Radio frequency filter and communication device comprising same

Abstract

This communication device comprises a plurality of radio frequency (RF) filters, and the RF filters may each comprise: a housing including a plurality of side wall portions; a plurality of resonant elements, each of the resonant elements being shaped to protrude in the perpendicular direction from a reference surface of the housing in a cavity space formed by corresponding side wall portions among the plurality of side wall portions; a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements in the housing, and spaced apart from the reference surface; a cover plate coupled at the top; a first conductive portion; and a second conductive portion. The first conductive portion may include a first end, which has a first surface facing the first resonant element and is spaced apart from the first resonant element, and a second end, which has a second surface facing the second resonant element and is spaced apart from the second resonant element.

Description

Radio frequency filter and communication device including the same

[0001] The following descriptions relate to a radio frequency (RF) filter and a communication device including said RF filter.

[0002] Products equipped with multiple antennas are being developed to enhance communication performance. It is expected that equipment featuring an even greater number of antennas will be used. As the number of antennas in communication devices increases, the number of associated RF components (e.g., RF filters) inevitably increases as well.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to embodiments of the present disclosure, a radio frequency (RF) filter device is provided. The RF filter device may include a housing comprising a plurality of sidewall portions; a plurality of resonant elements, wherein each resonant element of the plurality of resonant elements has a shape protruding vertically from a reference plane of the housing within a cavity space formed through a corresponding sidewall portion among the plurality of sidewall portions; a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the reference plane of the housing; and a cover plate coupled to the top of the housing. The metal structure may include a first conductive portion having a longitudinal direction corresponding to the direction from the first resonant element to the second resonant element; and a second conductive portion extending vertically from a point of the first conductive portion and coupled to the cover plate. The first conductive portion may include a first end spaced apart from the first resonant element having a first surface facing the first resonant element and a second end spaced apart from the second resonant element having a second surface facing the second resonant element.

[0005] According to embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of RF (radio frequency) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include a housing comprising a plurality of sidewall portions; a plurality of resonant elements, wherein each of the plurality of resonant elements has a shape protruding vertically from a reference plane of the housing within a cavity space formed through a corresponding sidewall portion among the plurality of sidewall portions; a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the reference plane of the housing; and a cover plate coupled to the top of the housing. The metal structure may include a first conductive portion having a longitudinal direction corresponding to the direction from the first resonant element to the second resonant element; and a second conductive portion extending vertically from a point of the first conductive portion and coupled to the cover plate. The first conductive portion may include a first end spaced apart from the first resonant element having a first surface facing the first resonant element and a second end spaced apart from the second resonant element having a second surface facing the second resonant element.

[0006] According to embodiments of the present disclosure, a radio frequency (RF) filter device is provided configured to pass signals having frequencies within a predefined frequency range among input signals. The filter device may include: an input port for receiving the input signals; an output port for providing the signals; a housing comprising a base plate and a plurality of sidewall portions, wherein each of the sidewall portions and the base plate forms a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, wherein each resonant element of the plurality of resonant elements is disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and is coupled to a cover plate at the top of the housing; and a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and may include a second conductive portion that extends from one point of the first conductive portion to the cover plate and is coupled to the cover plate.

[0007] According to embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of RF (radio frequency) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include an input port for receiving input signals; an output port for providing signals having frequencies within a predefined frequency range among the input signals; a housing comprising a base plate and a plurality of sidewall portions, each of the sidewall portions and the base plate forming a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, each resonant element of the plurality of resonant elements may include a cover plate disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and coupled at the top of the housing; and a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and may include a second conductive portion that extends from one point of the first conductive portion to the cover plate and is coupled to the cover plate.

[0008] According to embodiments of the present disclosure, a radio frequency (RF) filter device is provided that is configured to pass signals having frequencies within a predefined frequency range among input signals. The RF filter device may include: an input port for receiving the input signals; an output port for providing the signals; a housing comprising a base plate and a plurality of sidewall portions, wherein each of the sidewall portions and the base plate form a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, wherein each resonant element of the plurality of resonant elements is disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and may include a cover plate coupled at the top of the housing; and a plurality of metal structures. Each metal structure may be disposed between two of the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The plurality of metal structures may include a first metal structure disposed between a first resonant element and a second resonant element. The first metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and a second conductive portion extending from one point of the first conductive portion to the cover plate and coupled to the cover plate.

[0009] According to embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of RF (radio frequency) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include an input port for receiving input signals; an output port for providing signals having frequencies within a predefined frequency range among the input signals; a housing comprising a base plate and a plurality of sidewall portions, each of the sidewall portions and the base plate forming a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, each resonant element of the plurality of resonant elements may include a cover plate disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and coupled at the top of the housing; and a plurality of metal structures. Each metal structure may be disposed between two of the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The plurality of metal structures may be disposed between a first resonant element and a second resonant element. The first metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and a second conductive portion extending from one point of the first conductive portion to the cover plate and coupled to the cover plate.

[0010] Figure 1 shows a wireless communication system.

[0011] Figure 2 shows examples of components of a communication device.

[0012] Figure 3a shows an example of an RF (radio frequency) filter.

[0013] Figure 3b is a diagram illustrating the principle of a metal cavity filter.

[0014] Figure 4 shows an example of an RF filter including a metal structure.

[0015] Figure 5 shows an example of an RF filter including a metal structure.

[0016] FIGS. 6a, FIGS. 6b, and FIGS. 6c show the amount of inductive coupling according to the shape of the metal structure.

[0017] Figures 7a, 7b, 7c, and 7d show examples of the shapes of metal structures.

[0018] Figures 8a and 8b show examples of communication modules including RF filters.

[0019] Figures 9a and 9b show examples of communication devices.

[0020] FIGS. 10a and FIGS. 10b show examples of cross-sections of a communication device.

[0021] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0022] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0023] Terms referring to components of an electronic device used in the following description (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), board, PBA (printed board assembly), module, antenna, antenna board, antenna element, antenna element, circuit, processor, chip, component, or device), terms referring to the shape of a component (e.g., plate, substrate, structure, structure, support, contact, or protrusion), terms referring to a part of a component (e.g., point, section, region), terms referring to connections between structures (e.g., connection part, joint part, contact part, weld part, connection part, contact part, support part, contact structure, conductive member, or assembly), terms referring to a circuit (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, or Terms such as "combiner" are provided as examples for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as "...part," "...device," "...object," or "...body" used below may refer to at least one shape structure or a unit that processes a function.

[0024] Additionally, in this disclosure, expressions such as "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions such as "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of the elements from A (including A) to B (including B). Below, "C" and / or "D" refers to at least one of "C" or "D," i.e., including {"C," "D," and "C" and "D"}. Furthermore, below, the meaning of "approximately E" may be substituted with a value within an error range of ±5% or ±10% based on E.

[0025] FIG. 1 illustrates a wireless communication system. The wireless communication environment of FIG. 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), a third terminal (120-3)) as a part of the nodes using a wireless channel.

[0026] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance over which it can transmit signals. In addition to being a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5G node (5th generation node)', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit)), 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU)', remote radio head (RRH)', communication device, or other terms having an equivalent technical meaning. The base station (110) can transmit downlink signals or receive uplink signals.

[0027] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without user involvement. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as 'user equipment (UE)', 'mobile station', 'subscriber station', 'customer premises equipment (CPE)', 'remote terminal', 'wireless terminal', 'electronic device', or 'vehicle terminal', 'user device', or other terms having an equivalent technical meaning.

[0028] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. Therefore, to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, a base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0029] A key technology for enhancing the data capacity of 5G communication is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. However, increasing the number of RF paths leads to larger product sizes, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using dividers (or splitters) in the RF paths. Here, the antenna elements corresponding to the RF paths may be referred to as sub-arrays. As a non-limiting example, sub-array technology may be utilized to increase the signal radiation gain. An antenna array may include multiple sub-arrays. The antennas of the antenna array may be divided into the multiple sub-arrays. The signal may be radiated through each of the antennas of the sub-arrays.

[0030] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain a communication device including an antenna, but the embodiments of the present disclosure are not limited thereto. As a communication device according to the embodiments of the present disclosure, in addition to the base station (110), any wireless equipment performing a function equivalent to that of a base station, wireless equipment connected to a base station (e.g., TRP), the terminal (120) of FIG. 1, or other communication equipment used for 5G communication is possible. Hereinafter, as a structure of multiple antennas for communication in a MIMO (Multiple Input Multiple Output) environment, an antenna array composed of sub-arrays is described as an example, but it is not limited to examples where easy modifications for beamforming are possible.

[0031] FIG. 2 illustrates examples of components of a communication device. The communication device may be a base station (110) of FIG. 1 or a component of the base station (110). Meanwhile, unlike what is illustrated, the present disclosure does not exclude the possibility that the communication device may be implemented in a terminal (120).

[0032] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna section (211), a filter section (212), an RF (radio frequency) processing section (213), and a processor (214).

[0033] The antenna section (211) may include a plurality of antennas. The antennas may perform functions for transmitting and receiving signals over a wireless channel. The antennas may include a radiator made of a conductor (e.g., a metal structure) or a conductive pattern formed on a substrate (e.g., a PCB, a non-conductive substrate (e.g., a plastic substrate)). The antennas may radiate upconverted signals over a wireless channel or acquire signals radiated by another device. Each antenna may be referred to by an antenna element, an antenna component, an antenna radiator, a radiating part, a radiator, and / or equivalent technical terms. The antenna section (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna section (211) may be electrically connected to the filter section (212) via RF signal lines. For example, a plurality of antenna elements of the antenna section (211) may be coupled to a board (e.g., a PCB, a non-conductive substrate). The antenna elements may be disposed on one side of the board, or a module on which the antenna elements are disposed (e.g., a module including a non-conductive substrate and a radiating structure disposed on the non-conductive substrate) may be disposed. The board may include RF signal lines connecting each antenna element and the RF filters of the filter section (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiating board, a radiating board, an RF board, an RF board, and / or an equivalent technical term.

[0034] The filter section (212) can perform filtering to transmit a signal of a desired frequency. The filter section (212) may include a plurality of RF filters. The RF filters can perform the function of selectively passing a frequency by forming resonance. The filter section (212) may include at least one of a band-pass filter, a low-pass filter, a high-pass filter, or a band-reject filter. The filter section (212) may include RF circuits for obtaining a signal in a frequency band for transmission or a frequency band for reception. Each RF filter of the filter section (212) may be electrically connected to the antennas of the antenna section (211) and the RF processing circuit of the RF processing section (213). According to one embodiment, one or more RF filters may be placed on the same board as the board on which the antennas are placed (hereinafter referred to as the antenna board). For example, the antennas may be placed on a first surface of the antenna board, and the one or more RF filters may be placed on a second surface opposite to the first surface of the antenna board. As another example, the antennas and the one or more RF filters may be placed on one surface of the antenna board. According to another embodiment, the one or more RF filters may be placed on a board other than the antenna board where the antennas are placed (e.g., a main board where the RF processing unit (213) and the processor (214) are placed).

[0035] The RF processing unit (213) may include a plurality of RF processing circuits. An RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through an antenna. An RF processing circuit may include a plurality of paths corresponding to the antennas. At least one RF processing circuit may be referred to as an RF chain. An RF chain may include a plurality of RF elements. For example, the RF processing unit (213) may include a communication chip (e.g., RFIC). The RF elements may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The up converter and the DAC form part of the transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Additionally, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. For example, the communication device (210) may include a board having a stacked structure in the order of an antenna unit (211), a filter unit (212), and an RF processing unit (213).As another example, the communication device (210) may include a board having a stacked structure in the order of filter section (212) - RF processing section (213) and an antenna board having an antenna section (211) arranged thereon.

[0036] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating the transmitted bit sequence. Also, for example, when receiving data, the processor (214) restores the received bit sequence by demodulating and decoding the baseband signal. The processor (214) may perform the functions of a protocol stack required by the communication standard.

[0037] In FIG. 2, functional components of a communication device (210) are described as a communication device including a plurality of antennas. However, the example shown in FIG. 2 is merely an exemplary configuration of a communication device including an RF filter described below, and the embodiments of the present disclosure are not limited to the descriptions of the components of the communication device shown in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationships of the components are different, any device including an RF filter described below (e.g., a communication device, a communication module) can be understood as an embodiment of the present disclosure.

[0038] FIG. 3a shows an example of an RF (radio frequency) filter. The RF filter (300) may be included in the filter section (212) of FIG. 2. For the RF filter (300), the descriptions of the filter section (212) may be referenced.

[0039] Referring to FIG. 3a, the RF filter (300) may be configured to pass electromagnetic waves within a specific frequency range and attenuate electromagnetic waves with frequencies outside the specific frequency range. The RF filter (300) may include an input port (301) and an output port (302). Through frequency filtering, signals having frequency components within a specific frequency range among the signals transmitted to the input port (301) may be provided to the output port (302). The RF filter (300) may be a metal cavity filter. The metal cavity filter may be configured to resonate electromagnetic waves using an empty space (hereinafter referred to as a cavity space) surrounded by a conductor. The RF filter (300) may include a housing (310) and a cover plate (315) coupled to the top of the housing (310). The housing (310) may include a plurality of side wall portions. Each of the plurality of side wall portions may form a cavity space. Each side wall portion and cover plate (315) can form a cavity space.

[0040] The RF filter (300) may include a plurality of resonant elements (320). For example, the RF filter (300) may include a first resonant element (321), a second resonant element (322), a third resonant element (323), a fourth resonant element (324), a fifth resonant element (325), a sixth resonant element (326), a seventh resonant element (327), and / or an eighth resonant element (328). Each of the plurality of resonant elements (320) may have a metal material. Each resonant element may have a shape protruding in one direction (e.g., the (+)z-axis direction) from the base plate (380) (e.g., the bottom surface) of the housing (310). A resonant element or a combination of a resonant element and a tuning element may be referred to as a resonator. By enabling the surrounding signal to resonate at a specific frequency, the resonator may be configured to block or pass the component of the signal at the specific frequency. An RF filter (300) having one or more resonators may be configured to pass signals having frequencies within a predefined frequency range. The RF filter (300) may have a higher order and improved selectivity through multiple resonators. Accordingly, the squat characteristics of the filter may be improved. In terms of forming resonance within space, the resonant element may be referred to as a resonant structure, resonant part, pole, resonant pole, resonant load, and / or equivalent technical terms in addition to a resonator. The resonant element may be made of a metal material. For example, each resonant element of a plurality of resonant elements (320) may have a shape in which a metal rod and a metal plate are placed on said metal rod. A resonant element may be placed in each cavity space.

[0041] The RF filter (300) may include a plurality of tuning elements (330). The plurality of tuning elements (330) may be coupled to a cover plate (315). According to one embodiment, each tuning element may be used to adjust a frequency range for frequency filtering. For example, the tuning elements may be positioned between resonant elements or adjacent to resonant elements when the RF filter (300) is viewed from above. For example, the plurality of tuning elements (330) may include a first tuning element (331), a second tuning element (332), a third tuning element (333), a fourth tuning element (334), a fifth tuning element (335), a sixth tuning element (336), a seventh tuning element (337), an eighth tuning element (338), and / or a ninth tuning element (339). For example, the tuning elements may be positioned above the resonant elements. For example, a plurality of tuning elements (330) may include a first tuning element (351) placed on a first resonant element (321), a second tuning element (352) placed on a second resonant element (322), a third tuning element (353) placed on a third resonant element (323), a fourth tuning element (354) placed on a fourth resonant element (324), a fifth tuning element (355) placed on a fifth resonant element (325), a sixth tuning element (356) placed on a sixth resonant element (326), a seventh tuning element (357) placed on a seventh resonant element (327), and / or an eighth tuning element (358) placed on an eighth resonant element (328). The characteristics of the filter may be determined according to the relative position of the tuning elements with respect to the resonant elements. For example, at least some of the plurality of tuning elements (330) may be tuning bolts. A portion of the tuning element can be positioned within the cavity space through the rotation of the tuning bolt. Multiple tuning elements (330) may have a metal material.A frequency range for frequency filtering can be determined according to the space formed through the housing (310), a plurality of resonant elements (320), and a plurality of tuning elements (330).

[0042] In FIG. 3a, an example is described in which the input port (301) and the output port (302) are each positioned on the side (e.g., the yz plane), but the embodiments of the present disclosure are not limited thereto. For example, the input port (301), where the RF signal is transmitted, and / or the output port (302), where the signal is output, may be formed on the bottom surface (e.g., the xy plane) instead of the side.

[0043] FIG. 3b is a diagram illustrating the principle of a metal cavity filter (e.g., RF filter (300)).

[0044] Referring to FIG. 3b and example (380a), the RF filter (300) may include a resonator (e.g., a second resonant element (322) and a second tuning element (352)). The second resonant element (322) may include a metal rod (322a) and a metal plate (322b). The second resonant element (322) may be spaced apart from the second tuning element (352). The second resonant element (322) may be made of metal and function as an inductor. The gap between the second resonant element (322) and the second tuning element (352) may function as a capacitor. Referring to example (380b), the structure of the resonator of the second resonant element (322) and the second tuning element (352) may be represented as an equivalent circuit in which an inductor and a capacitor are connected in parallel.

[0045] The RF filter (300) may include a plurality of resonators. Each resonator may be represented by an equivalent circuit of example (380b). A coupling may be formed between two adjacent resonators. By transferring energy through the coupling, at least some of the signals from the input port of the RF filter (300) may be transmitted to the output port. For example, if an inductive coupling is formed between two adjacent resonators (e.g., second resonator (322), third resonator (323)), an equivalent circuit such as the first circuit (391) of example (380a) may be formed for the two resonators. At least some of the signals from the first input port (391a) may be transmitted to the first output port (391b). Inductive coupling indicates that energy is transferred between two conductors via a magnetic field. For example, if capacitive coupling is formed between two adjacent resonators (e.g., second resonator element (322), seventh resonator element (327)), an equivalent circuit such as the second example (392) of example (380a) can be formed for the two resonators. At least some of the signals from the first input port (392a) can be transmitted to the second output port (392b). Capacitive coupling indicates that energy is transferred between two conductors via an electric field. In this way, an RF filter (300) can be designed so that inductive or capacitive coupling is formed between two adjacent resonators among a plurality of resonators. As the amount of coupling formed between the two resonators increases, the gain of the signal output through the RF filter (300) can be increased. As the gain of the signal increases, broadband characteristics can be improved.

[0046] An RF filter (300) can be designed with a combination of at least one inductor and at least one capacitor. The inductor can form a magnetic field to store the flow of a signal in the surrounding magnetic field. The capacitor can pass a signal when there is a change in current or voltage between disconnected conductors. Resonance exhibits a phenomenon with frequency-selective characteristics, and the impedance of the inductor and the impedance of the capacitor may vary depending on the frequency. Resonance may occur at an impedance with low energy loss. For resonance to occur in a resonator, the imaginary component of the combined impedance of the inductor and the capacitor must be zero. The resonant frequency may be determined by the inductance of the inductor and the capacitance of the capacitor. An RF filter (e.g., RF filter (300)) containing multiple resonators may have multiple resonant frequencies due to the connection relationships between the multiple resonators. The resonant frequency at a specific resonator may affect the resonant frequency at a resonator adjacent to said specific resonator. As coupling becomes stronger, the interaction between resonant frequencies can increase. Therefore, as the amount of coupling increases, the spacing between resonant frequencies can widen as the degree of separation between them increases.

[0047] The demand for broadband communication equipment from telecommunications operators is increasing, and more coupling is required to support this. Meanwhile, miniaturization and weight reduction of communication devices (e.g., communication device (210)) are very important factors for enhancing product competitiveness. Since multiple RF filters (e.g., RF filter (300)) are required for beamforming, the size and weight of individual filters can have a direct impact on product competitiveness. The RF filter may be a metal cavity filter. The metal cavity filter may include a coupling structure for controlling the amount of coupling. However, the space for placing the coupling structure within the metal cavity filter may be limited. There is a limit to the coupling value that can be provided through the coupling structure within the limited space. To mitigate the above-mentioned problem, embodiments of the present disclosure describe the structure of an RF filter (e.g., RF filter (300)) to ensure a sufficient amount of coupling between two adjacent resonators. The RF filter (300) may be configured to pass signals of a specific frequency range and block (or reject) signals outside the specific frequency range through resonant elements, coupling between resonant elements, and group delay between an input port (301) and / or an output port (302). The RF filter (300) according to embodiments of the present disclosure may include a metal structure for coupling between resonant elements (e.g., inductive coupling for an inductor of an equivalent circuit and / or capacitive coupling for a capacitor of an equivalent circuit). Descriptions of the metal structure are described in detail through FIGS. 4, FIGS. 5, FIGS. 6a, FIGS. 6b, and FIGS. 6c.

[0048] FIG. 4 shows an example of an RF filter (e.g., RF filter (300)) including a metal structure. FIG. 5 shows an example of an RF filter (e.g., RF filter (300)) including a metal structure. The RF filter may be a metal cavity. The resonator of the RF filter may function as a circuit that passes signals of frequencies within a required frequency range by forming resonance. Filtering characteristics (e.g., band-pass characteristics, band-cut characteristics) may be determined according to the shape of the RF filter. FIG. 4 corresponds to a perspective view of at least a portion of the RF filter, and FIG. 5 shows a front view of at least a portion of the RF filter.

[0049] Referring to FIG. 4, the RF filter (300) may correspond to a metal cavity filter comprising a plurality of resonators. FIG. 4 illustrates an RF filter comprising two resonators to illustrate a metal structure (440) disposed between the resonators. However, embodiments of the present disclosure are not limited thereto. An RF filter (300) comprising three or more resonators may also be understood as an embodiment of the present disclosure.

[0050] The RF filter (300) may include a housing (410). The housing (410) may correspond to at least a portion of the housing (310) of FIG. 3A. The housing (410) may include a plurality of sidewall portions. A sidewall portion refers to a portion of the housing (410) for forming a space for frequency resonance. The space may be referred to as a cavity space or an opening space, or, in the aspect where a resonant element described later is placed, as a receiving space, mounting space, or resonant space, or referred to by an equivalent technical term. The housing (410) may form a plurality of cavity spaces by the sidewall portions. For example, the RF filter (300) may be a metal cavity filter and the sidewall portions may be made of a metal material. At least one side of the cavity space may be open so that a signal can pass through the RF filter (300). A signal may be transmitted through an open area (hereinafter, open space) spanning adjacent cavity spaces. For example, the plurality of sidewall portions may include first sidewall portions (411) and second sidewall portions (412). The first sidewall portions (411) may form a first cavity space. The second sidewall portions (412) may form a second cavity space. The sidewall portions for describing embodiments of the present disclosure may be used to form a cavity space as part of a housing (410). The sidewall portions may be referred to as bulkhead portions, bulkheads, walls, wall portions, receiving members, sidewalls, isolation members, and / or equivalent technical terms in addition to sidewall portions.

[0051] The RF filter (300) may include a plurality of resonant elements (420). A resonant element may be disposed in each cavity space. For example, a first resonant element (421) may be disposed in a first cavity space. The first resonant element (421) may have a shape protruding in a vertical direction (e.g., in the (+)z-axis direction) from one side (480) of the housing (410) (e.g., the xy plane, base plate (380)). For example, the first resonant element (421) may correspond to the first resonant element (321) of the RF filter (300). A second resonant element (422) may be disposed in a second cavity space. The second resonant element (422) may have a shape protruding in a vertical direction (e.g., in the (+)z-axis direction) from one side (480) of the housing (410) (e.g., the xy plane, base plate (380)). The second resonant element (422) may correspond to the second resonant element (322) of the RF filter (300). As resonators are arranged in the cavity space of the housing (410) within the RF filter (300), electromagnetic waves of a specific frequency may be repeatedly reflected. Signals in the RF filter (300) may be transmitted through the radio waves, allowing signals of a desired frequency band to pass through. For example, the RF filter (300) may output signals corresponding to the passband among the input signals. Although not shown in FIG. 4, the RF filter (300) may include a cover plate (e.g., a cover plate (315)). The cover plate may be coupled with tuning elements (450). For example, the tuning elements (450) may include a first tuning element (451) and a second tuning element (452). The first tuning element (451) may be placed on the first resonant element (421) and spaced apart from the first resonant element (421) at a certain distance. The first resonant element (421) and the first tuning element (451) may function as resonators. The second tuning element (452) may be placed on the second resonant element (422) and spaced apart from the second resonant element (422) at a certain distance.The second resonant element (422) and the second tuning element (452) can function as resonators.

[0052] An RF filter (300) according to embodiments of the present disclosure may include a metal structure (440). The metal structure (440) may be used to adjust the characteristics of the RF filter (300) by controlling the amount of coupling (e.g., inductive coupling) from a resonant element (e.g., a first resonant element (421)) to another resonant element (e.g., a second resonant element (422)). For example, as tuning of the resonant frequency is performed according to the coupling according to the metal structure (440), the bandwidth passed by the RF filter (300) may be adjusted. The metal structure (440) may be referred to as a conductive part, a conductive structure, a coupling part, a coupling structure, a coupling tuner, a coupling member, and / or equivalent structural or technical terms other than a metal structure. According to one embodiment, the metal structure (440) may be positioned between a first resonator (e.g., including a first resonator element (421)) and a second resonator (e.g., including a second resonator element (422)) among a plurality of resonators of the RF filter (300). For broadband, it may be required to increase the amount of coupling between the resonators. As many signals travel from resonator to resonator through inductive coupling, the strength of the passed signal may increase. As the signal strength increases, the frequency range of the signal having a gain above a threshold (e.g., -10 dB) may be widened. According to one embodiment, the metal structure (440) may be positioned spaced apart from the base plate (380) and sidewall portions (e.g., first sidewall portions (411), second sidewall portions (412)). As the partition is spaced apart from the base plate (380) instead of being formed integrally with the side wall portion as part of the housing, the amount of signal leaking to ground can be reduced. As the amount of leakage is reduced, the signal gain moving from the resonator (e.g., including the first resonant element (421)) to the resonator (e.g., including the second resonant element (422)) can be increased.

[0053] The metal structure (440) may include a first conductive portion (441) and a second conductive portion (442). The first conductive portion (441) may have a longitudinal direction corresponding to the direction (e.g., x-axis direction) from the first resonant element (421) to the second resonant element (422). The first conductive portion (441) may include a first end (441a) and a second end (441b). The first end (441a) may have a first surface facing the first resonant element (421) and may be spaced apart from the first resonant element (421). The second end (441b) may have a second surface facing the second resonant element (422) and may be spaced apart from the second resonant element (422). The second conductive portion (442) may be formed by extending in one direction (e.g., the (+)z-axis direction) from a point (460) of the first conductive portion (441). The second conductive portion (442) may have a length direction corresponding to the said one direction. The second conductive portion (442) may be coupled to a cover plate (e.g., a cover plate (315)) of the housing (410). According to one embodiment, at least a portion of the first conductive portion (441) may include the shape of a metal pillar parallel to the base plate (380) of the housing (410) and having a height corresponding to the direction from the first resonant element (421) to the second resonant element (422) (e.g., the (+)x-axis direction). According to one embodiment, at least a portion of the second conductive portion (442) may include the shape of a metal pillar coupled to the cover plate (315) and having a height corresponding to the vertical direction (e.g., the (+)z-axis direction).

[0054] According to embodiments of the present disclosure, the metal structure (440) may include a first conductive portion (441) having height in a horizontal direction (e.g., a direction parallel to the xy plane) and a second conductive portion (442) having height in a vertical direction (e.g., a z-axis direction). The second conductive portion (442) of the metal structure (440) may be understood as an additional resonator positioned between two resonators. As the distance between the resonators decreases, the amount of coupling may increase. Due to the placement of the second conductive portion (442), inductive coupling may be formed. The first conductive portion (441) may be positioned between the first resonant element (421) and the second resonant element (422). The first end (441a) of the first conductive portion (441) may have a first surface facing the first resonant element (421). A capacitor may be formed between the first end (441a) and the first resonant element (421). The second end (441b) of the first conductive portion (441) may have a second surface facing the second resonant element (422). A capacitor may be formed between the second end (441b) and the second resonant element (422). The second conductive portion (442) may be formed by extending vertically from a point (460) of the first conductive portion (441). A portion of the first conductive portion (441) and the second conductive portion (442) may function as an inductor. The metal structure (440) may provide a parallel connection of the capacitor and the inductor. The pass-through frequency range of the RF filter (300) may be increased through the L-notch resulting from the parallel connection.

[0055] According to embodiments of the present disclosure, the shape of the metal structure (440) and / or the position of the metal structure (440) within the RF filter (300) may affect the pass frequency range of the RF filter (300). According to one embodiment, the depth of the metal structure (440) (e.g., the length from the cover plate (315) to the first conductive portion (441) along the z-axis) may affect the pass frequency range of the RF filter (300). According to one embodiment, the width of the metal structure (440) (e.g., the length along the length of the first conductive portion (441) along the x-axis) may affect the pass frequency range of the RF filter (300). According to one embodiment, the coupling thickness of the metal structure (440) (e.g., the radius of the cross-section of the first conductive portion (441) along the y-axis) may affect the pass frequency range of the RF filter (300).

[0056] In FIGS. 4 and 5, two cavity spaces are illustrated to explain the RF filter (300), but this is exemplary and the embodiments of the present disclosure are not limited thereto. The RF filter (300) may include a plurality of cavity spaces and a resonant element disposed in each cavity space. According to one embodiment, the RF filter (300) may include two or more resonant metal structures (e.g., metal structures (440)). The metal structures (440) may be disposed according to the locations required for bandwidth tuning. For example, at least a portion of the metal structure (440) may be placed between two adjacent resonant elements among the resonant elements of the RF filter (300) (e.g., the first resonant element (321), the second resonant element (322), the third resonant element (323), the fourth resonant element (324), the fifth resonant element (325), the sixth resonant element (326), the seventh resonant element (327), and / or the eighth resonant element (328) of FIG. 3A). As an example, the metal structure (440) may be placed between every two adjacent resonant elements among the resonant elements. As an example, the metal structure (440) may not be placed between every two adjacent resonant elements among the resonant elements, but may be placed intermittently.

[0057] In FIGS. 4 and 5, an example is illustrated in which a metal structure (440) is disposed between two resonators (e.g., a first resonator element (421), a second resonator element (422)), but embodiments of the present disclosure are not limited thereto. The metal structure (440) may be disposed closer to one side rather than in the center of the two resonators, or may be disposed between one resonator and a side wall of the housing rather than between the two resonators. Additionally, in FIGS. 4 and 5, a hexagonal cavity space is illustrated as a space for a cavity filter, but embodiments of the present disclosure are not limited thereto. For example, an RF filter comprising a metal structure disposed across two cavity spaces, in which rectangular cavity spaces are disposed within the housing, may also be understood as an embodiment of the present disclosure.

[0058] FIGS. 6a, FIGS. 6b, and FIGS. 6c illustrate the amount of inductive coupling according to the shape of a metal structure (e.g., metal structure (440)). The amount of inductive coupling can be measured through an RF filter (300) including the metal structure (440) exemplified in FIGS. 4 and 5.

[0059] Referring to FIG. 6a, the graph (600a) represents the amount of inductive coupling according to the depth of the metal structure (440) (e.g., the length from the cover plate (315) to the first conductive portion (441) along the z-axis or the length in the longitudinal direction of the second conductive portion (442). The horizontal axis of the graph (600a) represents the length in the longitudinal direction of the second conductive portion (442) (unit: mm (millimeter)), and the vertical axis of the graph (600a) represents the amount of inductive coupling (unit: MHz (megahertz)). The amount of inductive coupling represents the difference between the bandwidth in the resonant mode of the RF filter (300) when the metal structure (440) is included and the bandwidth in the resonant mode of the RF filter when the metal structure (440) is not included. According to one embodiment, the depth of the metal structure (440) (e.g., the length from the cover plate (315) to the first conductive portion (441) along the z-axis) may affect the pass frequency range of the RF filter (300).

[0060] Referring to FIG. 6b, the graph (600b) represents the amount of inductive coupling according to the width of the metal structure (440) (e.g., the length of the first conductive portion (441) along the x-axis). The horizontal axis of the graph (600b) represents the length of the first conductive portion (441) along the x-axis (unit: mm), and the vertical axis of the graph (600b) represents the amount of inductive coupling (unit: MHz). The amount of inductive coupling represents the difference between the bandwidth in the resonant mode of the RF filter (300) when the metal structure (440) is included and the bandwidth in the resonant mode of the RF filter when the metal structure (440) is not included. According to one embodiment, the width of the metal structure (440) (e.g., the length of the first conductive portion (441) along the x-axis) may affect the pass frequency range of the RF filter (300).

[0061] Referring to FIG. 6c, graph (600c) represents the amount of inductive coupling according to the coupling thickness of the metal structure (440) (e.g., the radius of the cross-section of the first conductive part (441) on the y-axis). The horizontal axis of graph (600c) represents the thickness of the first conductive part (441) (unit: mm), and the vertical axis of graph (600c) represents the amount of inductive coupling (unit: MHz). The amount of inductive coupling represents the difference between the bandwidth in the resonant mode of the RF filter (300) when the metal structure (440) is included and the bandwidth in the resonant mode of the RF filter when the metal structure (440) is not included. According to one embodiment, the thickness of the first conductive part (441) (e.g., the radius of the cross-section of the first conductive part (441) on the y-axis) may affect the pass frequency range of the RF filter (300).

[0062] Figures 7a, 7b, 7c, and 7d show examples of the shapes of metal structures.

[0063] Referring to FIG. 7a, the RF filter (300) may correspond to a metal cavity filter comprising a plurality of resonators. The RF filter (300) may include a housing (410). The housing (410) may include a plurality of sidewall portions. The plurality of sidewall portions may include first sidewall portions (411) and second sidewall portions (412). The first sidewall portions (411) may form a first cavity space. The second sidewall portions (412) may form a second cavity space. The RF filter (300) may include a plurality of resonant elements (420). A resonant element may be disposed in each cavity space. The RF filter (300) may include tuning elements (450) coupled to a cover plate. The tuning elements (450) may include a first tuning element (451) and a second tuning element (452). The first resonant element (421) and the first tuning element (451) can operate as resonators. The second resonant element (422) and the second tuning element (452) can operate as resonators. For each component, the descriptions of FIGS. 4 and FIGS. 5 may be referenced.

[0064] To cause inductive coupling (or L-coupling, L-notch) for broadband, a metal structure (740a) may be placed between two resonators of the RF filter (300). According to one embodiment, the metal structure (740a) may include a first conductive portion (741a) and a second conductive portion (742a). The first conductive portion (741a) may have a longitudinal direction corresponding to the direction (e.g., x-axis direction) from the first resonant element (421) to the second resonant element (422). The second conductive portion (742a) may be formed by extending in one direction (e.g., (+)z-axis direction) from a point (760a) of the first conductive portion (741a). Based on the longitudinal direction (e.g., x-axis direction) of the first conductive portion (741a), the first end of the first conductive portion (741a) is positioned to face the first resonant element (421), and the second end of the first conductive portion (741a) can be connected to the second conductive portion (742). The first conductive portion (741a) and the second conductive portion (742a) are formed integrally and may have an 'L' shape.

[0065] Referring to FIG. 7b, the RF filter (300) may correspond to a metal cavity filter comprising a plurality of resonators. The RF filter (300) may include a housing (410). The housing (410) may include a plurality of sidewall portions. The plurality of sidewall portions may include first sidewall portions (411) and second sidewall portions (412). The first sidewall portions (411) may form a first cavity space. The second sidewall portions (412) may form a second cavity space. The RF filter (300) may include a plurality of resonant elements (420). A resonant element may be disposed in each cavity space. The RF filter (300) may include tuning elements (450) coupled to a cover plate. The tuning elements (450) may include a first tuning element (451) and a second tuning element (452). The first resonant element (421) and the first tuning element (451) can operate as resonators. The second resonant element (422) and the second tuning element (452) can operate as resonators. For each component, the descriptions of FIGS. 4 and FIGS. 5 may be referenced.

[0066] To cause inductive coupling (or L-coupling, L-notch) for broadband, a metal structure (740b) may be placed between two resonators of the RF filter (300). According to one embodiment, the metal structure (740b) may include a first conductive portion (741b) and a second conductive portion (742b). The first conductive portion (741b) may have a longitudinal direction corresponding to the direction (e.g., x-axis direction) from the first resonant element (421) to the second resonant element (422). The second conductive portion (742b) may be formed by extending in one direction (e.g., (+)z-axis direction) from a point (760b) of the first conductive portion (741b). The first conductive portion (741b) may include a first end (741ba) having a first surface facing the first resonant element (421) and a second end (741bc) having a second surface facing the second resonant element (422). The first end (741ba) of the first conductive portion (741b) may include a first portion facing the first resonant element (421) and a second portion extending from the first portion and having a length direction corresponding to a direction perpendicular to the length direction (e.g., (+)z-axis direction). The second end (741bc) of the first conductive portion (741b) may include a fourth portion facing the second resonant element (422) and a fourth portion extending from the third portion and having a length direction corresponding to a direction perpendicular to the length direction (e.g., (+)z-axis direction). The first conductive portion (741b) may include a column portion (741bb) having a longitudinal direction (e.g., x-axis direction) between the first end (741ba) and the second end (741bc). The second conductive portion (742b) may have a column shape extending from a point (760b) of the column portion (741bb) to a cover plate (e.g., cover plate (315)). The first conductive portion (741b) and the second conductive portion (742a) may be formed integrally to have a 'mountain' shape.

[0067] Referring to FIG. 7c, the RF filter (300) may correspond to a metal cavity filter comprising a plurality of resonators. The RF filter (300) may include a housing (410). The housing (410) may include a plurality of sidewall portions. The plurality of sidewall portions may include first sidewall portions (411) and second sidewall portions (412). The first sidewall portions (411) may form a first cavity space. The second sidewall portions (412) may form a second cavity space. The RF filter (300) may include a plurality of resonant elements (420). A resonant element may be disposed in each cavity space. The RF filter (300) may include tuning elements (450) coupled to a cover plate. The tuning elements (450) may include a first tuning element (451) and a second tuning element (452). The first resonant element (421) and the first tuning element (451) can operate as resonators. The second resonant element (422) and the second tuning element (452) can operate as resonators. For each component, the descriptions of FIGS. 4 and FIGS. 5 may be referenced.

[0068] To cause inductive coupling (or L-coupling, L-notch) for broadband, a metal structure (740c) may be placed between two resonators of the RF filter (300). According to one embodiment, the metal structure (740c) may include a first conductive portion (741c) and a second conductive portion (742c). The first conductive portion (741c) may have a longitudinal direction corresponding to the direction (e.g., x-axis direction) from the first resonant element (421) to the second resonant element (422). The second conductive portion (742c) may be formed by extending in one direction (e.g., (+)z-axis direction) from a point (760c) of the first conductive portion (741c). With respect to the longitudinal direction (e.g., x-axis direction) of the first conductive portion (741c), the first end (741ca) of the first conductive portion (741c) may be positioned to face the first resonant element (421). With respect to the longitudinal direction (e.g., x-axis direction) of the first conductive portion (741c), the second end (741cb) of the first conductive portion (741c) may be positioned to face the second resonant element (422). The first conductive portion (741c) and the second conductive portion (742c) may be formed integrally. To tune the pass-through frequency range, the shape of the first end (741ca) and the shape of the second end (741cb) may be asymmetric with respect to the second conductive portion (742c). For example, the shape of the first end (741ca) and the shape of the second end (741cb) may be different.

[0069] Referring to FIG. 7d, the RF filter (300) may correspond to a metal cavity filter comprising a plurality of resonators. The RF filter (300) may include a housing (410). The housing (410) may include a plurality of sidewall portions. The plurality of sidewall portions may include first sidewall portions (411) and second sidewall portions (412). The first sidewall portions (411) may form a first cavity space. The second sidewall portions (412) may form a second cavity space. The RF filter (300) may include a plurality of resonant elements (420). A resonant element may be disposed in each cavity space. The RF filter (300) may include tuning elements (450) coupled to a cover plate. The tuning elements (450) may include a first tuning element (451) and a second tuning element (452). The first resonant element (421) and the first tuning element (451) can operate as resonators. The second resonant element (422) and the second tuning element (452) can operate as resonators. For each component, the descriptions of FIGS. 4 and FIGS. 5 may be referenced.

[0070] To cause inductive coupling (or L-coupling, L-notch) for broadband, a metal structure (740d) may be placed between two resonators of the RF filter (300). According to one embodiment, the metal structure (740d) may include a first conductive portion (741d) and a second conductive portion (742d). The first conductive portion (741d) may have a longitudinal direction corresponding to the direction (e.g., x-axis direction) from the first resonant element (421) to the second resonant element (422). The second conductive portion (742d) may be formed by extending in one direction (e.g., (+)z-axis direction) from a point (760d) of the first conductive portion (741d). Based on the length direction (e.g., x-axis direction) of the first conductive part (741d), the first end (741da) of the first conductive part (741d) may have an 'L' shape on one plane (e.g., xy-plane). The first end (741da) of the first conductive part (741d) may include a first part facing the first resonant element (421) and a second part extending from the first part and having a length direction corresponding to a direction perpendicular to the length direction (e.g., (-)y-axis direction). Based on the length direction (e.g., x-axis direction) of the first conductive part (741d), the second end (741dc) of the first conductive part (741d) may have an 'L' shape on one plane (e.g., xy-plane). The second end (741dc) of the first conductive portion (741d) may include a third portion facing the second resonant element (422) and a fourth portion extending from the third portion and having a length direction corresponding to a direction perpendicular to the length direction (e.g., (+)y-axis direction). The first conductive portion (741d) and the second conductive portion (742d) may be formed integrally. To tune the pass-through frequency range, the shape of the first end (741da) and the shape of the second end (741db) may be symmetric with respect to a point (760d).

[0071] According to embodiments of the present disclosure, the RF filter (300) may include two or more metal structures (e.g., metal structures). Since the RF filter (300) includes a plurality of resonators, it may include two or more metal structures to implement an inductor having a high coupling amount between two adjacent resonators. The shape of each metal structure and / or the position of the metal structure (440) within the RF filter (300) may affect the pass-through frequency range of the RF filter (300). Even metal structures of the same filter device may have different shapes and / or positions within the housing (310). For example, the RF filter (300) may include a second metal structure positioned between a third resonant element and a fourth resonant element. The second metal structure may also include a third conductive portion having a longitudinal direction corresponding to the direction between the two resonators and a fourth conductive portion extending vertically from one point of the third conductive portion and coupled to a cover plate (315). According to one embodiment, the depth of the metal structure (440) (e.g., the length from the cover plate (315) to the first conductive portion (441) along the z-axis) may differ from the depth of the second metal structure (e.g., the length from the cover plate (315) to the third conductive portion along the z-axis). According to one embodiment, the width of the metal structure (440) (e.g., the length along the length of the first conductive portion (441) along the x-axis) may differ from the width of the second metal structure (e.g., the length along the length of the third conductive portion along the x-axis). According to one embodiment, the coupling thickness of the metal structure (440) (e.g., the radius of the cross-section of the first conductive portion (441) along the y-axis) may differ from the width of the second metal structure (e.g., the radius of the cross-section of the third conductive portion along the y-axis).

[0072] FIGS. 8A and 8B illustrate examples of communication modules including an RF filter (e.g., RF filter (300)). In addition to being a communication module, the communication module may be referred to as an antenna module, an antenna filter module, an antenna filter unit, an antenna unit, an access module, a wireless module, a wireless communication module, a radio frequency communication module, a wireless unit, a wireless unit module, and / or equivalent technical terms. FIG. 8A illustrates components on a first plane with respect to a substrate (e.g., board (810)) of the communication module, and FIG. 8B illustrates components on a second plane opposite to the first plane.

[0073] Referring to FIG. 8a, a communication module (800) (e.g., antenna module, RF module) may include a plurality of antennas. For the antennas, the description of the antenna section (211) of FIG. 2 may be referenced. Each of the plurality of antennas may be referred to as an antenna element. Each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. The communication module (800) may include a board (810) for arranging the plurality of antennas. The board (810) may be referred to by technical terms other than board, such as wireless unit substrate, wireless unit board, antenna substrate, antenna board, radiating substrate, radiating board, RF board, RF substrate, and / or equivalent.

[0074] A key technology for improving data capacity is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased or the power per RF path must be increased. Increasing the number of RF paths results in a larger product size, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using a splitter (or divider) in the RF path. The unit of multiple antenna elements connected to the RF path can be referred to as a sub-array. The multiple antennas of FIG. 8a can be divided into multiple sub-arrays. A communication module (800) may include multiple sub-arrays. The multiple sub-arrays may include antenna elements. For example, the communication module (800) may include 32 sub-arrays. Each sub-array may include three antenna elements. For example, the communication module (800) may include a sub-array (820). The sub-array (820) may include a first antenna element (821), a second antenna element (822), and a third antenna element (823).

[0075] One or more subarrays may be placed on a substrate (e.g., subarray substrate, insulating plate, insulating plate, subarray plate, radiating substrate, radiating plate, and / or referred to by equivalent technical terms). Each subarray may be connected to an RF path for a first polarization and an RF path for a second RF polarization. The first polarization and the second polarization may be perpendicular to each other. For example, the first polarization may correspond to vertical polarization and the second polarization may correspond to horizontal polarization. For example, the first polarization may correspond to (+)45 degree polarization and the second polarization may correspond to (-)45 degree polarization. Signals for the first polarization may be provided to each of the antenna elements of each subarray from the RF path for the first polarization. Signals for the second polarization may be provided to each of the antenna elements of each subarray from the RF path for the second polarization. Signals for a first polarization or signals for a second polarization may be provided to each of the antenna elements of the sub-array through a conductive pattern formed on the substrate. For example, the first antenna element (821), the second antenna element (822), and the third antenna element (823) of the sub-array (820) may be placed on the substrate (840). The sub-array (820) may be connected to the first conductive pattern (831) and the second conductive pattern (832). The first conductive pattern (831) may be configured to provide a signal of the first polarization from a wireless communication circuit (e.g., RFIC) to each antenna element of the sub-array (820). The second conductive pattern (832) may be configured to provide a signal of the second polarization from a wireless communication circuit (e.g., RFIC) to each antenna element of the sub-array (820). Each of the first conductive pattern (831) and the second conductive pattern (832) can be formed on the substrate (840).The communication module (800) may include 32 conductive patterns for a first polarization and 32 conductive patterns for a second polarization for each of the 32 sub-arrays.

[0076] Referring to FIG. 8b, a filter board (850) may be coupled to a board (810). The filter board (850) may represent a substrate for coupling a plurality of RF filters. For the RF filters, the description of the filter section (212) of FIG. 2 and the RF filter (300) of FIG. 3a through FIG. 7d may be referenced. In an example that is not limited, a number of RF filters may be coupled directly to the board (810) without a separate filter board (850). Antennas may be placed on a first surface of the board (810) via an antenna substrate (e.g., substrate (840)), and RF filters may be placed on a second surface opposite the first surface via a filter board (850) (or may be referred to as a filter substrate). In an example that is not limited, the antennas and the RF filters may be placed on the same surface of the board (810).

[0077] The communication module (800) may include a plurality of RF filters. For example, the plurality of RF filters may include an RF filter (300). For the RF filter (300), the descriptions of the RF filter (300) in FIGS. 3a through 7d may be referenced. In addition, the RF filter exemplified through FIGS. 9a, 9b, 10a, and 10b may also be referenced for the RF filter (300). As an example, the communication module (800) may include 64 RF filters. Each of the RF filters may correspond to an RF path. The RF path may be specified in sub-arrays and polarization units. The communication module (800) may include 32 sub-arrays. Each sub-array may be connected to conductive patterns for two polarizations (e.g., a first conductive pattern (831) and a second conductive pattern (832)). A single RF path from a wireless communication circuit (e.g., RFIC, wireless communication chip) may be associated with a single conductive pattern. The communication module (800) may include 32 RF filters corresponding to 32 conductive patterns for a first polarization. The communication module (800) may include 32 RF filters corresponding to 32 conductive patterns for a second polarization.

[0078] As the number of antennas increases, the complexity of RF components for processing RF signals may increase. Due to leasing costs or spatial constraints of installation sites, it may be required to make RF components (e.g., RF filter (300)) small, lightweight, and inexpensive. Furthermore, as communication equipment is implemented in a form where multiple RF components are assembled, the tolerances that occur during the assembly of RF components increase, which may cause performance degradation. To resolve these problems, the RF filter (e.g., RF filter (300)) according to the embodiments of the present disclosure may increase the amount of inductive coupling of the RF filter through a metal structure (e.g., metal structure (440)) instead of using a coupling wall structure that is coupled to two resonant elements. As the amount of inductive coupling increases, a wideband is possible, and as the coupling wall structure is omitted, the RF filter (300) can be made lighter. The implementation of the present disclosure can be confirmed by identifying a metal structure (e.g., metal structure (440)) having a first conductive portion (e.g., first conductive portion (441)) disposed between two resonators within an RF filter (300) and a second conductive portion (e.g., second conductive portion (442)) extending vertically (e.g., z-axis direction) from a point (e.g., one point (460)) of the first conductive portion.

[0079] FIGS. 9a and 9b illustrate examples of communication devices (e.g., communication device (210)). The communication device (210) may be referred to as a base station (110), a radio unit (RU), or an MMU.

[0080] Referring to FIG. 9a, in example (900a), the communication device (210) may include a front housing (901), an antenna assembly (902), a shield can (903), a circuit assembly (904), and a rear housing (905). According to one embodiment, the antenna assembly (902), the shield can (903), and the circuit assembly (904) may be understood as components of an antenna module. In terms of the antenna assembly (902) and the circuit assembly (904) being separable, the antenna module may be understood to have a separable structure.

[0081] The communication device (210) may include a front housing (901). The front housing (901) may be configured to enclose an antenna assembly (902). The front housing (901) may protect a plurality of antennas (or antenna elements) of the antenna assembly (902). In terms of protecting the plurality of antennas, it may be referred to as a front cover, antenna cover, radome, and / or an equivalent technical term. As an example, but not limited to, the front housing (901) may be configured to reduce transmission loss of the frequency band used in the communication device (210). One region of the front housing (901) may be composed of a material with excellent radio wave transmittance and excellent environmental resistance.

[0082] The communication device (210) may include an antenna assembly (902). The antenna assembly (902) may include a plurality of antennas. For example, the antenna assembly (902) may include a plurality of antennas and an antenna board on which the plurality of antennas (e.g., antenna elements, antenna arrays, antenna sub-arrays) are arranged. For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna section (211) of FIG. 2 may be referenced. The antenna board may be referred to as a radiating substrate, a radiating plate, an insulating substrate, and / or equivalent technical terms in addition to an antenna board. If the antenna board includes an insulating substrate, a conductive pattern formed on the insulating substrate may be used as a feed line to each radiator.

[0083] The communication device (210) may include a shield can (903) and a circuit assembly (904). The circuit assembly (904) may include a printed circuit board (PCB) and a plurality of components disposed on the PCB. The PCB may be referred to by technical terms such as main board, main board, main board, digital board, and / or equivalent, in that major RF components are disposed on the PCB. In addition to the circuit assembly, the circuit assembly (904) may be referred to by technical terms such as a filter assembly, main assembly, wireless assembly, wireless module, RU module, RU assembly, and / or equivalent. For example, the circuit assembly (904) may include RF filter(s) (e.g., filter section (212)), RF processing circuit(s) (e.g., RF processing section (213), power amplifier module (PAM)), processor(s) (e.g., processor (214)), and / or a circulator. A shield can (903) may be used to shield electromagnetic waves from a plurality of components placed on the PCB and to reduce interference and noise. For example, due to the shield can (903), the influence on signals emitted through a plurality of antennas by at least some of the components of the circuit assembly (904) may be reduced. The shield can (903) may be placed between the antenna assembly (902) and the circuit assembly (904). In an example that is not limited, an RF filter, an RF processing circuit, and a circulator may be placed on a first side of the PCB, and a processor may be placed on a second side of the PCB opposite to the first side. In an example that is not limited, an RF filter, an RF processing circuit, a circulator, and a processor may be placed together on one side of the PCB.

[0084] The communication device (210) may include a rear housing (905). The rear housing (905) may be used to protect at least some of the components of the communication device (210). The rear housing (905) may include a heat sink for heat dissipation. The heat sink may be configured to dissipate heat generated by at least some of the components of the circuit assembly (904) to the outside.

[0085] Referring to FIG. 9b, in example (900b), the communication device (210) may include a front housing (951), an antenna module (952), and a rear housing (953). According to one embodiment, the antenna module (952) may include an antenna board. The antenna board of the antenna assembly (902) of FIG. 9a and the main PCB of the circuit assembly (904) may be designed as a single substrate. The single substrate may be referred to as the antenna board of the antenna module (952). In terms of the antenna assembly (902) and the circuit assembly (904) being implemented through a common board, the antenna module may be understood to have an integrated structure.

[0086] The communication device (210) may include a front housing (951). The front housing (951) may be configured to enclose an antenna assembly (902). The front housing (951) may protect a plurality of antennas (or antenna elements) of the antenna assembly (902). In terms of protecting the plurality of antennas, it may be referred to as a front cover, antenna cover, radome, and / or an equivalent technical term. As an example, but not limited to, the front housing (951) may be configured to reduce transmission loss of the frequency band used in the communication device (210). A portion of the front housing (951) may be composed of a material with excellent radio wave transmittance and excellent environmental resistance.

[0087] The communication device (210) may include an antenna module (952). The antenna module (952) may include a plurality of antennas, an antenna board on which the plurality of antennas (e.g., antenna elements, antenna arrays, antenna sub-arrays) are arranged, components for RF signal processing, and a processor (e.g., processor (214)) for processing baseband signals. For example, the components for RF signal processing may include RF filter(s) (e.g., filter section (212)), RF processing circuit(s) (e.g., RF processing section (213), power amplifier module (PAM)), and / or a circulator. Each of the plurality of antennas may include a radiating structure. Each radiating structure may be formed of a conductive material. For the plurality of antennas, the descriptions of the antenna section (211) of FIG. 2 may be referenced. The antenna board may be referred to as a radiating substrate, a radiating plate, a main board, a main substrate, and / or equivalent technical terms, in addition to the antenna board.

[0088] The communication device (210) may include a rear housing (953). The rear housing (953) may be used to protect at least some of the components of the communication device (210). The rear housing (953) may include a heat sink for heat dissipation. The heat sink may be configured to dissipate heat generated by at least some of the components of the antenna module (952) to the outside.

[0089] FIGS. 10a and FIGS. 10b show examples of cross-sections of a communication device (e.g., communication device (210)).

[0090] Referring to FIG. 10a, the communication device (210) may include an antenna module having a separable structure (e.g., the structure of FIG. 9a). The antenna module may include a plurality of antennas (or antenna elements) (e.g., the antenna section (211) of FIG. 2) and an antenna board (1010). For example, the antenna module may include a first antenna (1011), a second antenna (1012), and a third antenna (1013). The antennas may be placed on the antenna board (1010). The conductive layers of the antenna board (1010) may be referred to as antenna layers or antenna layer sets. For the antennas, the descriptions of the antenna assembly (902) of FIG. 9a may be referenced. The antenna module may include a main board (1020) and processing components placed on the main board (1020). For example, the processing components may include an RF filter (300) (e.g., filter section (212) of FIG. 2), a processor (1030) (e.g., processor (214) of FIG. 2), a PAM (1060) (e.g., RF processing section (213) of FIG. 2), and a circulator (1065) (e.g., RF processing section (213) of FIG. 2). For the main board (1020) and the processing components, the descriptions of the circuit assembly (904) of FIG. 9a may be referenced. According to one embodiment, the antenna module may include a connecting structure (1045) (e.g., connector, pogo pin) for electrically connecting the RF filter (300) and a region of the antenna board (1010) (e.g., a conductive pattern connected to the first antenna (1011), the second antenna (1012), and the third antenna (1013)). A connecting structure (1045) may be arranged to connect the RF filter (300) and the antenna board (1010). According to one embodiment, the RF filter (300), PAM (1060), and circulator (1065) may be arranged on a first surface of the main board (1020). A processor (1030) may be arranged on a second surface opposite to the first surface of the main board (1020).For electromagnetic shielding of processing components on the main board (1020), the antenna module may include a shield can (1063) (e.g., the shield can (903) of FIG. 9a). To dissipate heat generated from the processor (1030) to the outside, the antenna module may include a heat sink (1070). The heat sink (1070) may be positioned to be connected to (e.g., in contact with) the processor (1030).

[0091] Referring to FIG. 10b, the communication device (210) may include an antenna module having an integrated structure (e.g., the structure of FIG. 9b). The antenna module may include an antenna board (1080). The antenna board (1080) may include a first set of layers (1080a) for antennas and a second set of layers (1080b) for a plurality of processing components. The first set of layers (1080a) may be referred to as antenna layers or an antenna layer set. The first set of layers (1080a) and the second set of layers (1080b) may be formed integrally as an antenna board (1080). The first set of layers (1080a) may be combined with the second set of layers (1080b). A first surface of the first set of layers (1080a) may be combined with the antennas. A second surface opposite to the first surface of the first set of layers (1080a) can be combined with the first surface of the second set of layers (1080b). A second surface opposite to the first surface of the second set of layers (1080b) can be combined with a plurality of processing parts.

[0092] The antenna module may include a plurality of antennas (or antenna elements) (e.g., the antenna section (211) of FIG. 2). For example, the antennas may include a first antenna (1011), a second antenna (1012), and a third antenna (1013). The antennas may be placed on an antenna board (1080). The antennas may be placed on a first set of layers of the antenna board (1080) (e.g., the top layer among the first set of layers). The antenna module may include a plurality of processing components. For example, the processing components may include an RF filter (300) (e.g., the filter section (212) of FIG. 2), a processor (1030) (e.g., the processor (214) of FIG. 2), a PAM (1060) (e.g., the RF processing section (213) of FIG. 2), and a circulator (1065) (e.g., the RF processing section (213) of FIG. 2). The plurality of processing components may be disposed on an antenna board (1080). The plurality of processing components may be disposed on a second set of layers of the antenna board (1080) (e.g., the lowest layer among the second set of layers). For the antennas and the processing components, the description of the antenna module (952) of FIG. 9b may be referenced. According to one embodiment, the antenna module may include a connection structure (1045) (e.g., a connector) for electrically connecting the RF filter (300) and the antennas (e.g., a conductive pattern connected to the first antenna (1011), the second antenna (1012), and the third antenna (1013)). The connection structure (1045) may be disposed across the layers of the antenna board (1080). According to one embodiment, the antenna module may include a heat sink (1070) to dissipate heat generated from at least some of the processing components (e.g., processor (1030), PAM (1060)) to the outside. For example, the heat sink (1070) may be positioned to be connected to (e.g. to be in contact with) the processor (1030).For example, the heat sink (1070) can be positioned to be connected to (e.g., in contact with) the PAM (1060).

[0093] According to embodiments of the present disclosure, metal structures of various shapes can be realized depending on the size of the space and the amount of coupling. In embodiments of the present disclosure, inductive coupling can be achieved over a wide band through variations in the depth, thickness, and width of the metal structure. By forming an L-notch, a wider pass-through frequency range can be obtained. Furthermore, since a separate conductive member (e.g., L-coupling wall) for connecting adjacent resonant elements is omitted, the weight of the housing (e.g., housing (310)) can be reduced.

[0094] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0095] According to embodiments of the present disclosure, a radio frequency (RF) filter device is provided. The RF filter device may include a housing comprising a plurality of sidewall portions; a plurality of resonant elements, wherein each resonant element of the plurality of resonant elements has a shape protruding vertically from a reference plane of the housing within a cavity space formed through a corresponding sidewall portion among the plurality of sidewall portions; a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the reference plane of the housing; and a cover plate coupled to the top of the housing. The metal structure may include a first conductive portion having a longitudinal direction corresponding to the direction from the first resonant element to the second resonant element; and a second conductive portion extending vertically from a point of the first conductive portion and coupled to the cover plate. The first conductive portion may include a first end spaced apart from the first resonant element having a first surface facing the first resonant element and a second end spaced apart from the second resonant element having a second surface facing the second resonant element.

[0096] For example, at least a portion of the first conductive portion may include the shape of a metal pillar parallel to the reference plane of the housing and having a height corresponding to the direction from the first resonant element to the second resonant element. At least a portion of the second conductive portion may include the shape of a metal pillar coupled to the cover plate and having a height corresponding to the vertical direction.

[0097] For example, the first resonant element may include a first metal rod and a first metal plate coupled to the first metal rod. The second resonant element may include a second metal rod and a second metal plate coupled to the second metal rod. The first conductive portion may be disposed between the first metal plate and the second metal plate.

[0098] For example, the first resonant element may be disposed within a first cavity space formed through a first sidewall portion among the plurality of sidewall portions. The second resonant element may be disposed within a second cavity space formed through a second sidewall portion among the plurality of sidewall portions. The metal structure may be disposed across the first cavity space, the second cavity space, and the open space between the first cavity space and the second cavity space.

[0099] For example, the RF filter device may include a plurality of tuning elements coupled to the cover plate. The plurality of tuning elements may include a first tuning element spaced apart from the first resonant element in the vertical direction and a second tuning element spaced apart from the second resonant element in the vertical direction. The plurality of tuning elements may not include a tuning element coupled to the region between the first tuning element and the second tuning element on the cover plate.

[0100] For example, the RF filter device may include a second metal structure disposed between a third resonant element and a fourth resonant element among the plurality of resonant elements within the housing and spaced apart from the reference plane of the housing. The height of the metal structure from the reference plane of the housing and the height of the second metal structure from the reference plane of the housing may be different.

[0101] For example, the first end of the first conductive part and the second end of the first conductive part may be arranged symmetrically with respect to the point connected to the second conductive part.

[0102] For example, the first end may have an 'L' shape from a point of the first conductive portion when viewed from the reference plane of the housing. The second end may have an 'L' shape from a point of the first conductive portion when viewed from the reference plane of the housing.

[0103] For example, the first end may have an 'L' shape comprising a first portion having a longitudinal direction toward the first resonant element and a second portion extending from the first portion having a longitudinal direction corresponding to the vertical direction. The second end may have an 'L' shape comprising a third portion having a longitudinal direction toward the second resonant element and a fourth portion extending from the third portion having a longitudinal direction corresponding to the vertical direction. The first end and the second end may be symmetrical with respect to the second conductive portion of the metal structure.

[0104] For example, the shape of the first end of the first conductive portion and the shape of the second end of the first conductive portion may be asymmetric with respect to the second conductive portion.

[0105] According to embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of RF (radio frequency) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include a housing comprising a plurality of sidewall portions; a plurality of resonant elements, wherein each of the plurality of resonant elements has a shape protruding vertically from a reference plane of the housing within a cavity space formed through a corresponding sidewall portion among the plurality of sidewall portions; a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the reference plane of the housing; and a cover plate coupled to the top of the housing. The metal structure may include a first conductive portion having a longitudinal direction corresponding to the direction from the first resonant element to the second resonant element; and a second conductive portion extending vertically from a point of the first conductive portion and coupled to the cover plate. The first conductive portion may include a first end spaced apart from the first resonant element having a first surface facing the first resonant element and a second end spaced apart from the second resonant element having a second surface facing the second resonant element.

[0106] For example, at least a portion of the first conductive portion may include the shape of a metal pillar parallel to the reference plane of the housing and having a height corresponding to the direction from the first resonant element to the second resonant element. At least a portion of the second conductive portion may include the shape of a metal pillar coupled to the cover plate and having a height corresponding to the vertical direction.

[0107] For example, the first resonant element may include a first metal rod and a first metal plate coupled to the first metal rod. The second resonant element may include a second metal rod and a second metal plate coupled to the second metal rod. The first conductive portion may be disposed between the first metal plate and the second metal plate.

[0108] For example, the first resonant element may be disposed within a first cavity space formed through a first sidewall portion among the plurality of sidewall portions. The second resonant element may be disposed within a second cavity space formed through a second sidewall portion among the plurality of sidewall portions. The metal structure may be disposed across the first cavity space, the second cavity space, and the open space between the first cavity space and the second cavity space.

[0109] For example, each of the above RF filters may further include a plurality of tuning elements coupled to the cover plate. The plurality of tuning elements may include a first tuning element spaced apart from the first resonant element in the vertical direction and a second tuning element spaced apart from the second resonant element in the vertical direction. The plurality of tuning elements may not include a tuning element coupled to the region between the first tuning element and the second tuning element on the cover plate.

[0110] For example, each of the above RF filters may further include a second metal structure disposed between the third and fourth resonant elements among the plurality of resonant elements within the housing and spaced apart from the reference plane of the housing. The height of the first metal structure from the reference plane of the housing and the height of the second metal structure from the reference plane of the housing may be different.

[0111] For example, the first end of the first conductive part and the second end of the first conductive part may be arranged symmetrically with respect to the point connected to the second conductive part.

[0112] For example, the first end may have an 'L' shape from a point of the first conductive portion when viewed from the reference plane of the housing. The second end may have an 'L' shape from a point of the first conductive portion when viewed from the reference plane of the housing.

[0113] For example, the first end may have an 'L' shape comprising a first portion having a longitudinal direction toward the first resonant element and a second portion extending from the first portion having a longitudinal direction corresponding to the vertical direction. The second end may have an 'L' shape comprising a third portion having a longitudinal direction toward the second resonant element and a fourth portion extending from the third portion having a longitudinal direction corresponding to the vertical direction. The first end and the second end may be symmetrical with respect to the second conductive portion of the metal structure.

[0114] For example, the shape of the first end of the first conductive portion and the shape of the second end of the first conductive portion may be asymmetric with respect to the second conductive portion.

[0115] According to embodiments of the present disclosure, a radio frequency (RF) filter device is provided configured to pass signals having frequencies within a predefined frequency range among input signals. The filter device may include: an input port for receiving the input signals; an output port for providing the signals; a housing comprising a base plate and a plurality of sidewall portions, wherein each of the sidewall portions and the base plate forms a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, wherein each resonant element of the plurality of resonant elements is disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and is coupled to a cover plate at the top of the housing; and a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and may include a second conductive portion that extends from one point of the first conductive portion to the cover plate and is coupled to the cover plate.

[0116] According to embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of RF (radio frequency) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include an input port for receiving input signals; an output port for providing signals having frequencies within a predefined frequency range among the input signals; a housing comprising a base plate and a plurality of sidewall portions, each of the sidewall portions and the base plate forming a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, each resonant element of the plurality of resonant elements may include a cover plate disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and coupled at the top of the housing; and a metal structure disposed between a first resonant element and a second resonant element among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and may include a second conductive portion that extends from one point of the first conductive portion to the cover plate and is coupled to the cover plate.

[0117] According to embodiments of the present disclosure, a radio frequency (RF) filter device is provided that is configured to pass signals having frequencies within a predefined frequency range among input signals. The RF filter device may include: an input port for receiving the input signals; an output port for providing the signals; a housing comprising a base plate and a plurality of sidewall portions, wherein each of the sidewall portions and the base plate form a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, wherein each resonant element of the plurality of resonant elements is disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and may include a cover plate coupled at the top of the housing; and a plurality of metal structures. Each metal structure may be disposed between two of the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The plurality of metal structures may include a first metal structure disposed between a first resonant element and a second resonant element. The first metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and a second conductive portion extending from one point of the first conductive portion to the cover plate and coupled to the cover plate.

[0118] For example, the first metal structure can function as an inductor to transmit signals between the first resonant element and the second resonant element.

[0119] For example, the amount of coupling of the first metal structure may depend on at least one of the distance between the cover plate and the first conductive portion, the length of the first conductive portion in the longitudinal direction, the area of ​​the first side facing the first resonant element, or the area of ​​the second side facing the first resonant element.

[0120] For example, the first resonant element may be disposed within a first cavity space formed by the first sidewall portion among the plurality of sidewall portions and the base plate. The second resonant element may be disposed within a second cavity space formed by the second sidewall portion among the plurality of sidewall portions and the base plate. The first metal structure may be disposed across the first cavity space, the second cavity space, and the open space between the first cavity space and the second cavity space.

[0121] For example, the plurality of metal structures may include a second metal structure disposed between the third and fourth resonant elements among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing.

[0122] For example, the first conductive portion may include a first end and a second end. The first end may have an 'L' shape including a first portion having a longitudinal direction toward the first resonant element and a second portion extending from the first portion and parallel to the base plate of the housing. The second end may have an 'L' shape including a third portion having a longitudinal direction toward the second resonant element and a fourth portion extending from the third portion and parallel to the base plate of the housing. The first end and the second end may be point-symmetric with respect to a point on the first conductive portion.

[0123] According to embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of RF (radio frequency) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include an input port for receiving input signals; an output port for providing signals having frequencies within a predefined frequency range among the input signals; a housing comprising a base plate and a plurality of sidewall portions, each of the sidewall portions and the base plate forming a cavity space; a plurality of resonant elements corresponding to the plurality of sidewall portions, each resonant element of the plurality of resonant elements may include a cover plate disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions and coupled at the top of the housing; and a plurality of metal structures. Each metal structure may be disposed between two of the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. The plurality of metal structures may be disposed between a first resonant element and a second resonant element. The first metal structure may include a first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and a second conductive portion extending from one point of the first conductive portion to the cover plate and coupled to the cover plate.

[0124] For example, the first metal structure can function as an inductor to transmit signals between the first resonant element and the second resonant element.

[0125] For example, the amount of coupling of the first metal structure may depend on at least one of the distance between the cover plate and the first conductive portion, the length of the first conductive portion in the longitudinal direction, the area of ​​the first side facing the first resonant element, or the area of ​​the second side facing the first resonant element.

[0126] For example, the first resonant element may be disposed within a first cavity space formed by the first sidewall portion among the plurality of sidewall portions and the base plate. The second resonant element may be disposed within a second cavity space formed by the second sidewall portion among the plurality of sidewall portions and the base plate. The first metal structure may be disposed across the first cavity space, the second cavity space, and the open space between the first cavity space and the second cavity space.

[0127] For example, the plurality of metal structures of each RF filter among the above RF filters may include a second metal structure disposed between the third and fourth resonant elements among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing.

[0128] For example, the first conductive portion may include a first end and a second end. The first end may have an 'L' shape including a first portion having a longitudinal direction toward the first resonant element and a second portion extending from the first portion and parallel to the base plate of the housing. The second end may have an 'L' shape including a third portion having a longitudinal direction toward the second resonant element and a fourth portion extending from the third portion and parallel to the base plate of the housing. The first end and the second end may be point-symmetric with respect to a point on the first conductive portion.

[0129] For one or more embodiments, at least one of the components described in one or more of the prior art drawings may be configured to perform one or more operations, techniques, processes and / or methods as described in the present disclosure. For example, a processor (e.g., a baseband processor) described in the present disclosure in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described in the present disclosure. As another example, circuits associated with user equipment (UE), a base station, a network element, etc., as described above in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described herein.

[0130] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0131] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0132] When implemented in software, a computer-readable storage medium (e.g., a non-transient computer-readable storage medium) storing one or more programs (software modules) may be provided. One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0133] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0134] Additionally, the program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WAN (wide area network), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0135] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0136] According to the embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as those performed by the corresponding component among the plurality of components prior to the integration. According to the embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0137] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure.

Claims

1. An RF (radio frequency) filter device configured to pass signals having frequencies within a predefined frequency range among input signals, An input port for receiving the above input signals; An output port for providing the above signals; A housing comprising a base plate and a plurality of side wall portions, wherein each of the side wall portions and the base plate forms a cavity space; A plurality of resonant elements corresponding to the plurality of sidewall portions, each resonant element of the plurality of resonant elements is disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions, and A cover plate joined at the top of the above housing; and It includes a plurality of metal structures, each metal structure being positioned between two of the plurality of resonant elements within the housing and spaced apart from the base plate of the housing, and The plurality of metal structures above include a first metal structure disposed between a first resonant element and a second resonant element, and The above first metal structure is: A first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and A second conductive portion extending from a point of the first conductive portion to the cover plate and coupled to the cover plate, RF filter device.

2. In Claim 1, The first metal structure above functions as an inductor to transmit signals between the first resonant element and the second resonant element, RF filter device.

3. In Claim 2, The amount of coupling of the first metal structure is dependent on at least one of the distance between the cover plate and the first conductive portion, the length of the first conductive portion in the longitudinal direction, the area of ​​the first side facing the first resonant element, or the area of ​​the second side facing the first resonant element. RF filter device.

4. In Claim 1, At least a portion of the first conductive portion comprises a bar shape formed parallel to the base plate of the housing and along the direction from the first resonant element to the second resonant element, and At least a portion of the second conductive portion comprises a bar shape formed along a vertical direction from the base plate to the cover plate. RF filter device.

5. In Claim 1, The first resonant element comprises a first metal rod and a first metal plate coupled to the first metal rod, and The second resonant element comprises a second metal rod and a second metal plate coupled to the second metal rod, and The first conductive portion is disposed between the first metal rod and the second metal rod and spaced apart from the first metal rod and the second metal rod, RF filter device.

6. In Claim 1, The first conductive portion comprises a first end having a first side facing the first resonant element and a second end having a second side facing the second resonant element. The first end of the first conductive portion and the second end of the first conductive portion are symmetrically arranged with respect to the point connected to the second conductive portion. RF filter device.

7. In Claim 1, The first resonant element is disposed within a first cavity space formed by the first sidewall portion among the plurality of sidewall portions and the base plate, and The second resonant element is disposed within a second cavity space formed by the second sidewall portion among the plurality of sidewall portions and the base plate, and The first metal structure is disposed across the first cavity space, the second cavity space, and the open space between the first cavity space and the second cavity space. RF filter device.

8. In Claim 1, The plurality of metal structures include a second metal structure disposed between the third and fourth resonant elements among the plurality of resonant elements within the housing and spaced apart from the base plate of the housing. RF filter device.

9. In Claim 1, The above-mentioned first conductive portion includes a first end and a second end, and The first end portion has an 'L' shape comprising a first portion having a longitudinal direction toward the first resonant element and a second portion extending from the first portion and parallel to the base plate of the housing. The second end portion has an 'L' shape comprising a third portion having a longitudinal direction toward the second resonant element and a fourth portion extending from the third portion and parallel to the base plate of the housing. The first end and the second end are point-symmetric with respect to a point of the first conductive portion. RF filter device.

10. In Claim 1, The first conductive portion comprises a first end having a first side facing the first resonant element and a second end having a second side facing the second resonant element. The shape of the first end of the first conductive portion and the shape of the second end of the first conductive portion are asymmetric with respect to the second conductive portion. RF filter device.

11. In a communication device, Multiple antennas; Multiple RF (radio frequency) filters; and It includes a plurality of RF processing circuits, and Each of the above plurality of RF filters is: Input port for receiving input signals; An output port for providing signals having frequencies within a predefined frequency range among the above input signals; A housing comprising a base plate and a plurality of side wall portions, wherein each of the side wall portions and the base plate forms a cavity space; A plurality of resonant elements corresponding to the plurality of sidewall portions, each resonant element of the plurality of resonant elements is disposed on the base plate within a cavity space formed through the corresponding sidewall portion among the plurality of sidewall portions, and A cover plate joined at the top of the above housing; and It includes a plurality of metal structures, each metal structure being positioned between two of the plurality of resonant elements within the housing and spaced apart from the base plate of the housing, and The above plurality of metal structures are disposed between the first resonant element and the second resonant element, and Among the plurality of metal structures above, the first metal structure is: A first conductive portion having a longitudinal direction from the first resonant element to the second resonant element; and A second conductive portion extending from a point of the first conductive portion to the cover plate and coupled to the cover plate, Communication device.

12. In Claim 11, The first metal structure above functions as an inductor to transmit signals between the first resonant element and the second resonant element, Communication device.

13. In Claim 12, The amount of coupling of the first metal structure is dependent on at least one of the distance between the cover plate and the first conductive portion, the length of the first conductive portion in the longitudinal direction, the area of ​​the first side facing the first resonant element, or the area of ​​the second side facing the first resonant element. Communication device.

14. In Claim 11, At least a portion of the first conductive portion comprises a bar shape formed parallel to the base plate of the housing and along the direction from the first resonant element to the second resonant element, and At least a portion of the second conductive portion comprises a bar shape formed along a vertical direction from the base plate to the cover plate. Communication device.

15. In Claim 11, The first resonant element comprises a first metal rod and a first metal plate coupled to the first metal rod, and The second resonant element comprises a second metal rod and a second metal plate coupled to the second metal rod, and The first conductive portion is disposed between the first metal rod and the second metal rod and spaced apart from the first metal rod and the second metal rod, Communication device.

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