Gold finger production method and circuit board

Abstract

The present application relates to a gold finger manufacturing method and a circuit board, wherein the gold finger manufacturing method includes: manufacturing gold fingers, gold finger guides and multiple gold finger shunt leads on a semi-finished circuit board; manufacturing a gasket layer on the gold finger shunt leads; manufacturing a covering layer on the semi-finished circuit board, and performing window processing on the covering layer at the corresponding position of the gold finger; energizing the gold finger shunt leads and performing electro-gold processing to gold-plate the gold finger surface; manufacturing slots in the area where the gasket layer is located, cutting off the gold finger shunt leads; and removing the covering layer and the gasket layer. The above-mentioned metallized half-hole manufacturing method manufactures gold finger shunt leads on the semi-finished circuit board in the form of shunts, which reduces the line width of a single gold finger guide lead, and manufactures a gasket layer on the gold finger shunt leads, which can prevent problems such as copper pulling and copper warping during slot processing. The above-mentioned gold finger manufacturing method is conducive to improving the manufacturing quality and reliability of gold fingers.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board processing, and in particular to a gold finger manufacturing method and a circuit board. Background Art

[0002] Printed circuit boards (PCBs), also known as printed circuit boards, are manufactured using electronic printing technology. They support electronic components and serve as the carrier for their electrical connections, playing a vital role in electronic products. PCB gold fingers are structures within the circuit board that enable plug-in connections and disconnections with connectors and other components. Like other solder pads, gold fingers require electrical testing to ensure proper circuit connectivity. During the gold finger manufacturing process, a layer of gold is electroplated onto the gold fingers to protect the copper circuitry, enhancing wear resistance and increasing service life.

[0003] The traditional gold finger production method first creates gold finger guide wires, which are then connected to the edge of the circuit board using the gold finger guide wires. A metal clip is then used to clamp the board edge to conduct current, completing the electroplating process. A layer of gold is then electroplated on the gold finger. Laser cutting is then used to cut the gold finger guide wires off, completing the gold finger production. During the laser cutting process, the high-energy laser also ablates the substrate layer of the circuit board while cutting the gold finger guide wires, producing residual substances such as carbon powder that adhere to the circuit board surface and can easily cause problems such as short circuits.

[0004] Therefore, the traditional gold finger manufacturing method has the problem of poor reliability. Summary of the Invention

[0005] Based on this, it is necessary to provide a gold finger manufacturing method and circuit board with high reliability to address the above technical problems.

[0006] In a first aspect, the present application provides a method for manufacturing a gold finger, comprising:

[0007] Making gold fingers, gold finger guide wires and a plurality of gold finger shunt leads on a semi-finished circuit board; the gold finger shunt leads are connected to the gold fingers through the gold finger guide wires; the line width of the gold finger shunt leads is smaller than that of the gold finger guide wires;

[0008] Making a gasket layer on the gold finger shunt lead;

[0009] Making a covering layer on the semi-finished circuit board, and performing window processing on the covering layer at the corresponding position of the gold finger;

[0010] Energizing the gold finger shunt lead and performing electro-gold processing to plate the surface of the gold finger with gold;

[0011] Making slots in the area where the gasket layer is located and cutting off the gold finger shunt leads;

[0012] The cover layer and the spacer layer are removed.

[0013] In one embodiment, the gold fingers, the gold finger leads and the gold finger shunt leads are manufactured simultaneously with the outer layer pattern of the semi-finished circuit board.

[0014] In one embodiment, the number of the gold finger shunt leads is two, each of which is connected to the gold finger through the gold finger guide lead; and the two gold finger shunt leads are spaced apart by a preset distance in the line width direction.

[0015] In one embodiment, the length of the gold finger shunt lead is 1 mm to 5 mm greater than the designed width of the slot.

[0016] In one embodiment, the gasket layer is made of epoxy resin fiberglass cloth.

[0017] In one embodiment, the width of the gasket layer is the same as the length of the gold finger shunt lead, and the distance between the gasket layer and the outermost gold finger shunt lead in the length direction is 1 mm to 5 mm.

[0018] In one embodiment, the distance between the width edge of the slot and the length edge of the gold finger shunt lead is ≥0.5 mm.

[0019] In one embodiment, the length of the slot is greater than or equal to the length of the gold finger shunt lead area, and less than or equal to the length of the pad layer.

[0020] In one embodiment, the covering layer is a dry film.

[0021] In a second aspect of the present application, a circuit board is provided, comprising a gold finger manufactured using the gold finger manufacturing method as described above.

[0022] The above-mentioned gold finger production method creates gold finger shunt leads on the semi-finished circuit board. The use of shunt leads reduces the line width of a single gold finger lead. The design of multiple but relatively thin lines provides a more easily processed line foundation for slot processing, which can prevent problems such as copper pulling and warping. The formation of a gasket layer on the gold finger shunt leads provides a reliable buffering effect for slot processing, further preventing problems such as copper pulling and warping. The combination of these technologies is conducive to improving the production quality and reliability of gold fingers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A schematic diagram of a process for making a gold finger according to an embodiment;

[0024] Figure 2 This is a schematic diagram of the structure after a plurality of gold finger shunt leads are manufactured on a semi-finished circuit board in one embodiment;

[0025] Figure 3 for Figure 2 Schematic diagram of the structure after the gasket layer and the covering layer are made;

[0026] Figure 4 for Figure 3 Top view of the structure;

[0027] Figure 5 for Figure 4 Schematic diagram of the structure after the slots are made;

[0028] Figure 6 for Figure 5 Top view of the structure.

[0029] Explanation of the reference numerals: 100 - gold finger, 200 - gold finger guide wire, 300 - gold finger shunt lead, 400 - outer layer pattern, 500 - substrate layer, 600 - gasket layer, 700 - covering layer, 701 - window area, 800 - slot. DETAILED DESCRIPTION

[0030] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0032] When used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0033] In addition, in this patent application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0034] In the first aspect of this application, a method for making a gold finger is provided. Please refer to Figure 1 In one embodiment, the method includes steps S10 to S60.

[0035] Step S10: making gold fingers, gold finger leads and a plurality of gold finger shunt leads on the semi-finished circuit board;

[0036] Step S20: making a pad layer on the gold finger shunt lead;

[0037] Step S30: making a covering layer on the semi-finished circuit board, and performing window processing on the covering layer at the corresponding position of the gold finger;

[0038] Step S40: energizing the gold finger shunt lead to perform electro-gold processing to plate the gold finger surface with gold;

[0039] Step S50: making slots in the area where the gasket layer is located and cutting off the gold finger shunt leads;

[0040] Step S60: removing the covering layer and the spacer layer.

[0041] The above-mentioned metallized half-hole production method cuts off the gold finger shunt lead by slotting, which does not require the production of a separate mold, resulting in low cost and high efficiency. The gold finger shunt lead is produced on the semi-finished circuit board, and the shunt form is adopted to reduce the line width of a single gold finger lead. The design of multiple but thinner lines provides a line foundation that is easier to process for slot processing, which can prevent problems such as copper pulling and copper warping. The formation of a gasket layer on the gold finger shunt lead can provide a reliable buffering effect for slot processing, further preventing problems such as copper pulling and copper warping. The combination of the above technologies and methods can make the gold finger lead wires simple, efficient, and reliable to disconnect, which is conducive to improving the production quality and reliability of the gold finger.

[0042] The following is a detailed description with reference to the accompanying drawings.

[0043] like Figure 2As shown, gold fingers 100, gold finger guides 200, and multiple gold finger shunt leads 300 are fabricated on the semi-finished circuit board. The gold finger shunt leads 300 connect to the gold fingers 100 through the gold finger guides 200, and the line width of the gold finger shunt leads 300 is smaller than that of the gold finger guides 200. During electroplating, current flows through the outer pattern 400, the gold finger shunt leads 300, and the gold finger guides 200 to the gold fingers 100, making the gold fingers 100 conductive and depositing a predetermined thickness of nickel-gold to form a surface gold layer. Due to the insulating properties of the substrate layer 500, no nickel-gold is deposited on the surface of the substrate layer 500 during the electroplating process.

[0044] Specifically, each gold finger 100 corresponds to a single gold finger guide line 200, and each gold finger guide line 200 corresponds to multiple gold finger branch leads 300. The line width of the gold finger guide line 200 is smaller than that of the corresponding gold finger 100, and the line width of the gold finger branch lead 300 is smaller than that of the corresponding gold finger guide line 200. One end of the gold finger branch lead 300 is connected to the outer layer pattern 400, and the other end is connected to the corresponding gold finger guide line 200. Adjacent gold finger branch leads 300 are separated by a preset distance. Preferably, each gold finger branch lead 300 is symmetrically arranged with the extension line of the corresponding gold finger guide line 200 as the symmetry axis, and the gold finger branch leads 300 corresponding to the same gold finger guide line 200 are parallel to each other.

[0045] In one embodiment, there are two gold finger shunt leads 300 , each connected to the gold finger 100 through the gold finger guide 200 ; and the two gold finger shunt leads 300 are spaced apart by a preset distance in the line width direction.

[0046] In one embodiment, the gold finger 100, the gold finger guide 200 and the gold finger shunt lead 300 are manufactured simultaneously with the outer layer pattern 400 of the semi-finished circuit board, so as to eliminate the need for a separate design process, reduce the processing difficulty, save processing costs, improve processing efficiency, and ensure the processing quality of the circuit board.

[0047] In one embodiment, the length of the gold finger shunt lead 300 is 1 mm to 5 mm larger than the design width of the slot to ensure that the gold finger guide 200 and the outer layer pattern 400 are not touched during the slot processing process, thereby reducing the line width on the processing path during the slot processing, providing a line foundation that is easier to process for the slot processing, and helping to avoid problems such as copper pulling and copper wrinkling.

[0048] like Figure 3 and Figure 4As shown, a gasket layer 600 is fabricated on the gold finger shunt lead 300. Preferably, the gasket layer 600 is made of epoxy resin glass fiber cloth. The gasket layer 600 completely covers the gold finger shunt lead 300 to provide a buffer for subsequent slot processing. In one embodiment, the width of the gasket layer 600 is the same as the length of the gold finger shunt lead 300, and the distance between the gasket layer 600 and the outermost gold finger shunt lead 300 in the length direction is 1mm to 5mm, thereby ensuring a buffering effect while saving material costs.

[0049] Please continue to refer to Figure 3 and Figure 4 After forming the gasket layer 600 on the gold finger shunt lead 300, a cover layer 700 is formed on the semi-finished circuit board, and a window treatment is performed on the cover layer 700 at the corresponding position of the gold finger 100. The cover layer 700 covers the circuit in the non-electrometallurgical area, and the gold finger 100 is exposed through the window area 701. Specifically, the cover layer 700 can be an electrometallurgical resistant gold ink or a dry film. Furthermore, when the cover layer 700 is a dry film, the window treatment can be performed before or after the dry film is applied, and the dry film can be pre-pressed before the electrometallurgical treatment to ensure a tight fit between the cover layer 700 and the outer layer pattern 400.

[0050] After the gold finger shunt lead 300 is energized and electro-gold processed, a layer of gold is plated on the surface of the gold finger 100. Figure 5 and Figure 6 , a slot 800 is made in the area where the gasket layer 600 is located, the gold finger shunt lead 300 is cut off, and the electrical connection between the gold finger 100 and the outer layer pattern 400 is disconnected. Preferably, the distance between the width edge of the slot 800 and the length edge of the gold finger shunt lead 300 is ≥0.5mm to ensure that the outer layer pattern 400 and the gold finger lead 200 are not touched during the processing of the slot 800. Preferably, the length of the slot 800 is greater than or equal to the length of the gold finger shunt lead area, and less than or equal to the length of the gasket layer 600, while ensuring that the gold finger shunt lead 300 is completely cut off, and the buffering effect of the gasket layer 600 is fully utilized. Among them, the gold finger shunt lead area is connected by the outermost extension line of the gold finger shunt lead 300. Preferably, the processing method of the slot 800 is milling, and the gold finger lead 100 is cut off by milling, which does not require a separate mold to be made, and the cost is low.

[0051] Finally, the covering layer 700 and the spacer layer 600 are removed to complete the processing of the gold finger.

[0052] In the above embodiment, the gold finger guide wires are cut off by milling grooves, which does not require a separate mold to be made, and the basic circuit graphics of the milling grooves can be made together in the previous process, without the need for a separate design process, which effectively reduces the difficulty of processing, saves processing costs, improves processing efficiency, and ensures the processing quality of the circuit board. Gold finger shunt leads are made on the semi-finished circuit board. The shunt form reduces the line width of a single gold finger guide wire. The design of multiple but thinner lines provides a line foundation that is easier to process for slot hole processing, which can prevent problems such as copper pulling and copper warping. A gasket layer is made on the gold finger shunt lead, which can provide a reliable buffering effect for slot hole processing, further preventing problems such as copper pulling and copper warping. The coordination of the overall design and method can make the gold finger guide wires disconnected simply, efficiently, and reliably, which is beneficial to improving the manufacturing quality and reliability of the gold finger and providing a good testing basis for the subsequent electrical testing of the gold finger.

[0053] In the second aspect of the present application, a circuit board is provided, comprising gold fingers made using the method of the above embodiment. Specifically, the circuit board can be a single-sided board or a double-sided board, or a multi-layer board; it can be a soft board, a hard board, or a soft-hard combination board. The number of gold fingers designed in the circuit board can be one or more. In short, this embodiment does not limit the number of layers, type, and number of gold fingers designed in the circuit board. It can be understood that, depending on the actual circuit design, other process steps can be used to make other structures of the circuit board before and / or after making the gold fingers to complete the entire circuit production of the circuit board.

[0054] The above-mentioned circuit board, when making the gold finger, uses the milling method to cut the gold finger guide wires, so there is no need to make a separate mold, and the basic circuit graphics of the milling groove can be made together in the previous process, without the need for a separate design process, which effectively reduces the difficulty of processing, saves processing costs, improves processing efficiency, and ensures the processing quality of the circuit board. The gold finger shunt leads are made on the semi-finished circuit board. The shunt form reduces the line width of a single gold finger guide wire. The design of multiple but thinner lines provides a line foundation that is easier to process for slot hole processing, which can prevent problems such as copper pulling and copper warping. Making a gasket layer on the gold finger shunt lead can provide a reliable buffering effect for slot hole processing, further preventing problems such as copper pulling and copper warping. The coordination of the overall design and method can make the gold finger guide wires able to be disconnected simply, efficiently and reliably, which is conducive to improving the production quality and reliability of the gold finger and providing a good testing basis for the subsequent electrical testing of the gold finger.

[0055] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above examples merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A method for making a gold finger, characterized in that: include: Making gold fingers, gold finger guide wires and a plurality of gold finger shunt leads on a semi-finished circuit board; the gold finger shunt leads are connected to the gold fingers through the gold finger guide wires; the line width of the gold finger shunt leads is smaller than that of the gold finger guide wires; Each of the gold fingers corresponds to one gold finger guide wire, and each of the gold finger guide wires corresponds to multiple gold finger branch wires; One end of the gold finger shunt lead is connected to the outer layer pattern, and the other end is connected to the corresponding gold finger guide lead, and a preset distance is spaced between two adjacent gold finger shunt leads; Making a gasket layer on the gold finger shunt lead; Making a covering layer on the semi-finished circuit board, and performing window processing on the covering layer at the corresponding position of the gold finger; Energizing the gold finger shunt lead and performing electro-gold processing to plate the surface of the gold finger with gold; Making slots in the area where the gasket layer is located and cutting off the gold finger shunt leads; The cover layer and the spacer layer are removed.

2. The method for making a gold finger according to claim 1, wherein: The gold fingers, the gold finger leads and the gold finger shunt leads are manufactured simultaneously with the outer layer pattern of the semi-finished circuit board.

3. The method for making a gold finger according to claim 1, wherein: There are two gold finger shunt leads, each of which is connected to the gold finger through the gold finger guide lead; and the two gold finger shunt leads are spaced apart by a preset distance in the line width direction.

4. The method for making a gold finger according to claim 1, wherein: The length of the gold finger shunt lead is 1 mm to 5 mm greater than the designed width of the slot.

5. The method for making a gold finger according to claim 1, wherein: The gasket layer is made of epoxy resin glass fiber cloth.

6. The method for making a gold finger according to claim 1, wherein: The width of the gasket layer is the same as the length of the gold finger shunt lead, and the distance between the gasket layer and the outermost gold finger shunt lead in the length direction is 1 mm to 5 mm.

7. The method for making a gold finger according to claim 6, characterized in that: The distance between the width edge of the slot and the length edge of the gold finger shunt lead is ≥0.5 mm.

8. The method for making a gold finger according to claim 6, wherein: The length of the slot is greater than or equal to the length of the gold finger shunt lead area, and less than or equal to the length of the gasket layer.

9. The method for making a gold finger according to any one of claims 1 to 8, characterized in that: The covering layer is a dry film.

10. A circuit board, characterized in that: The invention comprises a gold finger manufactured by using the gold finger manufacturing method according to any one of claims 1 to 9.

Images