2results about How to "No erosion" patented technology

This utility model relates to downhole release devices and belongs to the field of downhole tool technology. The purpose of this utility model is to address the problems existing in the prior art by providing a downhole release device, including an upper connector, with a casing female thread and a trapezoidal thread male thread at both ends; and a lower connector, with a trapezoidal thread female thread and a casing male thread at both ends; the ends of the trapezoidal thread male and female threads are tapered. The upper and lower connectors of this utility model are connected by trapezoidal threads at the tapered ends; after connection, an effective seal is formed, isolating internal and external mud. Even under high pump pressure circulation, the tapered trapezoidal threads will not be eroded by mud and can withstand various complex stresses (but not torque) together with the tubing string.

The application provides a manufacturing method of an image sensor. The manufacturing method comprises the following steps: providing a substrate, the substrate having an isolation structure, the top surface of the isolation structure protruding from the top surface of the substrate; forming a silicon nitride material layer on the substrate by using a low-pressure chemical vapor deposition process, the silicon nitride material layer covering the top surface of the substrate and the isolation structure; coating a photoresist on the silicon nitride material layer to form a second photoresist layer, exposing and developing the second photoresist layer to form a patterned second photoresist layer; taking the patterned second photoresist layer as a mask to etch the silicon nitride material layer to form a patterned second hard mask layer; and taking the patterned second hard mask layer as a mask to etch the substrate to form a groove accommodating a vertical transfer gate. In this way, the photolithography process window of the vertical transfer gate in the image sensor can be expanded, and the Hole miss phenomenon in the manufacturing process of the vertical transfer gate can be effectively reduced.