Radio frequency filter and communication device including same

Abstract

This RF filter device may comprise: a housing that includes a first sidewall portion forming a first cavity space and a second sidewall portion forming a second cavity space; a first resonance element disposed inside the first cavity space; a second resonance element disposed inside the second cavity space; a metal structure disposed, between the first resonance element and the second resonance element, inside the housing; a dielectric structure coupled to the metal structure; and a cover plate including a through hole for the dielectric structure and coupled to the upper end of the housing. The metal structure may include: a first conductive portion having a first surface; a second conductive portion having a second surface opposite to the first surface; and a third conductive portion coupled to the dielectric structure and formed to connect the first conductive portion and the second conductive portion. The metal structure may be coupled so as to be capable of rotating inside the housing together with the dielectric structure in accordance with the rotation of the dielectric structure.

Description

Radio frequency filter and communication device including same

[0001] The following descriptions relate to a radio frequency (RF) filter and a communication device including the RF filter.

[0002] Products equipped with multiple antennas are being developed to enhance communication performance. It is expected that devices with even greater numbers of antennas will be used. As the number of antennas in communication devices increases, the number of RF components (e.g., filters) will inevitably increase as well.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, a radio frequency (RF) filter device is provided. The RF filter device may include a housing including a first side wall portion forming a first cavity space and a second side wall portion forming a second cavity space; a first resonant element disposed within the first cavity space; a second resonant element disposed within the second cavity space; a metal structure disposed between the first resonant element and the second resonant element within the housing; a dielectric structure coupled to the metal structure; and a cover plate including a through hole for the dielectric structure and coupled to an upper end of the housing. The metal structure may include a first conductive portion having a first surface; a second conductive portion having a second surface opposite to the first surface; and a third conductive portion coupled to the dielectric structure and formed to connect the first conductive portion and the second conductive portion. The metal structure may be coupled to be rotatable together with the dielectric structure within the housing according to rotation of the dielectric structure.

[0005] In embodiments of the present disclosure, a communication device is provided. The communication device may include a plurality of antennas; a plurality of radio frequency (RF) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include a housing including a first sidewall portion forming a first cavity space and a second sidewall portion forming a second cavity space; a first resonant element disposed within the first cavity space; a second resonant element disposed within the second cavity space; a metal structure disposed between the first resonant element and the second resonant element within the housing; a dielectric structure coupled to the metal structure; and a cover plate including a through hole for the dielectric structure and coupled to an upper end of the housing. The metal structure may include a first conductive portion having a first surface; a second conductive portion having a second surface opposite the first surface; and a third conductive portion coupled to the dielectric structure and formed to connect the first conductive portion and the second conductive portion. The metal structure may be coupled to the dielectric structure so as to be rotatable within the housing according to the rotation of the dielectric structure.

[0006] In embodiments of the present disclosure, a communication device is provided. The communication device may include an antenna board; a plurality of sub-arrays disposed on a first surface of the antenna board, each sub-array including a plurality of antennas; a filter board, a first surface of the filter board coupled to a second surface of the antenna board opposite the first surface; and a plurality of RF filters disposed on the second surface of the filter board opposite the first surface. Each of the plurality of RF filters may include a housing including a plurality of sidewall portions; a resonant element disposed in a cavity space formed by each of the sidewall portions of the plurality of sidewall portions; a metal structure disposed between two resonant elements within the housing; a dielectric structure coupled to the metal structure; and a cover plate including a through hole for the dielectric structure and coupled to an upper end of the housing. The metal structure may be coupled to be rotatable together with the dielectric structure within the housing in accordance with rotation of the dielectric structure.

[0007] Figure 1 shows a wireless communication system.

[0008] Figure 2 shows an example of components of a communication device.

[0009] Figure 3 shows an example of a radio frequency (RF) filter including a coupling structure.

[0010] Figures 4a and 4b are drawings for explaining a notch.

[0011] Figure 5 shows an example of an RF filter including a coupling structure.

[0012] Figure 6 shows an example of an RF filter including a coupling structure.

[0013] Fig. 7 is a drawing for explaining the notch characteristics of an RF filter including a coupling structure.

[0014] Figures 8a and 8b illustrate examples of communication modules including RF filters.

[0015] Figures 9a, 9b, and 9c illustrate examples of covers including through holes for limiting the rotational range of the coupling structure.

[0016] Figures 10a, 10b, and 10c illustrate examples of fixed members for limiting the rotational range of a coupling structure.

[0017] Figures 11a, 11b, 11c, 11d, and 11e show examples of shapes of coupling structures.

[0018] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0019] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0020] In the following description, terms referring to components of electronic devices (e.g., insulating plate, substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, antenna element, circuit, amplifier circuit, processor, chip, component, device), terms referring to the shape of components (e.g., opening, structure, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, amplifier circuit, RF path, RF module, RF circuit, splitter, divider, coupler, combiner), etc. are examples for convenience of description. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, the terms '...bu', '...gi', '...mul', '...che', etc. used below may mean at least one shape structure or a unit that processes a function.

[0021] In addition, in the present disclosure, expressions such as more than or less than may be used to determine whether a specific condition is satisfied or fulfilled, but this is only a description to express an example and does not exclude descriptions such as more than or less than. A condition described as 'more than' may be replaced with 'more than', a condition described as 'less than' may be replaced with 'less than', and a condition described as 'more than and less than' may be replaced with 'more than and less than'. In addition, hereinafter, 'A' to 'B' mean at least one of the elements from A to (including A) and from B to (including B). Hereinafter, 'C' and / or 'D' mean at least one of 'C' or 'D', that is, including {'C', 'D', 'C' and 'D'}. In addition, hereinafter, the meaning of 'about E' may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0022] Although the present disclosure describes various embodiments using terms used in some communication standards (e.g., 3rd Generation Partnership Project (3GPP), European Telecommunications Standards Institute (ETSI), extensible radio access network (xRAN), open-radio access network (O-RAN), etc.), these are merely examples for explanation. The various embodiments of the present disclosure can be easily modified and applied to other communication systems.

[0023] Figure 1 illustrates a wireless communication system. The wireless communication environment of Figure 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), and a third terminal (120-3)) as part of nodes utilizing a wireless channel.

[0024] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance at which it can transmit a signal. In addition to the base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5th generation node', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit), 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU), remote radio head (RRH)' or other terms having equivalent technical meanings. The base station (110) may transmit a downlink signal or receive an uplink signal.

[0025] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without the involvement of the user. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as a 'user equipment (UE)', a 'mobile station', a 'subscriber station', a 'customer premises equipment (CPE)', a 'remote terminal', a 'wireless terminal', an 'electronic device', a 'vehicle terminal', a 'user device', or other terms having an equivalent technical meaning thereto.

[0026] Beamforming technology is being used as one of the technologies to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reception area of ​​radio waves or increase the directivity of reception sensitivity for a specific direction. Therefore, instead of forming a signal in an isotropic pattern using a single antenna, the base station (110) may be equipped with multiple antennas to form a beamforming coverage. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0027] A key technology for improving the data capacity of 5G communications is beamforming, which utilizes antenna arrays connected to multiple RF paths. To achieve higher data capacity, either the number of RF paths or the power per RF path must increase. Increasing RF paths increases the size of the product, and due to space constraints for installing actual base station equipment, further expansion is currently not feasible. To increase antenna gain through higher output power without increasing the number of RF paths, a divider (or splitter) can be used to connect multiple antenna elements in the RF paths. Here, the antenna elements corresponding to the RF paths can be referred to as subarrays. As a non-limiting example, subarray technology can be used to increase signal radiation gain. An antenna array can include multiple subarrays. The antennas of the antenna array can be divided into the multiple subarrays. The signal can be radiated through each antenna of the subarrays.

[0028] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain an electronic device including an antenna, but the embodiments of the present disclosure are not limited thereto. As an electronic device according to the embodiments of the present disclosure, in addition to the base station (110), a wireless device performing a function equivalent to a base station, a wireless device connected to the base station (e.g., TRP), a terminal (120) of FIG. 1, or any other communication device used for 5G communication may be of course possible. Hereinafter, in the present disclosure, an antenna array composed of sub-arrays is described as an example of a structure of a plurality of antennas for communication in a MIMO (Multiple Input Multiple Output) environment, but as a non-limiting example, it is of course possible to easily change it for beamforming.

[0029] Figure 2 illustrates examples of components of a communication device. The communication device may be the base station (110) of Figure 1 or a component of the base station (110). However, unlike the illustration, the present disclosure does not exclude that the communication device may be implemented in a terminal (120).

[0030] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna unit (211), a filter unit (212), an RF (radio frequency) processing unit (213), and a processor (214).

[0031] The antenna unit (211) may include a plurality of antennas. The antenna may perform functions for transmitting and receiving signals via a wireless channel. The antenna may include a radiator formed of a conductor (e.g., a metal structure) or a conductive pattern formed on a substrate (e.g., a PCB). The antenna may radiate an upconverted signal on a wireless channel or acquire a signal radiated by another device. Each antenna may be referred to as an antenna element, an antenna component, an antenna radiator, a radiating portion, a radiator, and / or equivalent technical terms. The antenna unit (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna unit (211) may be electrically connected to the filter unit (212) via RF signal lines. For example, a plurality of antenna elements of the antenna unit (211) may be coupled to a board (e.g., a PCB). The antenna elements may be arranged on one surface of the board, or a module on which the antenna elements are arranged may be arranged. The board may include RF signal lines connecting each antenna element and RF filters of the filter unit (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiation board, a radiation board, an RF board, an RF board, and / or equivalent technical terms.

[0032] The filter unit (212) can perform filtering to transmit a signal of a desired frequency. The filter unit (212) can include a plurality of RF filters. The RF filter can perform a function of selectively passing a frequency by forming a resonance. The filter unit (212) can include at least one of a band pass filter, a low pass filter, a high pass filter, or a band reject filter. The filter unit (212) can include RF circuits for obtaining a signal of a frequency band for transmission or a frequency band for reception. Each RF filter of the filter unit (212) can be electrically connected to the antennas of the antenna unit (211) and the RF processing circuit of the RF processing unit (213).

[0033] The RF processing unit (213) may include a plurality of RF processing circuits. The RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through the antenna. The RF processing circuit may include a plurality of paths corresponding to antennas. At least one RF processing circuit may be referred to as an RF chain. The RF chain may include a plurality of RF components. The RF components may include amplifiers, mixers, oscillators, DACs, ADCs, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal to an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Also, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts a digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of a receiving path. The receiving path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. The communication device (210) may include a structure in which an antenna unit (211) - a filter unit (212) - an RF processing unit (213) are stacked in that order. The antennas and the RF components of the RF processing unit (213) may be implemented on a PCB, and filters may be repeatedly connected between PCBs to form a plurality of layers.For example, the RF processing unit (213) may include a communication chip (e.g., RFIC).

[0034] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating a transmission bit stream. In addition, for example, when receiving data, the processor (214) restores a reception bit stream by demodulating and decoding a baseband signal. The processor (214) may perform functions of a protocol stack required by a communication standard.

[0035] In FIG. 2, functional components of a communication device (210) are described as communication equipment including a plurality of antennas. However, the example illustrated in FIG. 2 is merely an exemplary configuration for utilizing an RF filter described below, and embodiments of the present disclosure are not limited to the components of the communication device illustrated in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationship of the components is different, if it is a device (e.g., a communication device, a communication module) including an RF filter, it can be understood as an embodiment of the present disclosure.

[0036] Figure 3 illustrates an example of a radio frequency (RF) filter including a coupling structure. The RF filter may include a circuit that is configured to pass a signal of a desired frequency by forming a resonance. The filtering characteristics (e.g., bandpass characteristics, bandblock characteristics) may be determined depending on the shape of the RF filter.

[0037] Referring to FIG. 3, the RF filter (300) may include a cavity filter. For the cavity filter, the RF filter (300) may include a housing (310). The housing (310) may include a plurality of sidewall portions. The sidewall portions refer to portions of the housing (310) that form a space for frequency resonance. The space may be referred to as a cavity space or an aperture space, or may be referred to as a receiving space, a mounting space, a resonance space, or an equivalent technical term in terms of where a resonant element described later is placed. The housing (310) may form a plurality of cavity spaces by the sidewall portions. For example, when the RF filter (300) is a metal cavity filter, the sidewall portions may be made of a metal material. As a non-limiting example, when the RF filter (300) is a dielectric cavity filter, the sidewall portions may be made of a dielectric material. At least one side of the cavity space may be opened so that a signal may pass through the RF filter (300). A signal may be transmitted through the open portion. For example, the plurality of side wall portions may include first side wall portions (311) and second side wall portions (312). The first side wall portions (311) may form a first cavity space (331). The second side wall portions (312) may form a second cavity space (332). The side wall portion for describing embodiments of the present disclosure may be used as a part of the housing (310) to form the cavity space. The side wall portion may be referred to as a partition wall portion, a partition wall, a wall, a wall portion, a receiving member, a side wall, an isolation member, and / or equivalent technical terms thereof in addition to the side wall portion.

[0038] A resonant element may be arranged in each cavity space. For example, a first resonant element (321) may be arranged in a first cavity space (331). A second resonant element (322) may be arranged in a second cavity space (332). The signal may be filtered through the resonant element arranged in each cavity space. Specifically, the resonant element arranged in each cavity space may be configured to block or pass a component of the signal at a specific frequency by allowing a surrounding signal to resonate at the specific frequency. In terms of forming resonance within the space, the resonant element may be referred to as a resonator, a resonant structure, a resonant portion, a pole, a resonant pole, a resonant load, and / or equivalent technical terms in addition to the resonant element. The resonant element may be composed of a metallic material. As resonators are arranged in the cavity space of the housing (310) within the RF filter (300), electromagnetic waves of a specific frequency can be repeatedly reflected. Through the structure of the RF filter (300), signals of a desired frequency band can pass through. In other words, the RF filter (300) can output a signal component corresponding to the pass band among the signals.

[0039] An RF filter (300) according to embodiments of the present disclosure may include a coupling structure (350). The coupling structure (350) may be used to adjust the characteristics of the RF filter (300) by controlling the amount of coupling with a resonant element (e.g., a first resonant element (321), a second resonant element (322)). For example, as tuning of a resonant frequency is performed according to the coupling according to the coupling structure (350), a bandwidth that the RF filter (300) passes may be adjusted. The coupling structure (350) may include a metal structure (351) and a dielectric structure (353). The amount of coupling due to the coupling structure (350) may be determined based on a distance between the metal structure (351) and the resonant element and / or a size (e.g., an area) of an end of the metal structure (351). The metal structure (351) may be referred to as a conductive portion, a conductive structure, a coupling portion, a coupling tuner, a coupling member, a coupling substrate, a metal substrate, a metal sheet, a metal panel, a conductive plate, a metal plate, and / or other structural terms or technical terms equivalent thereto, in addition to the metal structure.

[0040] The metal structure (351) according to embodiments of the present disclosure may be positioned flexibly rather than fixedly within the housing (310). Depending on the flexibly positioned metal structure (351), the amount of coupling between the metal structure (351) and the resonant elements (e.g., the first resonant element (321), the second resonant element (322)) may be determined. According to one embodiment, the metal structure (351) may rotate in one plane (e.g., the xy plane). According to one embodiment, the metal structure (351) may be height-adjustable with respect to one axis (e.g., the z-axis).

[0041] The dielectric structure (353) may be coupled to the metal structure (351). As the dielectric structure (353) moves, the position of the metal structure (351) may change. For example, the metal structure (351) may rotate as the dielectric structure (353) rotates. For example, as the height (e.g., position along the z-axis) of the dielectric structure (353) changes, the height (e.g., position along the z-axis) of the metal structure (351) may change. For example, the dielectric structure (353) may be attached to a portion of the metal structure (351). The dielectric structure (353) may be configured to tune the amount of coupling with the resonant element by allowing the metal structure (351) to be rotated and positioned within the housing (310). At least a portion of the dielectric structure (353) may be positioned at an upper portion of the space of the housing (310). The dielectric structure (353) may be arranged to pass through a through hole of a cover (not shown) covering the top of the housing (310). At least another portion of the dielectric structure (353) may be exposed to the outside of the cover. The position of the metal structure (351) may be adjusted by adjusting the position of the dielectric structure (353). According to one embodiment, the dielectric structure (353) may include a screw portion capable of spiral movement through the through hole. The through hole may include a groove for the spiral movement. The screw portion may be coupled to a portion of the metal structure (351). The height of the metal structure (351) may vary through the spiral movement of the screw portion. As the height of the metal structure (351) varies, the relative position of the metal structure (351) with respect to the resonant elements may vary. This may result in a variation in the amount of coupling. The spiral movement of the screw portion may cause a rotational movement of the metal structure (351). The amount of coupling can be adjusted according to the rotational movement of the metal structure (351).The bandwidth can be tuned by adjusting the coupling amount according to the degree of rotation of the dielectric structure (353) and / or the depth into which the screw portion is inserted. According to another embodiment, the dielectric structure (353) may perform only a rotational motion without a separate change in height. The through hole of the cover may include a groove for the rotational motion. The dielectric structure (353) may include a rotational member. The rotational motion of the rotational member may cause a rotational motion of the metal structure (351). The coupling amount can be adjusted according to the rotational motion of the metal structure (351). In the examples described above, the spiral motion was divided into a rotational motion and a linear motion in order to explain the characteristics according to the change in height, but in the present disclosure, the spiral motion is also described as an aspect of the rotational motion.

[0042] The dielectric structure (353) may be referred to as a dielectric screw, a dielectric screw, a dielectric portion, a dielectric bolt, a dielectric tuning bolt, a dielectric rotor, a dielectric shaft portion, a dielectric rotating portion, a dielectric shaft, a non-conductive portion, a non-conductive screw, a non-conductive bolt, a non-conductive rotor, a non-conductive shaft portion, a non-conductive rotating portion, a non-conductive shaft, an insulating portion, an insulating screw, an insulating bolt, an insulating rotor, an insulating shaft portion, an insulating rotating portion, an insulating shaft, and / or equivalent structural terms or equivalent technical terms.

[0043] A structure may be considered in which a metal part causing coupling is fixed to a dielectric part (e.g., Teflon) and a metal tuning bolt is added to the dielectric part. The principle is that tuning for the bandwidth is performed by adjusting the metal tuning bolt. However, this principle does not adjust the metal part but rather performs tuning for the bandwidth through a separate metal tuning bolt, so the controllable tuning range may not be sufficient. In order to solve this problem, the present disclosure proposes a structure in which a metal structure (351) adjacent to a resonant element is arranged to be rotatable (e.g., about 360 degrees rotation, about 180 degrees rotation, about 90 degrees rotation). The rotation and / or height change of the metal structure (351) can be used for tuning the RF filter (300). The coupling structure (350) according to embodiments of the present disclosure may include a metal structure (351) and a dielectric structure (353) connected to the metal structure (351). The dielectric structure (353) may be understood as a tuning element made of a dielectric. As the above tuning element is composed of a dielectric, the current excited to the metal structure (351) through coupling may not be transmitted to the dielectric structure (353). As the dielectric structure (353) connected from the cover of the housing (310) is used as a rotation axis for the metal structure (351), a sufficient tuning range can be secured.

[0044] Although two cavity spaces are illustrated in FIG. 3 to explain the RF filter (300), this is exemplary and embodiments of the present disclosure are not limited thereto. The RF filter (300) may include a plurality of cavity spaces and a resonant element disposed in each cavity space. According to one embodiment, the RF filter (300) may include a coupling structure (350) disposed between at least two resonant elements among the resonant elements. The coupling structure (350) may be disposed as needed for bandwidth tuning. In other words, the coupling structure (350) may not be disposed between every two adjacent resonant elements among the resonant elements, but may be disposed intermittently.

[0045] Although FIG. 3 illustrates an example in which a coupling structure (350) is disposed between two resonators (e.g., a first resonant element (321) and a second resonant element (322)), embodiments of the present disclosure are not limited thereto. The coupling structure (350) may be disposed closer to one side of the two resonators instead of the center of the two resonators, or may be disposed between one resonator and a side wall of the housing rather than between the two resonators. In addition, although FIG. 2 illustrates a hexagonal cavity space as a space for a cavity filter, embodiments of the present disclosure are not limited thereto. For example, an RF filter including rectangular cavity spaces disposed within a housing and a coupling structure disposed between the cavity spaces and spanning the two cavity spaces may also be understood as an embodiment of the present disclosure.

[0046] Figures 4a and 4b are drawings for explaining a notch.

[0047] Referring to Fig. 4a, the graph (400) represents the performance of an RF filter (300) for passing a band. The horizontal axis of the graph (400) represents the frequency (unit: GHz) and the vertical axis of the graph (400) represents the S-parameter (e.g., S 11, reflectance coefficient) (unit: dB). The performance of an RF filter (e.g., an RF filter (300)) may include a band-pass characteristic and an attenuation characteristic. The band-pass characteristic of the RF filter (300) may be determined through resonance by a combination of an inductive load and a capacitive load. As the reflection coefficient is formed low in a bandwidth (401) of a certain size, frequency components within the bandwidth (401) among the input signals may pass through the RF filter (300). The attenuation characteristic of the RF filter (300) may include an insertion loss and a skirt characteristic. The insertion loss is a characteristic in which the input power is not sufficiently output and acts as a loss due to the insertion of a component or circuit. The skirt characteristic refers to the slope in the boundary band (e.g., outside the pass band) in the band-pass characteristic curve. The steeper the slope is set, the higher the pass characteristic is. In other words, the occurrence of a notch (e.g., a notch (402)) indicating a low pass coefficient can improve the skirt characteristic in the boundary band. This skirt characteristic is improved as the order of the filter (i.e., the number of resonators) increases. As the number increases, the insertion loss is improved, but there is a problem that the insertion loss increases inversely proportional to the order of the filter. Therefore, it can be arranged to form a notch (402) at an appropriate location.

[0048] Referring to Figure 4b, a C-notch can be utilized to enhance the skirt characteristics in the passband. The formation of the C-notch can depend on the size of the capacitance. The capacitance can be determined according to the following mathematical equation.

[0049]

[0050] C represents the capacitance, A is the area of ​​the two conductors, d is the spacing between the two conductors, represents the dielectric constant.

[0051] As the size of the capacitance increases, the position of the notch can be closer to the passband. Referring to [Mathematical Formula 1] and the coupling structure (350) of FIG. 3, the size of the capacitance can be determined by the distance between the resonant element (e.g., the first resonant element (321), the second resonant element (322)) and the metal structure (351) and the area of ​​the metal structure (351) facing the resonant element.

[0052] Graph (450) shows the performance of an RF filter (300) for passing a band. The horizontal axis of the graph (450) represents frequency (unit: GHz) and the vertical axis of the graph (450) represents S-parameters (e.g., S 11 , reflection coefficient) (unit: dB). Referring to the graph (450), the first line (451) represents the bandpass performance of the RF filter (300) according to the first size of capacitance. The second line (452) represents the bandpass performance of the RF filter (300) according to the second size of capacitance. The second size may be larger than the first size. The third line (453) represents the bandpass performance of the RF filter (300) according to the third size of capacitance. The third size may be larger than the second size. The fourth line (454) represents the bandpass performance of the RF filter (300) according to the fourth size of capacitance. The fourth size may be larger than the third size. Through this, it can be confirmed that as the size of the capacitance increases, a notch is formed at a position adjacent to the pass bandwidth (455) in the frequency domain.

[0053] Fig. 5 illustrates an example of an RF filter (e.g., RF filter (300)) including a coupling structure. Fig. 5 is a drawing of the RF filter (300) of Fig. 3 viewed in one direction (e.g., along the (+) y-axis direction). The same reference numbers may be used for the same description.

[0054] Referring to FIG. 5, the RF filter (300) may include a first resonant element (321) within a first cavity space (331). The RF filter (300) may include a second resonant element (322) within a second cavity space (332). A coupling structure (350) may be disposed between the first resonant element (321) and the second resonant element (322). The coupling structure (350) may be disposed across the first cavity space (331) and the second cavity space (332). The coupling structure (350) may include a metal structure (351) and a dielectric structure (353). The metal structure (351) may be disposed across the first cavity space (331) and the second cavity space (332).

[0055] The metal structure (351) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). The first conductive portion (351a) may have a first surface. The first surface may be positioned toward the first resonant element (321). The second conductive portion (351b) may have a second surface opposite the first surface. The second surface may be positioned toward the second resonant element (322). The third conductive portion (351c) may be formed to connect the first conductive portion (351a) and the second conductive portion (351b). For example, the third conductive portion (351c) may have a plate shape having a length direction corresponding to the direction connecting the first conductive portion (351a) and the second conductive portion (351b).

[0056] The distance between the resonant element and the metal structure (351) may affect the performance of the RF filter (300). For example, the distance between the first conductive portion (351a) and the first resonant element (321) may affect the amount of coupling between the first resonant element (321) and the metal structure (351). The distance between the second conductive portion (351b) and the second resonant element (322) may affect the amount of coupling between the second resonant element (322) and the metal structure (351). As mentioned in FIG. 3, the metal structure (351) may rotate (e.g., rotate in the xy plane) according to the rotation of the dielectric structure (353) (e.g., rotate about the z-axis). The rotation of the metal structure (351) may cause the amount of coupling between each resonant element and the metal structure (351) to vary. In this way, bandwidth tuning can be performed through rotation using the dielectric structure (353). Depending on the rotation of the dielectric structure (353), the metal structure (351) may not only rotate but also change in height. When the dielectric structure (353) moves in one direction (e.g., the (-) z-axis direction), the position of the metal structure (351) may also move along one axis (e.g., the z-axis). As the height of the metal structure (351) changes, the distance of the first conductive portion (351a) to the first resonant element (231) and the distance of the second conductive portion (351b) to the second resonant element (232) may change. The rotation of the metal structure (351) can change the amount of coupling between each resonant element and the metal structure (351). In this way, bandwidth tuning can be performed through rotation using the dielectric structure (353).

[0057] The effective area of ​​the metal structure (351) with respect to the resonant element may affect the performance of the RF filter (300). The effective area may refer to the size of an orthogonal projection of one side of the conductive portion of the metal structure (351) in the direction toward the resonant element. For example, the effective area of ​​the first conductive portion (351a) with respect to the first resonant element (321) may affect the amount of coupling between the first resonant element (321) and the metal structure (351). The effective area of ​​the first conductive portion (351a) may be determined based on the size (or area) of the first side (e.g., the side facing the (-) x-axis in FIG. 5) of the first conductive portion (321a) and the direction in which the first side faces relative to an axis (e.g., the x-axis) (e.g., the axis connecting the first resonant element (321) and the second resonant element (322)) on a plane (e.g., the xy plane). For example, when the size of the first surface is A1 and the metal structure (351) is rotated about 30 degrees from the one axis with the dielectric structure (353) as the axis, the size of the effective area may be A1cos(30°). The effective area of ​​the second conductive portion (322) with respect to the second resonant element (322) may affect the amount of coupling between the second resonant element (322) and the metal structure (351). The effective area of ​​the second conductive portion (351b) may be determined based on the size (or area) of the second surface (e.g., the surface facing the (+) x-axis in FIG. 5) of the second conductive portion (322a) and the direction in which the second surface faces with respect to an axis (e.g., the x-axis) on a plane (e.g., the xy plane). For example, if the size of the second surface is A2 and the metal structure (351) is rotated about 30 degrees from the first axis with the dielectric structure (353) as the axis, the size of the effective area may be A2cos(30°). The rotation of the metal structure (351) may cause the effective area of ​​the metal structure (351) for each resonant element to vary.In this way, tuning of the bandwidth can be performed through rotation using the dielectric structure (353).

[0058] As the dielectric structure (353) rotates, the first conductive portion (351a) and the second conductive portion (351b) of the metal structure (351) may each rotate. As the first conductive portion (351a) and the second conductive portion (351b) rotate, the coupling area for the resonant element or the distance from the resonant element may change, so that the amount of coupling may change. Since the effective area changes depending on the rotation, in order to provide a wide tuning range, each conductive portion may be required to have a single plane. For example, the first conductive portion (351a) may have a surface facing a first direction (e.g., the (-) x-axis direction) from the reference position of the coupling structure (350). The second conductive portion (351b) may have a surface facing the second direction (e.g., the (+) x-axis direction) at the reference position. The reference position may indicate the position of the coupling structure when the longitudinal direction of the third conductive portion (351c) corresponds to an axis (e.g., the x-axis, the axis connecting the first resonant element (321) and the second resonant element (322). In order to have a surface facing the resonant element, the metal structure (351) may be formed from a metal sheet. As a non-limiting example, the first conductive portion (351a) may be formed by bending the metal sheet. The second conductive portion (351b) may be formed by bending the metal sheet. The remaining portion through the two bends may correspond to the third conductive portion (351c). The first conductive portion (351a), the second conductive portion (351b), and the third The conductive portion (351c) may be integrally formed from the metal sheet. As a non-limiting example, the metal structure (351) may have a 'ㄷ' shape with a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c).

[0059] In Fig. 5, a metal structure (351) is illustrated as being formed by bending a metal sheet, but embodiments of the present disclosure are not limited thereto. In addition to the metal sheet, through processing of a conductive member, the conductive member may include a first portion having a first surface and a second portion having a second surface. A structure in which a dielectric structure (353) is attached to a portion of the conductive member that connects the first portion and the second portion can be understood as an embodiment of the present disclosure.

[0060] Although FIG. 5 illustrates an arrangement in which the first conductive portion (351a) is adjacent to the first resonant element (321) and the second conductive portion (351b) is adjacent to the second resonant element (322), embodiments of the present disclosure are not limited thereto. As a non-limiting example, the metal structure (351) may be configured to rotate by about 180 degrees or more according to the rotation of the dielectric structure (353). In this case, the first conductive portion (351a) of the metal structure (351) may be arranged to face the second resonant element (322), and the second conductive portion (351b) of the metal structure (351) may be arranged to face the first resonant element (321). In this case, the coupling applied to control the filter characteristics of the RF filter (300) may represent the coupling between the first resonant element (321) and the second conductive portion (351b) and the coupling between the second resonant element (322) and the first conductive portion (351a). The tuning range using the dielectric structure (353) may be determined based on the conductive portion adjacent to the resonant element.

[0061] FIG. 6 illustrates an example of an RF filter (e.g., RF filter (300)) including a coupling structure (e.g., coupling structure (350)). FIG. 5 illustrates a perspective view of the RF filter (300) of FIG. 3. The same reference numerals may be used for the same description.

[0062] Referring to FIG. 6, the RF filter (300) may be a cavity filter and may include a housing (310) for forming a cavity. The housing (310) may form a first cavity space (331) and a second cavity space (332). The RF filter (300) may include a first resonant element (321) in the first cavity space (331). The RF filter (300) may include a second resonant element (322) in the second cavity space (332). A coupling structure (350) may be disposed between the first resonant element (321) and the second resonant element (322). The coupling structure (350) may be disposed across the first cavity space (331) and the second cavity space (332). The coupling structure (350) may include a metal structure (351) and a dielectric structure (353). The metal structure (351) may be arranged across a first cavity space (331) and a second cavity space (332). The metal structure (351) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). For each of the first conductive portion (351a), the second conductive portion (351b), the third conductive portion (351c), and the dielectric structure (353), the descriptions of FIG. 5 may be referred to.

[0063] The coupling structure (350) can rotate within the housing (310). The metal structure (351) can rotate within the housing (310). The rotation radius of the metal structure (351) may correspond to a tuning range for bandwidth. For a sufficient rotation radius of the metal structure (351), the side wall portions (e.g., at least a portion of the first side wall portions (311) and at least a portion of the second side wall portions (312)) within the housing (310) may be required to secure a certain space. For example, the housing (310) may have a space that accommodates a circle whose diameter is the length along the longitudinal direction of the third conductive portion (351c) of the metal structure (351). A space for accommodating a circle having a diameter corresponding to the length in the longitudinal direction of the third conductive portion (351c) of the metal structure (351) may be provided in the space between the first resonant element (321) and the second resonant element (322).

[0064] The RF filter (300) may include a cover plate (610). The cover plate (610) may be coupled to one end (e.g., the top, the portion in the (+) z-axis direction) of the housing (310). The cover plate (610) may include a through hole (699) for a dielectric structure (353) for tuning. At least a portion of the dielectric structure (353) may pass through the through hole (699) and be disposed within the housing (310). At least another portion of the dielectric structure (353) may be exposed to the outside of the housing (310). The height (e.g., the position in the (+) z-axis direction) of the dielectric structure (353) may be adjustable. In one embodiment, the dielectric structure (353) may include a screw portion. To secure the dielectric structure (353) at the adjusted height, the through hole (699) may include a groove for receiving the screw portion.

[0065] FIG. 7 is a drawing for explaining the notch characteristics of an RF filter (e.g., RF filter (300)) including a coupling structure (e.g., coupling structure (350)).

[0066] Referring to FIG. 7, the graph (700) represents the performance of an RF filter (300) for passing a band. The horizontal axis of the graph (700) represents the frequency (unit: GHz) and the vertical axis of the graph (700) represents the S-parameter (e.g., S 11 , the reflection coefficient) (unit: dB). In order to form a notch close to the passband, a large capacitance may be required. In order to form a large capacitance, the size of the metal structure (e.g., the metal structure (351)) may be required to be large. This is because the larger the size of the portion of the metal structure facing each resonant element, the higher the capacitance. If the metal structure is fixedly arranged within the housing, a separate metal structure may be required each time the frequency position of the notch changes. However, through the metal structure (351) according to embodiments of the present disclosure, notches can be formed in various frequency ranges through rotation of the metal structure (351) without separate part replacement.

[0067] Referring to the graph (700), the first part (701) represents a notch formed when the metal structure (351) is rotated by a first angle (e.g., a rotation angle in the longitudinal direction of the third conductive portion (351c)) with respect to a reference axis (e.g., the x-axis in FIG. 5). The second part (702) represents a notch formed when the metal structure (310) is rotated by a second angle (e.g., a rotation angle in the longitudinal direction of the third conductive portion (351c)) with respect to a reference axis (e.g., the x-axis in FIG. 5). The third part (703) represents a notch formed when the metal structure (310) is rotated by a third angle (e.g., a rotation angle in the longitudinal direction of the third conductive portion (351c)) with respect to a reference axis (e.g., the x-axis in FIG. 5). Notches can be formed at each of various frequency positions within a wide frequency range through the rotation of the metal structure (351). In other words, the tuning range of the RF filter (300) can be increased through rotation of the metal structure (351).

[0068] FIGS. 8A and 8B illustrate examples of a communication module including an RF filter (e.g., RF filter (300)). The communication module may be referred to as an antenna module, an antenna filter module, an antenna filter unit, an antenna unit, an access module, a wireless module, a wireless communication module, a radio frequency communication module, a wireless unit, a wireless unit module, and / or equivalent technical terms in addition to a communication module. FIG. 8A illustrates components on a first side based on a substrate (e.g., board (810)) of the communication module, and FIG. 8B illustrates components on a second side opposite to the first side.

[0069] Referring to FIG. 8A, the communication module (800) may include a plurality of antennas. For the antennas, reference may be made to the description of the antenna unit (211) of FIG. 2. Each of the plurality of antennas may be referred to as an antenna element. Each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. The communication module (800) may include a board (810) for arranging the plurality of antennas. The board (810) may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiating board, a radiating board, an RF board, an RF board, and / or equivalent technical terms in addition to the board. A major technology for improving data capacity is beamforming technology using an antenna array connected to a plurality of RF paths. For higher data capacity, the number of RF paths must be increased or the power per RF path must be increased. Increasing the RF path size further increases the size of the product, and due to space constraints in installing actual base station equipment, it is currently impossible to increase the RF path size any further. In order to increase the antenna gain through high output without increasing the number of RF paths, the antenna gain can be increased by connecting multiple antenna elements using a splitter (or divider) in the RF path. The unit of multiple antenna elements connected to the RF path may be referred to as a sub-array. The multiple antennas of FIGS. 8A and 8B may be divided into multiple sub-arrays. The communication module (800) may include multiple sub-arrays. The multiple sub-arrays may include antenna elements. For example, the communication module (800) may include 32 sub-arrays. Each sub-array may include three antenna elements. As an example, the communication module (800) may include a sub-array (820).The subarray (820) may include a first antenna element (821), a second antenna element (822), and a third antenna element (823).

[0070] One or more subarrays may be disposed on a substrate (which may be referred to, for example, as a subarray substrate, an insulating plate, an insulating plate, a subarray plate, a radiating substrate, a radiating plate, and / or equivalent technical terms). Each subarray may be connected to an RF path for a first polarization and an RF path for a second RF polarization. The first polarization and the second polarization may be perpendicular to each other. For example, the first polarization may correspond to a vertical polarization and the second polarization may correspond to a horizontal polarization. For example, the first polarization may correspond to a (+)45 degree polarization and the second polarization may correspond to a (-)45 degree polarization. Signals for the first polarization may be provided to each of the antenna elements of each subarray from the RF path for the first polarization. Signals for the second polarization may be provided to each of the antenna elements of each subarray from the RF path for the second polarization. Signals for a first polarization or signals for a second polarization may be provided to each antenna element of the sub-array through a conductive pattern formed on the substrate. For example, a first antenna element (821), a second antenna element (822), and a third antenna element (823) of the sub-array (820) may be arranged on the substrate (840). The sub-array (820) may be connected to a first conductive pattern (831) and a second conductive pattern (832). The first conductive pattern (831) may be configured to provide a signal of a first polarization from a wireless communication circuit (e.g., RFIC) to each antenna element of the sub-array (820). The second conductive pattern (832) may be configured to provide a signal of a second polarization from a wireless communication circuit (e.g., RFIC) to each antenna element of the sub-array (820). Each of the first conductive pattern (831) and the second conductive pattern (832) may be formed on a substrate (840).The communication module (800) may include 32 conductive patterns for a first polarization and 32 conductive patterns for a second polarization for each of the 32 sub-arrays.

[0071] Referring to FIG. 8B, a filter board (850) may be coupled to a board (810). The filter board (850) may refer to a substrate to which a plurality of RF filters are coupled. For the RF filters, the description of the filter unit (212) of FIG. 2 may be referred to. Antennas may be arranged on a first surface of the board (810) through an antenna substrate (e.g., substrate (840)), and RF filters may be arranged on a second surface opposite to the first surface through a filter board (850) (which may also be referred to as a filter substrate).

[0072] The communication module (800) may include a plurality of RF filters. For example, the plurality of RF filters may include an RF filter (860). For the RF filter (860), reference may be made to the descriptions of the RF filter (300) of FIGS. 3, 4A, 4B, 5, 6, and 7. In addition, the RF filters illustrated in FIGS. 9A to 9C, 10A to 10C, and 11A to 11E may also be referenced for the RF filter (860) of FIGS. 8A and 8B. For example, the communication module (800) may include 64 RF filters. Each of the RF filters may correspond to an RF path. The RF path may be specified in units of subarrays and polarizations. The communication module (800) may include 32 subarrays. Each sub-array may be connected to conductive patterns for two polarizations (e.g., a first conductive pattern (831) and a second conductive pattern (832)). One RF path from a wireless communication circuit (e.g., an RFIC, a wireless communication chip) may be associated with one conductive pattern. The communication module (800) may include 32 RF filters corresponding to 32 conductive patterns for the first polarization. The communication module (800) may include 32 RF filters corresponding to 32 conductive patterns for the second polarization.

[0073] As the number of antennas increases, the complexity of RF components for processing RF signals may increase. Due to the lease cost or space constraints of the installation site, it may be required to manufacture RF components (e.g., RF filter (300), RF filter (860)) that are small, light, and inexpensive. In addition, as communication equipment is implemented in a form in which a plurality of RF components are assembled, the tolerance that occurs each time the RF components are assembled increases, which may cause a deterioration in performance. To solve this problem, the RF filter (e.g., RF filter (300), RF filter (860)) according to embodiments of the present disclosure enables bandwidth tuning of the RF filter through the structure of a rotatable metal structure (351) and a dielectric structure (353) instead of using the control of a tuning bolt made of metal. A wider tuning range can be secured due to the rotation of the metal structure (351) rather than the influence of the tuning bolt made of metal, insertion loss caused by coupling with an additional structure is reduced, and errors due to the coupling process can be reduced due to the tuning bolt made of a dielectric (e.g., dielectric structure (353)), so that mass production can be easier. Whether the present disclosure is implemented can be confirmed by confirming that the tuning bolt is implemented as a dielectric within the RF filter and that the tuning bolt implemented as a dielectric is directly attached and connected to the metal structure (e.g., metal structure (351)) located between the resonators. Additionally, whether the present disclosure is implemented can be confirmed by confirming that the metal structure (e.g., metal structure (351)) rotates according to the rotation of the dielectric (e.g., dielectric structure (353)).

[0074] FIGS. 9A, 9B, and 9C illustrate examples of covers including through holes for limiting the rotational range of a coupling structure (e.g., coupling structure (350)). The tuning range of the RF filter (300) (i.e., the range of frequency positions where a notch can be formed) may depend on the rotational range of the coupling structure (350). This is because, as the rotational angle of the coupling structure (350) increases with respect to a reference axis (e.g., the x-axis in FIG. 3), the distance between the resonant elements (e.g., the first resonant element (321) and the second resonant element (322)) and the metal structure (351) increases. However, when the coupling structure (350) rotates more than 90 degrees, the first conductive portion (351a) may be closer to the second resonant element (322) than to the first resonant element (321). Similarly, when the coupling structure (350) rotates more than 90 degrees, the second conductive portion (351b) may be closer to the first resonant element (321) than to the second resonant element (322). Unnecessary rotation may not only cause wear of the metal structure (351) or the dielectric structure (353) but also cause unnecessary coupling, so it may be advantageous to structurally limit the rotation range of the metal structure (351). The same reference numbers may be used for the same description.

[0075] Referring to FIG. 9A, the RF filter (300) may be a cavity filter and may include a housing (310) for forming a cavity. The housing (310) may form a first cavity space (331) and a second cavity space (332). The RF filter (300) may include a first resonant element (321) in the first cavity space (331). The RF filter (300) may include a second resonant element (322) in the second cavity space (332). A coupling structure (350) may be disposed between the first resonant element (321) and the second resonant element (322). The coupling structure (350) may be disposed across the first cavity space (331) and the second cavity space (332). The coupling structure (350) may include a metal structure (351) and a dielectric structure (353). The metal structure (351) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). For each of the first conductive portion (351a), the second conductive portion (351b), the third conductive portion (351c), and the dielectric structure (353), the descriptions of FIGS. 5 and 6 may be referred to.

[0076] The RF filter (300) may include a cover plate (910). The cover plate (910) may be coupled to one end (e.g., the top, the portion in the (+) z-axis direction) of the housing (310). The cover plate (910) may include a through hole (999) for a dielectric structure (353) for tuning. At least a portion of the dielectric structure (353) may be disposed within the housing (310) by penetrating the through hole (999). At least another portion of the dielectric structure (353) may be exposed to the outside of the housing (310). The height (e.g., the position in the (+) z-axis direction) of the dielectric structure (353) may be adjustable.

[0077] According to one embodiment, the shape of the opening of the through-hole (999) of the cover plate (910) may be different from the shape of the cross-section of the dielectric structure (353). When the dielectric structure (353) rotates 360 degrees, the metal structure (351) coupled with the dielectric structure (353) may also rotate 360 ​​degrees. In order to limit the rotational range of the metal structure (351), the rotational range of the dielectric structure (353) may need to be limited. In order to limit the rotational range of the dielectric structure (353), the shape of the through-hole (699) may need to be different from the shape of the cross-section of the dielectric structure (353). For the rotation of the metal structure (351), the opening of the through-hole (999) or the cross-section of the dielectric structure (353) may have a curve. However, for the limited rotation range of the metal structure (35), the cross-section of the dielectric structure (353) may have a shape other than a circle (e.g., an elliptical shape or a shape that includes only a portion of a curve and a portion of a straight line). For example, in FIG. 6, if the curvature of the cross-section of the dielectric structure (353) and the curvature of the through-hole (699) correspond to each other (e.g., are the same or within a critical range based on an error of about 5%), free rotation of the dielectric structure (353) may be possible. However, if the curvature of a portion of the cross-section of the dielectric structure (353) is different from the curvature of a portion of the through-hole (999), the rotation range of the dielectric structure (353) may be limited.

[0078] Referring to FIG. 9B, a drawing is shown of the RF filter (300) of FIG. 9A when viewed in one direction (e.g., the (-) z-axis). In example (931), the metal structure (351) may be placed at a reference position. The reference position may indicate the placement of the metal structure (351) when the longitudinal direction of the third conductive portion (351c) of the metal structure (351) corresponds to the axis (e.g., the x-axis) connecting the first resonant element (321) and the second resonant element (322). In example (932), the metal structure (351) may be rotated about 30 degrees clockwise when the RF filter (300) is viewed in one direction (e.g., the (-) z-axis direction) from the reference position. The metal structure (351) may rotate according to the rotation of the dielectric structure (353). Here, the shape of the cross-section of the dielectric structure (353) may have a first end having a first curvature and a second end having the first curvature. The through-hole (999) may include a first portion having a first curvature and a second portion having a different second curvature. For example, the through-hole (999) may have a first curvature on a first side and a second curvature on a second side, and may include a portion formed as a straight line between the first side and the second side. The curvature of the straight line may be '0'. Accordingly, it may be difficult for the dielectric structure (353) to rotate any further from the straight line portion. The rotation range of the metal structure (351) may be limited through the shape of the through-hole (999) on the cover plate (910).

[0079] Referring to Fig. 9c, a drawing of the RF filter (300) of Fig. 9a is shown when viewed in one direction (e.g., the (+) y-axis). An end of the dielectric structure (353) passing through the through hole (999) may be coupled to a third conductive portion (351c) of the metal structure (351). For example, an end of the dielectric structure (353) may be attached to the third conductive portion (351c) of the metal structure (351).

[0080] FIGS. 10a, 10b, and 10c illustrate examples of fixed members for limiting the rotational range of a coupling structure (e.g., coupling structure (350)).

[0081] Referring to FIG. 10A, the RF filter (300) may be a cavity filter and may include a housing (310) for forming a cavity. The housing (310) may form a first cavity space (331) and a second cavity space (332). The RF filter (300) may include a first resonant element (321) in the first cavity space (331). The RF filter (300) may include a second resonant element (322) in the second cavity space (332). A coupling structure (350) may be disposed between the first resonant element (321) and the second resonant element (322). The coupling structure (350) may be disposed across the first cavity space (331) and the second cavity space (332). The coupling structure (350) may include a metal structure (351) and a dielectric structure (353). The metal structure (351) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). For each of the first conductive portion (351a), the second conductive portion (351b), the third conductive portion (351c), and the dielectric structure (353), the descriptions of FIGS. 5 and 6 may be referred to.

[0082] The RF filter (300) may include a cover plate (610). The cover plate (610) may be coupled to one end (e.g., the top, the portion in the (+) z-axis direction) of the housing (310). The cover plate (610) may include a through hole (699) for a dielectric structure (353) for tuning. At least a portion of the dielectric structure (353) may be disposed within the housing (310) by penetrating the through hole (699). At least another portion of the dielectric structure (353) may be exposed to the outside of the housing (310). The height (e.g., the position in the (+) z-axis direction) of the dielectric structure (353) may be adjustable.

[0083] According to one embodiment, the RF filter (300) may further include a fixing member (1020). The fixing member (1020) may include a hole (1099). The dielectric structure (353) may be positioned to penetrate the hole. The dielectric structure (353) may penetrate the through hole (699) of the cover plate (610) and the hole (1099) of the fixing member (1020) and be coupled to the metal structure (351). The fixing member (1020) may be positioned in a fixed manner regardless of the rotation of the dielectric structure (353). In order to limit the rotational range of the metal structure (351), the fixing member (1020) may be positioned within the housing (310). The fixing member (1020) may have a shape for limiting the rotational range of the metal structure (351). For example, the fixed member (1020) may include a portion that functions as an obstacle to the rotation radius of the metal structure (351).

[0084] Referring to FIG. 10b, a drawing is shown of the RF filter (300) of FIG. 10a when viewed in one direction (e.g., the (-) z-axis). In example (1031), the metal structure (351) may be placed at a reference position. The reference position may indicate the placement of the metal structure (351) when the longitudinal direction of the third conductive portion (351c) of the metal structure (351) corresponds to the axis (e.g., the x-axis) connecting the first resonant element (321) and the second resonant element (322). In example (1032), the metal structure (351) may be rotated about 50 degrees clockwise when the RF filter (300) is viewed in one direction (e.g., the (-) z-axis direction) from the reference position. The metal structure (351) may rotate according to the rotation of the dielectric structure (353). The fixing member (1020) can be fixedly positioned regardless of the rotation of the dielectric structure (353). The fixing member (1020) can include a portion positioned within the rotation radius of the metal structure (351). Due to the portion, the rotation of the metal structure (351) can be physically difficult. For example, the fixing member (1020) can be in the shape of the letter 'ㄷ'. The fixing member (1020) can include a plate portion and leg portions connected to both ends of the plate portion. Each of the leg portions can be positioned within the rotation radius of the metal structure (351). As illustrated in example (1032), the rotation range of the metal structure (351) (e.g., the third conductive portion (351c)) can be limited due to the leg portions. As a non-limiting example, the hole (1099) can be formed wider than the cross-section of the dielectric structure (353). The fixed member (1020) can be positioned in a fixed position regardless of the rotation of the dielectric structure (353). Although not shown, the fixed member (1020) can be fixed by being combined with the cover plate (910).

[0085] Referring to Fig. 10c, a drawing of the RF filter (300) of Fig. 10a is shown when viewed in one direction (e.g., the (+) y-axis). An end of the dielectric structure (353) that passes through the through hole (699) and the hole (1099) of the fixing member (1020) can be coupled to a third conductive portion (351c) of the metal structure (351). For example, an end of the dielectric structure (353) can be attached to the third conductive portion (351c) of the metal structure (351).

[0086] FIG. 11a, FIG. 11b, FIG. 11c, FIG. 11d, and FIG. 11e illustrate examples of shapes of coupling structures (e.g., coupling structures (350)).

[0087] Referring to FIG. 11A, an example (1100a) shows a perspective view of an RF filter (300) including a metal structure (351) and a dielectric structure (353). An example (1150a) is a view of the RF filter of the example (1100a) as viewed from the (+) y-axis. According to one embodiment, the coupling structure (350) may have a hat shape. The coupling structure (350) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). The first conductive portion (351a) may have an 'L' shape, and the shape may include a portion having a first side facing the first resonant element (321) at a reference position. The second conductive portion (351b) may have an 'L' shape, and the shape may include a portion having a second side facing the second resonant element (322) at a reference position. The third conductive portion (351c) is formed to connect the first conductive portion (351a) and the second conductive portion (351b), and can be combined with the dielectric structure (353).

[0088] Referring to FIG. 11b, an example (1100b) shows a perspective view of an RF filter (300) including a metal structure (351) and a dielectric structure (353). An example (1150b) is a view of the RF filter of example (1100b) as viewed from the (+) y-axis. According to one embodiment, the coupling structure (350) may have a shape in which a plurality of regions are bent in a metal sheet. The coupling structure (350) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). The first conductive portion (351a) may have a shape formed of portions that are bent two or more times, and the shape may include a portion having a first surface facing the first resonant element (321) at a reference position. The second conductive portion (351b) has a shape composed of portions bent two or more times, and the shape may include a portion having a second surface facing the second resonant element (322) at the reference position. The third conductive portion (351c) is formed to connect the first conductive portion (351a) and the second conductive portion (351b), and may be combined with the dielectric structure (353).

[0089] Referring to FIG. 11c, an example (1100c) shows a perspective view of an RF filter (300) including a metal structure (351) and a dielectric structure (353). An example (1150c) is a view of the RF filter of example (1100c) as viewed from the (+) y-axis. According to one embodiment, the coupling structure (350) may have a ladle shape for receiving. The coupling structure (350) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). The first conductive portion (351a) may have an 'L' shape, and the shape may include a portion having a first surface facing the first resonant element (321) at a reference position. The second conductive portion (351b) has an 'L' shape, and the shape may include a portion having a second surface facing the second resonant element (322) at the reference position. The third conductive portion (351c) is formed to connect the first conductive portion (351a) and the second conductive portion (351b), and may be combined with the dielectric structure (353).

[0090] Referring to FIG. 11d, an example (1100d) shows a perspective view of an RF filter (300) including a metal structure (351) and a dielectric structure (353). An example (1150d) is a view of the RF filter of an example (1100d) as viewed from the (+) y-axis. According to one embodiment, the coupling structure (350) may have a pie shape. The coupling structure (350) may include a first conductive portion (351a), a second conductive portion (351b), and a third conductive portion (351c). The first conductive portion (351a) may have an 'ㄱ' shape, and the shape may include a portion having a first surface facing the first resonant element (321) at a reference position. The second conductive portion (351b) may have an 'ㄱ' shape, and the shape may include a portion having a second surface facing the second resonant element (322) at a reference position. The third conductive portion (351c) is formed to connect the first conductive portion (351a) and the second conductive portion (351b), and can be combined with the dielectric structure (353).

[0091] Referring to FIG. 11e, an example (1100e) shows a perspective view of an RF filter (300) including a metal structure (351) and a dielectric structure (353). Example (1150e) is a view of the RF filter of example (1100e) as viewed from the (+) y-axis. According to one embodiment, the coupling structure (350) may have a 'ㄷ' shape. Unlike the structure illustrated in FIG. 3, the first conductive portion (351a) and the second conductive portion (351b) of the coupling structure (350) may be arranged to face the (+) z-axis direction from the third conductive portion (351c). The coupling structure (350) may include the first conductive portion (351a), the second conductive portion (351b), and the third conductive portion (351c). The first conductive portion (351a) has a straight shape, and the shape may include a portion having a first surface facing the first resonant element (321) at the reference position. The second conductive portion (351b) has a straight shape, and the shape may include a portion having a second surface facing the second resonant element (322) at the reference position. The third conductive portion (351c) is formed to connect the first conductive portion (351a) and the second conductive portion (351b), and may be coupled to the dielectric structure (353).

[0092] Cavity filters using metal tuning bolts have the disadvantage of having to be individually tuned by hand through the rotation of the screw. This tuning reduces mass production, leads to a high defect rate, and increases the cost of the filter. Therefore, although performance-wise stable, they are not suitable for mass production due to the increase in antenna elements and RF paths. However, the tuning method using a dielectric structure (e.g., dielectric structure (353)) according to embodiments of the present disclosure not only has a wide tuning range through the rotation of a metal structure (e.g., metal structure (351)), but also provides stable performance by utilizing a rotation axis made of dielectric material. This allows the location of the frequency at which a notch is formed around the passband of the RF filter to be preset during the manufacturing process, enabling fine-tuning and automation using a robot. This can improve the overall performance of a communication device including multiple RF filters.

[0093] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0094] In embodiments, a radio frequency (RF) filter device (300) is provided. The RF filter device (300) may include a housing (310) including a first side wall portion forming a first cavity space and a second side wall portion forming a second cavity space; a first resonant element disposed within the first cavity space; a second resonant element disposed within the second cavity space; a metal structure (351) disposed between the first resonant element and the second resonant element within the housing (310); a dielectric structure (353) coupled to the metal structure (351); and a cover plate (610; 910) including a through hole for the dielectric structure (353) and coupled to an upper portion of the housing (310). The metal structure (351) may include a first conductive portion (351a) having a first surface; a second conductive portion (351b) having a second surface opposite to the first surface; It may include a third conductive portion (351c) that is coupled with the dielectric structure (353) and formed to connect the first conductive portion (351a) and the second conductive portion (351b). The metal structure (351) may be coupled so as to be rotatable within the housing (310) together with the dielectric structure (353) according to the rotation of the dielectric structure (353).

[0095] For example, the dielectric structure (353) may include a screw portion arranged to penetrate the through hole of the cover plate (610; 910). Depending on the rotation of the screw portion, the distance between the first conductive portion (351a) and the first resonant element may vary. Depending on the rotation of the screw portion, the distance between the second conductive portion (351b) and the second resonant element may vary.

[0096] For example, the third conductive portion (351c) may be formed as a plate having a longitudinal direction. When the longitudinal direction of the third plate corresponds to a reference axis connecting the first resonant element and the second resonant element according to the rotation of the dielectric structure (353), the first surface of the first conductive portion (351a) may be arranged to face the first resonant element, and the second surface of the second conductive portion (351b) may be arranged to face the second resonant element. The dielectric structure (353) may include a screw portion arranged to penetrate the through hole of the cover plate (610; 910). The metal structure (351) may be arranged to have a variable height according to the rotation of the screw portion.

[0097] For example, the metal structure (351) may include a metal sheet. The first conductive portion (351a) may be formed by bending one area of ​​the metal sheet. The second conductive portion (351b) may be formed by bending another area of ​​the metal sheet. The third conductive portion (351c) may be the remaining portion of the metal sheet excluding the first conductive portion (351a) and the second conductive portion (351b).

[0098] For example, the through-hole may include a first portion having a first curvature and a portion having a second curvature different from the first curvature. The dielectric structure (353) may have a columnar shape, and a cross-section of the dielectric structure (353) may include a portion having the first curvature.

[0099] For example, the RF filter device (300) may include a fixing member for limiting the rotation range of the metal structure (351) according to the rotation of the dielectric structure (353) including a hole. The dielectric structure (353) may be arranged to penetrate the hole of the fixing member and be coupled to the third conductive portion (351c) of the metal structure (351). The fixing member may be fixedly arranged regardless of the rotation of the dielectric structure (353).

[0100] For example, the dielectric structure (353) may include a screw portion arranged to penetrate the through hole of the cover plate (610; 910). Depending on the rotation of the screw portion, the effective area of ​​the first conductive portion (351a) facing the first resonant element may vary. Depending on the rotation of the screw portion, the effective area of ​​the second conductive portion (351b) facing the second resonant element may vary. The effective area of ​​the first conductive portion (351a) may be determined according to the size of the first surface and the direction in which the first surface faces with respect to a reference axis connecting the first resonant element and the second resonant element. The effective area of ​​the second conductive portion (351b) may be determined according to the size of the second surface and the direction in which the second surface faces with respect to a reference axis connecting the first resonant element and the second resonant element.

[0101] For example, the first conductive portion (351a), the second conductive portion (351b), and the third conductive portion (351c) may be formed integrally.

[0102] For example, the metal structure (351) may have a 'ㄷ' shape with the first conductive portion (351a), the second conductive portion (351b), and the third conductive portion (351c).

[0103] In embodiments, a communication device is provided. The communication device may include a plurality of antennas; a plurality of radio frequency (RF) filters; and a plurality of RF processing circuits. Each of the plurality of RF filters may include a housing (310) including a first sidewall portion forming a first cavity space and a second sidewall portion forming a second cavity space; a first resonant element disposed within the first cavity space; a second resonant element disposed within the second cavity space; a metal structure (351) disposed between the first resonant element and the second resonant element within the housing (310); a dielectric structure (353) coupled to the metal structure (351); and a cover plate (610; 910) coupled to an upper end of the housing (310) and including a through hole for the dielectric structure (353). The metal structure (351) includes a first conductive portion (351a) having a first surface; A second conductive portion (351b) having a second surface opposite to the first surface; and a third conductive portion (351c) formed to be coupled with the dielectric structure (353) and to connect the first conductive portion (351a) and the second conductive portion (351b). The metal structure (351) may be coupled to be rotatable within the housing (310) together with the dielectric structure (353) according to the rotation of the dielectric structure (353).

[0104] For example, the dielectric structure (353) may include a screw portion arranged to penetrate the through hole of the cover plate (610; 910). Depending on the rotation of the screw portion, the distance between the first conductive portion (351a) and the first resonant element may vary. Depending on the rotation of the screw portion, the distance between the second conductive portion (351b) and the second resonant element may vary.

[0105] For example, the third conductive portion (351c) may be formed as a plate having a longitudinal direction. When the longitudinal direction of the third plate corresponds to a reference axis connecting the first resonant element and the second resonant element according to the rotation of the dielectric structure (353), the first surface of the first conductive portion (351a) may be arranged to face the first resonant element, and the second surface of the second conductive portion (351b) may be arranged to face the second resonant element.

[0106] For example, the dielectric structure (353) may include a screw portion arranged to penetrate the through hole of the cover plate (610; 910). The metal structure (351) may be arranged to have a variable height depending on the rotation of the screw portion.

[0107] For example, the metal structure (351) may include a metal sheet. The first conductive portion (351a) may be formed by bending one area of ​​the metal sheet. The second conductive portion (351b) may be formed by bending another area of ​​the metal sheet. The third conductive portion (351c) may be the remaining portion of the metal sheet excluding the first conductive portion (351a) and the second conductive portion (351b).

[0108] For example, the through-hole may include a first portion having a first curvature and a portion having a second curvature different from the first curvature. The dielectric structure (353) may have a columnar shape, and a cross-section of the dielectric structure (353) may include a portion having the first curvature.

[0109] For example, each of the RF filters may include a fixing member for limiting a rotation range of the metal structure (351) according to rotation of the dielectric structure (353) including a hole. The dielectric structure (353) may be arranged to penetrate the hole of the fixing member and be coupled to the third conductive portion (351c) of the metal structure (351). The fixing member may be fixedly arranged regardless of the rotation of the dielectric structure (353).

[0110] For example, the dielectric structure (353) may include a screw portion arranged to penetrate the through hole of the cover plate (610; 910). Depending on the rotation of the screw portion, the effective area of ​​the first conductive portion (351a) facing the first resonant element may vary. Depending on the rotation of the screw portion, the effective area of ​​the second conductive portion (351b) facing the second resonant element may vary. The effective area of ​​the first conductive portion (351a) may be determined according to the size of the first surface and the direction in which the first surface faces with respect to a reference axis connecting the first resonant element and the second resonant element. The effective area of ​​the second conductive portion (351b) may be determined according to the size of the second surface and the direction in which the second surface faces with respect to a reference axis connecting the first resonant element and the second resonant element.

[0111] For example, the plurality of antennas may be divided into a plurality of sub-arrays. The RF filters may include a first filter connected to a first conductive pattern configured to provide a first signal of a first polarization to each of the antennas of a sub-array of the plurality of sub-arrays, and a second filter connected to a second conductive pattern configured to provide a second signal of a second polarization to each of the antennas of a sub-array of the plurality of sub-arrays.

[0112] In some embodiments, a communication device is provided. The communication device may include an antenna board; a plurality of sub-arrays disposed on a first surface of the antenna board, each sub-array including a plurality of antennas; a filter board, a first surface of the filter board coupled to a second surface of the antenna board opposite the first surface; and a plurality of RF filters disposed on the second surface of the filter board opposite the first surface. Each of the plurality of RF filters may include a housing (310) including a plurality of side wall portions; a resonant element disposed in a cavity space formed by each of the side wall portions of the plurality of side wall portions; a metal structure (351) disposed between two resonant elements within the housing (310); a dielectric structure (353) coupled to the metal structure (351); and a cover plate (610; 910) coupled to an upper portion of the housing (310) and including a through hole for the dielectric structure (353). The metal structure (351) can be coupled to the dielectric structure (353) so as to be rotatable within the housing (310) according to the rotation of the dielectric structure (353).

[0113] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0114] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0115] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0116] When implemented in software, a computer-readable storage medium (e.g., a non-transitory computer-readable storage medium) storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0117] These programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, magnetic cassettes, or may be stored in memories formed by a combination of some or all of these. In addition, each configuration memory may include multiple copies.

[0118] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network, such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device implementing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device implementing an embodiment of the present disclosure.

[0119] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed singularly or plurally, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in plural may be composed of singular elements, or components expressed in singular may be composed of plural elements.

[0120] According to embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0121] Meanwhile, although the detailed description of the present disclosure has described specific embodiments, it is obvious that various modifications are possible within the scope of the present disclosure.

Claims

1. In the RF (radio frequency) filter device, A housing comprising a first side wall portion forming a first cavity space and a second side wall portion forming a second cavity space; A first resonant element disposed within the first cavity space; A second resonant element disposed within the second cavity space; A metal structure disposed between the first resonant element and the second resonant element within the housing; A dielectric structure coupled to the above metal structure; and A cover plate including a through hole for the above dielectric structure and coupled to the top of the housing, The above metal structure: A first conductive portion having a first side; A second conductive portion having a second side opposite to the first side; A third conductive portion is formed to be coupled to the dielectric structure and to connect the first conductive portion and the second conductive portion, The metal structure is coupled to the dielectric structure so as to be rotatable within the housing according to the rotation of the dielectric structure. RF filter device.

2. In claim 1, The above dielectric structure includes a screw portion arranged to penetrate the through hole of the cover plate, Depending on the rotation of the screw portion, the distance between the first conductive portion and the first resonant element changes, Depending on the rotation of the screw portion, the distance between the second conductive portion and the second resonant element changes. RF filter device.

3. In claim 1, The third conductive portion is formed as a plate having a longitudinal direction, When the longitudinal direction of the third plate corresponds to the reference axis connecting the first resonant element and the second resonant element according to the rotation of the dielectric structure: The first surface of the first conductive portion is arranged to face the first resonant element, The second surface of the second conductive portion is arranged to face the second resonant element. RF filter device.

4. In claim 1, The above dielectric structure includes a screw portion arranged to penetrate the through hole of the cover plate, The above metal structure is arranged to have a variable height according to the rotation of the screw portion. RF filter device.

5. In claim 1, The above metal structure includes a metal sheet, The first conductive portion is formed as one area of ​​the metal sheet is bent, The second conductive portion is formed as another area of ​​the metal sheet is bent, The third conductive portion is the remaining portion of the metal sheet excluding the first conductive portion and the second conductive portion. RF filter device.

6. In claim 1, The above through hole includes a first portion having a first curvature and a portion having a second curvature different from the first curvature, The above dielectric structure has a columnar shape and a cross-section of the above dielectric structure includes a portion having the first curvature. RF filter device.

7. In claim 1, Including a fixing member for limiting the rotation range of the metal structure according to the rotation of the dielectric structure including a hole, The above dielectric structure is arranged to penetrate the hole of the fixing member and be coupled to the third conductive portion of the metal structure. The above fixed member is fixedly positioned regardless of the rotation of the dielectric structure. RF filter device.

8. In claim 1, The above dielectric structure includes a screw portion arranged to penetrate the through hole of the cover plate, Depending on the rotation of the screw portion, the effective area of ​​the first conductive portion facing the first resonant element changes, Depending on the rotation of the screw portion, the effective area of ​​the second conductive portion facing the second resonant element changes. The effective area of ​​the first conductive portion is determined based on the size of the first surface and the direction in which the first surface faces relative to the reference axis connecting the first resonant element and the second resonant element, The effective area of ​​the second conductive portion is determined based on the size of the second surface and the direction in which the second surface faces relative to the reference axis connecting the first resonant element and the second resonant element. RF filter device.

9. In claim 1, The first conductive portion, the second conductive portion, and the third conductive portion are formed integrally. RF filter device.

10. In claim 1, The metal structure has a 'ㄷ' shape with the first conductive portion, the second conductive portion, and the third conductive portion. RF filter device.

11. In communication devices, Multiple antennas; multiple RF (radio frequency) filters; and Contains multiple RF processing circuits, Each of the above plurality of RF filters, A housing comprising a first side wall portion forming a first cavity space and a second side wall portion forming a second cavity space; A first resonant element disposed within the first cavity space; A second resonant element disposed within the second cavity space; A metal structure disposed between the first resonant element and the second resonant element within the housing; A dielectric structure coupled to the above metal structure; and A cover plate including a through hole for the above dielectric structure and coupled to the top of the housing, The above metal structure: A first conductive portion having a first side; A second conductive portion having a second side opposite to the first side; A third conductive portion is formed to be coupled to the dielectric structure and to connect the first conductive portion and the second conductive portion, The metal structure is coupled to the dielectric structure so as to be rotatable within the housing according to the rotation of the dielectric structure. Communication device.

12. In claim 11, The above dielectric structure includes a screw portion arranged to penetrate the through hole of the cover plate, Depending on the rotation of the screw portion, the distance between the first conductive portion and the first resonant element changes, Depending on the rotation of the screw portion, the distance between the second conductive portion and the second resonant element changes. Communication device.

13. In claim 11, The third conductive portion is formed as a plate having a longitudinal direction, When the longitudinal direction of the third plate corresponds to the reference axis connecting the first resonant element and the second resonant element according to the rotation of the dielectric structure: The first surface of the first conductive portion is arranged to face the first resonant element, The second surface of the second conductive portion is arranged to face the second resonant element. Communication device.

14. In claim 11, The above dielectric structure includes a screw portion arranged to penetrate the through hole of the cover plate, The above metal structure is arranged to have a variable height according to the rotation of the screw portion. Communication device.

15. In communication devices, antenna board; A plurality of sub-arrays arranged on the first surface of the antenna board, each sub-array including a plurality of antennas, a filter board, a first side of said filter board being coupled to a second side of said antenna board opposite to said first side; and comprising a plurality of RF filters arranged on a second surface opposite to the first surface of the filter board; Each of the above plurality of RF filters: A housing comprising a plurality of side wall sections; A resonant element disposed in a cavity space formed by each of the plurality of side wall portions; A metal structure disposed between two resonant elements within the housing; A dielectric structure coupled to the above metal structure; and A cover plate including a through hole for the above dielectric structure and coupled to the top of the housing, The metal structure is coupled to the dielectric structure so as to be rotatable within the housing according to the rotation of the dielectric structure. Communication device.

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