Bonding device and method for manufacturing bonded component

Abstract

This bonding device comprises: a first stage that supports a first workpiece; a second stage that supports a second workpiece at a position facing the first workpiece; a base; a support member that movably supports the first stage with respect to the base; and a movement device that moves the base and / or the second stage in a near-far direction. This method for manufacturing a bonded component comprises: supporting a first workpiece by a first stage; supporting a second workpiece by a second stage; bringing a base and / or the second stage closer to each other to fit together fitting structures of the first workpiece and the second workpiece; and bringing the base and / or the second stage closer to each other to press and bond the first workpiece and the second workpiece of which the fitting structures are fitted together.

Description

Bonding device and method for manufacturing bonded components

[0001] The present disclosure relates to a bonding device for bonding two workpieces and a method for manufacturing bonded components.

[0002] For example, there is a device for bonding two members, such as a liquid crystal panel and a protective glass, with an adhesive. In such a device, in order to perform positioning accurately, after aligning the positions in a plan view using a CCD camera, there is a device that moves the members relatively in the vertical direction while fixing the planar position and then bonds them (see, for example, Japanese Patent Application Laid-Open No. 2014-145057).

[0003] However, a device using a CCD camera has a complicated configuration and also causes an increase in initial cost.

[0004] In view of the above problems, the present disclosure relates to providing a bonding device and a method for manufacturing bonded components that can easily bond two workpieces at a regular position.

[0005] A bonding device according to a first aspect of the present disclosure is a bonding device for bonding a first workpiece and a second workpiece, wherein the first workpiece and the second workpiece have a fitting structure that fits properly when bonded at a regular position, a first stage for supporting the first workpiece, a second stage for supporting the second workpiece at a position facing the first workpiece, a base, a support member for supporting the first stage movably relative to the base at least within a two-dimensional plane, and a moving device for directly or indirectly moving at least one of the base and the second stage in a proximity direction, which is a direction of approaching and separating from each other. The support member supports the first stage movably relative to the base at least within a two-dimensional plane in a direction intersecting the proximity direction.

[0006] With such a configuration, since the first stage is movable relative to the base by the support member, even if the positions of the workpieces held on each stage are displaced, it is possible to prevent the fitting of the fitting structure from being hindered, and the workpieces can be easily bonded at a regular position.

[0007] Furthermore, as a bonding apparatus according to a second aspect of the present disclosure, in the bonding apparatus according to the first aspect of the present disclosure, the support member may be an elastic member that can be deformed in the near-far direction and in a direction intersecting the near-far direction. Also, the first stage may be movable relative to the base in the near-far direction and in a direction intersecting the near-far direction.

[0008] With this configuration, the first stage can be moved three-dimensionally relative to the base, preventing excessive stress on the workpiece while allowing the workpiece to be properly bonded.

[0009] Furthermore, as a bonding apparatus according to a third aspect of the present disclosure, the bonding apparatus according to the first or second aspect of the present disclosure may include a stationary mechanism for stationary the first stage, which is located at the position where the first workpiece is installed.

[0010] With this configuration, the first workpiece can be stably mounted on the first stage, which is supported by a movable support member.

[0011] Furthermore, as a bonding apparatus according to a fourth aspect of the present disclosure, the bonding apparatus according to the third aspect of the present disclosure may be equipped with a positioning mechanism for stopping the first stage at a predetermined position.

[0012] This configuration makes it possible to suppress variations in the placement position of the first workpiece relative to the first stage.

[0013] Furthermore, as a bonding apparatus according to a fifth aspect of the present disclosure, in the bonding apparatus according to the fourth aspect of the present disclosure, the positioning mechanism includes a first component provided on the first stage and a second component provided on the stationary mechanism, and the first component and the second component include a convex portion formed on one of the first component and the second component and a concave portion formed on the other, wherein the convex portion may be fitted into the concave portion.

[0014] With this configuration, the first stage can be positioned and stopped using a simple setup.

[0015] Furthermore, as a bonding apparatus according to a sixth aspect of the present disclosure, in the bonding apparatus according to the fifth aspect of the present disclosure, the convex portion is formed in a conical or frustoconical shape, and the concave portion may be tapered.

[0016] This configuration allows for positioning with a simple setup.

[0017] Furthermore, as a bonding apparatus according to a seventh aspect of the present disclosure, in a bonding apparatus according to a fifth or sixth aspect of the present disclosure, the second stage may have a pressing member that presses the first component or the first stage in order to disengage the protrusion from the recess.

[0018] This configuration allows the first stage to be made movable without putting a load on the workpiece.

[0019] Furthermore, as a method for manufacturing a bonded part according to the eighth aspect of the present disclosure, a method for manufacturing a bonded part by bonding a first workpiece and a second workpiece using a bonding apparatus according to any one of the first to seventh aspects of the present disclosure, the method comprising: a step of the first stage supporting the first workpiece; a step of the second stage supporting the second workpiece; a step of moving at least one of the base and the second stage toward each other to fit the fitting structure on the first workpiece and the second workpiece; and a step of moving at least one of the base and the second stage toward each other to press the first workpiece and the second workpiece, on which the fitting structure is fitted, toward each other to bond them together.

[0020] This configuration allows for easy and precise bonding of the workpieces in their correct positions.

[0021] According to this disclosure, since the first stage is movable relative to the base by the support member, even if the positions of the workpieces held on each stage are misaligned, it is possible to prevent interference with the fitting of the mating structure, and the workpieces can be easily bonded together in the correct position.

[0022] This is a schematic longitudinal cross-sectional view showing the general configuration of a bonding apparatus according to an embodiment of the present disclosure. This is a flowchart showing a method for manufacturing a bonded part according to an embodiment of the present disclosure. This is a schematic longitudinal cross-sectional view showing the bottom stage of the bonding apparatus according to an embodiment of the present disclosure in a state where it is movable during operation. This is a schematic longitudinal cross-sectional view showing the bottom stage of the bonding apparatus according to an embodiment of the present disclosure in a state where it has moved during operation. This is a schematic longitudinal cross-sectional view showing the two workpieces being pressed together during operation of the bonding apparatus according to an embodiment of the present disclosure. This is a schematic longitudinal cross-sectional view showing the general configuration of a bonding apparatus according to a modified embodiment of the present disclosure.

[0023] This application is based on Japanese Patent Application No. 2025-024446, filed in Japan on 18 February 2025, the contents of which form part of the content of this application. The present invention will be more fully understood from the following detailed description. Further applications of the present invention will become apparent from the following detailed description. However, the detailed description and specific examples are preferred embodiments of the present invention and are described for illustrative purposes only, for various changes and modifications will be apparent to those skilled in the art from this detailed description, within the spirit and scope of the invention. The applicant has no intention of dedicating any of the described embodiments to the public, and any disclosed modifications and alternatives, even those not literally included in the claims, are also part of the invention under the doctrine of equivalents.

[0024] Embodiments of this disclosure will be described below with reference to the drawings. In each drawing, identical or equivalent components are denoted by the same or similar reference numerals, and redundant explanations are omitted. Also, the dimensions and proportions in the drawings are exaggerated for illustrative purposes and may differ from actual proportions.

[0025] First, with reference to Figure 1, the bonding apparatus 1 according to an embodiment of the present disclosure will be described. Figure 1 is a schematic longitudinal cross-sectional view showing the general configuration of the bonding apparatus 1. In Figure 1, hatching representing the cross-section has been omitted to avoid cluttering the diagram. The bonding apparatus 1 is a device that typically bonds a first workpiece (hereinafter referred to as "first workpiece 91") and a second workpiece (hereinafter referred to as "second workpiece 92") via resin. The bonding apparatus 1 also functions as a device that manufactures a bonded part obtained by bonding the first workpiece 91 and the second workpiece 92 together.

[0026] The first workpiece 91 and the second workpiece 92 may be substrates. Examples of substrates include LCD panels for smartphones, cover glass, VR glasses lenses, etc., and various other substrates may also be applied. The first workpiece 91 and / or the second workpiece 92 may be components other than substrates that are to be bonded together. The resin that can be supplied between the first workpiece 91 and the second workpiece 92 may function as an adhesive. When applied to the first workpiece 91 and / or the second workpiece 92, this resin is in the form of a liquid with a predetermined viscosity that has fluidity, and may have the property of hardening when the first workpiece 91 and the second workpiece 92 are bonded together and a thickening treatment is applied. Depending on the properties of the resin, examples of thickening treatments include irradiation with ultraviolet light, heating, waiting for a period of time, etc.

[0027] The first workpiece 91 and the second workpiece 92 have a mating structure 95 that fits together properly when bonded in their proper positions. Here, the proper position is typically the intended position (or design position) required for the bonded parts to function. Fitting together properly typically means that they fit together without any defects. Defects here include fracture such as cracks or breaks, and / or excessive stress that leads to a decrease in quality such as reduced strength or durability. In this embodiment, the mating structure 95 consists of a pair of recesses 96 formed on the bonding surface of the first workpiece 91 and protrusions 97 provided on the bonding surface of the second workpiece 92. Typically, there are multiple pairs of recesses 96 and protrusions 97, and these multiple pairs of recesses 96 and protrusions 97 are located apart from each other.

[0028] As described above, the first workpiece 91 and the second workpiece 92 have a specific bonding position that allows them to function as a bonded part when they are bonded together. Conventionally, after the bonding surfaces of the two members to be bonded were placed facing each other, a CCD camera was used to align their planar positions, and then the two members were brought close together and bonded. However, devices using a CCD camera have a complex configuration and lead to increased initial costs. In contrast, the bonding apparatus 1 according to this embodiment, which bonds the first workpiece 91 and the second workpiece 92 having a fitting structure 95, is a device that can easily bond the first workpiece 91 and the second workpiece 92 in the correct position without using a CCD camera. The bonding apparatus 1 comprises a bottom stage 10, a top stage 20, a base 31, a support member 38, and a moving device 42. When resin is applied to the first workpiece 91 and / or the second workpiece 92, a resin supply device (not shown) may be provided.

[0029] The bottom stage 10 is a stage that supports the first workpiece 91 and corresponds to the first stage. In this embodiment, the bottom stage 10 has a bottom holder 11 and a bottom base 12. The bottom holder 11 holds the first workpiece 91. The bottom holder 11 typically holds the first workpiece 91 by suction, but it may also hold it by a configuration other than suction, such as chuck jaws. The bottom holder 11 has a size that encompasses the first workpiece 91 in a plan view, and the upper surface on which the first workpiece 91 is placed is typically formed to be flat. The bottom holder 11 is typically positioned so that its upper surface (i.e., the surface on which the first workpiece 91 is placed) is horizontal.

[0030] The bottom base 12 supports the bottom support 11. The bottom base 12 is typically formed in a plate shape, larger than the bottom support 11 while encompassing it in a plan view. In this embodiment, the bottom support 11 is provided on the bottom base 12. A protrusion 15 is provided on the outer edge of the upper surface of the bottom base 12 (i.e., the surface on which the bottom support 11 is provided). The protrusion 15 extends upward from the upper surface of the bottom base 12. The protrusion 15 is typically formed in a frustoconical shape, with the horizontal cross-sectional area decreasing towards the top, and in this embodiment, it is formed in a frustoconical shape. Typically, multiple protrusions 15 are provided circumferentially spaced on the upper surface of the bottom base 12.

[0031] The top stage 20 is a stage that supports the second workpiece 92 in a position opposite the first workpiece 91, and corresponds to the second stage. In this embodiment, the top stage 20 has a top holder 21 and a top base 22. The top holder 21 holds the second workpiece 92. The top holder 21 typically holds the second workpiece 92 by suction, but it may also hold it by a configuration other than suction, such as chuck jaws. The top holder 21 is sized to encompass the second workpiece 92 in a plan view, and its lower surface in contact with the second workpiece 92 is typically formed flat. The top holder 21 is typically positioned so that its lower surface (i.e., the surface in contact with the second workpiece 92) is horizontal.

[0032] The top base 22 supports the top holder 21. Typically, the top base 22 is formed in a plate shape that is larger than the top holder 21 while encompassing it in a plan view. In this embodiment, the top holder 21 is attached to the lower surface of the top base 22. The top base 22 is positioned such that the second workpiece 92 held on the top holder 21 is positioned above and opposite the first workpiece 91 held on the bottom holder 11. In this embodiment, the top base 22 is large enough to encompass all the protrusions 15 provided on the bottom base 12 in a plan view. In this embodiment, the top base 22 is provided with a pressing member 26.

[0033] The pressing member 26 is a member that presses the protrusion 15 in a timely manner. Therefore, the number of pressing members 26 corresponding to the protrusion 15 is typically provided on the outer edge of the lower surface of the top base 22, at positions facing each protrusion 15. The pressing member 26 includes a pressing plate 28 and an expandable / contractible member 29. The pressing plate 28 can contact the protrusion 15 and press it. The pressing plate 28 is typically a plate-shaped member and is sized to press the top of the protrusion 15. The expandable / contractible member 29 is a member that connects the top base 22 and the pressing plate 28. In this embodiment, the expandable / contractible member 29 is a spring. The expandable / contractible member 29 expands and contracts in accordance with the distance of the pressing plate 28 relative to the top base 22. In other words, the pressing plate 28 can move closer to and further away from the top base 22 by being connected to the top base 22 via the expandable / contractible member 29.

[0034] The base 31 is a base member that supports the bottom stage 10. In this embodiment, the base 31 is formed of a plate-shaped member and has a planar shape that is large enough to encompass the bottom base 12. The base 31 is arranged so that the surfaces of the plate-shaped member face up and down. In this embodiment, the base 31 is provided with a side wall 33 that typically extends vertically along the outer edge of the upper surface. The side wall 33 may extend along the entire outer circumference of the base 31, but it is sufficient if it is provided adjacent to the position where the protrusions 15 are provided. In other words, the side wall 33 may be provided adjacent to each protrusion 15 at intervals in the circumferential direction of the base 31. On the upper part of the side wall 33, small pieces 34 are provided that protrude at the position where the protrusions 15 exist in a plan view. The number of small pieces 34 corresponds to the number of protrusions 15. In this embodiment, the small pieces 34 are made of a plate-shaped member and typically extend horizontally from the side wall 33 toward the inside (i.e., toward the side where the bottom support base 11 exists). The small piece 34 has a recess 35 into which the convex portion 15 fits. In this embodiment, the recess 35 is formed as a hole that penetrates the plate-shaped member of the small piece 34 in the thickness direction. In this embodiment, the recess 35 is tapered such that the horizontal cross-sectional area decreases as the hole that penetrates the plate-shaped member in the thickness direction goes upward. The taper of the recess 35 corresponds to the slope of the frustoconical outer surface that constitutes the convex portion 15. In other words, the recess 35 is formed in a shape and size that fits the convex portion 15. The diameter of the hole in the recess 35 on the lower surface of the small piece 34 is larger than the diameter of the top of the frustoconical convex portion 15 and smaller than the diameter of the bottom.

[0035] The support members 38 movably support the bottom stage 10 with respect to the base 31. In this embodiment, the support members 38 are springs (or coil springs) that correspond to elastic members. Multiple support members 38 are provided at intervals on the outer edge of the bottom base 12 so as to stably support the bottom stage 10. The same number of support members 38 may be provided as the number of protrusions 15, at positions corresponding to the protrusions 15 (typically below the protrusions 15). One end (or first end) of the spring of the support member 38 is attached to the lower surface of the bottom base 12, and the other end (or second end) is attached to the upper surface of the base 31, biasing the bottom base 12 toward the small piece 34. When the protrusions 15 on the bottom base 12 are fitted into the recesses 35 of the small piece 34 and the bottom base 12 cannot move upward, it is preferable that the spring of the support member 38 is slightly compressed so as to press the bottom base 12 toward the small piece 34. The support member 38 has a spring constant such that it compresses before the expandable / contractible member 29 when the protrusion 15 is pressed by the pressing member 26. In other words, in this embodiment, the support member 38 has a smaller spring constant than the expandable / contractible member 29. The expandable / contractible member 29 overcomes the biasing force of the support member 38, but it compresses if the top base 22 continues to descend after the pressing plate 28 hits the small piece 34.

[0036] When the protrusion 15 on the bottom base 12 is fitted into the recess 35 of the small piece 34 by the biasing force of the support member 38, and the bottom base 12 cannot move upward, the bottom stage 10 is stationary. In this way, the protrusion 15 and the small piece 34 with the recess 35 function as a stationary mechanism that keeps the bottom stage 10 stationary. Furthermore, when the bottom base 12 is stationary with the protrusion 15 fitted into the recess 35 of the small piece 34 and unable to move upward, the bottom stage 10 always exists at the same position in three-dimensional space (or Cartesian coordinate system) (hereinafter, this position is referred to as the "reference position"). In this way, the protrusion 15 and the small piece 34 with the recess 35 also function as a positioning mechanism that keeps the bottom stage 10 stationary at the reference position. The reference position of the bottom stage 10 corresponds to a predetermined position. The protrusion 15 corresponds to the first part, and the small piece 34 with the recess 35 corresponds to the second part. The small piece 34, on which the convex portion 15 and the concave portion 35 are formed, functions as a stationary mechanism and a positioning mechanism, as described above, and hereafter these may be collectively referred to as the "stationary positioning mechanism 50".

[0037] In this embodiment, the moving device 42 moves the top stage 20 up and down. By moving the top stage 20 up and down, the moving device 42 moves the top stage 20 toward the base 31 and the bottom stage 10 and toward it. Hereinafter, the direction toward which the top stage 20 and the base 31 move toward and toward each other will be referred to as the "near-far direction FN". By moving the top stage 20 in the near-far direction FN, the moving device 42 can move the second workpiece 92 from a position separated from the first workpiece 91 to a position in contact with it. Various mechanisms can be used as the moving device 42 to move the object to be moved back and forth in a linear motion. For example, a mechanism combining a ball screw operated by a motor with a linear guide, or a cylinder operated by fluid pressure such as pneumatic or hydraulic pressure can be used. Typically, the operation of the moving device 42 is controlled by a control device (not shown).

[0038] Next, with reference to Figures 1, 2, and 6, a method for manufacturing a bonded part formed by bonding a first workpiece 91 and a second workpiece 92 will be described. Figure 2 is a flowchart showing the procedure for manufacturing a bonded part. Figures 3 to 6 are schematic longitudinal cross-sectional views showing the state of the bonding apparatus 1 during the manufacturing process of a bonded part. To avoid cluttering the figures, hatching representing cross-sections has been omitted in Figures 3 to 6. The method for manufacturing a bonded part described below is performed using the bonding apparatus 1 described so far. The following description of the method for manufacturing a bonded part using the bonding apparatus 1 also serves as a description of the operation of the bonding apparatus 1. When the configuration of the bonding apparatus 1 is referred to in the following description, Figure 1 will also be referred to as appropriate. In addition, the operation of each device and equipment constituting the bonding apparatus 1 in the following method for manufacturing a bonded part is typically performed based on commands from a control device (not shown). The method for manufacturing a bonded part according to this embodiment may be provided in the form of a program that causes the processor of a control device (not shown) that controls each component of the bonding apparatus 1 to perform a predetermined operation, or in the form of a non-temporary computer-readable medium storing this program.

[0039] When the bonding device 1 is not operating, the bottom stage 10 is in the reference position, as shown in Figure 1. The top stage 20 is also in a position where at least the pressing member 26 does not bias (or press) the protrusion 15, and typically the pressing plate 28 is away from the protrusion 15. At this time, there is a gap between the bottom holder 11 and the top holder 21 that allows the first workpiece 91 and the second workpiece 92 to be smoothly inserted.

[0040] When manufacturing of the bonded parts begins, first, the first workpiece 91 is placed on the bottom holding base 11 with the recess 96 facing upward (i.e., opposite to the bottom holding base 11), and supported by the bottom holding base 11 (S1). At this time, the bottom stage 10, and by extension the bottom holding base 11, are in a reference position. Therefore, even though the bottom stage 10 is supported by a support member 38 made of springs whose relative positions at both ends can move, it remains stationary due to the static positioning mechanism 50. As a result, the first workpiece 91 can be stably placed on the bottom holding base 11. Furthermore, since the bottom stage 10, which is in a reference position due to the static positioning mechanism 50, always maintains a constant position in three-dimensional space, variations in the installation position on the bottom holding base 11 can be suppressed, for example, when the first workpiece 91 is transported by a robot arm moving along a fixed trajectory.

[0041] Next, the second workpiece 92 is brought into contact with the top holder 21 with the projection 97 facing downwards (i.e., opposite to the top holder 21), and supported by the top holder 21 (S2). As a result, the second workpiece 92 is supported by the top holder 21 above the first workpiece 91 and facing the first workpiece 91. The position of the second workpiece 92 supported by the top holder 21 in a plan view does not have to be in the exact correct position relative to the first workpiece 91, but may be in a position close to the correct position. In this case, a position close to the correct position is preferably a position in a plan view where the top of the projection 97 is within the range of the opening of the recess 96. The exact correct position is a position in a plan view where the top of the projection 97 coincides with the deepest part of the recess. When supporting the second workpiece 92 on the top holder 21, it is permissible for the second workpiece 92 to be shifted within a predetermined range from the correct position relative to the top holder 21, so alignment using a CCD camera is unnecessary, and rapid processing is possible.

[0042] In the example shown in Figure 2, for the sake of explanation, the first workpiece 91 is supported by the bottom holder 11 (S1), and then the second workpiece 92 is supported by the top holder 21 (S2). However, the order may be reversed, with the second workpiece 92 being supported by the top holder 21 before the first workpiece 91 is supported by the bottom holder 11, or the support of the first workpiece 91 by the bottom holder 11 and the support of the second workpiece 92 by the top holder 21 may be performed simultaneously. Furthermore, if the bonded parts are formed by bonding the first workpiece 91 and the second workpiece 92 with a resin in between, the bottom holder 11 or the top holder 21 may support the first workpiece 91 and / or the second workpiece 92 that have been coated with resin, or the resin may be applied to the first workpiece 91 supported by the bottom holder 11 and / or the second workpiece 92 supported by the top holder 21.

[0043] Once the support of the first workpiece 91 by the bottom holding base 11 and the support of the second workpiece 92 by the top holding base 21 are complete, the top stage 20 begins to descend (S3). In conventional bonding, the plane position was aligned using a CCD camera before lowering, but in this embodiment, the top stage 20 may begin to descend without aligning the plane position. The top stage 20 descends when the moving device 42 is activated by a command from a control device (not shown). As the top stage 20 descends, the pressing plate 28 first hits the top of the protrusion 15. The top stage 20 continues to descend even after the pressing plate 28 has contacted the protrusion 15, and the pressing member 26 presses against the protrusion 15 (S4). As a result, the protrusion 15 and the bottom stage 10 descend. The reason why the protrusion 15 and the bottom stage 10 descend is that the biasing force of the support member 38, which has a smaller spring constant than the expansion / contraction member 29, is overcome by the pressing force of the pressing member 26.

[0044] When the pressing member 26 overcomes the biasing force of the support member 38 and pushes down the convex portion 15 and the bottom stage 10, as shown in FIG. 3, the pressing plate 28 contacts the upper surface of the small piece 34. At this time, since the frustum-shaped convex portion 15 has been pushed down from the reference position, a gap is formed between the small piece 34 in the concave portion 35, and it is possible to move within a range until it contacts the small piece 34 in the horizontal direction (that is, the direction intersecting the depth direction FN). This is because the support member 38 is a spring (that is, an elastic member) that can be deformed in the depth direction FN and the direction intersecting the depth direction FN. Further, when the pressing plate 28 contacts the upper surface of the small piece 34, it is preferable that the tip of the protrusion 97 of the second workpiece 92 is inside the recess 96 of the first workpiece 91. Note that the tip of the protrusion 97 only needs to be within the range of the recess 96 in a plan view even if it does not enter the recess 96 (that is, even if it is located above the joint surface of the first workpiece 91).

[0045] Even after the pressing plate 28 contacts the upper surface of the small piece 34, the descent of the top stage 20 continues. However, since the small piece 34 is fixed to the base 31 via the side wall 33 and does not move, the telescopic member 29 contracts as the top stage 20 descends. At this time, while the convex portion 15 of the bottom stage 10 is pressed by the pressing member 26, the bottom base 12 is biased by the support member 38, so it does not move in the vertical direction and is movable in the horizontal direction. Therefore, when the telescopic member 29 contracts and the second workpiece 92 approaches the first workpiece 91, if the apex of the protrusion 97 in the planar position does not coincide with the deepest part of the recess 96, as the protrusion 97 descends and the contact area with the recess 96 increases, the bottom stage ¹0 moves horizontally and the planar position is adjusted. In order to smooth the horizontal movement of the bottom stage 10, a ball roller may be provided at the top of the convex portion 15.

[0046] As the top stage 20 descends as described above, as shown in FIG. 4, the recess 96 and the protrusion 97 are perfectly fitted together (S5). When the recess 96 and the protrusion 97 are perfectly fitted together, the first workpiece 91 and the second workpiece 92 are in contact with each other at the normal positions. In the state shown in FIG. 4, the first workpiece 91 and the second workpiece 92 are pressed in the direction of approaching each other mainly by the biasing force of the support member 38. In order to press the first workpiece 91 and the second workpiece 92 with a stronger force in the direction of approaching each other, the top stage 20 is further lowered so that the bottom stage 10 contacts the base 31 as shown in FIG. 5. When the bottom stage 10 contacts the base 31, it cannot descend any further.

[0047] Even after the bottom stage 10 contacts the base 31, by pressing the top stage 20 downward with a predetermined force, a predetermined force is applied to the first workpiece 91 and the second workpiece 92. Here, the predetermined force is the force to be applied to the first workpiece 91 and the second workpiece 92, which is required to make the bonded parts conform to the standard bonded state. When a predetermined force is applied to the first workpiece 91 and the second workpiece 92, the first workpiece 91 and the second workpiece 92 are bonded together (S6). When the first workpiece 91 and the second workpiece 92 are bonded via a resin, thickening measures may be taken at this stage.

[0048] When the bonding of the first workpiece 91 and the second workpiece 92 is completed, the support of the second workpiece 92 by the top holding base 21 is released, and the top stage 20 is raised (S7). Then, as shown in FIG. 6, the bottom stage, in the state where the bonded parts are supported by the bottom holding base 11, returns to the reference position by the action of the support member 38 and the stationary positioning mechanism 50, and the top stage 20 returns to the state before the start of bonding. When this state is reached, the support of the bonded parts by the bottom holding base 11 is released, and the bonded parts are taken out (S8). Thus, the production of one set of bonded parts is completed. Subsequently, when manufacturing another set of bonded parts, the above procedure may be repeated.

[0049] As described above, the bonding apparatus 1 and the method for manufacturing bonded parts according to this embodiment provide the following advantages. Since the bottom stage 10 is movable in three dimensions (or in the near-far direction FN and in directions intersecting the near-far direction FN) by the support member 38, the planar position can be moved to the correct position while bringing the second workpiece 92 closer to the first workpiece 91, and the first workpiece 91 and the second workpiece 92 can be easily bonded together in the correct position. Furthermore, since a stationary positioning mechanism 50 is provided, the first workpiece 91 can be stably installed on the bottom holding base 11, and variations in the installation position of the first workpiece 91 relative to the bottom holding base 11 can be suppressed. In addition, since the stationary positioning mechanism 50 includes a convex portion 15 formed in the shape of a frustocone and a small piece 34 having a tapered recess 35 into which the convex portion 15 fits, the bottom stage 10 can be positioned and stationary with a simple configuration.

[0050] Next, with reference to Figure 7, a modified example of the embodiment of the present disclosure, a bonding apparatus 1A, will be described. Figure 7 is a schematic longitudinal cross-sectional view showing the general configuration of the bonding apparatus 1A. In Figure 7, hatching representing the cross-section has been omitted to avoid cluttering the diagram. The bonding apparatus 1A differs from the bonding apparatus 1 (see Figure 1) mainly in the configuration for stationary and positioning the bottom stage 10. Hereinafter, the bonding apparatus 1A will be described focusing on the differences from the bonding apparatus 1 (see, for example, Figure 1). In the following description, when the configuration of the bonding apparatus 1 (see Figure 1) is referred to, Figure 1 will be referred to as appropriate.

[0051] In the bonding device 1A according to this modified example, a vertically extending portion 13 is provided on the outer edge of the upper surface of the bottom base 12. The vertical portion 13 only needs to be provided in the position where the protrusion 15 (see Figure 1) of the bonding device 1 (see Figure 1) was located in the circumferential direction of the bottom base 12, but it is not prevented from being provided over the entire circumferential direction of the bottom base 12. A flange portion 14 is provided at the top of the vertical portion 13, protruding horizontally outward. A protrusion 15A is provided on the lower surface of the flange portion 14, protruding downward. The protrusion 15A corresponds to the protrusion 15 (see Figure 1) in the bonding device 1 (see Figure 1). The protrusion 15A is typically formed in a conical shape, with the horizontal cross-sectional area decreasing as it goes downwards, and in this embodiment, it is formed in a conical shape. Typically, multiple protrusions 15A are provided spaced apart in the circumferential direction of the bottom base 12. Thus, in the bonding device 1A, a protrusion 15A is provided in place of the protrusion 15 (see Figure 1) in the bonding device 1 (see Figure 1), and a vertical portion 13 and a flange portion 14 are added to support the protrusion 15A.

[0052] Furthermore, in the bonding device 1A, a small piece 24 having a recess 25 into which a protrusion 15A fits is attached to the top base 22 via a side wall 23, rather than to the base 31. The side wall 23, the small piece 24, and the recess 25 have the same functions as the side wall 33, the small piece 34, and the recess 35 in the bonding device 1 (see Figure 1), respectively. In the bonding device 1A, the side wall 23 is provided on the outer edge of the lower surface of the top base 22. The side wall 23 may be provided over the entire outer circumference of the top base 22, but it is sufficient that it is provided in correspondence with the positions where the protrusion 15A is provided. In other words, the side wall 23 may be provided at intervals in the circumferential direction of the top base 22, corresponding to each protrusion 15A. The small piece 24 is provided at the lower part of the side wall 23. The small piece 24 typically extends horizontally inward from the side wall 23. The recess 25 formed in the small piece 24 is formed by a hole that penetrates the plate-like member in the thickness direction. In this embodiment, the recess 25 is tapered such that the horizontal cross-sectional area decreases as the hole that penetrates the plate-like member in the thickness direction goes downwards. The taper on the recess 25 corresponds to the slope of the conical outer surface that constitutes the convex portion 15A. The diameter of the hole in the recess 25 on the upper surface of the small piece 24 is smaller than the diameter of the upper part of the conical convex portion 15A (i.e., the part corresponding to the inverted conical bottom surface).

[0053] In the bonding device 1A, the stationary positioning mechanism 50A is composed of a protrusion 15A and a small piece 24 with a recess 25 formed therein. The protrusion 15A corresponds to the first component, and the small piece 24 with the recess 25 corresponds to the second component. The bonding device 1A does not have the pressing member 26 (see Figure 1) that was attached to the top base 22 in the bonding device 1 (see Figure 1), nor the side wall 33 (see Figure 1) and small piece 34 (see Figure 1) that were attached to the base 31. In the bonding device 1A, components that have the same reference numerals as those in the bonding device 1 (see Figure 1), other than those described above, are the same as those in the bonding device 1 (see Figure 1).

[0054] When manufacturing bonded parts using the bonding apparatus 1A configured as described above, the bonding apparatus 1A operates in the same manner as when using bonding apparatus 1 (see Figure 1), except for points related to the operation of the stationary positioning mechanism 50A. Therefore, the procedure for supporting the first workpiece 91 by the bottom holding base 11 and supporting the second workpiece 92 by the top holding base 21 in bonding apparatus 1A is the same as when using bonding apparatus 1 (see Figure 1). When bonding apparatus 1A is not operating, the bottom stage 10 is in the reference position, as shown in Figure 7. The top stage 20 is positioned with a gap between the bottom holding base 11 and the top holding base 21 that allows the first workpiece 91 and the second workpiece 92 to be smoothly inserted. The operation of bonding apparatus 1A when manufacturing bonded parts will be explained below, mainly focusing on the differences from bonding apparatus 1 (see Figure 1), although illustrations will be omitted.

[0055] In the bonding apparatus 1A according to this modified example, when the bottom stage 10 is in the reference position, the bottom stage 10 is slightly pulled upward by the top stage 20 via the stationary positioning mechanism 50A, causing the support member 38 to undergo tensile elastic deformation. As a result, the convex portion 15A fits snugly into the concave portion 25, and the bottom stage 10 is stationary and in a fixed position. Therefore, variations in the placement position when placing the first workpiece 91 on the bottom holding base 11 can be suppressed. After the support of the first workpiece 91 by the bottom holding base 11 and the support of the second workpiece 92 by the top holding base 21 are completed, the top stage 20 begins to descend, and when the tensile force acting on the support member 38 is removed, the bottom stage 10 descends slightly and stops. The position where the bottom stage 10 stops is the position where the load acting on the support member 38 in relation to the bottom stage 10 and the reaction force of the support member 38 are balanced. After the bottom stage 10 stops, as the top stage 20 continues to descend, the small piece 24 separates downward from the protrusion 15A, and the engagement between the protrusion 15A and the recess 25 is released. As a result, the bottom stage 10 becomes capable of moving in three dimensions, both horizontally and vertically. Note that in the manufacturing of bonded parts using the bonding device 1A, the process S4 shown in Figure 2, which is performed when using the bonding device 1 (see Figure 1), is not performed.

[0056] As the top stage 20 descends further, the first workpiece 91 and the second workpiece 92 move closer together, and the projection 97 of the second workpiece 92 enters the recess 96 of the first workpiece 91, causing the recess 96 and the projection 97 to fit together completely. If, during the process of the recess 96 and the projection 97 fitting together, the apex of the projection 97 in the planar position does not align with the deepest part of the recess 96, the bottom stage 10 moves horizontally to adjust its planar position as the projection 97 descends and the contact area with the recess 96 increases. Since the bottom stage 10 is supported by a spring-loaded support member 38 on the base 31, it can move horizontally while descending, making it easy to align the first workpiece 91 and the second workpiece 92 in a planar view. When the recess 96 and the projection 97 are fully fitted together, the bottom stage 10 is separated from the base 31, so the top stage 20 continues to descend to bring the bottom stage 10 into contact with the base 31. Then, even after the bottom stage 10 has come into contact with the base 31, the top stage 20 is pressed downward with a predetermined force to apply a predetermined force to the first workpiece 91 and the second workpiece 92, thereby bonding the first workpiece 91 and the second workpiece 92 together.

[0057] Once the bonding of the first workpiece 91 and the second workpiece 92 is complete, the support of the second workpiece 92 by the top holder 21 is released, and the top stage 20 is raised. Typically, when the top holder 21 separates from the second workpiece 92, the external force acting on the support member 38 is removed, and the support member 38 returns to its natural state (i.e., the load related to the bottom stage 10 acting on the support member 38 and the reaction force of the support member 38 are balanced). As a result, the plane of the convex portion 15A and the concave portion 25 aligns. As the top stage 20 rises further, the convex portion 15A fits into the concave portion 25, and when the support member 38 is slightly stretched and the convex portion 15A and the concave portion 25 fit together perfectly, the bottom stage 10 returns to its reference position. At this point, the top stage 20 has returned to the state before bonding began. Once this state is reached, the support of the bonded parts by the bottom holder 11 is released, and the bonded parts can be removed. As explained above, the bonding apparatus 1A according to this modified example and the method for manufacturing bonded parts using it also produce the same effects and advantages as the bonding apparatus 1 (see Figure 1) and the method for manufacturing bonded parts using it.

[0058] In the above description, the fitting structure 95 is assumed to have a recess 96 formed in the first workpiece 91 and a projection 97 provided in the second workpiece 92. However, the recess 96 may be formed in the second workpiece 92 and the projection 97 may be provided in the first workpiece 91. Alternatively, for each pair of recesses 96 and projections 97 provided, the location of the recess 96 and projection 97 on either the first workpiece 91 or the second workpiece 92 may be changed. For example, in one fitting structure 95, the recess 96 may be formed in the first workpiece 91 and the projection 97 may be provided in the second workpiece 92, while in another fitting structure 95, the recess 96 may be formed in the second workpiece 92 and the projection 97 may be provided in the first workpiece 91.

[0059] In the above description, the protrusion 15 in the bonding device 1 is assumed to be formed in the shape of a frustum (typically a frustum of a cone), but it may also be formed in the shape of a cone (typically a cone). Similarly, the protrusion 15A in the bonding device 1A is assumed to be formed in the shape of a cone (typically a cone), but it may also be formed in the shape of a frustum (typically a frustum of a cone).

[0060] In the above description, the protrusion 15 in the bonding device 1 is assumed to be formed in the shape of a frustocone, where the horizontal cross-sectional area decreases as it goes upwards. However, it may also be formed in the shape of a columnar (typically cylindrical) or tubular (typically cylindrical) shape, where the shape of the horizontal cross-section does not change even if the position in the axial direction changes. Even if it is formed in this way, it can still function as a stationary mechanism. Similarly, the protrusion 15A in the bonding device 1A may also be formed in the shape of a columnar (typically cylindrical) or tubular (typically cylindrical) shape, where the shape of the horizontal cross-section does not change even if the position in the axial direction changes.

[0061] In the above explanation, the expandable member 29 in the bonding device 1 is assumed to be a spring, but it may be an expandable member other than a spring, such as rubber.

[0062] In the above description, the stationary positioning mechanisms 50 and 50A are assumed to be configured to serve as both a stationary mechanism and a positioning mechanism. However, the stationary mechanism and the positioning mechanism may be configured separately and each may operate independently.

[0063] In the above description, the bonding device 1 is provided with a protrusion 15, a pressing member 26, and a small piece 34 and side wall 33 with a recess 35 formed therein. However, if a stationary positioning mechanism 50 is not required, these may be omitted. Similarly, in the bonding device 1A, if a stationary positioning mechanism 50A is not required, the upright portion 13, flange portion 14 and protrusion 15A, and the small piece 24 and side wall 23 with a recess 25 formed therein may be omitted.

[0064] In the above explanation, the support member 38 is assumed to be a spring, but depending on the situation, for example, when metal cannot be used, an elastomer such as rubber, sponge, bellows, etc. may be used.

[0065] In the above description, it was assumed that the support member 38 uses a spring (i.e., an elastic member) that allows the bottom stage 10 to move in three dimensions relative to the base 31. However, the support member 38 only needs to be able to support the bottom stage 10 so that it can move in at least a two-dimensional plane relative to the base 31, and such a configuration may consist of two flat plate-shaped members that can move relative to each other along their surfaces. In this case, it is preferable to move the two flat plate-shaped members parallel to the mounting surface on the bottom holding base 11 (i.e., the surface on which the first workpiece 91 is placed).

[0066] In the above description, the bottom stage 10 is configured to be movable in at least a two-dimensional plane, and typically in three dimensions, by the support member 38. However, the top stage 20 may also be made movable in two or three dimensions using a configuration equivalent to that of the support member 38.

[0067] In the above description, it was assumed that the moving device 42 moves the top stage 20 in the near-far direction FN, but it may also move the base 31 in the near-far direction FN, or both the top stage 20 and the base 31 may be moved to move them relatively in the near-far direction FN. Also, in the above description, it was assumed that the moving device 42 is attached to the top stage 20 and moves the top stage 20 directly, but it may also move indirectly by interposing, for example, gears, transmission belts, or other components. The same applies when the moving device 42 moves the base 31.

[0068] In the above description, the bonding apparatus 1, 1A and the method for manufacturing the bonded parts have been described with reference to the figures as illustrative embodiments. The configuration, structure, number, arrangement, shape, material, etc. of each part in this description are not limited to the above specific examples, and those that are appropriately selected and adopted by those skilled in the art are also included in the scope of the present invention, as long as they encompass the gist of the present invention.

[0069] All documents cited herein, including publications, patent applications, and patents, are incorporated here by reference to the same extent as each document is individually and specifically identified and its contents are described herein.

[0070] The use of nouns and similar demonstrative pronouns in connection with the description of the present invention (particularly in connection with the following claims) shall be construed as both singular and plural unless otherwise specifically noted herein or if it is clearly inconsistent with the context. The words “equip,” “have,” “include,” and “incorporate” shall be construed as open-ended terms (i.e., “include, but not limited to”) unless otherwise specifically noted herein. The numerical ranges described herein are intended solely as abbreviations for referring individually to each value falling within that range, unless otherwise specifically noted herein, and each value is incorporated into the specification as if it were individually enumerated herein. All methods described herein may be performed in any appropriate order unless otherwise specifically noted herein or if it is clearly inconsistent with the context. Any examples or illustrative phrases used herein (e.g., “etc.”) are intended solely to better illustrate the present invention and not to impose any limitations on the scope of the present invention, unless otherwise specifically asserted. No phrase in the specification shall be construed as indicating that any element not described in the claims is essential to the practice of the present invention.

[0071] This specification describes preferred embodiments of the Invention, including the best mode known to the inventors for carrying out the Invention. Those skilled in the art will see, upon reading the above description, that variations of these preferred embodiments will become apparent. The inventors anticipate that skilled persons will apply such variations as appropriate, and that the Invention will be carried out in ways other than those specifically described herein. Therefore, the Invention includes all modifications and equivalents of the claims appended herein, as permitted by applicable law. Furthermore, any combination of the above elements in all variations is incorporated into the Invention unless otherwise specifically noted herein or is obviously inconsistent with the context.

Claims

1. A bonding apparatus for bonding a first workpiece and a second workpiece, wherein the first workpiece and the second workpiece have a fitting structure that allows them to fit together appropriately when bonded in the correct positions, and comprising: a first stage for supporting the first workpiece; a second stage for supporting the second workpiece at a position opposite to the first workpiece; a base; a moving device for moving at least one of the base and the second stage directly or indirectly in the near and far directions, which are directions toward and away from each other; and a support member for supporting the first stage so as to be movable in at least a two-dimensional plane in a direction intersecting the near and far directions with respect to the base.

2. The bonding apparatus according to claim 1, wherein the support member is an elastic member that can be deformed in the near-far direction and in a direction intersecting the near-far direction, and the first stage is movable relative to the base in the near-far direction and in a direction intersecting the near-far direction.

3. The bonding apparatus according to claim 1 or claim 2, further comprising a stationary mechanism for stationary the first stage in the position where the first workpiece is installed.

4. The bonding apparatus according to claim 3, further comprising a positioning mechanism for stationary positioning the first stage.

5. The bonding apparatus according to claim 4, wherein the positioning mechanism includes a first component provided on the first stage and a second component provided on the stationary mechanism, and the first component and the second component include a convex portion formed on one of the first component and the second component and a concave portion formed on the other, the convex portion being fittable into the concave portion.

6. The bonding apparatus according to claim 5, wherein the convex portion is formed in a conical or frustum shape, and the concave portion is tapered.

7. The bonding apparatus according to claim 5, wherein the second stage has a pressing member that presses the first component or the first stage to disengage the protrusion from the recess.

8. A method for manufacturing a bonded part by bonding a first workpiece and a second workpiece using a bonding apparatus according to any one of claims 1 to 7, comprising: a step of supporting the first workpiece with the first stage; a step of supporting the second workpiece with the second stage; a step of moving at least one of the base and the second stage toward each other to fit the fitting structure on the first workpiece and the second workpiece; and a step of moving at least one of the base and the second stage toward each other to press the first workpiece and the second workpiece, with the fitting structure fitted to them, toward each other to bond them together.

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