2results about How to "Meeting basic needs" patented technology

This invention provides a biomimetic pet toy, comprising a shell, a drive unit, a circuit board, four legs, and a head. The drive unit and circuit board are installed inside the shell. The circuit board is connected to a horn, and the drive unit drives the legs and the tongue of the head via a linkage. The drive unit consists of a motor and a reduction gear set, which is divided into an overload clutch gear set, a limb gear set, and a head gear set. The motor drives the overload clutch gear set and the head gear set, enabling the legs to walk and the head and tongue to swing and extend / retract. The circuit board controls the motor's operation, the horn emits sound, and the battery box provides power. This toy has a simple structure, low cost, and can perform multiple actions, meeting the basic requirements of a biomimetic pet toy.

This application provides a power semiconductor device, its fabrication method, and its application. The power semiconductor device includes a ceramic substrate, a cladding body, multiple chips, and multiple lead frames. The ceramic substrate includes a ceramic wafer, an inner metal foil, and an outer metal foil. The inner metal foil is disposed on one side of the ceramic wafer, and the outer metal foil is disposed on the opposite side of the ceramic wafer. The cladding body covers the ceramic substrate, exposing the side of the outer metal foil away from the inner metal foil to the external space. The chips are located within the cladding body and disposed on the inner metal foil. The multiple chips are spaced apart from each other. The side of a single chip not in contact with the inner metal foil is electrically connected to the inner metal foil through a lead frame. This application replaces the lead bonding in traditional power semiconductor devices with lead frames, which not only improves the heat dissipation performance of the chips but also reduces thermal resistance, achieving miniaturization and weight reduction of the device, thereby improving the reliability of the power semiconductor device.