Semiconductor manufacturing apparatus, substrate holding device, substrate holding method, and method for manufacturing semiconductor device

Abstract

Provided is a technology which is capable of pressing a peripheral edge of a substrate according to various substrate sizes.　This semiconductor manufacturing apparatus comprises: a pair of chutes that convey a substrate; a mounting section that supports the substrate from below; a first clamp part that is provided in the vicinity of one of the pair of chutes and presses the substrate against the mounting section by moving downward; and a second clamp part that is provided in the vicinity of the other of the pair of chutes, is movable in the width direction of the substrate substantially perpendicular to the conveyance direction of the substrate, and presses the substrate against the mounting section by moving downward.

Description

Semiconductor manufacturing apparatus, substrate holding apparatus, substrate holding method, and method of manufacturing semiconductor device

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable, for example, to a dicing machine including a transfer lane for moving a substrate.

[0002] As one step of a semiconductor device manufacturing process, a die divided from a wafer is picked up, and the picked-up die is bonded to a substrate. For example, when bonding, the peripheral portion of the substrate may be pressed by a frame portion (for example, Japanese Patent Application Laid-Open No. 2023-134300).

[0003] Japanese Patent Application Laid-Open No. 2023-134300

[0004] An object of the present disclosure is to provide a technique capable of pressing the peripheral portion of a substrate corresponding to various substrate sizes. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0005] A summary of typical aspects of the present disclosure will be briefly described as follows. That is, a semiconductor manufacturing apparatus includes a pair of chutes for transporting a substrate, a placement portion for supporting the substrate from below, a first clamp component provided near one of the pair of chutes and pressing the substrate against the placement portion by moving downward, and a second clamp component provided near the other of the pair of chutes, movable in the width direction of the substrate substantially perpendicular to the transport direction of the substrate, and pressing the substrate against the placement portion by moving downward.

[0006] According to the present disclosure, it becomes possible to press the peripheral portion of a substrate corresponding to various substrate sizes, and the operation rate of the semiconductor manufacturing apparatus can be improved.

[0007] Figure 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1. Figure 3 is a flowchart illustrating a method for manufacturing a semiconductor device using the die bonder shown in Figure 1. Figure 4 is a schematic view of the clamp drive mechanism in the dashed line area B in Figure 1, as seen from above. Figure 5 is a diagram illustrating the schematic configuration as seen from the direction of arrow C in Figure 4. Figure 6 is a diagram illustrating the state when the substrate is clamped in Figure 5. Figure 7 is a diagram illustrating the chute movement mechanism for changing the width of the substrate in an embodiment. Figure 8 is a diagram illustrating the schematic configuration of the clamp drive mechanism when the width of the substrate is small in an embodiment. Figure 9 is a diagram illustrating the schematic configuration of the clamp drive mechanism when the width of the substrate is large in an embodiment. Figure 10 is a diagram illustrating the schematic configuration of the clamp drive mechanism in another embodiment.

[0008] The embodiments and other embodiments will be described below with reference to the drawings. However, in the following description, the same reference numerals will be used for the same components, and repeated descriptions may be omitted. In addition, in order to make the explanation clearer, the width, thickness, shape, etc. of each part may be represented schematically in the drawings, compared to the actual embodiment. Furthermore, the dimensional relationships of each element and the ratios of each element do not necessarily match between multiple drawings.

[0009] The configuration of a die bonder, which is one embodiment of a semiconductor manufacturing apparatus, will be explained using Figures 1 and 2. Figure 1 is a schematic top view showing an example of the configuration of a die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

[0010] The die bonder 1 is broadly composed of a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-to-back direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-and-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0011] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holding base 12, a peeling unit 13, and a wafer recognition camera 24.

[0012] The wafer cassette lifter 11 moves a wafer cassette (not shown) containing multiple wafer rings WR up and down to the wafer transport height. The wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. The wafer extractor (not shown) removes the wafer rings WR from the wafer cassette (not shown) and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette (not shown).

[0013] A wafer W is bonded (attached) to a dicing tape DT, and the wafer W is divided into multiple dies D. The dicing tape DT is held in a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are semiconductor chips or glass chips. A film-like adhesive material DF called a die attach film (DAF) may be attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0014] The wafer holder 12 moves in the X1-X2 and Y1-Y2 directions by a drive unit (not shown) to move the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 also rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 moves vertically by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0015] The wafer recognition camera 24 recognizes the pickup position of the die D picked up from the wafer W and performs surface inspection of the die D.

[0016] The pickup unit 20 includes a pickup head 21 and a pickup head table 23. The pickup head 21 is provided with a collet 22 that adsorbs and holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Z1-Z2 direction, Y1-Y2 direction, and X1-X2 direction. The pickup head table 23 may also rotate the pickup head 21.

[0017] The intermediate stage section 30 includes an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 is equipped with suction holes (not shown) for attracting the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed and a pickup stage on which the die D is picked up.

[0018] The bonding unit 40 includes a bond head 41, a bond head table 43, a substrate recognition camera 44, and a bond stage 46 which is a mounting unit. The bond head 41 is provided with a collet 42 that adsorbs and holds the die D at its tip. The bond head table 43 moves the bond head 41 in the Z1-Z2, Y1-Y2, and X1-X2 directions. The bond head table 43 may also rotate the bond head 41. The substrate recognition camera 44 images the substrate S and recognizes the bond position. Here, the substrate S is, for example, a wiring board, a lead frame, a glass substrate, etc. Multiple product areas (hereinafter referred to as package areas P) that will ultimately become one package are formed on the substrate S. Also, position recognition marks (not shown) for the package areas P are formed on the substrate S. When the die D is placed on the substrate S, the bond stage 46 is raised to support the substrate S from below. The bond stage 46 has a suction hole (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place. The bond stage 46 also has a heating section (not shown) for heating the substrate S.

[0019] With this configuration, the bond head 41 corrects its pickup position and orientation based on the image data from the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die onto the package area P of the substrate S based on the image data from the substrate recognition camera 44, or bonds it by stacking it on top of a die that has already been bonded onto the package area P of the substrate S.

[0020] The transport unit 50 includes transport claws 51 that grasp and transport the substrate S, and a transport lane (hereinafter referred to as a chute) 52 on which the substrate S moves. The substrate S moves in the X1 direction by driving nuts (not shown) of the transport claws 51 provided on the chute 52 with a ball screw (not shown) provided along the chute 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the chute 52 to the bonding position, and after bonding, moves to the substrate discharge unit 70 and hands over the substrate S to the substrate discharge unit 70.

[0021] The substrate supply unit 60 takes the substrates S that have been stored in a transport jig (not shown) and delivered, and supplies them to the transport unit 50. The substrate discharge unit 70 stores the substrates S that have been transported by the transport unit 50 into a transport jig (not shown).

[0022] As shown in Figure 1, the control unit 80 is configured as a computer having a CPU (Central Processing Unit) 81, a storage device 82, and an input / output device 83. The control unit 80 is also called a control device or controller. The storage device 82 has a main memory 82a and an auxiliary storage device 82b. The main memory 82a is composed of RAM (Random Access Memory) which stores processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) which stores control data and image data necessary for control. The processing program is a process recipe which describes the procedures and conditions for processing.

[0023] The input / output device 83 includes an image acquisition device 83a, a motor control device 83b, an I / O signal control device 83c, a monitor 83d, and an input device 83e. The image acquisition device 83a acquires image data from an optical system such as a substrate recognition camera 44. The motor control device 83b controls the drive units of the wafer supply unit 10, such as the XY table (not shown), the pickup head table 23, and the bond head table 43. The I / O signal control device 83c acquires signals from various sensors and outputs electrical signals to control the device. The monitor 83d displays the device status and information. The input device 83e is a pointing device such as a touch panel for inputting operator instructions, a keyboard, or a mouse for operating the monitor 83d.

[0024] A part of the manufacturing process for a semiconductor device using the die bonder 1 (method of manufacturing a semiconductor device) will be explained with reference to Figure 3. Figure 3 is a flowchart showing the method of manufacturing a semiconductor device using the die bonder shown in Figure 1. In the following explanation, the operation of each part constituting the die bonder 1 is controlled by the control unit 80.

[0025] (Wafer loading process: process S1) A wafer cassette (not shown) containing wafer rings WR is loaded into the wafer cassette lifter 11. The loaded wafer rings WR are supplied (loaded) into the wafer holder 12.

[0026] (Substrate loading process: process S2) The transport jig containing the substrate S is loaded into the substrate supply unit 60. In the substrate supply unit 60, the substrate S stored in the transport jig is removed from the transport jig. It is then supplied (loaded) to the bonding unit 40 via the transport unit 50.

[0027] (Pickup process: process S3) After process S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is imaged by the wafer recognition camera 24, and the die D is positioned and its surface inspected based on the image data acquired by the imaging. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder 1 is calculated and the die D is positioned. The die position reference point is set in advance to a predetermined position on the wafer holder 12 as the initial setting of the device. By processing the image data, the surface inspection of the die D is performed.

[0028] The positioned die D is peeled from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D, peeled from the dicing tape DT, is attracted and held by the collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0029] The die D on the intermediate stage 31 is imaged by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired through imaging. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1 is calculated, and positioning is performed. The die position reference point is a predetermined position on the intermediate stage 31, which is held as the initial setting of the device. The surface inspection of the die D is performed by processing the image data.

[0030] The pickup head 21, which has transported die D to the intermediate stage 31, is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, die D is peeled off one by one from the dicing tape DT following the same procedure.

[0031] (Bonding process: process S4) The substrate S is transported to the bonding stage 46 by the transport unit 50. The substrate S placed on the bonding stage 46 is imaged by the substrate recognition camera 44, and image data is acquired through imaging. The amount of displacement of the substrate S from the substrate position reference point of the die bonder 1 (in the X, Y, and θ directions) is calculated by image processing of the image data. The substrate position reference point is a predetermined position of the bonding unit 40, which is held in advance as the initial setting of the device.

[0032] In step S3, the suction position of the bond head 41 is corrected based on the amount of displacement of the die D on the intermediate stage 31 calculated, and the die D is picked up by the collet 42. The die D is bonded to a predetermined location on the substrate S supported by the bond stage 46 by the bond head 41, which has picked up the die D from the intermediate stage 31. The die D bonded to the substrate S is imaged by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by the image to determine whether the die D has been bonded to the desired position (relative position inspection of die D and substrate S), etc.

[0033] The bond head 41, which has bonded die D to substrate S, is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to substrate S. This is repeated until die D is bonded to all package areas P of substrate S.

[0034] (Substrate unloading process: process S5) The substrate S to which the die D has been bonded is transported from the bonding section 40 to the substrate unloading section 70 by the transport section 50. In the substrate unloading section 70, the substrate S is removed and stored in a transport jig (not shown) and the substrate S is unloaded. The transport jig (not shown) containing the substrate S is unloaded from the die bonder 1.

[0035] As described above, die D is mounted on substrate S and discharged from die bonder 1. Subsequently, for example, the transport jig containing substrate S with die D mounted on it is transported to the wire bonding process, where the electrodes of die D are electrically connected to the electrodes of substrate S via Au wire or the like. Then, substrate S is transported to the molding process, where die D and Au wire are sealed with molding resin (not shown), thereby completing the semiconductor package.

[0036] However, the substrate S in the bonding process of step S4 described above may have undergone deformation, i.e., warping, distortion, or dimensional (size) changes, due to the previous heating process or stress from the die bonding. Therefore, a holding method that can accommodate this substrate deformation is required for accurate bonding of the picked-up die D to the substrate S. Hereafter, we will explain the holding mechanism and method for the substrate S, using warping, one of these deformations, as an example.

[0037] The clamp drive mechanism and substrate holding method of the embodiment will be described. Figure 4 is a schematic diagram of the clamp drive mechanism in the dashed line area B in Figure 1, viewed from above. Figure 5 is a diagram illustrating the schematic configuration as viewed from the direction of arrow C in Figure 4. Figure 6 is a diagram illustrating the state when the substrate is clamped in Figure 5.

[0038] Figures 4 and 5 show the clamping mechanism on the bond stage 46 corresponding to bonding on the substrate SA where this warping is occurring. In particular, the clamping drive mechanism is shown as area E.

[0039] The chute 52 for transporting the substrate SA consists of a front chute 201a, which is one of a pair of chutes 52 located on the Y2 side of the front of the die bonder 1, and a rear chute 201b, which is the other of a pair of chutes 52 located on the Y1 side of the rear of the device. The clamping components that move downward in the Z2 direction on the bond stage 46 and press against the substrate SA consist of a first clamping component, a front clamper 203a on the Y2 side, and a second clamping component, a rear clamper 203b on the Y1 side. These two clamping components are provided approximately perpendicular to the substrate SA and are located near the front chute 201a and the rear chute 201b, respectively.

[0040] Furthermore, these clampers are configured to press against the edges of the substrate SA, i.e., outside the bonding area, so as not to affect the bonding area during the bonding process described above.

[0041] Furthermore, the vertical drive components that move each clamp up and down consist of a first vertical drive component, a front vertical driven component 204a on the Y2 side, and a second vertical drive component, a rear vertical drive component 204b on the Y1 side. The front vertical driven component 204a and the rear vertical drive component 204b are attached to the front chute 201a and the rear chute 201b, respectively, via linear guides 208a and 208b.

[0042] Furthermore, the front up-and-down driven component 204a and the rear up-and-down drive component 204b are connected to the shaft 202, and the rear up-and-down drive component 204b is connected to the shaft 202 via a bearing (not shown).

[0043] The vertical movement of the front clamper 203a and rear clamper 203b is performed by an actuator 205, which is a drive device, such as a motor or various cylinders. The operation by the actuator 205 is transmitted via a cam 206 and a cam follower 207 to the front vertical driven component 204a and the rear vertical drive component 204b, and converted into vertical movement of the front clamper 203a and rear clamper 203b.

[0044] With this structure, the shaft 202 connecting the front upper and lower driven parts 204a and the rear upper and lower driving parts 204b can synchronize the vertical movements of the front clamper 203a and the rear clamper 203b. As a result, as shown in FIG. 6, both ends of the warped substrate SA can be simultaneously moved downward in the Z2 direction and clamped, and can be placed on the bonding stage 46. With this synchronization operation and pressing, it becomes possible to reduce the deformation of the substrate SA on the bonding stage 46, and the operating rate of the device can be improved.

[0045] Needless to say, it is also possible to provide the clamp drive mechanism in the area E on the front clamper 203a on the Y2 side of the front of the device.

[0046] Next, when the substrate sizes are different, specifically when the widths of the substrates are different, the clamp drive mechanism for moving the chute 52, which is a countermeasure method, will be described using FIGS. 7 to 9. FIG. 7 is a diagram for explaining the moving mechanism of the chute for changing the width of the substrate in the embodiment. FIG. 8 is a diagram for explaining the schematic configuration of the clamp drive mechanism when the width of the substrate in the embodiment is small. FIG. 9 is a diagram for explaining the schematic configuration of the clamp drive mechanism when the width of the substrate in the embodiment is large.

[0047] The drive mechanism for the movement in the Y-axis direction, which is substantially perpendicular to the width direction of the substrate SA, that is, the conveyance direction of the substrate SA, at the lower part of the above-described rear chute २०१b is shown as area F. It is composed of an actuator 304 as a drive device, a ball screw 303 and a nut 302 that actually perform the movement operation in the Y-axis direction, a stage 301 that transmits the movement operation to the rear clamper 203b, and a rear chute holding table 305.

[0048] The ball screw 303 and the nut 302 convert the rotational motion of the actuator 304, for example, a motor, into a linear motion. By the balls between the shaft of the ball screw 303 and the nut 302 rolling and circulating, the stage 301 at the upper part can be moved in the Y-axis direction with a lighter propulsive force. The power transmitted through the stage 301 and the rear chute holding table 305 existing above the stage moves the rear chute 201b in the Y-axis direction.

[0049] At this time, the clamp drive mechanism in area E moves together with the drive mechanism in area F. Then, in conjunction with the width of the front chute 201a and the rear chute 201b, the width of the front clamper 203a and the rear clamper 203b also changes in the Y-axis direction.

[0050] Furthermore, this drive mechanism can, of course, be installed at the bottom of the front chute 201a on the Y2 side of the front of the device described above, to accommodate substrates of different widths.

[0051] Figure 8 shows the state of area E, which is the clamp drive mechanism, in the case of a narrow substrate SS, and Figure 9 shows the state in the case of a wide substrate SL. In Figure 8, the entire area E moves in the Y2 direction and corresponds to the narrow substrate SS and the bond stage 47. On the other hand, in Figure 9, it moves in the Y1 direction and corresponds to the wide substrate SL and the bond stage 48.

[0052] Note that Figures 8 and 9 illustrate the movement of the rear chute 201b and rear clamper 203b in cases of varying substrate widths; therefore, the depiction of the actual clamped state and the depiction of the Y-axis movement mechanism of area E described above, as shown in Figure 6, are omitted.

[0053] As shown in Figure 7, the Y-axis movable stage 301 allows the rear chute 201b and rear clamper 203b to be moved without replacing parts of the clamp drive mechanism, even when the width of the substrate is changed. Furthermore, the front clamper 203a and rear clamper 203b shown in Figures 8 and 9 can accommodate changes in substrate warping due to changes in substrate width, thereby reducing warping and improving the operating rate of the device.

[0054] The bond stages 46, 47, and 48 are replaced by the operator before transport, according to the width of each substrate. After replacement, the rear chute 201b is moved to the set width by the Y-axis movement mechanism of area F. This Y-axis movement of the rear chute 201b may be performed automatically by the control unit 80, which has been pre-programmed with set values, or it may be adjusted manually by the operator, for example, while observing the monitor 83d of the die bonder 1.

[0055] The chute 52, bond stage 46, front clamper 203a, and rear clamper 203b constitute a substrate holding device.

[0056] According to this embodiment, at least one of the following effects is achieved.

[0057] The clamper can be moved in the width direction of the substrate by a drive mechanism for movement in the Y-axis direction, which is approximately perpendicular to the substrate transport direction, thus accommodating changes in the substrate width.

[0058] It can clamp both ends of circuit boards of various widths without replacing any parts in the clamp drive mechanism.

[0059] Since the clamp drive mechanism does not require parts replacement, the time required for operating the device can be reduced, leading to improved productivity and utilization rates.

[0060] By synchronizing the clamping action at both ends, a substrate that is deformed due to warping or other reasons can be securely placed on the bonding stage.

[0061] Since clamping is performed in the areas at both ends of the substrate, the impact of the mechanical action of clamping on the bond area can be minimized.

[0062] Next, as another embodiment, a method in which the shaft 202 is not used by controlling the control unit 80 will be described. Figure 10 is a diagram illustrating a schematic configuration of the clamping mechanism in another embodiment.

[0063] Figure 10 shows the clamp drive mechanisms for areas G1 and G2 on the front and rear sides of the device, respectively. Note that explanations of areas other than the clamp drive mechanisms shown in areas G1 and G2 are the same as in the embodiment and are therefore omitted.

[0064] In area G1 on the front of the device, the actuator 501, which is a drive device, transmits the operation of, for example, a motor or various cylinders to the front vertical driven component 204a via a cam 502 and a cam follower 503, and converts it into vertical movement of the front clamper 203a. Similarly, in area G2 on the rear side of the device, the actuator 504, which is a drive device, transmits the operation of, for example, a motor or various cylinders to the rear vertical drive component 204b via a cam 505 and a cam follower 506, and converts it into vertical movement of the rear clamper 203b.

[0065] Here, the control unit 80 can synchronize the operation of actuator 501 and actuator 504, as well as the operation of the front up-and-down driven component 204a and the rear up-and-down driven component 204b, thereby synchronizing the up-and-down movement of the front clamper 203a and the rear clamper 203b in the Z-axis direction.

[0066] By providing vertical drive components in both area G1 and area G2 in this way, it becomes possible to reduce the deformation of the substrate SA, which is warped in the Y-axis direction, in a symmetrical manner without using the shaft 202, thereby improving the operating rate of the device.

[0067] The same effects as those in the embodiments described above can be obtained in the other embodiments described above as well.

[0068] It can clamp both ends of circuit boards of various widths without replacing any parts in the clamping mechanism.

[0069] Since no parts are replaced in either of the two clamping mechanisms, it is possible to reduce the time required for operating the equipment, thereby improving the productivity and operating rate of the equipment.

[0070] In addition, in other embodiments as well, the chute movement mechanism for area F, which changes the width of the substrate as described above in Figure 7, can be provided at the bottom of each clamp drive mechanism, and it goes without saying that this will allow for adaptation to changes in the width of the substrate.

[0071] As described above, in the embodiment and other embodiments, the vertical movement of the front clamper 203a and the rear clamper 203b is synchronized using a clamping mechanism. However, if, for example, a suction hole is provided in the bond stage and the substrate can be first attracted to the raised bond stage, it is possible to more effectively reduce the effect of warping of the substrate on the bond stage. In this case, since the substrate can be fixed on the bond stage, the downward movement of the front clamper 203a and the rear clamper 203b can be driven with a time difference rather than synchronously.

[0072] The actuator and cam may be a ball screw actuator, solenoid, or voice coil motor.

[0073] Furthermore, the shaft and bearing combination structure may be changed to a structure in which the shaft is sandwiched between cam followers.

[0074] The disclosures made by the Disclosers have been described in detail above based on the embodiments and other embodiments, but it goes without saying that the disclosures are not limited to the embodiments and other embodiments described above and are subject to various modifications.

[0075] In the other embodiments described above, the same effects as in the embodiments are achieved, namely, it becomes possible to hold down the peripheral edge of the substrate in accordance with various substrate sizes.

[0076] In the embodiment, an example using a die attach film (DAF) was described, but a preform section for applying adhesive to the substrate may be provided instead of using a DAF. The preform section includes a preform head for applying paste-like adhesive, a preform table for driving the preform head in the vertical and horizontal directions, and a preform stage for holding the substrate.

[0077] In this embodiment, an intermediate stage section 30 is provided between the pickup section 20 and the bonding section 40. The die D picked up from the pickup section 20 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, the die D picked up from the pickup section 20 by the bond head 41 may be bonded to the substrate S.

[0078] Furthermore, although the embodiment includes one pickup head 21 and one bond head 41, there may be two or more of each. Also, although the embodiment includes an intermediate stage 31, the intermediate stage 31 may be omitted.

[0079] In this embodiment, bonding is performed with the surface of die D facing upwards, but after picking up die D, the die D may be flipped over and bonded with the back surface facing upwards. This device is called a flip-chip bonder.

[0080] In this embodiment, a die bonder was used as an example, but it can also be applied to semiconductor manufacturing equipment that places picked-up dies onto a tray.

[0081] Furthermore, although a semiconductor manufacturing apparatus was described in the embodiment, it can also be applied to mounting apparatus for mounting electronic components onto printed circuit boards.

[0082] 1... Die bonder (semiconductor manufacturing equipment) 46... Bond stage (mounting section) 52... Conveyor lane (chute) 203a... Front clamper (first clamping component) 203b... Rear clamper (second clamping component)

Claims

1. A semiconductor manufacturing apparatus comprising: a pair of chutes for transporting substrates; a mounting section for supporting the substrates from below; a first clamping component provided near one of the pair of chutes, which moves downward to press the substrate against the mounting section; and a second clamping component provided near the other of the pair of chutes, which is movable in the width direction of the substrate substantially perpendicular to the transport direction of the substrate, and which moves downward to press the substrate against the mounting section.

2. A semiconductor manufacturing apparatus according to claim 1, further comprising: a first vertical drive component for moving the first clamp component up and down; a second vertical drive component for moving the second clamp component up and down; and a shaft connecting the first vertical drive component and the second vertical drive component.

3. A semiconductor manufacturing apparatus according to claim 2, further comprising a stage attached to at least one of the pair of chutes, for moving at least one of the first clamp component and the second clamp component in the width direction of the substrate.

4. The semiconductor manufacturing apparatus according to claim 2, further comprising the first clamp component and the second clamp component moving up and down in synchronous manner.

5. A semiconductor manufacturing apparatus according to claim 2, wherein the first vertical drive component is attached to one of the pair of chutes via a linear guide, and the second vertical drive component is attached to the other of the pair of chutes via a linear guide.

6. A semiconductor manufacturing apparatus according to claim 5, wherein at least one of the first vertical drive component and the second vertical drive component is connected to the shaft via a bearing.

7. A semiconductor manufacturing apparatus according to claim 6, further comprising an actuator connected via a cam to at least one of the first vertical drive component and the second vertical drive component.

8. A substrate holding device comprising: a pair of chutes for transporting substrates; a mounting section for supporting the substrates from below; a first clamping component provided near one of the pair of chutes, which moves downward to press the substrate against the mounting section; and a second clamping component provided near the other of the pair of chutes, which is movable in the width direction of the substrate substantially perpendicular to the transport direction of the substrate, and which moves downward to press the substrate against the mounting section.

9. A substrate holding device according to claim 8, further comprising: a first vertical drive component for moving the first clamp component up and down; a second vertical drive component for moving the second clamp component up and down; and a shaft connecting the first vertical drive component and the second vertical drive component.

10. A substrate holding device according to claim 9, further comprising a stage attached to at least one of the pair of chutes, for moving at least one of the first clamp component and the second clamp component in the width direction of the substrate.

11. A substrate holding device according to claim 9, further comprising the first clamp component and the second clamp component moving up and down in synchronous manner.

12. A substrate holding device comprising: a pair of chutes for transporting substrates; a mounting section for supporting the substrates from below; a first clamp component provided near one of the pair of chutes and pressing the substrate onto the mounting section by moving downward; and a second clamp component provided near the other of the pair of chutes, movable in the width direction of the substrate substantially perpendicular to the transport direction of the substrate, and pressing the substrate onto the mounting section by moving downward, wherein the substrate holding method includes the step of attaching at least one of the pair of chutes and moving the first clamp component and at least one of the second clamp component in the width direction of the substrate.

13. A substrate holding method according to claim 12, further comprising the step of synchronizing the vertical movement of the first clamp component and the second clamp component.

14. A method for manufacturing a semiconductor device, comprising the substrate holding method of claim 12.

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