of the SPD versus the total efficiency required for the parallel single-photon detection application.

[0024] In a preferred embodiment, a multi-module system is provided, comprising a plurality of detector modules according to any one of the above embodiments, wherein the at least the plurality of detector modules are shaped and arranged with respect to each other such as to form a tessellation. Tessellation refers to covering a surface with a pattern of shapes (called tiles) that fit together without large gaps or overlaps. By large gaps is meant for instance gaps larger than l-2mm. The tiles are meant to be easily mountable without friction.

[0025] In a preferred embodiment, all detector modules are identical and shaped as a regular polygon, preferably shaped as any one of a triangle, a square or a hexagon. For instance, a pattern of six equilateral triangular detector modules arranged with a common touching angle, or a honeycomb pattern of hexagonal modules may be envisaged. In this way, a surface may be entirely filled with detector modules for maximum space usage using a simple regularly shaped detector module or detector tile. Alternatively the multi-module system comprises two or more types of detector modules combined in a regular pattern, each type being shaped as a regular polygon.

[0026] In a preferred embodiment, the plurality of detector modules are further arranged with respect to each other to form a three-dimensional arrangement, preferably a tubular arrangement. Thetessellation may be extended in three-dimensions to build a 3D structure filling best the available space (within the cryostat).

[0027] In a preferred embodiment, each detector module comprises a separate printed circuit board (PCB) with a plurality of conductive layers and one or more interconnectors for interconnecting the plurality of PCBs. In this way, inter-connectability between modules may be enhanced.

[0028] In a preferred embodiment, the system further comprises a carrier board, wherein the at least two detector modules are configured to be mounted to said carrier board. The carrier board may further house further functions like read-out functions.

[0029] In a preferred embodiment, the interconnectors are openings in the PCB for inserting fixing means. In a preferred embodiment, the interconnectors are thermically connected to the conductive layers of the PCB and comprise a, typically metallic, surface for dissipating heat away from the PCB. In this way, heat may be distributed within the system and away from the PCB in an efficient manner. In a preferred embodiment, the plurality of detector modules are disposed in a cryostat for cooling the plurality of detector modules.

[0030] In a preferred embodiment, the plurality of detector modules are arranged in space to share a common relative orientation, said common relative orientation being defined by a common optical side and a common electrical side for all modules. This allows the multi-module detector system to interconnect with a first bundle of optical fibers and a second bundle of electrical cables in a compact manner in 3D. When the arrangement of the multiple modules forms a 3D tubular structure, a respective central and circumferential arrangement of the two bundles. When the arrangement of the multiple modules forms a 2D planar structure, a respective upper and lower arrangement of the two bundles with respect to the 2D plane.

[0031] This and other aspects of the present invention will now be described in more detail, with reference to the appended drawings showing preferred embodiments of the invention, wherein:

[0032] Figures 4 and 5 illustrate, respectively, a perspective top, and bottom, view of a detector module according to an embodiment of the invention;

[0033] Figure 6 illustrates a top view of a multi-module detector system with a planar arrangement comprising six detector modules as in Figures 4 and 5;

[0034] Figure 7 illustrates a perspective schematic view of a multi-module detector system in a tubular arrangement based on detector modules as in Figures 4 and 5.

[0035] Similar numbers have been used for similar elements throughout the figures. In particular, reference numbers used for elements of the prior art Figures 1-3, have been reemployed whenever similar elements were reappearing in embodiments of the invention.Figures 4 and 5 illustrate a perspective top and bottom view of a detector module 300 according to an embodiment of the invention. The detector module 300 is for parallel single photon detection applications. By parallel single-photon detection applications is meant simultaneous detection of non-related multiple single-photon events, as may be used for instance for quantum sensing and / or computing. The detector module 300 comprises a printed circuit board, PCB, 10, an electrical connector 35 arranged on the PCB 10 and a plurality of individual single-photon detectors 20 also arranged on the PCB 10 (note that in the present example twenty-two SPDs are shown, yet other numbers may be envisaged depending on circumstances). The PCB 10 may have a triangular shape with three side edges, a top surface 10a and a bottom surface 10b facing opposite directions. Yet other PCB shapes may be envisaged.

[0036] The plurality of individual single-photon detectors 20 are arranged on the PCB 10 preferably as in Figure 1 to detect photons from an optical fiber (not represented). The single-photon detectors 20 may be preferably superconducting nanowire single-photon detectors SNSPDs. Each single-photon detector 20 is configured to receive a respective input optical signal from a respective optical fiber (not represented for clarity, similar to Figure 1 showing optical fiber 200 providing an input optical signal to the SPD 20) and to output a respective output electrical signal representative of the detection of individual photons present in the received input optical signal. The electrical connector 30 is configured to connect the output electrical signals from the plurality of single-photon detectors 20 to an external read-out / driver system (not represented, see yet Figure 3 showing a driver system B and a read-out system M, interconnected via tee element L). The electrical connector 35 acts thus as a common electrical I / O interface for the plurality of SPDs 20 of the detector module 300. As can be seen in Figures 4 and 5, the electrical connector 35 and the plurality of single photon detectors 20 are arranged on opposite sides of the PCB 10. The optical axes A of the SPDs 20 extend perpendicularly to the surfaces 10a and 10b of the PCB 10. The SPDs 20 may be arranged on the top surface 10a of the PCB 10 while the electrical connector 35 may be arranged on the bottom surface 10b. The electrical connector 35 may be arranged protruding perpendicularly and outwardly from the bottom surface 10b.

[0037] The detector module 300 may comprise a plurality of mating sleeves 40 arranged on the printed circuit board 10 on the same side as the plurality of single-photon detectors 20. Each mating sleeve 40 may be configured to optically and mechanically couple a respective optical fiber (not represented, extending along the optical axis A) with its respective single-photon detector 20. The mating sleeves 40 may be shaped as tubular components arranged within holes formed in the PCB 10 and extending on both sides of the PCB 10.On the top surface 10a, a distance d between adjacent single-photon detectors 20 may be in the range of millimeters. This distance d may be taken between the centers of the mating sleeves 40 associated with each SPD 20. In such an embodiment, the distance d between adjacent single-photon detectors is thus at least larger than a diameter of the mating sleeves 40 of said single-photon detectors 20. The distance d may be selected such that the SPDs 20 (and the connector 35) may be regularly spread over the surface of the PCB 10. An optimum distance d may be selected based on a tradeoff between a desired compacity and ease of mounting.

[0038] On the bottom surface 10b, the electrical connector 35 may be arranged on a portion of the PCB without any mating sleeve 40. In an embodiment the electrical connector 35 may be arranged substantially centrally on the PCB 10, to limit the average length of conductive tracks within the PCB 10 from / to the connector 35 and each SPD 20. The electrical connector 35 may be further configured to operate as I / O interface for on the one hand individually addressing the output electrical signals from the single -photon detectors 20 and on the other hand connecting the plurality of single-photon detectors to an external driving system. For the same numbers of SPDs operating in parallel, it is noted that the cost of a single electrical connector 35 is typically lower than the costs associated with the plurality of individual connectors 30 of the prior art. The electrical connector 35 may be for instance high-speed hermaphroditic strip, for processing electrical signals to the read-out system and from the driving system of the SPDs 20.

[0039] Figure 6 illustrates a top view of a multi-module detector system 1000 with a planar arrangement comprising six detector modules 300, each detector module 300 being configured as in Figures 4 and 5. The detector modules 300 may be arranged with respect to each other such as to form a tessellation in a plane. In the embodiment shown, the tessellation is made of six tiles forming substantially together an hexagon. In an embodiment, the side edges of the PCBs 10 of the detector modules 300 may have complimentary shapes like jigsaw pieces to further facilitate the tessellation arrangement. By tessellation is meant a pattern of regular shapes substantially covering a whole surface, i.e. without substantial gaps nor overlaps. Although, all detector modules 300 shown in Figure 5 are shaped as a triangle, the same principle of tessellation may be applied to other identically shaped modules with different numbers of sides that may form together a tessellation, like for instance square or hexagon shaped modules. Alternatively, one may imagine a tessellation made of two or more different types of detector modules combined in a regular pattern, each type being shaped as a regular polygon of a different sort (i.e. combining tiles with one shape with tiles with a different shape to form a complex tessellation pattern).

[0040] SPDs require typically cooling, such that the multi module detector system 1000 is to be disposed in a cryostat, like cryostat A of Figure 1, for cooling the plurality of detector modules 20. By achievinga tessellation (without substantial gaps), the use of the available space inside such a cryostat may be optimized.

[0041] In an embodiment, the plurality of detector modules 300 may be arranged in space to share a common relative orientation. For instance, the common relative orientation may be defined by a common optical side and a common electrical side for all modules. In the case of a planar arrangement of a plurality of detector modules 300, like in Figure 6 but not limited to this specific tessellation, the optical fibers 200 may be bundled on one side of the planar arrangement, while the electrical connectors 30 may be exposed on the opposite side of the planar arrangement. In this way, wiring and mounting of the multi-module detector system in general may be simplified in that one side of the multi-module detector system may be for optical coupling, while the other side may be for electrical coupling.

[0042] As illustrated in Figure 6, each detector module 300 may comprise a separate PCB 10 with a plurality of conductive layers (internal) connected by vias 60. In embodiments, the PCB 10 may be provided with one or more interconnectors 50. The interconnectors 50 may be used to mount the detector modules 300 to a common carrier board (not represented). Alternatively, the interconnectors 50 may be used to directly interconnect the detector modules 300 with each other. The interconnectors 50 may be arranged as openings in the PCB 10 for inserting fixing means (not represented). The interconnectors 50 may be thermically connected to the conductive layers of the PCB and may have a, typically metallic, surface for dissipating heat away from the PCB. The interconnectors 50 may thus serve both a mechanical function and a thermal function.

[0043] Figure 7 illustrates a perspective schematic view of a multi-module detector system 2000 in a tubular arrangement based on detector modules 300 as in Figures 4 and 5. In this embodiment, the plurality of detector modules 300 may be further arranged with respect to each other to form a three-dimensional arrangement, for instance a tubular arrangement, yet other 3D structures may be envisaged depending on circumstances. In this way, a volume inside a cryostat may be used to the maximum to house as many SPDs as possible within that volume constraint. In the case of a 3D tubular arrangement, the optical fibers may be arranged towards an inside surface of the tubular arrangement, while the electrical connectors 30 may be arranged on an outside surface of the tubular arrangement, or vice versa.

[0044] Whilst the principles of the invention have been set out above in connection with specific embodiments, it is understood that this description is merely made by way of example and not as a limitation of the scope of protection which is determined by the appended claims.

Claims

CLAIMS1. A detector module for parallel single photon detection applications, said detector module comprising a printed circuit board, a common electrical connector and a plurality of individual single -photon detectors, said common electrical connector and said plurality of individual single-photon detectors being arranged on the printed circuit board,wherein each single-photon detector is configured to receive a respective input optical signal from a respective optical fiber and to output a respective output electrical signal representative of the detection of individual photons present in the received input optical signal, and wherein the common electrical connector is configured to connect the plurality of output electrical signals from the plurality of individual single-photon detectors to an external read-out system.

2. The detector module according to claim 1, wherein the common electrical connector and the plurality of individual single photon detectors are arranged on opposite sides of the printed circuit board.

3. The detector module according to claim 1, wherein a distance between adjacent single-photon detectors is in the range of millimeters.

4. The detector module according to any of the previous claims, further comprising a plurality of mating sleeves arranged on the printed circuit board on the same side as the plurality of single-photon detectors, each mating sleeve being configured to optically and mechanically couple a respective optical fiber with its respective single-photon detector.

5. The detector module according to the previous claim, wherein a distance between adjacent single-photon detectors is at least larger than the diameter of the mating sleeves of said single-photon detectors.

6. The detector module according to any of the above claims, wherein the common electrical connector is further configured to individually address the output electrical signals from the single-photon detectors.

7. The detector module according to any of the above claims, wherein the common electrical connector comprises a pair of two pins per single-photon detector, each pin of a pair being connected to a respective side of a single-photon detector.

8. The detector module according to any of the above claims, wherein the common electrical connector is further configured to connect the plurality of single-photon detectors to an external driving system.

9. The detector module according to any of the previous claims, wherein the common electrical connector is a high-speed hermaphroditic strip.

10. The detector module according to any of the previous claims, comprising at least ten single -photon detectors, preferably at least twenty single-photon detectors, regularly spaced on the printed circuit board.

11. The detector module according to any of the previous claims, wherein the singlephoton detectors are preferably superconducting nanowire single-photon detectors SNSPDs,12. A multi-module system, comprising:a plurality of detector modules according to any one of the above claims, wherein the at least the plurality of detector modules are shaped and arranged with respect to each other such as to form a tessellation.

13. The multi-module system according to the previous system claim, wherein all detector modules are identical and shaped as a regular polygon, preferably shaped as any one of a triangle, a square or a hexagon.

14. The multi-module system according to claim 12, comprising two or more types of detector modules combined in a regular pattern, each type being shaped as a regular polygon.

15. The multi-module system according to any of the previous system claims, wherein the plurality of detector modules are further arranged with respect to each other to form a three-dimensional arrangement, preferably a tubular arrangement.

16. The multi-module system according to any of the previous system claims, wherein each detector module comprises a separate printed circuit board, PCB, with a plurality of conductive layers and one or more interconnectors for interconnecting the plurality of PCBs.

17. The multi-module system according to any of the previous system claims, further comprising a carrier board, wherein the at least two detector modules are configured to be mounted to said carrier board.

18. The multi-module system according to the last two claims, wherein the interconnectors are openings in the PCB for inserting fixing means.

19. The multi-module system according to the last two claims, wherein the interconnectors are thermically connected to the conductive layers of the PCB and comprise a, typically metallic, surface for dissipating heat away from the PCB.

20. The multi-module system according to any of the previous system claims, wherein the plurality of detector modules are disposed in a cryostat for cooling the plurality of detector modules.

21. The multi-module system according to any of the previous system claims, wherein the plurality of detector modules are arranged in space to share a common relative orientation, said common relative orientation being defined by a common optical side and a common electrical side for all modules.

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