Optical package

Abstract

The present invention is capable of mounting a transparent member while eliminating the need for a guide groove on the outer peripheral surface of the side wall of an optical package.　This optical package is provided with: a substrate in which a cavity is formed; a frame positioned around the cavity and disposed on the substrate; a groove formed in a lateral direction in an inner wall surface of the frame; and an opening formed in a side surface of the frame so as to communicate with the groove. The optical package may include a transparent member inserted into the groove so as to be positioned on the cavity. The optical package may include an optical element mounted on the substrate so as to be located in the cavity.

Description

Optical Package

[0001] This technology relates to an optical package. Specifically, this technology relates to a non-hermetic optical package.

[0002] In an optical package, in order to prevent the intrusion of foreign matter such as dust, it may be hermetically sealed. For example, a semiconductor device has been proposed that shields a recess of a package and includes a detachable lid attached to the upper surface of a side wall (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2005-5614

[0004] However, in the above-mentioned conventional technology, since a guide groove for slidingly attaching a lid to which a glass plate is attached to the package is formed on the outer peripheral surface of the side wall of the package, there is a risk of complicating the configuration of the package.

[0005] This technology has been created in view of such a situation, and an object thereof is to enable a transparent member to be attached while eliminating the guide groove on the outer peripheral surface of the side wall of the optical package.

[0006] This technology has been made to solve the above-mentioned problems, and a first aspect thereof is an optical package including a substrate, a frame disposed on the substrate, a groove formed horizontally on an inner wall surface of the frame, and an opening formed on a side surface of the frame so as to communicate with the groove. Thereby, it brings about an effect that a transparent member is attached to the optical package based on sliding insertion into the groove through the opening.

[0007] Also, in the first aspect, an injection portion may be provided on a surface of the frame and capable of injecting resin into the frame. Thereby, it brings about an effect that resin is injected from above the frame.

[0008] Also, in the first aspect, a transparent member inserted into the groove may be provided. Thereby, it brings about an effect that the dust-proof property of the optical package is ensured based on sliding insertion of the transparent member into the groove.

[0009] Furthermore, the first side may have a gap between the transparent member and the groove. This ensures that the transparent member is mounted on the optical package while maintaining the airtightness of the optical package.

[0010] Furthermore, the first side may be provided with an adhesive that is placed in a part of the gap and adheres the transparent member to the frame. This ensures that the transparent member is fixed to the optical package while maintaining the airtightness of the optical package.

[0011] Furthermore, in the first aspect, the transparent member may be arranged asymmetrically with respect to the substrate. This results in the formation of an opening on the side of the frame while improving the dustproof properties of the optical package.

[0012] Furthermore, in the first aspect, the optical element may be mounted on the substrate so as to be located within the frame. This ensures the optical properties of the optical element while mounting the optical element in an optical package.

[0013] Furthermore, the first side surface may be provided with a sealing material positioned to close the opening. This allows the transparent member to slide into the groove through the opening, while preventing the transparent member from coming out of the groove.

[0014] Furthermore, in the first aspect, the frame may be separable vertically at the position of the groove. This allows for the formation of a groove laterally on the inner wall surface of the frame while suppressing the complexity of the manufacturing process.

[0015] Furthermore, in the first aspect, the frame may be provided with a fitting portion that allows the upper and lower frames, which are separated vertically, to be fitted together. This has the effect of facilitating the attachment and detachment of the transparent member to the inside of the frame.

[0016] Furthermore, in the first aspect, the frame may be provided with fastening parts that can fasten the upper frame and the lower frame, which are separated vertically, together. This has the effect of facilitating the attachment and detachment of the transparent member from the optical package.

[0017] Furthermore, in the first aspect, the frame may be rectangular in shape with four inner wall surfaces. This results in the planar shape of the optical package being rectangular.

[0018] Furthermore, in the first aspect, the groove may be provided on three of the four inner wall surfaces, and the opening may be provided on one of the inner wall surfaces other than the three. This allows for the sliding insertion of the transparent member into the groove through the opening, while improving the holding ability of the transparent member inserted into the groove.

[0019] Furthermore, on the first side, the portion of the frame above the groove may extend horizontally inward relative to the portion below the groove. This allows for sliding insertion into the groove through the opening while improving the dustproof properties of the optical package.

[0020] Furthermore, in the first aspect, the material of the frame may be ceramic or resin. This allows for the frame to be manufactured while appropriately selecting strength and workability.

[0021] Furthermore, the second aspect is an optical package comprising a substrate, a lower frame disposed on the substrate, an upper frame disposed on the lower frame, a transparent member joined to a position that closes the inside of the upper frame, and fastening parts disposed around the transparent member that fasten the lower frame and the upper frame together. This ensures that the transparent member can be attached to the optical package while also ensuring that the transparent member can be attached to the optical package.

[0022] Furthermore, in a second aspect, the fastening portion may be provided with screw holes in the lower frame and the upper frame, respectively. This allows the transparent member to be attached and detached by inserting or removing the screws.

[0023] Furthermore, the second side may include a housing that can fasten the lower frame and the upper frame together via the screw holes. This allows the transparent member and the optical package to be attached and detached by inserting or removing screws.

[0024] Furthermore, in the second aspect, a lens supported on the transparent member via the housing may be provided. This results in the effect that light incident through the optical package is focused through the lens.

[0025] Furthermore, in a second aspect, the upper frame may have a joining surface that is joined to the periphery of the upper or lower surface of the transparent member. This provides the effect of supporting the transparent member with the upper frame.

[0026] This is a cross-sectional view showing an example of the configuration of an optical package according to the first embodiment. This is a perspective view showing an example of the configuration of an optical package according to the first embodiment. This is a cross-sectional view showing an example of the manufacturing method of an optical package according to the first embodiment. This is a cross-sectional view showing an example of the manufacturing method of an optical package according to the first embodiment. This is a cross-sectional view showing an example of the configuration of an optical package according to the second embodiment. This is a cross-sectional view showing an example of the configuration of an optical package according to the third embodiment. This is a perspective view showing an example of the configuration of an optical package according to the fourth embodiment. This is a plan view showing an example of the configuration of an optical package according to the fifth embodiment. This is a cross-sectional view showing an example of the configuration of an optical package according to the fifth embodiment. This is a plan view showing an example of the configuration of an optical package according to the sixth embodiment. This is a cross-sectional view showing an example of the configuration of an optical package according to the sixth embodiment. This is a cross-sectional view showing an example of the manufacturing method of an optical package according to the sixth embodiment. This is a plan view showing an example of the configuration of an optical package according to the seventh embodiment. This is a cross-sectional view showing an example of the manufacturing method of an optical package according to the seventh embodiment. This is a cross-sectional view showing an example of the manufacturing method of an optical package according to the seventh embodiment. This is a plan view showing an example of the configuration of an optical package according to the eighth embodiment. This is a cross-sectional view showing an example of the configuration of an optical package according to the eighth embodiment. This is a cross-sectional view showing an example of the mounting of an optical package according to the eighth embodiment. This is a block diagram showing a schematic example of the configuration of a vehicle control system. This is an explanatory diagram showing an example of the installation location of the imaging unit.

[0027] The following describes embodiments for implementing this technology (hereinafter referred to as embodiments). The description will be in the following order: 1. First embodiment (an example in which a frame in which a transparent member is inserted into a groove formed laterally on the inner wall surface is mounted on a substrate in which an optical chip is face-up mounted) 2. Second embodiment (an example in which a frame in which a transparent member is inserted into a groove formed laterally on the inner wall surface is mounted on a substrate in which an optical chip is face-up mounted, and the transparent member is asymmetrically arranged with respect to the substrate) 3. Third embodiment (an example in which a frame in which a transparent member is inserted into a groove formed laterally on the inner wall surface is mounted on a substrate in which an optical chip is floppy-chip mounted) 4. Fourth embodiment (an example in which the upper and lower parts of a frame that can be separated vertically at the position of a groove formed laterally on the inner wall surface are made interlockable) 5. Fifth embodiment (an example in which a resin injection part is provided on the surface of a frame into which a transparent substrate is inserted from the side) 6. 7. Seventh Embodiment (An example in which the frame into which the transparent substrate is inserted from the side is composed of a lower frame and an upper frame, and the lower frame and the upper frame can be fastened together) 8. Eighth Embodiment (An example in which the upper frame that supports the transparent substrate on the top or bottom surface can be fastened to the lower frame, while the upper frame and the lower frame can be fastened to the housing) 9. Application Examples to Mobile Devices

[0028] <1. First Embodiment> Figure 1 is a cross-sectional view showing an example of the configuration of an optical package according to the first embodiment, and Figure 2 is a perspective view showing an example of the configuration of an optical package according to the first embodiment. In Figure 2, the canopy 136 in Figure 1 is omitted in order to make the groove 131 formed laterally on the inner wall surface 133 of the frame 125 easier to see. Also, Figure 2 shows the process of sliding the transparent substrate 124 into the frame 125.

[0029] In the figure, the optical package 100 comprises a mounting substrate 121, a chip 111, bonding wires 116, a transparent substrate 124, and a frame 125. In this case, the optical package 100 can constitute a hollow package on which the chip 111 is mounted. This hollow package is not airtight. The mounting substrate 121 is an example of a substrate described in the claims. The transparent substrate 124 is an example of a transparent member described in the claims.

[0030] A chip 111 is mounted on the mounting substrate 121. The mounting substrate 121 may be a BGA (Ball Grid Array), a PGA (Pin Grid Array), or an LGA (Land Grid Array). The base material of the mounting substrate 121 may be, for example, ceramic or resin. Bonding pads 122 and land electrodes 123 are formed on the mounting substrate 121. Wirings and vias may be formed on the mounting substrate 121. The bonding pads 122 are placed on the surface of the mounting substrate 121. In this case, the bonding pads 122 can be placed along all four sides of the mounting substrate 121. Bonding wires 116 can be connected to the bonding pads 122. The land electrodes 123 are placed on the back surface of the mounting substrate 121. External terminals such as solder balls can be connected to the land electrodes 123.

[0031] The chip 111 is mounted face up on the mounting substrate 121. The chip 111 can be bonded to the mounting substrate 121 via a die bond material 128. The die bond material 128 may be a paste material such as Ag paste, or a solder material such as Sn.

[0032] The chip 111 is connected to the mounting substrate 121 via a bonding wire 116. At this time, a pad electrode 113 to which the bonding wire 116 is connected can be formed on the chip 111. The bonding wire 116 can be made of a metal such as Au or Al.

[0033] The chip 111 may have semiconductor elements, optical elements, or MEMS (Micro Electro Mechanical Systems) formed on it. The substrate used for the chip 111 may be a semiconductor substrate, a dielectric substrate, or an organic substrate.

[0034] The light-receiving element may be an image sensor such as a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal-Oxide Semiconductor) sensor, or an event-based vision sensor. The light received by the image sensor may be visible light, near-infrared (NIR), short-wavelength infrared (SWIR), ultraviolet light, or X-rays. The optical element may be a light-receiving element such as a PD (Photo Diode), or a light-emitting element such as an LD (Laser Diode), LED (Light Emitting Diode), or VCSEL (Vertical Cavity Surface Emitting Laser). The optical element may also be an optical switch or a DMD (Digital Micromirror Device). The optical element may also be a display element such as a liquid crystal element or an organic EL (Electro Luminescence) element. The material used for the optical element may be a semiconductor such as Si, GaAs, InGaAs, or LiNbO ３ It may also be a dielectric such as glass or transparent resin.

[0035] Semiconductor elements may include ICs (Integrated Circuits), transistors, resistors, capacitors, etc. A memory, processor, signal processing circuit, data processing circuit, or interface circuit may be formed as a semiconductor element. Hardware circuits such as FPGAs (Field-Programmable Gate Arrays) or ASICs (Application Specific Integrated Circuits) may also be formed as semiconductor elements. The materials used for semiconductor elements may include Si, GaAs, SiC, GaN, InGaAs, InP, or InGaAsP.

[0036] For example, a CMOS image sensor can be formed on the chip 111. In this case, the chip 111 is provided with a light-receiving region 112. Pixels and pixel transistors are arranged in a matrix along the row and column directions in the light-receiving region 112. Pixels may have photodiodes or SPADs (Single Photon Avalanche Diodes). A color filter 114 is formed on the light-receiving region 112 for each pixel. An on-chip lens 115 is formed on the color filter 114 for each pixel. The material for the color filter 114 and the on-chip lens 115 is, for example, SiO ２ Insulating films such as SiN and SiCN, or transparent resins such as acrylic or polycarbonate can be used. The color filter 114 may contain pigments. The color filter 114 may, for example, form a Bayer array or a quad Bayer array. The color filter 114 may include an RGB filter, a complementary color filter, or a white filter. A lens, color splitter, or deflector made of a metasurface may be formed on the light-receiving area 112.

[0037] The frame 125 can support the transparent substrate 124 on the chip 111. The frame 125 can be arranged continuously along the outer circumference of the mounting substrate 121. In this case, the frame 125 can be located outside the bonding pad 122.

[0038] The frame 125 includes an opening 130 and a groove 131. The groove 131 is formed laterally on the inner wall surface 133 of the frame 125, as shown in Figure 2. The end of the transparent substrate 124 can be slid into the groove 131. The dimensions of the groove 131 can be set so that a gap 132 is created when the transparent substrate 124 is inserted into the groove 131. This gap 132 prevents foreign matter such as dust from entering the inside of the optical package 100 from the outside, while forming an air passage between the inside and outside of the optical package 100. The opening 130 is formed on the side surface of the frame 125 so as to communicate with the groove 131. The part of the frame 125 above the groove 131 may extend horizontally inwards relative to the part below the groove 131.

[0039] The frame 125 may be rectangular in shape and have four inner wall surfaces 133. In this case, the groove 131 can be provided on three of the four inner wall surfaces 133. The opening 130 can be provided on one of the inner wall surfaces 133 other than the three inner wall surfaces 133 on which the groove 131 is formed. In this case, as shown in Figures 2a to c, the transparent substrate 124 can be inserted into the groove 131 through the opening 130 and mounted on the frame 125.

[0040] The frame 125 may include an upper frame 127 and a lower frame 126. At this time, the upper frame 127 and the lower frame 126 may be separable at the position of the groove 131 or may be integrated. Awnings 136 can be provided on the upper frame 127. The awnings 136 are located around the transparent substrate 124 above the groove 131. The ends of the awnings 136 on the transparent substrate 124 can be located outside the light receiving area 112. Here, by providing the awnings 136 on the upper frame 127, the distance between the inside and the outside of the optical package 100 through the gap 132 can be increased without hindering the incidence of light to the light receiving area 112. Therefore, while preventing foreign matters such as dust from entering the inside of the optical package 100 from the outside, the non-airtightness of the optical package 100 can be achieved.

[0041] The material of the frame 125 may be an inorganic material such as ceramic, or a resin such as a thermosetting resin or an ultraviolet curable resin. For example, as the material of the frame 125, resins such as siloxane-based resins, acrylic-based resins, and epoxy-based resins can be used. In order to improve the reliability, the frame 125 may contain fillers made of inorganic or organic substances. The filler material may be glass. The frame 125 may be blackened in order to reduce flares or the like on the light receiving area 112. For example, the frame 125 may contain a black pigment such as carbon black, or may contain a filler such as carbon fiber.

[0042] The transparent substrate 124 is disposed on the chip 111. At this time, the transparent substrate 124 is supported on the mounting substrate 121 via the frame 125. The transparent substrate 124 may be a glass substrate, a quartz substrate, or a transparent resin substrate such as acrylic or polycarbonate. The transparent substrate 124 may use Al ２ O ３ , CaF ２ , MgF ２ or LiF or the like.

[0043] The sealing material 129 seals the opening 130. The sealing material 129 can be adhered to one side surface of the transparent substrate 124. At this time, the sealing material 129 can prevent the transparent substrate 124 from coming out of the frame 125 through the opening 130. The material of the sealing material 129 may be a thermosetting resin or an ultraviolet curable resin. For example, as the material of the sealing material 129, resins such as silicone-based resins, siloxane-based resins, acrylic-based resins, and epoxy-based resins can be used. The sealing material 129 may be blackened in order to reduce flare or the like on the light receiving region 112.

[0044] In addition, in order to improve the fixing strength of the transparent substrate 124 to the frame 125, a part of the transparent substrate 124 may be adhered to the frame 125 via an adhesive. Thereby, damage to the transparent substrate 124 when the optical package 100 drops can be prevented, and wobbling of the transparent substrate 124 can be prevented.

[0045] FIGS. 3 and 4 are cross-sectional views showing an example of a method for manufacturing an optical package according to the first embodiment.

[0046] In a of FIG. 3, the upper frame 127 and the lower frame 126 are aligned. At this time, the upper frame 127 and the lower frame 126 can be arranged at positions where the upper frame 127 overlaps the lower frame 126.

[0047] Next, as shown in b of FIG. 3, the upper frame 127 and the lower frame 126 are joined to form the frame 125. An adhesive may be used for joining the upper frame 127 and the lower frame 126. At this time, the groove 131 and the opening 130 are formed in the frame 125.

[0048] Next, as shown in c of FIG. 3, the transparent substrate 124 is slid inserted into the groove 131 through the opening 130.

[0049] Next, as shown in a of FIG. 4, the opening 130 is sealed with the sealing material 129. At this time, the sealing material 129 can be adhered to one side surface of the transparent substrate 124.

[0050] Next, as shown in Figure 4b, adhesive 135 is applied to the bonding positions of the frame 125 around the mounting substrate 121. Then, as shown in Figure 1, the lower surface of the frame 125 is bonded to the mounting substrate 121 via the adhesive 135 to form the optical package 100.

[0051] As described above, in the first embodiment, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally on the inner wall surface 133 is mounted on a mounting substrate 121 on which the chip 111 is face-up mounted. This prevents foreign matter such as dust from entering the inside of the optical package 100, while making the optical package 100 airtight, thereby improving the reliability of the optical package 100. For example, it is possible to prevent condensation caused by temperature differences between the inside and outside of the optical package 100, and to reduce the effects of cracks and peeling at the sealing points of the transparent substrate 124.

[0052] <2. Second Embodiment> In the first embodiment described above, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally in the inner wall surface 133 is mounted on a mounting substrate 121 on which the chip 111 is face-up mounted. In this second embodiment, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally in the inner wall surface 133 is mounted on a mounting substrate 121 on which the chip 111 is face-up mounted, and the transparent substrate 124 is positioned asymmetrically with respect to the mounting substrate 121.

[0053] Figure 5 is a cross-sectional view showing an example of the configuration of an optical package according to the second embodiment.

[0054] In the figure, the optical package 200 includes a mounting substrate 221 instead of the mounting substrate 121 of the first embodiment described above. The other configurations of the optical package 200 of the second embodiment are the same as those of the optical package 100 of the first embodiment described above.

[0055] The chip 111 is mounted face-up on the mounting substrate 221. A frame 125 with a transparent substrate 124 inserted is also mounted on the mounting substrate 221. In this case, the central position C1 of the mounting substrate 221 and the central position C2 of the transparent substrate 124 can be laterally offset from each other. For example, the transparent substrate 124 may be laterally offset from the chip 111.

[0056] As described above, in the second embodiment, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally in the inner wall surface 133 is mounted on a mounting substrate 121 on which a chip 111 is face-up mounted, and the transparent substrate 124 is positioned asymmetrically with respect to the mounting substrate 121. This makes it possible to adjust the position of the end of the transparent substrate 124 on the opening 130 side, and to optimize the amount of sealing material 129 inserted into the opening 130.

[0057] <3. Third Embodiment> In the first embodiment described above, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally in the inner wall surface 133 is mounted on a mounting substrate 121 on which a chip 111 is face-up mounted. In this third embodiment, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally in the inner wall surface 133 is mounted on a mounting substrate on which a chip is flip-chip mounted.

[0058] Figure 6 is a cross-sectional view showing an example of the configuration of an optical package according to the third embodiment.

[0059] In the figure, the optical package 300 includes a chip 311 and a mounting substrate 321 instead of the chip 111 and mounting substrate 121 of the first embodiment described above. The other configurations of the optical package 300 of the third embodiment are the same as those of the optical package 100 of the first embodiment described above.

[0060] A chip 311 is mounted on the mounting substrate 321. A land electrode 316 is formed on the front surface of the mounting substrate 321. A land electrode 323 is formed on the back surface of the mounting substrate 321. Wiring and vias may be formed on the mounting substrate 321. The other configurations of the mounting substrate 321 in the third embodiment are the same as those of the mounting substrate 121 in the first embodiment described above.

[0061] The chip 311 is mounted face-down on the mounting substrate 321. In this case, the chip 311 may also be flip-chip mounted on the mounting substrate 321. For example, a back-illuminated image sensor can be formed on the chip 311. In this case, a light-receiving region 112 is formed on the back side of the chip 311. A color filter 114 and an on-chip lens 115 are formed on the light-receiving region 112 for each pixel. In this case, the transparent substrate 124 is supported on the back side of the chip 311 via a frame 125. A wiring layer is formed on the front side of the chip 311. Land electrodes 313 are formed on the wiring layer on the front side of the chip 311. In this case, the chip 311 can be flip-chip mounted on the mounting substrate 321 by connecting the land electrodes 313 and 316 via solder balls 322. Through electrodes or through vias may be formed on the chip 311 to connect the light-receiving region 112 on the back side of the chip 311 and the wiring layer on the front side of the chip 311.

[0062] As described above, in the third embodiment, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally on the inner wall surface 133 is mounted on a mounting substrate 321 on which the chip 311 is flip-chip mounted. This makes it possible to make the optical package 300 airtight while preventing foreign matter such as dust from entering the inside of the optical package 300, and to reduce the mounting area of ​​the optical package 300 while maintaining the planar size of the chip 311.

[0063] <4. Fourth Embodiment> In the first embodiment described above, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally on the inner wall surface 133 is mounted on a mounting substrate 121 on which a chip 111 is face-up mounted. In this fourth embodiment, the upper and lower parts of a frame that can be separated vertically at the position of the groove formed laterally on the inner wall surface can be fitted together.

[0064] Figure 7 is a perspective view showing an example of the configuration of an optical package according to the fourth embodiment. Note that in this figure, only a portion of the optical package 400 is shown.

[0065] In the figure, the optical package 400 includes a frame 425 instead of the frame 125 of the first embodiment described above. The other configurations of the optical package 400 of the fourth embodiment are the same as those of the optical package 100 of the first embodiment described above.

[0066] The frame 125 comprises an upper frame 427 and a lower frame 426. The upper frame 427 and the lower frame 426 can be fitted together. In this case, a fitting portion 421 is formed on the lower surface of the upper frame 427. The fitting portion 421 protrudes from the lower surface of the upper frame 427. The fitting portion 421 can be elastically deformed in the lateral direction. The fitting portion 421 may be tulip-shaped. In this case, a step can be formed on the outer circumferential surface of the fitting portion 421 along the circumferential direction. The material of the fitting portion 421 can be, for example, resin. The fitting portion 421 can be arranged around the transparent substrate 124.

[0067] An opening 422 is formed in the lower frame 426. A fitting portion 421 can be inserted into the opening 422. At this time, a step can be provided along the circumferential direction on the inner surface of the opening 422 for hooking the fitting portion 421. The fitting portion 421 enters the opening 422 in a constricted state, and the fitting portion 421 opens at the position of the step on the inner surface of the opening 422, thereby hooking the fitting portion 421 into the opening 422. An extension portion 428 may also be provided in the lower frame 426. The extension portion 428 extends laterally from the side surface of the lower frame 426. Fastening holes 429 may be provided in the extension portion 428. At this time, the optical package 400 can be fixed to the motherboard via bolts inserted into the fastening holes 429. The other configurations of the frame 425 of the fourth embodiment are the same as those of the frame 125 of the first embodiment described above.

[0068] Thus, in the fourth embodiment described above, the upper frame 427 and the lower frame 426, which are separable vertically at the position of grooves formed laterally on the inner wall surface, can be fitted together. This prevents foreign matter such as dust from entering the inside of the optical package 400, while making the optical package 400 airtight, and also facilitates the attachment and detachment of the transparent substrate 124 to the inside of the frame 425.

[0069] <5. Fifth Embodiment> In the first embodiment described above, a frame 125 in which a transparent substrate 124 is inserted into a groove 131 formed laterally on the inner wall surface 133 is mounted on a mounting substrate 121 on which a chip 111 is face-up mounted. In this fifth embodiment, a resin injection section is provided on the surface of the frame into which the transparent substrate 124 is inserted from the side.

[0070] Figure 8 is a plan view showing an example of the configuration of an optical package according to the fifth embodiment, and Figure 9 is a cross-sectional view showing an example of the configuration of an optical package according to the fifth embodiment. Note that in Figure 9, a shows an example of the configuration cut along the line A1-A2 in Figure 8. In Figure 9, b shows an example in which resin is injected into the injection part of the optical package in Figure 9, a.

[0071] In Figure 9a, the optical package 500 includes a frame 525 instead of the frame 125 of the first embodiment described above. The other configurations of the optical package 500 of the fifth embodiment are the same as those of the optical package 100 of the first embodiment described above.

[0072] Frame 525 includes an upper frame 527 in place of the upper frame 127 of the first embodiment described above. The other configurations of frame 525 of the fifth embodiment are the same as those of frame 125 of the first embodiment described above.

[0073] The frame 525 can support the transparent substrate 124 on the chip 111. The frame 525 can be arranged continuously along the outer circumference of the mounting substrate 121. The frame 525 has openings 130 and grooves 131. The frame 525 may also be rectangular in shape with four inner wall surfaces 133.

[0074] The upper frame 527 and the lower frame 126 may be separable at the position of the groove 131, or they may be integrated. The upper frame 527 may be provided with an overhang 136. An injection section 501 is formed on the surface of the upper frame 527. The injection section 501 can inject resin 529 into the frame 525. The injection section 501 can be placed on the lower frame 126. In this case, the end of the transparent substrate 124 may be exposed through the injection section 501. The shape of the injection section 501 may be a groove or a hole. In this case, multiple holes may be provided. The number and spacing of the holes may be set considering the strength of the frame 525 and the viscosity of the resin 529. Also, as shown in Figure 8, the injection section 501 may be placed along one of the four sides of the upper frame 527, or along multiple sides. The lower frame 126 may be provided with a resin reservoir.

[0075] Then, as shown in Figure 9b, the transparent substrate 124 is inserted into the frame 525 from the side, and then the resin 529 is injected through the injection part 501. By curing the resin 529, the transparent substrate 124 can be fixed to the frame 525 while ensuring a gap between the frame 525 and the transparent substrate 124.

[0076] The resin 529 may be a thermosetting resin or an ultraviolet curing resin. For example, the resin 529 can be a silicone resin, a siloxane resin, an acrylic resin, or an epoxy resin.

[0077] Thus, in the fifth embodiment described above, a resin injection section 501 is provided on the surface of the frame 525 into which the transparent substrate 124 is inserted from the side. This allows the resin 529 to be injected from above the frame 525, preventing the resin injection process from becoming complicated.

[0078] <6. Sixth Embodiment> In the fifth embodiment described above, a resin injection section 501 is provided on the surface of the frame 525 into which the transparent substrate 124 is inserted from the side. In this sixth embodiment, the frame into which the transparent substrate 124 is inserted from the side is composed of a lower frame and an upper frame, and the lower frame and the upper frame can be fastened together.

[0079] Figure 10 is a plan view showing an example of the configuration of an optical package according to the sixth embodiment, and Figure 11 is a cross-sectional view showing an example of the configuration of an optical package according to the sixth embodiment. Note that in Figure 11, a shows an example of the configuration cut along the line A1-A2 in Figure 10. In Figure 11, b shows an example in which resin is injected into the injection part of the optical package a in Figure 11.

[0080] In the figure, the optical package 600 includes a frame 625 in place of the frame 525 of the fifth embodiment described above. The other configurations of the optical package 600 of the sixth embodiment are the same as those of the optical package 500 of the fifth embodiment described above.

[0081] In Figure 11a, the optical package 600 includes a frame 625 in place of the frame 525 of the fifth embodiment described above. The other configurations of the optical package 600 of the sixth embodiment are the same as those of the optical package 500 of the fifth embodiment described above.

[0082] The frame 625 can detachably support the transparent substrate 124 on the chip 111. The frame 625 can be arranged continuously along the outer circumference of the mounting substrate 121. The frame 625 has an opening 130 and a groove 131. The frame 625 may also be rectangular in shape with four inner wall surfaces 133.

[0083] The frame 625 comprises an upper frame 627 and a lower frame 626. The upper frame 627 and the lower frame 626 can be fastened together. In this case, screw holes 602 and 601 may be formed in the upper frame 627 and the lower frame 626, respectively. The screw holes 602 and 601 can be positioned to overlap each other. The screw holes 602 and 601 may be positioned along three of the four sides of the upper frame 627 and the lower frame 626, as shown in Figure 10. Taking design tolerances into consideration, the diameter of the screw hole 602 in the upper frame 627 may be larger than the diameter of the screw hole 601 in the lower frame 626.

[0084] An overhang 136 may be provided on the upper frame 627. An injection section 501 is formed on the surface of the upper frame 627. The injection section 501 can be placed on the lower frame 626. As shown in Figure 10, the injection section 501 may be placed along one of the four sides of the upper frame 627 and lower frame 626 that does not have screw holes 602, 601. Then, bolts 603 are inserted into the screw holes 602, 601 to fasten the upper frame 627 and lower frame 626 together. After that, the transparent substrate 124 is inserted into the frame 625 from the side.

[0085] Next, as shown in Figure 11b, the resin 529 is injected through the injection unit 501. By curing the resin 529, the transparent substrate 124 can be fixed to the frame 525 while maintaining a gap between the frame 525 and the transparent substrate 124.

[0086] Figure 12 is a cross-sectional view showing an example of a method for manufacturing an optical package according to the sixth embodiment.

[0087] In Figure 12a, adhesive 135 is applied to the joining position of the lower frame 626 around the mounting substrate 121. Then, the mounting substrate 121 and the lower frame 626 are aligned.

[0088] Next, as shown in Figure 12b, the lower surface of the lower frame 626 is bonded to the mounting substrate 121 via adhesive 135.

[0089] Next, as shown in c in Figure 12, the upper frame 627 and the lower frame 626 are aligned. Then, after positioning the upper frame 627 so that it overlaps the lower frame 626, steps a and b in Figure 11 are carried out.

[0090] As described above, in the sixth embodiment, the frame 625 into which the transparent substrate 124 is inserted from the side is composed of a lower frame 626 and an upper frame 627, and the lower frame 626 and the upper frame 627 can be fastened together. This allows the lower frame 626 and the upper frame 627 to be joined or separated, and the transparent substrate 124 can be removed or replaced after it has been mounted on the optical package 600.

[0091] <7. Seventh Embodiment> In the sixth embodiment described above, the frame 625 into which the transparent substrate 124 is inserted from the side is composed of a lower frame 626 and an upper frame 627, and the lower frame 626 and the upper frame 627 can be fastened together. In this seventh embodiment, the upper frame that supports the transparent substrate 124 on its upper or lower surface can be fastened to the lower frame.

[0092] Figure 13 is a plan view showing an example of the configuration of the optical package according to the seventh embodiment, and Figure 14 is a cross-sectional view showing an example of the configuration of the optical package according to the seventh embodiment. Note that a and b in Figure 14 show an example of the configuration cut along the line A1-A2 in Figure 13.

[0093] In Figures 13 and 14, in (a), the optical package 700A includes a frame 725 instead of the frame 625 of the sixth embodiment described above. The other configurations of the optical package 700A of the seventh embodiment are the same as those of the optical package 600 of the sixth embodiment described above.

[0094] The frame 725 can detachably support the transparent substrate 124 on the chip 111. The frame 725 can be arranged continuously along the outer circumference of the mounting substrate 121. The frame 725 may also be rectangular in shape with four inner wall surfaces 133.

[0095] The frame 725 comprises an upper frame 727 and a lower frame 726. The upper frame 727 and the lower frame 726 are fastened together. In this case, screw holes 702 and 701 may be formed in the upper frame 727 and the lower frame 726, respectively. The screw holes 702 and 701 can be positioned to overlap each other. The screw holes 702 and 701 may be arranged along the four sides of the upper frame 727 and the lower frame 726, as shown in Figure 13.

[0096] Furthermore, the upper frame 727 is provided with a joining surface MA. The joining surface MA may be located on the back side of the canopy 136. The joining surface MA may also be a flat surface. The periphery of the upper surface of the transparent substrate 124 can then be joined to the joining surface MA, thereby fixing the transparent substrate 124 to the upper frame 727.

[0097] Then, bolts are inserted into the screw holes 702 and 701 to fasten the upper frame 727 and the lower frame 726 together. At this time, no adhesive is required to fasten the upper frame 727 and the lower frame 726. Therefore, a gap can be formed between the upper frame 727 and the lower frame 726, ensuring that the optical package 700A is airtight.

[0098] Furthermore, in Figures 13 and 14(b), the optical package 700B includes a frame 725, similar to the optical package 700A in Figure 14(a). The difference from the optical package 700A is that in the optical package 700B, the upper frame 627 to which the transparent substrate 124 is bonded is placed upside down on the lower frame 626. In this case, the periphery of the lower surface of the transparent substrate 124 is bonded to the bonding surface MA, and the transparent substrate 124 is fixed to the upper frame 727. The other configurations of the optical package 700B in Figure 14(b) are the same as those of the optical package 700A in Figure 14(a).

[0099] Figures 15 and 16 are cross-sectional views showing an example of a method for manufacturing an optical package according to the seventh embodiment.

[0100] In Figure 15a, adhesive 135 is applied to the joining position of the lower frame 726 around the mounting substrate 121. Then, the mounting substrate 121 and the lower frame 726 are aligned.

[0101] Next, as shown in Figure 15b, the lower surface of the lower frame 726 is bonded to the mounting substrate 121 via adhesive 135.

[0102] Next, as shown in Figure 16a, the upper frame 627 and the transparent substrate 124 are aligned.

[0103] Next, as shown in Figure 16b, the transparent substrate 124 is joined to the upper frame 727.

[0104] Next, as shown in c in Figure 16, the upper frame 727 to which the transparent substrate 124 is attached and the lower frame 726 are aligned. Then, as shown in Figure 15, the upper frame 627 to which the transparent substrate 124 is attached is positioned so that it overlaps the lower frame 726.

[0105] Thus, in the seventh embodiment described above, the upper frame 727 that supports the transparent substrate 124 on its upper or lower surface can be fastened to the lower frame 726. This allows the transparent substrate 124 to be attached to the frame 725 while ensuring the ease of attachment and detachment of the transparent substrate 124 based on vertical assembly.

[0106] <8. Eighth Embodiment> In the seventh embodiment described above, the upper frame 727 that supports the transparent substrate 124 on its upper or lower surface can be fastened to the lower frame 726. In this eighth embodiment, the upper frame that supports the transparent substrate 124 can be fastened to the lower frame, and the upper frame and the lower frame can be fastened to the housing.

[0107] Figure 17 is a plan view showing an example of the configuration of an optical package according to the eighth embodiment, and Figure 18 is a cross-sectional view showing an example of the configuration of an optical package according to the eighth embodiment. Note that Figure 18 shows an example of the configuration cut along the line A1-A2 in Figure 17.

[0108] In the figure, the optical package 800 includes a frame 825 in place of the frame 725 of the seventh embodiment described above. The other configurations of the optical package 800 of the eighth embodiment are the same as those of the optical package 700A of the seventh embodiment described above.

[0109] The frame 825 can detachably support the transparent substrate 124 on the chip 111. The frame 825 can be arranged continuously along the outer circumference of the mounting substrate 121. The frame 825 includes an extended portion 810. The extended portion 810 can protrude horizontally beyond the position of the side surface of the mounting substrate 121. As shown in Figure 17, the extended portion 810 may be provided on two opposing sides of the frame 825, or on the four corners of the frame 825.

[0110] The frame 825 comprises an upper frame 827 and a lower frame 826. The upper frame 827 and the lower frame 826 can be fastened together. In this case, screw holes 802 and 801 may be formed in the extended portions 810 of the upper frame 827 and the lower frame 826, respectively. The screw holes 802 and 801 can be positioned to overlap each other.

[0111] Furthermore, the upper frame 827 is provided with a bonding surface MA. The bonding surface MA may be located on the back side of the canopy 136. The periphery of the upper surface of the transparent substrate 124 can then be bonded to the bonding surface MA, thereby fixing the transparent substrate 124 to the upper frame 827.

[0112] Figure 19 is a cross-sectional view showing an example of the mounting of an optical package according to the eighth embodiment.

[0113] In the figure, the optical module 900 comprises an optical package 800 and a housing 901. The housing 901 supports a lens 903 on the optical package 800. The housing 901 may be a case for a camera or smartphone. The housing 901 may also be a lens barrel. Screw holes 902 are provided in the side wall of the housing 901. The screw holes 902 are positioned on top of the screw holes 802. Here, the optical package 800 can be attached to the housing 901 via the extension portion 810. At this time, bolts are inserted into the screw holes 801, 802, and 902 to fasten the upper frame 827, the lower frame 826, and the housing 901 together. At this time, adhesive is not required to fasten the upper frame 827 and the lower frame 826. Therefore, a gap can be formed between the upper frame 827 and the lower frame 826, ensuring the airtightness of the optical package 800. The material of the housing 901 may be resin or a metal such as stainless steel.

[0114] Thus, in the eighth embodiment described above, the upper frame 827 supporting the transparent substrate 124 can be fastened to the lower frame 826, and the upper frame 827 and the lower frame 826 can be fastened to the housing 901. This makes it possible to attach and detach the transparent substrate 124 and the optical package 800 by inserting and removing bolts into and out of the screw holes 801, 802, and 902. At this time, the screw holes 801 and 802 can be shared for attaching and detaching the transparent substrate 124 from the optical package 800 and for attaching and detaching the optical package 800 from the housing 901. Therefore, it is not necessary to provide separate screw holes on the optical package 800 for attaching and detaching the transparent substrate 124 from the optical package 800 and for attaching and detaching the optical package 800 from the housing 901, and the configuration of the optical package 800 can be simplified.

[0115] <9. Examples of Application to Mobile Devices> The technology disclosed herein (the technology) can be applied to various products. For example, the technology disclosed herein may be implemented as a device mounted on any type of mobile device such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, and robots.

[0116] Figure 20 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0117] The vehicle control system 12000 comprises a plurality of electronic control units connected via a communication network 12001. In the example shown in Figure 20, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0118] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0119] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0120] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0121] The imaging unit 12031 is a light sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0122] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that captures images of the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0123] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking device based on information inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including collision avoidance or impact mitigation, following driving based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0124] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0125] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0126] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 20, the output devices include an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0127] Figure 21 shows an example of the installation position of the imaging unit 12031.

[0128] In Figure 21, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0129] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 installed on the upper part of the windshield inside the vehicle is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0130] Figure 21 shows an example of the imaging range of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0131] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0132] For example, the microcomputer 12051, based on distance information obtained from the imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to the vehicle 12100). In particular, it can extract the closest object on the vehicle 12100's path that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained before the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, etc., that drives autonomously without driver operation, can be performed.

[0133] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0134] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0135] The above describes an example of a vehicle control system to which the technology of this disclosure may be applied. The technology of this disclosure can be applied to the imaging unit 12031 of the configuration described above. Specifically, for example, the optical package of the above embodiment can be applied to the imaging unit 12031. By applying the technology of this disclosure to the vehicle control system 12000, the reliability of the imaging unit 12031 can be improved.

[0136] Furthermore, any of the optical packages of the first to eighth embodiments described above can be applied to imaging devices, as well as to electronic devices such as communication devices, display devices, data processing devices, control devices, measuring devices, or printing devices.

[0137] Furthermore, the embodiments described above are merely examples of how to realize the present technology, and there is a corresponding relationship between the matters in the embodiments and the inventive features in the claims. Similarly, there is a corresponding relationship between the inventive features in the claims and the matters in the embodiments of the present technology that bear the same name. However, the present technology is not limited to the embodiments and can be realized by making various modifications to the embodiments without departing from the gist of the present technology. Also, the effects described herein are merely examples and are not limiting, and there may be other effects.

[0138] Furthermore, this technology can also take the following configurations: (1) An optical package comprising a substrate, a frame disposed on the substrate, a groove formed laterally on the inner wall surface of the frame, and an opening formed on the side surface of the frame so as to communicate with the groove. (2) The optical package according to (1) comprising an injection part formed on the surface of the frame into which resin can be injected into the frame. (3) The optical package according to (1) or (2) comprising a transparent member inserted into the groove. (4) The optical package according to (3) comprising a gap provided between the transparent member and the groove. (5) The optical package according to (4) comprising an adhesive provided in a part of the gap for bonding the transparent member to the frame. (6) The optical package according to any one of (3) to (5) wherein the transparent member is arranged asymmetrically with respect to the substrate. (7) The optical package according to any one of (3) to (6) comprising an optical element mounted on the substrate so as to be located within the frame. (8) The optical package according to (7) comprising a sealing material provided at a position to close the opening. (9) The optical package according to any one of (1) to (8), wherein the frame is separable vertically at the position of the groove. (10) The optical package according to (9), wherein the frame has a fitting portion that allows the vertically separated upper frame and lower frame to be fitted together. (11) The optical package according to (9), wherein the frame has a fastening portion that allows the vertically separated upper frame and lower frame to be fastened together. (12) The optical package according to any one of (1) to (11), wherein the frame is rectangular in shape and has four inner wall surfaces. (13) The optical package according to (12), wherein the groove is provided on three of the four inner wall surfaces, and the opening is provided on one of the inner wall surfaces other than the three inner wall surfaces. (14) The optical package according to any one of (1) to (13), wherein the portion of the frame above the groove extends horizontally in the direction inward of the frame relative to the portion below the groove. (15) The optical package according to any one of (1) to (14), wherein the material of the frame is ceramic or resin.(16) An optical package comprising: a substrate; a lower frame disposed on the substrate; an upper frame disposed on the lower frame; a transparent member joined to a position that closes the inside of the upper frame; and fastening parts disposed around the transparent member for fastening the lower frame and the upper frame. (17) The optical package according to (16), wherein the fastening parts are screw holes provided in the lower frame and the upper frame, respectively. (18) The optical package according to (17), comprising a housing that can fasten the lower frame and the upper frame via the screw holes. (19) The optical package according to (18), comprising a lens supported on the transparent member via the housing. (20) The optical package according to any one of (16) to (19), wherein the upper frame is a joining surface that is joined to the periphery of the upper or lower surface of the transparent member.

[0139] 100 Optical package 111 Chip 112 Light-receiving area 113 Pad electrode 114 Color filter 115 On-chip lens 116 Bonding wire 121 Mounting substrate 122 Bonding pad 123 Land electrode 124 Transparent substrate 125 Frame 126 Lower frame 127 Upper frame 128 Die bond material 129 Encapsulation material 130 Aperture 131 Groove

Claims

1. An optical package comprising a substrate, a frame disposed on the substrate, a groove formed laterally on the inner wall surface of the frame, and an opening formed on the side surface of the frame so as to communicate with the groove.

2. The optical package according to claim 1, comprising an injection part formed on the surface of the frame into which resin can be injected.

3. The optical package according to claim 1, comprising a transparent member inserted into the groove.

4. The optical package according to claim 3, further comprising a gap between the transparent member and the groove.

5. The optical package according to claim 4, further comprising an adhesive provided in a part of the gap for bonding the transparent member to the frame.

6. The optical package according to claim 3, wherein the transparent member is arranged asymmetrically with respect to the substrate.

7. The optical package according to claim 3, comprising an optical element mounted on the substrate so as to be located within the frame.

8. The optical package according to claim 7, further comprising a sealing material provided at a position to close the opening.

9. The optical package according to claim 1, wherein the frame is separable vertically at the position of the groove.

10. The optical package according to claim 9, wherein the frame comprises a fitting portion that allows the upper and lower frames, which are separated vertically, to be fitted together.

11. The optical package according to claim 9, wherein the frame comprises fastening portions capable of fastening the upper frame and the lower frame, which are separated vertically, to each other.

12. The optical package according to claim 1, wherein the frame is rectangular in shape and has four inner wall surfaces.

13. The optical package according to claim 12, wherein the grooves are provided on three of the four inner wall surfaces, and the opening is provided on one of the inner wall surfaces other than the three inner wall surfaces.

14. The optical package according to claim 1, wherein the portion of the frame above the groove extends horizontally in the direction inward of the frame relative to the portion below the groove.

15. The optical package according to claim 1, wherein the material of the frame is ceramic or resin.

16. An optical package comprising: a substrate; a lower frame disposed on the substrate; an upper frame disposed on the lower frame; a transparent member joined to a position that closes the inside of the upper frame; and fastening parts disposed around the transparent member for fastening the lower frame and the upper frame together.

17. The optical package according to claim 16, wherein the fastening portion comprises screw holes provided in the lower frame and the upper frame, respectively.

18. The optical package according to claim 17, comprising a housing through which the lower frame and the upper frame can be fastened via the screw holes.

19. The optical package according to claim 18, comprising a lens supported on the transparent member via the housing.

20. The optical package according to claim 16, wherein the upper frame comprises a bonding surface that is joined to the periphery of the upper or lower surface of the transparent member.

Images